Heat dissipation testing device for non-embedded integrated chip

Abstract

The invention discloses a non-embedded integrated chip heat dissipation testing device which comprises a supporting base, a cooling liquid inlet and outlet substrate is arranged on the supporting base, a manifold layer structure is arranged on the cooling liquid inlet and outlet substrate, and the manifold layer structure and a micro-channel layer structure are bonded together. A temperature sensor above the micro-channel layer structure is connected to the temperature measurement PCB for signal acquisition; the micro-channel layer structure is connected with a to-be-tested chip, the to-be-tested chip is electrically connected with the PCB for power supply and signal connection, and normal work of the to-be-tested chip is guaranteed; fastening connection and sealing of the whole heat dissipation testing device are achieved through the fastening cover plate and the bolts. The invention provides a platform capable of carrying out heat dissipation tests on different chips, so that the temperature of the chips is effectively controlled, and the problem of high-temperature failure of a power device is solved. The detachable design is adopted, different cooling core modules can be replaced for heat dissipation testing, and expandability is achieved.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of chip heat dissipation, and particularly relates to a non-embedded integrated chip heat dissipation testing device. BACKGROUND

[0002] With the semiconductor manufacturing process continuously approaching the physical limit, the chip integration level is exponentially increasing. In the 5nm and below advanced process, the transistor density has broken through 300 million per square millimeter, causing the unit area power consumption to surge. According to IEEE data, the heat flux density of high-end CPU / GPU chips has soared from 50W / cm 2 in 2010 to the current 300W / cm 2 , and is expected to break through 1000W / cm 2 in 2030. At the same time, high-power devices such as artificial intelligence training chips and high-performance computing accelerators are continuously emerging, with single-chip power consumption breaking through 700W, and the heat management pressure has been upgraded from a "performance constraint factor" to a "system failure main factor".

[0003] The current mainstream solution adopts micro-channel direct etching on the chip packaging substrate, which can achieve a heat dissipation capacity of 150-200W / cm 2 , but has fatal defects: the flow channel design needs to match the chip layout, and each chip needs to develop a separate heat dissipation module, with a development cycle of 6-8 months; the cooling liquid and the chip circuit are separated by only an insulation layer of <100μm, and micro-leakage can cause the entire machine to be damaged; the heat dissipation structure is permanently bound to the chip, and the efficiency of different cooling strategies cannot be evaluated.

[0004] The external heat sink has insufficient efficiency, and the air cooling / heat pipe solution faces three ceilings: it needs to cross four interfaces (chip-solder-substrate-thermal paste) from the chip to the heat dissipation fin, with a cumulative thermal resistance of >0.5℃ / W, resulting in a virtual core temperature of 20~30℃; the external thermocouple temperature measurement point is >5mm away from the chip core, with a response delay of more than 10 seconds, which cannot capture transient hot spots; the rectangular heat dissipation base causes the edge area to have a 40% reduction in heat dissipation efficiency, inducing chip corner burning.

[0005] The existing heat dissipation testing device generally has two major faults: the traditional clamp only supports the installation of a single heat sink, and the replacement scheme needs to disassemble the entire machine, resulting in low testing efficiency; temperature collection relies on external sensors or infrared thermometers, with a spatial resolution of >1mm 2 , and a temperature measurement error of ±3℃.

[0006] The semiconductor industry is trapped in a "heat dissipation-performance" cycle, and it is urgent to develop a testing platform with high universality, precise heat monitoring, and active heat dissipation optimization to break the traditional path of "designing chips first and then adapting heat dissipation", and to provide a full-cycle heat management solution for high-power chips. SUMMARY

[0007] The technical problem to be solved by the present application is to provide a non-embedded integrated chip heat dissipation test device that can perform heat dissipation tests on different chips to effectively control the temperature of the chips, ensure the use performance of high-power devices, and improve the service life of the high-power devices.

[0008] The present application adopts the following technical solutions: A non-embedded integrated chip heat dissipation test device comprises: a support base; a cooling liquid inlet and outlet base plate arranged on the support base and comprising a cooling liquid inlet and a cooling liquid outlet; a manifold layer structure arranged on the cooling liquid inlet and outlet base plate, the bottom surface of which is provided with a manifold layer inlet and a manifold layer outlet, and the upper surface of which is provided with alternating and spaced liquid inlet flow channels and liquid outlet flow channels; a micro-channel layer structure bonded and sealed with the manifold layer structure, the bottom surface of which is provided with rectangular micro-channels that communicate with the liquid inlet flow channels and the liquid outlet flow channels, and the upper surface of which is integrated with a temperature sensor unit; a temperature measurement PCB board connected to the temperature sensor unit of the micro-channel layer structure to collect temperature signals; an electrical connection PCB board arranged above the chip to be tested for power supply and signal transmission of the chip to be tested; a fastening cover plate and bolts for fastening and sealing the fastening cover plate, the electrical connection PCB board, the chip to be tested, the temperature measurement PCB board, the micro-channel layer structure, the manifold layer structure, the cooling liquid inlet and outlet base plate, and the support base through the bolts; The manifold layer structure and the micro-channel layer structure are detachable independent modules.

[0009] Preferably, the liquid inlet flow channels are tapered structures that gradually shrink along the flow direction of the cooling liquid, and the liquid outlet flow channels are tapered structures that gradually expand along the flow direction of the cooling liquid; the width of the two liquid outlet flow channels at the two ends of the manifold layer structure is 1 / 2 of the width of the middle liquid outlet flow channel.

[0010] Preferably, the ratio of the middle width to the width at both ends of the liquid inlet flow channel is 1:2, and the ratio of the middle width to the width at both ends of the liquid outlet flow channel is 2:1.

[0011] Preferably, the temperature sensor unit integrated in the micro-channel layer structure is a Pt resistance temperature sensor; and the temperature sensor unit is welded to the temperature measurement PCB board through a lead wire.

[0012] Preferably, the cooling liquid inlet and outlet base plate is provided with a sealing groove in the middle, and the manifold layer structure is embedded in the sealing groove; the cooling liquid inlet is located on the side surface of the cooling liquid inlet and outlet base plate, and the cooling liquid outlet is located on the bottom surface.

[0013] Preferably, the manifold layer structure is sealed with silica gel gasket between the cooling liquid inlet and outlet base plate; the support base is sealed with silica gel substrate between the cooling liquid inlet and outlet base plate.

[0014] Preferably, the rectangular microchannel is formed by MEMS process; the microchannel layer structure is connected with the chip to be tested by heat-conducting silicone or silica gel.

[0015] Preferably, the support base and the fastening cover plate are made of stainless steel; the cooling liquid inlet and outlet base plate is made of transparent resin or acrylic material; the manifold layer structure and the microchannel layer structure are made of silicon.

[0016] Preferably, the support base, the cooling liquid inlet and outlet base plate and the fastening cover plate are provided with threaded holes at corresponding positions around the periphery, and the fastening connection is realized by the bolts.

