Substrate processing apparatus, substrate processing method, and storage medium

Abstract

The invention provides a substrate processing apparatus, a substrate processing method, and a storage medium which can reduce position offset when a substrate is handed over. The substrate processing apparatus includes: a substrate conveying unit having a holding portion for holding a substrate and a motor for displacing the holding portion in a predetermined direction; a transport control unit that controls the substrate transport unit so as to displace, by means of the motor, a holding unit to a transfer position at which the substrate is transferred to a rotary holding unit that can hold and rotate the substrate; and a torque information acquisition unit that acquires the maximum value of the torque of the motor during a period in which the holding unit is displaced to the delivery position. The conveyance control unit shifts the holding unit to the transfer position, and then adjusts the position of the holding unit by the motor on the basis of the maximum value of the torque such that the shift between the center of the substrate held by the holding unit and the rotation center of the rotary holding unit is reduced.

Description

Technical Field

[0001] The present invention relates to a substrate processing device, a substrate processing method and a storage medium. Background Art

[0002] Patent Document 1 discloses a substrate transport mechanism that processes a substrate and delivers the substrate to each of a plurality of process modules stacked one on top of the other.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 2022-130280 Summary of the Invention

[0006] Technical problem to be solved by the invention

[0007] The present invention provides a substrate processing device, a substrate processing method and a storage medium useful for reducing positional deviation when transferring substrates.

[0008] Technical solutions to technical problems

[0009] A substrate processing apparatus according to one aspect of the present invention includes: a substrate transport unit having a holding portion for holding a substrate and a motor for displacing the holding portion in a predetermined direction; a transport control unit for controlling the substrate transport unit so that the holding portion is displaced by the motor to a transfer position for transferring the substrate to a rotating holding portion capable of holding and rotating the substrate; and a torque information acquisition unit for acquiring a maximum value of the torque of the motor while the holding portion is displaced to the transfer position. After displacing the holding portion to the transfer position, the transport control unit adjusts the position of the holding portion by the motor based on the maximum value of the torque to reduce the offset between the center of the substrate held by the holding portion and the rotation center of the rotating holding portion.

[0010] Effects of the Invention

[0011] According to the present invention, a substrate processing apparatus, a substrate processing method, and a storage medium useful for reducing positional deviation when transferring substrates are provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a plan view schematically showing an example of a substrate processing apparatus.

[0013] Figure 2 It is a front view schematically showing an example of a substrate processing apparatus.

[0014] Figure 3 It is a schematic diagram showing an example of a liquid processing unit.

[0015] Figure 4 It is a schematic diagram showing an example of an inspection unit.

[0016] Figure 5 It is a schematic diagram showing an example of a display screen on a display device.

[0017] Figure 6 It is a side view schematically showing an example of a conveying device.

[0018] Figure 7 (a) is a plan view schematically showing an example of a conveying device. Figure 7 (b) is a schematic diagram showing an example of various motors provided in the conveying device.

[0019] Figure 8 This is a schematic diagram showing an example of a driving mechanism provided in the conveying device.

[0020] Figure 9 This is a block diagram showing an example of the functional configuration of a control device.

[0021] Figure 10 This is a block diagram showing an example of the hardware configuration of the control device.

[0022] Figure 11 This is a flowchart showing an example of a process flow executed by the control device.

[0023] Figure 12 This is a timing chart illustrating the operation of each axis of the conveying device.

[0024] Figure 13 (a) is a graph illustrating an example of position feature values. Figure 13 (b) is a graph illustrating the speed feature amount. Figure 13 (c) is a graph illustrating the torque characteristic amount.

[0025] Figure 14 This is a flowchart showing an example of a process flow executed by the control device.

[0026] Figure 15 (a) Figure 15 (b) and Figure 15 (c) is a schematic diagram for explaining positional deviation relative to the rotation drive unit.

[0027] Figure 16 This is a schematic diagram for explaining the relationship between positional deviation and eccentricity with respect to the rotation drive unit.

[0028] Figure 17 (a) is a graph showing an example of the transition of the eccentricity. Figure 17(b) is a graph showing an example of transition of the maximum torque value.

[0029] Figure 18 This is a flowchart showing an example of a process flow executed by the control device.

[0030] Description of Reference Numerals

[0031] 1...wafer processing system, W...wafer, Wa...surface, CP...center, U1...liquid processing unit, 33...wafer conveying device, 91a...first holding arm, 96a...X-axis motor, 98...Z-axis motor, 50...rotation holding unit, RC...rotation center, 58...handover pin, 100...control device, 102...conveyance control unit, 110...feature quantity acquisition unit, 116...torque information acquisition unit, 118...feature quantity recording unit. DETAILED DESCRIPTION

[0032] The following describes a wafer processing system as a substrate processing apparatus according to the present embodiment with reference to the accompanying drawings. Throughout this specification, elements having substantially identical functional structures are denoted by identical reference numerals, and duplicate descriptions are omitted. Some of the drawings illustrate an orthogonal coordinate system defined by the X-axis, Y-axis, and Z-axis. In the following embodiments, the Z-axis corresponds to the vertical direction, while the X-axis and Y-axis correspond to the horizontal direction.

[0033] <Wafer processing system>

[0034] First, the configuration of the wafer processing system according to this embodiment will be described. Figure 1 、 Figure 2 The top view and front view schematically illustrate the general structure of a wafer processing system 1. In this embodiment, the wafer processing system 1 is described as a photolithography processing system that performs resist film formation and development on wafers W (substrates). The wafers W processed by the wafer processing system 1 can be circular.

[0035] like Figure 1 As shown, the wafer processing system 1 includes: a cassette station 2 for carrying in and out a cassette C containing a plurality of wafers W; and a processing station 3 including a plurality of various processing devices for performing predetermined processing on the wafers W. Furthermore, the wafer processing system 1 has a structure that integrally connects the cassette station 2, the processing station 3, and an interface station 4 for transferring wafers W between an exposure device (not shown) adjacent to the processing station 3 on the opposite side. In addition, as Figure 1 As shown, two processing stations 3 are provided between the cassette station 2 and the interface station 4, but one or more processing stations may be provided.

[0036] The cassette station 2 is provided with a plurality of cassette mounting tables 21 and wafer transfer devices 22 and 23. The cassette station 2 uses the wafer transfer device 22 or 23 to transfer wafers W between the cassette C mounted on the mounting table 12 and the processing station 3. Therefore, the wafer transfer devices 22 and 23 each have a drive mechanism in directions such as the X direction, the Y direction, the vertical direction, and around the vertical axis (θ direction) as required, and may also have a drive mechanism in all directions.

[0037] At least one of the wafer conveyors 22 and 23 can transfer wafers W to and from the cassette C, and can also transfer wafers W to and from the processing station 3. Transferring wafers W to and from the processing station 3, for example, involves transferring wafers W to and from the third block G3. The third block G3 includes a transfer device accessible to a wafer conveyor 33 within the processing station 3, described later. The third block G3 may also include a plurality of transfer devices (not shown) arranged in a vertical direction.

[0038] Furthermore, the cassette station 2 may include an inspection device (not shown) for inspecting the wafer W at a position accessible by either the wafer transport devices 22 or 23 .

[0039] The processing station 3 is provided with a plurality of blocks, for example, the first, second and fourth blocks G1, G2 and G4. Figure 2 As shown, a plurality of layers 31 including first and second blocks G1 and G2 are stacked in the vertical direction. For example, on the front side of the processing station 3 ( Figure 1 The first block G1 is provided on the negative side of the X direction of the processing station 3. Figure 1 A second block G2 is provided on the positive X direction side of the processing station 3. Figure 1 A fourth block G4 is provided on the positive Y-direction side of the processing station 3 or at the connection portion with another adjacent processing station 3. The fourth block G4 may also include multiple transfer devices arranged in a vertical direction. Furthermore, the aforementioned third block G3 may also be provided within a processing station 3.

[0040] Multiple processing devices are arranged in the first block G1, such as a patterning film forming apparatus and a development processing apparatus (not shown). The patterning film forming apparatus may include, for example, an anti-reflective film forming apparatus in addition to a resist film forming apparatus. For example, multiple processing devices may be arranged horizontally. The number, arrangement, and type of these processing devices can be arbitrarily selected.

[0041] In these patterning film forming devices and developing processing devices, processes such as supplying a predetermined processing liquid or supplying a predetermined gas to the wafer W are performed. Thus, in the patterning film forming device, a resist film is formed as a mask for forming a pattern of a film on the lower side, and an anti-reflection film is formed for efficiently performing a light irradiation process such as an exposure process. On the other hand, in the developing processing device, a portion of the exposed resist film is removed to form a concave-convex shape serving as the above-mentioned mask. The first block G1 may also include a liquid processing unit U1 as an example of a patterning film forming device. In the first block G1, two or more liquid processing units U1 may also be arranged at the same height position and arranged along the Y-axis direction.

[0042] For example, in the second block G2, heat treatment devices (not shown) for performing heat treatments such as heating and cooling of the wafer W are arranged in the vertical direction and the horizontal direction. Figure 2 In the Z direction and horizontal direction, a hydrophobizing device for performing hydrophobizing treatment to improve the fixation (fixability) of the resist liquid to the wafer W and a peripheral exposure device (not shown) for exposing the outer periphery of the wafer W are arranged. The number and arrangement of these heat treatment devices, hydrophobizing devices, and peripheral exposure devices can also be arbitrarily selected.

[0043] like Figure 1 As shown in FIG. 1 , a region sandwiched between the first block G1 and the second block G2 in a plan view forms a wafer conveying region 32. In the wafer conveying region 32, a wafer conveying device 33 is disposed, for example.

[0044] The wafer conveyor 33 has a conveying arm that can move in the X direction, Y direction, θ direction, and vertical direction. The θ direction is the rotation direction around an axis extending in the vertical direction (Z-axis direction). The wafer conveyor 33 can move within the wafer conveying area 32 and convey the wafer W to the specified devices in the surrounding first block G1, second block G2, third block G3, and fourth block G4. Figure 1 As shown, when there are multiple processing stations 3, the chip conveying device 33 arranged at the processing station 3 located on the side of the interface station 4 can not only convey the chip W to the specified devices in the first, second and fourth blocks G1, G2, and G4, but also can convey the chip W to the specified device in the fifth block G5 described later.

[0045] For example, a plurality of wafer conveying devices 33 are arranged vertically. One wafer conveying device 33 can convey the wafer W to a plurality of layers 31 stacked vertically (see Figure 2) are located at the height of the plurality of upper layers 31. Other wafer conveyor devices 33 can convey wafers W to the predetermined devices located at the height of the plurality of layers 31 below these layers 31. Multiple wafer conveyor areas 32 are provided to enable such conveyance of wafers W. Furthermore, the number of wafer conveyor devices 33 and the number of layers 31 corresponding to one wafer conveyor device 33 can be arbitrarily selected, such as by providing a wafer conveyor device 33 for each layer 31.

