Encapsulated package with carrier

Abstract

A package (100) comprising: a carrier (102) comprising a component mounting area (104) from which a lateral extension (106) extends, the lateral extension (106) being configured to be clamped by an encapsulation tool pin (108) during encapsulation; an electronic component (110) mounted on the component mounting region (104); and an encapsulation material (112) encapsulating at least a portion of the electronic component (110) and a portion of the carrier (102), where the lateral extension (106) is laterally retracted relative to adjacent vertical sidewalls (114) of the encapsulation material (112), and where the encapsulation material (112) laterally covers the lateral extension (106).

Description

TECHNICAL FIELD

[0001] Various embodiments relate generally to a package and a method of manufacturing a package. BACKGROUND

[0002] A package can represent an encapsulated electronic component with electrical connection structures extending out of the encapsulation material and can be mounted on an electronic peripheral, such as a printed circuit board.

[0003] Package costs are an important driver in the industry. Related to this are performance, size and reliability. Different package solutions are manifold and have to meet the needs of the application. SUMMARY

[0004] It can be desirable to provide a possibility to manufacture a package with high device reliability in a simple and fast way.

[0005] According to one exemplary embodiment, a package is provided, the package comprising: a carrier comprising a component mounting area, a lateral extension extending from the component mounting area, the lateral extension being configured to be pinched by an encapsulation tool pin during encapsulation; an electronic component mounted on the component mounting area; and an encapsulation material encapsulating at least a portion of the electronic component and a portion of the carrier, wherein the lateral extension is laterally retracted with respect to an adjacent vertical side wall of the encapsulation material, and wherein the encapsulation material laterally covers the lateral extension.

[0006] According to another exemplary embodiment, a method of manufacturing a package is provided, wherein the method comprises: providing a carrier comprising a component mounting area, a lateral extension extending from the component mounting area; mounting an electronic component on the component mounting area; encapsulating at least a portion of the electronic component and a portion of the carrier by an encapsulation material, wherein the lateral extension is pinched by an encapsulation tool pin during at least a portion of the encapsulation; and adjusting the encapsulation process such that the lateral extension is laterally retracted with respect to an adjacent vertical side wall of the encapsulation material, and such that the encapsulation material laterally covers the lateral extension.

[0007] According to one exemplary embodiment, an encapsulated, in particular molded, package is provided, the package having a carrier, which can for example be made of a metallic material, in particular based on a leadframe structure, the carrier having a component mounting area, such as a die pad, which carries at least one electronic component, such as a semiconductor chip. At least one lateral extension can laterally extend from the component mounting area. The lateral extension can be used to be clamped by an encapsulation tool pin during encapsulation of the carrier and the electronic component by an encapsulation material, such as a molding compound. Clamping of the lateral extension together with the component mounting area of the carrier can prevent that still flowable encapsulation material undesirably flows to the bottom side of the carrier, which can allow to avoid undesirable phenomena such as molding flash or encapsulation material bleeding to unintended areas of the package. Advantageously, the lateral extension can laterally retract with respect to an adjacent, in particular outer or outermost, vertical side wall of the encapsulation material, which can be defined by a sawing process. Thus, the process of singulating the package from other packages in a mass manufacturing process can be simplified, as it is not necessary to saw through the lateral extension, in particular the metallic material. This can significantly speed up and simplify the singulation process. When such a sawing process essentially only extends through the encapsulation material (and optionally through one or more optional tiny die pads), this can lead to a configuration in which the encapsulation material laterally covers the lateral extension, thus providing a lateral cushioning between the lateral extension and the vertical side wall of the package. Thus, undesirable burrs at the side wall of the package, which can be created when sawing through the lateral extension, can be reliably prevented. Due to the described package architecture, defects such as molding flash and / or burrs can be efficiently suppressed, while allowing for a simple and efficient manufacturing of the package. Thus, a package can be provided, which can be manufactured in a simple and fast manner with high device reliability.

[0008] Description of further example embodiments

[0009] In the following, further exemplary embodiments of packages and methods will be explained.

[0010] In the context of the present application, the term "package" can in particular denote an electronic device, which can comprise one or more electronic components mounted on a carrier. The components of the package can at least partially be encapsulated by an encapsulation material. Optionally, one or more electrically conductive interconnects, such as connection wires and / or clips, can be implemented in the package, for example for electrically coupling the electronic components with the carrier and / or with leads.

[0011] In the context of the present application, the term "carrier" can in particular denote a support structure (which can be at least partially electrically conductive) that serves as a mechanical support for one or more electronic components to be mounted thereon and that can also facilitate electrical interconnections between the electronic component(s) and the periphery of the package. In other words, a carrier can fulfill a mechanical support function and an electrical connection function. A carrier can comprise or consist of a single component, a plurality of components joined via an encapsulation or other package component, or a subassembly of carriers. When a carrier forms part of a leadframe, the carrier can comprise a die pad.

[0012] In the context of the present application, the term "component mounting area" can in particular denote a section of a carrier that is configured for mounting at least one electronic component thereon. For example, the component mounting area can be a die pad. In one embodiment, the component mounting area can be a flat plate-like metal body or area.

[0013] In the context of the present application, the term "lateral extension" can in particular denote a portion of a carrier that can extend from a lateral side or edge of a component mounting area, thus can be a lateral protrusion of a component mounting area of a carrier. For example, a lateral extension can be formed integrally with a component mounting area and can extend as an appendage from a component mounting area. In one embodiment, the lateral extension can be a metal plate or metal strip section. A lateral extension can be coplanar with a component mounting area. A length and a width of a lateral extension can be smaller than a component mounting area. It is possible that a plurality of lateral extensions extend from different edge portions of a component mounting area, for example from two opposite edge portions. A lateral extension can serve as a support or base for an encapsulation tool pin that clamps down on the lateral extension and the connected component mounting area during formation of an encapsulation material. Descriptively, in one exemplary embodiment, a lateral extension can be denoted as a mold ear. Like a component mounting area, at least one lateral extension can also be made of metal, for example copper.

[0014] In the context of the present application, the term "clamping of a lateral extension by an encapsulation tool pin" can in particular denote a process in which a retractable, liftable or removable encapsulation tool pin of an encapsulation tool (for example a molding tool) can press a lateral extension of a carrier against a support surface (for example a support surface of an encapsulation tool) during an encapsulation process, thereby clamping the lateral extension together with a component mounting area on the support surface to prevent encapsulation material from flowing to the opposite side of the carrier. This can inhibit encapsulation defects, such as mold flash.

[0015] In the context of the present application, the term "electronic component" can particularly include a semiconductor chip (particularly a power semiconductor chip), an active electronic device (e.g. a transistor), a passive electronic device (e.g. a capacitor or an inductor or an ohmic resistor), a sensor (e.g. a microphone, a light sensor or a gas sensor), a light-emitting, semiconductor-based device (e.g. a light-emitting diode (LED) or a laser), an actuator (e.g. a loudspeaker) and a microelectromechanical system (MEMS). Particularly, the electronic component can be a semiconductor chip having at least one integrated circuit element (e.g. a diode or a transistor) in a surface portion thereof. The electronic component can be a bare die or can have been packaged or encapsulated. Semiconductor chips implemented in accordance with exemplary embodiments can be formed in silicon technology, gallium nitride technology, silicon carbide technology or the like.

[0016] In the context of the present application, the term "encapsulating material" can particularly denote a substantially electrically insulating material surrounding at least a portion of the electronic component and at least a portion of the carrier to provide mechanical protection, electrical insulation and, optionally, a contribution to heat dissipation during operation. Particularly, the encapsulating material can be a molding compound. The molding compound can comprise a matrix of a flowable and hardenable material and filler particles embedded therein. For example, the filler particles can serve to adjust properties of the molded component, particularly to enhance thermal conductivity.

[0017] In the context of the present application, the term "the lateral extension is laterally retracted with respect to an adjacent vertical side wall of the encapsulating material" can particularly denote the fact that the free lateral end of the lateral extension can remain laterally spaced apart with respect to a vertically extending side wall portion of the encapsulating material adjacent to the lateral extension (and, preferably, also of the package as a whole). The outer end of the lateral extension can be displaced inwardly with respect to a juxtaposed outer or outermost vertical side wall of the encapsulating material. In this configuration, the lateral extension does not form part of the vertically extending side wall of the package.

[0018] In the context of the present application, the term "the encapsulating material laterally covers the lateral extension" can particularly denote that the lateral extension can not be completely exposed, but can be covered at least at its outer lateral end by the material of the encapsulating material. Thus, the encapsulating material can serve as a spacer between the (particularly outer or outermost) vertically extending side wall of the encapsulating material and the lateral end of the lateral extension.

