Method, system, equipment and medium for prolonging service life of single crystal nickel base alloy device

By performing electrochemical polishing and multi-stage heat treatment on single-crystal nickel-based alloy devices, the microstructure was optimized, solving the problem of fatigue performance degradation of single-crystal nickel-based alloy devices under high-temperature environments, and achieving extended device life and improved high-temperature fatigue resistance.

CN120889009APending Publication Date: 2025-11-04AIR FORCE UNIV PLA
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Patent Information

Application Number
CN202511041897.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-07-28
Publication Date
2025-11-04

AI Technical Summary

Technical Problem

The microstructure of single-crystal nickel-based alloy devices ages under high-temperature environments and alternating loads, leading to a decline in high-temperature fatigue resistance and posing a risk of fracture failure.

Method used

After electrochemical polishing, multi-stage heat treatment is performed, including preheating, solution heat treatment and post-heat treatment, to optimize the microstructure, release harmful residual tensile stress introduced by fatigue deformation, reduce the density of deformation defects and improve high-temperature fatigue resistance.

Benefits of technology

It significantly extends the service life of single-crystal nickel-based alloy devices, reduces economic costs, avoids recrystallization from damaging the grain boundary-free structure, and improves resistance to high-temperature fatigue.

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Abstract

The invention provides a method, a system, equipment and a medium for prolonging the service life of a single crystal nickel base alloy device. The method comprises the following steps: performing electrochemical polishing treatment on a to-be-treated device; representing the device to be processed to obtain first geometric necessary dislocation density distribution; according to the first geometric necessary dislocation density distribution, pre-heating treatment process parameters are determined; performing preheating treatment on the to-be-treated device according to the preheating treatment process parameters; representing the device to be processed to obtain second geometric necessary dislocation density distribution; based on the second geometric necessary dislocation density distribution, solid solution heat treatment process parameters are determined; performing solid solution heat treatment on the to-be-treated device according to the solid solution heat treatment process parameters; representing the to-be-processed device to obtain a precipitated phase specification; determining post-heat treatment process parameters according to the specification of the precipitated phase; performing post-heat treatment on the to-be-treated device according to the post-heat treatment process parameters. The service life of the single crystal nickel base alloy device can be prolonged.
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Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of alloys, in particular to a method, system, device and medium for prolonging the service life of a single-crystal nickel-based alloy device. BACKGROUND

[0002] With the increase of the flight range and flight speed of an airplane, the requirements for the thrust and thrust-to-weight ratio of the airplane are higher and higher. In order to improve the thrust and efficiency of an aero-engine, the turbine inlet temperature (i.e., the temperature before the turbine) of the aero-engine needs to be as high as possible. In the related art, the turbine inlet temperature of an aero-engine with a thrust-to-weight ratio of 10 is 1580-1650℃. In order to further improve the performance of the aero-engine and effectively improve the thrust-to-weight ratio of the aero-engine, the high-temperature resistance of the material needs to be improved.

[0003] A high-temperature alloy is a metal material that can work for a long time at a temperature above 600℃ and under certain stress conditions, has excellent high-temperature strength, good oxidation resistance and hot corrosion resistance, good fatigue performance, fracture toughness and other comprehensive performance, and has become an irreplaceable key material for the hot end components of military and civil gas turbine engines. Among them, a single-crystal nickel-based alloy is a kind of engine blade material developed on the basis of equiaxed crystal and directional columnar crystal high-temperature alloy. The single-crystal nickel-based alloy refers to a metal material prepared by adding titanium, chromium and other strengthening elements to nickel as a matrix (content greater than 50wt%). The single-crystal nickel-based alloy has a unique structure without grain boundaries, excellent high-temperature resistance and corrosion resistance, and has been widely used in high-pressure turbine blades of aero-engines.

[0004] In actual service, the high-pressure turbine blades of the aero-engine inevitably face complex working conditions such as high-temperature environment and alternating load, and the microstructure of the single-crystal nickel-based alloy will gradually age, the high-temperature fatigue resistance will decrease, and the risk of fracture failure is extremely possible. SUMMARY

[0005] The present application provides a method, system, device and medium for prolonging the service life of a single-crystal nickel-based alloy device.

[0006] The present application provides a method for prolonging the service life of a single-crystal nickel-based alloy device, comprising the following steps:

[0007] Electrochemical polishing treatment is performed on the device to be treated;

[0008] The device to be treated after electrochemical polishing treatment is characterized to obtain a first geometrically necessary dislocation density distribution;

[0009] According to the first geometrically necessary dislocation density distribution, the preheating process parameters are determined;

[0010] preheat the device to be treated according to the preheat treatment process parameters;

[0011] characterize the device to be treated after the preheat treatment to obtain a second geometrically necessary dislocation density distribution;

[0012] determine solid solution heat treatment process parameters based on the second geometrically necessary dislocation density distribution;

[0013] solid solution heat treat the device to be treated according to the solid solution heat treatment process parameters;

[0014] characterize the device to be treated after the solid solution heat treatment to obtain a precipitate specification;

[0015] determine post-heat treatment process parameters according to the precipitate specification;

[0016] post-heat treat the device to be treated according to the post-heat treatment process parameters.

