Wire saw cutting machine and operation method

Abstract

The fretsaw cutting machine is used for cutting crystals and comprises a feeding assembly and a sliding rail used for supporting the crystals, and the feeding assembly is in sliding connection with the sliding rail; the feeding assembly comprises a rotatable overturning piece, and the overturning piece is arranged on the side, close to the cutting position of the fret saw cutting machine, of the feeding assembly. The overturning piece can rotate to the first position, and when the overturning piece is located at the first position, the overturning piece is used for limiting the end of the crystal. The overturning piece is arranged on the feeding assembly, after the feeding assembly conveys the crystal to the cutting position, the feeding assembly slides along the sliding rail to be separated from the crystal, and the overturning piece is overturned to the first position, abuts against the end of the crystal and is limited in the movement direction of the crystal; and non-uniform cutting thickness caused by displacement or violent shaking of the crystal in the cutting process is prevented, the cutting quality is improved, and the rework rate is reduced.

Description

Technical Field

[0001] The present invention relates to the field of crystal cutting, and in particular to a wire saw cutting machine and an operating method thereof. Background Art

[0002] In the prior art, the wire saw cutting process for crystal materials is widely used in the fields of semiconductors, optoelectronics, materials science, etc., and is used to cut large-sized crystal rods or ingots into thin sheet structures to meet the needs of subsequent processes such as grinding, polishing, or device manufacturing. In the actual use of the wire saw cutting machine, the crystal is usually pushed to the cutting area by a feeding mechanism, and the finished sheet or remaining crystal rod is taken out by the taking mechanism after the cutting is completed. To ensure cutting accuracy, the crystal needs to remain in a stable state during the cutting process to avoid deviation of the cutting trajectory due to factors such as uneven force, resonance, displacement, etc., which in turn causes problems such as inconsistent wafer thickness, edge cracking, and bevel cutting.

[0003] However, in traditional wire saw cutting equipment, when the crystal is pushed to the cutting position, there is no effective stop structure set in its movement direction. The crystal is prone to shaking back and forth during the cutting process due to wire saw tension fluctuations, cutting reaction force or other vibration factors, causing the cutting line to deviate from the predetermined trajectory. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to provide a wire saw cutting machine and an operating method, so as to achieve stable positioning of the crystal during the wire saw cutting process.

[0005] In order to solve the above technical problems, the technical solution adopted by the present invention is: A wire saw cutting machine for cutting crystals, comprising a feeding assembly and a slide rail for supporting the crystals, wherein the feeding assembly is slidably connected to the slide rail; The feeding assembly includes a rotatable flip member, which is arranged on a side of the feeding assembly close to the cutting position of the wire saw cutting machine; the flip member can be rotated to a first position, and when the flip member is in the first position, the flip member is used to limit the end of the crystal.

[0006] In order to solve the above technical problems, another technical solution adopted by the present invention is: An operating method, applied to a wire saw cutting machine, comprises the steps of: Controlling the flip member to the first position; The flipping member is controlled to slide along the slide rail and abut against the end face of the crystal, so as to adjust the posture of the crystal in the wire saw cutting machine.

[0007] The beneficial effects of the present invention are: providing a wire saw cutting machine and an operating method, wherein a flipping piece is arranged on the feeding assembly, and after the feeding assembly transports the crystal to the cutting position, the feeding assembly slides along the slide rail to separate from the crystal and flips the flipping piece to the first position, abutting the end of the crystal, and limiting the movement direction of the crystal to prevent the crystal from being displaced or violently shaken during the cutting process, resulting in uneven cutting thickness, thereby improving the cutting quality and reducing the rework rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 Schematic diagram of the assembly of a wire saw cutting machine in an embodiment; Figure 2 Schematic diagram of the feeding assembly in the embodiment; Figure 3 is a schematic diagram of the flip member in the embodiment being located in the first position; Figure 4 for Figure 2 A partial enlarged view of B; Figure 5 for Figure 1 A partial enlarged view of Figure 6 is a top view of a wire saw cutting machine in an embodiment; Figure 7 Schematic diagram of the material taking component in the embodiment; Description of labels: 1. Feeding assembly; 11. Flipping member; 12. Mounting platform; 13. First driving member; 14. Limiting member; 141. Connecting plate; 142. Clamping part; 15. Second driving member; 2. Slide rail; 3. First floating support; 4. Second floating support; 5. Third driving member; 6. Retrieving assembly; 61. Suction cup member; 62. Mounting shell; 63. Receiver plate; 64. Side clamping plate; 7. Cutting position. DETAILED DESCRIPTION

[0009] To illustrate the technical content, achieved objectives and effects of the present invention in detail, the following description is given in conjunction with the embodiments and accompanying drawings.

