Wafer container, top cover of wafer container and wafer container management method

Abstract

A wafer container management method for managing a plurality of wafer containers in a facility includes: transporting the wafer containers with a suspended handling system, where the suspended handling system includes a carrier, where the carrier includes a gripping device, where each wafer container includes an upper flange, the gripping device configured to grip the upper flange; classifying each wafer container into a safely usable group and an unsafely usable group; and covering the upper flange of each wafer container in the unsafe use group with a top cover, wherein the size or shape of the top cover is configured to prevent the upper flange from being grabbed by the grabbing device. Through the configuration, the conveying of the wafer containers classified as unsafe use is automatically interrupted, and the wafer containers unsafe use are prevented from being used in the wafer manufacturing process.

Description

TECHNICAL FIELD

[0001] The present invention relates to a wafer container, a top cover of a wafer container, and a method for managing wafer containers in a facility. BACKGROUND

[0002] A semiconductor manufacturing facility can contain wafer containers that require maintenance (e.g., wafer containers that require cleaning). If the wafer containers that require maintenance are not properly managed, they can be mixed with wafer containers that are in normal use, which can cause contamination or damage to the wafers or wafer processing equipment. SUMMARY

[0003] One aspect of the present invention is to provide a top cover for interrupting the transport of a wafer container that is not safe for use (e.g., a wafer container that requires maintenance).

[0004] According to some embodiments of the present invention, a wafer container includes a container body, an upper flange, and a top cover. The container body is configured to hold one or more semiconductor wafers. The upper flange protrudes from a top surface of the container body and includes a neck portion and a head portion. The neck portion connects between the container body and the head portion, and the head portion is wider than the neck portion. The top cover is disposed on the upper flange and is configured to interrupt the transport of the wafer container. The head portion of the upper flange has a first height and a first width, and the top cover has a second height and a second width. The second height is greater than the first height, and the second width is greater than the first width.

[0005] In one or more embodiments of the present invention, the top cover includes a sidewall that surrounds the head portion of the upper flange and has a bottom surface that is positioned below the head portion of the upper flange.

[0006] In one or more embodiments of the present invention, the top cover includes a top wall that faces a top surface of the head portion of the upper flange and a sidewall that connects the top wall and is disposed around the head portion. The head portion has a recess, and the top wall includes a protrusion that is inserted into the recess.

[0007] In one or more embodiments of the present invention, an outer edge of the head portion is formed with at least one notch, and the sidewall includes at least one protrusion that is configured to fit into the notch.

[0008] In one or more embodiments of the present invention, the top cover includes a housing and a cushioning element. The housing covers a top surface and a side surface of the head portion of the upper flange, and the cushioning element is disposed on a top surface of the housing.

[0009] In one or more embodiments of the present invention, the top cover includes a housing and an extension structure. The extension structure is connected to the housing and extends laterally beyond an outer edge of the container body.

[0010] According to some embodiments of the present disclosure, a wafer container management method for managing a plurality of wafer containers in a facility includes: transporting the wafer containers using a suspended transport system, wherein the suspended transport system includes a carrier including a gripping device, wherein each wafer container includes an upper flange, and the gripping device is configured to grip the upper flange; classifying each wafer container into a safe-to-use group and a not-safe-to-use group; and covering the upper flange of each wafer container in the not-safe-to-use group with a cap, wherein the cap is sized or shaped to prevent the upper flange from being gripped by the gripping device.

[0011] In one or more embodiments of the present disclosure, the wafer container management method further includes: lowering the gripping device; and detecting, by a balance detection mechanism of the carrier, whether the gripping device remains balanced during the lowering of the gripping device. The cap is wider than the upper flange, such that the gripping device becomes unbalanced when contacting the cap.

[0012] In one or more embodiments of the present disclosure, the wafer container management method further includes: detecting, by a flange detection mechanism disposed on the gripping device, a head portion of the upper flange. The upper flange further includes a neck portion, and the head portion is wider than the neck portion. The cap is taller than the head portion of the upper flange, such that the head portion of the upper flange is prevented from being detected by the flange detection mechanism.

