MEMS packaging structure, packaging method thereof and electronic equipment

Abstract

The invention provides an MEMS (Micro Electro Mechanical System) packaging structure, a packaging method thereof and electronic equipment, the MEMS packaging structure comprises a substrate, and a buried hole is formed in the substrate; the shell is arranged on one side of the substrate, and an accommodating cavity is defined by the shell and the substrate; the active chip module is arranged in the accommodating cavity and is electrically connected with the substrate; and the passive chip module is arranged in the buried hole and is electrically connected with the substrate. According to the MEMS packaging structure, the passive chip module is arranged in the buried hole of the substrate, and the passive chip module is electrically connected with the substrate, so that the overall size of the MEMS packaging structure is reduced, and the MEMS packaging structure can be more widely applied to small electronic equipment.

Description

Technical Field

[0001] The present application belongs to the field of packaging technology. Specifically, the present application relates to a MEMS packaging structure, a packaging method thereof, and an electronic device. Background Art

[0002] MEMS microphones are widely used in various electronic devices due to their stable performance. However, as electronic devices continue to move towards lighter, thinner, and smaller sizes, more stringent requirements are placed on the size of MEMS microphones.

[0003] In related technologies, conventional MEMS microphones integrate multiple chips on a substrate to achieve their functions. For example, the MEMS chip, ASIC chip and IPD chip are all placed on the front of the substrate, and a certain amount of space needs to be reserved between the chips, resulting in a larger overall structural size of the MEMS microphone, which limits the application of MEMS microphones in small electronic devices. Summary of the Invention

[0004] An object of the embodiments of the present application is to provide a new technical solution for a MEMS packaging structure and a packaging method thereof and an electronic device.

[0005] According to a first aspect of an embodiment of the present application, a MEMS packaging structure is provided, including:

[0006] a substrate, wherein a buried hole is provided in the substrate;

[0007] a housing, the housing being disposed on one side of the substrate and forming a receiving cavity with the substrate;

[0008] an active chip module, the active chip module being disposed in the accommodating cavity and electrically connected to the substrate;

[0009] A passive chip module is disposed in the buried via and electrically connected to the substrate.

[0010] Optionally, the passive chip module includes an IPD chip.

[0011] Optionally, the substrate includes a base and a wiring unit, and the wiring unit is provided on the base;

[0012] The passive chip module includes a chip body and a conductor, one end of the conductor is arranged on the chip body, and the other end of the conductor is arranged to be electrically connected to the wiring unit.

[0013] Optionally, the wiring unit includes a first wiring layer, a second wiring layer and an output terminal;

[0014] The conductor includes a first conductive column, a second conductive column and a third conductive column, the first conductive column is connected between the chip body and the first wiring layer, the second conductive column is connected between the chip body and the second wiring layer, and the third conductive column is connected between the chip body and the output end.

[0015] Optionally, the active chip module includes a MEMS chip and an ASIC chip, the side of the substrate facing the shell forms an assembly surface, the MEMS chip and the ASIC chip are arranged on the assembly surface at intervals and are electrically connected through connecting wires, and the ASIC chip is electrically connected to the substrate.

[0016] Optionally, in the thickness direction of the substrate, at least a portion of the passive chip module is opposite to the ASIC chip.

[0017] Optionally, a waterproof module is further included. A sound inlet hole is provided on the substrate. The MEMS chip is opposite to the sound inlet hole. The projection of the waterproof module on the substrate covers the sound inlet hole.

[0018] Optionally, a mounting groove is provided on the substrate, the mounting groove is communicated with the sound inlet hole, and the waterproof module is provided in the mounting groove.

[0019] According to a second aspect of an embodiment of the present application, a packaging method for a MEMS packaging structure is provided, the packaging method comprising:

[0020] forming a base material of a substrate on the passive chip module so that the base material wraps the passive chip module;

[0021] Mounting an active chip module on the substrate;

[0022] The housing is connected to the substrate to enclose a receiving cavity.

[0023] According to a third aspect of an embodiment of the present application, an electronic device is provided, which includes the MEMS packaging structure described in the first aspect.