[0010] Please refer to Figures 1 to 3 , a wire saw cutting machine for cutting crystals, comprising a feeding assembly 1 and a slide rail 2 for supporting the crystal, wherein the feeding assembly 1 is slidably connected to the slide rail 2; The feeding assembly 1 includes a rotatable flip member 11, which is arranged on a side of the feeding assembly 1 close to the cutting position 7 of the wire saw cutting machine; the flip member 11 can be rotated to a first position, and when the flip member 11 is in the first position, the flip member 11 is used to limit the end of the crystal.

[0011] As can be seen from the above description, the beneficial effects of the present invention are as follows: by providing a rotatable flip member 11 on the feed assembly 1, and rotating the flip member 11 to the first position after feeding is completed, so that it abuts against the end of the crystal, acting as a limiter during the cutting process. This structure effectively prevents the crystal from sliding along the slide rail 2 due to vibration or reaction force during the cutting process, avoiding the problem of inconsistent cutting thickness caused by displacement, thereby significantly improving cutting quality and reducing material waste and manual rework caused by repeated cutting.

[0012] The slide rail 2 may be a track with double or multiple rows of rollers evenly distributed, used to support the bottom of the crystal, and the rollers can realize the transportation of the crystal on the slide rail 2.

[0013] Specifically, in some embodiments, when the flip member 11 is in the first position, it is at least partially located above the slide rail 2. Designing the flip member 11 in the first position above the slide rail 2 allows it to exceed the structural limitations of the slide rail 2 and effectively contact the end of the crystal, thereby achieving position control. Preferably, when position control is not required, the flip member 11 is moved below the slide rail 2 to avoid interference with other components of the wire saw during transportation.

[0014] Please refer to Figures 2 to 3 In some embodiments, the feeding assembly 1 further includes a mounting platform 12 and a first driving member 13, the mounting platform 12 is slidingly connected to the slide rail 2, the first driving member 13 is connected to the mounting platform 12 and is rotationally connected to the flip member 11, and the first driving member 13 is used to rotate the flip member 11 to the first position.

[0015] As can be seen from the above description, through the coordinated cooperation of the first driving member 13 and the flipping member 11, the automatic rotation of the flipping member 11 from the initial position to the first position is realized, the intelligence level and control accuracy of the limiting structure are improved, and it is suitable for unmanned processing environments. Automatic drive avoids the errors and lags caused by manual intervention, ensures that the limiting action is completed as soon as possible after feeding, and effectively guarantees the stability of the crystal. In a specific embodiment, the first driving member 13 can be an electric push rod, a rotary servo motor or a pneumatic actuator, which is rotatably connected to the flipping member 11 through a connecting member. When the control system issues an instruction, the first driving member 13 drives the flipping member 11 to rotate to a vertical or preset angle to form a limiting surface.

[0016] In some embodiments, the feeding assembly 1 further includes two limiting members 14 , which are symmetrically arranged on both sides of the slide rail 2 and connected to the mounting platform 12 , and the limiting members 14 are used to limit the upper part of the crystal located on the slide rail 2 .

[0017] From the above description, it can be seen that by setting two symmetrical limiters 14, the upper limit of the crystal is further enhanced, and the support of the bottom slide rail 2 is used to limit the crystal in the vertical plane, further improving the stability of the crystal cutting process and ensuring cutting accuracy.

[0018] In some embodiments, the feeding assembly 1 also includes a second driving member 15 connected to the mounting platform 12, and the second driving member 15 is rotatably connected to the limit member 14 and is used to drive the limit member 14 to rotate to a second position; when the limit member 14 is in the second position, the limit member 14 is used to abut against the top of the crystal.

[0019] From the above description, it can be seen that the second driving member 15 is introduced into the limit member 14 to automate the process of flipping the limit member 14 upward to the top of the crystal and applying a clamping force, and the two limit members 14 are coordinated to control the two limit members 14 to prevent unstable behaviors such as warping and bouncing during the processing.

[0020] Please refer to 4. In some embodiments, the limiting member 14 includes a connecting plate 141 and a clamping portion 142. The connecting plate 141 is rotatably connected to the second driving member 15; the clamping portion 142 is rotatably connected to the connecting plate 141. When the limiting member 14 is located in the second position, the clamping portion 142 abuts against the top of the material and limits the material.