[0013] In one or more embodiments of the present disclosure, the cap includes a sidewall that surrounds the head portion of the upper flange and has a bottom surface positioned below the head portion of the upper flange.

[0014] In one or more embodiments of the present disclosure, the wafer container management method further includes: scanning, by an obstacle scanner of the carrier, for an obstacle between the carrier and the first wafer container. The cap includes an extension structure that extends laterally beyond an outer edge of a container body of the first wafer container, such that the obstacle scanner detects the presence of the obstacle.

[0015] According to some embodiments of the present disclosure, a cap for interrupting transport of a wafer container includes a housing. The housing is disposed on an upper flange of the wafer container and includes a top wall and a sidewall. The sidewall is disposed along an outer edge of the top wall and cooperates with the top wall to form a recess configured to receive the upper flange of the wafer container. The upper flange includes a neck portion and a head portion connected to the neck portion and wider than the neck portion. The cap is wider and taller than the head portion of the upper flange.

[0016] In summary, the present invention provides a technique for preventing the inadvertent use of unsafe wafer containers (e.g., wafer containers that could contaminate or damage semiconductor wafers or wafer processing equipment). Each wafer container classified as unsafe is covered with a lid. The lid's dimensions and shape prevent the container's upper flange from being grasped by a gripper device used to transport the wafer container. This configuration automatically halts the transport of wafer containers classified as unsafe, preventing their use in the wafer manufacturing process.

[0017] It should be understood that the foregoing general description and the following detailed description are merely exemplary, and are intended to provide further explanation of the invention claimed in this case. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] To make the above and other objects, features, advantages and embodiments of the present invention more clearly understood, the accompanying drawings are described as follows:

[0019] Figure 1 A schematic side view of a facility according to one embodiment of the present invention is shown;

[0020] Figure 2 To illustrate Figure 1 A schematic exploded view of one of the wafer containers is shown;

[0021] Figure 3 To illustrate Figure 1 A schematic side view of a carrier shown attempting to extract a wafer container without a top cover;

[0022] Figure 4 as well as Figure 5 To illustrate Figure 1 A schematic side view of a carrier is shown attempting to extract a wafer container having a top cover;

[0023] Figure 6 To illustrate Figure 1 A schematic side view of a carrier shown attempting to extract a wafer container according to another embodiment of the present invention; and

[0024] Figure 7 To illustrate Figure 1 The carrier shown is intended to be a schematic side view of a wafer container according to another embodiment of the present invention. DETAILED DESCRIPTION

[0025] The embodiments of the present application will be described in detail with reference to the drawings, wherein like reference numerals refer to like elements throughout. The following detailed description includes specific details for the purpose of providing a thorough understanding of the exemplary embodiments of the application. However, it will be apparent to those skilled in the art that the exemplary embodiments of the application can be practiced without these specific details. In some instances, well-known structures and functions have not been described in detail in order to avoid obscuring the concept of the application. It is therefore evident that the application can be practiced with modifications and alterations, and that the application should not be considered limited to the deliberately set forth and representative embodiments.

[0026] Reference will now be made to Figure 1 . Figure 1 A schematic side view of a facility 10 according to an embodiment of the present application is shown. The facility 10 is, for example, a semiconductor manufacturing facility. The facility 10 includes a plurality of wafer containers 11, each of which is configured to hold one or more semiconductor wafers. The wafer containers 11 are, for example, front opening unified pods (FOUPs). The facility 10 also includes an overhead hoist transport (OHT) 30 configured to transport the wafer containers 11 within the facility 10. For example, the overhead hoist transport 30 can transport the wafer containers 11 between various wafer storage sites and wafer processing equipment (not shown) within the facility 10.

