High-speed optical assembly automatic assembling system for optical module

Abstract

The invention discloses a high-speed optical component automatic assembling system for an optical module, which comprises an irradiation curing unit, a floating pressing plate, a first positioning plate and a second positioning plate are sequentially arranged below the irradiation curing unit, and a first profiling groove for limiting an optical filter of a wave component is formed in the first positioning plate; the first positioning plate is provided with a first profiling groove, the second positioning plate is provided with a wave component base used for fixing a wave component and a second profiling groove of a steering prism, the floating pressing plate is provided with a glass pressing block, the glass pressing block, the first profiling groove and the second profiling groove correspond in arrangement position, the glass pressing block loads an optical filter located in the first profiling groove under displacement of the floating pressing plate, and the glass pressing block loads an optical filter located in the second profiling groove under displacement of the floating pressing plate. And the optical filter and the wave component base positioned in the second profiling groove are glued. The invention not only has the advantages of miniaturization and convenience in assembly, but also can ensure that the optical filters on all the wavelength division components are glued on the same plane, thereby ensuring the consistency of batch production.

Description

Technical Field

[0001] The present invention relates to the technical field of optical modules, and in particular to a high-speed optical component automatic assembly system for optical modules. Background Art

[0002] The rapid development and large-scale application of emerging businesses such as cloud computing, big data, and artificial intelligence have led to an increasing demand for computing power, prompting the construction of a large number of data centers and supercomputing centers. This has also driven the continuous expansion of the high-speed optical module market. Correspondingly, the demand for various optical devices and components used in high-speed optical modules is also growing.

[0003] As a core component in high-speed optical modules, demand for wavelength division multiplexers (WDMs) continues to grow. WDMs typically include key components such as a turning prism, a WDM module base, and optical filters. Traditionally, the WDM module base and turning prism are bonded together first, followed by the individual filters.

[0004] The process of pasting filters in the existing technology has the following defects: 1. The existing technology mainly uses a clamp and a probe to paste the filters one by one. Since this method of pasting filters can only perform glue placement, positioning and curing on a single thin film filter of a wavelength division component at a time, it has the defects of cumbersome operation and low production efficiency; 2. When the existing technology mainly uses a clamp and a probe to paste the filters one by one, due to the pressure of the probe or clamp on the top, ultraviolet curing can only be irradiated from the side, resulting in uneven energy distribution on the glue, and there is a risk of curing failure.

[0005] Therefore, there is an urgent need for an improved automatic assembly system for high-speed optical components for optical modules to improve assembly efficiency and ensure glue curing quality, thereby meeting the growing market demand for high-speed optical modules. Summary of the Invention

[0006] The technical problem to be solved by the present invention is to provide a high-speed optical component automatic assembly system for optical modules in response to the technical defects existing in the prior art. The system not only has the advantages of miniaturization and easy assembly, but also can ensure that the filters on all wavelength division components are glued on the same plane, thereby ensuring the consistency of mass production.

[0007] The technical solution adopted by the present invention to solve its technical problems is as follows: the present invention discloses a high-speed optical component automatic assembly system for optical modules, including an irradiation and curing unit, below which a floating pressure plate, a first positioning plate, and a second positioning plate are sequentially arranged. The first positioning plate is provided with a first profiling groove for limiting the position of a filter of a wavelength division component, and the second positioning plate is provided with a second profiling groove for fixing a wavelength division component base and a turning prism of the wavelength division component. The floating pressure plate is provided with a glass pressure block, and the glass pressure block, the first profiling groove, and the second profiling groove are arranged in corresponding positions. The glass pressure block loads the filter located in the first profiling groove under the displacement of the floating pressure plate, thereby achieving gluing of the filter and the wavelength division component base located in the second profiling groove.

[0008] In a preferred embodiment of the present invention, it includes a hollow base, the top of which is fixedly connected to the second positioning plate, the first positioning plate is fixedly connected above the second positioning plate, and the base is provided with a locking push rod arranged vertically relative to the second contour groove, and the locking push rod and the second contour groove are arranged in a one-to-one correspondence.

[0009] In a preferred embodiment of the present invention, a liftable driving unit is provided on the hollow base, and the driving unit is connected to the floating pressure plate.

