MEMS packaging structure, packaging method thereof and electronic equipment

Abstract

The invention provides an MEMS packaging structure, a packaging method thereof and electronic equipment. The MEMS packaging structure comprises a substrate, and a groove is formed in the substrate; the shell is arranged on one side of the substrate, and an accommodating cavity is defined by the shell and the substrate; the supporting plate is arranged in the accommodating cavity and covers the opening of the groove; the active chip module comprises an ASIC (Application Specific Integrated Circuit) chip, and the ASIC chip is arranged on one side, far away from the substrate, of the supporting plate; and the passive chip module is arranged in the groove, and at least part of the passive chip module is opposite to the ASIC chip of the active chip module in the thickness direction of the substrate, so that the overall size of the MEMS packaging structure is reduced, and the MEMS packaging structure can be more widely applied to small electronic equipment.

Description

Technical Field

[0001] The present application belongs to the field of packaging technology. Specifically, the present application relates to a MEMS packaging structure, a packaging method thereof, and an electronic device. Background Art

[0002] MEMS microphones are widely used in various electronic devices due to their stable performance. However, as electronic devices continue to move towards lighter, thinner, and smaller sizes, more stringent requirements are placed on the size of MEMS microphones.

[0003] In related technologies, conventional MEMS microphones integrate multiple chips on a substrate to achieve their functions. For example, the MEMS chip, ASIC chip and IPD chip are all placed on the front of the substrate, and a certain amount of space needs to be reserved between the chips, resulting in a larger overall structural size of the MEMS microphone, which limits the application of MEMS microphones in small electronic devices. Summary of the Invention

[0004] An object of the embodiments of the present application is to provide a new technical solution for a MEMS packaging structure and a packaging method thereof and an electronic device.

[0005] According to a first aspect of an embodiment of the present application, a MEMS packaging structure is provided, including:

[0006] a substrate, wherein a groove is provided in the substrate;

[0007] a housing, the housing being disposed on one side of the substrate and forming a receiving cavity with the substrate;

[0008] a support plate, the support plate being disposed in the accommodating cavity and covering an opening of the groove;

[0009] an active chip module, the active chip module comprising an ASIC chip, the ASIC chip being disposed on a side of the support plate away from the substrate;

[0010] A passive chip module is disposed in the groove, and at least a portion of the passive chip module is opposite to the ASIC chip in a thickness direction of the substrate.

[0011] Optionally, the support plate is conductive, and the ASIC chip is electrically connected to the substrate via the support plate.

[0012] Optionally, a wiring unit is provided in the substrate, and the passive chip module is electrically connected to the wiring unit.

[0013] Optionally, the passive chip module includes an IPD chip.

[0014] Optionally, the passive chip module includes a chip body and a conductor, one end of the conductor is provided on the chip body, and the other end of the conductor is provided to be electrically connected to a wiring unit of the substrate.

[0015] Optionally, the wiring unit includes a first wiring layer, a second wiring layer and an output terminal;

[0016] The conductor includes a first conductive column, a second conductive column and a third conductive column, the first conductive column is connected between the chip body and the first wiring layer, the second conductive column is connected between the chip body and the second wiring layer, and the third conductive column is connected between the chip body and the output end.

[0017] Optionally, the active chip module includes a MEMS chip, a sound inlet hole is provided on the substrate, and the MEMS chip is arranged on a side of the substrate facing the housing and opposite to the sound inlet hole.

[0018] Optionally, a waterproof module is further included. A mounting groove is provided on the substrate, the mounting groove is communicated with the sound inlet hole, the waterproof module is arranged in the mounting groove, and the projection of the waterproof module on the substrate covers the sound inlet hole.

[0019] According to a second aspect of an embodiment of the present application, a packaging method for a MEMS packaging structure is provided, comprising:

[0020] providing a groove in the substrate;

[0021] Installing the passive chip module in the groove and setting a support plate to cover the opening of the groove;

[0022] An ASIC chip is arranged on a side of the support plate away from the substrate;

[0023] The housing is connected to the substrate to enclose a receiving cavity.