[0024] One of the technical effects of this application is:

[0025] An embodiment of the present application provides a MEMS packaging structure comprising a substrate having a buried via disposed therein; a housing disposed on one side of the substrate and forming a housing cavity with the substrate; an active chip module disposed in the housing cavity and electrically connected to the substrate; and a passive chip module disposed in the buried via and electrically connected to the substrate. Placing the passive chip module in the buried via of the substrate and electrically connecting the passive chip module to the substrate reduces the overall size of the MEMS packaging structure, enabling its wider application in small electronic devices.

[0026] Other features and advantages of the present application will become apparent from the following detailed description of exemplary embodiments of the present application with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the application and, together with the description, serve to explain the principles of the application.

[0028] Figure 1 A schematic diagram of a MEMS packaging structure provided in one embodiment of the present application;

[0029] Figure 2 A schematic diagram of a MEMS packaging structure provided in another embodiment of the present application;

[0030] Figure 3 A schematic diagram of a passive chip module of a MEMS packaging structure provided in one embodiment of the present application.

[0031] Among them: 1. Substrate; 11. Buried hole; 12. Base; 13. Wiring unit; 131. First wiring layer; 132. Second wiring layer; 133. Output end; 14. Sound inlet; 15. Mounting slot; 2. Shell; 3. Active chip module; 31. MEMS chip; 32. ASIC chip; 33. Connecting wire; 34. Cover; 4. Passive chip module; 41. Chip body; 42. Conductor; 421. First conductive column; 422. Second conductive column; 423. Third conductive column; 5. Waterproof module. DETAILED DESCRIPTION

[0032] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present application.

[0033] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be understood as limiting the present application. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of this application.

[0034] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly refer to one or more of the features. Throughout the description of this application, unless otherwise specified, "plurality" means two or more. Furthermore, "and / or" in the specification and claims refers to at least one of the connected entities, and the character " / " generally indicates an "or" relationship between the connected entities.

[0035] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0036] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0037] It should be noted that like reference numerals and letters refer to like items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0038] In related technologies, conventional MEMS microphones and other MEMS packaging structures integrate multiple chips on a substrate to achieve their functions. For example, the MEMS chip, ASIC chip and IPD chip are all placed on the front of the substrate, and a certain amount of space needs to be reserved between the chips, resulting in a larger overall structural size of the MEMS microphone, which limits the application of MEMS microphones in small electronic devices.

[0039] The MEMS (Micro-Electro-Mechanical System) packaging structure provided in the embodiment of the present application sets the passive chip module in the buried hole of the substrate, and the passive chip module is electrically connected to the substrate, so that the overall size of MEMS packaging structures such as MEMS microphones is reduced, and the MEMS packaging structure can be more widely used in small electronic devices.

[0040] Reference Figure 1 , an embodiment of the present application provides a MEMS packaging structure, the MEMS packaging structure comprising:

[0041] A substrate 1, wherein a buried hole 11 is provided in the substrate 1;

[0042] The housing 2 is disposed on one side of the substrate 1 and forms a receiving cavity with the substrate 1;

[0043] The active chip module 3 is arranged on one side of the substrate 1 in the accommodating cavity and is electrically connected to the substrate 1;

[0044] The passive chip module 4 is disposed in the buried via 11 and electrically connected to the substrate 1 .

[0045] In the above embodiment, the substrate 1 serves as a support and signal transmission component of the entire MEMS packaging structure, and can provide a mounting platform for other modules, ensuring that each module can be stably arranged and maintaining the overall structural stability of the packaging structure.

[0046] See also Figure 1 The buried hole 11 in the substrate 1 provides an installation position for the passive chip module 4. The passive chip module 4 is embedded in the interior of the substrate 1 through the buried hole design, which effectively utilizes the internal space of the substrate 1 and can reduce the overall size of the packaging structure.

[0047] The shell 2 is arranged on one side of the substrate 1 and forms a accommodating cavity with the substrate 1. The shell 2 can be a metal shell. The shell 2 provides physical protection for the active chip module 3 and the passive chip module 4 inside the accommodating cavity, preventing external environmental factors (such as dust, moisture, mechanical collision, etc.) from damaging the chip, ensuring that the chip works in a stable and safe environment, thereby improving the reliability of the packaging structure.

[0048] The active chip module 3 is arranged on the substrate 1 and electrically connected to the substrate 1. The active chip module 3 is an active component that realizes the functions of the MEMS packaging structure, such as being responsible for signal sensing, transmission, conversion and processing, thereby ensuring effective signal transmission.