[0010] In a preferred embodiment of the present invention, the driving unit includes a vertical guide groove arranged on the hollow base and a slider slidably connected to the vertical guide groove, the floating pressure plate is provided at the end of the slider, a spring is provided between the slider and the second positioning plate, and a pin assembly for driving its displacement is provided under the slider.

[0011] In a preferred embodiment of the present invention, the ejector assembly includes a mounting base, on which a micrometer, a seesaw and a guide hole are provided. The seesaw is rotatably connected to the mounting base via a pin, and an ejector is connected to the guide hole. One end of the seesaw contacts the micrometer, and the other end contacts the ejector.

[0012] In a preferred embodiment of the present invention, the slider is a U-shaped structure, a spring positioning block is connected to the slider, and a spring fixing groove is provided on the spring positioning block.

[0013] In a preferred embodiment of the present invention, both the first contoured groove and the second positioning plate are provided with a slider avoidance groove.

[0014] In a preferred embodiment of the present invention, each second contoured groove corresponds to at least one first contoured groove.

[0015] In a preferred embodiment of the present invention, the radiation curing unit includes a positioning base plate, the positioning base plate is connected to a positioning side plate, the positioning side plate is connected to a positioning cross bar that can be displaced up and down, and the positioning cross bar is provided with an irradiation member.

[0016] In a preferred embodiment of the present invention, the irradiation member is a UV curing lamp.

[0017] The present invention achieves the following beneficial effects: The disclosed high-speed optical component automated assembly system for optical modules, through its unique structural design, effectively addresses the existing issues of low WDM assembly efficiency and unstable glue curing quality. The system comprises an irradiation and curing unit, beneath which are positioned a floating pressure plate, a first positioning plate, and a second positioning plate. Through the corresponding arrangement of a glass pressure block, a first contoured groove, and a second contoured groove, the system achieves synchronized and precise gluing of the turning prism to the WDM assembly base. This significantly improves WDM assembly efficiency while ensuring glue curing quality and product consistency, providing strong support for the large-scale production of high-speed optical modules.

[0018] The present invention firstly realizes uniform pressure on the turning prism by uniformly pressing and fixing the glued filter discs with a transparent glass pressing block, thereby ensuring that the filters on all wavelength division components are on the same plane and ensuring the consistency of batch production.

[0019] Secondly, the transparent glass pressing block of the present invention does not cause any obstruction during UV curing, allowing UV light to directly irradiate the glue, making the curing energy more uniform, increasing the consistency of the product, and solving the problem of uneven energy distribution caused by side irradiation in the prior art.

[0020] Furthermore, the present invention achieves mass assembly of WDM components through the coordinated operation of the hollow base, locking push rod, and drive unit. The vertical guide groove, slider, and spring design in the drive unit ensure precise pressure control; the ejector assembly provides fine-tuning capabilities, further improving assembly precision. Furthermore, the design of multiple first contoured grooves corresponding to one second contoured groove allows for simultaneous assembly of multiple WDM components, significantly improving production efficiency.

[0021] Finally, the miniaturized design of the present invention's overall fixture allows it to be handheld and operated under a microscope, greatly improving the convenience and flexibility of assembly and significantly increasing production efficiency. This feature offers a significant advantage over existing methods that require the entire device to be fixed to a seismic isolation platform. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The present invention will be further described below with reference to the accompanying drawings and embodiments, in which: Figure 1It is a structural schematic diagram of the automatic assembly system of high-speed optical components for optical modules of the present invention; Figure 2 is a cross-sectional view of a high-speed optical component automatic assembly system for optical modules of the present invention; Figure 3 2. It is a structural schematic diagram of the second positioning plate of the automatic assembly system of high-speed optical components for optical modules of the present invention; Figure 4 This is a schematic structural diagram of a first positioning plate of a high-speed optical component automatic assembly system for optical modules of the present invention; Figure 5 1 is a top view of a first positioning plate of a high-speed optical component automatic assembly system for optical modules of the present invention; Figure 6 2. It is a schematic structural diagram of a driving unit of a high-speed optical component automatic assembly system for optical modules of the present invention; Figure 7 2. It is a schematic structural diagram of an irradiation curing unit of a high-speed optical component automatic assembly system for optical modules of the present invention; Figure 8 It is a structural schematic diagram of the wavelength division component of the high-speed optical component automatic assembly system for optical modules of the present invention. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0024] Example 1 Reference Figures 1 to 8 This embodiment provides a high-speed automated optical assembly system for optical modules, which is used to perform the gluing process for the optical filter 16-3 on the wavelength division module 16 and the wavelength division module base 16-2. The system primarily includes key components such as an irradiation and curing unit, a floating pressure plate 5, a first positioning plate 17, and a second positioning plate 8. Through precise mechanical design and coordinated operation, it solves the problems of low wavelength division module assembly efficiency and unstable glue curing quality in the prior art.

