Annular semiconductor COS laser shell sintering fixing device and fixing method

Abstract

The invention provides an annular semiconductor COS laser shell sintering fixing device and method, and relates to the technical field of laser welding equipment manufacturing, the annular semiconductor COS laser shell sintering fixing device comprises a base, the two ends of the base are connected with supporting frames respectively; the supporting frames are connected to the two ends of the base respectively; the sintering fixing blocks are connected between the two supporting frames; the sintering fixing block is provided with at least one first mounting hole and at least two second mounting holes which are arranged at intervals in the second direction, and the first mounting hole and the second mounting holes are arranged in the first direction; the size of the first mounting hole in the second direction is larger than that of the second mounting hole in the second direction, and the first mounting hole and the second mounting hole are respectively used for mounting sintering probes; and each sintering probe corresponds to one to-be-sintered chip of the to-be-sintered annular semiconductor laser shell. The effect that a user can easily adjust the pressure between the sintering fixing block and the to-be-sintered chip is achieved.

Description

Technical Field

[0001] The present application relates to the technical field of laser welding equipment manufacturing, and in particular to a sintering and fixing device and a fixing method for a ring-shaped semiconductor COS laser housing. Background Art

[0002] Laser technology has a wide range of applications, including welding and cutting. COS (Chip On Sub-mount) packaging is one of the mainstream semiconductor laser packaging formats. To achieve higher welding quality with an annular spot, existing technologies employ an annular double-layer chip structure of an annular semiconductor COS laser. However, this laser chip structure is difficult to sinter, complex to operate, and prone to sintering position shifts. Existing laser sintering fixtures are unable to stably secure the annular semiconductor laser housing and chip to be sintered, failing to meet the refined sintering requirements. Summary of the Invention

[0003] The purpose of this application is to provide a sintering and fixing device and a fixing method for a ring-shaped semiconductor COS laser shell, so as to improve the technical problems raised in the background technology section.

[0004] To achieve the above objectives, this application provides the following technical solutions: In a first aspect, the present application provides a sintering and fixing device for a ring-shaped semiconductor laser housing, comprising: A base, with both ends of the base connected to the support frames; Support frames, the support frames are respectively connected to both ends of the base; A plurality of rotatable sintering fixing blocks are connected between the two support frames, and the plurality of sintering fixing blocks form a hollow area to accommodate the ring-shaped semiconductor laser housing to be sintered; The sintering fixing block has at least one first mounting hole (1660) and at least two second mounting holes (1670) arranged at intervals along the second direction, wherein the first mounting hole (1660) and the second mounting holes (1670) are arranged along the first direction; The size of the first mounting hole in the second direction is larger than that of the second mounting hole in the second direction. The first mounting hole and the second mounting hole are used to install sintering probes respectively. Each sintering probe corresponds to a chip to be sintered in the ring-shaped semiconductor laser housing to be sintered.

[0005] Furthermore, the first direction is set to be parallel to the axial direction of the ring-shaped semiconductor laser housing, and the second direction is set to be the circumferential direction of the ring-shaped semiconductor laser housing.

[0006] Furthermore, the support frame includes: a first support frame outer ring, the first support frame outer ring being connected to a first end of the base; a second support frame outer ring, the second support frame outer ring being connected to the second end of the base; a first support frame inner ring, the first support frame inner ring being interlocked with the first support frame outer ring, and the first support frame inner ring being rotatable relative to the first support frame outer ring; The second support frame inner ring is locked with the second support frame outer ring, and the second support frame inner ring is rotatable relative to the second support frame outer ring.

[0007] Furthermore, the cutting path of the first mounting hole is shorter than the cutting path of the second mounting hole; and / or, The area of ​​the first mounting hole is larger than the area of ​​the second mounting hole.

[0008] Furthermore, the sintered fixed block includes: A first connecting portion, the first connecting portion being connected to the inner ring of the first supporting frame; a second connecting portion, the second connecting portion being connected to the inner ring of the second supporting frame; a first mounting portion, wherein a first mounting hole is formed on the first mounting portion; A second mounting portion is formed with a second mounting hole.

[0009] Furthermore, both sides of the second mounting portion along the second direction have a fixed inclination angle toward the chip to be sintered; and / or, the first connecting portion and the second connecting portion both have a U-shaped hollow structure.

[0010] Furthermore, the second mounting part includes a rotating shaft, a first hinge part and a second hinge part. The rotating shaft is provided with a spring so that the first hinge part and the second hinge part have a self-restoring force toward the chip to be sintered on both sides along the second direction. The sintering probe on the second mounting part automatically adjusts the angle according to the position of the ring-shaped semiconductor laser shell to be sintered.

[0011] Furthermore, the first mounting portion and the second mounting portion form a T-shaped structure, and the length of the first mounting portion along the second direction is shorter than the length of the second mounting portion along the second direction.

[0012] Furthermore, a plurality of detachable first fixed sliders are provided along the circumferential direction at the edge of the inner ring of the first support frame, and the first connecting portion, the first fixed sliders and the inner ring of the first support frame are connected and fixed by fixing members; A plurality of detachable second fixed sliding blocks are arranged along the circumferential direction at the edge of the inner ring of the second support frame, and the second connecting portion, the second fixed sliding blocks and the inner ring of the second support frame are connected and fixed by fixing members.

