Wafer array type multi-wire cutting device

Abstract

The utility model relates to the field of optics, and discloses a wafer array type multi-wire cutting device which comprises a machine body, and a roller is arranged at the front end of the machine body. The mortar spraying assembly comprises a rectangular box and a connecting arm, the bottom end of the rectangular box is open, and a first spraying unit and two sets of second spraying units are arranged in a cavity of the rectangular box; and a position adjusting unit is arranged between the two second spraying units and the rectangular box and comprises a servo motor, a rotating shaft and a moving seat. The position adjusting unit is arranged between the two sets of second spraying units and the rectangular box, so that the positions between the two sets of second spraying units and the rectangular box can be adjusted, the positions of the two sets of second spraying units are adjusted according to the size of an actual machined part, and it is guaranteed that mortar is reasonably and evenly distributed on the workpiece in the cutting process; and the stability of cutting quality is ensured.

Description

Technical Field

[0001] This utility model relates to the field of optics, and in particular to a wafer array multi-wire cutting device. Background Technology

[0002] A wafer array multi-wire dicing device, also known as a wafer multi-wire dicing machine, can be used to cut optical glass of various specifications, such as raw materials for optical components like lenses and prisms.

[0003] For example, utility model application CN202122796557.9 discloses a multi-wire cutting machine for processing piezoelectric quartz wafers, including a platform. An organic body is fixedly installed on the top of the platform. An electric telescopic rod is fixedly installed on the outer side of the platform. A bracket is fixedly installed on the top of the electric telescopic rod. A tray is slidably connected to the inner side of the tray. Placement frames are symmetrically fixedly installed on the surface of the tray. A support structure is provided on the outer side of the platform. A sliding rod is fixedly installed at the bottom of the bracket. A slider is slidably connected to the surface of the sliding rod.

[0004] For optical glass in the field of optics, the size and volume of the processed parts are usually different and there are many types. However, the existing mortar spraying components are usually fixedly installed, while the shapes of the processed parts to be cut may be different. There may be unreasonable nozzle positions, which will cause the sprayed mortar to be unevenly distributed on the processed parts, affecting the amount of sand on the cutting line and thus reducing the cutting quality.

[0005] Therefore, those skilled in the art have provided a wafer array multi-wire dicing apparatus to solve the problems mentioned in the background art. Utility Model Content

[0006] To address the shortcomings of existing technologies, this invention provides a wafer array multi-wire cutting device, which solves the problems mentioned in the background section.

[0007] To achieve the above objectives, the present invention adopts the following technical solution:

[0008] A wafer array multi-wire cutting device includes: a body with a roller at its front end; a slurry spraying assembly disposed at the front end of the body for spraying cutting fluid, the slurry spraying assembly including a rectangular box and a connecting arm, the bottom of the rectangular box being open, a first spraying unit and two sets of second spraying units disposed within the cavity of the rectangular box, the first spraying unit being fixedly installed at the center of the cavity of the rectangular box, and the two sets of second spraying units being located on both sides of the first spraying unit; a position adjustment unit is disposed between the two sets of second spraying units and the rectangular box for adjusting the position of the two sets of second spraying units, the position adjustment unit including a servo motor, a rotating shaft and a moving base, the moving base being fixedly installed at the top of the corresponding second spraying unit, the rotating shaft movably passing through the corresponding moving base, and the rotating shaft and the moving base being in a transmission engagement; one end of the connecting arm is movably engaged within the cavity of the body, and the height of the connecting arm is adjustable.

[0009] According to the wafer array multi-wire cutting device, the connecting arm is L-shaped, one end of the connecting arm is fixedly installed on the top of the rectangular box, and the other end of the connecting arm is fixedly connected to a baffle. A rectangular groove is opened at the front end of the machine body, and the baffle is movably engaged in the rectangular groove.

[0010] According to the wafer array multi-wire cutting device, the connecting arm is hollow, and a first telescopic tube is connected through one end of the connecting arm. A protrusion is fixedly installed on one end of the baffle inside the machine body cavity. An electric lift is fixedly installed inside the machine body cavity, and the telescopic end of the electric lift is fixedly connected to the protrusion.