[0017] Preferably, the working medium branch of the cooling liquid inlet is two-way, symmetrically connected to the manifold layer inlet on the bottom surface of the manifold layer structure. The manifold layer outlet is located in the middle of the bottom surface of the manifold layer structure, and is in communication with the cooling liquid outlet of the cooling liquid inlet and outlet base plate.

[0018] Compared with the prior art, the present application has at least the following beneficial effects: A non-embedded integrated chip heat dissipation testing device, cooling working medium flows into from the cooling liquid inlet and outlet base plate, flows through the manifold layer structure and the microchannel layer structure, and flows out from the outlet of the cooling liquid inlet and outlet base plate after heat exchange, so that the chip to be tested can be cooled, and the temperature of the chip can be measured in real time by a temperature sensor. In addition, the testing device can cool different chips for heat dissipation testing, thereby effectively controlling the temperature of the chip and solving the problem of high-temperature failure of power devices. The device adopts a detachable design, different cooling core module units (manifold layer and microchannel layer structure) can be replaced for heat dissipation testing, and the device has scalability.

[0019] Further, the liquid flow channel adopts a converging conical structure (middle width: two end widths = 1:2), increases the flow resistance at the end, forces more cooling liquid to flow into the front microchannel; the liquid outlet flow channel expands in a conical shape (middle: two ends = 2:1), reduces the backflow resistance, and cooperatively solves the flow decay problem at the end of the flow channel, and the actual flow uniformity is improved by 40; the width of the two end liquid outlet flow channels is reduced by half to 1 / 2 of the middle part, the cooling liquid flow rate in the edge area is increased in a targeted manner, and the risk of overheating at the corners of the chip is eliminated.

[0020] Further, the Pt resistance temperature sensor is directly integrated on the upper surface of the microchannel layer, has high temperature resistance and corrosion resistance, and has a long-term stability of ±0.1℃ in a deionized water / ethylene glycol environment; the lead is welded to the PCB, the heat transfer path is reduced, the response time is shortened to 0.5 seconds, and the transient heat testing requirement is met.

[0021] Further, the sealing groove precisely matches the manifold layer size (25mmx25mm), combined with the silica gel gasket to form a three-stage seal, with a pressure capacity of 1MPa; the three-dimensional layout of the side inlet and the bottom outlet shortens the cooling liquid return path, reduces the dead water area, and reduces the pressure drop by about 25%.

[0022] Further, the elastic deformation of the silica gel substrate and the gasket compensates for the assembly tolerance (±0.1mm) of the component, avoiding local leakage caused by hard sealing; the silica gel piece can be replaced, prolonging the service life of the device and reducing the maintenance cost by 70%.

[0023] Further, the stainless steel support base / cover plate provides high rigidity (deformation <0.05mm); the silica manifold / micro-channel layer ensures the machining precision of the micro-channel; the transparent resin substrate facilitates visual detection of flow patterns, and the acrylic substrate is 3D printed, reducing manufacturing costs by 60%.

[0024] Further, the heat-conducting silicone / silica gel fills the gap between the chip and the micro-channel layer, avoiding damage to the chip compared to the welding scheme.

[0025] Further, the cooling liquid inlet enters the manifold layer in two symmetrical ways, cooperating with the middle outlet to eliminate the temperature gradient caused by one-way flow, with a chip surface temperature difference of ≤2℃.

[0026] In summary, the present application provides a modular and detachable heat dissipation test platform, which can adapt to multiple types of chips by replacing the manifold / micro-channel module; the conical manifold structure is optimized to improve flow uniformity; the Pt temperature sensor is integrated to realize precise thermal monitoring; the three-stage sealing design can withstand 1MPa pressure; and the high-temperature failure problem of power devices is significantly solved, prolonging the service life of the chip.

[0027] The technical solutions of the present application will be further described in detail below with the help of the accompanying drawings and examples. BRIEF DESCRIPTION OF DRAWINGS

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the accompanying drawings used in the following comparative example description are briefly introduced, and obviously, the accompanying drawings in the following description can only be some embodiments of the present application, and other accompanying drawings can be obtained by those skilled in the art without creative labor.

[0029] Figure 1 A non-embedded chip heat dissipation test device design overall schematic diagram is provided for the embodiments of the present application; Figure 2 A test device structure schematic diagram not containing the chip to be tested is provided; Figure 3 A structure schematic diagram of the cooling liquid inlet and outlet substrate is provided; Figure 4is a top view of the manifold layer structure upper surface; Figure 5 is a top view of the manifold layer structure lower surface; Figure 6 is a schematic diagram of the microchannel layer structure bottom surface microchannel processing; Figure 7 is a schematic diagram of the local microchannel enlarged structure; Figure 8 is a schematic diagram of the microchannel layer structure integrated temperature sensor; Figure 9 is an enlarged schematic diagram of a single temperature sensor.

[0030] Wherein: 1. Support base; 2. Silicone substrate; 3. Cooling liquid inlet and outlet base plate; 31. Cooling liquid inlet; 32. Sealing groove; 33. Cooling liquid outlet; 34. Cooling liquid inlet and outlet base plate screw hole; 4. Silicone gasket; 5. Manifold layer structure; 51. Liquid inlet channel; 52. Liquid outlet channel; 53. Manifold layer inlet; 54. Manifold layer outlet; 6. Microchannel layer structure; 61. Rectangular microchannel; 62. Temperature sensor unit; 7. Temperature measurement PCB; 8. Chip to be measured; 9. Electrical connection PCB; 10. Fastening cover plate; 11. Bolt. DETAILED DESCRIPTION

[0031] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0032] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "one side", "one end", "one edge" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" can be explicitly or implicitly included one or more. In the description of the present application, unless otherwise specified, the meaning of "multiple" is two or more.

[0033] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connection", "linking" should be understood in a broad sense, for example, it can be fixed connection, or detachable connection, or integral connection; it can be mechanical connection, or electrical connection; it can be direct connection, or indirect connection through intermediate medium, or internal communication of two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0034] It should be understood that the terms "comprising" and "including" as used in the specification and the appended claims indicate the presence of the recited features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0035] It should also be understood that the terms used in the present application specification are only for the purpose of describing specific embodiments and are not intended to limit the present application. As used in the present application specification and the appended claims, the singular forms "a", "an" and "the" are intended to include the plural forms unless the context clearly indicates otherwise.

[0036] It should be further understood that the term "and / or" as used in the present application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations thereof, and includes these combinations.

[0037] Various structural diagrams according to the disclosed embodiments of the present application are shown in the accompanying drawings. These drawings are not drawn to scale, in which certain details are exaggerated for the purpose of clear expression, and certain details can be omitted. The shapes of various regions, layers shown in the drawings and their relative size, positional relationship may deviate in actuality due to manufacturing tolerances or technical limitations, and a person skilled in the art can additionally design regions / layers with different shapes, sizes, relative positions according to actual needs.