[0019] In one embodiment, the carrier includes another lateral extension extending from the component mounting area, which is configured to be clamped by another encapsulation tool pin during encapsulation, wherein the other lateral extension is laterally retracted relative to another adjacent vertical side wall of the encapsulation material, and wherein the encapsulation material laterally covers the other lateral extension. When multiple lateral extensions are provided, these lateral extensions can be clamped to opposing surfaces by encapsulation tool pins or the like during encapsulation, which can more reliably or more efficiently suppress undesirable tilting of the component mounting area of ​​the carrier. Different lateral extensions can extend from different edges of the component mounting area to obtain more balanced pressing characteristics. The features described herein for the lateral extensions can also be applied to the other lateral extensions.

[0020] In one embodiment, the lateral extension and the further lateral extension extend from opposite sides of the component mounting area and are laterally retracted relative to opposite vertical side walls of the encapsulation material. For example, the lateral extension and the further lateral extension can have the same shape and size to obtain a symmetrical package architecture. When one or more pull rods are foreseen, the lateral extension can extend from the same edge of the component mounting area as the assigned one or more pull rods. For example, two of the four side edges of the roughly rectangular component mounting area can be configured to form lateral extensions (optional pull rods), while the other two side edges can be configured to provide or connect leads or lead segments. This can achieve a compact design of the package.

[0021] In one embodiment, the encapsulation material has a recess in the vertical sidewall that extends vertically to only one of the two opposing major surfaces of the package. Such a recess can be a unique point in the package where one or more encapsulation tool pins are temporarily present during the manufacturing process, wherein such encapsulation tool pins can be removed from the package during or at the end of the manufacturing process, leaving behind the corresponding recess. Such a recess in the edge of the package can have a closed bottom, which can be defined by a portion of the lateral extension and / or by a portion of the encapsulation material.

[0022] In one embodiment, the lateral extension is exposed in the recess. More specifically, the lateral extension may be exposed only at the bottom of the recess. Accordingly, the method may include clamping the lateral extension by the encapsulation tool pins during the entire encapsulation process so that a recess is formed in the encapsulation material, and the lateral extension is exposed in the recess. For example, Figure 1 or Figure 9 Such an embodiment is shown in . A corresponding configuration can be obtained when an encapsulation tool pin is clamped or pressed onto the corresponding lateral extension until the encapsulation process is complete (e.g., until the molding compound is cured). Removal of the encapsulation tool pin may then expose at least a portion of the lateral extension.

[0023] In another embodiment, the lateral extensions are vertically separated from the recess by the encapsulation material. Thus, the method can comprise clamping by the encapsulation tool pins on the lateral extensions during a first part of the encapsulation process and retracting the encapsulation tool pins during a second part of the encapsulation process such that a recess is formed in the encapsulation material, wherein the lateral extensions are vertically separated from the recess by the encapsulation material. Such an embodiment is for example shown in Figure 5 When the encapsulation tool pins are only clamped or pressed onto the respective lateral extensions at the beginning of the manufacturing process, the configuration can be obtained, while the encapsulation tool pins can be removed from the package before the encapsulation process is completed, for example before the molding compound is completely cured. Then, the temporarily exposed parts of the lateral extensions can be covered by the still flowable encapsulation material before the encapsulation material is completely cured. Removing the encapsulation tool pins before the curing of the encapsulation material is completed can enable such a configuration, wherein the lateral extensions below the recess are covered by the encapsulation material at the bottom of the recess.

[0024] In one embodiment, at least one vertical side wall, which can be a sawing side wing of the package, is particularly defined by the encapsulation material only. In such an embodiment, the sawing of the side wing can be performed through the encapsulation material only, particularly the molding compound material. Since a metal sawing can be completely avoided in such an embodiment, a high speed sawing can be ensured, thereby ensuring an efficient processing.

[0025] In another embodiment, the package comprises at least one pull tab extending from the component mounting area and being exposed at a vertical side wall of the encapsulation material. Thus, at least one vertical side wall, which can be a sawing side wing of the package, can be particularly defined by the encapsulation material and a (particularly metallic) pull tab connected to the component mounting area of the carrier only. Such a pull tab can be used to integrally connect various carriers in a common carrier structure, for example a lead frame, before singulating into individual packages. Particularly, a ratio between a surface area of the pull tab exposed at the respective sawing side wing and an entire surface area of the respective sawing side wing can be less than 10%, particularly less than 5%, more particularly less than 3%. In such an alternative embodiment, the sawing is performed through the material of the (particularly molding type) encapsulation material combined with a material of only a very limited amount of metallic pull tab. The highly limited pull tab sawing can only saw through a few percent of the surface area of the metallic material, which preserves the advantages of a high speed sawing through the encapsulation material essentially. At the same time, the pull tab can connect different carriers of a lead frame, thereby a mechanical stability in the manufacturing process can be improved. Thus, a highly accurate package can be obtained.

[0026] In one embodiment, the lateral extension extends between two tie rods extending from the component mounting area. For example, the lateral extension may extend from a central side edge of the component mounting area and may be arranged between the two tie rods. Advantageously, such a construction may be formed on two opposite side edges of the component mounting area, i.e. for the lateral extension and for the other lateral extension mentioned above. This allows for a symmetrical design. With the described construction of lateral extensions and tie rods, a high stability and positioning accuracy may be achieved. While the tie rods may ensure an accurate mutual positioning and orientation between different carriers interconnected by the tie rods, the lateral extensions may avoid that the encapsulation material flows to the bottom side of the carriers while suppressing burrs at the vertical side walls of the package.

[0027] In one embodiment, the lateral extension has a shorter length and / or a greater width than the at least one tie rod and / or the same thickness as the at least one tie rod. In this case, the length of the lateral extension or tie rod can be its dimension from the component mounting area to its free end. Furthermore, the width of the lateral extension or tie rod can be its dimension along the corresponding side edge of the component mounting area, from which the lateral extension or tie rod extends. Furthermore, the thickness of the lateral extension or tie rod can be its dimension along the component mounting area and the stacking direction of the electronic components. When the length of the lateral extension is less than the length of the tie rod, it can be reliably ensured that the lateral extension does not extend into the vertical side walls of the package, while the tie rod does extend into the vertical side walls of the package. For example, the length of the lateral extension can be no more than half, and preferably no more than one-third, the length of the tie rod. When the width of the lateral extension is greater than the width of the tie rod, it can be reliably ensured that the lateral extension can be effectively clamped downward by the encapsulation tool pins, while the tie rod is narrow enough to avoid burrs where the tie rod intersects the vertical side walls of the package. For example, the width of the lateral extensions can be at least twice, preferably at least three times, the width of the tie bars. When the lateral extensions and the tie bars have the same thickness, and preferably the same thickness as the component mounting area, the entire carrier can be formed based on a metal sheet (which can, for example, be patterned and / or curved).

[0028] In another embodiment, the package is configured as a tie-bar-less package. Figures 9 to 12 As shown. Thus, the package can be completely free of tie bars. This can have the advantage that sawing the vertical sidewalls can only involve sawing through the encapsulation material (particularly the mold compound), so in such an embodiment, no metal needs to be sawed through. Singulation along the long leadframe axis can then be designed to allow for fast sawing (particularly without metal such as copper in the saw streets).

[0029] In one embodiment, the vertical side wall is formed by the encapsulation material only, or by the encapsulation material and the at least one tie bar only. When retracting the one or more lateral extensions relative to the vertical side wall and keeping them within the encapsulation material contour of the package, singulation can be performed quickly and simply, while a high efficiency in suppressing burrs at the vertical side wall can be achieved.

[0030] In one embodiment, the package comprises one or more electrically conductive lead sections, in particular at least one of the one or more electrically conductive lead sections is formed integrally with the component mounting area and / or at least one of the one or more electrically conductive lead sections is formed separately from the component mounting area, the one or more electrically conductive lead sections extending from the encapsulation material at one or both of the inclined side walls of the encapsulation material. Each lead section can comprise one or more leads. At least one lead section can be formed integrally with the component mounting area, the lateral extensions and optionally the tie bars. Additionally or alternatively, at least one lead section can be formed as a separate body relative to the component mounting area, the lateral extensions and optionally the tie bars, and can be electrically coupled with the component mounting area and / or at least one electronic component mounted on the component mounting area by one or more electrically conductive connection structures, such as connection wires and / or clips. For example, the lead sections can be arranged along edges of the component mounting area where no lateral extensions and / or tie bars are present. In the context of the present application, the term "lead" can in particular denote an electrically conductive (e.g. strip-shaped) element (which can be flat or curved) that can be functionally assigned to the carrier and used for contacting an electronic component with the outside of the package. For example, the leads can be partially encapsulated and partially exposed relative to the encapsulation material. When the carrier forms part of a lead frame, the leads can for example surround the die pads of the carrier on two opposite sides. The one or more leads can or can not form part of the carrier.