[0013] A second aspect of the present application provides a method for sintering and fixing a ring-shaped semiconductor laser housing, comprising: Step S10: installing the ring-shaped semiconductor laser housing to be sintered between two support frames; Step S20: installing a plurality of sintered fixed blocks between two support frames; Step S30: Installing sintering probes in the first mounting hole and the second mounting hole, and using the plurality of sintering probes to press the plurality of chips to be sintered against the ring-shaped semiconductor laser housing to be sintered in a one-to-one correspondence; Step S40: placing the ring-shaped semiconductor laser housing sintering fixture obtained in step S30, the chip to be sintered, and the ring-shaped semiconductor laser housing to be sintered into a reflow furnace for sintering.

[0014] A third aspect of the present application provides a method for sintering and fixing a ring-shaped semiconductor laser housing, comprising: Step S11, installing the ring-shaped semiconductor laser housing to be sintered between two support frames; Step S21, determining the number of sintering fixed blocks, first fixed sliders, and second fixed sliders corresponding to the ring-shaped semiconductor laser housing to be sintered; Step S31: Install the required number of first fixed sliders and second fixed sliders on the first support frame inner ring and the second support frame inner ring respectively, and install the required number of sintered fixed blocks between the first support frame inner ring and the second support frame inner ring; Step S41: Install sintering probes in the first mounting hole and the second mounting hole, and press the multiple chips against the ring-shaped semiconductor laser housing to be sintered in a one-to-one correspondence with the multiple sintering probes. Step S51 , placing the ring-shaped semiconductor laser housing sintering fixture obtained in step S41 , the chip to be sintered, and the ring-shaped semiconductor laser housing to be sintered into a reflow furnace for sintering.

[0015] The present application has at least the following advantages or beneficial effects: The present application solves the technical problems of the annular semiconductor COS laser in the annular double-layer chip structure, such as the difficulty in sintering the chip to be sintered, the complex operation, and the easy displacement of the sintering position, by designing a fixing device that facilitates sintering the chip to be sintered to the ring-shaped semiconductor laser housing. The application achieves the technical effect of facilitating 360-degree adjustment of the structure such as the chip to be sintered, easily adjusting the pressure between the sintering fixing block and the chip to be sintered, and gradually releasing the pressure of the sintering fixing block on the chip to be sintered as the solder melts. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the specific implementation methods of the present application or the technical solutions in the prior art, the following is a brief introduction to the drawings required for use in the specific implementation methods or the description of the prior art. Obviously, the drawings described below are some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0017] Figure 1 A schematic diagram of a sintering and fixing device for a ring-shaped semiconductor laser housing provided in Example 1 of the present application, wherein a ring-shaped semiconductor laser housing is placed inside; Figure 2 A schematic diagram of a sintering and fixing device for a ring-shaped semiconductor laser housing provided in Example 1 of the present application, wherein no ring-shaped semiconductor laser housing is placed inside; Figure 3 Schematic diagram of the base, first support frame outer ring, second support frame outer ring, first support frame inner ring, second support frame inner ring and annular semiconductor laser housing provided in Example 1 of the present application; Figure 4A This is an exploded view of the right side of the first support frame outer ring and the first support frame inner ring provided in Example 1 of the present application; Figure 4B This is an exploded view of the left side of the first support frame outer ring and the first support frame inner ring provided in Example 1 of the present application; Figure 5A This is an exploded view of the right side of the second support frame outer ring and the second support frame inner ring provided in Example 1 of the present application; Figure 5B This is an exploded view of the left side of the second support frame outer ring and the second support frame inner ring provided in Example 1 of the present application; Figure 6A This is a front view of the sintered fixing block provided in Example 1 of the present application; Figure 6B This is a schematic diagram of the back side of the sintered fixing block provided in Example 1 of the present application; Figure 6C This is an exploded view of the sintering fixing block and the sintering probe provided in Example 1 of the present application; Figure 6D A schematic diagram of the coordination between the sintering fixing block and the chip to be sintered provided in Example 1 of the present application; Figure 7A A schematic diagram of a ring-shaped semiconductor laser housing to be sintered provided in an embodiment of the present application; Figure 7B A schematic diagram of a chip to be sintered being sintered to a ring-shaped semiconductor laser housing provided in an embodiment of the present application; Figure 7C for Figure 7B A local enlarged view of area A; Figure 7D for Figure 7C Schematic diagram of the optimized structure shown; Figure 8A for Figure 6C A local enlarged view of the D region; Figure 8B Schematic diagram of the tool path for the first mounting hole; Figure 8C Schematic diagram of the tool path for the second mounting hole; Figure 9A A front view schematic diagram of the sintering fixing block and the sintering probe provided in Example 2 of the present application; Figure 9B This is a schematic diagram of the back side of the sintered fixing block provided in Example 2 of the present application; Figure 9C A schematic diagram of the inner ring of the first support frame provided in Example 2 of the present application; Figure 10 This is a flow chart of a method for sintering and fixing a ring-shaped semiconductor laser housing applied to the ring-shaped semiconductor laser housing sintering and fixing device described in Example 1; Figure 11 This is a flow chart of a method for sintering and fixing a ring-shaped semiconductor laser housing applied to the ring-shaped semiconductor laser housing sintering and fixing device described in the second embodiment.