[0038] The present application provides a non-embedded integrated chip heat dissipation test device, a manifold layer and a micro-channel layer form a standardized detachable module (25mmx25mm), support cone / serpentine channel quick replacement, adapt to 50-300W / cm 2The heat flow density chip breaks through the limitation of a single chip of a traditional test table; a Pt temperature sensor is directly integrated on the upper surface of a micro flow channel layer, contacts the chip through a <0.1mm heat conduction layer, realizes millisecond-level response, and the efficiency is improved by 3 times compared with external temperature measurement; a tapered manifold (liquid inlet contraction ratio 1:2 / liquid outlet expansion ratio 2:1) is combined with an end width-reducing flow channel, the flow unevenness is <5%, and the heat dissipation uniformity is improved by 40%; the silicone substrate + gasket + bonding surface composite sealing, pressure bearing 1MPa, leakage rate <10 -6 Pa.m 3 / s, guarantees the safe operation of 2L / min high flow, and solves the three industry pain points of difficult preparation, thermal sensing lag and uneven heat dissipation.

[0039] Please refer to Figure 1 The application discloses a non-embedded integrated chip heat dissipation test device which comprises a supporting base 1, a cooling liquid inlet and outlet base plate 3, a manifold layer structure 5, a micro flow channel layer structure 6, a temperature measurement PCB 7, a chip to be tested 8, an electrical connection PCB 9 and a fastening cover plate 10. The components are sequentially stacked and sealed by means of silicone gaskets or bonding. The supporting base 1 is provided with the cooling liquid inlet and outlet base plate 3, and the cooling liquid inlet and outlet base plate 3 is provided with the manifold layer structure 5, and the two are sealingly connected. The manifold layer structure 5 is bonded with the micro flow channel layer structure 6, and the temperature sensor integrated on the micro flow channel layer structure 6 is connected to the temperature measurement PCB 7 for signal acquisition. The chip to be tested 8 is arranged above the micro flow channel layer structure 6 (and can be selectively replaced), and the chip to be tested 8 is powered and signal inputted through the electrical connection PCB 9, so that the normal work of the chip to be tested 8 is ensured. The fastening cover plate 10 and the bolts 11 are combined to realize fastening connection and sealing of the whole heat dissipation test device.

[0040] The supporting base 1 is provided with a sealing groove, and the silicone substrate 2 and the sealing groove are sealed by the cooling liquid inlet and outlet base plate 3, and the silicone substrate 2 and the sealing groove have the same area. The supporting base 1 is used for providing support and fixation for the whole heat dissipation test, and four threaded holes are formed in the periphery, and the threaded holes are fastened and connected by bolts.

[0041] Please refer to Figure 3 The cooling liquid inlet and outlet base plate 3 comprises a cooling liquid inlet 31 and a cooling liquid outlet 33 for feeding the cooling liquid into the test device, so that the cooling liquid is circulated and radiated smoothly. The cooling liquid inlet 31 is located on the side surface of the cooling liquid inlet and outlet base plate 3, and the cooling liquid outlet 33 is located on the bottom surface of the cooling liquid inlet and outlet base plate 3. After the cooling working medium enters from the cooling liquid inlet 31, the cooling working medium is branched to two inlet ports of the manifold layer structure 5.

[0042] The size of the cooling liquid inlet and outlet substrate 3 is 90mm*60mm*15mm, and the material is transparent resin material. A sealing groove 32 is provided in the middle of the cooling liquid inlet and outlet substrate 3, and the size is 25mm*25mm, which matches the size of the manifold layer structure manufactured by the MEMS process. Two inlet ports and one outlet port are provided in the sealing groove 32, which are connected to the manifold layer structure 5. The two inlet ports are symmetrically arranged relative to the outlet port. Threaded holes 34 are provided around the cooling liquid inlet and outlet substrate 3, which are matched with the size, position and support base.

[0043] Please refer to Figure 4 and Figure 5 The upper surface of the manifold layer structure 5 is provided with a plurality of inlet flow channels 51 and outlet flow channels 52. The inlet flow channels 51 and the outlet flow channels 52 are arranged alternately and spaced apart, and the spacing between the inlet flow channels 51 and the outlet flow channels 52 is the same. The structure of the inlet flow channels 51 and the outlet flow channels 52 is symmetrical about the center line. On the left side of the center line, the inlet flow channel 51 is a tapered structure gradually narrowing along the flow direction of the cooling liquid, and the outlet flow channel 52 is a tapered structure gradually expanding along the flow direction of the cooling liquid. In addition, the width of the two outlet flow channels 52 at both ends of the manifold layer structure 5 is half of the width of the other outlet flow channels in the middle.

[0044] In addition, along the flow direction of the cooling medium, the ratio of the middle width of the inlet flow channel 51 to the width at both ends is 1:2, and the ratio of the middle width of the outlet flow channel 52 to the width at both ends is 2:1. Compared with the conventional manifold structure, the tapered or trapezoidal manifold inlet flow channel 51 has a larger flow resistance at the end, so that more cooling medium flows into the front end of the microchannel, which can improve the problem of uneven flow distribution.

[0045] Further, the bottom surface of the manifold layer structure 5 is provided with three groups of through holes, the left and right two groups are manifold layer inlets 53 for the cooling liquid entering the manifold layer structure 5, and the middle group is a manifold layer outlet 54. The manifold layer inlets 53 are symmetrically arranged relative to the position of the manifold layer outlet 54. The manifold layer structure 5 and the cooling liquid inlet and outlet substrate 3 are sealed by a silicone gasket 4.

[0046] The manifold layer structure 5 is located between the cooling liquid substrate 3 and the microchannel layer structure, and is responsible for uniformly distributing the working medium entering the cooling liquid inlet and outlet substrate to the microchannels 61 in the microchannel structure layer 6. The cooling medium enters the inlet flow channel 51 through the inlet 53 of the cooling liquid inlet and outlet substrate, flows to the microchannel 61, then exchanges heat to carry away the heat of the chip, and then guides the cooling liquid to the outlet in the middle of the bottom of the manifold layer structure 5 through the outlet flow channel 52, and then flows to the outlet 54 of the cooling liquid inlet and outlet substrate, and then flows out through the through hole provided in the support base 1, completing a heat exchange cycle.

[0047] Please refer to Figure 6 ,Figure 7 、 Figure 8 and Figure 9 The micro-channel layer structure 6 is arranged with a plurality of rectangular micro-channels 61 at the bottom surface, the plurality of rectangular micro-channels 61 are communicated with the liquid inlet channel 51 and the liquid outlet channel 52, and the upper surface of the rectangular micro-channel 61 is integrated with a temperature sensor 62 for real-time temperature measurement. The micro-channel layer structure is based on the MEMS process and is processed by photolithography, etching, sputtering and other processes to process micro-channel units and temperature sensor units of a certain size, and the size of the entire unit is 25mm*25mm.

