Silicon wafer rewinding device

Abstract

The invention provides a silicon wafer rewinding device. The silicon wafer rewinding device comprises a device main body; the carrier placing plate is located in the middle of the device main body, the carrier placing plate can move back and forth relative to the device main body, the carrier placing plate is used for placing a silicon wafer carrier, and a through groove penetrating through the carrier placing plate up and down is formed in the carrier placing plate; the two wafer supporting mechanisms are arranged on the device body and located on the left side and the right side of the carrier containing plate respectively, each wafer supporting mechanism comprises wafer supporting side teeth used for clamping silicon wafers, and wafer supporting clamping grooves are formed in the wafer supporting side teeth; the lifting mechanism comprises a lifting driving assembly and top teeth, the lifting driving assembly is connected with the bottoms of the top teeth, the tops of the top teeth can penetrate through the through grooves of the carrier containing plate, and the top teeth are provided with top tooth clamping grooves. According to the invention, the two wafer supporting mechanisms are arranged, so that the silicon wafer can be supported, the phenomenon that the silicon wafer falls in the carrier is avoided, the silicon wafer supporting device is suitable for the carrier with a large groove spacing, and meanwhile, the silicon wafer can be prevented from being scratched in the wafer reversing process.

Description

Technical Field

[0001] The present application relates to the technical field of solar cell manufacturing, and in particular to a silicon wafer flipping device. Background Art

[0002] Silicon wafer flipping refers to the process of transferring a silicon wafer from one loading location (such as a basket or boat) to another during semiconductor manufacturing. This process is typically performed to facilitate subsequent processing steps, such as cleaning or etching. Currently, silicon wafer flipping equipment is commonly used for this operation. However, during the implementation of the present invention, the inventors discovered the following problem with the prior art: when the spacing within the silicon wafer carrier slots is large, the silicon wafer tilts at a large angle within the carrier, resulting in falling over, which can easily cause scratches on the wafer during the flipping process. Summary of the Invention

[0003] The present invention provides a silicon wafer flipping device to solve the problems existing in the related art. The technical solution is as follows: The embodiment of the present application provides a silicon wafer flipping device, comprising: Device body; The carrier placement plate is located in the middle of the device body. The carrier placement plate can move forward and backward relative to the device body. The carrier placement plate is used to place silicon wafer carriers. The carrier placement plate has a through groove that runs through the carrier placement plate from top to bottom. Two wafer support mechanisms are provided on the device body, and the two wafer support mechanisms are respectively located on the left and right sides of the carrier placement plate. The wafer support mechanisms include wafer support side teeth for clamping the silicon wafer, and the wafer support side teeth have wafer clamping grooves; The lifting mechanism includes a lifting drive assembly and a top tooth. The lifting drive assembly is connected to the bottom of the top tooth. The top of the top tooth can pass through the through slot of the carrier placement plate. The top tooth is provided with a top tooth clamping groove.

[0004] In one embodiment, it further includes: Two film returning mechanisms are arranged on the main body of the device, and the two film returning mechanisms are respectively located on the left and right sides of the carrier placement plate. The two film returning mechanisms are respectively located above the two film supporting mechanisms. The film returning mechanisms include correction side teeth and correction driving parts for correcting the silicon wafers. The correction driving parts are connected to the correction side teeth. The correction driving parts of the two film returning mechanisms drive the correction side teeth to move toward or away from each other, and the correction side teeth are provided with correction clamping grooves.

[0005] In one embodiment, the film returning mechanism also includes a return fixing base, a return slide rail, a return fixing plate and a return support block. The return fixing base is fixed on the device body, the return slide rail is fixed on the return fixing base, the return fixing plate is slidably connected to the return slide rail through a slider, the return support block is fixed on the return fixing plate, and the return drive member is fixed on the return support block.