[0049] See also Figure 1The passive chip module 4 is arranged in the buried via 11 and electrically connected to the substrate 1. The passive chip module 4 works in conjunction with the active chip module 3 through the layout of the buried via. While meeting the functional requirements, by changing the installation position of the passive chip module 4, the space occupied by the chip on the front side of the substrate is reduced, and the overall size of the MEMS packaging structure is reduced, so that the packaging structure can better adapt to the application requirements of small electronic devices.

[0050] It is worth noting that the buried via 11 in the substrate 1 can be formed by the substrate 1 wrapping around the passive chip module 4 during molding, thereby directly forming the buried via 11 in the substrate 1 to ensure the stability of the passive chip module 4 in the substrate 1 .

[0051] In one embodiment, see Figure 1 , the passive chip module 4 includes an IPD chip.

[0052] In the above embodiment, the IPD chip is placed inside the substrate 1 and is electrically connected to the wiring in the substrate 1 through its own copper pillars, which can realize passive functions such as RF (Radio Frequency) signal filtering, matching and coupling; and the IPD chip cooperates with the active chip module 3 to improve the performance and reliability of the entire MEMS packaging structure.

[0053] For example, during signal transmission, the IPD chip can filter the signal, remove noise and interference signals, and make the signal purer; in addition, the IPD chip can also achieve impedance matching, improve signal transmission efficiency, and reduce signal reflection and loss.

[0054] In other embodiments, the passive chip module 4 may include other chips such as filter chips, protection chips and radio frequency chips. The passive chip module 4 is set in the buried hole 11 in the substrate 1, which can reduce the size of the MEMS packaging structure while ensuring the performance of the MEMS packaging structure.

[0055] In some embodiments, see Figure 1 and Figure 3 , the substrate 1 includes a base 12 and a wiring unit 13, and the wiring unit 13 is provided on the base 12;

[0056] The passive chip module 4 includes a chip body 41 and a conductor 42 . One end of the conductor 42 is disposed on the chip body 41 , and the other end of the conductor 42 is electrically connected to the wiring unit 13 .

[0057] In the above embodiment, base 12 serves as the insulating and supporting foundation for the entire substrate 1, providing stable support for wiring unit 13 and the subsequently installed active chip module 3, passive chip module 4, etc. Furthermore, during the MEMS packaging process and subsequent practical applications, base 12 can withstand certain external forces, preventing deformation or damage to substrate 1, thereby ensuring the normal operation of the modules installed thereon.

[0058] See also Figure 1 Wiring units 13 are distributed within base 12 of substrate 1 and enable electrical connections between various modules, such as active chip module 3 and passive chip module 4. By designing the wiring pattern of wiring units 13, wiring units 13 can accurately transmit signals generated by the chips to other modules that need them. They can also transmit control signals to the corresponding chips, enabling the various components to work together to achieve the functions set by the package structure.

[0059] In addition, by properly designing the width, spacing, and length of the wiring in the wiring unit 13, the impedance during signal transmission can be reduced, signal attenuation and reflection can be reduced, and the signal transmission quality and speed can be improved.

[0060] See also Figure 3 The chip body 41 of the passive chip module 4 can integrate passive components such as resistors, capacitors, and inductors. Through the combination and interaction of these passive components, passive functions such as filtering, matching, and coupling can be achieved. For example, during signal processing, the chip body 41 can filter the input signal, remove unnecessary frequency components, and improve signal quality.

[0061] See also Figure 1 and Figure 3 One end of the conductor 42 is disposed on the chip body 41, and the other end is electrically connected to the wiring unit 13. The conductor 42 provides a reliable electrical connection between the chip body 41 and the wiring unit 13. Signals generated by the chip body 41 can be transmitted to the wiring unit 13 through the conductor 42, and then transmitted externally. At the same time, signals transmitted by the wiring unit 13 can also be accurately transmitted to the chip body 41 through the conductor 42, achieving signal interaction and functional coordination.

[0062] In one embodiment, see Figure 1 The conductors 42 on the chip body 41 can be connected downward to the wiring unit 13, for example, by welding or crimping to achieve a secure electrical connection with the wiring unit 13, thereby improving the stability and reliability of the connection. When the conductors 42 are connected downward, the signal transmission path through the conductors 42 is primarily within the substrate 1, reducing the impact of external interference signals on signal transmission.