[0048] The micro-channel layer structure 6 and the manifold layer structure 5 are sealingly connected by silicon-silicon bonding. As shown in Figure 6 and Figure 7 , Pt resistance is used as the material of the temperature sensor. The upper surface of the micro-channel layer structure 6 is integrated with a plurality of temperature sensor units 62 for characterizing the temperature performance of the chip 8 to be tested. The temperature sensor units 62 are connected to the temperature measurement PCB 7 by wire bonding for signal acquisition. Four through holes are formed on the temperature measurement PCB 7, and the size and position thereof are adapted to the four threaded holes of the cooling liquid inlet and outlet base plate 3. The chip 8 to be tested is arranged above the micro-channel layer structure 6, and the chip 8 to be tested is connected to the micro-channel layer structure 6 through heat-conducting silicone grease or silica gel. The chip 8 to be tested is powered through the electrical connection PCB 9 to ensure the normal operation of the chip 8 to be tested.

[0049] The fastening cover plate 10 is arranged above the temperature measurement PCB 7, and the fastening cover plate 10 is provided with four through holes, the size and position of which are adapted to the through holes on the temperature measurement PCB 7. The fastening cover plate 10 is fastened and sealed to the entire heat dissipation test device through the bolts 11.

[0050] The materials of the manifold layer structure 5 and the micro-channel layer structure 6 are silicon, the materials of the support base 1 and the fastening cover plate 10 are stainless steel, the material of the cooling liquid inlet and outlet base plate 3 is acrylic material or transparent resin material, and 3D printing or reverse molding technology is used for manufacturing. The cooling medium is deionized water or ethylene glycol.

[0051] In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of protection of the present application.

[0052] In the prior art, the continuous development of semiconductor manufacturing processes greatly improves the chip integration, and the heat flux density of advanced process chips increases sharply, so that the traditional heat dissipation scheme faces multiple challenges. The method of etching micro-channels directly on the chip packaging substrate has defects such as long research and development cycle, high leakage risk, and unchangeable structure; the external heat sink causes temperature measurement error due to thermal resistance accumulation, and cannot capture transient thermal changes. The test device generally has the problems of fixed structure and insufficient temperature collection accuracy, which is difficult to meet the heat dissipation test demand of high-power chips.

[0053] In order to solve the above problems, the researchers found that the existing heat dissipation test device cannot realize modular replacement, resulting in low test efficiency. Through analysis, it is found that the permanent binding of the heat dissipation structure and the chip limits the evaluation of different cooling strategies. Further research shows that the external temperature sensor causes response delay due to being too far away from the core of the chip. Based on this, it is proposed to decompose the heat dissipation structure into detachable modules, integrate the temperature sensor in the micro-channel layer, and build a multi-layer sealed structure to realize rapid assembly and accurate temperature measurement.

[0054] Therefore, the present application proposes a heat dissipation test device comprising a support base, a cooling liquid inlet and outlet substrate, a manifold layer structure, a micro-channel layer structure, a temperature measurement PCB board, an electrical connection PCB board and a fastening assembly. The support base provides overall bearing function, and the cooling liquid inlet and outlet substrate is provided with an inlet and an outlet to realize working medium circulation. The inlet and outlet are arranged on the bottom surface of the manifold layer, and the liquid inlet channel and the liquid outlet channel are alternately arranged on the upper surface. The micro-channel layer is connected to the manifold layer by bonding and sealing, and the bottom surface is provided with a rectangular micro-channel connected to the flow channel, and the upper surface is integrated with a temperature sensor unit. The temperature measurement PCB board connects the sensor to collect signals, and the electrical connection PCB board supplies power to the chip. The fastening cover plate tightly seals the layers of structures by bolts, and the manifold layer and the micro-channel layer are detachable independent modules.

[0055] The support base refers to the basic structure that bears the entire device, which can be realized by processing metal plates, and plays a role in stable support and force transmission. The cooling liquid inlet and outlet base plate refers to a plate-shaped structure with a fluid channel, which can be manufactured by injection molding process, and is used to distribute the flow direction of the cooling working medium. The manifold layer structure refers to an intermediate layer with multiple channel distribution, which can be processed by photoetching process to realize uniform distribution of the cooling liquid. The micro-channel layer structure refers to a heat dissipation layer containing micro-channels, which can be manufactured by silicon-based MEMS process to enhance heat exchange efficiency through micro-channels. The temperature sensor unit refers to a temperature measuring element integrated in the micro-channel layer, which can be prepared by thin film platinum resistance to realize direct measurement of the surface temperature of the chip. The fastening cover plate refers to a top component that applies pressure, which can be processed by a numerical control machine tool to ensure sealing between layers by bolt pre-tightening force.

[0056] Specifically, the cooling liquid enters the manifold layer from the inlet of the inlet and outlet base plate, is distributed to the rectangular channels of the micro-channel layer through the tapered liquid inlet flow channel. After the fluid absorbs the heat of the chip in the micro-channel, it returns to the outlet of the manifold layer through the liquid outlet flow channel. The temperature sensor unit directly contacts the lower surface of the chip, collects temperature data in real time and outputs through the PCB board. The layers are sealed by bolt compression, and the detachable module design allows quick replacement of the manifold layer and micro-channel layer with different flow channel configurations. The inlet and outlet base plates made of transparent material facilitate observation of the fluid state, and the silicone gasket and substrate ensure the reliability of the interlayer sealing.

[0057] Compared with the prior art, the traditional scheme needs to disassemble the whole machine to replace the heat dissipation module, while the present scheme realizes quick configuration switching through the detachable manifold layer and micro-channel layer. The existing device relies on external sensors, resulting in temperature measurement delay, while the present scheme integrates the temperature sensor on the upper surface of the micro-channel layer, directly contacts the chip and obtains real-time data. The conventional heat dissipation test fixture adopts a monolithic structure, and the present scheme supports independent verification of multiple cooling strategies through a layered modular design.

[0058] Through the above technical scheme, the present application realizes the modular reconstruction of the heat dissipation test device, significantly shortens the verification period of different heat dissipation schemes. The integrated temperature sensor eliminates the measurement delay of the traditional external probe, improves the capture ability of transient thermal changes. The layered sealing structure ensures reliability while allowing individual replacement of specific functional modules, reducing test cost. The detachable design enables the same device to adapt to multiple chip specifications, expanding the application range of the test platform.

[0059] The present application further proposes a non-embedded integrated chip heat dissipation test device, which comprises a tapered structure of the inlet flow channel gradually shrinking along the flow direction of the cooling liquid, a tapered structure of the outlet flow channel gradually expanding along the flow direction of the cooling liquid, and the width of the two outlet flow channels at both ends of the manifold layer structure is half of the width of the middle outlet flow channel.

[0060] The taper structure of the inlet liquid flow channel refers to a geometric shape in which the cross-sectional size gradually decreases from the inlet end to the outlet end, and can be specifically implemented by using linear or nonlinear contraction of the flow channel wall surface design to accelerate the cooling liquid flow rate and improve local heat exchange efficiency.

[0061] The taper structure of the outlet liquid flow channel refers to a geometric shape in which the cross-sectional size gradually increases from the inlet end to the outlet end, and can be specifically implemented by using a gradually expanding flow channel cross-sectional change to balance the system pressure distribution by reducing the flow resistance.

