Surface unit, surface phased array control and phased array planar film antenna

Abstract

The invention provides a surface unit, a surface phased array and a phased array planar film antenna. In the surface unit, a phase modulation device, a storage device, a switching device and a surface metal structure are all arranged on a film; the phase modulation device and the memory device are connected in parallel with the first part and the second part of the mutually independent surface metal structure; the switching device is connected with the second connecting line and the surface metal structure and is configured to control connection and disconnection between the surface metal structure and an external circuit; the first connecting line is connected with the first part of the surface metal structure; the first connecting line is configured to input an external control electrical parameter signal; the third connecting line is connected with the second part of the surface metal structure through the switching device; the third connecting line is grounded. According to the embodiment of the invention, the elements in the surface unit are all arranged on the film, wave beam control can be realized through a single-layer structure, and the problem of interlayer alignment is avoided.

Description

Technical Field

[0001] The present application relates to the field of microwave antennas, and in particular to a surface unit, a surface phased array, and a phased array planar thin film antenna. Background Art

[0002] With the rapid development of modern communications technology, phased array antennas have gained widespread application in radar detection, satellite communications, 5G / 6G mobile communications, and other fields due to their significant advantages, including flexible beam scanning, high gain, and strong anti-interference capabilities. As a key form of phased array antenna, thin-film phased array antennas, with their lightweight, flexible, and easy-to-integrate characteristics, have shown great potential in space-constrained applications with special requirements for weight and flexibility.

[0003] However, the current mainstream phased array thin-film antenna designs tend to adopt a multi-layer structure. While this design improves antenna performance to a certain extent, such as increasing the effective radiation area and optimizing beam steering accuracy, it also brings a series of technical challenges. Specifically, the multi-layer structure requires extremely high inter-layer alignment accuracy. Any slight misalignment can significantly affect the antenna's radiation efficiency and beam pointing accuracy, increasing the difficulty of quality control during the manufacturing process. Summary of the Invention

[0004] In view of this, an object of the embodiments of the present application is to provide a surface unit, a surface phased array, and a phased array planar thin film antenna, which avoid the problem of inter-layer alignment.

[0005] In the first aspect, an embodiment of the present application provides a surface unit, comprising: a phase-adjusting device, a storage device, a switching device, a surface metal structure, a thin film, a first connecting line and a third connecting line arranged along a first direction, and a second connecting line arranged along a second direction; wherein the first direction and the second direction are perpendicular; the phase-adjusting device, the storage device, the switching device and the surface metal structure are all arranged on the thin film; the phase-adjusting device and the storage device are connected in parallel to the first part and the second part of the surface metal structure which are independent of each other; the switching device connects the second connecting line and the surface metal structure, and is configured to control the on and off of the surface metal structure and the external circuit; the first connecting line connects the first part of the surface metal structure; the first connecting line is configured to input an external control electrical parameter signal; the third connecting line is connected to the second part of the surface metal structure through the switching device; the third connecting line is grounded.

[0006] In the above implementation process, by arranging the phase-modulating device, the storage device, the switching device and the surface metal structure on the film, since the phase of the surface unit can be adjusted by adjusting the electrical parameters loaded on both ends of the phase-modulating device, beam control can be achieved by using only a single-layer structure, thereby reducing the number of layers of the phased array planar film antenna formed by the surface unit, thereby avoiding the problem of inter-layer alignment. In addition, a first connecting line and a third connecting line are respectively arranged along the first direction on the surface unit, and a second connecting line is arranged along the second direction. When multiple surface units are arranged in sequence, multiple surface units in the first direction and in the same column are connected in sequence through the first connecting line and the third connecting line. Multiple surface units in the second direction and in the same row are connected in sequence through the second connecting line. The surface units on each row and each column can be controlled separately through fewer lines, which can reduce the number of lines and simplify the structural design of the phased array control formed by the surface units.

[0007] In one embodiment, the first portion and the second portion of the surface metal structure have the same structure, and the first portion and the second portion of the surface metal structure are symmetrically arranged.

[0008] In the above implementation process, by setting the first part and the second part of the surface metal in the surface unit to have the same structure and symmetrical arrangement, the surface unit can have a high degree of translational symmetry, which can avoid the influence of routing and reduce routing complexity.

[0009] In one embodiment, it further includes: a metal reflective layer; the metal reflective layer is arranged on a side of the film away from the surface metal structure; and a support structure is arranged between the metal reflective layer and the film.

[0010] In the above implementation, the metal reflective layer is incorporated into the surface unit to reflect electromagnetic waves, concentrating signal energy and reducing signal attenuation, thereby enhancing signal strength. By reflecting and focusing electromagnetic waves, the metal reflective layer increases the gain of the surface unit, enhancing its radiation or reception capabilities in specific directions.

[0011] In one embodiment, the phase modulation device includes one of a varactor diode, a PIN diode, a liquid crystal, and a MEMS.

[0012] In the above implementation process, by setting the phase modulation device to include one of a varactor diode, a PIN diode, a liquid crystal, and a MEMS, a corresponding phase modulation device can be selected according to actual needs, thereby increasing the flexibility of phase modulation device selection and further increasing the application scenarios of the surface unit.

[0013] In one embodiment, the switching device is an integrated chip; wherein the integrated chip includes one of a MOSFET field effect transistor and a triode.

[0014] In the above implementation process, the switch device is configured as an integrated chip. The integrated chip is usually packaged in a miniaturized form. These miniaturized packages can greatly reduce the space occupied by the switch device and reduce the volume of the surface unit.

[0015] In one embodiment, the first connecting line and the surface metal structure are made of the same material; and / or the second connecting line and the surface metal structure are made of the same material; and / or the third connecting line and the surface metal structure are made of the same material.