[0006] In one embodiment, the film returning mechanism also includes an adjustment base and an adjustment fixing member. The adjustment base is fixed on the correction fixing base. A plurality of first adjustment holes are arranged along the length direction of the adjustment base. The correction fixing plate has a second adjustment hole. The adjustment fixing member can pass through the second adjustment hole and be placed in the corresponding first adjustment hole.

[0007] In one embodiment, the silicon wafer flipping device further includes a carrier moving assembly connected to a carrier placement plate, and the carrier moving assembly drives the carrier placement plate to move forward and backward relative to the device body.

[0008] In one embodiment, a carrier left and right alignment mechanism is provided on the carrier placement plate, and the carrier left and right alignment mechanism includes a carrier left alignment component and a carrier right alignment component. The carrier left alignment component includes a left alignment plate, and the carrier right alignment component includes a right alignment plate and a right alignment drive. The right alignment drive is connected to the right alignment plate, and the right alignment drive drives the right alignment plate to move toward or away from the left alignment plate.

[0009] In one embodiment, a carrier front and rear alignment mechanism is also provided on the carrier placement plate, and the carrier front and rear alignment mechanism includes a carrier front alignment component and a carrier rear alignment component, and the carrier rear alignment component includes a rear alignment seat, and the carrier front alignment component includes a front alignment drive and a front alignment plate, and the front alignment drive is connected to the front alignment plate, and the front alignment drive drives the front alignment plate to move toward or away from the rear alignment seat.

[0010] In one embodiment, the support plate mechanism also includes a support plate driving member, a support plate fixing base, a support plate slide rail, a support plate fixing plate, a support plate support block and a support plate adjustment seat. The support plate fixing base is fixed on the device body, the support plate slide rail is fixed on the support plate fixing base, the support plate fixing plate is slidably connected to the support plate slide rail through a slider, the support plate support block is fixed on the support plate fixing plate, the support plate driving member is fixed on the support plate support block, and the support plate driving member is connected to the support plate side teeth; the support plate adjustment seat is fixed on the support plate fixing base, and a plurality of third adjustment holes are provided along the length direction of the support plate adjustment seat. An adjustment member is provided on the support plate fixing plate, and the adjustment member is movably connected to the support plate adjustment seat through the third adjustment hole.

[0011] In one embodiment, the silicon wafer flipping device also includes a silicon wafer suction mechanism, which includes an X-axis moving component, a Y-axis moving component, a Z-axis moving component and a suction cup component. The X-axis moving component is fixed to the device body, the Z-axis moving component is connected to the X-axis moving component, the Y-axis moving component is connected to the Z-axis moving component, and the suction cup component is connected to the Y-axis moving component.

[0012] In one embodiment, the suction cup assembly includes a suction cup fixing member and a plurality of suction cups, wherein the plurality of suction cups are respectively located on the suction cup fixing member, and the suction cup assembly sucks the silicon wafer through the plurality of suction cups.

[0013] The advantages or beneficial effects of the above technical solution include at least: The wafer flipping device of the embodiment of the present application includes a device body, a carrier placement plate, two wafer supporting mechanisms and a lifting mechanism, the wafer supporting mechanism includes wafer side teeth, and the lifting mechanism includes a lifting drive assembly and a top tooth connected thereto. When the wafer flipping device is in use, the wafer carrier carrying the silicon wafer is first moved to the carrier placement plate, and then the wafer side teeth of the two wafer supporting mechanisms clamp the two sides of the silicon wafer so that the side of the silicon wafer is placed in the wafer supporting groove, thereby straightening the silicon wafer and reducing the tilt angle of the silicon wafer. The lifting drive assembly then drives the top tooth to move so that the bottom of the silicon wafer is located in the top tooth clamping groove, and the top tooth drives the silicon wafer to move upward to a predetermined position, and finally the silicon wafer is removed. The embodiment of the present application can perform a straightening operation on the silicon wafer through the arrangement of the two wafer supporting mechanisms, thereby preventing the silicon wafer from falling over in the carrier, and can be applied to carriers with larger groove spacing, and at the same time can prevent the silicon wafer from being scratched during the flipping process.