[0062] The width of the two end outlet liquid flow channels is half of the width of the middle outlet liquid flow channel, which means that the two outlet liquid flow channels located at the edges of the manifold layer structure have a size that is half of the size of the middle region flow channel in the vertical direction of the flow direction. This can be specifically implemented by adjusting the photolithography mask pattern or micro-machining parameters to compensate for the uneven distribution of cooling liquid flow in the edge region.

[0063] Specifically, the taper design of the inlet liquid flow channel forms a stable laminar flow state before the cooling liquid enters the micro-channel layer, avoiding turbulence loss caused by sudden changes in flow rate. The expanding taper structure of the outlet liquid flow channel reduces the backflow pressure drop through the gradually expanding flow channel cross-section, preventing local pressure accumulation that causes cooling liquid to stagnate. For the outlet liquid flow channels at the two ends of the manifold layer structure, the width reduction design can offset the excess flow phenomenon caused by the edge effect, making the cooling liquid discharge rate of each outlet liquid flow channel consistent, thereby eliminating the temperature gradient on the chip surface.

[0064] Compared with the prior art, the flow channel of the traditional heat dissipation device usually adopts an equal cross-section rectangular design, resulting in uneven distribution of cooling liquid flow rate during flow, and vortex or dead zone is easily formed in the edge region. The taper flow channel structure of the present application optimizes the dynamic characteristics of the cooling liquid through the continuous change of the flow channel cross-section, and the width adjustment of the two end outlet liquid flow channels specifically solves the flow distribution problem in the edge region of the heat dissipation module.

[0065] Through the above technical solutions, the present application effectively improves the uniformity of the cooling liquid flow in the manifold layer, reduces the risk of local hot spot formation caused by flow rate differences, and reduces the overall pressure drop of the cooling system, so that the heat dissipation test device can more accurately simulate the real thermal load state of high-power chips.

[0066] The present application further proposes that the ratio of the middle width to the two end widths of the inlet liquid flow channel is 1:2, and the ratio of the middle width to the two end widths of the outlet liquid flow channel is 2:1.

[0067] The ratio of the middle width of the liquid inlet channel to the width of both ends is 1:2, which means that the cross section of the channel presents a gradually changing shape with a narrow middle and wide ends along the fluid direction. Specifically, a tapered transition structure can be used to achieve this, and the uniform flow velocity distribution of the cooling liquid before entering the micro-channel layer is achieved by the gradient change of the cross-sectional area of the channel. The ratio of the middle width of the liquid outlet channel to the width of both ends is 2:1, which means that the cross section of the channel presents a gradually changing shape with a wide middle and narrow ends along the fluid direction. Specifically, an inverted tapered structure can be used to achieve this, and the fluid resistance is reduced by expanding the cross-sectional area of the middle part of the channel to promote the convergence of the cooling liquid from multiple branches at the outlet.

[0068] Specifically, during the cooling liquid circulation process, the liquid inlet channel adopts a tapered design with a narrow middle and wide ends, so that the flow velocity gradually decreases when the cooling liquid is divided from the inlet to both sides, avoiding local vortex caused by sudden change of flow velocity; the liquid outlet channel adopts an inverted tapered design with a wide middle and narrow ends, so that the flow velocity of the cooling liquid from each branch tends to be consistent before converging into the outlet, eliminating pressure oscillation caused by flow velocity difference. The structure realizes the laminar flow distribution of the cooling medium in the channel layer through the asymmetric change of the cross section of the channel, thereby improving the measurement stability of the temperature sensor unit in the micro-channel layer.

[0069] Compared with the prior art, the flow channel of the traditional heat dissipation test device usually adopts an equal cross section or a symmetrically changing design, which causes turbulent flow of the cooling liquid during the division process due to uneven flow velocity, resulting in temperature sensor signal fluctuation. The present scheme solves the temperature measurement error problem caused by unstable flow state by designing an asymmetric cross section of the flow channel while effectively suppressing fluid disturbance and maintaining compact structure.

[0070] Through the above technical scheme, the present application can make the cooling liquid form a stable laminar flow state when flowing through the surface of the chip to be tested, ensuring that the temperature data captured by the temperature sensor unit truly reflects the thermal distribution characteristics of each region of the chip, and providing a high-precision experimental data basis for evaluating different heat dissipation strategies.

[0071] The present application further proposes that the temperature sensor unit integrated with the micro-channel layer structure is a Pt resistance temperature sensor, and the temperature sensor unit is welded to the temperature measurement PCB board through a lead.

[0072] The Pt resistance temperature sensor refers to an element for temperature measurement based on the principle that the resistance value of platinum metal changes with temperature. Specifically, it can be integrated on the surface of the micro-channel layer by thin film deposition process, and its linearity and stability can meet the temperature monitoring requirements in a small space.

[0073] The lead welding refers to the electrical connection between the sensor electrode and the PCB pad by hot pressing welding or ultrasonic welding process. Specifically, gold wire bonding technology can be used to achieve this, which can ensure the establishment of a reliable signal transmission path in a small space.

[0074] Specifically, the Pt resistance temperature sensor array is directly integrated on the upper surface of the micro-channel layer structure by a semiconductor process, so as to form a coplanar contact with the chip heat generation area. When the chip to be measured is working, the resistance value of the Pt resistance changes due to the temperature change, and the change signal is transmitted to the signal conditioning circuit of the temperature measurement PCB board through the bonding wire, and the digital temperature data is output after analog-digital conversion. The integrated design of the sensor unit and the micro-channel layer shortens the distance between the temperature collection point and the chip heat source to the sub-millimeter level, and the soldered signal transmission path effectively avoids the measurement error caused by the contact resistance.

[0075] Compared with the prior art, the traditional scheme adopts an external thermocouple or an infrared thermal imager for temperature collection. The thermocouple needs to be installed through the heat dissipation structure, which leads to a large distance between the temperature measurement point and the chip core. The infrared thermal imager is limited by the light transmittance of the transparent material and the calibration error of the surface emissivity. The present scheme realizes in-situ multi-point temperature monitoring by directly integrating the Pt sensor array while maintaining the integrity of the heat dissipation structure, and the soldered signal transmission mode eliminates the signal distortion caused by poor contact.

[0076] Through the above technical scheme, the present application realizes high-precision real-time monitoring of the temperature distribution on the chip surface, solves the temperature data distortion problem caused by the position deviation of the temperature measurement point and the signal transmission interference in the prior art, and provides accurate temperature field data support for optimizing the flow channel design and cooling strategy of the heat dissipation structure.

[0077] The present application further proposes a non-embedded integrated chip heat dissipation test device, which comprises a cooling liquid inlet and outlet base plate, and a manifold layer structure embedded in a sealing groove in the middle of the cooling liquid inlet and outlet base plate.

[0078] The sealing groove refers to a recess structure arranged in the middle of the cooling liquid inlet and outlet base plate, which can be realized by machining or injection molding process, and is used for positioning and fixing the manifold layer structure and forming a sealing interface.

[0079] The embedded manifold layer structure refers to embedding the manifold layer structure into the sealing groove, which can be realized by interference fit or positioning pin, to ensure the accurate docking of the cooling liquid flow channel and the base plate interface.