[0011] According to the wafer array multi-wire cutting device, a limiting groove is formed between the cavity and the outer wall of the rectangular box. A slider is movably engaged in the limiting groove, and a guide rod is also fixedly installed in the limiting groove, with the guide rod moving through the slider.

[0012] According to the wafer array multi-wire cutting device, the first spraying unit and the second spraying unit have the same structure. The second spraying unit includes a liquid storage box and multiple sets of nozzles. A second telescopic tube is connected through the top of the liquid storage box. The other end of the second telescopic tube is connected through the connecting arm. The front and rear ends of the liquid storage box are fixedly connected to the corresponding sliders. A movable seat is fixedly installed on the top of the liquid storage box.

[0013] According to the wafer array multi-wire cutting device, the rotating shaft is movably installed in the rectangular box cavity, and a set of reverse threads are opened on both sides of the outer wall of the rotating shaft. Two sets of movable seats are located at both ends of the rotating shaft, and the rotating shaft and the two sets of movable seats are connected by threads.

[0014] According to the wafer array multi-wire cutting device, a driven wheel is fixedly inserted through the center of the rotating shaft, a servo motor is fixedly installed at the top of the rectangular box, the output end of the servo motor is fixedly connected to the main shaft, the main shaft is fixedly inserted through the driving wheel, a movable cavity is opened at the top of the rectangular box, and a belt is sleeved between the driving wheel and the driven wheel, the belt moving through the movable cavity.

[0015] This invention provides a wafer array multi-wire dicing device. It has the following advantages:

[0016] (1) During the cutting of optical glass, the slurry sprayed by the slurry spraying component can reduce the frictional heat between the diamond wire and the workpiece, prevent material thermal damage, and enhance the cutting ability and wash away the debris generated during cutting. However, existing slurry spraying components are usually fixedly installed, and the shapes of the workpieces to be cut may vary, which may result in unreasonable nozzle positions. This application sets the slurry spraying component to include a rectangular box and a connecting arm. The rectangular box cavity is provided with a first spraying unit and two sets of second spraying units. The first spraying unit is fixedly installed in the middle position of the rectangular box cavity, and the two sets of second spraying units are located on both sides of the first spraying unit. A position adjustment unit is set between the two sets of second spraying units and the rectangular box, so that the position between the two sets of second spraying units and the rectangular box can be adjusted. The position of the two sets of second spraying units can be adjusted according to the actual size of the workpiece to ensure that the slurry is reasonably and evenly distributed on the workpiece during the cutting process, and to ensure the stability of the cutting quality.

[0017] (2) When adjusting the position of the liquid storage box, the servo motor drives the spindle to rotate. The driven wheel is fixedly passed through the center of the rotating shaft, and the driving wheel is fixedly passed through the spindle. A belt is sleeved between the driving wheel and the driven wheel, thereby driving the rotating shaft to rotate. A set of reverse threads are opened on both sides of the outer wall of the rotating shaft. Two sets of moving seats are located at both ends of the rotating shaft. The rotating shaft and the two sets of moving seats are connected by threads. The moving seats are fixedly connected to the corresponding liquid storage boxes. The rotation of the rotating shaft makes the two sets of liquid storage boxes move closer or further away from each other. The position of the liquid storage box is adjusted according to the size of the workpiece. Attached Figure Description

[0018] Figure 1 This is a three-dimensional structural diagram of a wafer array multi-wire cutting device according to the present invention;

[0019] Figure 2 This is a three-dimensional structural diagram of the slurry spraying component of a wafer array multi-wire cutting device according to this utility model. Figure 1 ;

[0020] Figure 3 This is a three-dimensional structural diagram of the slurry spraying component of a wafer array multi-wire cutting device according to this utility model. Figure 2 ;

[0021] Figure 4 This is a bottom view schematic diagram of the slurry spraying component of a wafer array multi-wire cutting device according to the present invention;

[0022] Figure 5 This is a three-dimensional structural diagram of the second spraying unit of a wafer array multi-wire cutting device according to the present invention;

[0023] Figure 6 This is a three-dimensional structural diagram of the position adjustment unit of a wafer array multi-wire cutting device according to the present invention.