[0031] In one embodiment, the one or both inclined side walls can have a molded texture. Accordingly, the method can comprise forming the inclined side walls of the encapsulation material by the inclined side walls of the encapsulation tool cavity. This can enable a molded texture. In the context of the present application, the term "molded texture" can in particular denote a characteristic surface profile of the flanks formed by molding. In particular, such a molded texture can comprise a smooth surface (in particular with a surface roughness Ra that is smaller than the surface roughness of flanks having a sawing texture) having microscopic surface pixels corresponding to filler particles added to the molding compound, which occur at the outer surface of the molded type encapsulation material and are coated with the molded encapsulation material (in particular a molded resin).

[0032] In one embodiment, the vertical side wall has a sawing texture. Accordingly, the method can comprise forming the vertical side wall of the encapsulation material by mechanical sawing. In the context of the present application, the term "sawing texture of the side wing or vertical side wall" can in particular denote a surface structure or surface profile defined on the side surface of the encapsulation material by sawing. Preferably, the sawing process is a mechanical sawing process using a saw blade. Alternatively, laser sawing can also be used. Due to this sawing process, in particular the mechanical sawing process using a saw blade, a rough surface texture is obtained (in particular a roughness Ra of more than 0.8 pm, in particular between 0.8 pm and 5 pm, for example of about 1 pm). This sawing roughness of the sawed side wing is combined with microscopic scratches, marks, grooves or corrugations formed by the sawing tool. For example, a mechanical saw blade can have a polyimide bond with diamond bodies for sawing, which can for example produce the mentioned sawing texture. In particular, the sawing texture of the at least one side wing can have a roughness Ra of more than 0.8 pm and be combined with corrugations, the size of which is greater than the size of the protrusions and indentations associated with the roughness. The roughness of a surface can be defined as center line average height Ra and can be measured as center line average height Ra. Ra is the arithmetic average of all distances from the profile to the center line. For example, as mentioned in the context of the present application, the measurement or determination of the roughness Ra of the sawed surface can be carried out in accordance with DIN EN ISO 4287:2010. The saw for forming the sawing texture can be denoted as a tool comprising a tough saw blade with a hard tooth edge. Such a saw can be used to cut through the metal material of the encapsulation material and optionally also of the one or more lead wires by placing the tooth edge against the material and moving it powerfully forward and less powerfully backward or continuously forward. For example, an electric circular saw blade can be used for this purpose. At the sawed side wing of the encapsulation material, in particular at the sawed side wing of the molding compound, a fracture surface can be obtained at which filler particles are also sawed at the surface of the sawed side wing. Thus, the sawed side wing can be defined by the material of the encapsulation material matrix described above and also partly by the cut uncoated filler particles.

[0033] In one embodiment, a main surface of the component mounting area facing away from the electronic component is exposed with respect to the encapsulation material. This exposed main surface of the component mounting area of the carrier can allow for an efficient removal of heat generated by the at least one electronic component during operation of the package. Since the carrier can be made partially or completely from a metallic material, which can also have a high thermal conductivity, heat dissipation through the exposed carrier surface can be much more efficient than through the material of the encapsulation material, which typically has a significantly lower thermal conductivity than the carrier. When the carrier is exposed with respect to the encapsulation material at one main surface of the package, an exposed electrically conductive surface can be provided, which can simplify electrical connections of the package and can also facilitate heat dissipation during operation of the package (in particular when the electronic component is a power semiconductor chip).

[0034] In one embodiment, the method comprises: providing a strip-shaped carrier structure comprising a carrier and at least one additional carrier comprising at least one additional component mounting area from which at least one additional lateral extension extends; mounting at least one additional electronic component on the at least one additional component mounting area; encapsulating at least a portion of the at least one additional electronic component and a portion of the at least one additional carrier by a strip-shaped encapsulation material structure, the encapsulation material also belonging to the strip-shaped encapsulation material structure, wherein the at least one additional lateral extension is clamped during encapsulating the at least a portion by at least one additional tool pin and / or by the encapsulation tool pin (one option: two adjacent mold fingers can be clamped by only one pin); and separating the obtained structure into individual packages, each package comprising a respective one of the carrier, a respective one of the electronic components, and a portion of the encapsulation material structure as a respective encapsulation material, such that each of the lateral extensions is laterally retracted with respect to adjacent vertical side walls of the respective one of the encapsulation materials, and such that each respective encapsulation material laterally covers the respective lateral extension.

[0035] Still with reference to the previously described embodiments, the method can comprise mounting additional electronic components on an additional (preferably conductive) carrier (which can be designed as the above-described carrier, in particular with one or more lateral extensions), such that the electronic components and the carrier are arranged in a plurality of rows and columns, encapsulating at least a portion of the additional carrier and the additional electronic components by an additional encapsulation material, and sawing vertical side walls or flanks of the encapsulation material structure to form individual encapsulation materials. Additional leads or lead segments can also be provided, and the leads or lead segments extending beyond the encapsulation material can be punched. Thus, the manufacturing method can be carried out on a leadframe or panel level, i.e. simultaneously for a plurality of carriers and a plurality of electronic components. This batch processing further reduces the manufacturing effort and allows for manufacturing the packages on an industrial scale. The carriers, and thus the packages, can be arranged in a matrix-like fashion in rows and columns. Descriptively, the sawing can be carried out horizontally, i.e. along the rows, while the punching can be carried out vertically, i.e. along the columns. In this way, a highly efficient manufacturing process can be obtained.

[0036] In particular, the method can comprise forming a plurality of parallel encapsulation material structures or strips of the encapsulation material and the additional encapsulation material, wherein each encapsulation material structure or strip at least partially encapsulates all carriers and all electronic components of a respective column. According to such a preferred embodiment, encapsulation material structures or strips can be formed which, for example, simultaneously cover all carriers and electronic components of a column of the matrix-like arrangement of the preforms of the packages. Thus, an arrangement of parallel, vertically extending strips or structures of encapsulation material can be obtained. This can be carried out very advantageously by molding. In particular, the formation of vertically extending strips of encapsulation material in combination with the horizontal extension of leads or lead segments can have the greatest advantage.

[0037] In one embodiment, the method comprises sawing each one of the encapsulation material structures or strips, thereby separating a plurality of packages. Thus, each encapsulation material structure or strip can be cut into a plurality of individual portions, each portion being assigned to a respective package. This cutting can be done by sawing, in particular mechanical sawing. However, sawing a plurality of encapsulation material structures or strips can also be carried out in a common process, wherein the saw blade can saw all parallel and spaced apart encapsulation material structures or strips by first sawing along a first horizontal saw line, then sawing along a second horizontal saw line, and so on.

[0038] In one embodiment, the method comprises connecting the carrier with at least one additional carrier by at least one tie bar and separating the obtained structure into individual packages by sawing through the encapsulation material structure and sawing through the at least one tie bar. For example, the method can comprise connecting at least one column of carriers with at least one tie bar. It is also possible to subsequently separate the obtained structure into a plurality of packages by sawing through the at least one tie bar. These tie bars can improve the stability of the obtained structure and the leadframe during the manufacturing of the packages. Advantageously, the cross section of the tie bars can be kept very small, so that the sawing process cuts through the encapsulation material mainly with a very small content of metal material.

[0039] In one embodiment, the method comprises punching the lead segments which extend beyond the encapsulation material and are electrically coupled with the carrier and / or the electronic components. The punching can result in a punched surface. In the context of the present application, the term "punched surface" can particularly denote a surface area which is defined by one or more leads and which is defined by the punching. Punching can denote a forming process using a punch press to force a tool, which can be denoted as a punch, through a workpiece to create a hole via shearing. Punching is applicable to a variety of sheet materials, including metal sheets. Punching is a simple and thus very efficient method of defining structures in a patterned sheet material. Accordingly, the punched surface is a surface which is defined by the punching. The person skilled in the art will understand that the punched surface has dedicated properties which the person skilled in the art can easily and unambiguously analyze. At the punched surface which defines the leads, the respective flanks of the encapsulation material can be defined by the encapsulation process, in particular by the molding. The respective encapsulation material, such as a molding compound, can comprise a matrix with filler particles, for example including a resin. At the molded surface which corresponds to the punched surface of the leads, the filler particles are coated by the matrix material of the encapsulation material, in particular of the molding compound type, so that a defined structure with coated pixels on the surface is formed. Furthermore, the molded flanks at the punched surface of the respective leads can be inclined, for example with an inclination angle between 6° and 12°, in particular between 8° and 10°, to facilitate the removal of the respective molded body from the molding tool.

[0040] In one embodiment, the method comprises punching prior to sawing. Thus, the above-mentioned encapsulation material structure or strip can remain intact and provide its stability after the punching. Finally, the above-mentioned encapsulation material structure or strip can be sawn into individual packages by a mechanical saw blade.

[0041] In one embodiment, the method comprises clamping on the lateral extensions by the encapsulation tool pins during the encapsulation, so that the component mounting areas are pressed on opposite surfaces of the encapsulation tool. This can prevent the carrier from tilting during the encapsulation process, so that an unintentional flow of the encapsulation material to the backside of the carrier can be reliably prevented. Thus, undesirable phenomena such as molding flash or bleeding can be suppressed.