[0024] According to a third aspect of an embodiment of the present application, an electronic device is provided, comprising the MEMS packaging structure described in the first aspect.

[0025] One of the technical effects of this application is:

[0026] An embodiment of the present application provides a MEMS packaging structure, which includes a substrate with a groove provided therein; a shell, which is provided on one side of the substrate and forms a receiving cavity with the substrate; a support plate, which is provided in the receiving cavity and covers the opening of the groove; an active chip module, which includes an ASIC chip, which is provided on a side of the support plate away from the substrate; and a passive chip module, which is provided in the groove, and in the thickness direction of the substrate, at least a part of the passive chip module is opposite to the ASIC chip of the active chip module, so that the overall size of the MEMS packaging structure is reduced, and the MEMS packaging structure can be more widely used in small electronic devices.

[0027] Other features and advantages of the present application will become apparent from the following detailed description of exemplary embodiments of the present application with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the application and, together with the description, serve to explain the principles of the application.

[0029] Figure 1 A schematic diagram of a MEMS packaging structure provided in one embodiment of the present application;

[0030] Figure 2 A schematic diagram of a passive chip module of a MEMS packaging structure provided in one embodiment of the present application.

[0031] Among them: 1. Substrate; 11. Groove; 14. Sound inlet; 15. Mounting slot; 2. Shell; 3. Active chip module; 31. MEMS chip; 32. ASIC chip; 33. Connecting wire; 34. Cover; 4. Passive chip module; 41. Chip body; 42. Conductor; 421. First conductive column; 422. Second conductive column; 423. Third conductive column; 5. Waterproof module; 6. Support plate. DETAILED DESCRIPTION

[0032] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present application.

[0033] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be understood as limiting the present application. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of this application.

[0034] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly refer to one or more of the features. Throughout the description of this application, unless otherwise specified, "plurality" means two or more. Furthermore, "and / or" in the specification and claims refers to at least one of the connected entities, and the character " / " generally indicates an "or" relationship between the connected entities.

[0035] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0036] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0037] It should be noted that like reference numerals and letters refer to like items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0038] In related technologies, conventional MEMS microphones integrate multiple chips on a substrate to achieve their functions. For example, the MEMS chip, ASIC chip and IPD chip are all placed on the front of the substrate, and a certain amount of space needs to be reserved between the chips, resulting in a larger overall structural size of the MEMS microphone, which limits the application of MEMS microphones in small electronic devices.

[0039] The MEMS (Micro-Electro-Mechanical System) packaging structure provided in the embodiment of the present application sets the passive chip module in a groove, and in the thickness direction of the substrate, at least part of the passive chip module is opposite to the ASIC chip of the active chip module, so that the overall size of MEMS packaging structures such as MEMS microphones is reduced, and the MEMS packaging structure can be more widely used in small electronic devices.

[0040] Reference Figure 1 , an embodiment of the present application provides a MEMS packaging structure, the MEMS packaging structure comprising:

[0041] A substrate 1 having a groove 11 formed therein;

[0042] The housing 2 is disposed on one side of the substrate 1 and forms a receiving cavity with the substrate 1;

[0043] A support plate 6 is provided in the accommodating cavity and covers the opening of the groove 11;

[0044] The active chip module 3 includes an ASIC chip 32 , and the ASIC chip 32 is disposed on a side of the support plate 6 away from the substrate 1 ;

[0045] The passive chip module 4 is disposed in the groove 11 , and in the thickness direction of the substrate 1 , at least a portion of the passive chip module 4 is opposite to the ASIC chip 32 of the active chip module 3 .

[0046] In the above embodiment, the substrate 1 serves as a support and signal transmission component of the entire MEMS packaging structure, and can provide a mounting platform for other modules, ensuring that each module can be stably arranged and maintaining the overall structural stability of the packaging structure.