[0017] In an embodiment of the present application, determining the preheat treatment process parameters according to the first geometrically necessary dislocation density distribution comprises:

[0018] determining a first geometrically necessary dislocation density maximum value based on the first geometrically necessary dislocation density distribution;

[0019] determining the preheat treatment process parameters according to the first geometrically necessary dislocation density maximum value.

[0020] In an embodiment of the present application, the preheat treatment process parameters include an initial temperature, a temperature rise amplitude each time, a holding time at each temperature, a temperature rise rate between adjacent temperatures, a total heat treatment time, and a final temperature. Determining the preheat treatment process parameters according to the first geometrically necessary dislocation density maximum value comprises:

[0021] if the first geometrically necessary dislocation density maximum value is greater than 300*10 12 m -2 , the preheat treatment process parameters are determined as follows: the initial temperature is in a range of 1000-1100℃, the temperature rise amplitude each time is in a range of 10-20℃, the holding time at each temperature is in a range of 10-120min, the temperature rise rate between adjacent temperatures is less than 5℃ / min, the total heat treatment time is in a range of 60-180min, and the final temperature is in a range of 1280-1300℃;

[0022] if the first geometrically necessary dislocation density maximum value is in a range of 150*10 12 m -2 -300*10 12 m -2In the range of 1050-1150℃, the initial temperature, in the range of 10-50℃, the temperature increasing range, in the range of 10-120min, the holding time at each temperature, the temperature increasing rate between adjacent temperatures is less than 10℃ / min, the total heat treatment time is in the range of 60-180min, and the final temperature is in the range of 1270-1300℃.

[0023] If the first geometrically necessary dislocation density maximum value is less than 150*10 12 m -2 , the pre-heat treatment process parameters are determined as: the initial temperature is in the range of 1000-1100℃, the temperature increasing range is in the range of 10-100℃, the holding time at each temperature is in the range of 10-120min, the temperature increasing rate between adjacent temperatures is less than 20℃ / min, the total heat treatment time is in the range of 60-180min, and the final temperature is in the range of 1260-1300℃.

[0024] In an embodiment of the present application, based on the second geometrically necessary dislocation density distribution, the solid solution heat treatment process parameters are determined, including:

[0025] Based on the second geometrically necessary dislocation density distribution, the second geometrically necessary dislocation density maximum value is determined.

[0026] According to the second geometrically necessary dislocation density maximum value, the solid solution heat treatment process parameters are determined.

[0027] In an embodiment of the present application, the solid solution heat treatment process parameters include the temperature of solid solution heat treatment and the time length of solid solution heat treatment, according to the second geometrically necessary dislocation density maximum value, the solid solution heat treatment process parameters are determined, including:

[0028] If the second geometrically necessary dislocation density maximum value is greater than 150*10 12 m -2 , the solid solution heat treatment process parameters are determined as: the temperature of solid solution heat treatment is in the range of 1300-1350℃, and the time length of solid solution heat treatment is in the range of 10-60min.

[0029] If the second geometrically necessary dislocation density maximum value is in the range of 50*10 12 m -2 -150*10 12 m -2 , the solid solution heat treatment process parameters are determined as: the temperature of solid solution heat treatment is in the range of 1270-1320℃, and the time length of solid solution heat treatment is in the range of 10-60min.

[0030] if the second geometrically necessary dislocation density maximum is less than 50*10 12 m -2 The solid solution heat treatment process parameters are determined as follows: the temperature of the solid solution heat treatment is in the range of 1250-1300 DEG C, and the time length of the solid solution heat treatment is in the range of 10-60 min.

[0031] In an embodiment of the present application, the post-heat treatment process parameters include a first temperature, a second temperature, a first holding time at the first temperature and a second holding time at the second temperature, and the first temperature is greater than the second temperature.

[0032] If the precipitated phase size is greater than 250 nm, the post-heat treatment process parameters are determined as follows: the first temperature is in the range of 1100-1130 DEG C, the second temperature is in the range of 800-850 DEG C, the first holding time is in the range of 2-10 min, and the second holding time is in the range of 10-35 min.

[0033] In an embodiment of the present application, the post-heat treatment process parameters are determined according to the precipitated phase size, and further include:

[0034] If the precipitated phase size is in the range of 150-250 nm, the post-heat treatment process parameters are determined as follows: the first temperature is in the range of 1100-1140 DEG C, the second temperature is in the range of 830-880 DEG C, the first holding time is in the range of 2-10 min, and the second holding time is in the range of 10-35 min.

[0035] If the precipitated phase size is less than 150 nm, the post-heat treatment process parameters are determined as follows: the first temperature is in the range of 1120-1150 DEG C, the second temperature is in the range of 850-890 DEG C, the first holding time is in the range of 2-10 min, and the second holding time is in the range of 10-35 min.

[0036] The present application also provides a system for prolonging the service life of a single-crystal nickel-based alloy device, which comprises:

[0037] An electrochemical polishing treatment module is configured to perform electrochemical polishing treatment on a device to be treated.

