Binding method for aluminum-scandium alloy target material and aluminum alloy back plate

Abstract

The invention discloses a method for binding an aluminum-scandium alloy target material and an aluminum alloy back plate, which comprises the following steps of: firstly respectively carrying out surface grinding, oil removal, cleaning and pretreatment on the aluminum-scandium alloy target material and the aluminum alloy back plate, and then carrying out diffusion welding treatment by adopting SPS equipment, so as to obtain a target material and back plate binding assembly with the welding rate of more than 98% and the bonding strength of more than 60 MPa. The aluminum-scandium target material binding assembly obtained through the method is high in welding rate and bonding strength, has the advantages of being simple in technological process, easy in parameter control, short in production period and the like, and is suitable for industrial popularization.

Description

Technical Field

[0001] The invention belongs to the technical field of target material preparation, and in particular relates to a method for binding an aluminum-scandium alloy target material and an aluminum alloy back plate. Background Art

[0002] Compared with AlN, ZnO, and PZT films, AlScN films have a higher piezoelectric coefficient and a simpler manufacturing process. In addition, as the Sc content increases, its piezoelectric coefficient will also increase. It is the core of the new generation of piezoelectric MEMS devices. AlSc alloy is a key material for the preparation of AlScN films for high-end filters. As a sputtering target, AlSc alloy needs to be fixed on the sputtering equipment. At the same time, it needs to be conductive during the sputtering process, which will generate a certain amount of heat. Therefore, the AlSc alloy target must be bound to the backplate, and the backplate is used to support, conduct electricity, and dissipate heat for the target. However, the binding of AlSc alloy targets faces many technical bottlenecks. For example, the target material may crack during the bonding process. This is due to the low solid solubility of the Sc element in Al. As the Sc content increases, a large amount of intermetallic compounds (such as Al3Sc, Al2Sc, and AlSc) will precipitate in the target material, causing the target material to become hard and brittle, and prone to cracking during the bonding process. At the same time, brazing the target material to the backing plate is difficult. This is because the increase in Sc content also significantly reduces the wettability between the AlSc alloy and the solder (generally molten In), resulting in unsatisfactory brazing bonding and seriously reducing the bonding quality between the target material and the backing plate. Therefore, how to achieve high-quality bonding between AlSc alloy targets with different Sc contents and backing plates has become a key common technical problem that the industry urgently needs to overcome.

[0003] The Chinese patent application "Diffusion welding method of high-scB content aluminum-scB alloy target and prepared welding assembly" (application number: 202110062328.6) discloses a method for diffusion welding of high-scB content (Sc≥20 at.%) aluminum-scB alloy target and prepared welding assembly. The method includes: first ultrasonically cleaning the high-scB content aluminum-scB alloy target blank to be diffusion welded, then performing surface roughening treatment on the welding surface, and then cold spraying Al alloy or Cu alloy on the welding surface of the aluminum-scB alloy target blank, and then low-temperature heat treatment of the sprayed aluminum-scB alloy target to promote the diffusion of the AlSc alloy target blank and the sprayed backing plate, increase the welding strength of the AlSc alloy target, and finally mechanically processing the heat-treated aluminum-scB alloy target to obtain a crack-free high-Sc content AlSc alloy target diffusion welding assembly. Although this diffusion welding method has the advantages of high bonding strength (70~90MPa) and high welding rate, it requires surface roughening and cold spraying of the target material welding surface, as well as subsequent heat treatment and machining. The overall process is relatively complicated, and the heat treatment time is 2~6 hours, which is time-consuming and inefficient.

[0004] The Chinese patent application "A diffusion welding method for aluminum-scandium alloy targets" (application number: 202110719934.0) discloses a diffusion welding method for aluminum-scandium alloy targets (Sc content is 8~20 at.%). The method includes: first, the welding surface of the prepared aluminum-scandium alloy target and the back plate is polished, and the aluminum-scandium alloy target and the back plate are cleaned, and then the aluminum-scandium alloy target and oxygen-free copper or aluminum alloy are placed in a metal sheath for degassing (keeping warm for 2~4 hours), and then the metal sheath is vacuumed and sealed, and finally the metal sheath is hot isostatically pressed to complete the diffusion welding of the aluminum-scandium alloy target. During the hot isostatic pressing process, the metal sheath is heated and pressurized to 400~580 ℃ and 60~80 MPa, kept warm and pressurized for 1~2 hours, and cooled to room temperature with the furnace. Although the hot isostatic pressing diffusion welding method can prevent oxidation of the aluminum-scandium target and backing plate, the pressure required for hot isostatic pressing is very high (60-80 MPa), which poses a great risk of cracking the aluminum-scandium alloy target. In addition, the process is complex, time-consuming, and has low production efficiency.

[0005] The Chinese patent application "A Brazing Method for Aluminum-Sc Alloy Targets" (Application Number: 202110612734.5) discloses a brazing method for aluminum-Sc alloy targets. The method comprises: heating the aluminum-Sc alloy target and a backing plate, placing a brazing filler metal (In, Sn, or a Sn alloy) on the welding surfaces of the aluminum-Sc alloy target and the backing plate, and ultrasonically wetting the welding surfaces after the brazing filler metal melts. After the wetting is complete, a metal wire is placed on the welding surface of the backing plate, and the aluminum-Sc alloy target is fastened to the backing plate. Pressure is continuously applied, and heating is stopped and cooled to obtain a welded target assembly. The brazing equipment requirements are low, the operation is simple, and the backing plate is recyclable. However, the brazing filler metal used is a soft solder, and the bonding strength of the binding parts (10-50 MPa) is lower than that of the diffusion welding process. Furthermore, the melting point of the solder filler metal is relatively low (<300°C). Prolonged or high-power sputtering can easily cause the solder filler metal to melt, resulting in target material detachment and production accidents.