[0027] As shown in Figure 1 , each of the wafer containers 11 in the facility 10 is classified into a safe-to-use group and an unsafe-to-use group. One or more of the wafer containers 12 in the unsafe-to-use group are wafer containers that can contaminate or damage semiconductor wafers or semiconductor processing equipment. For example, the wafer containers 12 in the unsafe-to-use group can include wafer containers that require maintenance (e.g., cleaning). One or more of the wafer containers 13 in the safe-to-use group are wafer containers that meet requirements for protecting semiconductor wafers or wafer processing equipment (e.g., wafer containers that are functional and free of contaminants). In some embodiments, the wafer containers 11 in the facility 10 can be classified by a detection device (not shown) of the facility 10.

[0028] As shown in Figure 1 , each of the wafer containers 13 in the safe-to-use group includes a container body 21 and an upper flange 23 connected to the container body 21. The container body 21 is configured to hold one or more semiconductor wafers. The upper flange 23 protrudes from a top surface of the container body 21 and includes a neck portion 25 and a head portion 26. The neck portion 25 is connected between the container body 21 and the head portion 26, and the head portion 26 is wider than the neck portion 25.

[0029] AsFigure 1 As shown, the overhead handling system 30 includes a transport track 31 and a carrier 33. The transport track 31 extends between multiple locations in the facility 10 (e.g., wafer storage sites and wafer processing equipment). The carrier 33 is disposed on the transport track 31 and is configured to move along the transport track 31. The carrier 33 includes a carrier body 34, a gripping device 35, and a lifting drive device 36. The carrier body 34 is configured to store at least one wafer container 11. The gripping device 35 is configured to extract the wafer container 11 from a specific location (e.g., a load port) and move the wafer container 11 to the carrier body 34. The gripping device 35 is also configured to move the wafer container 11 out of the carrier body 34 and place it at a specific location (e.g., a load port). The gripping device 35 is configured to extract the wafer container 11 by gripping the upper flange 23 of the wafer container 11. The lifting drive device 36 is connected between the grabbing device 35 and the carrier body 34. The grabbing device 35 can move in the vertical direction under the drive of the lifting drive device 36. The lifting drive device 36 can include one or more transmission belts.

[0030] like Figure 1 As shown, each wafer container 12 in the unsafe-for-use group includes a container body 21 and an upper flange 23, the structures of which are identical to those of the container body 21 and upper flange 23 of the wafer container 13. Each wafer container 12 further includes a top cover 50 disposed on the upper flange 23. The top cover 50 covers the upper flange 23, and the size and shape of the top cover 50 are configured to prevent the upper flange 23 from being grasped by the grasping device 35. In other words, the top cover 50 can interrupt the transportation of the wafer containers 12 in the unsafe-for-use group. With this configuration, the wafer containers 12 in the unsafe-for-use group will not be accidentally used to hold semiconductor wafers in the facility 10, thereby preventing contamination and damage to the semiconductor wafers or semiconductor processing equipment.

[0031] Please refer to Figure 2 . Figure 2 To illustrate Figure 1 A schematic exploded view of one of the wafer containers 12 is shown. In some embodiments, the top cover 50 includes a shell 51 that is disposed on the upper flange 23 and includes a top wall 56 and side walls 57 connected to the top wall 56. The side walls 57 are disposed along the outer edge of the top wall 56 and, together with the top wall 56, form a recess 53 configured to receive the upper flange 23. When the top cover 50 is placed on the upper flange 23, the top wall 56 faces and covers the top surface of the head 26 of the upper flange 23, while the side walls 57 surround the head 26 and cover the sides of the head 26.

[0032] like Figure 2As shown, in some embodiments, the head 26 of the upper flange 23 has a recess 28. The top wall 56 of the housing 51 includes a protrusion 58 that protrudes downward from the top wall 56. When the top cover 50 is placed on the upper flange 23, the protrusion 58 is configured to be inserted into the recess 28 of the head 26. In some embodiments, the outer edge of the head 26 is formed with at least one notch 29, and the side wall 57 of the housing 51 includes at least one protrusion 59 that protrudes from the inner surface of the side wall 57. When the top cover 50 is placed on the upper flange 23, the protrusion 59 is aligned with the notch 29 of the head 26.