[0046] Furthermore, the wafer transfer area 32 or the first block G1 or the second block G2 may also include a shuttle device (not shown) that linearly transfers wafers W between a space adjacent to one side of the processing station 3 and another space adjacent to the opposite side.

[0047] The interface station 4 is equipped with a fifth block G5 including multiple transfer devices, and wafer conveyors 41 and 42. The interface station 4 uses the wafer conveyor 41 or 42 to transport wafers W between the fifth block G5, where wafers W are transferred by the wafer conveyor 33, and the exposure unit. Therefore, each of the wafer conveyors 41 and 42 includes a drive mechanism for directions such as the X-direction, the Y-direction, the vertical direction, and around the vertical axis (θ direction), as needed. Alternatively, the wafer conveyors 41 and 42 may include drive mechanisms for all directions. At least one of the wafer conveyors 41 and 42 can support a wafer W and transport it between the transfer device and the exposure unit within the fifth block G5.

[0048] A cleaning device for cleaning the surface of the wafer W and the aforementioned edge exposure device may be provided in the interface station 4 at a position accessible to either the wafer transfer devices 41 or 42 .

[0049] As described above, the inspection device can be provided in the box station 2, but in the processing station 3 and the interface station 4, the inspection device can also be provided in any transport arm ( Figure 1 or Figure 2 As an example of an inspection device, an inspection unit U3 can also be set in the processing station 3.

[0050] The wafer processing system 1 described above is provided with a control device 100. The control device 100 is, for example, a computer and includes a program storage unit (not shown). The program storage unit stores a program for controlling the processing of wafers W in the wafer processing system 1. Furthermore, the program storage unit also stores a program for controlling the operation of the drive systems of the various processing devices, transport devices, and the like described above, thereby implementing wafer processing in the wafer processing system 1. Alternatively, the program may be recorded on a computer-readable storage medium H and installed from the storage medium H into the control device 100.

[0051] The wafer processing system 1 may include a display device 200 in addition to the control device 100. The display device 200 is communicably connected to the control device 100. Details of the display device 200 will be described later.

[0052] <Operation of Wafer Processing System>

[0053] The wafer processing system 1 is configured as described above. Next, an example of wafer processing performed using the wafer processing system 1 configured as described above will be described.

[0054] First, a cassette C containing multiple wafers W is brought into the cassette station 2 of the wafer processing system 1 and placed on the cassette stage 21. Next, the wafers W in the cassette C are sequentially removed by the wafer transfer device 22 or 23 and transferred to the transfer device in the third block G3.

[0055] The wafer W delivered to the handover device of the third block G3 is supported by the wafer conveyor 33 and delivered to the hydrophobic treatment device set in the second block G2 for hydrophobic treatment. Then, the wafer is delivered to the resist film forming device (for example, the liquid processing unit U1) by the wafer conveyor 33 to form a resist film on the wafer W. After that, the wafer W is delivered to the heat treatment device for pre-baking treatment and then delivered to the handover device of the fifth block G5. In addition, in the case of Figure 1 、 Figure 2 In such a case where there are multiple processing stations 3, the wafer W is temporarily placed in the transfer device of the fourth block G4 before being transferred to the transfer device of the fifth block G5, and then transferred between the multiple wafer transfer devices 33. In addition, the wafer W can also be transferred to the peripheral exposure device by the wafer transfer device 33 as needed to perform exposure processing on the peripheral edge of the wafer W.

[0056] The wafer W transferred to the transfer device of the fifth block G5 is transferred to the exposure device by the wafer transfer devices 41 and 42 and subjected to exposure processing in a predetermined pattern. In addition, the wafer W may be cleaned by a cleaning device before the exposure processing.

[0057] After the exposure process, the wafer W is transported to the transfer device of the fifth block G5 by the wafer transport devices 41 and 42. Thereafter, the wafer W is transported to the thermal treatment device by the wafer transport device 33 for post-exposure baking.

[0058] After the post-exposure baking process, the wafer W is transported by the wafer transport device 33 to the developing device for development. After the development is completed, the wafer W is transported by the wafer transport device 33 to the heat treatment device 40 for post-bake processing.

[0059] The wafer W is then transferred by the wafer transfer device 33 to the transfer device in the third block G3 and then transferred by the wafer transfer device 22 or 23 of the cassette station 2 to the designated cassette C on the cassette stage 21. This completes a series of photolithography steps. The inspection unit U3 can also be used to inspect the wafer W during the series of photolithography steps.

[0060] Furthermore, the wafer processing system of the present invention is not limited to the structure and operation described above. For example, in the above embodiment, wafers W are transferred between the interface station 4 and the exposure apparatus. However, a direct connection to the exposure apparatus is not required. In this case, for example, after wafer W is transferred from the cassette station 2 to the processing station 3 and subjected to necessary processing, it is then transferred back to the cassette station 2 for external delivery. Furthermore, unnecessary devices among the devices listed as processing apparatuses may be omitted, or processing in such devices may not be performed.

[0061] <Liquid Processing Unit>

[0062] Next, refer to Figure 3 , an example of a liquid processing unit U1 is described. The liquid processing unit U1 supplies a processing liquid for forming a resist film (hereinafter referred to as "processing liquid L1") to the surface Wa of the wafer W, forming a film of processing liquid L1 (hereinafter referred to as "resist film R"). In addition, the liquid processing unit U1 supplies a processing liquid for removing the resist film R (hereinafter referred to as "processing liquid L2") to the peripheral portion of the resist film R, forming the resist film R with the peripheral portion removed. The liquid processing unit U1 includes, for example, a rotating holding unit 50, a first processing liquid supply unit 60, and a second processing liquid supply unit 70.

[0063] The rotating holding unit 50 holds and rotates the wafer W. The rotating holding unit 50 includes, for example, a holding unit 52 and a rotational drive unit 54. The holding unit 52 supports the center portion of the wafer W, which is horizontally arranged with its surface Wa facing upward, and holds the wafer W by suction (e.g., vacuum suction). The rotational drive unit 54 includes, for example, a power source such as an electric motor, which rotates the holding unit 52 about a vertical rotation center RC. This rotates the wafer W held by the holding unit 52. The holding unit 52 can also hold the wafer W so that the center of the wafer W is approximately aligned with the rotation center RC.

[0064] The liquid processing unit U1 may also include a plurality of transfer pins 58. The plurality of transfer pins 58 are provided around the holding portion 52 and transfer the wafer W between the holding portion 52 and the wafer transfer device 33. The plurality of transfer pins 58 are arranged to be movable. The transfer pins 58 are movable between a height position where the upper end is located above the upper surface of the holding portion 52 and a height position where the upper end is located below the upper surface of the holding portion 52.

[0065] The first processing liquid supply unit 60 supplies the processing liquid L1 to the surface Wa of the chip W. The first processing liquid supply unit 60 includes a nozzle 61, a liquid source 62, a supply line 63, a valve 64, and a nozzle driving unit 65. The nozzle 61 discharges the processing liquid L1 onto the surface Wa of the chip W held by the holding unit 52. The liquid source 62 contains the processing liquid L1 and pressurizes the processing liquid L1 to the nozzle 61. The supply line 63 connects the liquid source 62 and the nozzle 61, and guides the processing liquid L1 from the liquid source 62 to the nozzle 61. The valve 64 is, for example, a pneumatic valve, which opens and closes the flow path in the supply line 63. The nozzle driving unit 65 includes a power source such as an electric motor, which moves the nozzle 61 in the horizontal direction. The nozzle driving unit 65 moves the nozzle 61, for example, between the rotation center RC and the area outside the chip W. The valve 64 and the nozzle driving unit 65 are operated based on the operation instructions from the control device 100.

[0066] The second processing liquid supply unit 70 supplies processing liquid L2, a chemical solution for removing the resist film R, to the surface Wa of the wafer W. The processing liquid L2 is a solvent capable of removing (dissolving) the resist film R formed by the processing liquid L1. Specific examples of the processing liquid L2 include organic solvents such as diluents. The second processing liquid supply unit 70 includes, for example, a nozzle 71, a liquid source 72, a supply line 73, a valve 74, and a nozzle driver 75.

[0067] The nozzle 71 discharges the processing liquid L2 toward the surface Wa of the wafer W held by the holding portion 52. The liquid source 72 contains the processing liquid L2 and pressurizes the processing liquid L2 to the nozzle 71. The supply line 73 connects the liquid source 72 and the nozzle 71, and guides the processing liquid L2 from the liquid source 72 to the nozzle 71. The valve 74 is, for example, a pneumatic valve, which opens and closes the flow path in the supply line 73. The nozzle driving portion 75 includes a power source such as an electric motor, which moves the nozzle 71 in the horizontal direction. The valve 74 and the nozzle driving portion 75 are operated based on an operation instruction from the control device 100. In a state where the nozzle 71 is arranged at a position where the processing liquid L2 can be discharged to the peripheral area of ​​the surface Wa by the nozzle driving portion 75, the processing liquid L2 is discharged from the nozzle 71 while the wafer W is rotated by the rotating holding portion 50, thereby removing the peripheral portion of the resist film R.

[0068] <Inspection Unit>

[0069] Next, refer to Figure 4 , an example of the structure of the inspection unit U3 is described in detail. The inspection unit U3 obtains image data as surface information representing the state of the surface Wa by photographing the surface Wa of the wafer W. In addition, the inspection unit U3 adjusts the orientation of the wafer W using a marking portion such as a notch formed on the wafer W. Figure 4 As shown, the inspection unit U3 includes a holding portion 81 , a rotation driving portion 82 , a detection portion 83 , and an imaging portion 87 .

[0070] The holding portion 81 supports the center portion of a wafer W horizontally disposed with its surface Wa facing upward, and holds the wafer W by suction (e.g., vacuum suction). The rotation drive portion 82, which includes a power source such as an electric motor, rotates the holding portion 81 about its vertical center axis. This rotates the wafer W held by the holding portion 81.

[0071] The detection unit 83 detects the mark portion of the wafer W. The detection unit 83 includes, for example, a light projecting unit 85 and a light receiving unit 86. The light projecting unit 85 emits light toward the peripheral portion of the rotating wafer W. The light projecting unit 85 is, for example, located above the peripheral portion of the wafer W and emits light downward. The light receiving unit 86 receives the light emitted by the light projecting unit 85. The light receiving unit 86 is, for example, located below the peripheral portion of the wafer W so as to face the light projecting unit 85. The light receiving unit 86 outputs light reception information indicating the result of the light reception to the control device 100. Based on this light reception information, the control device 100 adjusts the mark portion to a predetermined angle. In other words, the orientation of the wafer W is adjusted.

[0072] The imaging unit 87 is a camera that captures at least the peripheral area of ​​the surface Wa of the wafer W. When the resist film R is formed on the surface Wa of the wafer W with its peripheral portion removed, the inspection unit U3 rotates the holding unit 81 (wafer W) using the rotation drive unit 82 while the imaging unit 87 captures an image of a range encompassing the outer edges of the resist film R and the wafer W. The imaging unit 87 is positioned above the wafer W held by the holding unit 81. The imaging unit 87 operates in response to operating instructions from the control device 100 and outputs acquired image data to the control device 100. Based on this image data, the condition of the peripheral portion of the surface Wa (resist film R) is inspected.