[0042] In one embodiment, the leadframe can be used as a carrier structure. In the context of the present application, the term "leadframe" can particularly denote a kind of metal structure comprising an array of initially integrally connected carriers and leads for a package. Electronic components can be attached to the carriers of the leadframe, then connection wires and / or clips can be provided to attach the pads of the electronic components to the leads of the leadframe. Subsequently, the leadframe can be molded in a plastic housing or any other encapsulation material. Outside and / or inside the leadframe, respective parts of the leadframe can be cut off, thereby separating the respective leads and / or carriers. The leadframe can consist of a plurality of carriers for electronic components, wherein each carrier can have a component mounting area, at least one lateral extension, optionally a pull tab, and one or more leads or lead segments.

[0043] In one embodiment, the above-mentioned leadframe can comprise at least one pull tab extending along a column and connecting the carriers of at least one column. The pull tab on the level of the leadframe is very advantageous to hold the carriers together before separating them. In particular, without a connecting structure such as a pull tab, the carriers can be difficult to handle before encapsulation.

[0044] In one embodiment, the electronic component is configured as a power semiconductor chip. Thus, the electronic component, such as a semiconductor chip, can be used for power applications, for example in the automotive field, and can for example have at least one integrated insulated gate bipolar transistor (IGBT) and / or at least one transistor of another type, such as a MOSFET, a JFET, etc., and / or at least one integrated diode. Such integrated circuit elements can for example be manufactured in silicon technology or based on wide-bandgap semiconductors, for example silicon carbide or gallium nitride. The semiconductor power chip can comprise one or more field effect transistors, diodes, inverter circuits, half bridges, full bridges, drivers, logic circuits, further devices, etc.

[0045] As a substrate or wafer on which the electronic component is formed, a semiconductor substrate, preferably a silicon substrate, can be used. Alternatively, a silicon oxide or another insulator substrate can be provided. A germanium substrate or a III-V semiconductor material can also be implemented. For example, exemplary embodiments can be implemented in gallium nitride or silicon carbide technology.

[0046] For encapsulation, plastic or ceramic materials can be used, which can be supplemented by encapsulation material additives, such as filler particles, additional resins or other materials.

[0047] The above and other objects, features and advantages will become apparent from the following description of the embodiments, taken in conjunction with the accompanying drawings, which show at least one example of a preferred embodiment. Like reference numerals in the drawings designate like elements or components. BRIEF DESCRIPTION OF DRAWINGS

[0048] The accompanying drawings, which are included to provide a further understanding of the exemplary embodiments and constitute a part of this specification, illustrate the exemplary embodiments.

[0049] In the drawings:

[0050] Figure 1 A three-dimensional view of a package according to one exemplary embodiment is shown.

[0051] Figure 2 A top view of a package according to Figure 1 is shown.

[0052] Figure 3 A three-dimensional front view of a structure obtained during the manufacture of a package according to Figure 1 and Figure 2 is shown.

[0053] Figure 4 A three-dimensional back view of a structure obtained during the manufacture of a package according to Figure 1 and Figure 2 is shown.

[0054] Figure 5 A three-dimensional back view of a package according to another exemplary embodiment is shown.

[0055] Figure 6 A three-dimensional front view of a package according to Figure 5 is shown.

[0056] Figure 7 A three-dimensional front view of a structure obtained during the manufacture of a package according to Figure 5 and Figure 6 is shown.

[0057] Figure 8 A three-dimensional back view of a structure obtained during the manufacture of a package according to Figure 5 and Figure 6 is shown.

[0058] Figure 9 A three-dimensional back view of a package according to another exemplary embodiment is shown.

[0059] Figure 10 A three-dimensional front view of a package according to Figure 9 is shown.

[0060] Figure 11 A three-dimensional front view of a structure obtained during the manufacture of a package according to Figure 9 and Figure 10 is shown.

[0061] Figure 12 A three-dimensional front view of a structure obtained during the manufacture of a package according toFigure 9 and Figure 10 a three-dimensional back view of the structure obtained during the manufacturing of the package according to one exemplary embodiment.

[0062] Figure 13 a top view of the structure obtained during the manufacturing of the package according to one exemplary embodiment is shown.

[0063] Figure 14 different views of the package obtained from the structure according to Figure 13 one exemplary embodiment are shown.

[0064] Figure 15 a three-dimensional back view of a portion of the structure according to Figure 13 one exemplary embodiment is shown.

[0065] Figure 16 a side view and a top view of the structure obtained during the manufacturing of the package according to one exemplary embodiment are shown.

[0066] Figure 17 different views of the package obtained from the structure according to Figure 16 one exemplary embodiment are shown.

[0067] Figure 18 a three-dimensional back view of the structure obtained during the manufacturing of the package according to one exemplary embodiment is shown.

[0068] Figure 19 the package obtained from the structure according to Figure 18 one exemplary embodiment is shown.

[0069] Figure 20 a three-dimensional back view of the structure obtained during the manufacturing of the package according to one exemplary embodiment is shown.

[0070] Figure 21 a three-dimensional front view of the structure according to Figure 20 one exemplary embodiment is shown.

[0071] Figure 22 a flowchart of a method of manufacturing a package according to one exemplary embodiment is shown. DETAILED DESCRIPTION

[0072] The illustrations in the drawings are for the purpose of illustrating preferred embodiments and are not necessarily to scale.

[0073] Before the example embodiments are described in detail, some general considerations based on the example embodiments that have been developed will be outlined.

[0074] A recently developed manufacturing architecture for packages involves forming a common encapsulation material structure for a plurality of packages, and then separating by sawing through the encapsulation material and the metal carrier structure, and punching through the lead structure. The corresponding molding process can be supported by holding the molding pins of the pull bar during molding, and includes the above-mentioned sawing process as a final singulation.

[0075] However, since the molding pins above the pull bar form cavities, burrs from the pull bar can get stuck in these spaces during sawing. This can result in packages with noticeable burrs, which can exceed acceptable burr specifications.

[0076] According to one exemplary embodiment, a package having an outer contour partially defined by an encapsulation material includes a carrier, preferably at least partially electrically conductive, which can define another portion of the outer contour of the package. Such a carrier can have a component mounting area, such as a die pad, on which one or more electronic components, for example one or more semiconductor dies, are mounted. Advantageously, one or more lateral extensions can laterally, for example horizontally, extend from the component mounting area. The lateral extensions can be used to clamp them down onto an opposing surface by at least one encapsulation tool pin, while at the same time supplying flowable encapsulation material for encapsulating, for example during molding, a portion of the carrier and at least a portion of the electronic components. Clamping the lateral extensions and their component mounting areas to a surface can suppress or eliminate unintended flow of encapsulation material underneath the carrier that has not yet hardened. Advantageously, this can reliably prevent defects such as mold flash. Advantageously, the lateral extensions can be laterally displaced relative to adjacent, flat and preferably vertical side walls of the encapsulation material, which can be defined by sawing in a singulation process at the end of mass production. This can make the manufacturing process fast, since sawing through the metal of the lateral extensions can not be necessary. A reliable, fast and simple manufacturing can be combined, which can enable high throughput and manufacturability of the package on an industrial scale. Since the sawing process for singulation can extend at least predominantly or even completely through the encapsulation material, a package can be obtained in which the encapsulation material laterally on the lateral extensions. This can allow to avoid unintended burrs of exposed carrier material, which can unintentionally be created when sawing through the metal. By the described package design and corresponding manufacturing concept, undesirable phenomena such as mold flash, burrs, etc. can be suppressed or even eliminated. At the same time, the package can be produced in a fast and simple manner. Thus, the package according to one exemplary embodiment can combine excellent device reliability with a simple manufacturing process.

[0077] In short, the integration of lateral extensions (which can also be denoted as mold ears) in a package (e.g. in a pull tab supported or pull tab free configuration) can be achieved in such a way that the lateral extensions remain partially covered by the encapsulation material (in particular a molded) material at the lateral ends and spatially separated from the vertical side walls of the package. This avoids sawing through the lateral extensions, which are preferably metallic, in the singulation process, thereby preventing the occurrence of burrs, while benefiting from the lateral extensions, which can be pressed down by the encapsulation tool pins to avoid encapsulation material flow to the bottom side of the package.

[0078] For example, in a manufacturing concept involving common encapsulation material structures along the columns, the units of carriers and electronic components arranged in rows and columns can be provided with pull tabs connecting the units in the frame structure, or in a pull tab free manner. Each unit can have one or more lateral extensions (which can be denoted as mold ears) that can extend from the component mounting area (which can be denoted as die pads) for mold clamping. Advantageously, the one or more lateral extensions can be arranged in the package such that they do not reach the adjacent outer end of the package (which can be a vertical side wall) after sawing singulation to eliminate sawing burrs. In one exemplary embodiment, the entire pull tab can be maintained to contribute to the good planarity of the die pads, which can enable controlling the total stack height.