[0033] Referring to Figure 3 . Figure 3 To illustrate Figure 1 As shown, in some embodiments, the carrier 33 further includes a balance detection mechanism 60 configured to detect whether the gripping device 35 remains balanced during the process of being lowered from the carrier body 34 by the lifting drive 36. In some embodiments, the balance detection mechanism 60 includes a signal transceiver 61 and a reflective plate 62 disposed on the carrier body 34 and the gripping device 35, respectively. The signal transceiver 61 is configured to emit a test signal 90 (e.g., an infrared light signal or other light signal) downward. If the gripping device 35 remains balanced (e.g., when the gripping device 35 remains horizontal), the reflective plate 62 can reflect the test signal 90, and the reflected signal 91 can return to and be received by the signal transceiver 61. Otherwise, if the gripping device 35 does not remain balanced (e.g., when the gripping device 35 is tilted), the reflective plate 62 can fail to reflect the test signal 90, or the reflective plate 62 reflects the test signal 90 but the reflected signal 91 proceeds obliquely, resulting in the signal transceiver 61 failing to receive the reflected signal 91.

[0034] As Figure 3 shown, in some embodiments, the balance detection mechanism 60 is configured to provide a sensing signal showing whether the gripping device 35 remains balanced. The balance detection mechanism 60 can provide the sensing signal periodically (e.g., every 0.1 second, every 0.05 second, etc.). The sensing signal can be provided by the signal transceiver 61 of the balance detection mechanism 60. In some embodiments, the carrier 33 further includes a control system 32 communicably coupled to the balance detection mechanism 60 and configured to receive the sensing signal. The control system 32 is further configured to instruct the carrier 33 to pause or stop transporting the wafer container when the sensing signal shows that the gripping device 35 does not remain balanced. In some embodiments, the control system 32 can include a processor, a data storage device, a communication device, and / or other electronic components.

[0035] As Figure 3As shown, when the carrier 33 attempts to pick up the wafer container 13 without the cap, the gripper 35 can remain balanced during the lowering process (e.g., the balance detection mechanism 60 continuously outputs a sensing signal indicating that the gripper 35 remains balanced), and the gripper 35 can successfully fit over the upper flange 23 of the wafer container 13.

[0036] As shown in FIG. 1, in some embodiments, the carrier 33 further includes a flange detection mechanism 63 disposed on the gripper 35 and configured to detect the head 26 of the upper flange 23, which is the structure that the gripper 35 can grasp to move the wafer container 13. Figure 3

[0037] As shown in FIG. 2, in some embodiments, the flange detection mechanism 63 includes a first signal transceiver 64 and a second signal transceiver 65. The first signal transceiver 64 is disposed to face the side of the head 26 of the upper flange 23, and the second signal transceiver 65 is disposed to face the gap 92 between the head 26 of the upper flange 23 and the container body 21. Figure 3 Figure 2 As shown in FIG. 3, in some embodiments, the first signal transceiver 64 and the second signal transceiver 65 are configured to horizontally emit a first test signal 96 and a second test signal 97, respectively. When the gripper 35 is positioned as shown in FIG. 4 (e.g., when the head 26 enters the central opening of the gripper 35), the first test signal 96 is reflected by the side of the head 26 of the upper flange 23 back to the first signal transceiver 64, and the second test signal 97 is emitted into the gap 92 without being reflected. Figure 3

[0038] As shown in FIG. 5, in some embodiments, the first signal transceiver 64 and the second signal transceiver 65 are configured to provide a first sensing signal and a second sensing signal, respectively, indicating whether the first signal transceiver 64 and the second signal transceiver 65 receive the reflected signals, respectively. In some embodiments, the control system 32 of the carrier 33 is communicably coupled to the flange detection mechanism 63 and configured to receive the first sensing signal and the second sensing signal. The control system 32 is further configured to instruct the carrier 33 to pause or stop moving the wafer container when the second sensing signal indicates that the second signal transceiver 65 receives the reflected signal. Figure 3