[0018] Reference numerals: 100 - ring-shaped semiconductor laser housing sintering fixture; 110 - base; 120 - first support frame outer ring; 1201 - first annular groove; 140 - first support frame inner ring; 1401 - first annular protrusion; 1402 - first positioning column; 1403 - first fixed slider; 1404 - first fixing hole; 1405 - second fixing hole; 130 - second support frame outer ring; 1301 - second annular groove; 150 - second support frame inner ring; 1501 - second annular protrusion; 1502 - second positioning column; 160 - sintering fixed block; 1610 - first connecting portion; 1620 - second connecting portion; 1630 - first mounting portion; 1640 - second mounting portion; 1650 - sintering probe; 1660 - first mounting hole; 1670 - second mounting hole; 1641 - rotating shaft; 1642 - first hinge portion; 1643 - second hinge portion; 1680 - positioning hole; 200 - annular semiconductor laser housing; 210 - chip to be sintered; 220 - positioning step; 230 - guide groove. DETAILED DESCRIPTION

[0019] The following will clearly and completely describe the technical solutions of this application in conjunction with the embodiments. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0020] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0021] In the description of the present invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer" and the like indicate positions or locations based on the positions shown in the accompanying drawings, or the positions or locations in which the inventive product is typically placed when in use. These terms are intended solely to facilitate the description of the present invention and to simplify the description, and are not intended to indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, the terms "first," "second," and "third," etc., are used solely to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0022] Furthermore, terms such as "horizontal" and "vertical" do not necessarily require a component to be absolutely horizontal or overhanging; rather, they may be slightly tilted. For example, "horizontal" simply refers to a more horizontal orientation relative to "vertical" and does not imply that the structure must be perfectly horizontal; rather, it may be slightly tilted. Terms such as "front," "back," "left," and "right" also do not necessarily require a component to be facing the front, back, left, or right; rather, they may be slightly tilted.

[0023] In the description of the present invention, it should also be noted that, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; they may refer to mechanical connections or electrical connections; they may refer to direct connections or indirect connections through an intermediate medium; and they may refer to internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0024] Example 1 The ring-shaped semiconductor laser housing sintering fixture provided herein is used to secure a chip to be sintered and the ring-shaped semiconductor laser housing to be sintered, thereby stably sintering the chip to be sintered to the ring-shaped semiconductor laser housing to be sintered. The ring-shaped semiconductor laser housing described herein can have a variety of structures, including but not limited to the tower-shaped structure described in this embodiment, or a columnar structure.

[0025] like Figure 1-Figure 3 As shown, the ring-shaped semiconductor laser housing sintering and fixing device 100 includes a base 110, a support frame and a plurality of sintering and fixing blocks 160, wherein the support frame includes a first support frame outer ring 120, a second support frame outer ring 130, a first support frame inner ring 140, and a second support frame inner ring 150. Figure 1 、 Figure 3 As shown, the ring-shaped semiconductor laser housing 200 to be sintered is accommodated in a hollow space surrounded by a plurality of sintering fixing blocks 160 , and the first support frame inner ring 140 and the second support frame inner ring 150 jointly fix the position of the ring-shaped semiconductor laser housing 200 to be sintered.

[0026] The first support frame outer ring 120 is connected to the first end of the base 110, such as Figure 3 The left end of the base 110 shown; the second support frame outer ring 130 is connected to the second end of the base 110, that is, Figure 3 The right end of the base 110 is shown.

[0027] like Figure 4A 、 4B As shown, the first support frame inner ring 140 is interlocked with the first support frame outer ring 120, and the first support frame inner ring 140 is rotatable relative to the first support frame outer ring 120. Specifically, the first support frame outer ring 120 has a first annular groove 1201 in the direction toward the first support frame inner ring 140, and the first support frame inner ring 140 has a first annular protrusion 1401 corresponding to the first annular groove 1201 in the direction toward the first support frame outer ring 120. The first annular groove 1201 and the first annular protrusion 1401 cooperate with each other, so that the first support frame inner ring 140 is rotatable relative to the first support frame outer ring 120. The first support frame inner ring 140 also has a first positioning column 1402 with an enlarged end. When the first support frame inner ring 140 rotates to a preset position relative to the first support frame outer ring 120, the first positioning column 1402 is used to fix the first support frame inner ring 140 and the first support frame outer ring 120 together.

[0028] like Figure 5A 、 5BAs shown, the second support frame inner ring 150 is interlocked with the second support frame outer ring 130, and the second support frame inner ring 150 is rotatable relative to the second support frame outer ring 130. Specifically, the second support frame outer ring 130 has a second annular groove 1301 in the direction toward the second support frame inner ring 150, and the second support frame inner ring 150 has a second annular protrusion 1501 corresponding to the second annular groove 1301 in the direction toward the second support frame outer ring 130. The second annular groove 1301 and the second annular protrusion 1501 cooperate with each other, so that the second support frame inner ring 150 is rotatable relative to the second support frame outer ring 130. The second support frame inner ring 150 also has a second positioning column 1502 with an enlarged end. When the second support frame inner ring 150 rotates to a preset position relative to the second support frame outer ring 130, the second positioning column 1502 is used to fix the second support frame inner ring 150 and the second support frame outer ring 130 together. During actual use, the first support frame inner ring 140 and the second support frame inner ring 150 rotate synchronously, which facilitates the user to adjust the structure such as the chip to be sintered 210 in 360 degrees.