[0079] During molding, it can be necessary to keep the large die pad type component mounting areas of in particular the carriers free from tilting, which can otherwise lead to mold overflow or bleed out. The addition of one or more lateral extensions (which can be denoted as mold ears) for pin holders can mitigate this molding risk while eliminating the occurrence of sawing burrs. Advantageously, this manufacturing architecture can be applied to very different package types.

[0080] Advantageously, the manufacturing concept of including a common encapsulation material strip - each encapsulation material strip formed in a common manner for a linear array of carriers and electronic components - can facilitate achieving high density of the frame, thereby reducing the effort of producing the package. Advantageously, exemplary embodiments can eliminate the risk of sawing burrs. This can be particularly useful for all packages, especially for large packages. The respective package can have vertical side walls on the sides where the package is sawn open at the lateral extensions (and optional tie bars) sides, wherein only the encapsulation material (and optional tie bars) is sawn, such that the one or more lateral extensions do not reach the side walls of the package. This can result in the absence of lateral extension burrs at the vertical side walls of the package, wherein the one or more lateral extensions are partially or completely covered by the encapsulation material. Descriptively, at least one die finger feature at the sawn side of the package assembled by the multi-package encapsulation material strip concept can be spatially displaced from the sawn side wall of the package to avoid cumbersome sawing through the metal lateral extensions.

[0081] More specifically, the package units can be arranged in an ultra-high density manner with a common strip-like encapsulation material structure, and optional tie bars connecting the units together in the frame. Each unit can have an extension for mold clamping from the die pad (which can be referred to as a die finger) that does not reach the active side of the package after singulation to eliminate sawing burrs. With this approach, the saw blade for singulation can only pass through the mold compound (and optional tie bars, if any) along the cut without contacting or disturbing the die finger, so that no sawing burrs occur.

[0082] The respective package can be sawn through the encapsulation material at the (optional) tie bar and die finger sides, only the encapsulation material (and tie bars, if any) can be sawn during molding, while the die finger or lateral extensions do not reach the side edges of the package. The two sides of the package (which can be denoted as tie bar sides, if tie bars are present) can be separated preferably via a mechanical sawing process rather than by stamping.

[0083] In one embodiment, a method of integrating a mold or lateral extension into a package (e.g. of a pull tab support) can be provided. In such a method, a portion of a carrier (which can be denoted as a lateral extension or mold) - which is preferably metallic - can extend slightly outward from the die pads of the carrier, but not all the way to the active side of the package, thereby eliminating sawing burrs due to sawing singulation in a comparative scenario where the lateral extension extends all the way to the vertical sidewall of the package. Advantageously, the lateral extension can be used by an encapsulation tool pin (such as a molding pin or clamp) to hold onto the lateral extension during the encapsulation (preferably molding) process, wherein the encapsulation tool pin holds the lateral extension (and optionally also the pull tab). Advantageously, the shorter length of the lateral extension eliminates the possibility of sawing burrs, as the lateral extension does not come into contact with the saw during the sawing singulation of the package. The pull tab can help maintain the planarity of the die pads, thereby controlling the height of the overall stack. Furthermore, the assembly of the (e.g. clamped) package can enable high density in the leadframe, thereby reducing manufacturing effort. In one embodiment, it can be beneficial to add a lateral extension for the pin to hold the die pads, as the die pad type component mounting area can need to be stabilized to avoid flash or bleed-out of the encapsulation material (particularly molding) due to tilting. Furthermore, this can also eliminate the formation of burrs during the sawing process.

[0084] Figure 1 A three-dimensional view of a package 100 according to one exemplary embodiment is shown. Figure 2 A top view of the package 100 according to Figure 1 is shown. Figure 1 and Figure 2 the same side of the package 100 is mainly shown. Figure 3 and Figure 4 additional features are shown.

[0085] The package 100 according to Figure 1 and Figure 2 comprises a carrier 102, which can comprise or consist of a metal such as copper. For example, the carrier 102 can be implemented as a leadframe structure. Since a major portion of the carrier 102 is encapsulated by an encapsulation material 112 such as a molding compound, the major portion of the carrier 102 is not visible in Figure 1 and Figure 2 However, Figure 1 and Figure 2 the configuration of the carrier 102 of the package 100 according to Figure 3 can be better seen in Figure 3 a preform is shown, Figure 1 and Figure 2The packages 100 have been singulated from the preform. The carrier 102 includes a component mounting area 104, which may be implemented as a die pad.

[0086] Lateral extensions 106, which may also be referred to as mold ears, extend from the lateral side edges of the component mounting area 104. During the encapsulation process, i.e., during the formation of the encapsulation material 112, the lateral extensions 106 may be configured to be used to encapsulate tool pins (see Figure 18 This can prevent unwanted molding flash or molding ooze from occurring at the exposed side of the component mounting area 104 of the package body 100 (see Figure 3 ). Therefore, as a unique feature of this manufacturing process, the encapsulation material 112 has a blind hole-type edge recess 116 in the vertical side wall 114, which extends to only one of the two opposite main surfaces 118, 120 of the package body 100. The recess 116 is arranged at the location where the encapsulation tool pin 108 already exists during the encapsulation process. The recess 116 is formed as a notch that extends laterally and vertically into the encapsulation material 112, thereby exposing a portion of the lateral extension 106. Therefore, the encapsulation material 112 has a recess 116 in the vertical side wall 114 that extends to only one of the two opposite main surfaces 118, 120 of the package body 100, so that the lateral extension 106 is exposed in the recess 116. The recess 116 is partially bounded by the lateral extension 106 and partially bounded by the encapsulation material 112. Thus, lateral extension 106 is exposed in recess 116. The horizontal bottom surface defining recess 116 has an outer encapsulation material section adjacent vertical sidewall 114 and an inner metal section defined by lateral extension 106. The vertical surface section defining recess 116 is defined solely by encapsulation material 112.

[0087] For example, Figure 14 As shown, electronic component 110 can be mounted on the encapsulated surface of component mounting area 104. For example, electronic component 110 can be a semiconductor die, such as a power semiconductor die. Electronic component 110 can be assembled on component mounting area 104 using a conductive connection medium (such as solder, sintering material, and / or conductive glue). Multiple electronic components can also be mounted on component mounting area 104.

[0088] The already mentioned encapsulation material 112 may completely encapsulate the electronic component 110 and partially encapsulate the carrier 102 .

[0089] Now refer to it again Figure 1 and Figure 2, the lateral extension 106 is laterally retracted with respect to the adjacent outermost vertical side wall 114 of the encapsulation material 112. Thus, the lateral extension 106 extends towards, but not to, the vertically closest vertical side wall 114 defined at least predominantly by the encapsulation material 112. As Figure 1 and Figure 2 illustrate, the encapsulation material 112 laterally covers the lateral extension 106 such that the encapsulation material 112 extends to the vertical side wall 114, while the lateral extension 106 remains spaced apart with respect to the vertical side wall 114. The lateral spacing between the lateral extension 106 and the vertical side wall 114 of the package 100 has the advantage that, when separating the package 100 from a larger compound, the mechanical saw blade mainly saws through the encapsulation material 112 to form the vertical side wall 114, but does not have to cut through the metallic lateral extension 106. This accelerates and simplifies the sawing process, while preventing burrs at the lateral extension 106 that can be generated by the cutting of metal.

[0090] As can be best seen in Figure 2 and Figure 3 , the carrier 102 comprises a further lateral extension 107 extending from the other side edge of the component mounting area 104 and is configured to be clamped by a further encapsulation tool pin (see reference sign 109 in Figure 18 or even by the same encapsulation tool pin 108) during encapsulation. The further lateral extension 107 and the respective further recess 116 partially delimited by the further lateral extension 107 can be configured as described above for the lateral extension 106 partially delimiting the aforementioned recess 116 (see Figure 2 ). More specifically, the further lateral extension 107 is laterally retracted with respect to the adjacent further outermost vertical side wall 115 of the encapsulation material 112. Moreover, the encapsulation material 112 laterally covers the further lateral extension 107 as well. As Figure 2 and Figure 3 illustrate, the lateral extension 106 and the further lateral extension 107 extend from opposite sides of the component mounting area 104 and are laterally retracted with respect to the opposite vertical side walls 114, 115 of the encapsulation material 112. Thus, the lateral extensions 106, 107 extend from opposite side edges of the component mounting area 104 and are partially exposed in the bottom wall of the blind hole type recesses 116, 116 formed in the opposite vertical side walls 114, 115 of the encapsulation material 112 and the package 100 as a whole.

[0091] Reference is now made to Figure 1 , further reference being made to Figure 3 and Figure 4The package 100 includes pull tabs 122, 123 extending from the component mounting area 104 and exposed at the vertical sidewall 114 of the encapsulation material 112. As shown, the lateral extension 106 extends between two pull tabs 122, 123 that extend from the same side edge of the component mounting area 104 from which the lateral extension 106 also extends. Correspondingly, the package 100 includes further pull tabs 150, 151 (see Figure 3 ), the other lateral extension 107 also extending from this side edge and being exposed at the opposite vertical sidewall 115 of the encapsulation material 112. The other lateral extension 107 extends between two further pull tabs 150, 151 extending from the component mounting area 104.