[0016] In the above implementation process, by setting the first connecting line and the surface metal structure to be the same material, the second connecting line and the surface metal structure to be the same material and / or the third connecting line and the surface metal structure to be the same material, the first connecting line and the surface metal structure can be an integrated structure, the second connecting line and the surface metal structure can be an integrated structure and / or the third connecting line and the surface metal structure can be an integrated structure, thereby reducing the layout of the circuits on the surface unit, reducing the complexity of the circuits, and reducing the cost of the surface unit.

[0017] In one embodiment, the surface unit includes an initial state, an on state and an off state; wherein, when an off signal is inputted into the second connecting line, the switching device disconnects the surface metal structure from the external circuit, and the surface unit is in the initial state; when an on signal is inputted into the second connecting line, the switching device connects the surface metal structure to the external circuit, the storage device stores electrical energy, the phase modulation device performs phase regulation, and the surface unit is in the on state; after the on state, and the second connecting line inputs an off signal, the switching device disconnects the surface metal structure from the external circuit, the electrical parameters provided by the storage device to the phase modulation device are the same as those in the previous on state, the phase modulation device performs phase regulation, and the surface unit is in the off state.

[0018] In the second aspect, an embodiment of the present application further provides a surface phased array, comprising: a control line, two feed lines, and a plurality of surface units according to the first aspect or any one embodiment of the first aspect; the plurality of surface units are arranged in sequence in the form of a matrix; the plurality of surface units are connected in sequence in the first direction through a first connecting line and a third connecting line; the plurality of surface units are connected in sequence in the second direction through a second connecting line; one end of each of the control lines is connected to the first connecting line at the end of each column in the first direction, and the end of the third connecting line in each column is grounded; one end of each of the power lines is connected to the second connecting line at the end of each row in the first direction; wherein the control line and the power line are configured to control the electrical parameters and control signals of the surface units.

[0019] In the above implementation process, a surface phased array is formed by arranging multiple surface units in sequence in a matrix form, and the multiple surface units are connected in sequence in the first direction through first connecting lines, and the multiple surface units are connected in sequence in the second direction through second connecting lines. This can reduce the number of circuits set in the surface phased array and simplify the surface phased array structure.

[0020] In one embodiment, it further includes: a control chip; the control line and the power line are connected to the control chip at one end away from the surface unit; wherein the control chip is configured to control the electrical parameters loaded to the control line and control the on-off signal on the power line.

[0021] In the above implementation process, by setting up a control chip and connecting both the control line and the power line to the control chip, the electrical parameters can be automatically sent to the surface unit through the control chip, thereby realizing the phase control of the surface unit. In addition, by sending an on-off signal to the power line through the control chip, the on-off control of the surface unit is realized, thereby realizing the automation and intelligence of the surface phased array phase modulation.

[0022] In a third aspect, an embodiment of the present application further provides a surface phased array control method, which is applied to the surface phased array in the second aspect or any embodiment of the second aspect, and the method includes: controlling the on-off state of each surface unit in the surface phased array control by controlling the first signal of the input power line; controlling the target electrical parameters of each surface unit in the surface phased array control by controlling the second signal of the input control line; wherein, each surface unit in the surface phased array is controlled by the first signal and the second signal.

[0023] In one embodiment, the first signal includes a turn-on signal and a turn-off signal, and the second signal includes a target electrical parameter; the on-off state of each surface unit in the surface phased array control is controlled by controlling the first signal of the input power line; the target electrical parameters of each surface unit in the surface phased array control are controlled by controlling the second signal of the input control line, including: controlling at least one of the power lines to input a turn-on signal, and the other power lines to input a turn-off signal; wherein, the surface unit connected to the power line that inputs the turn-on signal enters the on state, and the surface unit connected to the power line that inputs the turn-off signal maintains the initial state; controlling one or more control lines to respectively input the target electrical parameters required by each on-state surface unit; replacing the power line that inputs the turn-on signal, and repeating the above steps, the surface unit whose power line input signal changes from a turn-on signal to a turn-off signal enters the turn-off state, and the energy storage device in the surface unit maintains the electrical parameters of the on state; the surface unit whose power line input signal changes from a turn-off signal to a turn-on signal enters the on state; the surface unit whose power line input signal keeps the turn-off signal unchanged maintains the initial state.

[0024] In a fourth aspect, an embodiment of the present application further provides a phased array planar film antenna, comprising: a feed antenna, and a surface phased array according to the second aspect, or any embodiment of the second aspect; the feed antenna is arranged on one side of the surface phased array; wherein the feed antenna is configured to transmit electromagnetic waves to the surface phased array and / or receive the electromagnetic waves reflected by the surface phased array.

[0025] In the above implementation process, by setting up a phased array planar film antenna including surface units arranged in a matrix, multiple surface units can be independently controlled through multiple lines, and only the first connecting line at the end of each column in the first direction needs to be connected to a control line, and the second connecting line at the end of each row in the second direction needs to be connected to a power line. Compared with the traditional unit control circuit, the number of lines is greatly reduced, and the structure of the phased array planar film antenna can be simplified.

[0026] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, the following embodiments are given in conjunction with the accompanying drawings for detailed description as follows. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0028] Figure 1A schematic diagram of the planar structure of a surface unit provided in an embodiment of the present application; Figure 2 A schematic diagram of the three-dimensional structure of a surface unit provided in an embodiment of the present application; Figure 3 A schematic diagram of the structure of a surface phased array provided in an embodiment of the present application; Figure 4 A flow chart of the surface phased array control method provided in an embodiment of the present application; Figure 5 A detailed flow chart of the surface phased array control method provided in an embodiment of the present application; Figures 6(a), 6(b), and 6(c) are example diagrams of different surface units of the control surface phased array; Figure 7 A schematic diagram of the structure of a phased array planar film antenna provided in an embodiment of the present application; Figure 8 A schematic diagram of the phase adjustment response results of the phased array planar film antenna provided in an embodiment of the present application; Figure 9 Schematic diagram of the two-dimensional beam scanning results of the phased array planar film antenna provided in an embodiment of the present application.