[0024] Legend:

[0025] 10. Machine body; 11. Roller; 12. Mortar spraying assembly; 13. Rectangular box; 14. Connecting arm; 15. Limiting groove; 16. Guide rod; 17. Position adjustment unit; 18. Baffle; 19. First telescopic tube; 20. Electric lifting rod; 21. First spraying unit; 22. Second spraying unit; 23. Liquid storage box; 24. Second telescopic tube; 25. Moving seat; 26. Nozzle; 27. Slider; 28. Rotary shaft; 29. ​​Driven wheel; 30. Servo motor; 31. Main shaft; 32. Drive wheel; 33. Belt. Detailed Implementation

[0026] like Figure 1-6 As shown: A wafer array type multi-wire cutting device includes: a body 10, with an 11 at the front end of the body 10; a slurry spraying assembly 12, which is disposed at the front end of the body 10 and is used to spray cutting fluid. The slurry spraying assembly 12 includes a rectangular box 13 and a connecting arm 14. The bottom end of the rectangular box 13 is open. A first spraying unit 21 and two sets of second spraying units 22 are disposed inside the cavity of the rectangular box 13. The first spraying unit 21 is fixedly installed in the middle position inside the cavity of the rectangular box 13, and the two sets of second spraying units 22 are located at... On both sides of the first spraying unit 21; a position adjustment unit 17 is provided between the two sets of second spraying units 22 and the rectangular box 13 for adjusting the position of the two sets of second spraying units 22. The position adjustment unit 17 includes a servo motor 30, a rotating shaft 28 and a moving seat 25. The moving seat 25 is fixedly installed on the top of the corresponding second spraying unit 22. The rotating shaft 28 moves through the corresponding moving seat 25 and the rotating shaft 28 and the moving seat 25 are in a transmission cooperation; one end of the connecting arm 14 is movably engaged in the cavity of the machine body 10, and the height of the connecting arm 14 can be adjusted.

[0027] It is worth noting that the machine body 10 is based on a prior art multi-wire cutting machine for processing piezoelectric quartz wafers (publication number: CN216230165U). The machine body 10 is also equipped with a sandblasting container and a delivery pump. The slurry is delivered from the sandblasting container to the first telescopic tube 19 through the delivery pump.

[0028] Specifically, during the cutting of optical glass, the slurry sprayed by the slurry spraying assembly 12 can reduce the frictional heat between the diamond wire and the workpiece, prevent thermal damage to the material, and enhance cutting ability and flush away the debris generated during cutting. However, existing slurry spraying assemblies 12 are usually fixedly installed, and the shapes of the workpieces being cut may vary, which may result in unreasonable nozzle 26 positions. This application addresses this by setting the slurry spraying assembly 12 to include a rectangular box 13 and a connecting arm 14, with a first spraying unit 21 disposed within the cavity of the rectangular box 13. The rectangular box 13 is equipped with two sets of second spraying units 22. The first spraying unit 21 is fixedly installed in the middle of the cavity of the rectangular box 13. The two sets of second spraying units 22 are located on both sides of the first spraying unit 21. A position adjustment unit 17 is set between the two sets of second spraying units 22 and the rectangular box 13, so that the position between the two sets of second spraying units 22 and the rectangular box 13 can be adjusted. The position of the two sets of second spraying units 22 is adjusted according to the actual size of the workpiece to ensure that the mortar is reasonably and evenly distributed on the workpiece during the cutting process, and to ensure the stability of the cutting quality.

[0029] The connecting arm 14 is L-shaped. One end of the connecting arm 14 is fixedly installed on the top of the rectangular box 13, and the other end of the connecting arm 14 is fixedly connected to a baffle 18. A rectangular groove is opened at the front end of the machine body 10, and the baffle 18 is movably engaged in the rectangular groove. The connecting arm 14 is hollow, and a first telescopic tube 19 is connected through one end of the connecting arm 14. A protrusion is fixedly installed at one end of the baffle 18 inside the cavity of the machine body 10. An electric lift 20 is fixedly installed inside the cavity of the machine body 10, and the telescopic end of the electric lift 20 is fixedly connected to the protrusion.