[0092] As best seen in Figure 3 , each of the lateral extensions 106, 107 has a smaller length in a longitudinal length direction 152 extending from the respective designated side edge of the component mounting area 104 to a free end of the respective lateral extension 106, 107 than the pull tabs 122, 123, 150, 151. Further, each of the lateral extensions 106, 107 can have a larger width in a transverse width direction 154 perpendicular to the longitudinal length direction 152 and within a plane defined by the component mounting area 104 and the pull tabs 122, 123, 150, 151. The thickness of the lateral extensions 106, 107 can be the same as the thickness of the pull tabs 122, 123, 150, 151 and / or as the thickness of the component mounting area 104. For example, the lateral extensions 106, 107, the pull tabs 122, 123, 150, 151 and the component mounting area 104 can be formed based on a common metal sheet, which can be patterned and / or curved.

[0093] As best seen in Figure 1As best visible, the vertical sidewall 114 is formed only by the encapsulation material 112 and the pull tabs 122, 123. Correspondingly, the vertical sidewall 115 is formed only by the encapsulation material 112 and the pull tabs 150, 151. In contrast thereto, the lateral extensions 106, 107 do not form part of the vertical sidewalls 114, 115. When sawing the larger encapsulation material structure to separate the package 100, the mechanical saw blade essentially only saws through the molding compound and through the tiny pull tabs 122, 123, 150, 151. There is no need to saw through the laterally retracted lateral extensions 106, 107, so that the risk of forming burrs due to the lateral extensions 106, 107 can be eliminated. In short, a respective mold lip (in the form of the lateral extensions 106, 107) can be provided on each sawing side of the package 100 (i.e. at the vertical sidewalls 114, 115) without any copper burr being created. The extended die pad type component mounting area 104 with mold lip type lateral extensions 106, 107 can be configured such that the lateral extensions 106, 107 do not reach the side of the package 100. Thus, the laterally extending lateral extensions 106, 107 from the die pad type component mounting area 104 can be used for mold clamping, but do not reach the active side of the package 100 after sawing singulation to eliminate sawing burrs.

[0094] The package 100 further comprises electrically conductive (preferably metallic, e.g. made of copper) lead segments 124, 126 which extend partially within the encapsulation material 112 and partially outside the encapsulation material 112. The lead segment 124 can be formed integrally with the component mounting area 104. The lead segment 126 can be a separate body from the component mounting area 104, but can be electrically coupled with the electronic component 110 and / or with the component mounting area 104 by one or more electrically conductive connection elements such as clips and / or connection wires, not shown. Both lead segments 124, 126 extend out of the encapsulation material 112 at two opposite inclined sidewalls 128, 129 of the encapsulation material 112. The inclined sidewalls 128, 129 can be defined by the contour of the cavity of the encapsulation tool used for encapsulating the package 100 (i.e. for forming the encapsulation material 112, preferably by molding). Thus, the surface of both inclined sidewalls 128, 129 can have a molding texture which is a unique point of the molding process performed to define the inclined sidewalls 128, 129. In contrast thereto, the surface of the vertical sidewalls 114, 115 is formed by sawing and thus has a sawing texture. By inspecting the respective texture, a skilled person can distinguish between a sawing texture and a molding texture.

[0095] As in Figure 3As best visible, the substantially rectangular component mounting area 104 of the carrier 102 has two opposite side edges from which the lateral extensions 106, 107 and the pull bars 122, 123, 150, 151 extend. The lead segments 124, 126 are arranged at the two remaining side edges of the component mounting area 104 and opposite to each other.

[0096] Although not shown in Figure 1 and Figure 2 , it is shown that the main surface of the component mounting area 104 facing away from the encapsulated electronic component 110 is exposed with respect to the encapsulation material 112. Thus, heat dissipation from the encapsulated electronic component 110 can be efficiently performed via the exposed high heat conductive surface of the component mounting area 104. Figure 3

[0097] The two opposite main surfaces 118, 120 of the package can be parallel to each other. The vertical side walls 114, 115 can extend perpendicular to the main surfaces 118, 120. The inclined side walls 128, 129 can be inclined with respect to the vertical side walls 114, 115 and with respect to the main surfaces 118, 120. For example, the angle of inclination of the inclined side walls 128, 129 with respect to the vertical side walls 114, 115 can be in the range of 6° to 12°.

[0098] Figure 3 A three-dimensional front view of a structure obtained during manufacturing of a package 100 according to Figure 1 and Figure 2 is shown. Figure 4 A three-dimensional back view of a structure obtained during manufacturing of a package 100 according to Figure 1 and Figure 2 is shown.

[0099] For manufacturing the package 100, a carrier 102 can be provided having a component mounting area 104 from which lateral extensions 106, 107 extend. An electronic component 110 can be mounted on one of the two opposite main surfaces of the component mounting area 104. Thereafter, a portion of the carrier 102 and the electronic component 110 can be encapsulated by a molding type encapsulation material 112. During encapsulation, the lateral extensions 106, 107 can be clamped by the encapsulation tool pins 108, 109. The encapsulation process can be adjusted such that the lateral extensions 106, 107 are laterally retracted with respect to the respective adjacent vertical side walls 114, 115 of the encapsulation material 112. Further, the encapsulation process can be configured such that the encapsulation material 112 laterally covers the lateral extensions 106, 107.

[0100] Reference is now made to a use of a package 100 according to Figure 3 and Figure 4 ​The batch manufacturing process of the structure can provide an integrally formed strip carrier structure 132 comprising the carrier 102 and the additional carriers 103. Each additional carrier 103 can comprise an additional component mounting area 105 from which two additional opposite laterally extending portions 134 extend. For each additional carrier 103, an additional pull tab 156 can be provided which can have the properties corresponding to the pull tabs 122, 123, 150, 151 described above. As shown, the carrier 102 and the additional carriers 103 are connected to each other by the pull tabs 122, 123, 150, 151, 156.

[0101] Furthermore, additional electronic components 111 can be mounted on the additional component mounting areas 105, more precisely one or more electronic components 111 are mounted on each additional component mounting area 105.

[0102] Thereafter, parts of the additional carriers 103 and the additional electronic components 111 can be encapsulated together with the electronic components 110 and the carrier 102 by an integrally formed strip encapsulation material structure 130 which can be shaped as a strip. The encapsulation material 112 of the package 100 described above also belongs to the strip-shaped strip encapsulation material structure 130. As described above for the laterally extending portions 106, 107, the additional laterally extending portions 134 are clamped by additional tool pins (see reference sign 136 in Figure 18 ) and / or by the same encapsulation tool pins 108, 109 which clamp the laterally extending portions 106, 107, 134 during the encapsulation process. At the end of the encapsulation process, the encapsulation tool pins 108, 109, 136 can be retracted or removed, thereby forming the recesses 116. Thus, the multi-package structure shown in Figure 3 and Figure 4 is obtained. More specifically, the manufacturing method can comprise clamping on the laterally extending portions 106, 107, 134 by the encapsulation tool pins 108, 109, 136 during encapsulation such that the respective component mounting areas 104, 105 are pressed onto the opposing surfaces of the encapsulation tool to avoid molding flash. In Figures 1 to 4 embodiments of the manufacturing method, the clamping on the laterally extending portions 106, 107, 134 by the encapsulation tool pins 108, 109, 136 can occur during the entire encapsulation process until the encapsulation material structure 130 is cured completely, thereby forming recesses 116 in the encapsulation material 112, 113 in which the laterally extending portions 106, 107, 134 are exposed. At the end of the encapsulation process, the encapsulation tool pins 108, 109, 136 can be removed.

[0103] Subsequently, the obtained multi-package structure is separated into individual packages 100, each package 100 comprising a respective one of the carriers 102, 103, a respective one of the electronic components 110, 111, and a portion of the encapsulation material structure 130 as a respective encapsulation material 112, 113. In the obtained individual packages 100, each of the lateral extensions 106, 107, 134 is laterally retracted with respect to an adjacent vertical side wall 114, 115 of the respective one of the encapsulation materials 112, 113. Further, each respective encapsulation material 112, 113 laterally covers the respective lateral extension 106, 107, 134. During the separation of the obtained multi-package structure into individual packages 100, a mechanical saw blade (not shown) can saw through the encapsulation material structure 130 and through the pull bars 122, 123, 150, 151, 156. In contrast, the retracted bar-shaped structures 106, 107, 134 are not sawn, avoiding burrs. Further, the vertical side walls 114, 115 of the encapsulation materials 112, 113 can be formed and defined by the mechanical sawing. In contrast, other inclined side walls 128, 129 of the encapsulation materials 112, 113 are defined by the inclined side walls of the encapsulation tool cavities, i.e. by the molding process. The lead segments 124, 126 extending beyond the encapsulation materials 112, 113 and electrically coupled with the carriers 102, 103 and / or the electronic components 110, 111 can be separated by stamping from other structures, e.g. Figure 3 and Figure 4 structures (see, e.g. Figure 13 ). Advantageously, the stamping can be performed before the sawing, so that the mechanical integrity provided by the bar-shaped encapsulation material structure 130 can be maintained almost until the end of the manufacturing process.