[0006] To address the challenges of existing diffusion welding processes, which include cumbersome steps, long thermal diffusion holding times, and a high risk of target cracking, as well as low bond strength and easy melting of the brazing filler metal under high-temperature operating conditions, this present invention achieves efficient, high-quality bonding of an aluminum-scandium alloy target to an aluminum alloy backing plate through innovative surface treatment and bonding processes. This invention leverages the synergistic effects of pulsed current heating, axial pressure, and plasma activation in spark plasma sintering (SPS) equipment to promote atomic interdiffusion at the target and backing plate interface, thereby achieving high-quality diffusion welding. Furthermore, it combines the advantages of simple target and backing plate surface treatment, high welding efficiency (holding time of only 10-20 minutes), and low axial pressure (1-6 MPa). The bonded target does not crack, and the target and backing plate weld rate is high, with strong bonding strength. This innovative solution for efficient, high-quality bonding of aluminum-scandium alloy targets has significant engineering application value. Summary of the Invention

[0007] In response to the shortcomings of existing aluminum-scandium alloy target and aluminum alloy backplate binding technology, the present invention provides an efficient and high-quality aluminum-scandium alloy target and aluminum alloy backplate binding method. After binding, the welding bonding rate of the target and the backplate is greater than 98%, and the bonding strength is greater than 60 MPa.

[0008] To achieve the above object, the present invention adopts the following technical solutions: A method for binding an aluminum-scandium alloy target and an aluminum alloy backing plate, comprising the following steps: 1) Surface grinding: Grind the surface of the aluminum-scandium alloy target and the surface of the aluminum alloy backing plate separately; 2) Degreasing and cleaning: Soak the target and backing plate after surface grinding in acetone and remove the oil by ultrasonic vibration. Then rinse with deionized water and blow dry. 3) Pretreatment: Soak the cleaned target and backing plate in NaOH solution and HNO3 solution respectively, rinse with deionized water and anhydrous ethanol, and then blow dry; 4) Diffusion welding: The pre-treated target and backing plate are buckled together to form a component to be bonded, placed in a graphite mold, and then placed in a spark plasma sintering (SPS) device for diffusion welding. After cooling to room temperature with the furnace, it is taken out.

[0009] The following are preferred technical solutions of the present invention, but are not intended to limit the technical solutions provided by the present invention. Through the following technical solutions, the technical objectives and beneficial effects of the present invention can be better achieved and realized.

[0010] As a preferred technical solution of the present invention, the scandium content in the aluminum-scandium alloy target is 5-45 at.%.

[0011] As a preferred technical solution of the present invention, the aluminum alloy backplane is made of 6061 aluminum alloy. This is because its thermal expansion coefficient is close to that of the AlSc alloy target, its strength can meet the backplane support requirements, and it has low density, light weight, good electrical and thermal conductivity, and good corrosion resistance.

[0012] As a preferred technical solution of the present invention, the roughness Ra of the surface of the aluminum-scandium alloy target and the surface of the aluminum alloy backing plate after grinding in step 1) are both 0.5-1.2 μm.

[0013] As a preferred technical solution of the present invention, the time for the oil removal treatment in step 2) is 8 to 15 minutes.

[0014] As a preferred technical solution of the present invention, the concentration of the NaOH solution used in step 3) is 10-20 g / L, and the soaking time is 3-5 min.

[0015] As a preferred technical solution of the present invention, the mass concentration of the HNO3 solution used in step 3) is 20-30%, and the soaking time is 3-5 min.

[0016] The grinding, degreasing, cleaning and pre-treatment processes of the present invention can remove surface pollutants and oxide films of the target material and the back plate, thereby improving the quality of diffusion welding.

[0017] As a preferred technical solution of the present invention, in step 4), graphite paper needs to be placed between the component to be bound and the graphite mold, so that the bound component and the graphite mold can be easily separated after the diffusion welding process.

[0018] As a preferred technical solution of the present invention, the graphite mold used in step 4) needs to be wrapped with graphite felt to provide thermal insulation and reduce heat loss during diffusion welding.

[0019] As a preferred technical solution of the present invention, the diffusion welding parameters described in step 4) are: vacuum ≤ 5 Pa, heating rate 50-100°C / min, welding temperature 480-560°C, holding time 10-20 min, and axial pressure 1-6 MPa during the holding period. Keeping the vacuum below 5 Pa effectively prevents the formation of an oxide film at the interface between the target and the backing plate during diffusion welding, thereby ensuring welding quality. A welding temperature of 480-560°C and a holding time of 10-20 min prevent excessive growth of the intermetallic compound layer at the interface during diffusion welding and prevents grain coarsening within the target and backing plate. An axial pressure of 1-6 MPa ensures good contact between the target and the backing plate, and between the component to be bonded and the graphite mold. Furthermore, a low axial pressure can prevent cracking of the aluminum-scandium target.