[0014] The above summary is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the present application will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the multiple drawings represent the same or similar components or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings only depict some embodiments disclosed in this application and should not be construed as limiting the scope of this application.

[0016] Figure 1 Schematic diagram of the structure of a silicon wafer flipping device; Figure 2 Another structural schematic diagram of a silicon wafer flipping device; Figure 3 A schematic diagram of the combination of the lifting mechanism and the carrier placement plate; Figure 4 It is a structural diagram of the supporting mechanism; Figure 5 Schematic diagram of the structure of the film returning mechanism; Figure 6 This is a schematic diagram of the structure of the silicon wafer suction mechanism; Description of reference numerals: 1. Device body; 2. Carrier placement plate; 3. Supporting piece mechanism; 4. Lifting mechanism; 21. Through slot; 31. Supporting piece side teeth; 311. Supporting piece clamping groove; 41. Lifting drive assembly; 42. Top teeth; 421. Top teeth clamping groove; 5. Carrier left and right alignment mechanism; 51. Carrier left alignment assembly; 52. Carrier right alignment assembly; 511. Left alignment plate; 521. Right alignment plate; 522. Right alignment drive; 6. Carrier front and back alignment mechanism; 61. Carrier front alignment assembly; 62. Carrier rear alignment assembly; 621. Rear alignment seat; 622. Placement position; 611. Front alignment drive; 612. Front alignment plate; 613. Front alignment seat; 7. Carrier moving assembly; 71. Carrier moving slide rail; 72. Ball screw; 32. Supporting piece Driving member; 33. Support piece fixing base; 34. Support piece slide rail; 35. Support piece fixing plate; 36. Support piece support block; 37. Support piece adjustment seat; 371. Third adjustment hole; 38. Adjusting member; 8. Sheet return mechanism; 81. Correction side teeth; 82. Correction driving member; 811. Correction clamping groove; 83. Correction fixing base; 84. Correction slide rail; 85. Correction fixing plate; 86. Correction support block; 87. Adjusting base; 88. Adjusting fixing member; 871. First adjustment hole; 9. Wafer suction mechanism; 91. X-axis moving assembly; 92. Y-axis moving assembly; 93. Z-axis moving assembly; 94. Suction cup assembly; 941. Suction cup fixing member; 942. Suction cup; 9411. Mounting slot; 943. Spring; 10. Wafer carrier. DETAILED DESCRIPTION

[0017] Hereinafter, only certain exemplary embodiments are briefly described. As will be appreciated by those skilled in the art, the described embodiments may be modified in various ways without departing from the spirit or scope of the present application. Therefore, the drawings and description are to be regarded as illustrative in nature and not restrictive.

[0018] like Figures 1 to 3 As shown, the embodiment of the present application provides a silicon wafer flipping device, including a device body 1, a carrier placement plate 2, two wafer supporting mechanisms 3 and a lifting mechanism 4. Among them, the carrier placement plate 2 is located in the middle of the device body 1, and the carrier placement plate 2 can move back and forth relative to the device body 1. The carrier placement plate 2 is used to place the silicon wafer carrier 10, and the carrier placement plate 2 has a through groove 21 that passes through the carrier placement plate 2 from top to bottom. The two wafer supporting mechanisms 3 are arranged on the device body 1, and the two wafer supporting mechanisms 3 are respectively located on the left and right sides of the carrier placement plate 2. As shown Figure 4 As shown, the wafer support mechanism 3 includes side teeth 31 for clamping the silicon wafer, each having a wafer clamping groove 311. The lifting mechanism 4 includes a lifting drive assembly 41 and a top tooth 42. The lifting drive assembly 41 is connected to the bottom of the top tooth 42. The top of the top tooth 42 can pass through the through slot 21 of the carrier plate 2. The top tooth 42 has a top tooth clamping groove 421.

