MinLED circuit board etching liquid immersion etching device
Through the mechanical linkage fixture and swing component design, the problems of cumbersome fixture operation and uneven etching in miniLED circuit board manufacturing are solved, and an efficient and low-cost etching process is achieved, ensuring etching quality and stability.
Patent Information
- Application Number
- CN202510864527.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-26
- Publication Date
- 2025-09-12
- Estimated Expiration
- 2045-06-26
AI Technical Summary
In the existing miniLED circuit board manufacturing, the fixture operation is cumbersome and easily damaged, etching is uneven, the electric fixture is expensive, and the etching liquid does not have sufficient contact with the circuit board, making it difficult to meet high-precision etching requirements.
A miniLED circuit board etching liquid immersion etching device is designed. It adopts a mechanically linked clamp and swing assembly. The motor drives the mounting plate to rotate to achieve automatic expansion and clamping of the clamp. Combined with the sliding and swinging of the mounting frame, it ensures that the circuit board is stirred and reciprocated in the etching liquid. It integrates the etching liquid tank and ultrasonic cleaning tank.
It improves the convenience of circuit board loading, enhances etching uniformity and efficiency, reduces device costs and the risk of damage to electronic components, and ensures etching quality and stability.
Smart Images

Figure CN120640544A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of etching technology, and in particular to a miniLED circuit board etching liquid immersion etching device. Background Art
[0002] In the manufacturing of miniLED circuit boards, the etching process is a key step in forming fine circuit patterns. Currently, existing technologies mostly use manual mechanical clamps for clamping and removing circuit boards. The specific operation steps are cumbersome: when loading, the operator must first manually open the clamp, then carefully place the miniLED circuit board in the clamping area of the clamp. Then, by tightening bolts and snaps, the clamping force of the clamp is adjusted one by one to ensure the circuit board is firmly fixed. This process is not only time-consuming, but even the slightest carelessness can cause the circuit board to deform or even be damaged due to uneven clamping force. After etching is completed, removing the circuit board is also troublesome. Some devices have attempted to use electric clamps. However, electric clamps have a significant cost disadvantage. Electric clamps require electronic components such as motors, sensors, and controllers, which are expensive to purchase. In addition, during the etching process, the movement of the circuit board in the etching liquid is single, usually just static immersion or simple horizontal movement. This makes the etching liquid not in sufficient contact with the surface of the circuit board, and uneven etching is prone to occur, which cannot meet the high-precision and high-reliability etching requirements of the miniLED circuit board. Summary of the Invention
[0003] The purpose of the present invention is to provide a miniLED circuit board etching liquid immersion etching device in order to solve the above problems, as described in detail below.
[0004] To achieve the above objectives, the present invention provides the following technical solutions: The present invention provides a miniLED circuit board etching liquid immersion etching device, comprising a base plate, a mounting frame slidably connected to the base plate via a sliding assembly, the mounting frame rotatably connected to a mounting plate, and a motor fixedly connected to the mounting frame for rotating the mounting plate; The mounting plate is rotatably connected to a plurality of clamps, the clamps clamping the circuit board, and the mounting frame is fixedly connected to a swing assembly, which can rotate the circuit board in cooperation with the swing assembly when the mounting plate rotates; The clamp includes two clamping plates close to each other, and an expansion component is fixedly connected to the mounting plate. When the mounting plate drives the circuit board to rotate to an angle greater than the horizontal angle, it cooperates with the expansion component to make the two clamping plates move away from each other and detach from the circuit board.
[0005] The above-mentioned miniLED circuit board etching liquid is used to immerse the etching device, and the mounting plate is rotated by the motor. After the mounting plate is rotated to a specified angle, the clamps of all the clamps can be unfolded with the cooperation of the unfolding component. Then, the circuit board can be placed between the two clamps. At this time, the angle of the circuit board is raised, so even if the clamp does not clamp the circuit board, the circuit board will not slide down from the clamp. The mounting plate is rotated in the opposite direction by the motor, and after it is separated from the unfolding component, the clamp can clamp the circuit board. The circuit board is moved to the top of the etching liquid tank by the mounting frame, and the mounting plate is rotated by the motor to immerse the circuit board in the etching liquid in the etching liquid tank. The motor and the mounting plate cooperate to drive the circuit board to swing back and forth in the etching liquid tank to stir the solution. In the process of the circuit board following the swing of the mounting plate, the circuit board cooperates with the swing component, and the clamp can rotate back and forth, so that the circuit board can swing back and forth and rotate back and forth at the same time, so that the circuit board is repeatedly in contact with the solution.