[0063] In another embodiment, see Figure 2 The conductor 42 on the chip body 41 can be connected to the wiring unit 13 upward. The conductor 42 facing upward can make the signal transmission path more direct and shorter, reduce the interference and loss that may be caused when the signal passes through other modules or structures during transmission, and improve the quality and speed of signal transmission.

[0064] In some embodiments, see Figure 1 , the wiring unit 13 includes a first wiring layer 131, a second wiring layer 132 and an output terminal 133;

[0065] The conductor 42 includes a first conductive column 421, a second conductive column 422 and a third conductive column 423. The first conductive column 421 is connected between the chip body 41 and the first wiring layer 131, the second conductive column 422 is connected between the chip body 41 and the second wiring layer 132, and the third conductive column 423 is connected between the chip body 41 and the output end 133.

[0066] In the above embodiment, the wiring unit 13 may include multiple wiring layers spaced apart from each other. For example, the first wiring layer 131 and the second wiring layer 132 in the wiring unit 13 are spaced apart from each other, and the second wiring layer 132 cooperates with the first wiring layer 131 to optimize the layout of the entire wiring unit 13. By assigning different types of signals to different wiring layers, the crossing and overlapping of wiring can be reduced, the complexity of wiring can be reduced, and the reliability and maintainability of wiring can be improved. The output terminal 133 of the wiring unit 13 is an important interface for the wiring unit 13 to interact with the outside of the packaging structure or other functional modules for signal exchange. The signal processed by the chip body 41 is output to the external device or other module that needs the signal through the output terminal 133, thereby realizing the functional output of the packaging structure.

[0067] See also Figure 1 and Figure 3 The first wiring layer 131 is located on the surface of the substrate 1, and the active chip module 3 can be connected to the first wiring layer 131; the first conductive column 421 serves as a connecting bridge between the chip body 41 and the first wiring layer 131, realizing electrical conduction between the two, so that the signal generated by the active chip module 3 can be transmitted to the chip body 41 through the first wiring layer 131; the second conductive column 422 connects the chip body 41 and the second wiring layer 132, expanding the grounding channel of the chip body 41; the third conductive column 423 connects the chip body 41 and the output end 133, realizing direct signal output between the chip body 41 and the outside of the packaging structure, so that the signal processed by the chip body 41 can be quickly and accurately output to external devices or other functional modules, meeting the functional output requirements of the packaging structure.

[0068] In one embodiment, the conductor 42 is a copper pillar or a combination of a copper pillar and a solder ball carried by the chip body 41. The copper pillar can be compared to a metal blind via. By grinding the copper pillar to the appropriate height, the conductor 42 can be connected to the wiring layer. Because the passive chip module 4 has its own copper pillar, unlike the buried via installation method of the ASIC chip, the additional RDL (redistribution layer) processing required for the buried via installation of the ASIC chip is avoided, thus simplifying the overall MEMS packaging structure manufacturing process.

[0069] In some embodiments, see Figure 1 and Figure 2 The active chip module 3 includes a MEMS chip 31 and an ASIC chip 32. The side of the substrate 1 facing the shell 2 forms an assembly surface. The MEMS chip 31 and the ASIC chip 32 are arranged at intervals on the assembly surface and are electrically connected by connecting wires 33 such as gold wires. The ASIC chip 32 is electrically connected to the substrate 1.

[0070] In the above embodiment, the MEMS chip 31 and ASIC chip 32 are each connected to the substrate 1 via respective adhesive bonds. The MEMS chip implements sound pickup within the MEMS package structure. The ASIC chip 32 is electrically connected to the substrate 1 via another connecting wire 33. The ASIC chip 32 is covered by a cover 34, enabling the ASIC chip to process electrical signals. Simultaneously, the IPD chip is connected to the wiring layer within the substrate. Furthermore, the electrical connections between the MEMS chip, ASIC chip, and IPD chip are achieved through the interaction of gold wires with the substrate 1.

[0071] See also Figure 1 The MEMS chip 31 converts mechanical motion into electrical signals, enabling the MEMS package to sense external sound signals and pick up sound. The ASIC chip 32 amplifies, filters, and digitizes the raw signals collected by the MEMS chip 31, performing control operations based on system requirements. The ASIC chip 32 is electrically connected to the substrate 1, enabling it to electrically connect to the wiring unit 13 on the substrate 1, thus realizing the system-level functions of the entire package structure.