[0047] See also Figure 1 A groove 11 is set in the substrate 1 to provide an installation space for the passive chip module 4, and the passive chip module 4 is "embedded" into the interior of the substrate 1, avoiding the passive chip module 4 competing for space with other chips (such as ASIC chip 32) on the front of the substrate.

[0048] The shell 2 is arranged on one side of the substrate 1 and forms a accommodating cavity with the substrate 1. The shell 2 can be a metal shell. The shell 2 provides physical protection for the active chip module 3 and the passive chip module 4 inside the accommodating cavity, preventing external environmental factors (such as dust, moisture, mechanical collision, etc.) from damaging the chip, ensuring that the chip works in a stable and safe environment, thereby improving the reliability of the packaging structure.

[0049] See also Figure 1The support plate 6 covers the opening of the groove 11. On the one hand, it can form a closed installation space in the groove 11 to ensure the sealing of the passive chip module 4 set in the groove 11; on the other hand, it can provide a stable support platform for the active chip module 3 (such as the ASIC chip 32), ensuring that the active chip module 3 can be firmly installed in the packaging structure, reducing chip displacement or damage caused by factors such as vibration.

[0050] At the same time, the support plate 6 can also serve as a positioning reference for the active chip module 3 to ensure that the relative position between the active chip module 3 and the passive chip module 4 in the thickness direction of the substrate 1 is accurate, thereby facilitating signal interaction and electrical connection between the two.

[0051] See also Figure 1 ASIC chip 32 serves as the main signal processing and control function for MEMS packaging structures such as MEMS microphones. It can amplify, filter, and perform analog-to-digital conversion on the weak signals collected by the MEMS chip, and convert the processed signals into usable electrical signals for output.

[0052] The ASIC chip 32 is arranged on the side of the support plate 6 away from the substrate 1, and the ASIC chip 32 and the passive chip module 4 arranged in the groove 11 of the substrate 1 are arranged relative to each other in the thickness direction of the substrate 1, which fully utilizes the space of the packaging structure in the vertical direction, avoids the arrangement of multiple chips on the substrate plane, effectively reduces the overall size of the packaging structure, and meets the space requirements of small electronic devices.

[0053] Moreover, the ASIC chip 32 and the passive chip module 4 are arranged opposite to each other in the thickness direction, and the thickness direction of the substrate 1 can be Figure 1 The up and down directions in the transmission path shorten the signal between the two, reduce the loss and interference of the signal during transmission, and improve the efficiency and accuracy of signal interaction.

[0054] In the above embodiment, the passive chip module 4 may include passive components such as capacitors, inductors, and resistors. These passive components can filter, stabilize, match, and perform other processing on the signal output by the ASIC chip 32 to improve the signal quality and ensure that the ASIC chip 32 can operate stably and accurately.

[0055] See also Figure 1 , the passive chip module 4 is arranged in the groove 11 of the substrate 1, which makes full use of the internal space of the substrate 1 and avoids the passive chip module 4 on the front side of the substrate ( Figure 1 The upper surface of the middle substrate) takes up extra space, thereby reducing the size of the package structure as a whole.

[0056] In addition, glue may be provided in the groove 11 to fix the passive chip module 4 by the glue, thereby ensuring the stability of the passive chip module 4 .

[0057] In one embodiment, the support plate 6 is disposed on the surface of the substrate 1 by using a support plate adhesive, and the support plate 6 is then bonded and fixed to the ASIC chip, which can not only ensure the sealing of the passive chip module 4 but also support the ASIC chip.

[0058] In one embodiment, the support plate 6 is conductive, and the ASIC chip 32 is electrically connected to the substrate 1 through the support plate 6 .

[0059] In the above embodiment, the support plate 6 can be made of metal materials such as aluminum or steel. The support plate 6 serves as a conductive medium and builds an electrical connection bridge between the ASIC chip 32 and the substrate 1. It can accurately and stably transmit the electrical signals generated by the ASIC chip 32 to the relevant circuits on the substrate 1. At the same time, it can also transmit the power signal and control signal provided by the substrate 1 to the ASIC chip 32, ensuring the normal operation of the chip, reducing the need for additional wiring, and optimizing the electrical layout inside the packaging structure.