[0039] As shown in FIG. 6, in some embodiments, the first signal transceiver 64 and the second signal transceiver 65 are configured to provide a first sensing signal and a second sensing signal, respectively, indicating whether the first signal transceiver 64 and the second signal transceiver 65 receive the reflected signals, respectively. In some embodiments, the control system 32 of the carrier 33 is communicably coupled to the flange detection mechanism 63 and configured to receive the first sensing signal and the second sensing signal. The control system 32 is further configured to instruct the carrier 33 to pause or stop moving the wafer container when the second sensing signal indicates that the second signal transceiver 65 receives the reflected signal. Figure 3 ​​​​As shown, when the carrier 33 attempts to retrieve the wafer container 13 without the cap, the flange detection mechanism 63 can successfully detect the head 26 of the upper flange 23 of the wafer container 13 (e.g., the first sensing signal indicates that the first signal transceiver 64 receives the reflected signal, and the second sensing signal indicates that the second signal transceiver 65 does not receive the reflected signal). Thus, the carrier 33 can continue to retrieve the wafer container 13. For example, the end of the gripping device 35 can extend horizontally toward the neck 25 such that the gripping device 35 can grasp the upper flange 23 of the wafer container 13.

[0040] Referring to Figure 4 . Figure 4 To illustrate Figure 1 As shown, when the carrier 33 attempts to retrieve the wafer container 12 (i.e., the wafer container with the cap 50), the flange detection mechanism 63 fails to detect the head 26 of the upper flange 23 of the wafer container 12 because the second sensing signal indicates that the second signal transceiver 65 receives the reflected signal, which is the second test signal 97 emitted by the second signal transceiver 65 reflected by the sidewall 57 of the cap 50. Thus, the gripping device 35 stops retrieving the wafer container 12.

[0041] As Figure 4 shown, when the carrier 33 attempts to retrieve the wafer container 13 without the cap, the flange detection mechanism 63 can successfully detect the head 26 of the upper flange 23 of the wafer container 13 (e.g., the first sensing signal indicates that the first signal transceiver 64 receives the reflected signal, and the second sensing signal indicates that the second signal transceiver 65 does not receive the reflected signal). Thus, the carrier 33 can continue to retrieve the wafer container 13. For example, the end of the gripping device 35 can extend horizontally toward the neck 25 such that the gripping device 35 can grasp the upper flange 23 of the wafer container 13.

[0042] As Figure 4 shown, in some embodiments, the sidewall 57 of the cap 50 has a bottom surface 52 that is positioned below the head 26 of the upper flange 23. With the above configuration, the sidewall 57 can reflect the second test signal 97 emitted by the second signal transceiver 65 such that the carrier 33 fails to detect the head 26 of the upper flange 23.

[0043] Referring to Figure 5 . Figure 5 To illustrate Figure 1 As shown, when the carrier 33 attempts to retrieve the wafer container 12 (i.e., the wafer container with the cap 50), the flange detection mechanism 63 fails to detect the head 26 of the upper flange 23 of the wafer container 12 because the second sensing signal indicates that the second signal transceiver 65 receives the reflected signal, which is the second test signal 97 emitted by the second signal transceiver 65 reflected by the sidewall 57 of the cap 50. Thus, the gripping device 35 stops retrieving the wafer container 12.

[0044] As Figure 5As shown, when the carrier 33 attempts to retrieve the wafer container 12, if the gripping device 35 is not properly aligned with the wafer container 12, the gripping device 35 becomes tilted when it contacts the top cover 50. Since the signal transceiver 61 does not receive the reflected signal 91, the sensing signal provided by the balance detection mechanism 60 indicates that the gripping device 35 is not balanced. Therefore, the gripping device 35 stops retrieving the wafer container 12.