[0020] The advantages of the present invention are: 1) The surface treatment process of the AlSc alloy target and aluminum alloy back plate before diffusion welding used in the present invention is simple. The surface contaminants and oxide film of the target and back plate can be removed through grinding, degreasing, cleaning and pre-treatment processes, thereby improving the quality of diffusion welding.

[0021] 2) The bonded assembly of the AlSc alloy target and the aluminum alloy backing plate of the present invention is of high quality. By fully utilizing the synergistic effect of pulsed current heating, axial pressure and plasma activation of spark plasma sintering (SPS), the bonded assembly can achieve a welding rate of more than 98% and a bonding strength greater than 60 MPa.

[0022] 3) The axial pressure used in the diffusion welding process of the present invention is small, which avoids the cracking of the hard and brittle aluminum-scandium target during the welding process. In addition, the internal stress of the prepared binding assembly is small, and the binding assembly does not crack during use.

[0023] 4) The overall process flow of the present invention is simple and the production cycle is short. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a scanning electron microscope image of the interface of the aluminum-scandium alloy target assembly obtained in Example 1.

[0025] Figure 2 This is a scanning electron microscope image of the interface of the aluminum-scandium alloy target assembly obtained in Comparative Example 2.

[0026] Figure 3 This is a scanning electron microscope image of the interface of the aluminum-scandium alloy target assembly obtained in Comparative Example 3. DETAILED DESCRIPTION

[0027] A method for binding an aluminum-scandium alloy target and an aluminum alloy backing plate, comprising the following steps: 1) Surface grinding: The surface of the aluminum-scandium alloy target (scandium content of 5-45 at.%) and the surface of the 6061 aluminum alloy backing plate are ground separately until the roughness Ra of the aluminum-scandium alloy target and the aluminum alloy backing plate reaches 0.5-1.2 μm after grinding; 2) Degreasing and cleaning: The aluminum-scandium alloy target and aluminum alloy backing plate after surface grinding were immersed in acetone and degreased with ultrasonic vibration for 8-15 minutes, then rinsed with deionized water and dried; 3) Pretreatment: Soak the cleaned target and backing plate in a 10-20 g / L NaOH solution for 3-5 minutes, rinse with deionized water and blow dry, then soak in a 20-30% HNO3 solution for 3-5 minutes, rinse with deionized water and anhydrous ethanol and blow dry; 4) Diffusion welding: The pre-treated target and back plate are buckled together to form a component to be bonded, which is then placed in a graphite mold. Graphite paper is placed between the component to be bonded and the graphite mold. Graphite felt is wrapped around the outside of the graphite mold. The component is then placed in a spark plasma sintering device and welded for 10 to 20 minutes at a vacuum degree of ≤5 Pa, a heating rate of 50 to 100 °C / min, and a welding temperature of 480 to 560 °C. The axial pressure during the insulation period is 1 to 6 MPa. The component is then cooled to room temperature with the furnace and taken out.

[0028] In order to make the contents of the present invention easier to understand, the technical solutions of the present invention are further described below in conjunction with specific implementation methods, but the present invention is not limited thereto.

[0029] Unless otherwise specified, various materials, instruments, and equipment used in the present invention can be purchased from the market or prepared by existing methods.

[0030] Example 1 1) First, the aluminum-scandium alloy target (scandium content of 30 at.%) and the 6061 aluminum alloy backing plate were ground using sandpaper of different mesh sizes to achieve a surface roughness of 1 μm. 2) Soak the target and backing plate after surface grinding in acetone respectively, degrease them with ultrasonic vibration for 10 minutes, then rinse with deionized water and blow dry; 3) Soak the aluminum-scandium target and backing plate in 10 g / L NaOH solution for 3 min, rinse with deionized water and blow dry, then soak in 20% HNO3 solution for 3 min, rinse with deionized water, and finally clean with anhydrous ethanol and blow dry; 4) The aluminum-scandium target and the backing plate are buckled together to form a component to be bonded, which is then placed in a graphite mold. Graphite paper is placed between the component to be bonded and the graphite mold, and graphite felt is wrapped around the outside of the graphite mold. 5) Place the graphite mold containing the components to be bonded into the SPS equipment, turn on the SPS equipment, evacuate to a vacuum of 1 Pa, set the relevant welding parameters (heating rate of 70°C / min, axial pressure of 1 MPa, welding temperature of 540°C, and holding time of 10 min) for diffusion welding, then cool to room temperature with the furnace and take out to obtain the bonded components.

[0031] After testing, the welding bonding rate of the obtained aluminum-scandium alloy target assembly was 99.9%, and the welding bonding strength was 96.1MPa.

[0032] Figure 1 This is a scanning electron microscope image of the interface of the prepared aluminum-scandium alloy target assembly. It can be seen from the image that there are no welds or pores.

[0033] Example 2 1) First, the aluminum-scandium alloy target (scandium content of 40 at.%) and the 6061 aluminum alloy backing plate were ground using sandpaper of different mesh sizes to achieve a surface roughness of 1.2 μm. 2) The target and backing plate after surface grinding were immersed in acetone respectively, and degreased by ultrasonic vibration for 13 minutes, and then rinsed with deionized water and dried; 3) Soak the aluminum-scandium target and backing plate in 20 g / L NaOH solution for 4 min, rinse with deionized water and blow dry, then soak in 20% HNO3 solution for 3 min, rinse with deionized water, and finally clean with anhydrous ethanol and blow dry; 4) The aluminum-scandium target and the backing plate are buckled together to form a component to be bonded, which is then placed in a graphite mold. Graphite paper is placed between the component to be bonded and the graphite mold, and graphite felt is wrapped around the outside of the graphite mold. 5) Place the graphite mold containing the components to be bonded into the SPS equipment, turn on the SPS equipment, evacuate to a vacuum of 3 Pa, set the relevant welding parameters (heating rate of 90°C / min, axial pressure of 6 MPa, welding temperature of 560°C, and holding time of 15 min) for diffusion welding, then cool to room temperature with the furnace and take out to obtain the bonded components.