[0038] A first characterization module is configured to characterize the device to be treated after electrochemical polishing treatment to obtain a first geometrically necessary dislocation density distribution.

[0039] A pre-heat treatment process parameter determination module is configured to determine pre-heat treatment process parameters according to the first geometrically necessary dislocation density distribution.

[0040] a pre-heat treatment module configured to pre-heat treat the device to be treated according to the pre-heat treatment process parameters;

[0041] a second characterization module configured to characterize the device to be treated after the pre-heat treatment to obtain a second geometrically necessary dislocation density distribution;

[0042] a solution heat treatment process parameter determination module configured to determine solution heat treatment process parameters based on the second geometrically necessary dislocation density distribution;

[0043] a solution heat treatment module configured to solution heat treat the device to be treated according to the solution heat treatment process parameters;

[0044] a third characterization module configured to characterize the device to be treated after the solution heat treatment to obtain a precipitate specification;

[0045] a post-heat treatment process parameter determination module configured to determine post-heat treatment process parameters according to the precipitate specification;

[0046] a post-heat treatment module configured to post-heat treat the device to be treated according to the post-heat treatment process parameters.

[0047] The application also provides an electronic device, comprising:

[0048] one or more processors;

[0049] a memory configured to store one or more programs, which, when executed by the one or more processors, cause the electronic device to implement the method for prolonging the service life of a single-crystal nickel-based alloy device as described above.

[0050] The application also provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor of a computer, causes the computer to perform the method for prolonging the service life of a single-crystal nickel-based alloy device as described above.

[0051] The application has the following beneficial effects:

[0052] In the present application, the device to be treated is subjected to electrochemical polishing treatment, the device to be treated subjected to electrochemical polishing treatment is characterized to obtain a first geometric necessary dislocation density distribution, the preheating process parameters are determined according to the first geometric necessary dislocation density, the device to be treated is subjected to preheating treatment according to the preheating process parameters, the device to be treated subjected to preheating treatment is characterized to obtain a second geometric necessary dislocation density distribution, the solution heat treatment process parameters are determined based on the second geometric necessary dislocation density, the device to be treated is subjected to solution heat treatment according to the solution heat treatment process parameters, the device to be treated subjected to solution heat treatment is characterized to obtain a precipitated phase specification, the post-heat treatment process parameters are determined according to the precipitated phase specification, and the device to be treated is subjected to post-heat treatment according to the post-heat treatment process parameters. Through the multi-stage heat treatment of the single-crystal nickel-based alloy device, the harmful residual tensile stress introduced by fatigue deformation is released, the density of deformation defects is reduced, and the high-temperature fatigue level of the single-crystal nickel-based alloy is improved, thereby achieving the purpose of prolonging the service life of the single-crystal nickel-based alloy device. BRIEF DESCRIPTION OF DRAWINGS

[0053] The accompanying drawings, which are incorporated into and form a part of the specification, illustrate one embodiment consistent with the present application and, together with the description, serve to explain the principles of the application. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained from these drawings without creative labor for those skilled in the art.

[0054] In the drawings:

[0055] Figure 1 A flowchart of the method for prolonging the service life of a single-crystal nickel-based alloy device is shown for an exemplary embodiment of the present application.

[0056] Figure 2 For Figure 1 A flowchart of determining the preheating process parameters according to the first geometric necessary dislocation density distribution in the embodiment shown is shown in an exemplary embodiment.

[0057] Figure 3 For Figure 2 A flowchart of determining the preheating process parameters according to the maximum value of the first geometric necessary dislocation density in the embodiment shown is shown in an exemplary embodiment.

[0058] Figure 4 For Figure 1 A flowchart of determining the solution heat treatment process parameters based on the second geometric necessary dislocation density distribution in the embodiment shown is shown in an exemplary embodiment.

[0059] Figure 5 For Figure 4Flow chart for determining solution heat treatment process parameters in an exemplary embodiment according to the maximum dislocation density necessary for the second geometry in the illustrated embodiment;

[0060] Figure 6 For Figure 1 Flow chart for determining post-heat treatment process parameters in an exemplary embodiment according to the precipitate specification in the illustrated embodiment;

[0061] Figure 7 For Figure 1 Flow chart for determining post-heat treatment process parameters in another exemplary embodiment according to the precipitate specification in the illustrated embodiment.

[0062] Figure 8 Figure for the characterization results of the first geometrically necessary dislocation density of a single crystal nickel-based alloy turbine blade subjected to electrochemical polishing in a specific embodiment, a is a two-dimensional distribution map of the first geometrically necessary dislocation density, and b is a frequency distribution map of the first geometrically necessary dislocation density;

[0063] Figure 9 Figure for the characterization results of the second geometrically necessary dislocation density of a single crystal nickel-based alloy turbine blade subjected to pre-heat treatment in a specific embodiment, a is a two-dimensional distribution map of the second geometrically necessary dislocation density, and b is a frequency distribution map of the second geometrically necessary dislocation density;