[0029] Description of the drawings: 10-surface unit, 100-phase modulation device, 200-storage device, 300-switch device, 400-surface metal structure, 410-first part, 420-second part, 500-first connecting line, 600-thin film, 700-metal reflective layer, 20-control line, 30-power line, 40-control chip, 50-feed antenna. DETAILED DESCRIPTION

[0030] The technical solutions in the embodiments of the present application will be described below in conjunction with the accompanying drawings in the embodiments of the present application.

[0031] It should be noted that similar reference numerals and letters represent similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings. At the same time, in the description of this application, the terms "first", "second", etc. are only used to distinguish the description and should not be understood as indicating or implying relative importance.

[0032] Phased array thin-film antennas are a high-performance antenna technology that integrates technologies from multiple fields, including communications, radar, and remote sensing. They are widely used in aerospace communications, navigation, and Earth observation. They offer significant advantages, including flexible beam control, efficient resource utilization, and strong anti-interference capabilities. They can electronically adjust beam direction in real time and support multi-beam operation, thus meeting the communication needs of multiple users and multiple regions. Compared to traditional phased array antennas, thin-film phased array antennas are lightweight and foldable, significantly reducing launch and deployment costs. They also utilize flexible materials to enable large-scale deployment, providing a more efficient solution for low-orbit satellite communications, high-resolution imaging, and other missions.

[0033] Current phased array thin-film antennas mostly utilize a multi-layer structure. While this design offers certain performance advantages, it also presents challenges such as difficult inter-layer alignment, complex structure, and high manufacturing costs. Most existing phased array thin-film antennas operate in the P-band or L-band. Surface elements offer a new technological approach to the development of phased array thin-film antennas. Through electronic control and other means, they enable precise control of the surface's electromagnetic response, thereby enabling flexible regulation of the radiation beam.

[0034] However, after extensive research, the inventors discovered that most surface phased array thin-film antennas can only achieve one-dimensional beam steering due to the complex control bias lines of the functional surface elements of a two-dimensional reconfigurable structure, which significantly interferes with the structure's electromagnetic response. Separating the surface elements from the bias line network increases the number of structural layers and is unsuitable for the development of phased array thin-film antennas.

[0035] In view of this, the present application proposes a surface unit, which can realize beam control through a single-layer structure by setting the phase modulation device, storage device, switching device and surface metal structure on a thin film, thereby reducing the number of layers of the phased array planar thin film antenna formed by the surface unit, avoiding the problem of inter-layer alignment. In addition, a first connecting line is set along the first direction and a second connecting line is set along the second direction on the surface unit. When a plurality of surface units are arranged in sequence, a plurality of surface units in the first direction and located in the same column are connected in sequence through the first connecting line. A plurality of surface units in the second direction and located in the same row are connected in sequence through the second connecting line, and the surface units on each row and each column can be controlled separately through fewer lines, which can reduce the number of lines and simplify the structural design of the phased array control formed by the surface units.

[0036] To facilitate understanding of this embodiment, the surface unit disclosed in the embodiment of this application is first introduced in detail.

[0037] like Figure 1, is a schematic structural diagram of the surface unit 10, comprising: a phase modulation device 100, a storage device 200, a switching device 300, a surface metal structure 400, a film 600, a first connecting line 500 arranged along a first direction, a third connecting line, and a second connecting line arranged along a second direction; wherein the first direction and the second direction are perpendicular.

[0038] Here, the phase modulation device 100, the storage device 200, the switching device 300 and the surface metal structure 400 are all arranged on the film 600; the phase modulation device 100 and the storage device 200 are connected in parallel to the first part 410 and the second part 420 of the surface metal structure 400, which are independent of each other; the switching device 300 is connected to the second connecting line and the surface metal structure 400, and is used to control the on and off of the surface metal structure 400 and the external circuit; the switching device 300 is connected to the external circuit through the second connecting line; the first connecting line 500 is connected to the first part 410 of the surface metal structure 400, and the first connecting line 500 is configured to input an external control electrical parameter signal; the third connecting line is connected to the second part 420 of the surface metal structure 400 through the switching device 300 for grounding.

[0039] The switch device 300 is configured to control the connection and disconnection between the surface metal structure 400 and the external circuit. The switch device 300 can be an integrated chip, a transistor, a relay or other components, and the switch device 300 can be selected according to actual conditions.

[0040] The phase modulation device 100 is a device for adjusting the phase of the surface unit 10. For example, it can be a varactor diode, an oscillator, a digital phase modulator, etc. The phase modulation device 100 can be selected according to actual conditions.

[0041] The storage device 200 is a device for storing electrical energy, such as a capacitor, an inductor, a supercapacitor, a piezoelectric element, etc. The storage device 200 can be selected according to actual conditions.

[0042] The surface unit 10 is configured to adjust the phase by adjusting the electrical parameters of the phase-modulating device 100. The electrical parameters at both ends of the phase-modulating device 100 are stabilized and controlled by the switching device 300 and the storage device 200. Specifically, the electrical parameters are switched in real time by controlling the on / off timing of the switching device 300 and the external control electrical parameter signal input via the first connection line 500, thereby adjusting the phase of the surface unit 10.

[0043] Optionally, the surface unit 10 includes shapes such as triangle, square, rectangle, trapezoid, etc. The shape of the surface unit 10 can be selected according to actual conditions.