[0034] After testing, the welding bonding rate of the obtained aluminum-scandium alloy target assembly was 99.9%, and the welding bonding strength was 82.6MPa.

[0035] Example 3 1) First, the aluminum-scandium alloy target (scandium content of 35 at.%) and the 6061 aluminum alloy backing plate were ground using sandpaper of different mesh sizes to achieve a surface roughness of 0.8 μm. 2) Soak the target and backing plate after surface grinding in acetone respectively, degrease them with ultrasonic vibration for 8 minutes, then rinse with deionized water and blow dry; 3) Soak the aluminum-scandium target and backing plate in 15g / L NaOH solution for 3 minutes, rinse with deionized water and blow dry, then soak in 25% HNO3 solution for 4 minutes, rinse with deionized water, and finally clean with anhydrous ethanol and blow dry; 4) The aluminum-scandium target and the backing plate are buckled together to form a component to be bonded, which is then placed in a graphite mold. Graphite paper is placed between the component to be bonded and the graphite mold, and graphite felt is wrapped around the outside of the graphite mold. 5) Place the graphite mold containing the components to be bonded into the SPS equipment, turn on the SPS equipment, evacuate to a vacuum of 5 Pa, set the relevant welding parameters (heating rate of 50°C / min, axial pressure of 3 MPa, welding temperature of 500°C, and holding time of 10 min) for diffusion welding, then cool to room temperature with the furnace and take out to obtain the bonded components.

[0036] After testing, the welding bonding rate of the obtained aluminum-scandium alloy target assembly was 98.3%, and the welding bonding strength was 69.1MPa.

[0037] Example 4 1) First, the aluminum-scandium alloy target (scandium content of 45 at.%) and the 6061 aluminum alloy backing plate were ground using sandpaper of different mesh sizes to achieve a surface roughness of 1 μm. 2) Soak the target and backing plate after surface grinding in acetone respectively, degrease them with ultrasonic vibration for 15 minutes, then rinse with deionized water and blow dry; 3) Soak the aluminum-scandium target and backing plate in 15 g / L NaOH solution for 5 min, rinse with deionized water and blow dry, then soak in 20% HNO3 solution for 3 min, rinse with deionized water, and finally clean with anhydrous ethanol and blow dry; 4) The aluminum-scandium target and the backing plate are buckled together to form a component to be bonded, which is then placed in a graphite mold. Graphite paper is placed between the component to be bonded and the graphite mold, and graphite felt is wrapped around the outside of the graphite mold. 5) Place the graphite mold containing the components to be bonded into the SPS equipment, turn on the SPS equipment, evacuate to a vacuum of 3 Pa, set the relevant welding parameters (heating rate of 100°C / min, axial pressure of 1 MPa, welding temperature of 520°C, and holding time of 20 min) for diffusion welding, then cool to room temperature with the furnace and take out to obtain the bonded components.

[0038] After testing, the welding bonding rate of the obtained aluminum-scandium alloy target assembly was 99.2%, and the welding bonding strength was 73.7MPa.

[0039] Example 5 1) First, the aluminum-scandium alloy target (scandium content of 5 at.%) and the 6061 aluminum alloy backing plate were ground using sandpaper of different mesh sizes to achieve a surface roughness of 0.5 μm. 2) Soak the target and backing plate after surface grinding in acetone respectively, degrease them with ultrasonic vibration for 8 minutes, then rinse with deionized water and blow dry; 3) Soak the aluminum-scandium target and backing plate in 10 g / L NaOH solution for 3 minutes, rinse with deionized water and blow dry, then soak in 25% HNO3 solution for 5 minutes, rinse with deionized water, and finally clean with anhydrous ethanol and blow dry; 4) The aluminum-scandium target and the backing plate are buckled together to form a component to be bonded, which is then placed in a graphite mold. Graphite paper is placed between the component to be bonded and the graphite mold, and graphite felt is wrapped around the outside of the graphite mold. 5) Place the graphite mold containing the components to be bonded into the SPS equipment, turn on the SPS equipment, evacuate to a vacuum of 5 Pa, set the relevant welding parameters (heating rate of 60°C / min, axial pressure of 6 MPa, welding temperature of 480°C, and holding time of 15 min) for diffusion welding, then cool to room temperature with the furnace and take out to obtain the bonded components.

[0040] After testing, the welding bonding rate of the obtained aluminum-scandium alloy target assembly was 98.7%, and the welding bonding strength was 67.2MPa.