[0029] like Figure 1 、 Figure 2 As shown, multiple sintering blocks 160 are connected between the first support frame inner ring 140 and the second support frame inner ring 150. These blocks 160 form a hollow region in the form of prismatic surfaces, thereby placing the ring-shaped semiconductor laser housing 200 to be sintered within the hollow region. In this embodiment, eight sintering blocks 160 are installed by way of example. In actual application, the number of sintering blocks 160 can be adjusted as needed. In this embodiment, screws are used to secure the sintering blocks 160 to the first support frame inner ring 140 and the second support frame inner ring 150, respectively. In actual application, the securing method can be adjusted as needed.

[0030] like Figure 6A -6D, a plurality of sintering probes 1650 are provided on each sintering fixed block 160, and each sintering probe 1650 corresponds to one chip 210 to be sintered on the annular semiconductor laser housing 200 to be sintered, so the number of sintering probes 1650 can be adjusted accordingly according to the number of corresponding chips 210 to be sintered. In this embodiment, three sintering probes 1650 are provided on each sintering fixed block 160, corresponding to the three chips to be sintered distributed on the two layers of the annular semiconductor laser housing 200. In this embodiment, the sintering probes 1650 are fixed to the sintering fixed block 160 by screws, and the fixing method can be adjusted according to the actual application. Figure 6B As shown, each sintering probe 1650 of this embodiment has two pins for fixing the chip to be sintered. In actual application, the number of pins can be selected according to the area or mass of the chip to be sintered. Generally speaking, the larger the area of ​​the chip to be sintered, the more pins are required. Figure 6D As shown, during the working state, the three sintering probes 1650 of the sintering fixing block 160 respectively abut against the three chips 210 to be sintered, and two pins on each sintering probe jointly fix one chip to be sintered.

[0031] As Figure 6A shown, the sintering fixing block 160 includes a first connecting portion 1610, a second connecting portion 1620, a first mounting portion 1630 and a second mounting portion 1640. The above-mentioned parts are divided according to their functions. When manufacturing the sintering fixing block 160, each part can be formed separately and then spliced into a complete sintering fixing block, or can be integrally formed. Figure 6A The shown sintering fixing block 160 is integrally formed by four parts.

[0032] As Figure 1 and 6A shown, the first connecting portion 1610 is connected to the inner ring 140 of the first support frame by screws, and the second connecting portion 1620 is connected to the inner ring 150 of the second support frame by screws, thereby stably installing the sintering fixing block 160 between the inner ring 140 of the first support frame and the inner ring 150 of the second support frame. As Figure 3 shown, an installation groove is provided at the central position of the inner ring 140 of the first support frame, and the shape of the installation groove matches the shape of the annular semiconductor laser housing 200 near the inner ring 140 of the first support frame, so that the annular semiconductor laser housing 200 can be stably snapped into the installation groove, making the connection between the annular semiconductor laser housing 200 and the inner ring 140 of the first support frame more stable. Optionally, as Figure 6A 、 6D shown, both the first connecting portion 1610 and the second connecting portion 1620 are designed as a hollow structure in the shape of a Chinese character "hui", which is beneficial for users to observe the abutting situation between the sintering probes 1650 and the chips to be sintered from the outside, so as to timely adjust the pressure between the sintering fixing block 160 and the chips 210 to be sintered. Since the sintering probes 1650 and the sintering fixing block 160 in the present application are connected by screws, the pressure between the sintering fixing block 160 and the chips 210 to be sintered can be easily adjusted by adjusting the tightness of the screws. At the same time, during the sintering and welding process of the chips 210 to be sintered and the annular semiconductor laser housing 200 to be sintered, as the solder melts, the pressure of the sintering fixing block 160 on the chips 210 to be sintered is gradually released to improve the effect of positioning welding.

[0033] As Figure 6AAs shown, a first mounting hole 1660 is formed on the first mounting portion 1630, and a sintered probe 1650 is mounted in the first mounting hole 1660. A second mounting hole 1670 is formed on the second mounting portion 1640, and two sintered probes 1650 are mounted in the second mounting hole 1670. The first sintered probe 1650 and the second sintered probe 1650 are arranged along a first direction (X direction), and the first sintered probe is located between the two second sintered probes along a second direction (Y direction). The first direction is parallel to the axis of the ring-shaped semiconductor laser housing 200, and the second direction is the circumferential direction of the ring-shaped semiconductor laser housing 200.

[0034] like Figure 6A 、 6B As shown, optionally, the second mounting portion 1640 has a fixed inclination angle on both sides along the second direction toward the chip 210 to be sintered, so that the pins of the two sintering probes 1650 on the second mounting portion 1640 are inclined toward each other, so that the sintering probes 1650 further adapt to the shape of the annular semiconductor laser housing 200 to be sintered, so that the chip 210 to be sintered fits more closely to the annular semiconductor laser housing 200 to be sintered.