[0006] Preferably, the bottom plate is fixedly connected to an etching liquid tank and an ultrasonic cleaning tank, and the circuit board corresponds to the etching liquid tank and the ultrasonic cleaning tank.
[0007] Preferably, the sliding assembly includes a slide groove 1 and a slide groove 2 opened on both sides of the base plate, the depth direction of the slide groove 1 is perpendicular to and connected to the slide groove 2, the mounting frame is an inverted U-shape, and the two sides of the mounting frame are respectively fitted with clearances with the two slide grooves 1, and a guide block is slidably connected in the slide groove 2, and the guide block is fixedly connected to the mounting frame.
[0008] Preferably, a bolt is threadedly connected to the mounting bracket, and an end of the bolt corresponds to a side surface of the etching liquid tank or the ultrasonic cleaning tank.
[0009] Preferably, both sides of the mounting plate are fixedly connected with rotating shafts, the two rotating shafts are rotatably connected to the mounting plate, and the motor output shaft is fixedly connected to any end of the rotating shaft.
[0010] Preferably, the clamp includes a fixed sleeve, which is rotatably connected to the mounting plate, a rectangular rod is fixedly connected inside the fixed sleeve, the length direction of the rectangular rod is arranged along the diameter of the fixed sleeve, two movable plates are slidably connected to the rectangular rod, the bottom of the fixed sleeve is open, the movable plate passes through the bottom of the fixed sleeve and is fixedly connected to a clamping plate, a tension spring is provided on the surface of the rectangular rod, and the two ends of the tension spring are respectively fixedly connected to the two movable plates, and two springs are provided on the surface of the rectangular rod, and the two ends of the spring are respectively fixedly connected to the inner wall of the fixed sleeve and the movable plate.
[0011] Preferably, the unfolding assembly includes a vertical rod, which passes through the top of the fixed sleeve and is slidably connected to the top of the fixed sleeve. One end of the vertical rod inserted into the fixed sleeve is fixedly connected to a top block, which corresponds to the two movable plates. Both sides of the top block are provided with inclined surfaces for pushing the two movable plates to move the two movable plates away from each other.
[0012] Preferably, a pressure plate is rotatably connected to the top of the fixing sleeve, and the bottom of the pressure plate contacts the upper end of the vertical rod, and a plurality of limit rods corresponding to the pressure plate are fixedly connected to the mounting plate.
[0013] Preferably, two fixed plates are fixedly connected to the top of the fixed sleeve, a pin is rotatably connected between the two fixed plates, a pressure plate is fixedly connected to the pin, two torsion springs are sleeved on the surface of the pin, the two ends of the torsion springs are respectively fixedly connected to the pressure plate and the fixed plate, and the pin is lower than the top of the vertical rod.
[0014] Preferably, the swing assembly includes a torsion spring mounted on the surface of the clamp, the two ends of the torsion spring are respectively fixedly connected to the clamp and the mounting plate, an L-shaped rod is fixedly connected to the surface of the clamp, and a plurality of fixed rods are fixedly connected to the mounting frame, and the fixed rods are vertically arranged to correspond to the cross bar of the L-shaped rod.
[0015] The beneficial effects are: 1. The clamp cooperates with the expansion component. When the mounting plate rotates to a specified angle, the clamp can automatically expand to facilitate the placement of the circuit board. The upward angle of the circuit board can prevent it from slipping when it is not clamped. After the mounting plate rotates in the opposite direction and disengages from the expansion component, the clamp automatically clamps the circuit board. This design not only improves the convenience of loading; 2. The mounting frame, motor, and swing assembly work together to enable the circuit board to not only swing back and forth in the etching solution to stir the solution, but also to achieve its own reciprocating rotation during the swinging process, greatly increasing the contact frequency and contact area between the circuit board and the etching solution, significantly improving the etching uniformity and etching efficiency, and ensuring the etching quality of the miniLED circuit board; 3. The device integrates an etching liquid tank and an ultrasonic cleaning tank. Combined with a sliding component, the mounting frame slides between the two. Combined with the motor to control the rotation of the mounting plate, the efficiency of the circuit board from etching to cleaning can be improved. 4. The device operates primarily through mechanical linkage, eliminating the need for electric fixtures and complex electronic control systems. This avoids damage to electronic components in corrosive environments and significantly improves the stability and durability of the device. It also reduces the costs of purchasing, installing, debugging, and maintaining electronic components, resulting in a lower price compared to electric devices. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0017] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention; Figure 2 It is a front view structural schematic diagram of the present invention; Figure 3 This is a schematic diagram of the three-dimensional cross-sectional structure of the bottom plate of the present invention; Figure 4 Is a schematic structural diagram of the present invention, the circuit board is swung to a horizontal state; Figure 5 This is a schematic diagram of the three-dimensional structure of the mounting frame of the present invention; Figure 6 This invention Figure 5 A in the middle is an enlarged structural diagram; Figure 7 It is a schematic diagram of the three-dimensional cross-sectional structure of the fixing sleeve of the present invention; Figure 8 It is a schematic diagram of the three-dimensional structure of the fixing sleeve of the present invention.