[0041] Example 6 1) First, the aluminum-scandium alloy target (scandium content of 10 at.%) and the 6061 aluminum alloy backing plate were ground using sandpaper of different mesh sizes to achieve a surface roughness of 0.8 μm. 2) Soak the target and backing plate after surface grinding in acetone respectively, degrease them with ultrasonic vibration for 10 minutes, then rinse with deionized water and blow dry; 3) Soak the aluminum-scandium target and backing plate in 10 g / L NaOH solution for 5 min, rinse with deionized water and blow dry, then soak in 20% HNO3 solution for 5 min, rinse with deionized water, and finally clean with anhydrous ethanol and blow dry; 4) The aluminum-scandium target and the backing plate are buckled together to form a component to be bonded, which is then placed in a graphite mold. Graphite paper is placed between the component to be bonded and the graphite mold, and graphite felt is wrapped around the outside of the graphite mold. 5) Place the graphite mold containing the components to be bonded into the SPS equipment, turn on the SPS equipment, evacuate to a vacuum of 1 Pa, set the relevant welding parameters (heating rate of 80°C / min, axial pressure of 3 MPa, welding temperature of 560°C, and holding time of 10 min) for diffusion welding, then cool to room temperature with the furnace and take out to obtain the bonded components.

[0042] After testing, the welding bonding rate of the obtained aluminum-scandium alloy target assembly was 99.9%, and the welding bonding strength was 69.4MPa.

[0043] Example 7 1) First, the aluminum-scandium alloy target (scandium content of 15 at.%) and the 6061 aluminum alloy back plate were ground with sandpaper of different mesh numbers to make their surface roughness reach 1 μm; 2) The target and the back plate after surface grinding treatment were respectively soaked in acetone, combined with ultrasonic oscillation to remove oil for 13 min, then cleaned with deionized water and blown dry; 3) The aluminum-scandium target and the back plate were respectively soaked in 20 g / L NaOH solution for 3 min, rinsed with deionized water and blown dry, then soaked in 30 % HNO3 solution for 3 min, rinsed with deionized water, and finally cleaned with anhydrous ethanol and blown dry; 4) The aluminum-scandium target and the back plate were buckled together to form a to-be-bonded assembly, which was placed in a graphite mold, and graphite paper was placed between the to-be-bonded assembly and the graphite mold, and the graphite mold was wrapped with graphite felt; 5) The graphite mold with the to-be-bonded assembly was placed in the SPS device, the SPS device was started, vacuumized to a vacuum degree of 5 Pa, and relevant welding parameters (heating rate of 50 ℃ / min, axial pressure of 1 MPa, welding temperature of 480 ℃, and holding time of 10 min) were set for diffusion welding treatment, then the assembly was cooled to room temperature in the furnace, and the bonded assembly was obtained.

[0044] It was detected that the welding bonding rate of the obtained aluminum-scandium alloy target assembly was 99.6 %, and the welding bonding strength was 63.3 MPa.

[0045] Example 8 1) First, the aluminum-scandium alloy target (scandium content of 20 at.%) and the 6061 aluminum alloy back plate were ground with sandpaper of different mesh numbers to make their surface roughness reach 1.2 μm; 2) The target and the back plate after surface grinding treatment were respectively soaked in acetone, combined with ultrasonic oscillation to remove oil for 15 min, then cleaned with deionized water and blown dry; 3) The aluminum-scandium target and the back plate were respectively soaked in 20 g / L NaOH solution for 4 min, rinsed with deionized water and blown dry, then soaked in 30 % HNO3 solution for 4 min, rinsed with deionized water, and finally cleaned with anhydrous ethanol and blown dry; 4) The aluminum-scandium target and the back plate were buckled together to form a to-be-bonded assembly, which was placed in a graphite mold, and graphite paper was placed between the to-be-bonded assembly and the graphite mold, and the graphite mold was wrapped with graphite felt; 5) Put the graphite mold with the to-be-bonded assembly into the SPS device, turn on the SPS device, vacuumize to a vacuum degree of 1 Pa, set the relevant welding parameters (temperature rising speed of 100 ℃ / min, axial pressure of 6 MPa, welding temperature of 560 ℃, and holding time of 20 min), and then perform diffusion welding treatment, and then cool to room temperature in the furnace, and take out to obtain the bonded assembly.

[0046] It is detected that the welding bonding rate of the obtained aluminum scandium alloy target assembly is 99.9 %, and the welding bonding strength is 86.3 MPa.

[0047] Comparative Example 1 1) First, use sandpaper of different mesh to grind the aluminum scandium alloy target material (scandium content of 30 at.%) and the 6061 aluminum alloy back plate, so that the surface roughness of them reaches 1 μm; 2) Soak the target material and the back plate after surface grinding treatment in acetone, and remove oil by ultrasonic oscillation for 10 min, and then clean with deionized water and blow dry; 3) Soak the aluminum scandium target material and the back plate in 10 g / L NaOH solution for 3 min, rinse with deionized water and dry, then soak in 20 % HNO3 solution for 3 min, then rinse with deionized water, and finally clean with anhydrous ethanol and dry; 4) The aluminum scandium target material and the back plate are buckled together to form a to-be-bonded assembly, which is placed in a graphite mold, and the to-be-bonded assembly and the graphite mold are covered with graphite paper, and the graphite mold is wrapped with graphite felt; 5) Put the graphite mold with the to-be-bonded assembly into the SPS device, turn on the SPS device, vacuumize to a vacuum degree of 1 Pa, set the relevant welding parameters (temperature rising speed of 70 ℃ / min, axial pressure of 0.2 MPa, welding temperature of 540 ℃, and holding time of 10 min), and then perform diffusion welding treatment, and then cool to room temperature in the furnace, and take out to obtain the bonded assembly.

[0048] It is detected that the welding bonding rate of the obtained aluminum scandium alloy target assembly is 93.1 %, and the welding bonding strength is 46.2 MPa.