[0025] The overall structure of this batch assembly device includes an irradiation and curing unit positioned at the top, with a floating pressure plate 5, a first positioning plate 17, and a second positioning plate 8 positioned below it. The first positioning plate 17 is provided with a first contoured groove for retaining the wavelength division component's filter 16-3. This contoured groove is precisely designed based on the filter's shape, ensuring accurate positioning of the filter. The second positioning plate 8 is provided with a second contoured groove for securing the wavelength division component's base 16-2 and steering prism 16-1. This contoured groove precisely matches the shape of the wavelength division component base and steering prism, ensuring that the component does not shift during assembly. A glass block 6 is mounted on the floating pressure plate 5. This glass block is made of a transparent material with excellent optical transparency. The arrangement positions of the glass block 6, the first profiling groove and the second profiling groove correspond to each other, ensuring that the glass block 6 can accurately load the filter 16-3 located in the first profiling groove under the displacement of the floating pressure plate 5, thereby achieving precise bonding between the filter 16-3 and the wavelength division component base 16-2 located in the second profiling groove.

[0026] The device also includes a hollow base 10, with a second positioning plate 8 fixed to its top end. A first positioning plate 17 is fixed above the second positioning plate 8. Hollow base 10 is provided with multiple guide slots 15, each arranged perpendicularly relative to the second contoured slot to ensure precise locking. Each guide slot 15 is equipped with a locking push rod 7, which corresponds to the second contoured slot. This design ensures that each WDM module base is securely locked within the second contoured slot, preventing displacement during assembly.

[0027] The drive unit, a core component of this device, is mounted on a hollow base 10, capable of lifting and lowering, and connected to the floating pressure plate 5. The drive unit comprises a vertical guide slot mounted on the hollow base 10 and a slider 9 that slides within the slot. The floating pressure plate 5 is mounted at the end of the slider 9, with a spring 21 positioned between the slider 9 and the second positioning plate 8. This design allows for flexible vertical movement of the floating pressure plate 5, while maintaining appropriate pressure through the spring 21. Below the slider 9, a pin assembly is located to drive its movement, enabling precise control of the floating pressure plate 5.

[0028] The ejector assembly includes a mounting base 14, which is connected to the hollow base 10 via a mounting side plate 18, forming a stable support structure. A micrometer 11, a rocker 12, and a guide hole are mounted on the mounting base 14 via a connecting plate 13. The rocker 12 is pivotally connected to the mounting base 14 via a pin, and an ejector 19 is connected to the guide hole. One end of the rocker 12 contacts the micrometer 11, and the other end contacts the ejector 19. This lever mechanism converts minute rotations of the micrometer 11 into precise displacements of the ejector 19, thereby achieving precise control of the floating pressure plate 5.

[0029] The slider 9 adopts a U-shaped design, which provides excellent stability and guidance. A spring positioning block 20 is connected to the slider 9. This spring positioning block 20 is provided with a spring retaining groove to secure the spring 21 and prevent it from deflecting during compression and release. Both the first contoured groove and the second positioning plate 8 are provided with a clearance groove for the slider 9. This design ensures that the slider 9 does not interfere with other components during movement.

[0030] An important feature of the device is that each second profiled groove corresponds to at least one first profiled groove. This one-to-many design enables the device to realize batch assembly of wavelength division components, greatly improving production efficiency.

[0031] The radiation curing unit is another core component of the device. It includes a positioning base plate 4, to which is connected a positioning side plate 3. This side plate 3 is connected to a vertically movable positioning crossbar 2, on which a UV curing lamp 1 is mounted. The positioning side plate 3 is graduated to adjust the position of the positioning crossbar 2, thereby adjusting the distance between the UV curing lamp 1 and the assembly table, and thus adjusting the UV light power. This design allows the UV curing process to be precisely adjusted according to different glue types and curing requirements, ensuring consistent and stable curing results.