[0064] Figure 10 Figure for the characterization results of the third geometrically necessary dislocation density of a single crystal nickel-based alloy turbine blade subjected to solution heat treatment in a specific embodiment, a is a two-dimensional distribution map of the third geometrically necessary dislocation density, and b is a frequency distribution map of the third geometrically necessary dislocation density;

[0065] Figure 11 Figure for the characterization results of the precipitate specification of a single crystal nickel-based alloy turbine blade subjected to solution heat treatment in a specific embodiment;

[0066] Figure 12 Figure for the characterization results of the precipitate specification of a single crystal nickel-based alloy turbine blade subjected to post-heat treatment in a specific embodiment;

[0067] Figure 13 Figure for the high-temperature fatigue life test results of a single crystal nickel-based alloy turbine blade before and after treatment;

[0068] Figure 14 Figure for the characterization results of the second geometrically necessary dislocation density of a single crystal nickel-based alloy turbine blade subjected to pre-heat treatment in another specific embodiment;

[0069] Figure 15 Figure for the characterization results of the second geometrically necessary dislocation density of a single crystal nickel-based alloy turbine blade subjected to pre-heat treatment in another specific embodiment;

[0070] Figure 16 FIG. 6 is a graph showing the characterization results of precipitate size specifications for a post-heat treated single crystal nickel-base alloy turbine vane of another specific embodiment;

[0071] Figure 17 FIG. 6 is a graph showing the characterization results of precipitate size specifications for a post-heat treated single crystal nickel-base alloy turbine vane of another specific embodiment;

[0072] Figure 18 FIG. 6 is a graph showing the characterization results of precipitate size specifications for a post-heat treated single crystal nickel-base alloy turbine vane of another specific embodiment;

[0073] Figure 19 FIG. 6 is a graph showing the characterization results of precipitate size specifications for a post-heat treated single crystal nickel-base alloy turbine vane of another specific embodiment;

[0074] Figure 20 FIG. 6 is a graph showing the characterization results of precipitate size specifications for a post-heat treated single crystal nickel-base alloy turbine vane of another specific embodiment;

[0075] Figure 21 FIG. 6 is a graph showing the characterization results of precipitate size specifications for a post-heat treated single crystal nickel-base alloy turbine vane of another specific embodiment; DETAILED DESCRIPTION

[0076] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative work fall within the protection scope of the present application.

[0077] The present application provides a method for prolonging the service life of a single crystal nickel-base alloy device, such as a turbine vane.

[0078] Please refer to Figure 1 In an example embodiment of the present application, the method for prolonging the service life of a single crystal nickel-base alloy device includes steps S1001 to S1010, which are described in detail as follows.

[0079] Step S1001. Perform electrochemical polishing treatment on the device to be treated.

[0080] It should be noted that in the present application, the device to be treated refers to a device made of a single crystal nickel-base alloy.

[0081] Exemplarily, the ethanol solution with a volume concentration of 8wt%-12wt% of perchloric acid is used for electrochemical polishing treatment of the device to be treated; the voltage of the electrochemical polishing treatment is 20-30V, and the time length of the electrochemical polishing treatment is 10min-60min; the device to be treated is observed under a scanning electron microscope after the electrochemical polishing treatment, and no scratches are found on the surface;

[0082] Step S1002. Characterizing the device to be treated after the electrochemical polishing treatment to obtain a first geometrically necessary dislocation density distribution;

[0083] Exemplarily, the electron backscatter diffraction technology can be used to characterize the device to be treated after the electrochemical polishing treatment;

[0084] Step S1003. Determining the preheating treatment process parameters according to the first geometrically necessary dislocation density distribution;

[0085] Step S1004. Preheating the device to be treated according to the preheating treatment process parameters;

[0086] Step S1005. Characterizing the device to be treated after the preheating treatment to obtain a second geometrically necessary dislocation density distribution;

[0087] Exemplarily, the electron backscatter diffraction technology can be used to characterize the device to be treated after the preheating treatment;

[0088] Step S1006. Determining the solution heat treatment process parameters based on the second geometrically necessary dislocation density distribution;

[0089] Step S1007. Solution heat treating the device to be treated according to the solution heat treatment process parameters;

[0090] Step S1008. Characterizing the device to be treated after the solution heat treatment to obtain a precipitated phase specification;

[0091] Exemplarily, the scanning electron microscope can be used to characterize the device to be treated after the solution heat treatment;

[0092] Step S1009. Determining the post-heat treatment process parameters according to the precipitated phase specification;

[0093] Step S1010. Post-heat treating the device to be treated according to the post-heat treatment process parameters.

[0094] In the present application, the post-heat treatment process parameters are determined according to the precipitated phase specification, and the device to be treated is post-heat treated according to the post-heat treatment process parameters, which can optimize the microstructure of the single-crystal nickel-based alloy, optimize the size and morphology of the precipitated phase, improve the high-temperature fatigue resistance of the single-crystal nickel-based alloy, and prolong the service life of the single-crystal nickel-based alloy device.