[0030] Specifically, one end of the connecting arm 14 is fixedly connected to the rectangular box 13, and the other end of the connecting arm 14 is fixedly connected to the baffle 18. The baffle 18 is movably engaged in the rectangular groove at the front end of the machine body 10. An electric lifting rod 20 and a protrusion are set to drive the rectangular box 13 to rise and fall synchronously through the lifting of the baffle 18.

[0031] A limiting groove 15 is formed between the cavity and the outer wall of the rectangular box 13. A slider 27 is movably engaged in the limiting groove 15. A guide rod 16 is also fixedly installed in the limiting groove 15, and the guide rod 16 movably passes through the slider 27.

[0032] Specifically, a limiting groove 15 is provided between the cavity and the outer wall of the rectangular box 13. A slider 27 is movably engaged in the limiting groove 15. A guide rod 16 is also fixedly installed in the limiting groove 15. The guide rod 16 movably passes through the slider 27. The slider 27 is fixedly connected to both sides of the liquid storage box 23, thereby limiting and guiding the movement of the liquid storage box 23.

[0033] The first spraying unit 21 and the second spraying unit 22 have the same structure. The second spraying unit 22 includes a liquid storage box 23 and multiple sets of nozzles 26. The top end of the liquid storage box 23 is connected to a second telescopic tube 24, and the other end of the second telescopic tube 24 is connected to a connecting arm 14. The front and rear ends of the liquid storage box 23 are fixedly connected to the corresponding sliders 27. A movable seat 25 is fixedly installed on the top end of the liquid storage box 23.

[0034] Specifically, by setting the first spraying unit 21 and the second spraying unit 22 to have the same structure, the mortar enters the cavity of the liquid storage box 23 through the second telescopic tube 24 and is sprayed out from the nozzle 26. The front and rear ends of the liquid storage box 23 are fixedly connected to the corresponding sliders 27, so that the liquid storage box 23 moves along the direction of the guide rod 16 during the movement.

[0035] A rotating shaft 28 is movably installed inside the cavity of a rectangular box 13. A set of reverse threads is formed on both sides of the outer wall of the rotating shaft 28. Two sets of movable seats 25 are located at both ends of the rotating shaft 28, and the rotating shaft 28 and the two sets of movable seats 25 are connected by threads. A driven wheel 29 is fixedly inserted through the center of the rotating shaft 28. A servo motor 30 is fixedly installed at the top of the rectangular box 13. The output end of the servo motor 30 is fixedly connected to a main shaft 31, which is fixedly inserted through a driving wheel 32. A movable cavity is formed at the top of the rectangular box 13. A belt 33 is fitted between the driving wheel 32 and the driven wheel 29, and the belt 33 movably passes through the movable cavity.

[0036] Specifically, when adjusting the position of the liquid storage box 23, the servo motor 30 drives the main shaft 31 to rotate. The driven wheel 29 is fixedly passed through the center of the rotating shaft 28, and the main shaft 31 is fixedly passed through the driving wheel 32. A belt 33 is sleeved between the driving wheel 32 and the driven wheel 29, thereby driving the rotating shaft 28 to rotate. A set of reverse threads are opened on both sides of the outer wall of the rotating shaft 28. Two sets of moving seats 25 are located at both ends of the rotating shaft 28. The rotating shaft 28 and the two sets of moving seats 25 are connected by threads. The moving seats 25 are fixedly connected to the corresponding liquid storage box 23. The rotation of the rotating shaft 28 causes the two sets of liquid storage boxes 23 to move closer or further away from each other. The position of the liquid storage box 23 is adjusted according to the size of the workpiece.

[0037] The working principle of the wafer array multi-wire cutting device of this application is as follows: This application sets up a slurry spraying assembly 12, which includes a rectangular box 13 and a connecting arm 14. The rectangular box 13 is equipped with a first spraying unit 21 and two sets of second spraying units 22. The first spraying unit 21 is fixedly installed in the middle position of the cavity of the rectangular box 13. The two sets of second spraying units 22 are located on both sides of the first spraying unit 21. A position adjustment unit 17 is set between the two sets of second spraying units 22 and the rectangular box 13, so that the position between the two sets of second spraying units 22 and the rectangular box 13 can be adjusted. The position of the two sets of second spraying units 22 is adjusted according to the actual size of the workpiece to ensure that the slurry is reasonably and evenly distributed on the workpiece during the cutting process, and to ensure the stability of the cutting quality.