[0049] From Example 1 and Comparative Example 1, it can be seen that when the axial pressure applied during diffusion welding is lower than the required pressure, the welding bonding rate and the welding bonding strength of the aluminum scandium alloy target assembly prepared are both significantly decreased.

[0050] Comparative Example 2 1) First, use sandpaper of different mesh to grind the aluminum scandium alloy target material (scandium content of 40 at.%) and the 6061 aluminum alloy back plate, so that the surface roughness of them reaches 1.2 μm; 2) The target and backing plate after surface grinding were immersed in acetone respectively, and degreased by ultrasonic vibration for 13 minutes, and then rinsed with deionized water and dried; 3) Soak the aluminum-scandium target and backing plate in 20 g / L NaOH solution for 4 min, rinse with deionized water and blow dry, then soak in 20% HNO3 solution for 3 min, rinse with deionized water, and finally clean with anhydrous ethanol and blow dry; 4) The aluminum-scandium target and the backing plate are buckled together to form a component to be bonded, which is then placed in a graphite mold. Graphite paper is placed between the component to be bonded and the graphite mold, and graphite felt is wrapped around the outside of the graphite mold. 5) Place the graphite mold containing the components to be bonded into the SPS equipment, turn on the SPS equipment, evacuate to a vacuum of 3 Pa, set the relevant welding parameters (heating rate of 90°C / min, axial pressure of 15 MPa, welding temperature of 560°C, and holding time of 15 min) for diffusion welding, then cool to room temperature with the furnace and take out to obtain the bonded components.

[0051] After testing, the welding bonding rate of the obtained aluminum-scandium alloy target assembly was 96.2%, the welding bonding strength was 53.0 MPa, and target cracking occurred.

[0052] From Example 2, Comparative Example 2 and Figure 2 It can be seen that when the axial pressure applied during diffusion welding is higher than the required axial pressure, the aluminum-scandium alloy target material will show obvious cracking, the target material will be destroyed, and the welding bonding rate and welding bonding strength of the target assembly will decrease.

[0053] Comparative Example 3 1) First, the aluminum-scandium alloy target (scandium content of 35 at.%) and the 6061 aluminum alloy backing plate were ground using sandpaper of different mesh sizes to achieve a surface roughness of 0.8 μm. 2) Soak the target and backing plate after surface grinding in acetone respectively, degrease them with ultrasonic vibration for 8 minutes, then rinse with deionized water and blow dry; 3) Soak the aluminum-scandium target and backing plate in 15 g / L NaOH solution for 3 minutes, rinse with deionized water and blow dry, then soak in 25% HNO3 solution for 4 minutes, rinse with deionized water, and finally clean with anhydrous ethanol and blow dry; 4) The aluminum-scandium target and the backing plate are buckled together to form a component to be bonded, which is then placed in a graphite mold. Graphite paper is placed between the component to be bonded and the graphite mold, and graphite felt is wrapped around the outside of the graphite mold. 5) Place the graphite mold containing the components to be bonded into the SPS equipment, turn on the SPS equipment, evacuate to a vacuum of 5 Pa, set the relevant welding parameters (heating rate of 50°C / min, axial pressure of 3 MPa, welding temperature of 500°C, and holding time of 5 min) for diffusion welding, then cool to room temperature with the furnace and take out to obtain the bonded components.

[0054] After testing, the welding bonding rate of the obtained aluminum-scandium alloy target assembly was 22.8%, and the welding bonding strength was 1.6MPa.

[0055] From Example 3, Comparative Example 3 and Figure 3 It can be seen that when the diffusion welding holding time is lower than the required holding time, there is an obvious unwelded phenomenon in the target assembly, and the welding bonding rate and welding bonding strength of the prepared aluminum-scandium alloy target assembly are significantly reduced.

[0056] Comparative Example 4 1) First, the aluminum-scandium alloy target (scandium content of 45 at.%) and the 6061 aluminum alloy backing plate were ground using sandpaper of different mesh sizes to achieve a surface roughness of 1 μm. 2) Soak the target and backing plate after surface grinding in acetone respectively, degrease them with ultrasonic vibration for 15 minutes, then rinse with deionized water and blow dry; 3) Soak the aluminum-scandium target and backing plate in 15 g / L NaOH solution for 5 min, rinse with deionized water and blow dry, then soak in 20% HNO3 solution for 3 min, rinse with deionized water, and finally clean with anhydrous ethanol and blow dry; 4) The aluminum-scandium target and the backing plate are buckled together to form a component to be bonded, which is then placed in a graphite mold. Graphite paper is placed between the component to be bonded and the graphite mold, and graphite felt is wrapped around the outside of the graphite mold. 5) Place the graphite mold containing the components to be bonded into the SPS equipment, turn on the SPS equipment, evacuate to a vacuum of 3 Pa, set the relevant welding parameters (heating rate of 100°C / min, axial pressure of 1 MPa, welding temperature of 520°C, and holding time of 40 min) for diffusion welding, then cool to room temperature with the furnace and take out to obtain the bonded components.

[0057] After testing, the welding bonding rate of the obtained aluminum-scandium alloy target assembly was 94.9%, and the welding bonding strength was 48.8MPa. Aluminum leakage caused by excessive melting of the backplane occurred.

[0058] It can be seen from Example 4 and Comparative Example 4 that when the diffusion welding holding time is higher than the required holding time range, the welding bonding rate and welding bonding strength of the prepared aluminum-scandium alloy target assembly are both reduced.