[0095] Single crystal nickel-based alloy is a kind of engine blade material developed on the basis of equiaxed crystal and directional columnar crystal high-temperature alloy. Single crystal nickel-based alloy refers to a metal material prepared by adding titanium, chromium and other strengthening elements on the basis of nickel (content greater than 50wt%). Single crystal nickel-based alloy has a unique structure without grain boundaries, excellent high-temperature resistance and corrosion resistance. After the inventors analyze the related technology, it is found that in the actual service process, the high-pressure turbine blade of the aero-engine will inevitably face complex working conditions such as high-temperature environment and alternating load, the microstructure of the single crystal nickel-based alloy will gradually age, the high-temperature fatigue resistance will decrease, and the risk of fracture failure will be extremely possible. Therefore, the inventors consider that by electrochemical polishing treatment on the to-be-processed device, the to-be-processed device subjected to electrochemical polishing treatment is characterized to obtain a first geometric necessary dislocation density distribution, the preheating treatment process parameters are determined according to the first geometric necessary dislocation density distribution, the to-be-processed device is preheated according to the preheating treatment process parameters, the to-be-processed device subjected to preheating treatment is characterized to obtain a second geometric necessary dislocation density distribution, the solid solution heat treatment process parameters are determined based on the second geometric necessary dislocation density distribution, the to-be-processed device is subjected to solid solution heat treatment according to the solid solution heat treatment process parameters, the to-be-processed device subjected to solid solution heat treatment is characterized to obtain a precipitated phase specification, and the post-heat treatment process parameters are determined according to the precipitated phase specification. The to-be-processed device is subjected to post-heat treatment according to the post-heat treatment process parameters, that is, the single crystal nickel-based alloy device is subjected to multi-stage heat treatment in the present application, the harmful residual tensile stress introduced by fatigue deformation is released, the density of deformation defects is reduced, and the high-temperature fatigue resistance of the single crystal nickel-based alloy is improved, so as to achieve the purpose of prolonging the service life of the single crystal nickel-based alloy device. Specifically, firstly, the preheating treatment process releases the elastic stored energy of the plastic deformation defects introduced by high-temperature service deformation in the single crystal nickel-based alloy, and avoids the recrystallization caused by direct solid solution heat treatment; secondly, the geometric necessary dislocations that are not completely released by the preheating treatment can be basically completely removed by the short-time holding treatment in the solid solution heat treatment process; finally, the microstructure of the single crystal nickel-based alloy is regulated and controlled through the post-heat treatment process, the size and morphology of the precipitated phase are optimized, and the high-temperature fatigue resistance of the single crystal nickel-based alloy is improved, so as to prolong the service life of the single crystal nickel-based alloy device. Compared with directly replacing the single crystal nickel-based alloy device, the multi-stage heat treatment can significantly reduce the economic cost. At the same time, simple solid solution heat treatment will damage the grain boundary organization characteristics of the single crystal nickel-based alloy, and the preheating treatment and post-heat treatment of the present application can avoid the formation of recrystallization. At the same time, by regulating the microstructure of the single crystal nickel-based alloy, the service life of the single crystal nickel-based alloy device can be prolonged.

[0096] Please refer to Figure 2 , Figure 2 for Figure 1The first geometrically necessary dislocation density distribution is used to determine the pre-heat treatment process parameters in the embodiment shown. A flow chart of the pre-heat treatment process parameters in an exemplary embodiment is shown.

[0097] As shown in the embodiment shown, in an exemplary embodiment of the present application, Figure 2 As shown in the embodiment shown, in an exemplary embodiment of the present application, Figure 1 The process of determining the pre-heat treatment process parameters according to the first geometrically necessary dislocation density distribution in the embodiment shown includes steps S2001 to S2002, which are described in detail as follows:

[0098] Step S2001. Determine the maximum value of the first geometrically necessary dislocation density based on the first geometrically necessary dislocation density distribution.

[0099] Exemplarily, the maximum value of the first geometrically necessary dislocation density can be obtained according to the first geometrically necessary dislocation density distribution.

[0100] Step S2002. Determine the pre-heat treatment process parameters according to the maximum value of the first geometrically necessary dislocation density.

[0101] In the present application, the pre-heat treatment process parameters are determined according to the maximum value of the first geometrically necessary dislocation density, and the pre-heat treatment is performed on the device to be treated according to the pre-heat treatment process parameters, which can reduce the geometrically necessary dislocation density of the single crystal nickel-based alloy, reduce the risk of stress concentration, and thus delay the initiation and propagation of cracks, thereby prolonging the service life of the device to be treated.

[0102] Referring to Figure 3 , Figure 3 As shown in the embodiment shown, in an exemplary embodiment of the present application, Figure 2 A flow chart of the pre-heat treatment process parameters in an exemplary embodiment is shown, which includes the initial temperature, the temperature rise amplitude each time, the holding time at each temperature, the temperature rise rate between adjacent temperatures, the total heat treatment time, and the final temperature. In other words, in the present application, the pre-heat treatment is specifically: gradient heat treatment is performed on the device to be treated in the temperature range from the initial temperature (T1) to the final temperature (T2), the temperature rise amplitude (ΔT) each time is the temperature rise amplitude each time, the temperature rise rate (v) between adjacent temperatures is the temperature rise rate between adjacent temperatures, and the holding time (t1) at each corresponding temperature is the holding time at each temperature.