[0045] In some embodiments, the top cover 50 comprises a metallic material (e.g., aluminum), which increases the weight of the top cover 50 so that the top cover 50 can be stably rested on the upper flange 23 of the wafer container 12, for example, to prevent the top cover 50 from falling off the upper flange 23 when it is hit by the gripping device 35. In other embodiments, the top cover 50 can also comprise other materials such as acrylic.

[0046] In some embodiments, the top cover 50 and the container body 21 can have different colors so that personnel in the facility 10 can easily identify the wafer container 12 in the unsafe-to-use group. In some embodiments, the outer surface of the top cover 50 can be marked with a warning message so that personnel in the facility 10 can easily identify the wafer container 12 in the unsafe-to-use group.

[0047] Please refer to Figure 6 . Figure 6 To illustrate Figure 1 As shown, the carrier 33 attempts to retrieve the wafer container 14 according to another embodiment of the present application. The wafer container 14 comprises a top cover 70, which further comprises a cushioning element 74 disposed on the top surface of the housing 51 compared to the top cover 50 described above. The cushioning element 74 increases the height of the top cover 70 to ensure that the top cover 70 can reflect the second test signal 97 emitted by the second signal transceiver 65. In some embodiments, the cushioning element 74 can comprise one or more mechanical springs or one or more soft pads.

[0048] Please refer to Figure 7 . Figure 7 To illustrate Figure 1A schematic side view of a carrier 33 attempting to retrieve a wafer container 15 according to another embodiment of the present application is shown. In some embodiments, the carrier 33 further comprises an obstacle scanner 37 disposed on the carrier body 34 and configured to scan for obstacles between the carrier 33 and the wafer container that the carrier 33 is attempting to retrieve. In some embodiments, the obstacle scanner 37 is configured to emit at least one test signal 98 (e.g., an infrared light signal or other light signal) in a direction. If there are no obstacles between the carrier 33 and the wafer container, the obstacle scanner 37 will not receive a reflected signal, whereas if there are obstacles between the carrier 33 and the wafer container, the test signal 98 will be reflected and received by the obstacle scanner 37. In some embodiments, the obstacle scanner 37 comprises a signal transceiver. In some embodiments, the obstacle scanner 37 can emit test signals 98 in multiple directions. For example, the test signal 98 emitted by the obstacle scanner 37 can encompass a sector, a triangle, a cone, or other suitable shape of area. In such embodiments, any obstacles in the area cause the test signal 98 to be reflected and received by the obstacle scanner 37.

[0049] As shown, in some embodiments, the obstacle scanner 37 is configured to provide a sensing signal that indicates whether there are obstacles between the carrier 33 and the wafer container that the carrier 33 is attempting to retrieve. In some embodiments, the control system 32 of the carrier 33 is communicably coupled to the obstacle scanner 37 and is configured to receive the sensing signal from the obstacle scanner 37. The control system 32 is further configured to instruct the carrier 33 to pause or stop transporting the wafer container if the sensing signal indicates that there are obstacles between the carrier 33 and the wafer container. Figure 7 As shown, in some embodiments, the obstacle scanner 37 is configured to provide a sensing signal that indicates whether there are obstacles between the carrier 33 and the wafer container that the carrier 33 is attempting to retrieve. In some embodiments, the control system 32 of the carrier 33 is communicably coupled to the obstacle scanner 37 and is configured to receive the sensing signal from the obstacle scanner 37. The control system 32 is further configured to instruct the carrier 33 to pause or stop transporting the wafer container if the sensing signal indicates that there are obstacles between the carrier 33 and the wafer container.

[0050] Figure 7 As shown, in some embodiments, the obstacle scanner 37 is configured to provide a sensing signal that indicates whether there are obstacles between the carrier 33 and the wafer container that the carrier 33 is attempting to retrieve. In some embodiments, the control system 32 of the carrier 33 is communicably coupled to the obstacle scanner 37 and is configured to receive the sensing signal from the obstacle scanner 37. The control system 32 is further configured to instruct the carrier 33 to pause or stop transporting the wafer container if the sensing signal indicates that there are obstacles between the carrier 33 and the wafer container.