[0060] In one embodiment, a wiring unit is provided in the substrate 1 , and the passive chip module 4 is electrically connected to the wiring unit.

[0061] In the above embodiment, the wiring unit within substrate 1 provides a connection path for the electrical connection between the various components within the package structure, connecting the passive chip module 4, the active chip module 3, and other modules into a single entity, enabling signal and power transmission between the various modules. Furthermore, the electrical connection between the passive chip module 4 and the wiring unit within substrate 1 simplifies the assembly process of the package structure.

[0062] In one embodiment, see Figure 1 , the passive chip module 4 includes an IPD chip.

[0063] In the above embodiment, the IPD chip is placed inside the substrate 1 and is electrically connected to the wiring in the substrate 1 through its own copper pillars, which can realize passive functions such as RF (Radio Frequency) signal filtering, matching and coupling; and the IPD chip cooperates with the active chip module 3 to improve the performance and reliability of the entire MEMS packaging structure.

[0064] For example, during signal transmission, the IPD chip can filter the signal, remove noise and interference signals, and make the signal purer; in addition, the IPD chip can also achieve impedance matching, improve signal transmission efficiency, and reduce signal reflection and loss.

[0065] In other embodiments, the passive chip module 4 may include other chips such as filter chips, protection chips and radio frequency chips. The passive chip module 4 is set in the groove 11 in the substrate 1, which can reduce the size of the MEMS packaging structure while ensuring the performance of the MEMS packaging structure.

[0066] In some embodiments, see Figure 1 and Figure 2 The passive chip module 4 includes a chip body 41 and a conductor 42 . One end of the conductor 42 is disposed on the chip body 41 , and the other end of the conductor 42 is electrically connected to a wiring unit of the substrate 1 .

[0067] In the above embodiment, the wiring unit is distributed within substrate 1 and enables electrical connections between various modules, such as active chip module 3 and passive chip module 4. By designing the wiring pattern of the wiring unit, the wiring unit can accurately transmit signals generated by the chip to other modules, and can also transmit control signals to the corresponding chips, enabling various components to work together to achieve the functions set by the packaging structure.

[0068] In addition, by rationally designing the width, spacing, and length of wiring in the wiring unit, the impedance during signal transmission can be reduced, signal attenuation and reflection can be reduced, and the signal transmission quality and speed can be improved.

[0069] See also Figure 2 The chip body 41 of the passive chip module 4 can integrate passive components such as resistors, capacitors, and inductors. Through the combination and interaction of these passive components, passive functions such as filtering, matching, and coupling can be achieved. For example, during signal processing, the chip body 41 can filter the input signal, remove unnecessary frequency components, and improve signal quality.

[0070] See also Figure 1 and Figure 2 One end of the conductor 42 is disposed on the chip body 41, and the other end is electrically connected to the wiring unit within the substrate 1. The conductor 42 provides a reliable electrical connection between the chip body 41 and the wiring unit. Signals generated by the chip body 41 can be transmitted to the wiring unit through the conductor 42, and then transmitted externally. At the same time, signals transmitted by the wiring unit can also be accurately transmitted to the chip body 41 through the conductor 42, achieving signal interaction and functional coordination.

[0071] In one embodiment, see Figure 1Conductors 42 on chip body 41 can be connected downward to the wiring unit within substrate 1, for example, by welding or crimping to achieve a secure electrical connection, improving the stability and reliability of the connection. When conductors 42 are connected downward, the signal transmission path through conductors 42 is primarily within substrate 1, reducing the impact of external interference signals on signal transmission.

[0072] In another embodiment, the conductor 42 on the chip body 41 can be connected to the wiring unit upward. The conductor 42 facing upward can make the signal transmission path more direct and shorter, reduce the interference and loss that may be generated when the signal passes through other modules or structures during the transmission process, and improve the quality and speed of signal transmission.