[0035] like Figure 7A 、 7B As shown, the ring-shaped semiconductor laser housing 200 to be sintered in the embodiment of the present application has a tower-shaped double-layer chip structure, with 8 chips in the upper tower layer and 16 chips in the lower tower layer. The number of chips in the lower tower layer is twice the number of chips in the upper tower layer. Therefore, the corresponding sintering fixing block 160 has a triangular structure, with the first sintering probe 1650 corresponding to the chips in the upper tower layer and the second sintering probe 1650 corresponding to the chips in the lower tower layer. The number of chips in the upper and lower layers of the ring-shaped semiconductor laser housing 200 to be sintered can be adjusted as needed. For example, the number of chips in the upper tower layer can be 6, and the number of chips in the corresponding lower tower layer can be 12. In order to adapt to the number of chips in the upper and lower layers of the ring-shaped semiconductor laser housing 200 to be sintered, the number of sintering fixing blocks on the ring-shaped semiconductor laser housing sintering fixture should also be adjusted accordingly. The number of sintering fixing blocks 160 can be 6 to 10. Figure 7C for Figure 7B A partial enlarged view of area A, such as Figure 7C As shown, the chip 210 to be sintered is not placed in the B area, and the chip 210 to be sintered is placed in the C area. A positioning step 220 is also provided on the ring-shaped semiconductor laser housing 200 to be sintered, which is used to accurately define the position of the chip 210 to be sintered. The B and C areas can be further optimized to obtain Figure 7D The structure shown, such as Figure 7DAs shown, a guide groove 230 is provided on the positioning step 220 between adjacent chips 210 to be sintered to prevent solder from overflowing and accumulating due to gravity during the sintering process of the chips 210 to be sintered.

[0036] like Figure 8A As shown, the first mounting portion 1630 is provided with a first mounting hole 1660, and the second mounting portion 1640 is provided with two second mounting holes 1670. Both the first mounting hole 1660 and the second mounting hole 1670 are used to mount the sintering probe 1650. Since only one mounting hole is installed on the first mounting portion 1630, while two mounting holes are required on the second mounting portion 1640, the installation space of the first mounting portion 1630 is relatively sufficient, and the area of ​​the first mounting hole 1660 can be larger than the area of ​​the second mounting hole 1670. Figure 8A As shown, the size of the first mounting hole 1660 in the second direction is larger than the size of the second mounting hole 1670 in the second direction. This is because in the second direction, the four corner positioning holes 1680 of the first mounting hole 1660 are located on the outside of the main body, while the four corner positioning holes of the second mounting hole 1670 are located on the inside of the main body. Considering the current stage of the mounting hole processing technology, a single pass is used for precise processing, such as Figure 8B 、 8C As shown, Figure 8B The tool path of the first mounting hole 1660 is relatively Figure 8C The tool path of the second mounting hole 1670 is shorter. Specifically, in this embodiment, the tool path of the first mounting hole 1660 is 17.4 mm, and the tool path of the second mounting hole 1670 is 19.5 mm. Therefore, the processing time of the first mounting hole 1660 is short and the efficiency is high, but the area occupied is large; while the processing time of the second mounting hole 1670 is long and the efficiency is low, but the area occupied is small. The smaller second mounting hole 1670 can be processed in the following manner: Figure 8A A larger area is reserved on both sides of the second mounting hole 1670 along the second direction, thereby improving the mechanical strength of the second mounting portion 1640 .

[0037] This embodiment solves the technical problems of the annular semiconductor COS laser in the annular double-layer chip structure, such as the difficulty in sintering the chip to be sintered, the complex operation, and the easy displacement of the sintering position, by designing a fixing device that facilitates sintering the chip to be sintered to the ring-shaped semiconductor laser housing. This embodiment achieves the technical effect of facilitating 360-degree adjustment of the structure such as the chip to be sintered, easily adjusting the pressure between the sintering fixing block and the chip to be sintered, and gradually releasing the pressure of the sintering fixing block on the chip to be sintered as the solder melts.

[0038] Example 2 The difference between this embodiment and the ring-shaped semiconductor laser housing sintering and fixing device of embodiment 1 is that the structure of the sintering and fixing block 160 is improved, and accordingly, the structures of the first support frame inner ring 140 and the second support frame inner ring 150 are adaptively adjusted. Figure 9A 、 9B As shown, the sintered fixing block 160 includes a first connecting part 1610, a second connecting part 1620, a first mounting part 1630 and a second mounting part 1640. The above parts are divided according to their functions. When manufacturing the sintered fixing block 160, the various parts can be formed separately and then spliced ​​into a complete sintered fixing block, or they can be formed as one piece.

[0039] The second mounting portion 1640 of the sintering fixing block 160 adopts a hinge structure, such as Figure 9B As shown, the hinge structure includes: a rotating shaft 1641, a first hinge part 1642 and a second hinge part 1643. An elastic structure, such as a rotating shaft torsion spring, is installed inside the rotating shaft 1641, so that the first hinge part 1642 and the second hinge part 1643 are naturally close to the chip 210 to be sintered without the action of external force. The angle between the first hinge part 1642 and the second hinge part 1643 can be properly adjusted under the action of external force. Two sintering probes 1650 are respectively installed on the first hinge part 1642 and the second hinge part 1643 of the second mounting part 1640. Therefore, the sintering probe 1650 on the second mounting part 1640 can automatically adjust the angle according to the position of the ring-shaped semiconductor laser housing 200 to be sintered. Figure 9A 、 9B As shown, the first mounting portion 1630 and the second mounting portion 1640 form a T-shaped structure, and the length of the first mounting portion 1630 along the second direction is shorter than the length of the second mounting portion 1640 along the second direction. An observation gap is formed between the first mounting portion 1630 and the second mounting portion 1640, which is beneficial for the user to observe the abutment between the sintering probe 1650 and the chip to be sintered 210 from the outside, so as to timely adjust the pressure between the sintering fixing block 160 and the chip to be sintered 210.