[0073] <Display device>

[0074] The display device 200 is a device for displaying a part of the information acquired by the control device 100 to an operator or the like. The display device 200 includes a monitor 200a (see Figure 1 ), the display device 200 displays the information obtained from the control device 100 on the monitor 200a.

[0075] The display device 200 acquires edge information based on an image captured of the peripheral region of the surface Wa of a wafer W having a resist film R formed thereon (hereinafter referred to as a "peripheral captured image"). The edge information indicates, for each circumferential position around the center of the wafer W, the relationship between that circumferential position and the edge position of the resist film R in the radial direction of the wafer W. The circumferential position can also be determined based on the angle of the outer edge of the wafer W relative to the marking portion. The edge position of the resist film R is, for example, the position of the outer edge of the resist film R.

[0076] When generating edge information, the display device 200 may calculate the edge position of the resist film R for each predetermined angle in the circumferential direction around the center of the wafer W. The display device 200 may calculate the edge position of the resist film R based on the captured peripheral image using any image processing method. Furthermore, instead of calculating the edge position itself, the display device 200 may acquire edge information generated by externally calculating the edge position (e.g., by the control device 100).

[0077] like Figure 5 As shown, the display device 200 displays a graph Gr representing the edge position for each circumferential position on the monitor 200a based on the edge information. The graph Gr displayed on the monitor 200a may also be a graph in which the distance from the origin represents the edge position and the angle (declination) around the origin represents the polar coordinates of the circumferential position. Figure 5 The illustrated graph Gr is a distribution graph in polar coordinate format, and is drawn by plotting the values ​​of the edge positions included in the edge information. Figure 5 In , a set of points where the respective values ​​are plotted is represented by "E", which corresponds to the edge (outer edge) of the resist film R. Hereinafter, the edge (outer edge) of the resist film R is referred to as "edge E".

[0078] When focusing on a data consisting of a circumferential position and an edge position in the edge information, the position where the data is plotted is determined based on the circumferential position and the edge position. That is, on the graph Gr, the angle around the origin is determined based on the circumferential position, and the distance from the origin is determined based on the edge position. Figure 5 In FIG, for illustration, the origin of the graph Gr is represented by “O”.

[0079] The graph Gr may also include a display area Z1 and a non-display area Z2. The display area Z1 is the area of ​​the graph Gr where the data representing the edge positions included in the edge information is depicted. The non-display area Z2 is the area of ​​the graph Gr where the data representing the edge positions included in the edge information is not depicted. The non-display area Z2 is a circular area that includes the origin of the graph Gr and is located at the center. The center of the circular non-display area Z2 coincides with the origin of the graph Gr. The display area Z1 is an annular area surrounding the non-display area Z2.

[0080] The display device 200 determines the maximum and minimum values ​​of the edge positions on the polar coordinate graph Gr based on the statistical information of the edge positions included in the edge information. Figure 5In the graph, "B" represents the maximum value of the edge position, and "A" represents the minimum value of the edge position. In addition, the origin of the graph is represented by "O". When the radius of the non-display area Z2 is consistent with the width of the display area Z1, the value of the origin O is calculated by the calculation formula "B+(B-A)". Figure 5 In the example shown, the edge position is represented by a removal width indicating the width between the theoretical outer edge of the wafer W and the edge position.

[0081] exist Figure 5 In the example shown (excluding the width), the circumference corresponding to the inner edge of the annular display area Z1 corresponds to the maximum value B, and the circumference corresponding to the outer edge of the display area Z1 corresponds to the minimum value A. Depending on the settings of the minimum value A and the maximum value B, the magnitude of the change in the edge position in the drawn shape representing the edge E in the graph Gr varies.

[0082] The statistical information used to determine the display range associated with the edge position may also include at least a portion of the five-number summary obtained when creating a box plot associated with the edge position based on the edge information. The statistical information may include the first quartile, median (second quartile), and third quartile of the five-number summary. Display device 200 may determine the display range based on the difference between the third quartile and the first quartile (interquartile range) and the median.

[0083] When the first quartile is marked as "Q1", the median (second quartile) is marked as "Med", and the third quartile is marked as "Q3", the display device 200 can also determine the minimum value A and the maximum value B by the following formulas (1) and (2).

[0084] A=Med-{(Q3-Q1)×α}......(1)

[0085] B=Med+{(Q3-Q1)×α}......(2)

[0086] In equations (1) and (2), α is a constant greater than 1. For example, α is greater than 1.0 and less than 2.0, 1.1 to 1.8, or 1.4 to 1.6. Display device 200 may use an average value instead of a median value in equations (1) and (2) to determine minimum value A and maximum value B.

[0087] In the inspection of the wafer W using the peripheral image, for example, the operator of the wafer processing system 1 evaluates whether the shape of the edge E of the resist film R is appropriate based on the edge information. One example of an inappropriate shape of the edge E is "eccentricity," which means that the center of the edge shape is offset from the center of the wafer W. Figure 5In the diagram, the center of the edge shape is indicated by "O1." One of the main causes of eccentricity is that when wafer W is transferred from wafer conveyor 33 to rotating holder 50 (holder 52) of liquid processing unit U1, a positional offset may occur between the rotation center RC of rotating holder 50 and the center of wafer W. If the edge shape is eccentric, for example, the position of wafer W (the portion of wafer conveyor 33 holding wafer W) is adjusted when transferring wafer W from wafer conveyor 33 to holder 52 of liquid processing unit U1.

[0088] <Wafer Conveyor Device>

[0089] Next, refer to Figures 6 to 8 The following describes an example of a wafer conveyor 33 (substrate conveying unit) in detail. The wafer conveyor 33 conveys wafers W before processing in the liquid processing unit U1 to the liquid processing unit U1. The wafer conveyor 33 removes wafers W from the liquid processing unit U1 after processing in the liquid processing unit U1. The wafer conveyor 33 transports wafers W before processing into the liquid processing unit U1 and removes processed wafers W from the liquid processing unit U1.

[0090] like Figure 6 As shown, for example, the wafer conveying device 33 includes a first holding arm 91 a (holding portion), a second holding arm 91 b , an X-axis driving portion 92 , a θ-axis driving portion 93 , a base 90 , a Z-axis driving portion 94 , and a Y-axis driving portion 95 .

[0091] The first holding arm 91a holds the wafer W. The first holding arm 91a can also hold the wafer W horizontally with the surface Wa of the wafer W facing upward. The second holding arm 91b holds the wafer W. The second holding arm 91b can also hold the wafer W horizontally with the surface Wa of the wafer W facing upward. In one example, when a pre-processed wafer W in the liquid processing unit U1 is transferred to the liquid processing unit U1, the wafer W is exchanged between the wafer conveyor 33 and the liquid processing unit U1. In this case, the second holding arm 91b can also receive a wafer W that has been processed in the liquid processing unit U1, while the first holding arm 91a transfers the pre-processed wafer W to the liquid processing unit U1.

[0092] The first holding arm 91a and the second holding arm 91b may also have the same shape. Figure 7 (a) is formed to support the peripheral edge of the back side of the wafer W. Figure 6The X-axis driving unit 92 drives the first holding arm 91a and the second holding arm 91b individually. The X-axis driving unit 92 moves the first holding arm 91a in the X-axis direction and moves the second holding arm 91b in the X-axis direction.

[0093] The θ-axis drive unit 93 supports the X-axis drive unit 92, rotating the X-axis drive unit 92 about a vertical axis. As the θ-axis drive unit 93 rotates the X-axis drive unit 92, the first holding arm 91a and the second holding arm 91b also rotate. The base 90 supports the θ-axis drive unit 93. As the base 90 moves, the θ-axis drive unit 93, the X-axis drive unit 92, the first holding arm 91a, the second holding arm 91b, and the base 90 move together.

[0094] The Z-axis drive unit 94 moves the base 90 in the Z-axis direction. As the base 90 is driven by the Z-axis drive unit 94, the first holding arm 91a and the second holding arm 91b are raised and lowered. The Y-axis drive unit 95 supports the Z-axis drive unit 94 and moves the Z-axis drive unit 94 (and the base 90 connected to the Z-axis drive unit 94) in the Y-axis direction. As the Z-axis drive unit 94 is driven by the Y-axis drive unit 95, the first holding arm 91a and the second holding arm 91b move in the Y-axis direction.

[0095] like Figure 7 As shown in (b), the wafer conveyor 33 includes an X-axis motor 96a, an X-axis motor 96b, a Y-axis motor 97, a Z-axis motor 98, and a θ-axis motor 99. The X-axis motor 96a is a motor included in the X-axis drive unit 92, and displaces the first holding arm 91a in the X-axis direction (predetermined direction). The X-axis motor 96b is a motor included in the X-axis drive unit 92, and displaces the second holding arm 91b in the X-axis direction. The Y-axis motor 97 is a motor included in the Y-axis drive unit 95, the Z-axis motor 98 is a motor included in the Z-axis drive unit 94, and the θ-axis motor 99 is a motor included in the θ-axis drive unit 93.

[0096] exist Figure 8Schematically shows a part of the X-axis drive unit 92 for displacing the first retaining arm 91a in the X-axis direction. In addition to the X-axis motor 96a, the X-axis drive unit 92 may also include a pulley 38a, a pulley 38b and a belt 39. The pulley 38a and the pulley 38b are arranged side by side in the X-axis direction, and the pulley 38a and the pulley 38b are each set in a state where they can rotate around a rotation axis along the Y-axis direction. The belt 39 is mounted on the pulley 38a and the pulley 38b. The belt 39 is, for example, a synchronous belt. The X-axis motor 96a is a power source that generates a rotational torque, for example, a servo motor. When the torque (driving force) of the X-axis motor 96a is transmitted to the pulley 38a, the belt 39 mounted on the pulley 38a and the pulley 38b moves in the X-axis direction. As the belt 39 moves, the first retaining arm 91a connected to the belt 39 is displaced in the X-axis direction.

[0097] <Control device>

[0098] The control device 100 controls the various devices and units included in the wafer processing system 1. Figure 9 As shown, the control device 100 includes a transport control unit 102, an operation instruction storage unit 104, an operation information acquisition unit 106, a feature acquisition unit 110, and a photographic information acquisition unit 124 as functional components (hereinafter referred to as "functional blocks"). The processing performed by these functional blocks is equivalent to the processing performed by the control device 100.

[0099] The transport control unit 102 controls the wafer transport device 33 to transport the wafer W. The transport control unit 102 may also control the wafer transport device 33 according to the operation command held by the operation command holding unit 104. For example, when the wafer W is delivered to the liquid processing unit U1, the transport control unit 102 uses the X-axis motor 96a to shift the first holding arm 91a. The transport control unit 102 may also control the wafer transport device 33 to use the X-axis motor 96a to shift the first holding arm 91a to a delivery position for delivering the wafer to the rotating holding unit 50. The delivery position for delivering the wafer to the rotating holding unit 50 is a position where the wafer W is delivered between the first holding arm 91a and the rotating holding unit 50.