[0059] Comparative Example 5 1) First, the aluminum-scandium alloy target (scandium content of 5 at.%) and the 6061 aluminum alloy backing plate were ground using sandpaper of different mesh sizes to achieve a surface roughness of 0.5 μm. 2) Soak the target and backing plate after surface grinding in acetone respectively, degrease them with ultrasonic vibration for 8 minutes, then rinse with deionized water and blow dry; 3) Soak the aluminum-scandium target and backing plate in 10 g / L NaOH solution for 3 minutes, rinse with deionized water and blow dry, then soak in 25% HNO3 solution for 5 minutes, rinse with deionized water, and finally clean with anhydrous ethanol and blow dry; 4) The aluminum-scandium target and the backing plate are buckled together to form a component to be bonded, which is then placed in a graphite mold. Graphite paper is placed between the component to be bonded and the graphite mold, and graphite felt is wrapped around the outside of the graphite mold. 5) Place the graphite mold containing the components to be bonded into the SPS equipment, turn on the SPS equipment, evacuate to a vacuum of 5 Pa, set the relevant welding parameters (heating rate of 60°C / min, axial pressure of 6 MPa, welding temperature of 380°C, and holding time of 15 min) for diffusion welding, then cool to room temperature with the furnace and take out to obtain the bonded components.

[0060] After testing, the welding bonding rate of the obtained aluminum-scandium alloy target assembly was 80.3%, and the welding bonding strength was 12.1MPa.

[0061] It can be seen from Example 5 and Comparative Example 5 that when the diffusion welding temperature is lower than the required welding temperature range, the welding bonding rate and welding bonding strength of the prepared aluminum-scandium alloy target assembly are significantly reduced.

[0062] Comparative Example 6 1) First, the aluminum-scandium alloy target (scandium content of 10 at.%) and the 6061 aluminum alloy backing plate were ground using sandpaper of different mesh sizes to achieve a surface roughness of 0.8 μm. 2) Soak the target and backing plate after surface grinding in acetone respectively, degrease them with ultrasonic vibration for 10 minutes, then rinse with deionized water and blow dry; 3) Soak the aluminum-scandium target and backing plate in 10 g / L NaOH solution for 5 min, rinse with deionized water and blow dry, then soak in 20% HNO3 solution for 5 min, rinse with deionized water, and finally clean with anhydrous ethanol and blow dry; 4) The aluminum-scandium target and the backing plate are buckled together to form a component to be bonded, which is then placed in a graphite mold. Graphite paper is placed between the component to be bonded and the graphite mold, and graphite felt is wrapped around the outside of the graphite mold. 5) Place the graphite mold containing the components to be bonded into the SPS equipment, turn on the SPS equipment, evacuate to a vacuum of 1 Pa, set the relevant welding parameters (heating rate of 80°C / min, axial pressure of 3 MPa, welding temperature of 660°C, and holding time of 10 min) for diffusion welding, then cool to room temperature with the furnace and take out to obtain the bonded components.

[0063] After testing, the welding bonding rate of the obtained aluminum-scandium alloy target assembly was 93.9%, and the welding bonding strength was 51.7MPa. Aluminum leakage caused by excessive melting of the backplane occurred.

[0064] It can be seen from Example 6 and Comparative Example 6 that when the diffusion welding temperature is higher than the required welding temperature range, the welding bonding rate and welding strength of the prepared aluminum-scandium alloy target assembly are reduced.

[0065] Comparative Example 7 1) First, the aluminum-scandium alloy target (scandium content of 15 at.%) and the 6061 aluminum alloy backing plate were ground using sandpaper of different mesh sizes to achieve a surface roughness of 1 μm. 2) The target and backing plate after surface grinding were immersed in acetone respectively, and degreased by ultrasonic vibration for 13 minutes, and then rinsed with deionized water and dried; 3) Soak the aluminum-scandium target and backing plate in 20 g / L NaOH solution for 3 minutes, rinse with deionized water and blow dry, then soak in 30% HNO3 solution for 3 minutes, rinse with deionized water, and finally clean with anhydrous ethanol and blow dry; 4) The aluminum-scandium target and the backing plate are buckled together to form a component to be bonded, which is then placed in a graphite mold. Graphite paper is placed between the component to be bonded and the graphite mold, and graphite felt is wrapped around the outside of the graphite mold. 5) Place the graphite mold containing the components to be bonded into the SPS equipment, turn on the SPS equipment, evacuate to a vacuum of 80 Pa, set the relevant welding parameters (heating rate of 50°C / min, axial pressure of 1 MPa, welding temperature of 480°C, and holding time of 10 min) for diffusion welding, then cool to room temperature with the furnace and take out to obtain the bonded components.

[0066] After testing, the welding bonding rate of the obtained aluminum-scandium alloy target assembly was 95.1%, and the welding bonding strength was 50.6MPa.

[0067] It can be seen from Example 7 and Comparative Example 7 that when the vacuum degree does not reach the required vacuum degree, the welding bonding rate and welding bonding strength of the prepared aluminum-scandium alloy target assembly are significantly reduced.