[0018] The following are the descriptions of the reference numerals: 1. Bottom plate; 2. Etching liquid tank; 3. Ultrasonic cleaning tank; 4. Sliding assembly; 5. Mounting frame; 6. Mounting plate; 7. Motor; 8. Clamp; 9. Circuit board; 10. Slide chute 1; 11. Slide chute 2; 12. Guide block; 13. Bolt; 14. Rotating shaft; 15. Torsion spring 1; 16. Swing assembly; 17. Unfolding assembly; 18. Fixed rod; 19. L-shaped rod; 20. Rectangular rod; 21. Tension spring; 22. Spring; 23. Movable plate; 24. Clamp; 25. Top block; 26. Arc surface; 27. Vertical rod; 28. Pressure plate; 29. Limit rod; 30. Pin; 31. Fixed plate; 32. Torsion spring 2; 33. Fixed sleeve. DETAILED DESCRIPTION
[0019] To make the objectives, technical solutions, and advantages of the present invention more apparent, the technical solutions of the present invention will be described in detail below. Obviously, the embodiments described are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other implementations obtained by those of ordinary skill in the art without inventive effort are within the scope of protection of the present invention.
[0020] See also Figures 1-8 As shown, the present invention provides a miniLED circuit board etching liquid immersion etching device, including a base plate 1, a mounting frame 5 is slidably connected to the base plate 1 through a sliding component 4, the mounting frame 5 is rotatably connected to the mounting plate 6, and the mounting frame 5 is fixedly connected to a motor 7 for rotating the mounting plate 6; The mounting plate 6 is rotatably connected to a plurality of clamps 8, which hold a circuit board 9. The mounting frame 5 is fixedly connected to a swing assembly 16. When the mounting plate 6 rotates, it cooperates with the swing assembly 16 to rotate the circuit board 9. The clamp 8 includes two clamping plates 24 close to each other, and an expansion component 17 is fixedly connected to the mounting plate 6. When the mounting plate 6 drives the circuit board 9 to rotate to an angle greater than the horizontal angle, it cooperates with the expansion component 17 to make the two clamping plates 24 move away from each other and detach from the circuit board 9.
[0021] As an optional embodiment, the base plate 1 is fixedly connected to the etching liquid tank 2 and the ultrasonic cleaning tank 3, and the circuit board 9 corresponds to the etching liquid tank 2 and the ultrasonic cleaning tank 3. The guide block 12 in the sliding assembly 4 slides in the slide groove 11, driving the mounting frame 5 to move horizontally to just above the etching liquid tank 2. After cleaning is completed, the motor 7 rotates in the opposite direction to remove the circuit board 9 from the cleaning tank. The motor 7 drives the mounting plate 6 to rotate downward, immersing the circuit board 9 in the cleaning liquid. The ultrasonic generator is started to remove the etching liquid and impurities remaining on the surface of the circuit board through high-frequency vibration. The mounting plate 6 can swing slightly to enhance the cleaning effect.
[0022] A liquid level sensor and a photoelectric sensor are set at the bottom of the etching liquid tank 2. When abnormal liquid level changes or circuit board images are detected, the machine will be stopped and an alarm will be issued immediately to prevent the circuit board 9 from sliding off.
[0023] The sliding assembly 4 includes a slide groove 10 and a slide groove 2 11 opened on both sides of the base plate 1. The depth direction of the slide groove 10 is perpendicular to and connected to the slide groove 2 11. The mounting frame 5 is an inverted U-shape. The two sides of the mounting frame 5 are respectively fitted with gaps between the two slide grooves 10. A guide block 12 is slidably connected in the slide groove 2 11. The guide block 12 is fixedly connected to the mounting frame 5. The sliding assembly 4 adopts a manual structure and can also be replaced by an electric drive, such as a linear motor.