[0040] Figure 9C This is a schematic diagram of the first support frame inner ring 140 provided in the second embodiment of the present application. It should be noted that: Figure 9C Only the structure that is different from the inner ring of the first support frame described in the first embodiment is shown, so the annular protrusion and positioning column structures are omitted in the figure, and the actual product still has the annular protrusion and positioning column structures. Figure 9CAs shown, the first support frame inner ring 140 adopts a circular structure, and the circular outer edge is used to install multiple detachable first fixed sliders 1403. The first fixed sliders 1403 have two first fixing holes 1404. The appropriate number of first fixed sliders 1403 can be selected according to the structure of the ring-shaped semiconductor laser housing 200 to be sintered, and the first fixed sliders 1403 are fixed to the first support frame inner ring 140 through the first fixing holes 1404. The first connecting portion 1610, the first fixed slider 1403 and the first support frame inner ring 140 are connected and fixed by fixing members. For example, the fixing member can be a screw, that is, the screw is passed through the first fixing hole 1404 to determine the number and position of the first fixed sliders 1403. The first connecting portion 1610 and the first fixed slider 1403 are connected and fixed so that the positions of the two are relatively fixed in the first support frame inner ring 140, as shown in FIG. Figure 9B As shown, the first connecting portion 1610 has a screw hole that matches the second fixing hole 1405 on the first fixed slider 1403, and the first connecting portion 1610 and the first fixed slider 1403 are fixed and locked by screws. The structure of the second support frame inner ring 150 is similar to that of the first support frame inner ring 140 and will not be repeated here.

[0041] like Figure 9B As shown, since the first connecting portion 1610 and the second connecting portion 1620 are connected to the first fixed slider 1403 and the second fixed slider respectively by one screw, the number of the first fixed slider 1403 is equal to the number of the second fixed slider, and the number of the first fixed slider 1403 and the second fixed slider is equal to the number of the sintering fixed blocks 160. According to the structure of the ring-shaped semiconductor laser housing 200 to be sintered, the number of the sintering fixed blocks 160 can be 6 to 10, such as Figure 8A 、 8B As shown, the number of upper chips of the corresponding ring-shaped semiconductor laser housing 200 to be sintered is 6 to 10.

[0042] Compared with Example 1, Example 2 solves the technical problem that the existing laser sintering fixing device cannot adapt to changes in the number of chips and is only suitable for a specific annular semiconductor laser shell 200 to be sintered by adjusting the number of the first fixed slider 1403 and the second support frame inner ring 150. Example 2 adjusts the number of the first fixed slider 1403 and the second fixed slider, combined with the automatic angle adjustment feature of the hinge structure of the second mounting part 1640, to achieve the technical effect that the annular semiconductor laser shell sintering fixing device of this embodiment can be adjusted according to the structure of the annular semiconductor laser shell 200 to be sintered.

[0043] Example 3 Figure 10 This is a flow chart of the method for sintering and fixing the ring-shaped semiconductor laser housing used in the ring-shaped semiconductor laser housing sintering and fixing device described in Example 1. Figure 10 As shown, the sintering and fixing method of the ring-shaped semiconductor laser housing includes: Step S10: Install the ring-shaped semiconductor laser housing to be sintered between the inner ring of the first support frame and the inner ring of the second support frame. Figure 3 As shown, the annular semiconductor laser housing 200 is fixed on the annular semiconductor laser housing sintering fixture 100 by the first support frame inner ring 140 and the second support frame inner ring 150. The annular semiconductor laser housing 200 can rotate synchronously with the first support frame inner ring 140 and the second support frame inner ring 150, thereby achieving the technical effect of the annular semiconductor laser housing 200 freely rotating relative to the first support frame outer ring 120 and the second support frame outer ring 130.

[0044] Step S20: Install multiple sintered fixing blocks between the inner ring of the first support frame and the inner ring of the second support frame. Figure 2 、 6A As shown, the sintered fixing block 160 can be fixed to the first support frame inner ring 140 and the second support frame inner ring 150 by screws on the first connecting part 1610 and the second connecting part 1620 of the sintered fixing block 160, and the sintered fixing block 160 can rotate synchronously with the first support frame inner ring 140, the second support frame inner ring 150 and the annular semiconductor laser housing 200.

[0045] Step S30: Install the sintering probes in the first mounting hole and the second mounting hole, and press the multiple chips to be sintered onto the ring-shaped semiconductor laser housing to be sintered in a one-to-one correspondence. Figure 6D As shown, the pressing force of the sintering probes 1650 on the sintering fixing block 160 on the chip to be sintered is adjusted by screws on the first mounting portion 1630 and the second mounting portion 1640 of the sintering fixing block 160, so that each sintering probe 1650 is tightly pressed against the corresponding chip 210 to be sintered.