[0080] The cooling liquid inlet side arrangement refers to arranging the inlet channel on the side wall of the base plate, which can be formed by drilling or milling process, facilitating external pipeline connection and not affecting the flatness of the base plate surface.

[0081] The cooling liquid outlet bottom arrangement refers to arranging the outlet channel on the bottom of the base plate, which can be realized by a vertical through-hole structure, so that the cooling liquid is directly discharged downward to avoid horizontal flow interference.

[0082] Specifically, the cooling liquid enters and exits the base plate through the sealing groove in the middle of the manifold layer structure, which realizes the modular installation of the manifold layer structure. When a manifold layer with a different flow channel design is needed, the original module can be removed from the groove and replaced with a new module. After the cooling liquid enters from the inlet on the side of the base plate, it is uniformly transported along the distribution channel on the edge of the sealing groove to the manifold layer. The cooling liquid that has completed heat exchange is vertically discharged through the outlet at the bottom of the base plate. This design makes the connection interface between the manifold layer and the base plate always in a sealed space formed by the sealing groove, effectively preventing the leakage of the cooling liquid.

[0083] Compared with the prior art, the cooling flow channel of the traditional heat dissipation test device is usually formed integrally with the base plate, which causes the entire device to be disassembled when the heat dissipation module is replaced. The present application realizes the independent packaging of the manifold layer through the sealing groove, which significantly improves the module replacement efficiency while maintaining the sealing performance. In addition, the inlet and outlet of the cooling liquid in the prior art are usually arranged in the same plane, which can easily cause flow channel interference. The present application optimizes the flow path of the cooling working medium through the three-dimensional layout of the side inlet and the bottom outlet.

[0084] Through the above technical solutions, the present application realizes the quick replacement and test requirement of the heat dissipation module, and reduces the flow channel pressure drop loss through the three-dimensional distribution of the inlet and outlet structure. The cooperation design of the sealing groove and the embedded structure provides hardware support for the comparison test of different heat dissipation schemes on the basis of ensuring the interface sealing, effectively solving the problem of low test efficiency caused by the structural solidification of the traditional device.

[0085] The present application further proposes that the manifold layer structure and the cooling liquid inlet and outlet base plate are sealed by a silica gel gasket, and the support base and the cooling liquid inlet and outlet base plate are sealed by a silica gel substrate.

[0086] The silica gel gasket is a sealing material with elasticity and high temperature resistance, which can be specifically implemented by a uniformly thick molded silica gel sheet, and the surface can be designed with concave-convex textures to enhance the sealing effect of the contact surface. The silica gel substrate is a buffer layer covering the contact surface between the support base and the cooling liquid inlet and outlet base plate, which can be specifically implemented by pouring and solidifying liquid silica gel, and can compensate for the slight unevenness of the contact surface during mechanical fastening.

[0087] Specifically, the silica gel gasket is pre-installed at the assembly interface between the manifold layer structure and the cooling liquid inlet and outlet base plate, and fills the structural gap through elastic deformation during the screw fastening process, forming a full circumferential seal of the cooling liquid flow path. The silica gel substrate is laid on the upper surface of the support base, and when the cooling liquid inlet and outlet base plate is installed, the silica gel material flows and distributes uniformly under pressure, eliminating local stress concentration caused by processing errors. When the cooling liquid flows through the inlet and outlet of the manifold layer, the silica gel gasket can withstand cyclic pressure fluctuations without creep failure, and at the same time allows the manifold layer structure to be disassembled and replaced as an independent module.

[0088] Compared with the prior art, the traditional sealing mode adopts welding or glue fixing, which causes the heat dissipation module to be unable to be disassembled and has the risk of aging cracking. The combined sealing scheme of the silica gel gasket and the substrate can adapt to multiple disassembly and assembly conditions and avoid the restriction of permanent bonding on modular testing. The hard sealing interface in the prior art is prone to micro cracks under thermal cycling, and the elastic recovery characteristics of the silica gel material can effectively compensate for the thermal expansion difference.

[0089] Through the above technical solutions, the application realizes reliable sealing of the cooling liquid flow channel connection interface, prevents liquid leakage under high pressure working conditions, and at the same time maintains the quick disassembly and assembly function of the manifold layer structure and the support base. The chemical corrosion resistance of the silica gel material can be compatible with the long-term use of various cooling working media, and the elastic sealing structure reduces the assembly precision requirement, so that the test device can adapt to the quick replacement demand of different size chip heat dissipation modules.

[0090] The application further proposes that the rectangular microchannel is formed by a MEMS process; and the microchannel layer structure and the chip to be tested are connected by heat-conducting silicone grease or silica gel.

[0091] The MEMS process refers to a micro-electro-mechanical system processing technology, which can be implemented by photolithography, ion etching or chemical vapor deposition process. This technology can form a microchannel structure with high precision and complex geometry on the surface of a silicon-based material. The rectangular microchannel formed by this process has the characteristics of high size consistency and low surface roughness, which is beneficial to the uniformity control of the cooling liquid flow. The heat-conducting silicone grease or silica gel refers to an interface filling material with high thermal conductivity, which can be implemented by adding aluminum oxide or boron nitride particles to an organic silicon compound. This material can fill the micro gaps on the contact surface between the microchannel layer structure and the chip, and reduce the interface contact thermal resistance.

[0092] Specifically, the rectangular microchannel of the microchannel layer structure is patterned on a silicon substrate by a MEMS process. First, silicon dioxide is deposited on the surface of the silicon wafer as a mask layer, and a deep reactive ion etching technology is used to form a rectangular groove structure with vertical side walls. When the microchannel layer is assembled with the chip to be tested, heat-conducting silicone grease or silica gel material is coated on the contact surface, and the pressure generated by the bolt fastening makes the interface material uniformly extend to form a continuous heat conduction path. When the cooling liquid flows in the rectangular microchannel, heat is transferred from the chip to the microchannel layer through the heat-conducting interface, and then taken away by the working medium through convective heat transfer.

[0093] Compared with the prior art, the traditional micro-channel processing adopts a laser etching or mechanical milling process, and has problems of large channel size deviation and high surface roughness, resulting in uneven flow resistance distribution. The scheme can realize sub-micron level processing precision by adopting the MEMS process, and ensure the geometric parameter consistency of each micro-channel. In the prior art, the chip and the heat dissipation structure are directly pressed, and there are a large number of air gaps in the actual contact surface, and the scheme fills the interface gap through heat-conducting silicone grease or silica gel, which significantly improves the heat transfer efficiency.

[0094] Through the above technical scheme, the application realizes precise machining of the micro-channel structure and reliable thermal interface connection, effectively reduces the risk of local overheating caused by uneven flow, and improves the heat transfer efficiency from the chip to the cooling working medium. The scheme can adapt to the test requirements of different size chips and avoid the problem of temperature measurement distortion caused by high contact thermal resistance.

[0095] The application further proposes that the support base and the fastening cover plate are made of stainless steel material, the cooling liquid inlet and outlet substrate is made of transparent resin or acrylic material, and the manifold layer structure and the micro-channel layer structure are made of silicon material.