[0073] In some embodiments, see Figure 1 and Figure 2 , the wiring unit includes a first wiring layer, a second wiring layer and an output terminal;

[0074] The conductor 42 includes a first conductive column 421, a second conductive column 422 and a third conductive column 423. The first conductive column 421 is connected between the chip body 41 and the first wiring layer, the second conductive column 422 is connected between the chip body 41 and the second wiring layer, and the third conductive column 423 is connected between the chip body 41 and the output end.

[0075] In the above embodiment, the wiring unit may include multiple wiring layers spaced apart from each other. For example, the first wiring layer and the second wiring layer in the wiring unit are spaced apart from each other, and the second wiring layer cooperates with the first wiring layer to optimize the layout of the entire wiring unit. By assigning different types of signals to different wiring layers, the intersection and overlap of wiring can be reduced, the complexity of wiring can be reduced, and the reliability and maintainability of wiring can be improved. The output end of the wiring unit is an important interface for the wiring unit to exchange signals with the outside of the packaging structure or other functional modules. The signal processed by the chip body 41 is output through the output end to an external device or other module that requires the signal, thereby realizing the functional output of the packaging structure.

[0076] In one embodiment, the first wiring layer is located on the surface of the substrate, and the active chip module 3 can be connected to the first wiring layer; the first conductive column 421 serves as a connecting bridge between the chip body 41 and the first wiring layer, realizing electrical conduction between the two, so that the signal generated by the active chip module 3 can be transmitted to the chip body 41 through the first wiring layer; the second conductive column 422 connects the chip body 41 and the second wiring layer, expanding the grounding channel of the chip body 41; the third conductive column 423 connects the chip body 41 and the output end, realizing direct signal output between the chip body 41 and the outside of the packaging structure, so that the signal processed by the chip body 41 can be quickly and accurately output to external devices or other functional modules, meeting the functional output requirements of the packaging structure.

[0077] In some embodiments, see Figure 1 The active chip module 3 includes a MEMS chip 31 . A sound inlet hole 14 is provided on the substrate 1 . The MEMS chip 31 is provided on a side of the substrate 1 facing the housing 2 and opposite to the sound inlet hole 14 .

[0078] In the above embodiment, the side of the substrate 1 facing the housing 2 forms an assembly surface, the MEMS chip 31 and the ASIC chip 32 are spaced apart on the assembly surface and electrically connected by connecting wires 33 such as gold wires, and the ASIC chip 32 is electrically connected to the substrate 1.

[0079] In one embodiment, the MEMS chip 31 and ASIC chip 32 can each be connected to the substrate 1 via respective adhesive bonds. The MEMS chip enables sound pickup within the MEMS package structure. The ASIC chip 32 is electrically connected to the substrate 1 via another connecting wire 33. The ASIC chip 32 is covered by a cover 34, enabling the ASIC chip to process electrical signals. Simultaneously, the IPD chip is connected to the wiring layer within the substrate. Furthermore, gold wires interact with the substrate 1 to achieve electrical connections between the MEMS chip, ASIC chip, and IPD chip.

[0080] See also Figure 1 MEMS chip 31 converts mechanical motion into electrical signals, enabling the MEMS package to sense external sound signals and pick up sound. ASIC chip 32 amplifies, filters, and digitizes the raw signals collected by MEMS chip 31, performing control operations based on system requirements. ASIC chip 32 is electrically connected to substrate 1, enabling electrical connection to the wiring elements on substrate 1, thus enabling system-level functionality within the entire package.

[0081] Both the MEMS chip 31 and the ASIC chip 32 generate heat during operation. The spacing setting can reduce the thermal coupling between the two, avoid the high temperature generated by the high power consumption of the ASIC chip 32 affecting the sensing accuracy of the MEMS chip 31, ensure the working environment temperature of the MEMS chip 31 is stable, and thus improve the accuracy of the sensing signal.