[0019] When the wafer flipping device of the embodiment of the present application is in use, the silicon wafer carrier 10 carrying the silicon wafer is first moved to the carrier placement plate 2, and then the two wafer supporting side teeth 31 of the two wafer supporting mechanisms 3 clamp the two sides of the silicon wafer so that the side of the silicon wafer is placed in the wafer supporting clamping groove 311, thereby straightening the silicon wafer and reducing the tilt angle of the silicon wafer. Then the lifting drive assembly 41 drives the top teeth 42 to move so that the bottom of the silicon wafer is located in the top tooth clamping groove 421, and the top teeth 42 drive the silicon wafer to move upward to a predetermined position, and finally the silicon wafer is removed. The embodiment of the present application can perform a straightening operation on the silicon wafer through the provision of the two wafer supporting mechanisms 3, avoid the phenomenon of the silicon wafer falling over in the carrier, can be applied to carriers with larger groove spacing, and can also avoid the silicon wafer from being scratched during the flipping process.

[0020] like Figure 1 As shown, in one embodiment, a carrier left-right alignment mechanism 5 is provided on the carrier placement plate 2 to enable the silicon wafer carrier 10 to be placed at a predetermined position on the carrier placement plate 2. The carrier left-right alignment mechanism 5 includes a carrier left alignment component 51 and a carrier right alignment component 52. The left alignment component 51 aligns the left side of the silicon wafer carrier 10, while the right alignment component 52 aligns the right side of the silicon wafer carrier 10.

[0021] Specifically, if Figure 3 As shown, the carrier left alignment assembly 51 includes a left alignment plate 511, which is fixed to the carrier placement plate 2 by screws or the like. Two left alignment plates 511 can be provided, one at each end of the carrier placement plate 2, thereby aligning the left side of the wafer carrier 10 from two different positions.

[0022] The carrier right alignment assembly 52 includes a right alignment plate 521 and a right alignment driver 522. The right alignment driver 522 is connected to the right alignment plate 521 and drives the right alignment plate 521 toward or away from the left alignment plate 511. Preferably, the right alignment driver 522 is a pneumatic cylinder fixed to the carrier placement plate 2. When the wafer carrier 10 is moved from an external device to the carrier placement plate 2, the right alignment driver 522 drives the right alignment plate 521, thereby moving the wafer carrier 10, thereby aligning the left and right sides of the wafer carrier 10.

[0023] In one embodiment, if Figure 1 、 Figure 2 As shown, a carrier front and rear alignment mechanism 6 is also provided on the carrier placement plate 2. The carrier front and rear alignment mechanism 6 includes a carrier front alignment component 61 and a carrier rear alignment component 62. The carrier front alignment component 61 and the carrier rear alignment component 62 jointly align the front and rear sides of the carrier.

[0024] Specifically, if Figure 3 As shown, the carrier rear alignment assembly 62 includes a rear alignment seat 621, which is fixed to the carrier placement plate 2 via screws. The rear alignment seat 621 has a protruding placement area 622, on which one end of the silicon wafer carrier 10 is placed. The carrier front alignment assembly 61 includes a front alignment driver 611 and a front alignment plate 612. The front alignment driver 611 is connected to the front alignment plate 612 and drives the front alignment plate 612 toward or away from the rear alignment seat 621. Preferably, the front alignment driver 611 is a pneumatic cylinder fixed to the carrier placement plate 2.

[0025] In one embodiment, the carrier front alignment assembly 61 further includes a front alignment seat 613, which is fixed to the carrier placement plate 2 via screws. The front alignment seat 613 also has a protruding placement position 622, into which one end of the silicon wafer carrier 10 is placed. The front alignment plate 612 is located in the center of the front alignment seat 613. After the silicon wafer carrier 10 is placed on the carrier placement plate 2, the front alignment driver 611 drives the front alignment plate 612 to move, thereby pushing the silicon wafer carrier 10 to move and align the silicon wafer carrier 10.