[0072] Both the MEMS chip 31 and the ASIC chip 32 generate heat during operation. The spacing setting can reduce the thermal coupling between the two, avoid the high temperature generated by the high power consumption of the ASIC chip 32 affecting the sensing accuracy of the MEMS chip 31, ensure the working environment temperature of the MEMS chip 31 is stable, and thus improve the accuracy of the sensing signal.

[0073] In some embodiments, at least a portion of the passive chip module 4 is opposite to the ASIC chip 32 in the thickness direction of the substrate 1 .

[0074] In the above embodiment, the thickness direction of the substrate 1 can be Figure 1 In the vertical direction of the passive chip module 4, all or part of the passive chip module 4 is opposite to the ASIC chip 32. On the one hand, the signal transmission path between the passive chip module 4 and the ASIC chip 32 is shortened, reducing the delay and loss of signal transmission and improving the efficiency of signal interaction; on the other hand, the width direction of the MEMS packaging structure in the substrate 1 (for example, Figure 1 The size in the left and right directions (in the middle) realizes the miniaturization of the MEMS packaging structure.

[0075] In other embodiments, the passive chip module 4 and the ASIC chip 32 may be staggered in the thickness direction of the substrate 1 to avoid signal interference between them.

[0076] In some embodiments, see Figure 1 The MEMS packaging structure further includes a waterproof module 5 . A sound inlet 14 is provided on the substrate 1 . The MEMS chip 31 is opposite to the sound inlet 14 . The projection of the waterproof module 5 on the substrate 1 covers the sound inlet 14 .

[0077] In the above embodiment, the sound inlet 14 is a channel for sound waves to enter the MEMS packaging structure, which enables the MEMS chip 31 to sense external sound signals, ensures the connectivity between the MEMS chip 31 and the external acoustic environment, and enables the MEMS chip 31 to normally perform its acoustic detection or collection function.

[0078] See also Figure 1 The MEMS chip 31 is arranged relative to the sound inlet 14, so that external sound waves can directly and efficiently reach the sensitive area of ​​the MEMS chip 31, reducing the path and interference of the sound waves during propagation, ensuring that the MEMS chip 31 can accurately and timely perceive external sound signals, and improving the efficiency and accuracy of sound wave collection.

[0079] At the same time, the projection of waterproof module 5 on substrate 1 covers sound inlet 14, effectively preventing the intrusion of impurities such as moisture while ensuring that sound waves can enter the package normally. Waterproof module 5 can be made of a waterproof and breathable membrane. The waterproof and breathable membrane allows sound waves to pass through while preventing liquid or gaseous moisture such as water droplets and water vapor from entering sound inlet 14, thereby protecting MEMS chip 31.

[0080] In some embodiments, see Figure 1 A mounting groove 15 is provided on the substrate 1 , the mounting groove 15 is communicated with the sound inlet 14 , and the waterproof module 5 is provided in the mounting groove 15 .

[0081] In the above embodiment, the waterproof module 5 can be adhered to the installation groove 15 by hot-melt adhesive tape and hot-pressed, and the waterproof module 5 can be dotted or painted with sealant around to improve the reliability of waterproofing.

[0082] See also Figure 1 The waterproof module 5 is positioned within the mounting groove 15, precisely covering the sound inlet 14 and providing effective waterproof protection. The sidewalls of the mounting groove 15 act as a restraint on the waterproof module 5, preventing moisture from seeping through the edges and gaps, thereby improving the reliability and stability of the waterproofing effect. Furthermore, positioning the waterproof module 5 within the mounting groove 15 makes the surface of the substrate 1 smoother and more aesthetically pleasing, while reducing the thickness of the MEMS package structure.

[0083] The present invention also provides a method for packaging a MEMS packaging structure, the method comprising:

[0084] S101, forming a base material of a substrate on the passive chip module so that the base material wraps the passive chip module;

[0085] By wrapping the passive chip module with a molded matrix material, physical protection is provided for the passive chip module. During the subsequent packaging process and product use, this can effectively prevent damage to the passive chip module from external mechanical shocks, vibrations, etc., thereby improving the reliability and service life of the passive chip module. It also avoids the passive chip module occupying the internal space of the MEMS packaging structure, thus achieving miniaturization of the MEMS packaging structure.