[0096] The stainless steel material refers to a metal material with high mechanical strength and corrosion resistance, which can be realized by using 304 stainless steel or 316L stainless steel. The high rigidity can ensure that the deformation of the multi-layer structure is controlled within microns when fastening, and can resist chemical corrosion of the cooling liquid. The transparent resin or acrylic material refers to a high polymer with optical transparency, which can be realized by using polycarbonate or polymethyl methacrylate. The light transmission allows real-time observation of the cooling liquid flow state and bubble generation. The silicon material refers to a single crystal silicon or polycrystalline silicon material, which can be realized by using a semiconductor grade silicon wafer processed by a micro-electro-mechanical system process. The thermal expansion coefficient matches the chip substrate, which can avoid the interface stress caused by temperature change.

[0097] Specifically, the support base and the fastening cover plate are made of stainless steel material. When uniform pressure is applied by bolts, the high yield strength of stainless steel can prevent sealing failure caused by deformation of the threaded hole. The cooling liquid inlet and outlet substrate is made of transparent resin or acrylic material. During the cooling liquid circulation process, the operator can directly detect whether there are foreign matter blockage or phase change in the flow channel by visual inspection. The manifold layer structure and the micro-channel layer structure are made of silicon material, and the surface roughness can be controlled within nanometers. When the micro-channel layer structure is bonded, a gapless sealing interface can be formed, and the high thermal conductivity of silicon is beneficial to heat transfer from the chip to be tested to the cooling working medium.

[0098] Compared with the prior art, the support structure of the conventional heat dissipation test device is mostly made of aluminum alloy or engineering plastic. The former is prone to plastic deformation after long-term compression, and the latter has poor thermal stability. The existing cooling liquid cavity generally adopts a metal casting process, which cannot realize visual monitoring of the flow channel, while the transparent resin substrate used in the present application can simultaneously realize structural strength and observation function. The existing manifold structure is mostly made of copper or stainless steel, and its machining precision is difficult to meet the micro-flow channel matching requirements. The application of silicon material enables the micro-flow channel structure to achieve sub-micron level size control through semiconductor process.

[0099] Through the above technical solutions, the present application effectively solves the sealing failure problem of the multi-layer test device caused by the difference in material thermal expansion coefficient, avoids the risk of equipment damage caused by cooling liquid leakage, and simultaneously realizes real-time visual monitoring of the internal state of the flow channel. The application of silicon material ensures the thermal matching of the micro-flow channel structure and the chip substrate, eliminates the influence of interface thermal resistance on the test precision, and provides a reliable test environment for the evaluation of the heat dissipation performance of chips of different materials.

[0100] The present application further proposes that the corresponding positions of the support base, the cooling liquid inlet and outlet substrate, and the fastening cover plate are provided with threaded holes, and fastening connection is realized through bolts.

[0101] The threaded hole refers to the hole structure distributed on the edge of the support base, the cooling liquid inlet and outlet substrate, and the fastening cover plate, which can be realized by numerical control machining center drilling and tapping, and the thread specification can be M6 standard parts, which is used to ensure the positioning accuracy and connection strength when the multi-layer structure is aligned.

[0102] The bolt refers to a fastener with external threads, which can be made of 304 stainless steel material and surface nickel plating treatment. A torque wrench is used to apply a pre-tightening force of 5-8 N·m, so that uniform pressure distribution is formed in the vertical direction of each layer structure, and plastic deformation of the sealing interface is avoided.

[0103] Specifically, during assembly, the support base, the cooling liquid inlet and outlet substrate, the manifold layer structure, the micro-flow channel layer structure, the temperature measurement PCB board, the chip to be tested, the electrical connection PCB board, and the fastening cover plate are sequentially stacked, and the bolts symmetrically distributed at the four corners are sequentially inserted through the threaded holes of each layer, and the axial tension of the bolts is used to press and seal each layer. The corresponding position design of the threaded hole makes the fastening force uniformly transmitted to the silicone gasket and the interface of the thermal conductive silicone grease, forming a stable interlayer contact thermal resistance. When the chip to be tested needs to be replaced or the flow channel needs to be cleaned, the bolts can be loosened to disassemble the layers without damaging the overall structure.

[0104] In some embodiments, the number of threaded holes can be four groups, each group containing two coaxial through holes located in the four corner areas of the support base and the fastening cover plate; the installation sequence of the bolts can follow the principle of alternating tightening along the diagonals to eliminate the flatness deviation caused by assembly stress.

[0105] Compared with the prior art, the traditional heat dissipation test device adopts a glue bonding or welding method to fix each layer structure, and needs to damage the sealing interface when disassembled and cannot be reused. The present scheme realizes non-destructive disassembly through the cooperation of threaded holes and bolts, ensures the sealing while allowing the manifold layer and the micro-channel layer to be replaced individually, and significantly shortens the test switching time of different chip heat dissipation schemes.

[0106] Through the above technical scheme, the present application solves the problem of difficult maintenance of the existing heat dissipation test device due to overall packaging, and through the modular threaded connection structure, the sealing reliability of the cooling liquid flow channel is maintained, and the key heat dissipation components can be quickly replaced, meeting the comparison test demand of heat dissipation performance of multiple types of chips.

[0107] The present application further proposes that the working medium branch of the cooling liquid inlet is two-way, symmetrically connected to the manifold layer inlet on the bottom surface of the manifold layer structure; the manifold layer outlet is located in the middle of the bottom surface of the manifold layer structure, and is connected to the cooling liquid outlet of the cooling liquid inlet and outlet substrate.

[0108] Among them, the working medium branch is two-way, that is, two symmetrically distributed branch channels are arranged at the cooling liquid inlet, which can be realized by using a Y-type flow divider or a double-channel injection molding structure, and the flow distribution on both sides is balanced through symmetric branch design.

[0109] Among them, the manifold layer outlet is located in the middle of the bottom surface, that is, the cooling liquid collection outlet is arranged in the geometric center area of the manifold layer, which can be realized by using a circular or rectangular flow collection cavity structure, and the flow path of each flow channel to the outlet is shortened by using the central position.

[0110] Specifically, after the cooling liquid enters the manifold layer inlet from the two-way symmetric branch, uniform distribution of laminar flow is formed in the conical liquid inlet flow channel, and after flowing through the micro-channel layer to complete heat exchange, the cooling liquid is collected and discharged at the middle outlet of the manifold layer. The structure eliminates the flow deviation caused by one-sided liquid supply through symmetric branch, and reduces the flow resistance through center flow design, so that the back pressure of each micro-channel tends to be consistent.

[0111] Compared with the prior art, the traditional single-inlet structure is prone to uneven flow on both sides of the manifold layer, and the pressure drop of the edge flow channel is too large, while the center flow outlet design can avoid local vortex caused by outlet position deviation. In the prior art, the cooling liquid outlet is usually arranged on the side or asymmetric position, causing residual bubbles to accumulate at the end of the flow channel. The present scheme realizes fluid dynamic balance through the center outlet cooperating with the symmetric inlet.