[0104] Advantageously, the mold ears or lateral extensions 106, 107, 134 maintain stability during encapsulation and avoid tilting of the die pad type component mounting areas 104, 105. According to Figures 1 to 4 , the encapsulation tool pins 108, 109, 136 remain pressed on the respective lateral extensions 106, 107, 134 until the end of the encapsulation process. The pull bars 122, 123, 150, 151, 156 provide additional stability.

[0105] Figure 1 Fig. 16 in Figure 1 Fig. 17 in

[0106] Figure 5A three-dimensional back view of the package 100 according to another exemplary embodiment is shown. Figure 6 A three-dimensional front view of the package 100 according to Figure 5 another exemplary embodiment is shown. Figure 7 A three-dimensional front view of a structure obtained during the manufacturing of the package 100 according to Figure 5 another exemplary embodiment is shown. Figure 6 A three-dimensional back view of a structure obtained during the manufacturing of the package 100 according to Figure 8 another exemplary embodiment is shown. Figure 5 A three-dimensional front view of a structure obtained during the manufacturing of the package 100 according to Figure 6 another exemplary embodiment is shown.

[0107] Figures 5 to 8 The embodiments according to the present application differ from the embodiments according to the present application in particular in that, according to the present application, each of the lateral extensions 106, 107, 134 is vertically separated from the recess 116 by the encapsulation material 112. In other words, in the embodiments according to the present application, the lateral extensions 106, 107, 134 are not exposed in the recess 116, but are covered by the encapsulation material. Thus, according to the present application, the bottom surface of the recess 116 is defined only by the encapsulation material. Figures 1 to 4 Figures 5 to 8 This can be achieved by modifying the manufacturing method described above in that, according to the present application, the encapsulation tool pins 108, 109, 136 are pressed against the lateral extensions 106, 107, 134 only during the first part of the encapsulation process, but are retracted before the encapsulation material 112 has completely solidified during the second part of the encapsulation process. For example, the encapsulation tool pins 108, 109, 136 can be lifted up during transfer molding (e.g. after 50% of most processes). Thus, the encapsulation material, which has not yet completely solidified and is still flowable, can fill a portion of the recess 116, thereby covering the lateral extensions 106, 107, 134. This will result in a recess 116 in the encapsulation material 112, 113, wherein the lateral extensions 106, 107, 134 are vertically separated from the respective recess 116 by the respective encapsulation material 112, 113. Figures 5 to 8 Figures 5 to 8 A three-dimensional back view of the package 100 according to another exemplary embodiment is shown.

[0108] A three-dimensional front view of the package 100 according to Figures 5 to 8 another exemplary embodiment is shown. A three-dimensional front view of a structure obtained during the manufacturing of the package 100 according to

[0109] another exemplary embodiment is shown. Figure 9 A three-dimensional back view of a structure obtained during the manufacturing of the package 100 according to Figure 10 another exemplary embodiment is shown. Figure 9 A three-dimensional front view of a structure obtained during the manufacturing of the package 100 according to Figure 11 another exemplary embodiment is shown. Figure 9 A three-dimensional back view of a structure obtained during the manufacturing of the package 100 according to Figure 10 another exemplary embodiment is shown. Figure 12 A three-dimensional front view of a structure obtained during the manufacturing of the package 100 according to Figure 9 another exemplary embodiment is shown. Figure 10a three-dimensional back view of the structure obtained during the manufacturing of the package 100 according to one exemplary embodiment.

[0110] Figures 9 to 12 The embodiment of the package 100 according to one exemplary embodiment differs from the embodiment of the package 100 according to Figures 1 to 4 The embodiment of the package 100 according to one exemplary embodiment differs from the embodiment of the package 100 according to Figures 9 to 12 The embodiment of the package 100 according to one exemplary embodiment differs from the embodiment of the package 100 according to Figures 9 to 12 The embodiment of the package 100 according to one exemplary embodiment differs from the embodiment of the package 100 according to Figures 9 to 12 The embodiment of the package 100 according to one exemplary embodiment differs from the embodiment of the package 100 according to

[0111] The sawing process for separating individual packages 100 according to one exemplary embodiment is particularly simple, since it is sufficient to saw through the molding compound only. The stability of the die pad type component mounting areas 104, 105 during the encapsulation is achieved only by the cooperation of the lateral extensions 106, 107, 134 with the encapsulation tool pins 108, 109, 136. Figures 9 to 12

[0112] A top view of the structure obtained from the structure according to one exemplary embodiment is shown. Figure 13 Different views of the package 100 obtained from the structure according to one exemplary embodiment are shown. Figure 14 Figure 13 Corresponds to one embodiment of the manufacturing of the package 100 as described above with reference to

[0113] Corresponds to one embodiment of the manufacturing of the package 100 as described above with reference to Figure 13 The carrier 102, 103 is shown arranged as an integrally formed carrier structure 132 in rows and columns, wherein a respective integrally formed strip-shaped encapsulation material structure 130 can be formed for each row or each column. Figures 1 to 4 Figure 13 The illustrated embodiment relates to a clip-on package, which can be manufactured in a low-cost and high-density manner based on a leadframe architecture. With the illustrated batch manufacturing architecture, 144 packages 100 can be manufactured.

[0114] The illustrated embodiment relates to a clip-on package, which can be manufactured in a low-cost and high-density manner based on a leadframe architecture. With the illustrated batch manufacturing architecture, 144 packages 100 can be manufactured.

[0115] Figure 14 The top side of the package 100 according to one exemplary embodiment shows a cross-sectional view of the respective package 100. Figure 14 The bottom of the package 100 according to one exemplary embodiment shows a transparent top view of such a package 100.

[0116] Figure 15 A three-dimensional back view of a portion of the structure according to one exemplary embodiment is shown. Furthermore, Figure 13 The structure shown in the middle corresponds to the structure shown in the left. Figure 15 The structure shown in the middle corresponds to the structure shown in the left. Figure 4

[0117] Figure 15 ​​A sawing line 162 is shown along which the multi-package structure can be separated by sawing to obtain the individual package 100. Figure 15

[0118] With the described embodiments, full assistance of the pull bars 122, 123, 150, 151, 156 can be maintained to obtain good planarity of the die pad type component mounting areas 104, 105. This can enable control of the total stack height. It can be advantageous to maintain large die pads during molding to avoid tilting, preventing molding flash or bleed-out. The addition of mold ear type lateral extensions 106, 107, 134 for clamping by pin holders can mitigate the risk of molding flash, while the occurrence of sawing burrs can be eliminated.

[0119] The illustrated recesses 116 are openings resulting from the holding of the mold ears by molding pins or clamps during the molding process.

[0120] Figure 16 A side view (see top) and a top view (see bottom) of a structure obtained during the manufacturing of a package 100 according to one exemplary embodiment is shown. Figure 17 Different views of a package 100 obtained from a structure according to Figure 16 Figure 16 The embodiment of Figure 17 corresponds to a smaller version of the package 100 according to Figures 1 to 4 Furthermore, this embodiment provides a package 100 configured to eliminate sawing burrs. Again, the recesses 116 are openings resulting from the holding of the mold ears by molding pins or clamps during the molding process.

[0121] Figure 18 A three-dimensional back view of a structure obtained during the manufacturing of a package 100 according to one exemplary embodiment is shown. Figure 19 A package 100 obtained from a structure according to Figure 18 Figure 19 The construction of the package 100 according to Figures 5 to 8 corresponds to the embodiment of

[0122] In particular, Figure 18 ​​​Encapsulation tool pins 108, 109, 136 are shown that can press down on lateral extensions 106, 107, 134 during a portion of the encapsulation process to avoid encapsulation material from seeping to the opposite side of the component mounting area 104, 105 of the connection. After the portion of the encapsulation process is complete, the encapsulation tool pins 108, 109, 136 can be lifted up, as indicated by reference numeral 166. When the encapsulation process is not yet complete at the time of lifting, the lateral extensions 106, 107, 134 thus exposed can be covered by a material skin of the encapsulation material 112, 113, wherein a recess 116 in the encapsulation material 112, 113 can still remain due to the temporary presence of the encapsulation tool pins 108, 109, 136. Thus, retractable pins can also be used on the mold ears and / or the pull bar during molding. A flash-free package 100 can be achieved. After retracting to a certain height, the recess 116 forms an imprint or a mark of the retractable pin.