[0082] In the above embodiment, the sound inlet 14 is a channel for sound waves to enter the MEMS packaging structure, which enables the MEMS chip 31 to sense external sound signals, ensures the connectivity between the MEMS chip 31 and the external acoustic environment, and enables the MEMS chip 31 to normally perform its acoustic detection or collection function.

[0083] See also Figure 1 The MEMS chip 31 is arranged relative to the sound inlet 14, so that external sound waves can directly and efficiently reach the sensitive area of ​​the MEMS chip 31, reducing the path and interference of the sound waves during propagation, ensuring that the MEMS chip 31 can accurately and timely perceive external sound signals, and improving the efficiency and accuracy of sound wave collection.

[0084] In some embodiments, see Figure 1 The MEMS packaging structure also includes a waterproof module 5. A mounting groove 15 is provided on the substrate 1. The mounting groove 15 is connected to the sound inlet 14. The waterproof module 5 is provided in the mounting groove 15, and the projection of the waterproof module 5 on the substrate 1 covers the sound inlet 14.

[0085] In the above embodiment, the waterproof module 5 can be adhered to the installation groove 15 by hot-melt adhesive tape and hot-pressed, and the waterproof module 5 can be dotted or painted with sealant around to improve the reliability of waterproofing.

[0086] See also Figure 1 The waterproof module 5 is positioned within the mounting groove 15, precisely covering the sound inlet 14 and providing effective waterproof protection. The sidewalls of the mounting groove 15 act as a restraint on the waterproof module 5, preventing moisture from seeping through the edges and gaps, thereby improving the reliability and stability of the waterproofing effect. Furthermore, positioning the waterproof module 5 within the mounting groove 15 makes the surface of the substrate 1 smoother and more aesthetically pleasing, while reducing the thickness of the MEMS package structure.

[0087] At the same time, the projection of waterproof module 5 on substrate 1 covers sound inlet 14, effectively preventing the intrusion of impurities such as moisture while ensuring that sound waves can enter the package normally. Waterproof module 5 can be made of a waterproof and breathable membrane. The waterproof and breathable membrane allows sound waves to pass through while preventing liquid or gaseous moisture such as water droplets and water vapor from entering sound inlet 14, thereby protecting MEMS chip 31.

[0088] The present invention also provides a method for packaging a MEMS packaging structure, the method comprising:

[0089] S101, providing a groove in the substrate;

[0090] The recessed grooves within the substrate provide space for the passive chip module, eliminating the need for the module to occupy additional planar space on the front of the substrate. This fully utilizes the vertical space within the substrate, allowing for a more compact package structure. This helps meet the space requirements of small electronic devices and enables a more compact package design.

[0091] Moreover, the groove can position and fix the passive chip module. Embedding the passive chip module in the groove can reduce the possibility of displacement of the passive chip module due to vibration, impact and other factors during subsequent packaging processes and use, thereby improving the stability and reliability of the entire MEMS packaging structure.

[0092] S102, installing the passive chip module in the groove and setting a support plate to cover the opening of the groove;

[0093] The passive chip module is installed in the groove, achieving the integration of the passive chip module and the substrate. The passive chip module can contain components such as capacitors, inductors, and resistors, and can perform signal filtering, voltage stabilization, and matching, providing a good foundation for subsequent ASIC chip processing.

[0094] At the same time, the groove provides a relatively closed environment for the passive chip module, protecting it from external environmental factors. Moreover, the support plate covers the groove opening, providing a stable support platform for subsequent installation of components such as ASIC chips on the support plate.

[0095] S103, placing an ASIC chip on a side of the support plate away from the base plate;

[0096] The ASIC chip amplifies, filters, and performs analog-to-digital conversion on the weak signals collected by the MEMS chip, converting them into usable electrical output signals. Placing the ASIC chip on the side of the support plate away from the substrate facilitates signal exchange between the ASIC chip and the passive chip module, jointly completing the packaging structure's functionality. The support plate also serves as a positioning reference, ensuring the accurate relative positioning of the ASIC chip and the passive chip module across the thickness of the substrate, facilitating signal exchange and electrical connection between the two.