[0032] The device is used as follows: First, rotate micrometer 11 to depress rocker 12. Rocker 12 lifts ejector pin 19, which in turn lifts slider 9. Glass block 6 and floating plate 5 are bonded together and secured to slider 9. As slider 9 rises, it clears space for the wavelength splitter assembly. Simultaneously, slider 9 presses upward against the spring retaining slot, compressing the two springs 21 therein. This allows the spring retaining slot and ejector pin 19 to secure slider 9, creating a stable position for subsequent assembly.

[0033] Example 2 This embodiment provides a specific workflow and application method for a high-speed optical component automatic assembly system for optical modules. Based on Example 1, this device focuses on a detailed description of its actual working process and the synergistic effects of various components, as well as the application effects in actual production.

[0034] In actual use, the operator must first prepare the device and its associated components. Place the device on a stable work surface, ensuring its levelness and stability. Rotate micrometer 11 to press down on rocker 12. Through the lever mechanism, rocker 12 lifts ejector pin 19, which in turn lifts slider 9. Because glass pressure block 6 and floating pressure plate 5 are bonded to slider 9, as slider 9 rises, the entire superstructure rises, creating ample clearance for the placement of the wavelength division components.

[0035] Simultaneously, as the slider 9 moves upward, it presses against the spring retaining groove, compressing the two springs 21 therein. These compressed springs 21, together with the ejector pin 19, securely hold the slider 9 in its raised position, providing a stable working environment for subsequent delicate operations. This design cleverly utilizes mechanical principles, avoids complex electrical control systems, and makes the device simpler and more reliable.

[0036] After preparations are complete, the operator carefully places the WDM module base 16-2, with the steering prism 16-1 already attached, into the second contoured groove of the second positioning plate 8. Because the shape of the second contoured groove precisely matches the WDM module base 16-2 and the steering prism 16-1, the assembly is accurately positioned. Once placed, the locking push rod 7 is rotated to securely fasten the WDM module base 16-2 within the second contoured groove, preventing displacement during subsequent operations.

[0037] Next, the operator dispenses glue according to the spacing of the holes on the first positioning plate 17. This glue dispensing operation requires precise control of the amount and placement of the glue to ensure a good bond. After the glue is dispensed, the filters 16-3 are placed sequentially into the first contoured slots of the first positioning plate 17 in order of wavelength. This wavelength-ordered placement ensures that the final assembled wavelength division component functions properly and achieves the desired wavelength separation effect.

[0038] After the filters are placed on both sides of the wavelength division assembly, the operator rotates micrometer 11 to lower rocker 12. As rocker 12 descends, the compressed spring 21 releases its force, pushing slider 9 and ejector pin 19 downward. This process continues until the glass block 6 and floating pressure plate 5 fixed to slider 9 press down on the filter surface.

[0039] The smooth surface design of the glass clamp 6 is a key feature of this device. When pressed into place, it evenly compresses the filters 16-3 on both sides of the WDM assembly to the same plane, ensuring uniform flatness and consistent adhesive thickness across all filters. This consistency is crucial to the optical performance of the WDM assembly and directly impacts the quality and reliability of the final product. In this state, the spring 21 exerts a continuous force, allowing the glass clamp 6 to firmly press the filters 16-3 against the WDM assembly base 16-2, creating a stable pressure that creates ideal conditions for the adhesive to cure.

[0040] After the components are secured on the assembly table, the next step is UV curing. The operator uses a slide to precisely position the entire assembly table onto the UV curing table. The UV curing table's positioning base plate (4) features guide rails that align perfectly with the assembly table's base, ensuring the component assembly table remains in the same position each time it is placed on the curing table. This is crucial for consistency in mass production.

[0041] The scale design on the positioning side plate 3 allows the operator to precisely adjust the position of the positioning crossbar 2, thereby adjusting the distance between the UV curing lamp 1 and the assembly table. This adjustability allows for flexible adjustment of the UV light power to optimize the curing effect according to different types of glue and curing requirements.