[0123] Figure 20 A three-dimensional back view of a structure obtained during manufacturing of a package 100 according to one exemplary embodiment is shown. Figure 21 A three-dimensional front view of a structure according to Figure 20 This embodiment corresponds to a pull bar free package 100 formed according to the embodiment described above Figures 9 to 12 Likewise, the recess 116 forms an opening resulting from the mold ears being held by molding pins or clamps during molding.

[0124] Figure 22 A flowchart 200 of a method of manufacturing a package 100 according to one exemplary embodiment is shown. The reference numerals of the following description of the manufacturing method relate to Figure 1 and Figure 21 the embodiments described above.

[0125] With reference to block 202, the method comprises providing a carrier 102 comprising a component mounting area 104 from which a lateral extension 106 extends.

[0126] With reference to block 204, the method comprises mounting an electronic component 110 on the component mounting area 104.

[0127] With reference to block 206, the method comprises encapsulating at least a portion of the electronic component 110 and a portion of the carrier 102 by an encapsulation material 112, wherein during encapsulating the at least a portion, the lateral extension 106 is clamped by an encapsulation tool pin 108.

[0128] With reference to block 208, the method comprises adjusting the encapsulation process such that the lateral extension 106 is retracted laterally with respect to an adjacent vertical side wall 114 of the encapsulation material 112 and such that the encapsulation material 112 laterally covers the lateral extension 106.

[0129] It should be noted that the term "comprising" does not exclude other elements or features and "a" or "an" does not exclude a plurality. Also, means plus function or step plus function limitations that follow from indicated actions of devices, structures or means do not require that the corresponding actions be performed by computers or machines. Furthermore, the term "comprising" is used in the context of open and non-restrictive claims that do not require any specific features. Moreover, the term "comprising" does not exclude that there are also additional features. Also, the term "a" or "an" does not exclude a plurality. Further, it is noted that the use of certain terms, such as "a", "an", "the", "at least one" or "one", can not exclude a plurality of these elements. Furthermore, the use of the term "about" in connection with a numerical value qualifies that value, but does not exclude that the value is exactly the value as stated. Also, the use of the term "in about” in connection with a numerical value qualifies that value, but does not exclude that the value is exactly the value as stated. Also, the use of the term "in about” in connection with a numerical value qualifies that value, but does not exclude that the value is exactly the value as stated. Also, the use of the term "in about” in connection with a numerical value qualifies that value, but does not exclude that the value is exactly the value as stated

Claims

1. A package (100), comprising: A carrier (102) comprising a component mounting area (104) from which extend lateral extensions (106), the lateral extensions (106) being configured for being gripped by encapsulation tool pins (108) during encapsulation; electronic components (110) mounted on the component mounting area (104); and an encapsulation material (112) encapsulating at least a portion of the electronic component (110) and a portion of the carrier (102); • wherein the lateral extension (106) is laterally retracted relative to an adjacent vertical sidewall (114) of the encapsulation material (112), and the encapsulation material (112) laterally covers the lateral extension (106).

2. The package (100) according to claim 1, wherein The carrier (102) includes another lateral extension (107) extending from the component mounting area (104), which is configured to be clamped by another encapsulation tool pin (109) during encapsulation, the other lateral extension (107) being laterally retracted relative to another adjacent vertical side wall (115) of the encapsulation material (112), and the encapsulation material (112) laterally covering the other lateral extension (107).

3. The package (100) according to claim 2, wherein: A lateral extension (106) and another lateral extension (107) extend from opposite sides of the component mounting area (104) and are laterally set back relative to opposite vertical side walls (114, 115) of the encapsulation material (112).

4. The package (100) according to any one of claims 1 to 3, wherein: The encapsulation material (112) has a recess (116) in the vertical sidewall (114) that extends vertically to only one of the two opposing major surfaces (118, 120) of the package (100).

5. The package (100) according to claim 4, wherein: The lateral extension (106) is exposed in the recess (116).

6. The package (100) according to claim 4, wherein: The lateral extension (106) is vertically separated from the recess (116) by the encapsulation material (112).

7. The package (100) according to any one of claims 1 to 6, wherein: The package (100) includes at least one tie rod (122) extending from a component mounting area (104) and exposed at a vertical sidewall (114) of an encapsulation material (112).

8. The package (100) according to claim 7, wherein: The package (100) includes at least one of the following features: A lateral extension (106) extends between two tie rods (122, 123) extending from the component mounting area (104); The lateral extension (106) has a smaller length and / or a larger width than the at least one tie rod (122) and / or the same thickness as the at least one tie rod (122).

9. The package (100) according to any one of claims 1 to 6, wherein: The package (100) is configured as a tie-bar-less package.

10. The package (100) according to any one of claims 1 to 9, wherein: The package (100) includes at least one of the following features: The vertical sidewall (114) is formed only of the encapsulation material (112), or only of the encapsulation material (112) and at least one tie rod (122); The package (100) comprises one or more conductive lead segments (124, 126), in particular, at least one of the one or more conductive lead segments (124, 126) is formed integrally with the component mounting area (104) and / or at least one of the one or more conductive lead segments (124, 126) is formed separately from the component mounting area (104), and the one or more conductive lead segments (124, 126) extend from the encapsulation material (112) at one or two inclined side walls (128, 129) of the encapsulation material (112), and the one or two inclined side walls (128, 129) in particular have a molded texture; A major surface of the component mounting area (104) facing away from the electronic component (110) is exposed relative to the encapsulation material (112); The vertical sidewalls (114) have a saw cut texture.

11. A method for manufacturing a package (100), the method comprising: providing a carrier (102) comprising a component mounting area (104) with lateral extensions (106) extending from the component mounting area (104); Mounting the electronic component (110) on the component mounting area (104); encapsulating at least a portion of the electronic component (110) and a portion of the carrier (102) by an encapsulation material (112), wherein the lateral extensions (106) are clamped by encapsulation tool pins (108) during at least a portion of the encapsulation; and • Adjusting the encapsulation process so that the lateral extensions (106) are laterally retracted relative to adjacent vertical sidewalls (114) of the encapsulation material (112) and so that the encapsulation material (112) laterally covers the lateral extensions (106).

12. The method according to claim 11, wherein The method comprises: providing a strip-shaped carrier structure (132) comprising a carrier (102) and at least one additional carrier (103), the at least one additional carrier (103) comprising at least one additional component mounting area (105), at least one additional lateral extension (134) extending from the at least one additional component mounting area (105); Mounting at least one additional electronic component (111) on the at least one additional component mounting area (105); encapsulating at least a portion of the at least one additional electronic component (111) and a portion of the at least one additional carrier (103) by means of a strip-shaped encapsulation material structure (130), the encapsulation material (112) also belonging to the strip-shaped encapsulation material structure (130), wherein the at least one additional lateral extension (134) is clamped during at least a portion of the encapsulation by at least one additional tool pin (136) and / or by the encapsulation tool pin (108); and separating the obtained structure into individual packages (100), each package (100) comprising a respective one of the carriers (102, 103), a respective one of the electronic components (110, 111), and a portion of the encapsulating material structure (130) as a respective encapsulating material (112, 113), such that each of the lateral extensions (106, 134) is laterally retracted relative to an adjacent vertical side wall (114) of a respective one of the encapsulating materials (112, 113), and such that each respective encapsulating material (112, 113) laterally covers the respective lateral extension (106, 134).

13. The method according to claim 12, wherein: The method comprises: connecting the carrier (102) to the at least one additional carrier (103) via at least one tie rod (122, 123); and The obtained structure is separated into individual packages (100) by sawing through the encapsulation material structure (130) and sawing through the at least one tie rod (122, 123).

14. The method according to any one of claims 11 to 13, wherein The method includes forming vertical sidewalls (114) of an encapsulation material (112) by mechanical sawing.

15. The method according to any one of claims 11 to 14, wherein The method includes forming another inclined sidewall (128) of the encapsulation material (112) through the inclined sidewall of the encapsulation tool cavity.

16. The method according to any one of claims 11 to 15, wherein The method includes stamping lead segments (124, 126) that extend beyond an encapsulation material (112) and are electrically coupled to a carrier (102) and / or an electronic component (110).

17. The method according to claims 14 and 16, wherein The method includes punching prior to sawing.

18. The method according to any one of claims 11 to 17, wherein The method includes clamping the component mounting area (104) onto the lateral extension (106) by an encapsulation tool pin (108) during encapsulation so that the component mounting area (104) is pressed against an opposing surface of the encapsulation tool.

19. The method according to claim 18, wherein The method includes clamping the lateral extension (106) with an encapsulation tool pin (108) throughout the encapsulation process so that a recess (116) is formed in the encapsulation material (112) and the lateral extension (106) is exposed in the recess (116).

20. The method according to claim 18, wherein The method includes clamping onto the lateral extension (106) with an encapsulation tool pin (108) during a first portion of the encapsulation process, and retracting the encapsulation tool pin (108) during a second portion of the encapsulation process such that a recess (116) is formed in the encapsulation material (112), with the lateral extension (106) vertically separated from the recess (116) by the encapsulation material (112).

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