[0024] The mounting frame 5 is threadedly connected with a bolt 13 , the end of the bolt 13 corresponds to the side of the etching liquid tank 2 or the ultrasonic cleaning tank 3 , and the bolt 13 is rotated so that its end is against the side of the etching liquid tank 2 to fix the position of the mounting frame 5 .
[0025] Rotating shafts 14 are fixedly connected to both sides of the mounting plate 6 . The two rotating shafts 14 are rotatably connected to the mounting plate 6 , and the output shaft of the motor 7 is fixedly connected to the end of any one of the rotating shafts 14 .
[0026] The clamp 8 includes a fixed sleeve 33, which is rotatably connected to the mounting plate 6. A rectangular rod 20 is fixedly connected inside the fixed sleeve 33. The length direction of the rectangular rod 20 is set along the diameter of the fixed sleeve 33. Two movable plates 23 are slidably connected to the rectangular rod 20. The bottom of the fixed sleeve 33 is open. The movable plate 23 passes through the bottom of the fixed sleeve 33 and is fixedly connected to the splint 24. A tension spring 21 is provided on the surface of the rectangular rod 20. The two ends of the tension spring 21 are respectively fixedly connected to the two movable plates 23. Two springs 22 are provided on the surface of the rectangular rod 20. The two ends of the spring 22 are respectively fixedly connected to the inner wall of the fixed sleeve 33 and the movable plate 23.
[0027] The tension spring 21 is sleeved on the surface of the rectangular rod 20, and its two ends are respectively connected to the two movable plates 23, providing a pulling force to bring the two movable plates 23 closer to each other; the spring 22 is also sleeved on the surface of the rectangular rod 20, and its two ends are respectively connected to the inner wall of the fixed sleeve 33 and the movable plate 23, playing the role of assisting resetting and adjusting the clamping force.
[0028] The clamp 8 utilizes a dual elastic element structure consisting of a tension spring 21 and a spring 22. The ends of the tension spring 21 connect to two movable plates 23, primarily providing a lateral contraction force that pulls the clamping plates 24 toward the center. One end of the spring 22 is connected to the inner wall of the fixed sleeve 33, while the other end acts on the movable plates 23. This assists the tension spring 21 in enhancing the clamping effect while also providing a buffer and fine-tuning effect. These two elements work together to generate a stable and strong clamping force when the clamping plates 24 are closed, firmly securing the circuit board 9.
[0029] During the device development and production stages, the fixture 8 is subjected to a static clamping force test. Standard test plates of varying weights, sizes, and shapes are placed in the fixture 8, and the maximum tension and thrust that the clamping plate 24 can withstand after being clamped is measured to ensure that its clamping force meets the design requirements while leaving a certain safety margin. Dynamic simulation tests are then performed on the fixture 8, simulating the actual working conditions of the circuit board 9 during the etching process. The fixture 8, with the circuit board 9 mounted, is placed in a simulated etching solution tank 2. The motor 7 drives the mounting plate 6 to swing back and forth and rotate, while monitoring the changes in the clamping force of the clamping plate 24 and the fixed state of the circuit board 9. Repeated tests verify that the fixture 8 can maintain sufficient clamping force in a dynamic environment, ensuring the stable fixation of the circuit board 9. When no external force is applied, the elastic force of the tension spring 21 and the spring 22 pulls the two clamping plates 24 toward each other, clamping them. When the circuit board 9 needs to be placed, the external force and the expansion assembly cooperate, and the movable plate 23 overcomes the elastic force of the tension spring 21 and the spring 22, slides on the rectangular rod 20, and drives the clamping plates 24 away from each other, opening the clamp 8. When the external force disappears, the tension spring 21 and the spring 22 return to their original position, pulling the movable plate 23 and the clamping plates 24 to clamp the circuit board 9, thus achieving stable clamping of the circuit board 9.
[0030] The unfolding assembly 17 includes a vertical rod 27, which passes through the top of the fixed sleeve 33 and is slidably connected to the top of the fixed sleeve 33. One end of the vertical rod 27 inserted into the fixed sleeve 33 is fixedly connected to a top block 25, which corresponds to the two movable plates 23. Both sides of the top block 25 are provided with inclined surfaces for pushing the two movable plates 23 to move the two movable plates 23 away from each other.
[0031] The top of the fixing sleeve 33 is rotatably connected to a pressing plate 28 , and the bottom of the pressing plate 28 contacts the upper end of the vertical rod 27 . A plurality of limiting rods 29 corresponding to the pressing plate 28 are fixedly connected to the mounting plate 5 .