[0038] The circuits, electronic components, and modules involved are all existing technologies, which can be fully implemented by those skilled in the art, and need not be elaborated upon. The content protected by this utility model does not involve any improvement to the software and methods.

[0039] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model.

Claims

1. A wafer array type multi-wire dicing device, characterized in that, include: Body (10), the front end of which is provided with a roller (11); The mortar spraying assembly (12) is located at the front end of the machine body (10) and is used to spray cutting fluid. The mortar spraying assembly (12) includes a rectangular box (13) and a connecting arm (14). The bottom end of the rectangular box (13) is open. The cavity of the rectangular box (13) is provided with a first spraying unit (21) and two sets of second spraying units (22). The first spraying unit (21) is fixedly installed in the middle position of the cavity of the rectangular box (13), and the two sets of second spraying units (22) are located on both sides of the first spraying unit (21). A position adjustment unit (17) is provided between the two sets of second spraying units (22) and the rectangular box (13) for adjusting the position of the two sets of second spraying units (22). The position adjustment unit (17) includes a servo motor (30), a rotating shaft (28) and a moving seat (25). The moving seat (25) is fixedly installed on the top of the corresponding second spraying unit (22). The rotating shaft (28) moves through the corresponding moving seat (25). The rotating shaft (28) and the moving seat (25) are in a transmission cooperation. One end of the connecting arm (14) is movably engaged in the cavity of the body (10), and the height of the connecting arm (14) can be adjusted.

2. The wafer array multi-wire dicing apparatus according to claim 1, characterized in that: The connecting arm (14) is L-shaped. One end of the connecting arm (14) is fixedly installed on the top of the rectangular box (13), and the other end of the connecting arm (14) is fixedly connected to a baffle (18). A rectangular groove is opened at the front end of the body (10), and the baffle (18) is movably engaged in the rectangular groove.

3. The wafer array multi-wire dicing apparatus according to claim 1, characterized in that: The connecting arm (14) is hollow, and a first telescopic tube (19) is connected through one end of the connecting arm (14). A protrusion is fixedly installed at one end of the baffle (18) inside the cavity of the body (10). An electric lift (20) is fixedly installed inside the cavity of the body (10), and the telescopic end of the electric lift (20) is fixedly connected to the protrusion.

4. The wafer array multi-wire dicing apparatus according to claim 1, characterized in that: A limiting groove (15) is provided between the cavity and the outer wall of the rectangular box (13). A slider (27) is movably engaged in the limiting groove (15). A guide rod (16) is also fixedly installed in the limiting groove (15). The guide rod (16) movably passes through the slider (27).

5. The wafer array multi-wire dicing apparatus according to claim 1, characterized in that: The first spraying unit (21) and the second spraying unit (22) have the same structure. The second spraying unit (22) includes a liquid storage box (23) and multiple sets of nozzles (26). The top of the liquid storage box (23) is connected to a second telescopic tube (24). The other end of the second telescopic tube (24) is connected to a connecting arm (14). The front and rear ends of the liquid storage box (23) are fixedly connected to the corresponding sliders (27). A movable seat (25) is fixedly installed on the top of the liquid storage box (23).

6. The wafer array multi-wire dicing apparatus according to claim 1, characterized in that: The rotating shaft (28) is movably installed in the cavity of the rectangular box (13). A set of reverse threads are provided on both sides of the outer wall of the rotating shaft (28). Two sets of movable seats (25) are located at both ends of the rotating shaft (28). The rotating shaft (28) and the two sets of movable seats (25) are connected by threads.

7. The wafer array multi-wire dicing apparatus according to claim 6, characterized in that: A driven wheel (29) is fixedly inserted through the center of the rotating shaft (28). A servo motor (30) is fixedly installed on the top of the rectangular box (13). The output end of the servo motor (30) is fixedly connected to a main shaft (31). The main shaft (31) is fixedly inserted through the driving wheel (32). A movable cavity is opened at the top of the rectangular box (13). A belt (33) is sleeved between the driving wheel (32) and the driven wheel (29). The belt (33) moves through the movable cavity.

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