[0044] When multiple surface units 10 are arranged in an array, the surface units 10 in the same column in a first direction are sequentially connected via first and third connecting lines 500. The surface units 10 in the same row in a second direction are sequentially connected via second connecting lines. By controlling the on / off state of the switching device 300, the surface units 10 in each row can be independently driven. Furthermore, electrical parameters at both ends of the phase modulation device 100 in the surface unit 10 can be controlled via control lines, independently controlling the electrical parameters of each column of surface units 10.

[0045] The first connecting line 500, the second connecting line, and the third connecting line can be arranged on the side of the film 600 close to the surface metal structure 400, or on the side of the film 600 away from the surface metal structure 400. The first connecting line 500, the second connecting line, and the third connecting line do not intersect on the film 600. The specific arrangement positions of the first connecting line 500, the second connecting line, and the third connecting line can be selected according to actual conditions.

[0046] In one embodiment, the film 600 is a polyimide film.

[0047] In the above implementation process, the phase-modulating device 100, the storage device 200, the switching device 300 and the surface metal structure 400 are all arranged on the film 600. Since the phase of the surface unit can be adjusted by adjusting the electrical parameters loaded at both ends of the phase-modulating device 100, beam control can be achieved using only a single-layer structure, thereby reducing the number of layers of the phased array planar film 600 antenna composed of the surface unit 10, thereby avoiding the problem of inter-layer alignment.

[0048] In a possible implementation, the first portion 410 and the second portion 420 of the surface metal structure 400 have the same structure, and the first portion 410 and the second portion 420 of the surface metal structure 400 are symmetrically arranged.

[0049] It should be understood that by setting the first part 410 and the second part 420 of the surface metal structure 400 in the surface unit 10 to be identical and symmetrical, the surface unit 10 can have a high degree of translational symmetry, which can avoid the impact of routing and reduce routing complexity.

[0050] In one possible implementation, Figure 2 As shown, the surface unit 10 further includes: a metal reflective layer 700 .

[0051] The metal reflective layer 700 is disposed on a side away from the metal structure 400 on the surface of the film 600 ; a support structure is disposed between the metal reflective layer 700 and the film 600 .

[0052] The metal reflective layer 700 is a thin film or coating made of a metal material. It is primarily used to reflect light (especially light in a specific wavelength band) or electromagnetic waves, and has the characteristics of high reflectivity and low absorptivity. Examples include silver, aluminum, gold, and copper. The metal reflective layer 700 can be selected based on actual conditions.

[0053] Optionally, a gas layer or a dielectric layer may be formed between the metal reflective layer 700 and the thin film 600 . The structure between the metal reflective layer 700 and the thin film 600 may be selected according to actual conditions.

[0054] The above-mentioned support structure refers to a structure that separates the film 600 from the metal reflective layer 700. For example, a support rod, an empty frame, etc. The support structure can be selected according to actual conditions.

[0055] In the above implementation, by providing the metal reflective layer 700 in the surface unit 10, the metal reflective layer 700 can reflect electromagnetic waves, concentrate signal energy, reduce signal attenuation, and thus enhance signal strength. By reflecting and focusing electromagnetic waves, the metal reflective layer 700 can increase the gain of the surface unit 10, making the surface unit 10 more capable of radiating or receiving in a specific direction.

[0056] In a possible implementation, the phase modulation device 100 includes one of a varactor diode, a PIN diode, a liquid crystal, and a MEMS.

[0057] The varactor diode is a semiconductor device that works by utilizing the characteristic that the junction capacitance of a PN junction changes with the applied voltage when the PN junction is reverse biased. By adjusting the voltage across the varactor diode, the phase of the reflected electromagnetic wave can be adjusted, thereby dynamically controlling the surface unit 10.

[0058] Liquid crystals are a state of matter between solid and liquid, possessing the anisotropy of crystals and the fluidity of liquids. External stimuli (such as electric fields, temperature, or light) alter the molecular arrangement, thereby manipulating the propagation properties of light waves (such as phase, polarization, or intensity).

[0059] MEMS (Micro-Electro-Mechanical Systems) are micro-devices or systems that integrate micromechanical structures, sensors, actuators, and electronic circuits on micron- to nanometer-scale chips. Mechanical motion (translational or rotational) alters the propagation path of light waves, causing optical path differences and, consequently, phase delay.

[0060] In the above implementation process, by setting the phase modulation device 100 to include one of a varactor diode, a PIN diode, a liquid crystal, and a MEMS, a corresponding phase modulation device 100 can be selected according to actual needs, thereby increasing the flexibility of selecting the phase modulation device 100 and further increasing the application scenarios of the surface unit 10.

[0061] In a possible implementation, the switch device 300 is an integrated chip.

[0062] The integrated chip here is a microelectronic device that integrates a large number of electronic components (such as transistors, resistors, capacitors, etc.) and their interconnections on a single semiconductor substrate.

[0063] Among them, the transistors in the integrated chip can be used to realize the switching function.

[0064] Optionally, the integrated chip includes a MOSFET field effect transistor or a triode.

[0065] MOSFET field-effect transistor (Metal-Oxide-Semiconductor Field-Effect Transistor, Chinese name: Metal-Oxide-Semiconductor Field-Effect Transistor) is a unipolar voltage-controlled device that uses the electric field effect to control the current.

[0066] In the above implementation process, the switch device 300 is set as an integrated chip. The integrated chip usually adopts a miniaturized package. These miniaturized packages can greatly reduce the space occupied by the switch device 300 and reduce the volume of the surface unit 10.

[0067] In a possible implementation, the first connecting line 500 and the surface metal structure 400 are made of the same material; and / or the second connecting line and the surface metal structure 400 are made of the same material; and / or the third connecting line and the surface metal structure 400 are made of the same material.