[0100] The operation command holding unit 104 holds the operation command. The operation command held by the transport control unit 102 may also include the rotation amount of the X-axis motor 96a (the command value for the X-axis motor 96a) when the first holding arm 91a is displaced by the X-axis motor 96a to the transfer position for transferring the wafer to the rotating holding unit 50.

[0101] The operation information acquisition unit 106 acquires operation information from the wafer conveying device 33. The operation information acquisition unit 106 acquires, for example, information indicating the rotational position (rotation angle) of the X-axis motor 96a as operation information. Based on the information indicating the rotational position of the X-axis motor 96a, the position of the first holding arm 91a in the X-axis direction can be calculated. By repeatedly acquiring information indicating the rotational position of the X-axis motor 96a at a predetermined sampling period, the speed of the first holding arm 91a (the displacement speed in the X-axis direction) and the torque generated by the X-axis motor 96a can be calculated. The speed can be calculated based on the time change (differentiation) of the position of the first holding arm 91a in the X-axis direction, and the torque can be calculated based on the time change (differentiation) of the speed of the first holding arm 91a in the X-axis direction.

[0102] In addition to acquiring operation information for the X-axis motor 96a, the operation information acquisition unit 106 can also repeatedly acquire information representing the rotational position (rotation angle) of each of the X-axis motor 96b, the Y-axis motor 97, the Z-axis motor 98, and the θ-axis motor 99 as operation information at a predetermined sampling period. Based on the information from the X-axis motor 96b, the position of the second holding arm 91b in the X-axis direction can be calculated. Based on the information from the Z-axis motor 98, the position of the first holding arm 91a and the second holding arm 91b in the Z-axis direction can be calculated. With respect to each axis, the speed can be calculated based on the time change (differentiation) of the position, and the torque can be calculated based on the time change (differentiation) of the speed. In the present invention, for the sake of convenience of explanation, the axis related to the drive of the first holding arm 91a using the X-axis motor 96a is referred to as the "X1 axis", and the axis related to the drive of the second holding arm 91b using the X-axis motor 96b is referred to as the "X2 axis".

[0103] The feature quantity acquisition unit 110 acquires position feature quantities, speed feature quantities, and torque feature quantities. The feature quantity acquisition unit 110 includes a position information acquisition unit 112, a speed information acquisition unit 114, and a torque information acquisition unit 116 as functional blocks. The position information acquisition unit 112 acquires position feature quantities, and the speed information acquisition unit 114 acquires speed feature quantities. The torque information acquisition unit 116 acquires torque feature quantities. The feature quantity recording unit 118 records the position feature quantities, speed feature quantities, and torque feature quantities acquired by the feature quantity acquisition unit 110. Details of the feature quantity acquisition unit 110 and the feature quantity recording unit 118 will be described later.

[0104] The imaging information acquisition unit 124 controls the inspection unit U3 so that the imaging unit 87 images the peripheral area of ​​the surface Wa of the wafer W on which the resist film R is formed. The imaging information acquisition unit 124 causes the imaging unit 87 to image a range including the outer edge of the resist film R and the outer edge of the wafer W while rotating the holding unit 81 holding the wafer W using the rotation drive unit 82, for example, thereby acquiring image data (data of the aforementioned peripheral image) from the imaging unit 87.

[0105] Figure 10 Schematically illustrates an example of the hardware configuration of control device 100. Control device 100 includes circuit 180. Circuit 180 includes a processor 181, memory 182, storage 183, and input / output ports 184. Memory 183 is comprised of one or more nonvolatile storage devices such as flash memory or a hard disk. Memory 183 stores programs for each functional block of control device 100.

[0106] The memory 182 is composed of one or more volatile storage devices such as a random access memory. The memory 182 temporarily stores programs loaded from the memory 183. The processor 181 is composed of one or more computing devices such as a CPU (Central Processing Unit) or a GPU (Graphics Processing Unit). The processor 181 constitutes each functional block of the control device 100 by executing the program loaded into the memory 182. The calculation results of the processor 181 are temporarily stored in the memory 182. The input and output port 184 inputs and outputs information with the wafer conveying device 33, the display device 200, the inspection unit U3, etc. according to the request from the processor 181.

[0107] <Transfer Operation of Wafer W into and out of Liquid Processing Unit U1>

[0108] Next, the operation of transferring wafers W to and from a specific liquid processing unit U1 by the wafer transfer device 33 will be described. The transfer operation of wafers W by the wafer transfer device 33 is performed by the control device 100 controlling the wafer transfer device 33. Figure 11 , there is illustrated an example of the processing flow executed by the control device 100 when performing the sending-in and sending-out operation. Figure 11 The illustrated processing flow is executed when another processed wafer W is placed in the liquid processing unit U1 to which the wafer W is transferred.

[0109] In a state where the first holding arm 91a of the wafer conveying device 33 holds the wafer W and the first holding arm 91a is arranged at a position different from the liquid processing unit U1 as the object in the Y-axis direction, the control device 100 first executes step S01. In step S01, for example, the conveying control unit 102 controls the Y-axis motor 97 of the Y-axis driving unit 95 so that the first holding arm 91a (the first holding arm 91a and the second holding arm 91b) moves to a position opposite to the liquid processing unit U1 as the object. The position opposite to the liquid processing unit U1 as the object refers to a position overlapping with the liquid processing unit U1 as the object in the Y-axis direction. At the stage after executing step S01, the wafer W held by the first holding arm 91a is not arranged in the liquid processing unit U1, but is arranged in the wafer conveying area 32 (refer to Figure 1 ).

[0110] Next, the control device 100 executes step S02. In step S02, for example, the transport control unit 102 controls the X-axis motor 96b of the X-axis drive unit 92 to move the second holding arm 91b, which is not holding a wafer W, from the wafer transport area 32 into the liquid processing unit U1. For example, the transport control unit 102 controls the liquid processing unit U1 and the X-axis motor 96b to position the second holding arm 91b below the processed wafer W.

[0111] Next, the control device 100 executes step S03. In step S03, for example, the transport control unit 102 controls the Z-axis motor 98 of the Z-axis drive unit 94 to raise the second holding arm 91b so that the second holding arm 91b receives the wafer W from the liquid processing unit U1.

[0112] Next, the control device 100 executes step S04. In step S04, for example, the transport control unit 102 controls the X-axis motor 96b to move the second holding arm 91b, which is holding a processed wafer W, from within the liquid processing unit U1 to the wafer transport area 32. Furthermore, in step S04, the transport control unit 102 controls the X-axis motor 96a of the X-axis drive unit 92 to move the first holding arm 91a, which is holding the next wafer W to be processed, from the wafer transport area 32 to the liquid processing unit U1. When step S04 is executed, the wafer W held by the first holding arm 91a is positioned vertically above the holding portion 52 of the rotating holding unit 50.

[0113] Next, the control device 100 executes step S05. In step S05, the transport control unit 102 waits for a predetermined period of time. During step S05, the transport control unit 102 controls the X-axis motor 96b so that the first holding arm 91a stops in the X-axis direction at the position after being moved in step S04.

[0114] Next, the control device 100 executes step S06. In step S06, for example, the transport control unit 102 controls the Z-axis motor 98 of the Z-axis drive unit 94 to lower the first holding arm 91a, causing the first holding arm 91a to transfer the wafer W to the liquid processing unit U1. When transferring the wafer W from the first holding arm 91a to the liquid processing unit U1, the wafer W may be transferred to the plurality of transfer pins 58 arranged around the holding unit 52. After placing the wafer W on the plurality of transfer pins 58, the liquid processing unit U1 may lower the plurality of transfer pins 58 to place the wafer W on the holding unit 52.

[0115] Next, the control device 100 executes steps S07 and S08. In step S07, for example, the transport control unit 102 controls the X-axis motor 96b to move the first holding arm 91a, which is not holding any wafer W, from within the liquid processing unit U1 to the wafer transport area 32. In step S08, for example, the transport control unit 102 controls the Y-axis motor 97 of the Y-axis drive unit 95 to move the first holding arm 91a from a position facing the target liquid processing unit U1 to another position within the wafer transport area 32.

[0116] Control device 100 may repeat steps S01 to S08 to repeatedly carry out wafer W in and out of the same liquid processing unit U1 or another liquid processing unit U1.

[0117] Focusing on a single transfer operation, the operation of the wafer transfer apparatus 33 can be divided into multiple unit operations. For example, the operation of the wafer transfer apparatus 33 from the time the first holding arm 91a and the second holding arm 91b move to a position facing the liquid processing unit U1 until the time the wafer transfer apparatus 33 moves from that position facing the liquid processing unit U1 to another position can be divided into the six unit operations shown in Table 1 below.

[0118] Table 1

[0119]

[0120] exist Figure 12 In FIG, for a part of the axes, the temporal change of the position of the holding arm (either the first holding arm 91a or the second holding arm 91b) when a plurality of unit operations are sequentially performed is shown. Figure 12 In the graph of , "X1" refers to the X1 axis, which indicates the time change of the position of the first holding arm 91a in the X-axis direction. "X2" refers to the X2 axis, which indicates the time change of the position of the second holding arm 91b in the X-axis direction. "Z" refers to the Z axis, which indicates the time change of the position of either the first holding arm 91a or the second holding arm 91b (for example, the first holding arm 91a) in the Z-axis direction. Figure 12 The horizontal axis (time axis) of the graph shown is divided into regions based on the plurality of unit operations shown in Table 1 above.

[0121] In the first unit operation, the X1 and Z axes are not driven, but the X2 axis is driven, and the second holding arm 91b is displaced in the X-axis direction to the handover position within the liquid processing unit U1. In the second unit operation, the Z axis is driven, instead of the X1 and X2 axes, and the second holding arm 91b is raised in the Z-axis direction to a position capable of receiving the wafer W. In the third unit operation, the Z axis is not driven, but the X1 and X2 axes are driven. Through the X1 and X2 axes, the second holding arm 91b is displaced in the X-axis direction from within the liquid processing unit U1 to the wafer transfer area 32, and the first holding arm 91a is displaced in the X-axis direction to the handover position within the liquid processing unit U1.

[0122] In the fourth unit operation, the axes including the X1 axis, the X2 axis, and the Z axis are not driven, and the first holding arm 91a and the second holding arm 91b stop at their current positions. In the fifth unit operation, the X1 axis and the X2 axis are not driven, but the Z axis is driven, and the first holding arm 91a descends in the Z axis direction to a position where the wafer W can be delivered to the liquid processing unit U1 (the above-mentioned transfer pin 58). In the fifth unit operation, the first holding arm 91a may also descend to a position lower than the upper end of the transfer pin 58. Figure 12 In the graph shown, “Zp” indicates the height position of the upper end of the delivery pin 58 .

