Solution for attaching mylar bubbles to copper-free area of wireless charging product

Abstract

The invention discloses a solution for pasting mylar bubbles in a copper-free area of a wireless charging product, and relates to the technical field of wireless charging, and the solution comprises the following steps: S1, cutting a copper foil, and cutting a raw material according to the size and requirements of the product; s2, forming 0.6 mm air holes in a copper-free area, corresponding to mylar lamination, of the copper foil; s3, copper plating is carried out on the perforated copper foil, and a circuit pattern of the copper foil is manufactured; s4, air holes of 1.0 mm are formed in the covering film, and then the covering film with the air holes is attached to the copper foil; s5, the covering film and the copper foil are tightly combined through pressure; s6, nickel and gold are deposited on the surface of the copper foil; and S7, the mylar is attached to the copper foil. The air holes are formed in the copper foil and the covering film, the positions of the air holes in the copper foil and the positions of the air holes in the covering film are kept consistent, bubbles generated in the attaching process can be effectively discharged, the problem of mylar bubbles is solved, the defects of a traditional technology are optimized, and the production efficiency and the product quality are improved.

Description

Technical Field

[0001] The present invention relates to the field of wireless charging technology, and in particular to a solution for pasting Mylar bubbles in copper-free areas of wireless charging products. Background Art

[0002] Wireless charging technology enables contactless power transmission. Currently, it is categorized into three main types: electromagnetic induction, electromagnetic resonance, and radio waves. Smartphones, tablets, wireless headphones, and other devices have widely adopted wireless charging technology. With the development of wireless charging technology, the performance requirements for wireless charging products are becoming increasingly demanding.

[0003] The processing of copper foil and cover film is a critical step in the manufacturing of wireless charging products. The copper foil of traditional wireless charging products is approximately 0.07mm thicker than that of conventional FPCs, and the copper-free areas have deeper steps. This prevents conventional processes from effectively removing air bubbles during the attachment process, thus affecting product performance and reliability. Summary of the Invention

[0004] The purpose of the present invention is to provide a solution to the problem of bubbles in the Mylar lamination process in the copper-free area of ​​a wireless charging product. The method solves the bubble problem by opening air holes in the copper foil and the cover film to ensure that the bubbles generated during the Mylar lamination process can be discharged smoothly.

[0005] In order to achieve the above objectives, the present invention provides the following technical solution: a solution for attaching Mylar bubbles to the copper-free area of ​​a wireless charging product, comprising the following steps: S1: Cutting of copper foil, cutting raw materials according to product size and requirements; S2: Open a 0.6mm vent hole in the copper-free area where the copper foil corresponds to the Mylar laminate. S3: copper plating is performed on the copper foil after the holes are opened to produce a circuit pattern of the copper foil; S4: Open 1.0 mm air holes on the cover film, and then attach the cover film with air holes to the copper foil; S5: The cover film and the copper foil are tightly bonded by pressure; S6: Nickel-gold is deposited on the surface of the copper foil to improve the surface hardness and oxidation resistance; S7: Laminate the Mylar film onto the copper foil and apply pressure to tightly bond the Mylar film and the copper foil.

[0006] Furthermore, in S2, the ventilation holes on the copper foil avoid the main circuit area, pads and sensitive components on the copper foil, ensuring that the ventilation holes do not have a negative impact on the electrical performance of the copper foil, thereby solving the bubble problem while maintaining the functional integrity of the product.

[0007] Furthermore, in S2, the depth of the air holes on the copper foil penetrates the entire copper foil layer, ensuring that the bubbles can be directly discharged from the copper-free area to the outside instead of being trapped inside the copper foil, thereby effectively solving the bubble problem.

[0008] Furthermore, in S2, the ventilation holes on the copper foil are formed by using high-precision laser drilling equipment, thereby ensuring the dimensional accuracy and position accuracy of the ventilation holes.

[0009] Furthermore, in said S4, the processing flow of the covering film is as follows: a. Cutting: Cutting raw materials according to product size and requirements; b. Drilling: Drill 1.0mm air holes in the corresponding Mylar area of ​​the cover film; c. Punching: Punch the covering film into the required shape.

[0010] Furthermore, the depth of the air holes on the covering film runs through the entire covering film layer, ensuring that bubbles can be discharged smoothly through the covering film.

[0011] Furthermore, the ventilation holes on the covering film are formed by high-precision laser drilling equipment, thereby ensuring the size accuracy and position accuracy of the ventilation holes.

[0012] Furthermore, the positions of the vent holes on the copper foil and the vent holes on the cover film are consistent, and the alignment accuracy error does not exceed 0.1 mm, ensuring that bubbles can be discharged smoothly through the vent holes, thereby improving the efficiency and reliability of bubble discharge.

[0013] In the above technical solution, the technical effects and advantages provided by the present invention are: By setting ventilation holes on the copper foil and the cover film, the positions of the ventilation holes on the copper foil and the cover film are consistent, which can effectively discharge the bubbles generated during the bonding process, solve the problem of Mylar bubbles, optimize the shortcomings of the traditional process, and improve production efficiency and product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments described in the present invention. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0015] Figure 1 It is a schematic diagram of the steps of the present invention; Figure 2 Schematic diagram of the product made for the present invention; Figure 3 Schematic diagram of products made using traditional craftsmanship. DETAILED DESCRIPTION

[0016] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings.