[0046] Step S40: Place the ring-shaped semiconductor laser housing sintering fixture obtained in step S30, the chip to be sintered, and the ring-shaped semiconductor laser housing to be sintered into a reflow furnace for sintering. The solder between the chip to be sintered 210 and the ring-shaped semiconductor laser housing to be sintered 200 is melted by the high temperature in the reflow furnace, thereby stably sintering the chip to be sintered 210 to the ring-shaped semiconductor laser housing to be sintered 200.

[0047] The sintering and fixing method of the annular semiconductor laser housing of this embodiment fully utilizes the design advantages of the sintering and fixing device of the annular semiconductor laser housing described in Example 1, and therefore has the same technical effect as the sintering and fixing device of the annular semiconductor laser housing described in Example 1, that is, it is convenient for users to adjust the structure such as the chip to be sintered 360 degrees, and easily adjust the pressure between the sintering fixing block and the chip to be sintered. As the solder melts, the pressure of the sintering fixing block on the chip to be sintered is gradually released.

[0048] Example 4 Figure 11 This is a flow chart of the method for sintering and fixing the ring-shaped semiconductor laser housing used in the ring-shaped semiconductor laser housing sintering and fixing device described in Example 2. Figure 11 As shown, the sintering and fixing method of the ring-shaped semiconductor laser housing includes: Step S11 : installing the ring-shaped semiconductor laser housing to be sintered between the inner ring of the first support frame and the inner ring of the second support frame.

[0049] Step S21, determine the number of sintering fixed blocks, first fixed sliders and second fixed sliders corresponding to the ring-shaped semiconductor laser housing to be sintered. Figure 7A 、 7B As shown in the figure, the number of chips required for the upper layer of the tower of the ring-shaped semiconductor laser housing 200 to be sintered is 8, and the number of chips required for the lower layer of the tower is 16. Therefore, the number of sintering fixed blocks, first fixed sliders and second fixed sliders required is 8; if the number of chips required for the upper layer of the tower is 6, and the number of chips required for the lower layer of the tower is 12, the number of sintering fixed blocks, first fixed sliders and second fixed sliders required is 6.

[0050] Step S31: Install the required number of first fixed sliders and second fixed sliders on the first support frame inner ring and the second support frame inner ring respectively, and install the required number of sintered fixed blocks between the first support frame inner ring and the second support frame inner ring. Figure 9C As shown, the first fixed slider 1403 is mounted on the first support frame inner ring 140 by screws and the first fixing hole 1404, and the second fixed slider is mounted on the second support frame inner ring 150 in the same manner. Figure 9A 、 9CAs shown, the sintered fixing block 160 can be fixed to the second fixing hole 1405 of the first fixed slider 1403 using screws on the first connecting portion 1610 of the sintered fixing block 160. The sintered fixing block 160 is similarly mounted on the second support frame inner ring 150. Both the first fixing hole 1404 and the second fixing hole 1405 ensure a stable connection between the first fixed slider 1403 and the first support frame inner ring 140. The sintered fixing block 160 can rotate synchronously with the first support frame inner ring 140, the second support frame inner ring 150, and the annular semiconductor laser housing 200.

[0051] Step S41: Install the sintering probes in the first mounting hole and the second mounting hole, and press the multiple chips against the ring-shaped semiconductor laser housing to be sintered in a one-to-one correspondence. Figure 9A As shown, the pressing force of the sintering probes 1650 on the sintering fixing block 160 on the chip to be sintered is adjusted by screws on the first mounting portion 1630 and the second mounting portion 1640 of the sintering fixing block 160, so that each sintering probe 1650 is tightly pressed against the corresponding chip 210 to be sintered.

[0052] Step S51 , placing the ring-shaped semiconductor laser housing sintering fixture obtained in step S41 , the chip to be sintered, and the ring-shaped semiconductor laser housing to be sintered into a reflow furnace for sintering.

[0053] The sintering and fixing method of the annular semiconductor laser housing of this embodiment fully utilizes the design advantages of the sintering and fixing device of the annular semiconductor laser housing described in Example 2, and therefore has the same technical effect as the sintering and fixing device of the annular semiconductor laser housing described in Example 2, that is, it achieves the technical effect of enabling the sintering and fixing device of the annular semiconductor laser housing of this embodiment to be adjusted according to the structure of the annular semiconductor laser housing 200 to be sintered.

[0054] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A ring-shaped semiconductor laser housing sintering and fixing device (100), characterized in that: include: A base (110), with both ends of the base respectively connected to the support frame; a support frame, the support frame being respectively connected to both ends of the base (110); A plurality of rotatable sintering fixing blocks (160), the sintering fixing blocks (160) being connected between the two support frames, the plurality of sintering fixing blocks (160) enclosing a hollow area to accommodate a ring-shaped semiconductor laser housing (200) to be sintered; The sintering fixing block (160) has at least one first mounting hole (1660) and at least two second mounting holes (1670) arranged at intervals along the second direction, wherein the first mounting hole (1660) and the second mounting holes (1670) are arranged along the first direction; The size of the first mounting hole (1660) in the second direction is greater than the size of the second mounting hole (1670) in the second direction. The first mounting hole (1660) and the second mounting hole (1670) are respectively used to install sintering probes (1650). Each of the sintering probes (1650) corresponds to a chip (210) to be sintered of the ring-shaped semiconductor laser housing (200) to be sintered.