[0042] Another significant advantage of this device is the transparent glass block 6. This design allows the UV curing lamp 1 to evenly illuminate the glue directly from above. UV light passes through the transparent glass block 6 and directly impinges on the glue, ensuring that all filters on the wavelength division component receive consistent irradiation power, greatly improving curing consistency. This offers significant advantages over traditional methods that rely solely on side illumination, effectively resolving curing quality issues caused by uneven energy distribution.

[0043] After a period of UV exposure, the glue will fully cure, firmly bonding filter 16-3 to WDM assembly base 16-2. At this point, the operator can rotate micrometer 11, lift glass clamp 6 again, unlock locking rod 7, and carefully remove the assembled WDM assembly. Because this device can process multiple WDM assemblies simultaneously, it significantly improves production efficiency, making it an ideal tool for mass production.

[0044] The device's overall design is compact and lightweight, making it easy to hold and operate. It allows for precise assembly work under a microscope, greatly improving operational flexibility and convenience. Furthermore, the use of mechanical transmission principles eliminates the need for complex electrical control systems, reducing equipment complexity and failure rates while improving production reliability and stability.

[0045] It should be understood that the size of the serial numbers of the steps in the above embodiments does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0046] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all such improvements and changes should fall within the scope of protection of the appended claims of the present invention.

Claims

1. A high-speed optical component automatic assembly system for optical modules, characterized in that: The invention comprises an irradiation and curing unit, below which are sequentially provided a floating pressure plate, a first positioning plate, and a second positioning plate. The first positioning plate is provided with a first profiling groove for limiting the position of the filter of the wavelength division component, and the second positioning plate is provided with a second profiling groove for fixing the wavelength division component base and the turning prism of the wavelength division component. The floating pressure plate is provided with a glass pressing block. The glass pressing block, the first profiling groove, and the second profiling groove are arranged in corresponding positions. The glass pressing block loads the filter located in the first profiling groove under the displacement of the floating pressure plate, thereby achieving gluing of the filter and the wavelength division component base located in the second profiling groove.

2. The high-speed optical component automatic assembly system for optical modules according to claim 1, characterized in that: It includes a hollow base, the top of which is fixedly connected to the second positioning plate, the first positioning plate is fixedly connected above the second positioning plate, and the base is provided with a locking push rod arranged vertically relative to the second contoured groove, and the locking push rod and the second contoured groove are arranged in a one-to-one correspondence.

3. The high-speed optical component automatic assembly system for optical modules according to claim 2, characterized in that: A liftable driving unit is provided on the hollow base, and the driving unit is connected to the floating pressure plate.

4. The high-speed optical component automatic assembly system for optical modules according to claim 3, characterized in that: The driving unit includes a vertical guide groove arranged on the hollow base and a slider slidably connected to the vertical guide groove, the floating pressure plate is provided at the end of the slider, a spring is provided between the slider and the second positioning plate, and a pin assembly for driving its displacement is provided below the slider.

5. The high-speed optical component automatic assembly system for optical modules according to claim 4, characterized in that: The ejector assembly includes a mounting base, on which a micrometer, a seesaw and a guide hole are provided. The seesaw is rotatably connected to the mounting base via a pin shaft, and an ejector is connected in the guide hole. One end of the seesaw contacts the micrometer, and the other end contacts the ejector.

6. The high-speed optical component automatic assembly system for optical modules according to claim 4, characterized in that: The slider is a U-shaped structure. A spring positioning block is connected to the slider. A spring fixing groove is provided on the spring positioning block.

7. The high-speed optical component automatic assembly system for optical modules according to claim 6, characterized in that: The first contoured groove and the second positioning plate are both provided with a slider avoidance groove.

8. The high-speed optical component automatic assembly system for optical modules according to claim 1, characterized in that: There are a plurality of second profiling grooves, and each second profiling groove corresponds to at least one first profiling groove.

9. The high-speed optical component automatic assembly system for optical modules according to claim 1, characterized in that: The radiation curing unit comprises a positioning base plate, a positioning side plate is connected to the positioning base plate, a positioning cross bar which can be displaced up and down is connected to the positioning side bar, and an irradiation member is provided on the positioning cross bar.

10. The high-speed optical component automatic assembly system for optical modules according to claim 9, characterized in that: The irradiating element is an ultraviolet curing lamp.

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