[0017] The present invention provides Figures 1 to 2 A solution to the problem of Mylar bubbles in the copper-free area of ​​a wireless charging product is shown, comprising the following steps: S1: Cutting of copper foil: Cutting the copper foil raw materials into the required size and shape according to product size and design requirements; S2: Use high-precision laser drilling equipment to create ventilation holes with a diameter of 0.6mm in the copper-free area of ​​the copper foil corresponding to the Mylar bonding. The depth of the ventilation holes should penetrate the entire copper foil layer. When opening the ventilation holes, pay special attention to avoid the main circuit areas, pads and sensitive components on the copper foil to ensure that the electrical performance of the copper foil is not affected. S3: copper plating is performed on the copper foil after the opening to form a uniform copper layer, and then a circuit pattern of the copper foil is made; S4: Processing of the cover film: Cut the cover film raw material according to the product size and requirements, then use high-precision laser drilling equipment to drill 1.0mm diameter ventilation holes in the corresponding Mylar area of ​​the cover film. The depth of the ventilation holes should penetrate the entire cover film layer. Then, punch the cover film into the required shape, ensuring that the size and shape of the cover film meet the design requirements. Finally, the cover film with ventilation holes is bonded to the copper foil. S5: Use pressure to tightly bond the cover film to the copper foil. During the bonding process, ensure that the vent holes on the cover film are precisely aligned with the vent holes on the copper foil, with an alignment accuracy error of no more than 0.1 mm. S6: Nickel-gold is deposited on the surface of the copper foil to improve the surface hardness and oxidation resistance; S7: Laminate the Mylar film onto the copper foil and apply pressure to tightly bond the Mylar film and the copper foil.

[0018] Through the above steps, a 0.6mm diameter air hole is opened in the copper-free area where the copper foil corresponds to the Mylar bonding, and a 1.0mm diameter air hole is opened in the Mylar area of ​​the cover film. After the cover film is tightly combined with the copper foil, the air holes on the cover film are precisely aligned with the air holes on the copper foil, and the alignment accuracy error does not exceed 0.1 mm, forming an exhaust channel. After the Mylar is bonded to the copper foil, the air holes are provided on the copper foil and the cover film, which can effectively discharge bubbles generated during the bonding process, solve the Mylar bubble problem, optimize the shortcomings of the traditional process, and improve production efficiency and product quality.

[0019] The above description is merely illustrative of certain exemplary embodiments of the present invention. It goes without saying that those skilled in the art will be able to modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and description are illustrative in nature and should not be construed as limiting the scope of protection of the claims.

Claims

1. A solution to the problem of Mylar bubbles in copper-free areas of wireless charging products, characterized by: The following steps are involved: S1: Cutting of copper foil, cutting raw materials according to product size and requirements; S2: Open a 0.6mm vent hole in the copper-free area where the copper foil corresponds to the Mylar laminate. S3: copper plating is performed on the copper foil after the holes are opened to produce a circuit pattern of the copper foil; S4: Open 1.0 mm air holes on the cover film, and then attach the cover film with air holes to the copper foil; S5: The cover film and the copper foil are tightly bonded by pressure; S6: Nickel-gold is deposited on the surface of the copper foil to improve the surface hardness and oxidation resistance; S7: Laminate the Mylar film onto the copper foil and apply pressure to tightly bond the Mylar film and the copper foil.

2. A solution to the problem of Mylar bubbles in copper-free areas of wireless charging products according to claim 1, characterized in that: In the above-mentioned S2, the ventilation holes on the copper foil are formed to avoid the main circuit area, pads and sensitive components on the copper foil.

3. A solution to the problem of Mylar bubbles in copper-free areas of wireless charging products according to claim 1, characterized in that: In the above-mentioned S2, the depth of the vent holes on the copper foil runs through the entire copper foil layer.

4. A solution to the problem of Mylar bubbles in copper-free areas of wireless charging products according to claim 1, characterized in that: In the above-mentioned S2, the air holes on the copper foil are formed by using high-precision laser drilling equipment.

5. The solution to the problem of Mylar bubbles in copper-free areas of wireless charging products according to claim 1, characterized in that: In S4, the processing flow of the covering film is as follows: a. Cutting: Cutting raw materials according to product size and requirements; b. Drilling: Drill 1.0mm air holes in the corresponding Mylar area of ​​the cover film; c. Punching: Punch the covering film into the required shape.

6. A solution to the problem of Mylar bubbles in copper-free areas of wireless charging products according to claim 5, characterized in that: The depth of the air holes on the covering film runs through the entire covering film layer.

7. A solution to the problem of Mylar bubbles in copper-free areas of wireless charging products according to claim 5, characterized in that: The air holes on the covering film are formed by high-precision laser drilling equipment.

8. The solution to the problem of Mylar bubbles in copper-free areas of wireless charging products according to claim 1, characterized in that: The positions of the ventilation holes on the copper foil and the ventilation holes on the cover film are consistent, and the alignment accuracy error does not exceed 0.1 mm.

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