2. The ring-shaped semiconductor laser housing sintering and fixing device according to claim 1, characterized in that: The first direction is set to be parallel to the axial direction of the ring-shaped semiconductor laser housing (200), and the second direction is set to be the circumferential direction of the ring-shaped semiconductor laser housing (200).

3. The ring-shaped semiconductor laser housing sintering and fixing device according to claim 1, characterized in that: The tool path of the first mounting hole (1660) is shorter than the tool path of the second mounting hole (1670); and / or, The area of ​​the first mounting hole (1660) is greater than the area of ​​the second mounting hole (1670).

4. The ring-shaped semiconductor laser housing sintering and fixing device according to claim 1, characterized in that: The support frame comprises: a first support frame outer ring (120), the first support frame outer ring (120) being connected to a first end of the base (110); a second support frame outer ring (130), the second support frame outer ring (130) being connected to a second end of the base (110); a first support frame inner ring (140), the first support frame inner ring (140) being interlocked with the first support frame outer ring (120), and the first support frame inner ring (140) being rotatable relative to the first support frame outer ring (120); A second support frame inner ring (150) is interlocked with the second support frame outer ring (130), and the second support frame inner ring (150) is rotatable relative to the second support frame outer ring (130).

5. The sintering and fixing device for a ring-shaped semiconductor laser housing according to claim 4, characterized in that: The sintered fixed block (160) comprises: A first connecting portion (1610), the first connecting portion (1610) being connected to the first support frame inner ring (140); A second connecting portion (1620), the second connecting portion (1620) being connected to the second support frame inner ring (150); A first mounting portion (1630), wherein the first mounting hole (1660) is formed on the first mounting portion (1630); A second mounting portion (1640) is provided, wherein the second mounting hole (1670) is formed on the second mounting portion (1640).

6. The sintering and fixing device for a ring-shaped semiconductor laser housing according to claim 5, characterized in that: The second mounting portion (1640) has a fixed inclination angle on both sides along the second direction toward the chip to be sintered (210); and / or, the first connecting portion (1610) and the second connecting portion (1620) both have a hollow structure.

7. The sintering and fixing device for a ring-shaped semiconductor laser housing according to claim 5, characterized in that: The second mounting portion (1640) comprises a rotating shaft (1641), a first hinge portion (1642) and a second hinge portion (1643); the rotating shaft (1641) enables the first hinge portion (1642) and the second hinge portion (1643) to have a self-restoring force toward the chip to be sintered (210) on both sides along the second direction through a spring; and the sintering probe (1650) on the second mounting portion (1640) automatically adjusts its angle according to the position of the ring-shaped semiconductor laser housing (200) to be sintered.

8. The sintering and fixing device for a ring-shaped semiconductor laser housing according to claim 5, characterized in that: The first mounting portion (1630) and the second mounting portion (1640) form a T-shaped structure, and the length of the first mounting portion (1630) along the second direction is shorter than the length of the second mounting portion (1640) along the second direction.

9. The sintering and fixing device for a ring-shaped semiconductor laser housing according to claim 7, characterized in that: A plurality of detachable first fixed sliding blocks (1403) are provided along the circumferential direction at the edge of the first support frame inner ring (140); the first connecting portion (1610), the first fixed sliding blocks (1403) and the first support frame inner ring (140) are connected and fixed by a fixing member; A plurality of detachable second fixed sliding blocks are provided along the circumferential direction at the edge of the second support frame inner ring (150); the second connecting portion (1620), the second fixed sliding blocks and the second support frame inner ring (150) are connected and fixed by fixing members.

10. A method for sintering and fixing a ring-shaped semiconductor laser housing applied to the ring-shaped semiconductor laser housing sintering and fixing device according to any one of claims 1 to 6, characterized in that: The method comprises: Step S10: installing the ring-shaped semiconductor laser housing to be sintered between two support frames; Step S20: installing a plurality of sintered fixed blocks between two support frames; Step S30: Installing sintering probes in the first mounting hole and the second mounting hole, and using the plurality of sintering probes to press the plurality of chips to be sintered against the ring-shaped semiconductor laser housing to be sintered in a one-to-one correspondence; Step S40: placing the ring-shaped semiconductor laser housing sintering fixture obtained in step S30, the chip to be sintered, and the ring-shaped semiconductor laser housing to be sintered into a reflow furnace for sintering.

11. A method for sintering and fixing a ring-shaped semiconductor laser housing applied to the ring-shaped semiconductor laser housing sintering and fixing device according to any one of claims 7 to 9, characterized in that: The method comprises: Step S11, installing the ring-shaped semiconductor laser housing to be sintered between two support frames; Step S21, determining the number of sintering fixed blocks, first fixed sliders, and second fixed sliders corresponding to the ring-shaped semiconductor laser housing to be sintered; Step S31: Install the required number of first fixed sliders and second fixed sliders on the first support frame inner ring and the second support frame inner ring respectively, and install the required number of sintered fixed blocks between the first support frame inner ring and the second support frame inner ring; Step S41: Install sintering probes in the first mounting hole and the second mounting hole, and press the multiple chips against the ring-shaped semiconductor laser housing to be sintered in a one-to-one correspondence with the multiple sintering probes. Step S51 , placing the ring-shaped semiconductor laser housing sintering fixture obtained in step S41 , the chip to be sintered, and the ring-shaped semiconductor laser housing to be sintered into a reflow furnace for sintering.

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