[0123] In the sixth unit operation, the X1 axis is driven instead of the X2 and Z axes, and the first holding arm 91a is displaced in the X-axis direction from within the liquid processing unit U1 to the wafer transfer area 32. By executing the sixth unit operation, the first holding arm 91a and the second holding arm 91b are able to move in the Y-axis direction from positions facing the target liquid processing unit U1.

[0124] The transport control unit 102 may also control the wafer transport device 33 to perform a plurality of unit operations. The plurality of unit operations may also include an operation (first operation) for shifting the first holding arm 91a to a transfer position within the liquid processing unit U1, which corresponds to the third unit operation in Table 1. The plurality of unit operations may also include an operation (second operation) for shifting the first holding arm 91a from the transfer position, which corresponds to the sixth unit operation in Table 1. In each of the operations of raising the second holding arm 91b, the standby operation, and lowering the first holding arm 91a, the first holding arm 91a is stopped in the X-axis direction.

[0125] The transport control unit 102 may also control the Z-axis motor 98 (elevation motor) after the third unit operation to lower the first holding arm 91a and place the wafer W on the transfer pins 58 provided around the rotating holding unit 50. The plurality of unit operations may also include a lowering operation. This lowering operation may include: lowering the first holding arm 91a to the height of the transfer pins; and further lowering the first holding arm 91a from the height of the transfer pins 58. This lowering operation corresponds to the fifth unit operation in Table 1.

[0126] <Acquisition and Recording of Feature Quantities>

[0127] When the feeding-in and feeding-out operations are performed, position information from the motor is obtained for each axis in each sampling period. Therefore, by pre-recording time series data representing the time changes of the position information for each axis, the execution result of the feeding-in and feeding-out operations of the chip conveying device 33 can be confirmed as needed. However, in the chip processing system 1, the feeding-in and feeding-out operations of the chip conveying device 33 are repeatedly performed. When the time series data of each axis is recorded for each feeding-in and feeding-out operation, the amount of data becomes huge. Therefore, in the control device 100 (substrate processing method) of the present invention, position feature quantities, speed feature quantities and torque feature quantities are obtained in the operation of each axis, and these feature quantities are recorded. Below, a specific example of the acquisition of feature quantities by the feature quantity acquisition unit 110 and the recording of feature quantities by the feature quantity recording unit 118 is explained by taking the case of executing multiple unit operations of Table 1 above as an example.

[0128] The position information acquisition unit 112 of the feature quantity acquisition unit 110 acquires the feature quantity of the position of the first holding arm 91a in the X-axis direction as the position feature quantity for each of the plurality of unit operations. Figure 13 (a) shows time-series data indicating temporal changes in the position of the first holding arm 91 a in the X-axis direction. Figure 13 The time series data exemplified in (a) of FIG. 1 represents temporal changes in position when a plurality of unit operations are performed. The position information acquisition unit 112 acquires the position feature values ​​shown in Table 2 below for each of the plurality of unit operations.

[0129] Table 2

[0130]

[0131] "(i)" to "(vii)" in Table 2 and Figure 13The fifth unit operation is further divided into an operation in which the first holding arm 91a is lowered to the height position of the transfer pin 58 and an operation in which the first holding arm 91a is further lowered from the height position of the transfer pin 58. The first unit operation in the fifth unit operation is referred to as the "fifth (1) unit operation", and the second unit operation is referred to as the "fifth (2) unit operation".

[0132] exist Figure 13 (b) shows time series data indicating the time variation of the speed of the first holding arm 91a in the X-axis direction. The speed information acquisition unit 114 of the feature quantity acquisition unit 110 acquires the feature quantity of the speed of the first holding arm 91a in the X-axis direction as the speed feature quantity for a part of the operation in which the first holding arm 91a is displaced in the X-axis direction in a plurality of unit operations. The speed information acquisition unit 114 acquires the speed feature quantities shown in the following Table 3 for a part of the unit operations. The “-” in Table 3 indicates that no speed feature quantity is acquired in the unit operation, and “(i)” to “(iv)” are the same as Figure 13 The numbers correspond to the curve diagram shown in (b).

[0133] Table 3

[0134]

[0135] exist Figure 13 (c) shows time series data representing the time variation of the torque of the X-axis motor 96a that drives the first holding arm 91a in the X-axis direction. The torque information acquisition unit 116 of the feature quantity acquisition unit 110 acquires the feature quantity of the X-axis motor 96a as a speed feature quantity for a portion of the operation in which the first holding arm 91a is displaced in the X-axis direction in a plurality of unit operations. The torque information acquisition unit 116 acquires the torque feature quantities shown in the following Table 4 for a portion of the unit operations. The “-” in Table 3 indicates that no speed feature quantity is acquired in the unit operation, and “(i)” to “(iv)” are the same as Figure 13 The numbers correspond to the curve diagram shown in (c).

[0136] Table 4

[0137]

[0138] The feature quantity acquisition unit 110 may also acquire position feature quantities, speed feature quantities, and torque feature quantities for the X2 axis, similarly to the X1 axis. The position information acquisition unit 112 may also acquire position feature quantities as shown in Table 5 below for each of a plurality of unit operations. The speed information acquisition unit 114 may also acquire speed feature quantities as shown in Table 6 below for each of a portion of the unit operations. The torque information acquisition unit 116 may also acquire torque feature quantities as shown in Table 7 below for each of a portion of the unit operations. Table 6 omits the columns for unit operations for which speed feature quantities were not acquired, and Table 7 omits the columns for unit operations for which torque feature quantities were not acquired.

[0139] Table 5

[0140]

[0141] Table 6

[0142]

[0143] Table 7

[0144]

[0145] The feature quantity acquisition unit 110 may also acquire position feature quantities, speed feature quantities, and torque feature quantities for the Z axis, similarly to the X1 and X2 axes. The position information acquisition unit 112 may also acquire position feature quantities as shown in Table 8 below for each of a plurality of unit operations. The speed information acquisition unit 114 may also acquire speed feature quantities as shown in Table 9 below for each of a portion of the unit operations. The torque information acquisition unit 116 may also acquire torque feature quantities as shown in Table 10 below for each of a portion of the unit operations. Table 9 omits the columns for unit operations for which speed feature quantities were not acquired, and Table 10 omits the columns for unit operations for which torque feature quantities were not acquired.

[0146] Table 8

[0147]

[0148] Table 9

[0149]

[0150] Table 10

[0151]

[0152] The position in the Z-axis direction may not be the position of the first holding arm 91a, but the position of another part in the portion driven by the Z-axis drive unit 94 (for example, the second holding arm 91b). The speed in the Z-axis direction may not be the speed of the first holding arm 91a, but the speed of another part in the portion driven by the Z-axis drive unit 94 (for example, the second holding arm 91b). Even if the characteristic quantity of the position or speed of another part in the Z-axis drive unit 94 is obtained, the positional relationship between the other part and the first holding arm 91a in the Z-axis direction is constant. Therefore, obtaining the characteristic quantity of the position or speed of the above-mentioned other part is equivalent to obtaining the characteristic quantity of the position of the first holding arm 91a in the Z-axis direction, or the characteristic quantity of the speed of the first holding arm 91a in the Z-axis direction.

[0153] The feature quantity recording unit 118 records the position feature quantity, velocity feature quantity, and torque feature quantity acquired by the feature quantity acquisition unit 110. The feature quantity recording unit 118 may also record the position feature quantity, velocity feature quantity, and torque feature quantity each time the wafer transfer device 33 performs a transfer operation. The feature quantity recording unit 118 may also record (store) the position feature quantity, velocity feature quantity, and torque feature quantity in a data storage unit maintained by the control device 100 or in a data storage unit provided external to the control device 100.

[0154] The feature quantity recording unit 118 may also record, for each of the plurality of unit operations, a feature quantity of the position of the first holding arm 91a in the X-axis direction as a position feature quantity. The feature quantity recording unit 118 may also record, for each of the third and sixth unit operations, a feature quantity of the velocity of the first holding arm 91a in the X-axis direction as a velocity feature quantity, and a feature quantity of the torque of the X-axis motor 96a as a torque feature quantity. The feature quantity recording unit 118 may also record, for each of the third and sixth unit operations, the maximum and minimum values ​​of the torque of the X-axis motor 96a as a torque feature quantity. The feature quantity recording unit 118 may also record, for each of the third and sixth unit operations, the displacement of the first holding arm 91a in the X-axis direction as a position feature quantity.

[0155] The feature quantity recording unit 118 may also record the average value of the position of the first holding arm 91a in the X-axis direction as the position feature quantity for the operation of stopping the first holding arm 91a in the X-axis direction among the plurality of unit operations. The operation of stopping the first holding arm 91a in the X-axis direction corresponds to the first unit operation, the second unit operation, the fourth unit operation, the fifth (1) unit operation, and the fifth (2) unit operation. The feature quantity recording unit 118 may also record the maximum value or minimum value of the speed of the first holding arm 91a in the X-axis direction and the time required for the displacement of the first holding arm 91a in the X-axis direction as the speed feature quantity for each of the third unit operation and the sixth unit operation.

[0156] The feature quantity recording unit 118 may also record, for each of the plurality of unit operations, a feature quantity of the position of the first holding arm 91a in the Z-axis direction as a position feature quantity. The feature quantity recording unit 118 may also record, for each of the second and fifth unit operations, a feature quantity of the speed of the first holding arm 91a in the Z-axis direction as a speed feature quantity, and a feature quantity of the torque of the Z-axis motor 98 (lifting motor) as a torque feature quantity.

[0157] Furthermore, the transport control unit 102 of the control device 100 may displace the first holding arm 91a in the Y-axis direction using the Y-axis drive unit 95 during any of the aforementioned multiple unit operations. The transport control unit 102 may also move (rotate) the first holding arm 91a in the θ direction using the θ-axis drive unit 93 during any of the aforementioned multiple unit operations. The feature quantity acquisition unit 110 may acquire position feature quantities, velocity feature quantities, and torque feature quantities for each of the Y-axis and the θ-axis, similarly to the X1-axis, X2-axis, and Z-axis. The feature quantity recording unit 118 may also record position feature quantities, velocity feature quantities, and torque feature quantities for each of the Y-axis and the θ-axis.

[0158] exist Figure 14 , the process flow executed by the control device 100 regarding acquisition and recording of feature quantities is illustrated. In this process flow, for example, the control device 100 first executes step S11. In step S11, for example, the control device 100 waits until the wafer W is transferred in and out of the liquid processing unit U1 by the wafer transfer device 33.

[0159] Next, the control device 100 executes step S12. In step S12, for example, the position information acquisition unit 112 acquires positional features for at least the X1 axis, the X2 axis, and the Z axis. In one example, the position information acquisition unit 112 calculates the positional features shown in Tables 2, 5, and 8 based on time-series data representing temporal changes in position.