[0112] Through the above technical solution, this application effectively solves the problem of local chip overheating caused by uneven coolant distribution, reduces the risk of gas-liquid two-phase flow within the microchannel, and improves the stability of the temperature field distribution during heat dissipation testing. The symmetrical diversion structure ensures that the coolant evenly covers the chip's heating area, and the central flow collection design prevents sudden changes in outlet backpressure from interfering with flow monitoring data.

[0113] Manifold layer structure variation Stepped conical flow channel: The continuous conical inlet / outlet liquid flow channel is replaced with a stepped contraction / expansion structure (such as three-section width mutation), and the flow is evenly distributed through stepped resistance adjustment.

[0114] Curved guide wall: The side wall of the flow channel adopts a parabolic curved design (instead of a straight cone), which further reduces eddy current loss and reduces pressure drop by 15%.

[0115] Microfluidic Layer Alternatives Composite material substrate: The microfluidic layer 6 uses a silicon carbide-aluminum composite material (instead of single crystal silicon), with thermal conductivity increased to 250W / m·K, while being compatible with MEMS processing.

[0116] Serpentine microchannel: The rectangular microchannel 61 is replaced with a continuous serpentine layout, the flow channel length is increased by 2 times, and the heat exchange efficiency is improved by 22%.

[0117] Sealing and connection optimization Metal sealing ring: The silicone gasket 4 is replaced with a copper-nickel alloy sealing ring (temperature resistance > 200°C), which is suitable for high-temperature working fluid testing.

[0118] Magnetic quick-release structure: Bolt 11 is replaced with an electromagnet locking module, shortening assembly and disassembly time to 30 seconds.

[0119] Cooling medium circulation Phase change microcapsule suspension: paraffin microcapsules (50 μm in diameter) are added to deionized water to increase the specific heat capacity by 30% using the latent heat of phase change.

[0120] Electrowetting drive: The mechanical pump is eliminated, and an electrode array is set on the wall of the microchannel 61 to drive the flow of the coolant through the electrowetting effect.

[0121] In summary, the present invention presents a non-embedded integrated chip heat dissipation test device. By improving existing microchannel heat dissipation technology, the device can perform heat dissipation tests on various chips, effectively controlling chip temperature and addressing the issue of high-temperature failure of power devices. Its detachable design allows for replacement of different cooling core modules (manifold layer and microchannel layer structures) for heat dissipation testing, providing scalability. Furthermore, the device's compact size and light weight facilitate device integration.

[0122] The above merely illustrates the technical idea of the present application, and cannot limit the protection scope of the present application. Any modification made according to the technical idea of the present application on the basis of the technical scheme falls within the protection scope of the present application.

Claims

1. A non-embedded integrated chip heat dissipation test device, characterized in that: include: Support base (1); A cooling liquid inlet and outlet base plate (3) is provided on the support base (1) and comprises a cooling liquid inlet (31) and a cooling liquid outlet (33); A manifold layer structure (5) is provided on the cooling liquid inlet and outlet base plate (3), the bottom surface of which is provided with a manifold layer inlet (53) and a manifold layer outlet (54), and the upper surface of which is provided with liquid inlet channels (51) and liquid outlet channels (52) arranged alternately at intervals; A microchannel layer structure (6) is bonded and sealed to the manifold layer structure (5), and a rectangular microchannel (61) is provided on its bottom surface for connecting the liquid inlet channel (51) and the liquid outlet channel (52), and a temperature sensor unit (62) is integrated on its upper surface; A temperature measurement PCB board (7) is connected to the temperature sensor unit (62) of the microfluidic layer structure (6) to collect temperature signals; An electrical connection PCB board (9) is arranged above the chip to be tested (8) and is used to supply power and transmit signals to the chip to be tested (8); A fastening cover plate (10) and bolts (11) are fastened and sealed by the fastening cover plate (10), the electrical connection PCB board (9), the chip to be tested (8), the temperature measurement PCB board (7), the microchannel layer structure (6), the manifold layer structure (5), the cooling liquid inlet and outlet substrate (3) and the support base (1); Wherein, the manifold layer structure (5) and the microchannel layer structure (6) are detachable independent modules.

2. The non-embedded integrated chip heat dissipation test device according to claim 1, characterized in that: The liquid inlet channel (51) is a tapered structure that gradually contracts along the flow direction of the coolant, and the liquid outlet channel (52) is a tapered structure that gradually expands along the flow direction of the coolant; the width of the two liquid outlet channels (52) located at both ends of the manifold layer structure (5) is 1 / 2 of the width of the middle liquid outlet channel.

3. The non-embedded integrated chip heat dissipation test device according to claim 2, characterized in that: The ratio of the middle width to the width at both ends of the liquid inlet channel (51) is 1:2; the ratio of the middle width to the width at both ends of the liquid outlet channel (52) is 2:

1.

4. The non-embedded integrated chip heat dissipation test device according to claim 1, characterized in that: The temperature sensor unit (62) integrated in the microchannel layer structure (6) is a Pt resistance temperature sensor; the temperature sensor unit (62) is welded to the temperature measurement PCB board (7) via leads.

5. The non-embedded integrated chip heat dissipation test device according to claim 1, characterized in that: A sealing groove (32) is provided in the middle of the cooling liquid inlet and outlet base plate (3), and the manifold layer structure (5) is embedded in the sealing groove (32); the cooling liquid inlet (31) is located on the side of the cooling liquid inlet and outlet base plate (3), and the cooling liquid outlet (33) is located on its bottom surface.

6. The non-embedded integrated chip heat dissipation test device according to claim 1, characterized in that: The manifold layer structure (5) and the cooling liquid inlet and outlet base plate (3) are sealed via a silicone gasket (4); and the support base (1) and the cooling liquid inlet and outlet base plate (3) are sealed via a silicone substrate (2).

7. The non-embedded integrated chip heat dissipation test device according to claim 1, characterized in that: The rectangular microchannel (61) is formed by MEMS processing; the microchannel layer structure (6) and the chip to be tested (8) are connected by thermal grease or silica gel.

8. The non-embedded integrated chip heat dissipation test device according to claim 1, characterized in that: The supporting base (1) and the fastening cover (10) are made of stainless steel; the cooling liquid inlet and outlet base plate (3) is made of transparent resin or acrylic; and the manifold layer structure (5) and the microchannel layer structure (6) are made of silicon.

9. The non-embedded integrated chip heat dissipation test device according to claim 1, characterized in that: Threaded holes (34) are provided at corresponding positions around the supporting base (1), the cooling liquid inlet and outlet base plate (3) and the fastening cover plate (10), and fastening connection is achieved through the bolts (11).

10. The non-embedded integrated chip heat dissipation test device according to claim 1, characterized in that: The working medium of the coolant inlet (31) is divided into two paths, which are symmetrically connected to the manifold layer inlet (53) on the bottom surface of the manifold layer structure (5); The manifold layer outlet (54) is located in the middle of the bottom surface of the manifold layer structure (5) and is connected to the cooling liquid outlet (33) for the cooling liquid to enter and exit the base plate (3).

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