[0021] From the above description, it can be seen that by concretizing the structure of the limiter 14 into a two-stage mechanism of the connecting plate 141 and the clamping portion 142, and providing a rotating connection, the clamping portion 142 can be better adapted to the surface contour of the crystal and the contact stability can be enhanced; at the same time, the clamping portion 142 is rotatably connected to the rotating plate. When the clamping portion 142 abuts against the crystal, the clamping portion 142 can adaptively adjust the clamping angle according to the size of the crystal to avoid damage to the crystal during the clamping process.

[0022] Preferably, the clamping portion 142 is a V-shaped clamping plate. Setting the clamping portion 142 as a V-shaped clamping plate can achieve natural embedded positioning of cylindrical or polygonal crystal surfaces of different diameters, and can provide multi-point uniform contact to avoid local stress concentration or slippage caused by point contact.

[0023] Please refer to Figure 1 、 Figure 5 and Figure 6 In some embodiments, it also includes a first floating support 3 and a second floating support 4 for supporting the crystal, the first floating support 3 is fixedly connected to the slide rail 2 and is located at the cutting position 7 of the wire saw cutting machine; the second floating support 4 is slidably connected to the slide rail 2; the contact position of the first floating support 3 and the second floating support 4 with the crystal is located above the slide rail 2.

[0024] After the crystal is cut, some crystal segments may be too short and cannot be effectively supported on the slide rail 2, resulting in toppling or even falling. In order to solve this problem, a fixed first floating support 3 is set in the cutting area, and a slidable second floating support 4 is set on the slide rail 2. During cutting, the two ends of the cut crystal are supported respectively. After sawing, the cut crystal is supported by the first and second floating supports 4 and the slide rail 2 to ensure stability after cutting and facilitate subsequent unloading or reverse cutting operations.

[0025] Preferably, the second floating support 4 is connected to the side of the feed assembly 1 close to the wire saw cutting position 7. Connecting the second floating support 4 to the feed assembly 1 helps it move to the cutting position 7 and position itself together with the feed assembly 1, thereby ensuring that it quickly enters the supporting state after feeding, improving the efficiency and stability of the support mechanism in place after cutting.

[0026] Please refer to Figure 2 In some embodiments, the first floating support 3 and the second floating support 4 both include a third driving member 5, and the third driving member 5 is used to control the first floating support 3 and / or the second floating support 4 to approach or move away from the crystal.

[0027] From the above description, it can be seen that the third driving member 5 is provided in the floating support structure, so that the support assembly can be fine-tuned up and down, flexibly adapting to crystals of different heights or sizes, ensuring balanced contact force, and preventing cutting defects caused by uneven force on the crystal.

[0028] Please refer to Figure 7 In some embodiments, the system further includes a pick-up assembly 6, which is slidably connected to the slide rail 2. The pick-up assembly 6 and the feed assembly 1 are located on either side of the wire saw cutting position 7. A second floating support 4 is also provided on the side of the pick-up assembly 6 that is closest to the wire saw cutting position 7. In other words, floating supports are provided in the cutting area and on both sides of the cutting area to provide auxiliary support for the two crystal segments produced by cutting, preventing the cut crystals from rolling off.

[0029] Specifically, the material removal assembly 6 includes a suction cup 61, a mounting housing 62, and at least two positioning members. Two of the positioning members are located on the end face of the material removal assembly 6 facing the cutting position 7, and at least two positioning members are provided with a preset spacing in the height direction of the end face of the mounting housing 62. The positioning members are used to measure the uniformity of the material surface. The principle is that the height data obtained by multiple positioning members can be used to determine whether the material surface is tilted, undulating, or uneven, and then determine whether it is suitable for suction using the current suction cup solution, or to change the suction cup structure (such as switching to a small or flexible suction cup) to adapt to the surface conditions. The suction cup 61 and the positioning member are located on the same end face of the material removal assembly 6, and the suction cup 61 is used to absorb the cut crystal. A fourth drive member is also included, which is used to adjust the height position of the material removal assembly 6.

[0030] Preferably, the retrieving assembly 6 also includes a receiving plate 63 and two symmetrically arranged side clamps 64. The receiving plate 63 is connected to the bottom of the mounting housing 62, and the side clamps 64 are located on either side of the mounting housing 62 in the width direction. The clamping member is composed of the receiving plate 63 and two symmetrical side clamps 64. The receiving plate 63 provides bottom support, while the side clamps 64 provide left and right limited clamping, forming a three-sided support structure. This structure is suitable for various cylindrical or polygonal materials, effectively preventing lateral sliding or rotation of the materials. While maintaining a simple structure, it significantly enhances the support stability and anti-disturbance capability before adsorption.