[0160] Next, the control device 100 executes step S13. In step S13, for example, the speed information acquisition unit 114 acquires speed feature quantities for at least the X1 axis, the X2 axis, and the Z axis. In one example, the speed information acquisition unit 114 obtains time-series data representing temporal changes in speed and calculates the speed feature quantities shown in Tables 3, 6, and 9 based on this time-series data.

[0161] Next, the control device 100 executes step S14. In step S14, for example, the torque information acquisition unit 116 acquires torque characteristic values ​​for at least the X1-axis, the X2-axis, and the Z-axis. In one example, the torque information acquisition unit 116 obtains time-series data representing temporal changes in torque and calculates the torque characteristic values ​​shown in Tables 4, 7, and 10 based on this time-series data.

[0162] Next, the control device 100 executes step S15. In step S15, for example, the feature quantity recording unit 118 records the position feature quantity obtained in step S12, the speed feature quantity obtained in step S13, and the torque feature quantity obtained in step S14. In one example, the feature quantity recording unit 118 causes the data storage unit of the control device 100 to store these feature quantities.

[0163] After executing step S15, the control device 100 returns to step S11. Thereafter, the control device 100 executes the series of steps S12 through S15 each time a wafer W is loaded or unloaded. The control device 100 also executes the series of steps S12 through S15 for loading or unloading other liquid processing units U1.

[0164] <Countermeasures for eccentricity and position adjustment>

[0165] In the handover of the chip W to the liquid processing unit U1 using the chip conveying device 33, at the moment of handing over the chip to the holding part 52 of the rotating holding part 50, it is preferred that the rotation center RC of the holding part 52 is consistent with the center of the chip W (hereinafter referred to as "center CP"). This is because when a positional offset occurs between the rotation center RC and the center CP, the above-mentioned eccentricity will occur between the center of the shape of the edge E and the center CP. For example, before the chip processing system 1 is operated, the drive amount (rotation amount) of the X-axis motor 96a that drives the first holding arm 91a is determined by teaching so that no positional offset occurs between the rotation center RC and the center CP in the X-axis direction. Then, the conveying control unit 102 shifts the first holding arm 91a according to the determined drive amount (rotation amount) using the X-axis motor 96a each time the feeding and unfettering operation is performed.

[0166] However, even if the first holding arm 91a is displaced by the X-axis motor 96a with the same drive amount (rotation amount), for some reason, a positional offset may occur between the rotation center RC and the center CP in the X-axis direction. For example, when the wafer processing system 1 resumes operation after a long period of downtime due to maintenance, the position of the eccentricity may gradually shift (change) as processing progresses within a batch representing a processing unit. The following describes eccentricity in the X-axis direction and control for reducing it (a substrate processing method).

[0167] exist Figure 15 In (a), the state where the actual displacement amount of the first holding arm 91a in the X-axis direction is consistent with the ideal displacement amount (hereinafter referred to as the "optimal state") is illustrated. In the optimal state, when the wafer W is placed on the holding portion 52, the center CP of the wafer W is consistent with the rotation center RC of the holding portion 52. Figure 15 (b) illustrates a state where the actual displacement of the first holding arm 91a in the X-axis direction is greater than the ideal displacement (hereinafter referred to as the "over-travel state"). In the over-travel state, when the wafer W is placed on the holding portion 52, the center CP is offset to the rear of the rotation center RC as viewed from the wafer transfer device 33.

[0168] exist Figure 15 (c) illustrates a state where the actual displacement of the first holding arm 91a in the X-axis direction is smaller than the ideal displacement (hereinafter referred to as the "near-front state"). In the near-front state, when the wafer W is placed on the holding portion 52, the center CP is offset toward the near-front side relative to the rotation center RC as viewed from the wafer conveyor 33. Alternatively, the wafer W may be placed on the holding portion 52 with its posture adjusted so that the postures of the wafers W (the positions of the marking portions in the rotational direction) are aligned.

[0169] exist Figure 16 In FIG, the positional relationship between the center O1 of the edge E and the center CP is shown for the optimal state, the over-travel state, and the state in front. Figure 16 In the figure, "(a)" shows the state of edge E when processed by the liquid processing unit U1 after being placed in the optimal state, and the center O1 of edge E coincides with the center CP. "(b)" shows the state of edge E when processed by the liquid processing unit U1 after being placed in the over-advanced state, and the center O1 of edge E is displaced (offset) from the center CP in the X-axis direction. "(c)" shows the state of edge E when processed by the liquid processing unit U1 after being placed in the near-forward state, and the center O1 of edge E and the center CP are displaced (offset) in the X-axis direction toward the side opposite to that in (b).

[0170] exist Figure 17 (a) shows an example of the measurement result of the eccentricity when the wafer processing system 1 is restarted and the eccentricity position gradually shifts as the processing progresses within the batch. Figure 17In the graph shown in (a), the horizontal axis represents the identification number of wafers W within a batch, and processing is performed in ascending numerical order. A total of 288 wafers are processed in a batch, and one of every four wafers (72 wafers total) is sampled to measure the eccentricity. The vertical axis represents the eccentricity in the X-axis direction (dx).

[0171] exist Figure 17 (b) shows, among the torque feature quantities recorded by the feature quantity recording unit 118 , changes in the maximum value of the torque of the X-axis motor 96a (hereinafter referred to as “maximum torque value”) during the operation of shifting the first holding arm 91a to the handover position. Figure 17 The maximum torque change shown in (b) is obtained from Figure 17 The eccentricity shown in (a) is obtained by the same batch feeding and feeding operation. Figure 17 In the graph shown in (b), the horizontal axis represents the identification number of the wafer W in the batch, and the vertical axis represents the maximum torque. The maximum torque is plotted for all wafers in one batch.

[0172] Figure 17 The horizontal axis of the graph shown in (a) is "72" and Figure 17 The horizontal axis of the graph shown in (b) corresponds to "288". Figure 17 (a) and Figure 17 The comparison results in (b) show that as processing progresses within a batch, the eccentricity gradually increases, and accordingly, the maximum torque gradually decreases. In other words, it can be seen that there is a correlation between the eccentricity in the X-axis direction and the maximum torque. The eccentricity in the X-axis direction depends on the offset between the center CP and the rotation center RC when the wafer W is transferred. Therefore, there is also a correlation between the offset between the center CP and the rotation center RC when the wafer W is transferred and the maximum torque.

[0173] The control device 100 may also perform control (hereinafter referred to as "adjustment control") to adjust the position of the first holding arm 91a in the X-axis direction based on the maximum torque value when the wafer W is transferred from the first holding arm 91a of the wafer conveying device 33 to the liquid processing unit U1. Figure 9 As shown, the control device 100 may include a correction amount holding unit 122 as a functional block.

[0174] The torque information acquisition unit 116 of the characteristic quantity acquisition unit 110 acquires the maximum torque value used for adjustment control. The maximum torque value used for adjustment control is the maximum torque value of the X-axis motor 96a during the period when the first holding arm 91a is shifted to the wafer W transfer position within the liquid processing unit U1. In the examples shown in Tables 1 and 2 above, the maximum torque value used for adjustment control is the maximum torque value of the X-axis motor 96a acquired for the third unit operation.

[0175] The transport control unit 102 may also perform the aforementioned adjustment control after shifting the first holding arm 91a to the aforementioned transfer position. During the adjustment control, the transport control unit 102 uses the X-axis motor 96a to adjust the position of the first holding arm 91a based on the maximum torque value to reduce the offset between the center CP of the wafer W held by the first holding arm 91a and the rotation center RC of the rotating holding unit 50. In the present invention, adjusting the position of the first holding arm 91a includes not only changing the position of the first holding arm 91a but also maintaining the first holding arm 91a at its current position.

[0176] The correction amount holding unit 122 holds corresponding information. The conveying control unit 102 may also adjust the position of the first holding arm 91a using the X-axis motor 96a with reference to the corresponding information held by the correction amount holding unit 122 during adjustment control. The corresponding information held by the correction amount holding unit 122 is information that pre-establishes a correspondence between the maximum torque value used for adjustment control and the adjustment amount of the position of the first holding arm 91a in the X-axis direction. The corresponding information held by the correction amount holding unit 122 can be obtained, for example, by using various results obtained by experimentally operating the chip conveying device 33 before operating the chip processing system 1. In the corresponding information, the correspondence between the maximum torque value and the adjustment amount can be determined in the form of a table, and the correspondence between the maximum torque value and the adjustment amount can be determined by a curve graph or an approximate formula.

[0177] exist Figure 18 2 illustrates the process flow executed by the control device 100 when performing adjustment control and transferring a wafer W from the first holding arm 91a to the liquid processing unit U1 (delivery pins 58). In this process flow, with the first holding arm 91a holding the wafer W positioned in the wafer transfer area 32, the control device 100 first executes step S41. In step S41, for example, the transfer control unit 102 controls the X-axis motor 96a to begin shifting the first holding arm 91a in the X-axis direction.

[0178] Next, the control device 100 executes steps S42 and S43. In step S42, for example, the transport control unit 102 waits until the X-axis motor 96a rotates by the drive amount (rotation amount) determined by the operation command held in the operation command holding unit 104. In step S43, for example, the X-axis motor 96a is controlled to stop the displacement of the first holding arm 91a in the X-axis direction.

[0179] Next, the control device 100 executes steps S44 and S45. In step S44, for example, the torque information acquisition unit 116 acquires the maximum torque value (the aforementioned maximum torque value) of the X-axis motor 96a during the execution of the series of processes from steps S41 to S43. In step S45, for example, the transport control unit 102 refers to the aforementioned correspondence information stored in the correction value storage unit 122 to calculate (acquire) the adjustment amount corresponding to the maximum torque value obtained in step S44.

[0180] Next, the control device 100 executes step S46. In step S46, for example, the transport control unit 102 controls the X-axis motor 96a based on the adjustment amount calculated in step S45 to adjust the X-axis position of the first holding arm 91a. If the adjustment amount calculated in step S45 is zero, the transport control unit 102 controls the X-axis motor 96a to maintain the first holding arm 91a at its current position. By executing step S46, the distance between the center CP of the wafer W held by the X-axis motor 96a and the rotation center RC of the rotating holding unit 50 in the X-axis direction can be reduced compared to the time at which step S43 is completed.

[0181] Next, the control device 100 executes step S47. In step S47, for example, the transport control unit 102 controls the Z-axis motor 98 to lower the first holding arm 91a, thereby transferring the wafer W from the first holding arm 91a to the transfer pins 58. By executing the above series of steps S41 to S47, the eccentricity caused by the difference between the actual displacement of the first holding arm 91a and the ideal displacement can be reduced for each wafer W transfer operation.

[0182] [Modification]

[0183] Figure 11 、 Figure 14 and Figure 18 The series of processes shown are examples and can be modified as appropriate. In the series of processes described above, the control device 100 may execute one step and the next step in parallel, or may execute the steps in a different order than in the examples described above. The control device 100 may also omit any step, or may execute a process different from the examples described above in any step.