[0068] It should be understood that the first connecting wire 500, the second connecting wire, and the third connecting wire can be integrated with the surface metal structure 400, or can be separated from the surface metal structure 400. The specific structures of the first connecting wire 500, the second connecting wire, and the third connecting wire can be selected according to actual conditions.

[0069] When the first connecting wire 500, the second connecting wire, and the third connecting wire are integrated with the surface metal structure 400, the first connecting wire 500 is an extension of the surface metal structure 400. That is, a metal wire of a certain width extending along the first direction from the surface metal structure 400 is the first connecting wire 500 and the third connecting wire.

[0070] In the above implementation process, by setting the first connecting line 500 and the surface metal structure 400 to be the same material, the second connecting line and the surface metal structure 400 to be the same material and / or the third connecting line and the surface metal structure 400 to be the same material, the first connecting line 500 and the surface metal structure 400 can be an integrated structure, the second connecting line and the surface metal structure 400 can be an integrated structure and / or the third connecting line and the surface metal structure 400 can be an integrated structure, thereby reducing the layout of the circuits on the surface unit 10 and reducing the complexity of the circuits.

[0071] In a possible implementation, the surface unit 10 includes an initial state, an on state, and an off state.

[0072] In which, when a shutdown signal is inputted into the second connection line, the switching device 300 disconnects the surface metal structure 400 from the external circuit, and the surface unit 10 is in the initial state; when a conduction signal is inputted into the second connection line, the switching device 300 conducts the connection between the surface metal structure 400 and the external circuit, the storage device 200 stores electrical energy, the phase modulation device 100 performs phase regulation, and the surface unit 10 is in the conduction state; after the conduction state, and a shutdown signal is inputted into the second connection line, the switching device 300 disconnects the surface metal structure 400 from the external circuit, the electrical parameters provided by the storage device 200 to the phase modulation device 100 are the same as those in the previous conduction state, the phase modulation device 100 performs phase regulation, and the surface unit 10 is in the shutdown state.

[0073] It should be understood that since the surface unit 10 is provided with a first connecting line 500, a third connecting line, and a second connecting line, the first connecting line 500 and the third connecting line together constitute a control electrical parameter circuit. One end of the first connecting line 500 is connected to the control line, and the other end is connected to the first portion 410 of the surface metal structure 400, for inputting an external control electrical parameter signal to the first portion 410. The third connecting line is connected to the second portion 420 of the surface metal structure 400 via the switching device 300 for grounding. When the switching device 300 and the second connecting line are interconnected to control the on / off connection between the surface metal structure 400 and the external circuit, the control electrical parameter circuit formed by the first connecting line 500 and the third connecting line can achieve switching between the three states of the surface unit 10.

[0074] That is, in the initial state, the switch device 300 shuts off the circuit on the second connecting line, that is, shuts off the circuit of the surface metal structure 400. No current flows through the phase modulation device 100 or the memory device 200. At this time, even if a control signal is applied to the control electrical parameter circuit formed by the first connecting line 500 and the third connecting line, the surface unit 10 in the initial state does not perform any phase control operation. In the conductive state, the switch device 300 conducts the circuit on the second connecting line, that is, the circuit on the surface metal structure 400 is conductive. At this time, the complete circuit consisting of the external circuit, the first connecting line 500, the first portion 410 of the surface metal structure 400, the phase modulation device 100, the memory device 200, the second portion 420 of the surface metal structure 400, the switch device 300, and the third connecting line is conductive. The potential difference between the first connecting line 500 and the third connecting line charges the memory device 200, and the phase modulation device 100 is in an operating state. At this time, the control electrical parameter circuit formed by the first connecting line 500 and the third connecting line provides a control signal, which is directly applied to both ends of the phase modulation device 100. In the off state, after the on state, the switching device 300 shuts off the circuit on the second connecting line, that is, the circuit on the surface metal structure 400. At this point, the circuit formed by the first connecting line 500, the first portion 410 of the surface metal structure 400, the phase-modulating device 100, the storage device 200, and the second portion 420 of the surface metal structure 400 is conductive. The storage device 200 acts as a temporary power source, maintaining the electrical parameters of the control signal provided by the control electrical parameter circuit formed by the first connecting line 500 and the third connecting line in the on state before the off state occurs. The electrical parameters applied to the ends of the phase-modulating device 100 are the electrical parameters of the previous on state, allowing the phase-modulating device 100 to continue normal operation. In the off state, even if the control electrical parameter signal input to the first connecting line 500 changes, it will not affect the electrical parameters applied to the ends of the phase-modulating device 100 in the off state.

[0075] like Figure 3 , which is a schematic structural diagram of a surface phased array, includes: a control line 20, a power line 30, and a plurality of surface units 10 in the above-mentioned embodiments.

[0076] Among them, multiple surface units 10 are arranged in sequence in the form of a matrix; multiple surface units 10 are connected in sequence in the first direction through a first connecting line 500 and a third connecting line; multiple surface units 10 are connected in sequence in the second direction through a second connecting line; one end of each control line 20 is connected to the first connecting line 500 at the end of each column in the first direction; the end of the third connecting line in each column is grounded; one end of each power line 30 is connected to the second connecting line at the end of each row in the first direction.

[0077] The control line 20 and the power line 30 are configured to control the electrical parameters and control signals of the surface unit 10. The electrical parameters may be voltage parameters, current parameters, etc., and the electrical parameters may be selected according to actual conditions.

[0078] In one embodiment, the number of control lines 20 is the same as the number of columns in the surface phased array, and the number of power lines 30 is the same as the number of rows in the surface phased array.