[0026] like Figure 1 、 Figure 4 As shown, in order to enable the carrier placement plate 2 to move forward and backward relative to the device body 1, the silicon wafer flipping device also includes a carrier moving assembly 7, which is connected to the carrier placement plate 2. The carrier moving assembly 7 drives the carrier placement plate 2 to move forward and backward relative to the device body 1. Furthermore, the carrier moving assembly 7 includes two carrier movement rails 71 and a ball screw 72. The two carrier movement rails 71 are arranged opposite to each other, and the carrier placement plate 2 is slidably connected to the two carrier movement rails 71 through a slider. The ball screw 72 is located between the two carrier movement rails 71, and the carrier placement plate 2 is connected to the screw nut of the ball screw 72. When the motor drives the ball screw 72 to rotate, it drives the carrier placement plate 2 to slide on the two carrier movement rails 71, thereby adjusting the position of the carrier placement plate 2.

[0027] In the embodiment of the present application, the carrier moving component 7 can drive the silicon wafer carrier 10 to move, so that one of the silicon wafers on the silicon wafer carrier 10 is located between the two supporting side teeth 31. After the supporting side teeth 31 straighten the silicon wafer, the silicon wafer is directly above the top teeth 42, so that the silicon wafer can be driven upward by the top teeth 42.

[0028] In one embodiment, if Figure 4As shown, to clamp and straighten the silicon wafer, the wafer support mechanism 3 also includes a wafer driver 32, a wafer fixing base 33, a wafer slide 34, a wafer fixing plate 35, and a wafer support block 36. The wafer fixing base 33 is fixed to the device body 1 by screws, and the wafer slide 34 is fixed to the wafer fixing base 33 by screws. The wafer fixing plate 35 is slidably connected to the wafer slide 34 via a slider. The wafer support block 36 is fixed to the wafer fixing plate 35. The wafer driver 32 is fixed to the wafer support block 36 and connected to the wafer side teeth 31. Preferably, the wafer driver 32 is a pneumatic cylinder. Three wafer clamping grooves 311 are provided at each end of the wafer side teeth 31. After the side edge of the silicon wafer is placed in the wafer clamping groove 311, the top teeth 42 move upward to remove the silicon wafer from the wafer clamping groove 311.

[0029] Because the support plate 35 is slidably connected to the support rail 34 via a slider, the position of the support plate 35 can be manually adjusted, allowing the support mechanism 3 to adapt to the needs of silicon wafers of different sizes. To secure the support plate 35 after adjustment, the support mechanism 3 also includes a support adjustment seat 37. The support adjustment seat 37 is fixed to the support base 33 and has multiple third adjustment holes 371 arranged along its length. The support plate 35 is equipped with an adjustment member 38, which is movably connected to the support adjustment seat 37 through the third adjustment holes 371.

[0030] Specifically, the adjustment member 38 is a knob plunger. The arm fixing plate 35 has a fourth adjustment hole. One end of the adjustment member 38 can be passed through the fourth adjustment hole and then placed into the corresponding third adjustment hole 371, thereby securing the arm fixing plate 35. To adjust the position of the arm fixing plate 35, one end of the adjustment member 38 is simply unscrewed from the third adjustment hole 371.

[0031] After the wafer supporting mechanism 3 straightens the corresponding silicon wafer in the silicon wafer carrier 10, the lifting drive assembly 41 of the lifting mechanism 4 then drives the top teeth 42 to move upward, so that the bottom of the silicon wafer is inserted into the top tooth clamping groove 421 of the top teeth 42, and the top teeth 42 drive the silicon wafer upward. Among them, the lifting drive assembly 41 is an existing linear slide module, which drives the top teeth 42 to move upward or downward. Preferably, there can be two top teeth 42, and the two top teeth 42 can jointly drive the silicon wafer to move, making the silicon wafer more stable during movement.

[0032] like Figure 1As shown, after the silicon wafer moves upward to the predetermined position, it needs to be aligned. To do this, the wafer rewinding device also includes two wafer return mechanisms 8. These two wafer return mechanisms 8 are mounted on the device body 1, one on the left and one on the right side of the carrier plate 2, and one above each of the two wafer support mechanisms 3. After the silicon wafer moves upward to the predetermined position, the two wafer return mechanisms 8 align the wafer from the left and right sides, respectively.