[0032] When the mounting plate 6 rotates to a specified angle, the pressure plate 28 is blocked by the limiting rod 29. The pressure plate 28 then pushes the vertical rod 27, which in turn drives the top block 25 downward. After the inclined surfaces on both sides of the top block 25 come into contact with the movable plate 23, as the top block 25 continues to descend, the inclined surfaces generate a horizontal force component, pushing the two movable plates 23 to slide on the rectangular rod 20, overcoming the elastic force of the tension spring 21 and the spring 22, and causing the two clamping plates 24 to move away from each other.
[0033] Two fixed plates 31 are fixedly connected to the top of the fixed sleeve 33, and a pin shaft 30 is rotatably connected between the two fixed plates 31. A pressure plate 28 is fixedly connected to the pin shaft 30, and a torsion spring 232 is sleeved on the surface of the pin shaft 30. The two ends of the torsion spring 232 are fixedly connected to the pressure plate 28 and the fixed plate 31 respectively. The pin shaft 30 is lower than the top of the vertical rod 27.
[0034] The swing assembly 16 includes a torsion spring 15 sleeved on the surface of the clamp 8. The two ends of the torsion spring 15 are fixedly connected to the clamp 8 and the mounting plate 6 respectively. An L-shaped rod 19 is fixedly connected to the surface of the clamp 8. A plurality of fixed rods 18 are fixedly connected to the mounting frame 5. The fixed rods 18 are vertically arranged to correspond to the crossbars of the L-shaped rods 19. The L-shaped rod 19 on the surface of the clamp 8 interacts with the fixed rod 18 on the mounting frame 5. When the mounting plate 6 drives the circuit board 9 to swing, the cross bar of the L-shaped rod 19 contacts and is subjected to force on the fixed rod 18, so that the clamp 8 overcomes the elastic force of the torsion spring 15 and rotates back and forth on the mounting plate 6, thereby achieving the circuit board 9 to rotate back and forth while swinging back and forth, increasing the contact frequency and contact area between the circuit board 9 and the etching liquid, and improving the etching uniformity and efficiency. A polyurethane buffer pad is added at the contact end of the L-shaped rod 19 and the fixed rod 18 to reduce the impact force of the collision.
[0035] With the above structure, the motor 7 rotates the mounting plate 6. After the mounting plate 6 rotates to a specified angle, the unfolding assembly 17 cooperates to unfold all the clamps 24 of the clamp 8. Then, the circuit board 9 can be placed between the two clamps 24. At this time, the angle of the circuit board 9 is raised. Therefore, even if the clamp 8 does not clamp the circuit board 9, the circuit board 9 will not slide down from the clamp 8. The motor 7 rotates the mounting plate 6 in the opposite direction. After the unfolding assembly 17 is disengaged, the clamp 8 can clamp the circuit board 9. The circuit board 9 is moved to the top of the etching liquid tank 2 by the mounting frame 5, and the mounting plate 6 is rotated by the motor 7 to immerse the circuit board 9 in the etching liquid in the etching liquid tank 2. The motor 7 cooperates with the mounting plate 6 to drive the circuit board 9 to swing back and forth in the etching liquid tank 2 to stir the solution. In addition, the circuit board 9 cooperates with the swinging assembly 16 during the swinging of the mounting plate 6, and the clamp 8 can rotate back and forth, so that the circuit board 9 can swing back and forth and rotate back and forth at the same time, so that the circuit board 9 is repeatedly in contact with the solution.
[0036] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any modifications or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present invention should be included in the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.
Claims
1. A miniLED circuit board etching liquid immersion etching device, characterized by: The invention comprises a base plate (1), a mounting frame (5) being slidably connected to the base plate (1) via a sliding assembly (4), the mounting frame (5) being rotatably connected to a mounting plate (6), and a motor (7) being fixedly connected to the mounting frame (5) for rotating the mounting plate (6); The mounting plate (6) is rotatably connected to a plurality of clamps (8), the clamps (8) clamp a circuit board (9), and the mounting frame (5) is fixedly connected to a swing assembly (16), and when the mounting plate (6) rotates, it cooperates with the swing assembly (16) to rotate the circuit board (9); The clamp (8) includes two clamping plates (24) close to each other, and an expansion component (17) is fixedly connected to the mounting plate (6). When the mounting plate (6) drives the circuit board (9) to rotate to an angle greater than the horizontal angle, the mounting plate (6) cooperates with the expansion component (17) to move the two clamping plates (24) away from each other and detach from the circuit board (9).