[0079] It should be understood that since each surface unit 10 is identical and the first connection lines 500, the second connection lines, and the third connection lines on the surface units 10 are also arranged in the same position, when the plurality of surface units 10 are arranged in a matrix, the first connection lines 500 and the third connection lines of two adjacent surface units 10 are connected to each other, and the second connection lines are connected to each other, so that the plurality of surface units 10 in the same column are connected via the first connection lines 500 and the third connection lines, and the plurality of surface units 10 in the same row are connected via the second connection lines.

[0080] When controlling the surface units 10 in the surface phased array, each surface unit 10 can be individually controlled via the control lines 20 and power lines 30 connected to the surface unit 10. Alternatively, all surface units 10 in the same column or row connected to the same control line 20 or power line 30 can be collectively controlled. The control of the surface units 10 in the surface phased array can be selected based on actual conditions.

[0081] In one embodiment, by controlling the electrical parameters at both ends of the phase-modulating device 100 within the surface element 10, preset electrical parameters are sequentially input into each column of the surface phased array. Consequently, M×N surface elements 10 can be independently and sequentially manipulated via M rows and N columns of control circuits. Furthermore, each surface element 10 in the surface phased array is a strictly translational replica. Consequently, the entire array forms a two-dimensional reconfigurable active matrix-based structure with row-column addressing drive modes, enabling functions such as two-dimensional beam steering.

[0082] In the above implementation process, a surface phased array is formed by arranging multiple surface units 10 in sequence in the form of a matrix, and the multiple surface units 10 are connected in sequence in the first direction through the first connecting lines 500, and the multiple surface units 10 are connected in sequence in the second direction through the second connecting lines. This can reduce the number of lines set in the surface phased array and simplify the surface phased array structure.

[0083] In a possible implementation, the surface phased array further includes: a control chip 40 .

[0084] The ends of the control line 20 and the power line 30 away from the surface unit 10 are connected to the control chip 40 .

[0085] The control chip 40 is a semiconductor integrated circuit whose internal logic functions can be defined by the user through programming. The control chip 40 can send electrical parameters (such as voltage parameters) and control signals to the surface unit 10 through the control line 20 and the power line 30.

[0086] The control chip 40 is configured to control the electrical parameters loaded onto the control line 20 and control the on / off signal on the power line 30 .

[0087] In the above implementation process, by setting up a control chip 40, and connecting both the control line 20 and the power line 30 to the control chip 40, electrical parameters can be automatically sent to the surface unit 10 through the control chip 40, thereby controlling the phase of the surface unit 10 and realizing automation and intelligence of the surface phased array phase modulation.

[0088] like Figure 4 FIG. 1 is a flow chart of a surface phased array control method according to an embodiment of the present invention. Figure 4 The specific process shown is explained in detail.

[0089] Step S201 : controlling the on / off state of each surface unit in the surface phased array control by controlling the first signal of the input power line.

[0090] The power line here can be used to input on-off power to control the on-off state of each surface unit in the surface phased array control.

[0091] The first signal includes an on signal and an off signal.

[0092] It should be understood that by controlling the first signal on each power line, the on / off state of the corresponding surface unit connected to the power line can be controlled.

[0093] Step S202 : controlling the target electrical parameters of each surface unit in the surface phased array control by controlling the second signal of the input control line.

[0094] Each surface unit in the surface phased array is regulated by the first signal and the second signal.

[0095] The control lines here can be used to input electrical parameters, thereby controlling the target electrical parameters of each surface unit in the surface phased array control.

[0096] The second signal includes a target electrical parameter.

[0097] It should be understood that when regulating the surface phased array, the first signal input in the power line and the second signal input in the control line may be regulated separately, thereby achieving independent control of each surface unit in the phased array.

[0098] In one possible implementation, Figure 5 As shown, the surface phased array control method can further implement the control of the surface phased array according to the following process: Step S2011 , controlling at least one power line to input a turn-on signal, and controlling the other power lines to input turn-off signals.

[0099] It should be understood that each time the surface phased array is controlled, at least one power line receives an on signal, while the remaining power lines receive an off signal. At this point, the surface units connected to the power line receiving the on signal enter the on state, while the surface units connected to the power line receiving the off signal remain in the initial state.

[0100] When the power line inputs the on signal, the energy storage device in the surface unit connected to the power line inputting the on signal is charged. At this time, the surface unit can be in the on state. The surface unit connected to the power line inputting the off signal is in the initial state or the off state.

[0101] Optionally, each time the surface phased array is regulated, the number of power lines for inputting conduction signals may be selected according to actual conditions.

[0102] In addition, when switching the power lines for inputting conduction signals, the switching can be done sequentially or randomly. The method for switching the power lines for inputting conduction signals can be selected according to actual conditions.

[0103] Step S2012: controlling one or more control lines to input target electrical parameters required by each conductive state surface unit.

[0104] When multiple control lines respectively input the target electrical parameters required by each surface unit, the target electrical parameters input by the multiple control lines can be the same or different. The target electrical parameters input by the control lines can be selected according to actual conditions.

[0105] It should be understood that when controlling at least one power line to input a conduction signal, one or more control lines can be further controlled to input the target electrical parameters required by each conduction state surface unit, thereby regulating the electrical parameters and control signals of one or more surface units, charging the energy storage device in the surface unit, and triggering the phase modulation device to perform phase regulation.

[0106] Since each time adjustment is made, a conduction signal is input to the corresponding power line, and corresponding target electrical parameters are input to the surface units connected to the power line that inputs the conduction signal, independent control of each surface unit can be achieved in real time by independently adjusting the target electrical parameters of the surface units connected to the power line that inputs the conduction signal.

[0107] In one embodiment, the surface unit in the off state maintains electrical parameters via an energy storage device in the surface unit.