[0033] like Figure 5 As shown, the wafer return mechanism 8 includes a return side tooth 81 for returning the silicon wafer and a return driver 82. The return driver 82 is connected to the return side tooth 81. The return drivers 82 of the two wafer return mechanisms 8 drive the return side teeth 81 to move toward or away from each other. The return side teeth 81 have a return clamping groove 811. Preferably, the return driver 82 is a cylinder, which drives the return side teeth 81 to move. Because the return side teeth 81 have the return clamping groove 811, when the side edge of the silicon wafer is inserted into the return clamping groove 811, the return side teeth 81 can drive the silicon wafer to move, thereby achieving return.

[0034] In one embodiment, the film return mechanism 8 further includes a return fixing base 83, a return slide 84, a return fixing plate 85, and a return support block 86. The return fixing base 83 is fixed to the device body 1 by screws, the return slide 84 is fixed to the return fixing base 83, the return fixing plate 85 is slidably connected to the return slide 84 via a slider, the return support block 86 is fixed to the return fixing plate 85 by screws, and the return driving member 82 is fixed to the return support block 86.

[0035] Since the correction fixing plate 85 is slidably connected to the correction slide rail 84 through a slider, the correction fixing plate 85 can be manually slid along the correction slide rail 84 to adjust the position of the correction fixing plate 85. After the position of the correction fixing plate 85 is adjusted, the correction fixing plate 85 needs to be fixed. In order to fix the correction fixing plate 85, the sheet returning mechanism 8 also includes an adjustment base 87 and an adjustment fixing member 88. The adjustment base 87 is fixed to the correction fixing base 83 by screws, and a plurality of first adjustment holes 871 are provided along the length direction of the adjustment base 87. The correction fixing plate 85 is provided with a second adjustment hole, and the adjustment fixing member 88 can pass through the second adjustment hole and be placed in the corresponding first adjustment hole 871. Preferably, the adjustment fixing member 88 is also a knob plunger.

[0036] After the silicon wafer moved to the predetermined position is aligned, the aligned silicon wafer can be transferred to realize the wafer flipping operation. Figure 1 As shown, in order to realize the transfer of the silicon wafer, the silicon wafer flipping device further includes a silicon wafer suction mechanism 9, through which the silicon wafer after being straightened is sucked.

[0037] like Figure 2 、 Figure 6 As shown, the silicon wafer suction mechanism 9 includes an X-axis moving assembly 91, a Y-axis moving assembly 92, a Z-axis moving assembly 93, and a suction cup assembly 94. The X-axis moving assembly 91 is fixed to the device body 1, the Z-axis moving assembly 93 is connected to the X-axis moving assembly 91, the Y-axis moving assembly 92 is connected to the Z-axis moving assembly 93, and the suction cup assembly 94 is connected to the Y-axis moving assembly 92. The X-axis moving assembly 91, the Y-axis moving assembly 92, and the Z-axis moving assembly 93 can drive the suction cup assembly 94 to move in the X-axis, Y-axis, and Z-axis directions. The X-axis moving assembly 91, the Y-axis moving assembly 92, and the Z-axis moving assembly 93 can all be existing linear modules.

[0038] Suction cup assembly 94 includes a suction cup fixture 941 and multiple suction cups 942. Each of the suction cups 942 is positioned on suction cup fixture 941. Suction cup assembly 94 uses the suction cups 942 to hold the silicon wafer. Suction cups 942 adhere to the silicon wafer using the principle of vacuum adsorption. Preferably, there are three suction cups 942, arranged in a triangular configuration on suction cup fixture 941.

[0039] To secure suction cup 942 to suction cup fixture 941, suction cup fixture 941 has three mounting slots 9411, with suction cup 942 positioned within these slots. Four springs 943 are mounted at four different locations on suction cup 942, one end of each spring connected to suction cup 942 and the other end connected to suction cup fixture 941, thereby securing suction cup 942 within these slots 9411.