[0068] Comparative Example 8 1) First, the aluminum-scandium alloy target (scandium content of 20 at.%) and the 6061 aluminum alloy backing plate were ground using sandpaper of different mesh sizes to achieve a surface roughness of 1.2 μm. 2) Soak the target and backing plate after surface grinding in acetone respectively, degrease them with ultrasonic vibration for 8 minutes, then rinse with deionized water and blow dry; 3) The aluminum-scandium target and the backing plate are buckled together to form a component to be bonded, which is then placed in a graphite mold. Graphite paper is placed between the component to be bonded and the graphite mold, and graphite felt is wrapped around the outside of the graphite mold. 4) Place the graphite mold containing the components to be bonded into the SPS equipment, turn on the SPS equipment, evacuate to a vacuum of 1 Pa, set the relevant welding parameters (heating rate of 100°C / min, axial pressure of 6 MPa, welding temperature of 560°C, and holding time of 20 min) for diffusion welding, then cool to room temperature with the furnace and take out to obtain the bonded components.

[0069] After testing, the welding bonding rate of the obtained aluminum-scandium alloy target assembly was 94.1%, and the welding bonding strength was 41.4MPa.

[0070] It can be seen from Example 8 and Comparative Example 8 that when the preparation method lacks a pre-treatment process, the welding bonding rate and welding bonding strength of the prepared aluminum-scandium alloy target assembly are significantly reduced.

[0071] Comparative Example 9 1) First, the aluminum-scandium alloy target (scandium content of 30 at.%) and the 6061 aluminum alloy backing plate were ground using sandpaper of different mesh sizes to achieve a surface roughness of 1 μm. 2) Soak the target and backing plate after surface grinding in acetone respectively, degrease them with ultrasonic vibration for 10 minutes, then rinse with deionized water and blow dry; 3) Soak the aluminum-scandium target and backing plate in 10 g / L NaOH solution for 3 min, rinse with deionized water and blow dry, then soak in 20% HNO3 solution for 3 min, rinse with deionized water, and finally clean with anhydrous ethanol and blow dry; 4) The aluminum-scandium target and the backing plate are buckled together to form a component to be bonded, and a graphite indenter is set on the non-welding surface of the target and the backing plate to conduct current and pressure; 5) Place the components to be bonded in a high-frequency pulse current device, turn on the device, evacuate to a vacuum of 1 Pa, set the relevant welding parameters (axial pressure of 8 MPa, high-frequency pulse current of 5000 A, and power-on time of 3 minutes) for diffusion welding, then cool to room temperature with the furnace and take out to obtain the bonded components.

[0072] After testing, the welding bonding rate of the obtained aluminum-scandium alloy target assembly was 66.3%, and the welding bonding strength was 21.2MPa.

[0073] It can be seen from Example 1 and Comparative Example 9 that when a high-frequency pulse current device is directly used for diffusion welding, the welding bonding rate and welding bonding strength of the prepared aluminum-scandium alloy target assembly are significantly reduced.

[0074] Table 1 Welding rate and bonding strength of the aluminum-scandium alloy target assembly prepared in the examples and comparative examples

[0075] The applicant declares that the present invention uses the above-described embodiments to illustrate the detailed method of the present invention, but the present invention is not limited to the above-described detailed method. All technical solutions that fall within the scope of protection of the present invention are within the scope of protection of the present invention. It should be noted that for those skilled in the art, various improvements and modifications that do not depart from the principles of the present invention should also be considered within the scope of protection of the present invention.

Claims

1. A method for binding an aluminum-scandium alloy target and an aluminum alloy back plate, characterized in that: The following steps are involved: 1) Surface grinding: Grind the surface of the aluminum-scandium alloy target and the surface of the aluminum alloy backing plate separately; 2) Degreasing and cleaning: Soak the target and backing plate after surface grinding in acetone, degrease them with ultrasonic vibration, then rinse with deionized water and blow dry. 3) Pretreatment: Soak the cleaned target and backing plate in NaOH solution and HNO3 solution respectively, rinse with deionized water and anhydrous ethanol, and then blow dry; 4) Diffusion welding: The pre-treated target material and the back plate are buckled together to form a component to be bonded, placed in a graphite mold, and then placed in a spark plasma sintering device for diffusion welding. After that, it is cooled to room temperature with the furnace and taken out.

2. The binding method according to claim 1, wherein: The scandium content in the aluminum-scandium alloy target is 5-45 at.%.

3. The binding method according to claim 1, characterized in that: The aluminum alloy back plate is made of 6061 aluminum alloy.

4. The binding method according to claim 1, wherein: Step 1) The roughness Ra of the surface of the aluminum-scandium alloy target and the surface of the aluminum alloy backing plate after grinding is 0.5-1.2 μm.

5. The binding method according to claim 1, wherein: The degreasing treatment time in step 2) is 8 to 15 minutes.

6. The binding method according to claim 1, wherein: The concentration of the NaOH solution used in step 3) is 10-20 g / L, and the soaking time is 3-5 min.

7. The binding method according to claim 1, wherein: The mass concentration of the HNO3 solution used in step 3) is 20-30%, and the soaking time is 3-5 minutes.

8. The binding method according to claim 1, characterized in that: Step 4) Graphite paper needs to be placed between the component to be bound and the graphite mold.

9. The binding method according to claim 1, characterized in that: Step 4) The graphite mold used needs to be wrapped with graphite felt.

10. The binding method according to claim 1, wherein: The diffusion welding parameters in step 4) are: vacuum degree ≤ 5 Pa, heating rate 50-100 °C / min, welding temperature 480-560 °C, holding time 10-20 min, and axial pressure during holding period 1-6 MPa.

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