[0051] On the other hand, when the carrier 33 attempts to retrieve the aforementioned wafer container 13 without the top cover, in the absence of other obstacles, the sensing signal output by the obstacle scanner 37 indicates that there are no obstacles, and thus the carrier 33 can begin to lower the gripping device 35 to grasp the upper flange 23 of the wafer container 13.

[0052] ​According to an embodiment of the present application, a wafer container management method for managing a plurality of wafer containers (e.g., the wafer containers 11-15) in a facility includes: using a suspended carrier system (e.g., the suspended carrier system 30) to transport the wafer containers; classifying each wafer container into a safe-to-use group and a non-safe-to-use group; and covering an upper flange of each wafer container in the non-safe-to-use group with a cap (e.g., the cap 50, 70, or 80) configured to prevent the upper flange from being grabbed by a grabbing device of a carrier of the suspended carrier system. In some embodiments, the steps of classifying the wafer containers and covering the upper flanges of the wafer containers with the caps can be performed by automated equipment. In some embodiments, the wafer container management method can further include any of the operations performed by the carrier 33 described above.

[0053] In summary, the present application provides a technique for preventing the inadvertent use of non-safe-to-use wafer containers (e.g., wafer containers that can contaminate or damage semiconductor wafers or wafer processing equipment) in a semiconductor manufacturing process. Each wafer container classified as non-safe-to-use is covered with a cap configured to prevent an upper flange of the wafer container from being grabbed by a grabbing device of a carrier used to transport the wafer container. With the above configuration, the transportation of wafer containers classified as non-safe-to-use is automatically interrupted, preventing the use of non-safe-to-use wafer containers in a semiconductor manufacturing process.

[0054] Although the present application has been described in detail with particular references to certain illustrative embodiments thereof, other embodiments will be obvious to those skilled in the art. Accordingly, the spirit and scope of the attached claims should not be limited to the description of the embodiments contained herein.

[0055] Obviously, many modifications and changes can be made to the present application without departing from the scope or spirit thereof. Accordingly, the application intends to embrace all such modifications and changes as fall within the scope of the appended claims.

[0056] LIST OF SYMBOLS

[0057] 10: facility

[0058] 11, 12, 13, 14, 15: wafer container

[0059] 21: container body

[0060] 23: upper flange

[0061] 25: neck

[0062] 26: head

[0063] 28: recess

[0064] 29: notch

[0065] 30: suspended transport system

[0066] 31: transport track

[0067] 32: control system

[0068] 33: carrier

[0069] 34: carrier body

[0070] 35: gripping device

[0071] 36: lifting drive

[0072] 37: obstacle scanner

[0073] 50, 70, 80: top cover

[0074] 51: housing

[0075] 52: bottom surface

[0076] 56: top wall

[0077] 57: side wall

[0078] 58, 59: protrusion

[0079] 60: balance detection mechanism

[0080] 61: signal transceiver

[0081] 62: reflector plate

[0082] 63: flange detection mechanism

[0083] 64: first signal transceiver

[0084] 65: second signal transceiver

[0085] 74: buffer element

[0086] 84: extension structure

[0087] 90, 98: test signal

[0088] 91: reflected signal

[0089] 92: gap

[0090] 96: first test signal

[0091] 97: second test signal

[0092] H1: first height

[0093] H2: second height

[0094] W1: first width

[0095] W2: second width.

Claims

1. A wafer container, characterized in that: Include: a container body configured to accommodate one or more semiconductor wafers; an upper flange protruding from the top surface of the container body and comprising a neck and a head, wherein the neck is connected between the container body and the head, and the head is wider than the neck; as well as A top cover is arranged on the upper flange and is used to interrupt the transportation of the wafer container, wherein the head of the upper flange has a first height and a first width, and the top cover has a second height and a second width, the second height is greater than the first height, and the second width is greater than the first width.