[0040] When using the wafer unwinding device of the present embodiment, an external device first moves the wafer carrier 10 carrying the wafer onto the carrier placement plate 2. The wafer carrier 10 is then aligned by the carrier left-right alignment mechanism 5 and the carrier front-back alignment mechanism 6, so that the leading wafer at the front of the wafer carrier 10 is aligned with the top teeth 42. If the wafer is not aligned with the top teeth 42, the wafer placement plate 2 can be moved using the carrier movement assembly 7.

[0041] Next, the support drive 32 drives the side teeth 31 to move, allowing the side edge of the silicon wafer to enter the support clamping groove 311 of the side teeth 31, thereby straightening the silicon wafer and reducing the wafer's tilt angle. The lifting drive assembly 41 then drives the top teeth 42 upward, allowing the bottom of the silicon wafer to enter the top tooth clamping groove 421 of the top teeth 42. The top teeth 42 then drive the straightened silicon wafer upward to the predetermined position.

[0042] Next, the alignment drive 82 drives the alignment teeth 81, allowing the side edge of the silicon wafer to enter the alignment groove 811 of the alignment teeth 81. The alignment teeth 81 then align the silicon wafer, positioning it for suction cup 942 to absorb it. Finally, the X-axis motion assembly 91, Y-axis motion assembly 92, and Z-axis motion assembly 93 drive the suction cup 942 to the back of the silicon wafer. After suction cup 942 absorbs the silicon wafer, it is moved to an external carrier. After alignment, the silicon wafer is vertically positioned as much as possible, facilitating suction by suction cup 942.

[0043] The present invention can automatically perform the wafer flipping operation and is applicable to a wafer carrier 10 having a large groove spacing and a large tilt angle of the wafer in the carrier. The wafer flipping device of the present invention can also be used with wafers of different sizes, automatically performing the wafer flipping operation, improving work efficiency and reducing manufacturing costs.

[0044] In one embodiment, the apparatus body 1 may be equipped with two carrier plates 2, two lifting mechanisms 4, a corresponding number of wafer support mechanisms 3 and wafer return mechanisms 8, and a single wafer suction mechanism 9. This arrangement allows for simultaneous wafer rewinding operations on two wafer carriers 10.

[0045] In the description of this specification, the reference terms "one embodiment," "some embodiments," "example," "specific example," or "some examples" mean that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. Moreover, the specific features, structures, materials, or characteristics described may be combined in any appropriate manner in any one or more embodiments or examples. In addition, those skilled in the art may combine and combine different embodiments or examples described in this specification, as well as features of different embodiments or examples, unless they are mutually inconsistent.

[0046] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. Throughout the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0047] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any person skilled in the art can easily conceive of various modifications or substitutions within the technical scope disclosed in this application, and such modifications or substitutions should be included within the scope of protection of the present application. Therefore, the scope of protection of the present application should be based on the scope of protection of the claims.

Claims

1. A silicon wafer flipping device, characterized in that: include: Device body; The carrier placement plate is located in the middle of the device body. The carrier placement plate can move forward and backward relative to the device body. The carrier placement plate is used to place silicon wafer carriers. The carrier placement plate has a through groove that runs through the carrier placement plate from top to bottom. Two wafer support mechanisms are provided on the device body, and the two wafer support mechanisms are respectively located on the left and right sides of the carrier placement plate. The wafer support mechanisms include wafer support side teeth for clamping the silicon wafer, and the wafer support side teeth have wafer clamping grooves; The lifting mechanism includes a lifting drive assembly and a top tooth. The lifting drive assembly is connected to the bottom of the top tooth. The top of the top tooth can pass through the through slot of the carrier placement plate. The top tooth is provided with a top tooth clamping groove.