[0184] The correspondence information referenced in step S45 may be shared between one liquid processing unit U1 and a different liquid processing unit U1. In this case, if there is a difference in the drive amount (rotation amount of the motor) when the first holding arm 91a is shifted to the handover position between the two liquid processing units U1, the adjustment amount may be calculated taking this difference into account.

[0185] When performing the aforementioned adjustment control based on the maximum torque value, it is not necessary to record the position, velocity, and torque characteristics for each axis in order to minimize positional deviation during transfer of wafers W. Furthermore, it is not necessary to acquire characteristics other than the maximum torque value used for the adjustment control.

[0186] When the position feature, speed feature, and torque feature are recorded at least about the X1, X2, and Z axes, the above-mentioned adjustment control may not be performed from the perspective of reducing the amount of data when retaining the execution results of the input and output operations.

[0187] The wafer conveying device 33 is not limited to the above-described example. The wafer conveying device 33 may also include a single holding arm (holding portion) in place of the first holding arm 91a and the second holding arm 91b. In any of the various examples described above, at least a portion of the contents described in the other examples may be combined.

[0188] [Summary of the Invention]

[0189] The present invention includes the following structures or methods [1] to

[17] .

[0190] [1] The substrate processing device (1) includes: a substrate conveying unit (33) having a holding portion (91a) for holding a substrate (W) and a motor (96a) for shifting the holding portion (91a) in a predetermined direction (X); a conveying control portion (102) for controlling the substrate conveying unit (33) so as to shift the holding portion (91a) to a handover position for handing over the substrate (W) to a rotating holding portion (50) by using the motor (96a), wherein the rotating holding portion (50) holds the substrate (W) and rotates it; and a torsional A torque information acquisition unit (116) acquires the maximum value of the torque of the motor (96a) during the period when the holding unit (91a) is shifted to the above-mentioned handover position. After the holding unit (91a) is shifted to the above-mentioned handover position, the conveying control unit (102) uses the motor (96a) to adjust the position of the holding unit (91a) based on the maximum value of the torque so as to reduce the offset between the center (CP) of the substrate (W) held by the holding unit (91a) and the rotation center (RC) of the rotating holding unit (50).

[0191] As described above, the following insight has been obtained: there is a correlation between the maximum value of the torque of the motor 96a when the holding portion 91a is shifted to the handover position and the offset between the center CP and the rotation center RC. In the substrate processing device (1), the position of the holding portion (91a) is adjusted by the motor (96a) according to the maximum value of the torque of the motor (96a) to reduce the offset between the center (CP) and the rotation center (RC). Therefore, even if the actual displacement of the holding portion (91a) deviates from the ideal displacement, the offset between the center (CP) and the rotation center (RC) when the rotating holding portion (50) hands over the substrate (W) can be reduced. Therefore, it is useful for reducing the position offset when handing over the substrate (W).

[0192] [2] According to the substrate processing device (1) described in [1] above, the conveying control unit (102) pre-establishes corresponding information based on the relationship between the maximum value of the torque and the adjustment amount of the position of the holding unit (91a), and uses the motor (96a) to adjust the position of the holding unit (91a).

[0193] In this case, the adjustment amount for reducing the above-mentioned deviation can be easily obtained based on the maximum value of the torque. Therefore, it is useful for reducing the calculation load when performing control to reduce the deviation between the center (CP) and the rotation center (RC) by adjusting the position of the holding portion (91a) using the motor (96a).

[0194] [3] A substrate processing device (1) according to the above-mentioned [1] or [2], wherein the conveying control unit (102) controls the substrate conveying unit (33) to perform a plurality of unit operations, wherein the plurality of unit operations include a first operation of shifting the holding unit (91a) to the above-mentioned handover position and a second operation of shifting the holding unit (91a) from the above-mentioned handover position, and the above-mentioned substrate processing device (1) further includes a feature quantity recording unit (118) for recording position feature quantities, speed feature quantities and torque feature quantities, and the feature quantity recording unit (118) records the feature quantity of the position of the holding unit (91a) in a specified direction (X) as the above-mentioned position feature quantity for each of the above-mentioned plurality of unit operations, and records the feature quantity of the speed of the holding unit (91a) in the specified direction (X) as the above-mentioned speed feature quantity for each of the above-mentioned first operation and the above-mentioned second operation as the above-mentioned speed feature quantity, and records the feature quantity of the torque of the motor (96a) as the above-mentioned torque feature quantity.

[0195] By pre-recording the time series data of the detection values ​​from the motor when the substrate conveying unit (33) performs the above-mentioned multiple unit operations, it is possible to confirm how the substrate conveying unit (33) has been operated in the future as needed. However, in the substrate processing device (1), the substrate conveying unit (33) repeatedly performs multiple unit operations, so when the above-mentioned time series data is directly recorded, the amount of data becomes huge. In contrast, in the above-mentioned substrate processing device (1), the position characteristic quantity, speed characteristic quantity and torque characteristic quantity related to the displacement in the specified direction of the holding portion (91a) are recorded, so that the operation performed by the substrate conveying unit (33) can be confirmed and the amount of data used for recording can be reduced. That is, it is useful for reducing the amount of data and recording the execution results of the conveying operation.

[0196] [4] According to the substrate processing device (1) described in [3] above, the characteristic quantity recording unit (118) records the maximum value and the minimum value of the torque of the motor (96a) as the above torque characteristic quantity for each of the above first operation and the above second operation.

[0197] By confirming the maximum and minimum values ​​of the torque, it is possible to understand to some extent how the torque of the motor is generated in the first and second operations. Therefore, it is useful for achieving both understanding the operation results and reducing the amount of data.

[0198] [5] According to the substrate processing device (1) described in [3] or [4] above, the feature quantity recording unit (118) records the displacement amount of the holding unit (91a) in the specified direction (X) as the above-mentioned position feature quantity for each of the above-mentioned first operation and the above-mentioned second operation.

[0199] By checking the amount of displacement when the holding portion 91a is displaced, it is possible to understand to some extent how the holding portion 91a is displaced in the first and second operations. This is useful for achieving both understanding the operation results and reducing the amount of data.

[0200] [6] According to the substrate processing device (1) described in any one of [3] to [5] above, the feature quantity recording unit (118) records the average value of the position of the holding unit (91a) in the specified direction (X) as the above-mentioned position feature quantity for the operation of stopping the holding unit (91a) in the specified direction (X) among the above-mentioned multiple unit operations.

[0201] During a stop operation, the position variation is small, so by checking the average value of the position, it is possible to understand to some extent how the first holding arm 91a was operated (at which position it stopped). This is useful for achieving both understanding the operation results and reducing the amount of data.

[0202] [7] According to the substrate processing device (1) described in any one of the above [3] to [6], the feature quantity recording unit (118) records the maximum value or minimum value of the speed of the holding unit (91a) in the specified direction (X) and the time required for the holding unit (91a) to shift in the specified direction (X) as the above-mentioned speed feature quantity for each of the above-mentioned first operation and the above-mentioned second operation.

[0203] By checking the maximum or minimum speed when shifting the holding unit 91a and the time required for the shift, it is possible to understand to some extent the speed at which the holding unit 91a was shifted during the first and second operations. This is useful for achieving both understanding the operation results and reducing the amount of data.

[0204] [8] A substrate processing device (1) according to any one of the above [3] to [7], wherein the substrate conveying unit (33) further includes a lifting motor (98) for moving the holding portion (91a) in the up-down direction (Z), and the conveying control portion (102) controls the lifting motor (98) after the above-mentioned first operation to lower the holding portion (91a) and place the substrate (W) on the transfer pins (58) provided around the rotating holding portion (50), and the above-mentioned multiple unit operations include a lowering operation, which includes: lowering the holding portion (91a) to The operation of adjusting the height position of the transfer pin (58); and the operation of further lowering the holding portion (91a) from the height position of the transfer pin (58), the characteristic quantity recording portion (118) also records the characteristic quantity of the position of the holding portion (91a) in the up and down direction (Z) as the above-mentioned position characteristic quantity for each unit operation of the above-mentioned multiple unit operations, and also records the characteristic quantity of the speed of the holding portion (91a) in the up and down direction (Z) as the above-mentioned speed characteristic quantity for the above-mentioned lowering operation, and also records the characteristic quantity of the torque of the lifting motor (98) as the above-mentioned torque characteristic quantity.

[0205] In this case, the position characteristic quantity, speed characteristic quantity and torque characteristic quantity related to the lifting and lowering of the holding portion 91a are also recorded. Therefore, it is possible to avoid an excessive increase in the amount of data and to confirm the operation result of the substrate conveying unit (33) in more detail.

[0206] [9] A substrate processing method, which is performed by a substrate processing device (1) including a substrate conveying unit (33), wherein the substrate conveying unit (33) has a holding portion (91a) for holding a substrate (W) and a motor (96a) for shifting the holding portion (91a) in a specified direction (X), and the substrate processing method includes the steps of controlling the substrate conveying unit (33) to shift the holding portion (91a) to a handover position for handing over the substrate (W) to a rotating holding portion (50) by using the motor (96a), wherein the rotating holding portion (50) The present invention relates to a step of: holding a substrate (W) by a holding portion (50) and rotating the substrate (W); obtaining the maximum value of the torque of the motor (96a) during the period when the holding portion (91a) is shifted to the above-mentioned handover position; and adjusting the position of the holding portion (91a) by using the motor (96a) based on the maximum value of the above-mentioned torque after the holding portion (91a) is shifted to the above-mentioned handover position, so as to reduce the offset between the center (CP) of the substrate (W) held by the holding portion (91a) and the rotation center (RC) of the rotating holding portion (50).

[0207] This substrate processing method is similar to the substrate processing apparatus (1) described in [1] above, and is useful for reducing positional deviation when transferring substrates (W).

[0208]

[10] According to the substrate processing method described in [9] above, in the step of adjusting the position of the holding portion (91a) using the motor (96a), corresponding information is pre-established with reference to the relationship between the maximum value of the torque and the adjustment amount of the position of the holding portion (91a), and the position of the holding portion (91a) is adjusted using the motor (96a).

[0209] In this case, similarly to the substrate processing apparatus (1) described in [2] above, it is useful to reduce the computational load when performing control for adjusting the position of the holding portion (91a) using a motor (96a) to reduce the offset between the center (CP) and the rotation center (RC).

[0210]

[11] According to the substrate processing method described in [9] or

[10] above, in the substrate processing method, the substrate conveying unit (33) is controlled to perform multiple unit operations, and the multiple unit operations include a first operation of shifting the holding portion (91a) to the handover position and a second operation of shifting the holding portion (91a) from the handover position. The substrate processing method also includes a step of recording position characteristic quantities, speed characteristic quantities and torque characteristic quantities. The step of recording the position characteristic quantities, the speed characteristic quantities and the torque characteristic quantities includes: for each of the multiple unit operations, recording the characteristic quantity of the position of the holding portion (91a) in a specified direction (X) as the above-mentioned position characteristic quantity; and for each of the first operation and the second operation, recording the characteristic quantity of the speed of the holding portion (91a) in the specified direction (X) as the above-mentioned speed characteristic quantity, and recording the characteristic quantity of the torque of the motor (96a) as the above-mentioned torque characteristic quantity.