[0086] S102, mounting an active chip module on a substrate;

[0087] Active chip modules typically contain integrated circuit chips with specific functions, such as microprocessors and sensor signal processing chips. Mounting them on a substrate and combining them with passive chip modules enables the integration of multiple functions, giving the MEMS package structure more powerful performance and a wider range of applications.

[0088] S103, connecting the shell to the substrate to form a receiving cavity.

[0089] In the above-described embodiment, the cavity formed by the connection between the housing and the substrate provides a relatively closed environment for the entire MEMS package structure, isolating the chip and other components within from the external environment. The housing can be made of a conductive material such as metal, which has a certain degree of electromagnetic shielding performance. This can prevent external electromagnetic radiation from interfering with the chip within the package. It can also reduce the interference of electromagnetic radiation generated by the chip within the package on external devices, thereby improving the electromagnetic compatibility of the entire MEMS package structure.

[0090] An embodiment of the present application further provides an electronic device, which includes the above-mentioned MEMS packaging structure.

[0091] In the MEMS packaging structure of the electronic device, a passive chip module is arranged in a buried hole of a substrate, and the passive chip module is electrically connected to the substrate, so that the overall size of the MEMS packaging structure such as a MEMS microphone is reduced, and the MEMS packaging structure can be more widely used in small electronic devices.

[0092] Although some specific embodiments of the present application have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present application. It should be understood by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the present application. The scope of the present application is defined by the appended claims.

Claims

1. A MEMS packaging structure, characterized in that: include: A substrate (1), wherein a buried hole (11) is provided in the substrate (1); a housing (2), the housing (2) being arranged on one side of the substrate (1) and forming a receiving cavity with the substrate (1); an active chip module (3), the active chip module (3) being arranged in the accommodating cavity and electrically connected to the substrate (1); A passive chip module (4) is provided in the buried hole (11) and is electrically connected to the substrate (1).

2. The MEMS packaging structure according to claim 1, wherein: The passive chip module (4) includes an IPD chip.

3. The MEMS packaging structure according to claim 1, wherein: The substrate (1) comprises a base (12) and a wiring unit (13), wherein the wiring unit (13) is arranged on the base (12); The passive chip module (4) comprises a chip body (41) and a conductor (42), one end of the conductor (42) is arranged on the chip body (41), and the other end of the conductor (42) is arranged to be electrically connected to the wiring unit (13).

4. The MEMS packaging structure according to claim 3, characterized in that: The wiring unit (13) includes a first wiring layer (131), a second wiring layer (132) and an output terminal (133); The conductor (42) includes a first conductive column (421), a second conductive column (422) and a third conductive column (423), wherein the first conductive column (421) is connected between the chip body (41) and the first wiring layer (131), the second conductive column (422) is connected between the chip body (41) and the second wiring layer (132), and the third conductive column (423) is connected between the chip body (41) and the output end (133).

5. The MEMS packaging structure according to claim 1, wherein: The active chip module (3) comprises a MEMS chip (31) and an ASIC chip (32); a side of the substrate (1) facing the housing (2) forms an assembly surface; the MEMS chip (31) and the ASIC chip (32) are spaced apart on the assembly surface and electrically connected via a connecting wire (33); and the ASIC chip (32) is electrically connected to the substrate (1).

6. The MEMS packaging structure according to claim 5, characterized in that: In the thickness direction of the substrate (1), at least a portion of the passive chip module (4) is opposite to the ASIC chip (32).

7. The MEMS packaging structure according to claim 5, characterized in that: It also includes a waterproof module (5), a sound inlet hole (14) is provided on the substrate (1), the MEMS chip (31) is opposite to the sound inlet hole (14), and the projection of the waterproof module (5) on the substrate (1) covers the sound inlet hole (14).

8. The MEMS packaging structure according to claim 7, characterized in that: The base plate (1) is provided with a mounting groove (15), the mounting groove (15) is communicated with the sound inlet hole (14), and the waterproof module (5) is arranged in the mounting groove (15).

9. A packaging method for a MEMS packaging structure, characterized in that: include: forming a base material of a substrate on the passive chip module so that the base material wraps the passive chip module; Mounting an active chip module on the substrate; The housing is connected to the substrate to enclose a receiving cavity.

10. An electronic device, characterized in that: The MEMS packaging structure comprises the MEMS packaging structure according to any one of claims 1 to 8.

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