2. The silicon wafer flipping device according to claim 1, characterized in that: Also includes: Two film returning mechanisms are arranged on the main body of the device, and the two film returning mechanisms are respectively located on the left and right sides of the carrier placement plate. The two film returning mechanisms are respectively located above the two film supporting mechanisms. The film returning mechanisms include correction side teeth and correction driving parts for correcting the silicon wafers. The correction driving parts are connected to the correction side teeth. The correction driving parts of the two film returning mechanisms drive the correction side teeth to move toward or away from each other, and the correction side teeth are provided with correction clamping grooves.

3. The silicon wafer flipping device according to claim 2, characterized in that: The film returning mechanism also includes a return fixing base, a return slide rail, a return fixing plate and a return support block. The return fixing base is fixed on the device body, the return slide rail is fixed on the return fixing base, the return fixing plate is slidably connected to the return slide rail through a slider, the return support block is fixed on the return fixing plate, and the return drive member is fixed on the return support block.

4. The silicon wafer flipping device according to claim 3, characterized in that: The sheet returning mechanism also includes an adjustment base and an adjustment fixing member. The adjustment base is fixed on the correction fixing base. A plurality of first adjustment holes are arranged along the length direction of the adjustment base. The correction fixing plate has a second adjustment hole. The adjustment fixing member can pass through the second adjustment hole and be placed in the corresponding first adjustment hole.

5. The silicon wafer flipping device according to any one of claims 1 to 4, characterized in that: The silicon wafer flipping device also includes a carrier moving component, which is connected to the carrier placement plate. The carrier moving component drives the carrier placement plate to move back and forth relative to the device body.

6. The silicon wafer flipping device according to any one of claims 1 to 4, characterized in that: A carrier left and right correction mechanism is provided on the carrier placement plate, and the carrier left and right correction mechanism includes a carrier left correction component and a carrier right correction component. The carrier left correction component includes a left correction plate, and the carrier right correction component includes a right correction plate and a right correction drive. The right correction drive is connected to the right correction plate, and the right correction drive drives the right correction plate to move toward or away from the left correction plate.

7. The silicon wafer flipping device according to claim 6, characterized in that: The carrier placement plate is also provided with a carrier front and rear correction mechanism, which includes a carrier front correction component and a carrier rear correction component. The carrier rear correction component includes a rear correction seat. The carrier front correction component includes a front correction drive and a front correction plate. The front correction drive is connected to the front correction plate, and the front correction drive drives the front correction plate to move toward or away from the rear correction seat.

8. The silicon wafer flipping device according to any one of claims 1 to 4, characterized in that: The support plate mechanism also includes a support plate driving member, a support plate fixing base, a support plate slide rail, a support plate fixing plate, a support plate support block and a support plate adjustment seat. The support plate fixing base is fixed on the device body, the support plate slide rail is fixed on the support plate fixing base, the support plate fixing plate is slidably connected to the support plate slide rail through a slider, the support plate support block is fixed on the support plate fixing plate, the support plate driving member is fixed on the support plate support block, and the support plate driving member is connected to the support plate side teeth; the support plate adjustment seat is fixed on the support plate fixing base, and a plurality of third adjustment holes are provided along the length direction of the support plate adjustment seat. An adjustment member is provided on the support plate fixing plate, and the adjustment member is movably connected to the support plate adjustment seat through the third adjustment hole.

9. The silicon wafer flipping device according to any one of claims 1 to 4, characterized in that: The silicon wafer flipping device also includes a silicon wafer suction mechanism, which includes an X-axis moving component, a Y-axis moving component, a Z-axis moving component and a suction cup component. The X-axis moving component is fixed to the device body, the Z-axis moving component is connected to the X-axis moving component, the Y-axis moving component is connected to the Z-axis moving component, and the suction cup component is connected to the Y-axis moving component.

10. The silicon wafer flipping device according to any one of claims 1 to 4, characterized in that: The suction cup assembly includes a suction cup fixing part and a plurality of suction cups. The plurality of suction cups are respectively located on the suction cup fixing part. The suction cup assembly sucks the silicon wafer through the plurality of suction cups.

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