[0108] Step S2013, replace the power line that inputs the conduction signal, and repeat the above steps. The surface unit whose power line input signal changes from a conduction signal to an off signal enters the off state, and the energy storage device in the surface unit maintains the electrical parameters of the conduction state; the surface unit whose power line input signal changes from an off signal to a conduction signal enters the conduction state; the surface unit whose power line input signal remains the off signal maintains the initial state.

[0109] The following is a detailed description of the specific implementation process of the surface phased array control method in the embodiment of the present application through an embodiment: As shown in Figure 6(a), a turn-on signal is first input to power line A in the surface phased array, while the other power lines are input with turn-off signals. Control lines 1 through N are then fed with corresponding target voltages. At this point, the storage devices in the surface cells controlled by power line A store energy, and the phase modulation devices regulate the phase. The surface cells controlled by power line A enter the on state, while the other surface cells remain in their initial states.

[0110] As shown in Figure 6(b), a turn-on signal is then input to power line B in the surface phased array shown in Figure 6(b), while turn-off signals are input to the other power lines. Control lines 1 through N are fed corresponding target voltages. At this point, the storage devices in the surface cells controlled by power line B store energy, the phase modulation devices perform phase control, and the surface cells controlled by power line B enter the on state. The storage devices in the surface cells controlled by power line A discharge, providing the same voltage as in the previous on state to the phase modulation devices. The phase modulation devices perform phase control, and the surface cells controlled by power line A enter the off state, while the other surface cells remain in their initial states.

[0111] As shown in Figure 6(c), a turn-on signal is then input to power line C in the surface phased array in Figure 6(c), while turn-off signals are input to the other power lines. Control lines 1 through N are each fed with a corresponding target voltage. At this point, the storage devices in the surface cells controlled by power line C store energy, the phase modulation devices perform phase control, and the surface cells controlled by power line C enter the on state. The storage devices in the surface cells controlled by power line A and power line B discharge, providing the phase modulation devices with the same voltage as their respective last on states. The phase modulation devices perform phase control, and the surface cells controlled by power line A and power line B enter the off state, while the other surface cells remain in their initial states.

[0112] The above process schematically illustrates the control process of the array, and the signals transmitted by the control lines and the power lines are controlled as needed until the phase control is completed.

[0113] like Figure 7 , which is a schematic structural diagram of a phased array planar film 600 antenna, including: a feed antenna 50 and the surface phased array in the above embodiment.

[0114] The feed antenna 50 is arranged on one side of the surface phased array.

[0115] The feed antenna 50 here is the core component of the antenna system. As a primary radiator, its function is to efficiently convert the radio frequency signal from the feed line into electromagnetic waves and radiate them to the reflecting surface or lens, while receiving the reflected signal and transmitting it to the receiving system.

[0116] The feed antenna 50 is configured to transmit electromagnetic waves to the surface phased array and / or receive electromagnetic waves reflected by the surface phased array.

[0117] In one embodiment, in the phased array planar film 600 antenna, the phase of the scattered electromagnetic wave is adjusted by changing the input electrical parameters of the surface unit 10, and the electrical parameters of the surface unit 10 at a specific position are determined by the phase, thereby realizing functions such as two-dimensional beam scanning.

[0118] For example, if the electrical parameter is voltage, then in the phased array planar film 600 antenna, the phase of the scattered electromagnetic wave is adjusted by changing the input voltage waveform of the surface unit 10, thereby realizing functions such as two-dimensional beam scanning.

[0119] It should be understood that in the phased array planar film 600 antenna, the phase of the reflected electromagnetic wave can be adjusted by adjusting the electrical parameters at both ends of the phase adjustment device 100, thereby achieving dynamic control of the phased array planar film 600 antenna.

[0120] For example, the surface unit 10 is designed with an operating frequency of 5.4 GHz. Key structural parameters are as follows: the width of the surface unit 10 is p = 25 mm, the first length of the surface metal structure 400 is a = 6 mm, the first width of the surface metal structure 400 is c = 3 mm, and the second width of the surface metal structure 400 is d = 6 mm. The air layer between the surface unit 10 and the metal reflective layer 700 has a height of h = 2 mm. Figure 2 The composite structure of the surface unit 10 integrated and processed on a polyimide film 600 with a thickness of 0.025 mm is shown. It consists of an integrated chip with two N-MOS transistors and a chip capacitor. The gates of the two N-MOS transistors are connected to a gate bus, the sources are short-circuited, one drain is connected to a source bus, and the other drain is connected to a chip capacitor and a varactor diode.

[0121] The phase adjustment response result of the phased array planar film 600 antenna in the above example is as follows: Figure 8 As shown, by changing the voltage loaded into the control line 20, the voltage across the phase modulating device 100 is changed, and then the capacitance value of the phase modulating device 100 is changed, thereby achieving phase adjustment of the phased array planar film 600 antenna. Figure 8 The capacitance values ​​shown are 0.32pf, 0.36pf, 0.40pf, and 0.55pf.

[0122] The two-dimensional beam scanning results of the phased array planar film 600 antenna in the above example are as follows: Figure 9 As shown: Beam scanning effects can be achieved through specific phase calculation arrays, and different deflection beams can be obtained through different phase gradient arrays. By different arrangements in the E and H directions, beam control in both the E and H planes can be achieved. Figure 9 The scanning results of the E and H planes when the beam deflection is 0°, 15°, and 30°.

[0123] In the above implementation process, by setting the phased array planar film 600 antenna to include surface units 10 arranged in a matrix, multiple surface units 10 can be independently controlled through multiple lines, and only the first connecting line 500 at the end of each column in the first direction needs to be connected to a control line 20, and the second connecting line at the end of each row in the second direction needs to be connected to a power line 30. Compared with the traditional unit control circuit, the number of lines is greatly reduced, and the structure of the phased array planar film 600 antenna can be simplified.