[0103] As shown in the embodiment shown, in an exemplary embodiment of the present application, Figure 3 As shown in the embodiment shown, in an exemplary embodiment of the present application, Figure 2 The process of determining the pre-heat treatment process parameters according to the maximum value of the first geometrically necessary dislocation density distribution in the embodiment shown includes steps S3001 to S3003, which are described in detail as follows:

[0104] Step S3001. If the maximum value of the first geometrically necessary dislocation density is greater than 300*1012 m -2 The preheating treatment process parameters are determined as follows: the initial temperature is in the range of 1000-1100 °C, the temperature increasing range of each time is in the range of 10-20 °C, the holding time at each temperature is in the range of 10-120 min, the temperature increasing rate between adjacent temperatures is less than 5 °C / min, the total heat treatment time is in the range of 60-180 min, and the final temperature is in the range of 1280-1300 °C.

[0105] Step S3002. If the first geometrically necessary dislocation density maximum value is in the range of 150*10 12 m -2 -300*10 12 m -2 The preheating treatment process parameters are determined as follows: the initial temperature is in the range of 1050-1150 °C, the temperature increasing range of each time is in the range of 10-50 °C, the holding time at each temperature is in the range of 10-120 min, the temperature increasing rate between adjacent temperatures is less than 10 °C / min, the total heat treatment time is in the range of 60-180 min, and the final temperature is in the range of 1270-1300 °C.

[0106] Step S3003. If the first geometrically necessary dislocation density maximum value is less than 150*10 12 m -2 The preheating treatment process parameters are determined as follows: the initial temperature is in the range of 1000-1100 °C, the temperature increasing range of each time is in the range of 10-100 °C, the holding time at each temperature is in the range of 10-120 min, the temperature increasing rate between adjacent temperatures is less than 20 °C / min, the total heat treatment time is in the range of 60-180 min, and the final temperature is in the range of 1260-1300 °C.

[0107] Exemplarily, the corresponding parameters can be determined according to the preset mapping relationship between the first geometrically necessary dislocation density maximum value and the initial temperature, the temperature increasing rate between adjacent temperatures, and the final temperature in the above corresponding numerical ranges. The preset mapping relationship between the first geometrically necessary dislocation density maximum value and the initial temperature is negative correlation, the preset mapping relationship between the first geometrically necessary dislocation density maximum value and the temperature increasing rate between adjacent temperatures is negative correlation, and the preset mapping relationship between the first geometrically necessary dislocation density maximum value and the final temperature is positive correlation. In other words, the greater the first geometrically necessary dislocation density maximum value, the lower the initial temperature, the lower the temperature increasing rate between adjacent temperatures, and the higher the final temperature.

[0108] Please refer to Figure 4 , Figure 4 for Figure 1 the flow chart of determining the solid solution heat treatment process parameters based on the second geometrically necessary dislocation density distribution in an exemplary embodiment.

[0109] AsFigure 4 As shown in an exemplary embodiment of this application, Figure 1 The process of determining solution heat treatment parameters based on the second geometrically necessary dislocation density distribution in the illustrated embodiment includes steps S4001 to S4002, which are described in detail below:

[0110] Step S4001. Based on the second geometrically necessary dislocation density distribution, determine the maximum value of the second geometrically necessary dislocation density;

[0111] For example, the maximum value of the first geometrically necessary dislocation density can be obtained based on the distribution of the first geometrically necessary dislocation density;

[0112] Step S4002. Determine the solution heat treatment process parameters based on the maximum value of the second geometrically necessary dislocation density.

[0113] In this application, the solution heat treatment process parameters are determined based on the maximum value of the second geometrically necessary dislocation density, and the device to be treated is subjected to solution heat treatment according to the solution heat treatment process parameters. This can eliminate the geometrically necessary dislocations of the single-crystal nickel-based alloy, restore the deformed structure of the single-crystal nickel-based alloy, reduce the fatigue deformation rate of the single-crystal nickel-based alloy, and extend the service life of the device to be treated.

[0114] Please see Figure 5 , Figure 5 for Figure 4 The flowchart shown in the embodiment, which determines the solution heat treatment process parameters based on the maximum value of the second geometrically necessary dislocation density, is an exemplary embodiment. The solution heat treatment process parameters include the solution heat treatment temperature and the solution heat treatment duration. In other words, in this application, the solution heat treatment process specifically involves holding the device to be treated at the solution heat treatment temperature (T3) for a certain duration (t3).

[0115] like Figure 5 As shown in an exemplary embodiment of this application, Figure 4 The process of determining the solution heat treatment parameters based on the maximum value of the second geometrically necessary dislocation density in the embodiment shown includes steps S5001 to S5003, which are described in detail below:

[0116] Step S5001. If the maximum value of the second geometrically necessary dislocation density is greater than 150*10 12 m -2 The solution heat treatment process parameters are determined as follows: the solution heat treatment temperature is in the range of 1300-1350℃, and the solution heat treatment duration is in the range of 10-60min.