[0031] An operating method, applied to a wire saw cutting machine, comprises the steps of: Controlling the flip member to the first position; The flipping member is controlled to slide along the slide rail and abut against the end face of the crystal, so as to adjust the posture of the crystal in the wire saw cutting machine.

[0032] From the above description, it can be seen that by controlling the flip part to flip to the first position, the flip part can be used to abut one end of the crystal, thereby limiting the end face of the crystal to prevent the crystal from tipping in a certain direction, avoiding accidents on the slide rail or other receiving objects of the processed crystal, causing the device to stop working, and improving the stability of the wire saw cutting machine operation.

[0033] Preferably, the feeding assembly and the picking assembly can cooperate to pick irregular crystals. For example, the front end of the crystal itself is a cone. After the cone is cut off, the material itself is irregular and is prone to tipping or sinking on the slide rail. At the same time, since the cone surface itself is difficult to limit and unload using the original suction cup or clamping assembly (i.e., the head material unloading process), the present embodiment provides a method for unloading the irregular crystals mentioned above, and the steps are as follows: Controlling the material taking assembly to rise so that the receiving plate abuts against the bottom end of the crystal; The side clamps of the material taking assembly are controlled to clamp the crystal, and the flip member is driven to abut against the rear end of the crystal, and the flip member is used to adjust the posture of the crystal in the clamping state of the side clamps.

[0034] From the above description, it can be seen that for irregular crystals (such as cutting head materials), the receiving plate in the feeding assembly is first used to abut the bottom end of the crystal, and then the side clamps are used to limit the crystal on both sides of the crystal. However, since the irregular crystal may be tilted or other clamping is unstable at this time, the flip part is used to abut the cut end face of the crystal and the flip part is used to abut the crystal end face to adjust the crystal posture, correct the tilt or collapse of the crystal, and ensure stable unloading of irregular crystals.

[0035] In some embodiments, the wire saw cutting machine performs the following cutting method: Controlling the material taking component 6 to move closer to or farther from the cutting position 7 along the slide rail 2, and / or controlling the material taking component 6 to adjust its position in the height direction; Control the feeding assembly 1 to move closer to or farther from the cutting position 7 .

[0036] As can be seen from the above description, the wire saw cutter achieves precise control over the crystal placement process by controlling the pick-up assembly 6 to move closer to or further away from the cutting position 7 along the slide rail 2 and / or adjusting the height of the pick-up assembly 6, effectively improving the degree of automation and operational stability during the crystal placement, placement, and pre-cutting positioning stages. The movement of the pick-up assembly 6 along the slide rail 2 allows it to adapt to the handling requirements of crystals of different positions or lengths, making it particularly suitable for multi-station assembly line crystal processing systems. The height adjustment capability further enhances the requirements of processes such as unloading, for example: When the wire saw cutting machine needs to unload materials, the suction cup 61 of the material-picking component 6 is controlled to adsorb the crystal and move along the slide rail 2 to the unloading area. After that, the material-picking component 6 is controlled to rise to a height that can avoid the crystal, and then move to the front of the crystal and then descend. The pushing structure (such as a push plate, etc.) set at the tail end of the material-picking component 6 is used to push the material to the unloading area at the end of the slide rail 2.

[0037] Also, for the slicing process, during the slicing process, the suction cup component 61 adsorbs the crystal surface. After the slicing is completed, the material removal component 6 rises to a preset height, thereby breaking the water film force between the slice and the remaining crystal, and then retreats to the unloading area to unload the slice.

[0038] The above method further includes: The flip member 11 of the feeding assembly 1 is controlled to rotate to a first position; when the flip member 11 is located at the first position, the flip member 11 is at least partially located above the slide rail 2 .

[0039] From the above description, it can be seen that when the crystal is cut, in order to maintain the stability of the cutting, the flip member rotated to the first position is used to abut the end of the crystal, limiting the length direction of the crystal to prevent the crystal from shaking or displacement during the cutting process.