2. The wafer container according to claim 1, wherein: The top cover includes a side wall surrounding the head portion of the upper flange and having a bottom surface located below the head portion of the upper flange.

3. The wafer container according to claim 1, wherein: The top cover includes a top wall and side walls, wherein the top wall faces the top surface of the head of the upper flange, and the side walls are connected to the top wall and are arranged around the head, wherein the head has a recess, and the top wall includes a protrusion inserted into the recess.

4. The wafer container according to claim 1, wherein: The top cover includes a top wall and a side wall, the top wall faces the top surface of the head of the upper flange, the side wall is connected to the top wall and is arranged around the head, the outer edge of the head is formed with at least one notch, and the side wall includes at least one protrusion matching the at least one notch.

5. The wafer container according to claim 1, wherein: The top cover includes a shell and a buffer element. The shell covers the top surface and side surfaces of the head portion of the upper flange. The buffer element is arranged on the top surface of the shell.

6. The wafer container according to claim 1, wherein: The top cover includes a shell and an extension structure. The shell covers the top surface and side surfaces of the head of the upper flange. The extension structure is connected to the shell and extends laterally beyond the outer edge of the container body.

7. A wafer container management method for managing a plurality of wafer containers in a facility, characterized in that: Include: transporting the plurality of wafer containers using an overhead handling system, wherein the overhead handling system comprises a carrier, the carrier comprises a gripping device, wherein each of the plurality of wafer containers comprises an upper flange, and the gripping device is configured to grip the upper flange; classifying each of the plurality of wafer containers into a safe-to-use group and an unsafe-to-use group; as well as The upper flange of each wafer container in the unsafe-for-use group is covered with a top cover, wherein the size or shape of the top cover is configured to prevent the upper flange from being grasped by the grasping device.

8. The wafer container management method according to claim 7, characterized in that: Further including: lowering the gripping device; and During the descent of the grabbing device, the balance detection mechanism of the carrier detects whether the grabbing device maintains balance; The top cover is wider than the upper flange, so that the gripping device is unbalanced when contacting the top cover.

9. The wafer container management method according to claim 7, wherein: Further including: detecting a head portion of the upper flange by a flange detection mechanism disposed on the gripping device, wherein the upper flange further comprises a neck portion, and the head portion is wider than the neck portion; The top cover is higher than the head of the upper flange, thereby preventing the head of the upper flange from being detected by the flange detection mechanism.

10. The wafer container management method according to claim 9, characterized in that: The top cover includes a side wall surrounding the head portion of the upper flange and having a bottom surface located below the head portion of the upper flange.

11. The wafer container management method according to claim 7, wherein: Further including: Scanning, by an obstacle scanner of the carrier, an obstacle between the carrier and a first wafer container among the plurality of wafer containers; The top cover includes an extension structure, and the extension structure extends laterally beyond the outer edge of the container body of the first wafer container, so that the obstacle scanner can detect the existence of an obstacle.

12. A top cover for interrupting the transport of a wafer container, characterized in that: Include: a housing, disposed on the upper flange of the wafer container, and comprising a top wall and a side wall, wherein the side wall is disposed along an outer edge of the top wall and forms a groove together with the top wall, wherein the groove is configured to receive the upper flange of the wafer container; The upper flange includes a neck and a head, the head is connected to the neck and is wider than the neck, and the top cover is wider than and higher than the head of the upper flange.

13. The top cover according to claim 12, wherein: The side wall has a bottom surface, and the bottom surface is located below the head of the upper flange.

14. The top cover according to claim 12, wherein: A buffer element is further included, and the buffer element is disposed on the top surface of the shell.

15. The top cover according to claim 12, wherein: The invention further comprises an extension structure connected to the shell and extending laterally beyond the outer edge of the container body of the wafer container.

Images