[0124] In one possible implementation, the feed antenna 50 includes one of a patch antenna, a standard waveguide, a slot antenna, and a Vivaldi antenna.

[0125] In the above implementation process, by setting the feed antenna 50 to include one of a patch antenna, a standard waveguide, a slot antenna, and a Vivaldi antenna, the corresponding feed antenna 50 can be selected according to actual needs, thereby increasing the flexibility of the feed antenna 50 selection and thereby increasing the application scenarios of the phased array planar film 600 antenna.

[0126] The above are merely preferred embodiments of the present application and are not intended to limit the present application. Various modifications and variations are possible for those skilled in the art. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application shall be included within the scope of protection of the present application. It should be noted that similar reference numerals and letters represent similar items in the following figures. Therefore, once an item is defined in one figure, it does not need to be further defined or explained in subsequent figures.

[0127] The above are only specific embodiments of the present application, but the scope of protection of this application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A surface unit, characterized in that include: A phase modulation device, a memory device, a switching device, a surface metal structure, a thin film, a first connecting line and a third connecting line arranged along a first direction, and a second connecting line arranged along a second direction; wherein the first direction and the second direction are perpendicular; The phase modulation device, the storage device, the switching device, and the surface metal structure are all disposed on the film; the phase modulation device and the storage device are connected in parallel to a first portion and a second portion of the surface metal structure that are independent of each other; the switching device is connected to the second connecting line and the surface metal structure, and is configured to control the connection and disconnection between the surface metal structure and the external circuit; The first connecting line is connected to the first part of the surface metal structure; the first connecting line is configured to input an external control electrical parameter signal; the third connecting line is connected to the second part of the surface metal structure through the switching device; and the third connecting line is grounded.

2. The surface unit according to claim 1, characterized in that in, The first part and the second part of the surface metal structure have the same structure, and the first part and the second part of the surface metal structure are symmetrically arranged.

3. The surface unit according to claim 1, characterized in that Also includes: Metal reflective layer; The metal reflective layer is arranged on a side of the film away from the surface metal structure; a supporting structure is arranged between the metal reflective layer and the film.

4. The surface unit according to any one of claims 1 to 3, characterized in that The first connecting line and the surface metal structure are made of the same material; and / or the second connecting line and the surface metal structure are made of the same material; and / or the third connecting line and the surface metal structure are made of the same material.

5. The surface unit according to any one of claims 1 to 3, characterized in that The surface unit includes an initial state, an on state and an off state; Wherein, when a shut-off signal is inputted into the second connecting line, the switching device disconnects the surface metal structure from the external circuit, and the surface unit is in an initial state; A conduction signal is inputted into the second connection line, the switching device conducts the connection between the surface metal structure and the external circuit, the storage device stores electrical energy, the phase modulation device performs phase modulation, and the surface unit is in a conducting state; After the on-state, and the second connecting line inputs a shutdown signal, the switching device disconnects the surface metal structure from the external circuit, the electrical parameters provided by the storage device to the phase modulation device are the same as those in the previous on-state, the phase modulation device performs phase regulation, and the surface unit is in the off-state.

6. A surface phased array, characterized in that: include: Control lines, power lines, and a plurality of surface units according to any one of claims 1 to 5; The plurality of surface units are arranged in sequence in the form of a matrix; The plurality of surface units are sequentially connected in a first direction via first and third connection lines; The plurality of surface units are sequentially connected in the second direction by second connecting lines; One end of each of the control lines is connected to the first connection line at the end of each column in the first direction, and an end of each of the third connection lines is grounded; One end of each of the power lines is connected to a second connection line at the end of each row in the first direction; The control line and the power line are configured to control electrical parameters and control signals of the surface unit.

7. The surface phased array according to claim 6, characterized in that: Also includes: Control chip; The ends of the control line and the power line away from the surface unit are connected to the control chip; wherein the control chip is configured to control the electrical parameters loaded to the control line and control the on / off signal on the power line.

8. A surface phased array control method, characterized in that: Applied to the surface phased array according to claim 6 or 7, the method comprises: Controlling the on / off state of each surface unit in the surface phased array control by controlling the first signal of the input power line; Controlling target electrical parameters of each surface unit in the surface phased array control by controlling a second signal of the input control line; Wherein, each of the surface units in the surface phased array is regulated by the first signal and the second signal.

9. The surface phased array control method according to claim 8, characterized in that: The first signal includes an on signal and an off signal, and the second signal includes a target electrical parameter; The on / off state of each surface unit in the surface phased array control is controlled by controlling the first signal of the input power line; Controlling the target electrical parameters of each surface unit in the surface phased array control by controlling the second signal of the input control line includes: Controlling at least one of the power lines to input a conduction signal and the other power lines to input a shutdown signal; wherein the surface unit connected to the power line inputting the conduction signal enters a conduction state, and the surface unit connected to the power line inputting the shutdown signal maintains an initial state; controlling one or more control lines to input target electrical parameters required by each conductive state surface unit; Replace the power line that inputs the conduction signal and repeat the above steps. The surface unit whose power line input signal changes from a conduction signal to an off signal enters an off state, and the energy storage device in the surface unit maintains the electrical parameters of the conduction state; the surface unit whose power line input signal changes from an off signal to an on signal enters an on state; the surface unit whose power line input signal remains an off signal maintains the initial state.

10. A phased array planar film antenna, characterized in that: include: A feed antenna, and a surface phased array according to claim 6 or 7; The feed antenna is arranged on one side of the surface phased array; The feed antenna is configured to transmit electromagnetic waves to the surface phased array and / or receive the electromagnetic waves reflected by the surface phased array.

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