[0097] S104 , connecting the shell to the substrate to form a receiving cavity.

[0098] The accommodating cavity enclosed by the shell and the substrate provides a relatively closed environment for the module inside the packaging structure, effectively preventing external pollutants such as dust, water vapor, and chemicals from causing corrosion, short circuits, and other damage to the chip, thereby improving the reliability of the MEMS packaging structure.

[0099] An embodiment of the present application further provides an electronic device, which includes the above-mentioned MEMS packaging structure.

[0100] In the MEMS packaging structure of the electronic device, the passive chip module 4 is arranged in the groove 11, and in the thickness direction of the substrate 1, at least a portion of the passive chip module 4 is opposite to the ASIC chip 32 of the active chip module 3, so that the overall size of the MEMS packaging structure such as the MEMS microphone is reduced, and the MEMS packaging structure can be more widely used in small electronic devices.

[0101] Although some specific embodiments of the present application have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present application. It should be understood by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the present application. The scope of the present application is defined by the appended claims.

Claims

1. A MEMS packaging structure, characterized in that: include: A substrate (1), wherein a groove (11) is provided in the substrate (1); a housing (2), the housing (2) being arranged on one side of the substrate (1) and forming a receiving cavity with the substrate (1); a support plate (6), the support plate (6) being arranged in the accommodating cavity and covering the opening of the groove (11); An active chip module (3), the active chip module (3) comprising an ASIC chip (32), the ASIC chip (32) being arranged on a side of the support plate (6) away from the substrate (1); A passive chip module (4) is provided in the groove (11), and in the thickness direction of the substrate (1), at least a portion of the passive chip module (4) is opposite to the ASIC chip (32).

2. The MEMS packaging structure according to claim 1, wherein: The support plate (6) is electrically conductive, and the ASIC chip (32) is electrically connected to the substrate (1) via the support plate (6).

3. The MEMS packaging structure according to claim 1, wherein: The substrate (1) has a wiring unit therein, and the passive chip module (4) is electrically connected to the wiring unit.

4. The MEMS packaging structure according to claim 1, wherein: The passive chip module (4) includes an IPD chip.

5. The MEMS packaging structure according to claim 1, wherein: The passive chip module (4) comprises a chip body (41) and a conductor (42), one end of the conductor (42) is arranged on the chip body (41), and the other end of the conductor (42) is provided with a wiring unit electrically connected to the substrate (1).

6. The MEMS packaging structure according to claim 5, characterized in that: The wiring unit includes a first wiring layer, a second wiring layer and an output terminal; The conductor (42) includes a first conductive column (421), a second conductive column (422) and a third conductive column (423), wherein the first conductive column (421) is connected between the chip body (41) and the first wiring layer, the second conductive column (422) is connected between the chip body (41) and the second wiring layer, and the third conductive column (423) is connected between the chip body (41) and the output end.

7. The MEMS packaging structure according to claim 1, wherein: The active chip module (3) comprises a MEMS chip (31), a sound inlet hole (14) is provided on the substrate (1), and the MEMS chip (31) is arranged on a side of the substrate (1) facing the housing (2) and opposite to the sound inlet hole (14).

8. The MEMS packaging structure according to claim 7, characterized in that: The invention also includes a waterproof module (5), wherein a mounting groove (15) is provided on the substrate (1), the mounting groove (15) is communicated with the sound inlet hole (14), the waterproof module (5) is arranged in the mounting groove (15), and the projection of the waterproof module (5) on the substrate (1) covers the sound inlet hole (14).

9. A packaging method for a MEMS packaging structure, characterized in that: include: providing a groove in the substrate; Installing the passive chip module in the groove and setting a support plate to cover the opening of the groove; An ASIC chip is arranged on a side of the support plate away from the substrate; The housing is connected to the substrate to enclose a receiving cavity.

10. An electronic device, characterized in that: The MEMS packaging structure comprises the MEMS packaging structure according to any one of claims 1 to 8.

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