[0117] Step S5002. If the maximum value of the second geometrically necessary dislocation density is 50*10 12 m -2 -150*1012 m -2 Within the specified range, the solution heat treatment process parameters are determined as follows: the solution heat treatment temperature is in the range of 1270-1320℃, and the solution heat treatment duration is in the range of 10-60min.

[0118] Step S5003. If the maximum value of the second geometrically necessary dislocation density is less than 50*10 12 m -2 The solution heat treatment process parameters are determined as follows: the solution heat treatment temperature is in the range of 1250-1300℃, and the solution heat treatment duration is in the range of 10-60min.

[0119] For example, the temperature of the solution heat treatment can be determined within the aforementioned numerical range according to a preset mapping relationship between the maximum value of the second geometrically necessary dislocation density and the temperature of the solution heat treatment. This preset mapping relationship is positively correlated. In other words, the larger the maximum value of the second geometrically necessary dislocation density, the higher the temperature of the solution heat treatment.

[0120] Please see Figure 6 , Figure 6 for Figure 1 The flowchart shown in the embodiment illustrates the determination of post-heat treatment process parameters based on the precipitated phase specifications in an exemplary embodiment. In this application, the post-heat treatment process parameters include a first temperature (T4), a second temperature (T5), a first holding time (t4) at the first temperature, and a second holding time (t5) at the second temperature, wherein the first temperature is greater than the second temperature. In other words, in this application, the post-heat treatment process specifically involves: first holding the product at the first temperature (T4) for a certain time (t4), and then holding it at the first temperature (T5) for a certain time (t5).

[0121] like Figure 6 As shown in an exemplary embodiment of this application, Figure 1 The process of determining the post-heat treatment parameters based on the precipitate specifications in the illustrated embodiment includes step S6001, which is described in detail below:

[0122] Step S6001. If the precipitated phase size is greater than 250nm, the post-heat treatment process parameters are determined as follows: the first temperature is in the range of 1100-1130℃, the second temperature is in the range of 800-850℃, the first holding time is in the range of 2-10min, and the second holding time is in the range of 10-35min.

[0123] Please see Figure 7 , Figure 7 for Figure 1 The flowchart in another exemplary embodiment shows how the heat treatment process parameters are determined based on the precipitated phase specifications.

[0124] As shown in the figure, in another exemplary embodiment of the present application, Figure 7 the process of determining the post-heat treatment process parameters according to the precipitated phase specification in the embodiment shown further includes steps S7002 to S7003, which are described in detail as follows: Figure 1 Step S7001. If the precipitated phase specification is greater than 250 nm, the post-heat treatment process parameters are determined as follows: the first temperature is in the range of 1100-1130℃, the second temperature is in the range of 800-850℃, the first holding time is in the range of 2-10min, and the second holding time is in the range of 10-35min;

[0125] Step S7002. If the precipitated phase specification is in the range of 150-250nm, the post-heat treatment process parameters are determined as follows: the first temperature is in the range of 1100-1140℃, the second temperature is in the range of 830-880℃, the first holding time is in the range of 2-10min, and the second holding time is in the range of 10-35min;

[0126] Step S7003. If the precipitated phase specification is less than 150nm, the post-heat treatment process parameters are determined as follows: the first temperature is in the range of 1120-1150℃, the second temperature is in the range of 850-890℃, the first holding time is in the range of 2-10min, and the second holding time is in the range of 10-35min.

[0127] Exemplarily, the corresponding parameters can be determined within the above corresponding numerical ranges according to a preset mapping relationship between the precipitated phase specification and the first temperature, the second temperature, the first holding time, and the second holding time. The preset mapping relationship between the precipitated phase specification and the first temperature is a negative correlation, the preset mapping relationship between the precipitated phase specification and the second temperature is a negative correlation, the preset mapping relationship between the precipitated phase specification and the first holding time is a negative correlation, and the preset mapping relationship between the precipitated phase specification and the second holding time is a negative correlation. In other words, the smaller the precipitated phase specification, the higher the first temperature, the longer the first holding time, the higher the second temperature, and the longer the second holding time.

[0128] In a specific embodiment (hereinafter referred to as embodiment 1), the method for prolonging the service life of a single-crystal nickel-based alloy turbine blade includes the following specific steps:

[0129] The single-crystal nickel-based alloy (DD6) turbine blade is treated by an electrochemical polishing method. Specifically, an ethanol solution with a volume concentration of 10wt% of perchloric acid is used as an electrolyte, the single-crystal nickel-based alloy turbine blade is used as an anode, a direct current voltage of 25V is applied, and the surface is observed under a scanning electron microscope for 20min without scratches;

[0130]

[0131] ​The single crystal nickel-based alloy turbine blade treated by electrochemical polishing is characterized by using electron backscatter diffraction technology, and a first geometric necessary dislocation density distribution map is obtained. Specifically, the cell parameters (a=b=c=0.353 nm, α=β=γ=90°) of the metal nickel are used to calibrate the Kikuchi pattern of the sample, and a two-dimensional distribution map of the first geometric necessary dislocation density is obtained by analysis, as shown in Figure 8 a. As shown in Figure 8 a, the first geometric necessary dislocation density of the most severely deformed region is ≥150*10 12 m -2 , and the maximum value of the first geometric necessary dislocation density is 170*10 12 m -2 ; the distribution frequency of the first geometric dislocation density is counted, and the result is shown in Figure 8 b. As shown in Figure 8 b, most of the first geometric dislocation density is distributed near the value of 50*10 12 m -2 , and the average value of the first geometric necessary dislocation density is 61.3*10 12 m -2 ;