[0040] In summary, the present invention provides a wire saw cutting machine, which realizes full-process stable control and intelligent operation in the crystal cutting process by introducing a variety of coordinated control mechanisms in the feeding component, the material taking component and the support structure, and significantly improves the efficiency and accuracy of crystal processing. The wire saw cutting machine is provided with a rotatable flip part, and after the feeding is completed, it rotates to the end of the crystal to form a rigid limit, which can effectively offset the crystal displacement caused by stress or mechanical vibration during the cutting process, thereby ensuring the stability of the cutting line position and improving the consistency of the cutting thickness. When not in use, the flip part can be moved to the bottom of the slide rail to avoid interference and further optimize the spatial layout. At the same time, the multiple limiters in the feeding component can be flipped upward to the top of the crystal and pressed, and the rotating structure of the clamping part and the V-shaped splint design can be used to enhance the stability of the crystal in the vertical direction, adapt to crystals of different diameters, and improve the versatility of the system.

[0041] In terms of crystal support, the first and second floating supports are set to lift the two ends of the crystal, and the height is adjusted by the third drive component to prevent the cut crystal from tipping over due to insufficient support, effectively ensuring the integrity of the cut crystal. On the other hand, the material-retrieving component is combined with the clamping structure through a suction cup component, and cooperates with multiple positioning parts to detect the uniformity of the crystal surface, thereby improving the adaptability of the crystal before adsorption, and realizing automatic operations such as unloading and film breaking through height adjustment and slide rail sliding, reducing manual participation. Finally, through the coordinated control of the feeding component and the material-retrieving component, the entire process of crystal positioning, cutting, segmentation, and unloading is realized. It not only reduces the crystal loss rate and rework rate, but also improves the general adaptability and intelligence level of the equipment, which is suitable for crystal processing scenarios with high efficiency and high precision requirements.

[0042] The above descriptions are merely embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent transformations made using the contents of the present invention's description and drawings, or directly or indirectly applied in related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A wire saw cutting machine for cutting crystals, characterized in that: It comprises a feeding assembly and a slide rail for supporting the crystal, wherein the feeding assembly is slidably connected to the slide rail; The feeding assembly includes a rotatable flip member, which is arranged on a side of the feeding assembly close to the cutting position of the wire saw cutting machine; the flip member can be rotated to a first position, and when the flip member is in the first position, the flip member is used to limit the end of the crystal.

2. The wire saw cutting machine according to claim 1, characterized in that: The feeding assembly also includes a mounting platform and a first driving member, the mounting platform is slidably connected to the slide rail, the first driving member is connected to the mounting platform and is rotationally connected to the flip member, and the first driving member is used to rotate the flip member to the first position.

3. The wire saw cutting machine according to claim 2, characterized in that: The feeding assembly further includes two limiting members, which are symmetrically arranged on both sides of the slide rail and connected to the mounting platform. The limiting members are used to limit the position of the crystal above the slide rail.

4. The wire saw cutting machine according to claim 3, characterized in that: The feeding assembly also includes a second driving member connected to the mounting platform, the second driving member is rotatably connected to the limit member and is used to drive the limit member to rotate to a second position; when the limit member is in the second position, the limit member is used to abut against the top of the crystal.

5. The wire saw cutting machine according to claim 4, characterized in that: The limiting member includes a connecting plate and a clamping portion, the connecting plate is rotatably connected to the second driving member; the clamping portion is rotatably connected to the connecting plate, and when the limiting member is located at the second position, the clamping portion abuts against the top of the material and limits the material.

6. The wire saw cutting machine according to claim 1, characterized in that: It also includes a first floating support and a second floating support for supporting the crystal, the first floating support is fixedly connected to the slide rail and is located at the cutting position of the wire saw cutting machine; the second floating support is slidably connected to the slide rail; the contact position of the first floating support and the second floating support with the crystal is located above the slide rail.

7. The wire saw cutting machine according to claim 6, characterized in that: The second floating support is connected to a side of the feeding assembly close to the cutting position of the wire saw cutting machine.

8. A wire saw cutting machine according to any one of claims 6-7, characterized in that: The first floating support and the second floating support each include a third driving member, and the third driving member is used to control the first floating support and / or the second floating support to approach or move away from the crystal.

9. The wire saw cutting machine according to claim 1, characterized in that: When the flip member is located at the first position, the flip member is at least partially located above the slide rail.

10. An operating method, characterized in that: A wire saw cutting machine according to any one of claims 1 to 9, comprising the steps of: Controlling the flip member to the first position; The flipping member is controlled to slide along the slide rail and abut against the end face of the crystal, so as to adjust the posture of the crystal in the wire saw cutting machine.

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