2. A miniLED circuit board etching liquid immersion etching device according to claim 1, characterized in that: The bottom plate (1) is fixedly connected to an etching liquid tank (2) and an ultrasonic cleaning tank (3), and the circuit board (9) corresponds to the etching liquid tank (2) and the ultrasonic cleaning tank (3).
3. The miniLED circuit board etching liquid immersion etching device according to claim 1, characterized in that: The sliding assembly (4) includes a first slide groove (10) and a second slide groove (11) provided on both sides of the bottom plate (1). The depth direction of the first slide groove (10) is perpendicular to and connected to the second slide groove (11). The mounting frame (5) is an inverted U-shape. The two sides of the mounting frame (5) are respectively fitted with clearances between the two first slide grooves (10). A guide block (12) is slidably connected in the second slide groove (11). The guide block (12) is fixedly connected to the mounting frame (5).
4. A miniLED circuit board etching liquid immersion etching device according to claim 3, characterized in that: The mounting frame (5) is threadedly connected with a bolt (13), and the end of the bolt (13) corresponds to the side of the etching liquid tank (2) or the ultrasonic cleaning tank (3).
5. The miniLED circuit board etching liquid immersion etching device according to claim 1, characterized in that: Rotating shafts (14) are fixedly connected to both sides of the mounting plate (6), the two rotating shafts (14) are rotatably connected to the mounting plate (6), and the output shaft of the motor (7) is fixedly connected to the end of any one of the rotating shafts (14).
6. The miniLED circuit board etching liquid immersion etching device according to claim 1, characterized in that: The clamp (8) includes a fixed sleeve (33), the fixed sleeve (33) is rotatably connected to the mounting plate (6), a rectangular rod (20) is fixedly connected inside the fixed sleeve (33), the length direction of the rectangular rod (20) is arranged along the diameter of the fixed sleeve (33), two movable plates (23) are slidably connected to the rectangular rod (20), the bottom of the fixed sleeve (33) is open, the movable plate (23) passes through the bottom of the fixed sleeve (33) and is fixedly connected to the clamp (24), a tension spring (21) is sleeved on the surface of the rectangular rod (20), and the two ends of the tension spring (21) are respectively fixedly connected to the two movable plates (23), and two springs (22) are sleeved on the surface of the rectangular rod (20), and the two ends of the spring (22) are respectively fixedly connected to the inner wall of the fixed sleeve (33) and the movable plate (23).
7. The miniLED circuit board etching liquid immersion etching device according to claim 6, characterized in that: The unfolding assembly (17) includes a vertical rod (27), the vertical rod (27) passes through the top of the fixed sleeve (33) and is slidably connected to the top of the fixed sleeve (33), and one end of the vertical rod (27) inserted into the fixed sleeve (33) is fixedly connected to a top block (25), and the top block (25) corresponds to the two movable plates (23). Both sides of the top block (25) are provided with inclined surfaces for pushing the two movable plates (23) to move the two movable plates (23) away from each other.
8. The miniLED circuit board etching liquid immersion etching device according to claim 7, characterized in that: The top of the fixed sleeve (33) is rotatably connected to a pressing plate (28), and the bottom of the pressing plate (28) contacts the upper end of the vertical rod (27). The mounting plate (5) is fixedly connected to a plurality of limiting rods (29) corresponding to the pressing plate (28).
9. The miniLED circuit board etching liquid immersion etching device according to claim 8, characterized in that: The top of the fixed sleeve (33) is fixedly connected to two fixed plates (31), and a pin shaft (30) is rotatably connected between the two fixed plates (31). A pressure plate (28) is fixedly connected to the pin shaft (30), and a second torsion spring (32) is sleeved on the surface of the pin shaft (30). The two ends of the second torsion spring (32) are fixedly connected to the pressure plate (28) and the fixed plate (31), respectively. The pin shaft (30) is lower than the top of the vertical rod (27).
10. The miniLED circuit board etching liquid immersion etching device according to claim 1, characterized in that: The swing assembly (16) includes a torsion spring (15) sleeved on the surface of the clamp (8), the two ends of the torsion spring (15) are fixedly connected to the clamp (8) and the mounting plate (6), respectively, an L-shaped rod (19) is fixedly connected to the surface of the clamp (8), and a plurality of fixed rods (18) are fixedly connected to the mounting frame (5), and the fixed rods (18) are vertically arranged to correspond to the crossbar of the L-shaped rod (19).
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