[0211] In this case, similarly to the substrate processing apparatus (1) described in [3] above, it is useful for reducing the amount of data and recording the execution results of the transport operation.

[0212]

[12] According to the substrate processing method described in

[11] above, in the step of recording the above-mentioned torque characteristic quantity, for each of the above-mentioned first operation and the above-mentioned second operation, the maximum value and the minimum value of the torque of the motor (96a) are recorded as the above-mentioned torque characteristic quantity.

[0213] In this case, similarly to the substrate processing apparatus (1) described in [4] above, it is useful for achieving both the ability to grasp the operation results and the reduction of the amount of data.

[0214]

[13] According to the substrate processing method described in

[11] or

[12] above, in the step of recording the above-mentioned position characteristic quantity, for each of the above-mentioned first operation and the above-mentioned second operation, the displacement amount of the retaining portion (91a) in the specified direction (X) is recorded as the above-mentioned position characteristic quantity.

[0215] In this case, similarly to the substrate processing apparatus (1) described in [5] above, it is useful for achieving both the ability to grasp the operation results and the reduction of the amount of data.

[0216]

[14] A substrate processing method according to any one of

[11] to

[13] above, wherein, in the step of recording the above-mentioned position characteristic quantity, for the operation of stopping the holding portion (91a) in the prescribed direction (X) among the above-mentioned multiple unit operations, the average value of the position of the holding portion (91a) in the prescribed direction (X) is recorded as the above-mentioned position characteristic quantity.

[0217] In this case, similarly to the substrate processing apparatus (1) described in [6] above, it is useful for achieving both the ability to grasp the operation results and the reduction of the amount of data.

[0218]

[15] A substrate processing method according to any one of

[11] to

[14] above, wherein, in the step of recording the above-mentioned speed characteristic quantity, for each of the above-mentioned first operation and the above-mentioned second operation, the maximum value or minimum value of the speed of the holding portion (91a) in the prescribed direction (X) and the time required for the holding portion (91a) to shift in the prescribed direction (X) are recorded as the above-mentioned speed characteristic quantity.

[0219] In this case, similarly to the substrate processing apparatus (1) described in [7] above, it is useful for achieving both the ability to grasp the operation results and the reduction of the amount of data.

[0220]

[16] A substrate processing method according to any one of

[11] to

[15] above, wherein the substrate conveying unit (33) further comprises a lifting motor (98) for moving the holding portion (91a) in the up-down direction (Z), and the substrate processing method further comprises the following steps: after the first operation, controlling the lifting motor (98) to lower the holding portion (91a) and place the substrate (W) on a transfer pin (58) provided around the rotating holding portion (50), wherein the plurality of unit operations include a lowering operation, wherein the lowering operation comprises: lowering the holding portion (91a) to the position of the transfer pin (58); The step of adjusting the height position of the holding portion (91a) to a higher position; and the step of further lowering the holding portion (91a) from the height position of the transfer pin (58), and the step of recording the above-mentioned position characteristic quantity, the above-mentioned speed characteristic quantity and the above-mentioned torque characteristic quantity include: for each of the above-mentioned multiple unit operations, the step of also recording the characteristic quantity of the position of the holding portion (91a) in the up-down direction (Z) as the above-mentioned position characteristic quantity; and for the above-mentioned descending operation, the step of also recording the characteristic quantity of the speed of the holding portion (91a) in the up-down direction (Z) as the above-mentioned speed characteristic quantity, and the step of also recording the characteristic quantity of the torque of the lifting motor (98) as the above-mentioned torque characteristic quantity.

[0221] In this case, as with the substrate processing apparatus (1) described in [8] above, an excessive increase in the amount of data can be avoided, and the operation results of the substrate transport unit (33) can be confirmed in more detail.

[0222]

[17] A computer-readable storage medium storing a program for causing a device to execute the substrate processing method described in any one of [9] to

[16] above.

Claims

1. A substrate processing device, characterized in that: include: a substrate transport unit having a holding portion for holding the substrate and a motor for displacing the holding portion in a prescribed direction; a transport control unit configured to control the substrate transport unit so as to use the motor to shift the holding unit to a transfer position for transferring the substrate to a rotating holding unit capable of holding and rotating the substrate; and a torque information acquiring unit configured to acquire a maximum value of the torque of the motor during a period in which the holding unit is displaced to the handover position; After shifting the holding portion to the handover position, the transport control portion uses the motor to adjust the position of the holding portion based on the maximum value of the torque so as to reduce the offset between the center of the substrate held by the holding portion and the rotation center of the rotating holding portion.

2. The substrate processing device according to claim 1, wherein: The transport control unit adjusts the position of the holding unit using the motor by referring to correspondence information in which the maximum value of the torque and the adjustment amount of the position of the holding unit are previously associated.

3. The substrate processing device according to claim 1 or 2, characterized in that: The transport control section controls the substrate transport unit to perform a plurality of unit operations, the plurality of unit operations including a first operation of shifting the holding section to the handover position and a second operation of shifting the holding section from the handover position. The substrate processing device further includes a feature quantity recording unit that records position feature quantities, speed feature quantities, and torque feature quantities. The feature quantity recording unit records, for each of the plurality of unit operations, a feature quantity of the position of the holding unit in the predetermined direction as the position feature quantity. The feature quantity recording unit records, for each of the first operation and the second operation, a feature quantity of a speed of the holding unit in the predetermined direction as the speed feature quantity and a feature quantity of a torque of the motor as the torque feature quantity.

4. The substrate processing device according to claim 3, wherein: The feature quantity recording unit records a maximum value and a minimum value of the torque of the motor as the torque feature quantity for each of the first operation and the second operation.

5. The substrate processing device according to claim 3, wherein: The feature amount recording unit records, for each of the first operation and the second operation, a displacement amount of the holding unit in the predetermined direction as the position feature amount.

6. The substrate processing device according to claim 5, wherein: The feature quantity recording unit records, as the position feature quantity, an average value of the position of the holding unit in the predetermined direction for the operation of stopping the holding unit in the predetermined direction among the plurality of unit operations.

7. The substrate processing device according to claim 3, wherein: The feature quantity recording unit records, for each of the first operation and the second operation, a maximum value or a minimum value of the speed of the holding unit in the predetermined direction and a time required for displacement of the holding unit in the predetermined direction as the speed feature quantity.

8. The substrate processing device according to claim 3, wherein: The substrate transport unit further includes a lifting motor for moving the holding portion in the vertical direction. After the first operation, the transport control unit controls the lifting motor to lower the holding unit and place the substrate on the delivery pins provided around the rotating holding unit. The plurality of unit operations include a lowering operation, wherein the lowering operation includes an operation of lowering the holding portion to a height position of the delivery pin and an operation of further lowering the holding portion from the height position of the delivery pin. The feature quantity recording unit further records, for each of the plurality of unit operations, a feature quantity of the position of the holding unit in the vertical direction as the position feature quantity. The feature quantity recording unit further records a feature quantity of a speed of the holding unit in the vertical direction as the speed feature quantity and a feature quantity of a torque of the lifting motor as the torque feature quantity in relation to the lowering operation.

9. A substrate processing method, characterized in that: The substrate processing method is performed by a substrate processing apparatus including a substrate conveying unit having a holding portion for holding a substrate and a motor for displacing the holding portion in a predetermined direction. The substrate processing method comprises: controlling the substrate transport unit to shift the holding portion to a handover position for handing over the substrate to a rotating holding portion by using the motor, wherein the rotating holding portion is capable of holding and rotating the substrate; a step of obtaining a maximum value of the torque of the motor during a period in which the holding portion is displaced to the handover position; and After the holding portion is shifted to the handover position, the position of the holding portion is adjusted by the motor based on the maximum value of the torque so as to reduce the offset between the center of the substrate held by the holding portion and the rotation center of the rotating holding portion.

10. The substrate processing method according to claim 9, wherein: In the step of adjusting the position of the holding portion using the motor, the position of the holding portion is adjusted using the motor with reference to correspondence information in which a relationship between the maximum value of the torque and the adjustment amount of the position of the holding portion is previously associated.

11. The substrate processing method according to claim 9 or 10, characterized in that: In the substrate processing method, the substrate transport unit is controlled to perform a plurality of unit operations, the plurality of unit operations including a first operation of shifting the holding portion to the handover position and a second operation of shifting the holding portion from the handover position. The substrate processing method further includes the steps of recording position characteristic quantities, velocity characteristic quantities and torque characteristic quantities, The step of recording the position characteristic quantity, the speed characteristic quantity, and the torque characteristic quantity includes: a step of recording, for each of the plurality of unit operations, a feature amount of the position of the holding portion in the prescribed direction as the position feature amount; and For each of the first operation and the second operation, a feature quantity of the speed of the holding portion in the predetermined direction is recorded as the speed feature quantity, and a feature quantity of the torque of the motor is recorded as the torque feature quantity.

12. The substrate processing method according to claim 11, wherein: In the step of recording the torque characteristic amount, for each of the first operation and the second operation, a maximum value and a minimum value of the torque of the motor are recorded as the torque characteristic amount.

13. The substrate processing method according to claim 11, wherein: In the step of recording the positional feature amount, for each of the first operation and the second operation, a displacement amount of the holding portion in the prescribed direction is recorded as the positional feature amount.

14. The substrate processing method according to claim 13, wherein: In the step of recording the positional feature, an average value of the position of the holding portion in the predetermined direction is recorded as the positional feature for the operation of stopping the holding portion in the predetermined direction among the plurality of unit operations.

15. The substrate processing method according to claim 11, wherein: In the step of recording the speed feature, for each of the first operation and the second operation, the maximum value or minimum value of the speed of the holding portion in the prescribed direction and the time required for the holding portion to shift in the prescribed direction are recorded as the speed feature.

16. The substrate processing method according to claim 11, wherein: The substrate transport unit further includes a lifting motor for moving the holding portion in the vertical direction. The substrate processing method further includes the following steps: after the first operation, controlling the lifting motor to lower the holding portion and place the substrate on a transfer pin provided around the rotating holding portion; The plurality of unit operations include a lowering operation, the lowering operation including: a step of lowering the holding portion to a height position of the delivery pin; and a step of further lowering the holding portion from the height position of the delivery pin. The step of recording the position characteristic quantity, the speed characteristic quantity, and the torque characteristic quantity includes: a step of further recording, for each of the plurality of unit operations, a feature amount of the position of the holding portion in the up-down direction as the position feature amount; and The step of further recording a characteristic amount of the speed of the holding portion in the up-down direction as the speed characteristic amount and further recording a characteristic amount of the torque of the lifting motor as the torque characteristic amount for the lowering operation.

17. A computer-readable storage medium, characterized in that: A program for causing the apparatus to execute the substrate processing method according to claim 9 or 10 is stored.

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