[0132] According to the first geometric necessary dislocation density, the preheating process parameters are determined, specifically;

[0133] If the maximum value of the first geometric necessary dislocation density is greater than 300*10 12 m -2 , the preheating process parameters are determined as follows: the initial temperature (T1) is in the range of 1000-1100°C, the temperature rise amplitude (ΔT) is in the range of 10-20°C, the holding time (t1) at each temperature is in the range of 10-120 min, the temperature rise rate (v) between adjacent temperatures is less than 5°C / min, the total heat treatment time is in the range of 60-180 min, and the final temperature (T2) is in the range of 1280-1300°C;

[0134] If the maximum value of the first geometric necessary dislocation density is in the range of 150*10 12 m -2 -300*10 12 m -2 , the preheating process parameters are determined as follows: the initial temperature (T1) is in the range of 1050-1150°C, the temperature rise amplitude (ΔT) is in the range of 10-50°C, the holding time (t1) at each temperature is in the range of 10-120 min, the temperature rise rate (v) between adjacent temperatures is less than 10°C / min, the total heat treatment time is in the range of 60-180 min, and the final temperature (T2) is in the range of 1270-1300°C;

[0135] If the maximum value of the first geometrically necessary dislocation density is less than 150*10 12 m- 2 The preheating process parameters are determined as follows: initial temperature (T1) in the range of 1000-1100℃, temperature rise increment (ΔT) in the range of 10-100℃, holding time (t1) at each temperature in the range of 10-120min, heating rate (v) between adjacent temperatures less than 20℃ / min, total heat treatment time in the range of 60-180min and final temperature (T2) in the range of 1260-1300℃;

[0136] According to the preheating process parameters, the single-crystal nickel-based alloy turbine blades are preheated. Specifically, the single-crystal nickel-based alloy turbine blades are subjected to gradient heat treatment within the temperature range of [1100℃, 1280℃], with each temperature increase being 30℃. That is, the heat treatment temperatures are 1100℃, 1130℃, 1160℃, 1190℃, 1220℃, 1250℃ and 1280℃, respectively. The holding time at each temperature is 10min, the heating rate between adjacent temperatures is 6℃ / min, and the total heat treatment time (i.e. 10*7+30 / 6*6=100) is 100min.

[0137] Electron backscattering diffraction was used to characterize the preheated single-crystal nickel-based alloy turbine blades, with the same parameters as above, to obtain the second geometrically necessary dislocation density distribution map. The results are as follows. Figure 9 As shown in Figure a, the maximum geometrically required dislocation density of single-crystal nickel-based alloy turbine blades is reduced by 100*10. 12 m -2 Based on the two-dimensional distribution diagram of the second geometrically necessary dislocation density, the maximum value of the second geometric dislocation density distribution can be obtained, which is 100*10. 12 m -2 The distribution frequencies of the second geometrically necessary dislocation density were statistically analyzed, and the results are as follows: Figure 9 As shown in b. (As shown in...) Figure 9 As shown in b, most of the second geometric dislocation densities are distributed in (0, 50*10). 12 m -2 Within this range, through further calculation of the average value, the average value of the second geometrically necessary dislocation density is 35.4 * 10. 12 m -2 .

[0138] The solution heat treatment process parameters are determined based on the maximum value of the second geometrically necessary dislocation density. Specifically:

[0139] If the maximum value of the second geometrically required dislocation density is greater than 150*10 12 m -2The solution heat treatment process parameters are determined as follows: the solution heat treatment temperature is in the range of 1300-1350℃, and the solution heat treatment duration is in the range of 10-60min.

[0140] If the maximum value of the second geometrically required dislocation density is 50*10 12 m -2 -150*10 12 m -2 Within the specified range, the solution heat treatment process parameters are determined as follows: the solution heat treatment temperature is in the range of 1270-1320℃, and the solution heat treatment duration is in the range of 10-60min.

[0141] If the maximum value of the second geometrically required dislocation density is less than 50*10 12 m -2 The solution heat treatment process parameters are determined as follows: the solution heat treatment temperature is in the range of 1250-1300℃, and the solution heat treatment duration is in the range of 10-60min.

[0142] According to the solution heat treatment process parameters, the single crystal nickel-based alloy turbine blades were subjected to solution heat treatment. Specifically, the single crystal nickel-based alloy turbine blades were held at 1300℃ for 30 minutes.

[0143] Electron backscattering diffraction was used to characterize the solution-heat-treated single-crystal nickel-based alloy turbine blades, with the same parameters as above, to obtain the third geometrically necessary dislocation density distribution map. The results are as follows. Figure 10 As shown in a, the maximum value of the third geometrically necessary dislocation density is reduced to ≤50*10 12 m -2 The distribution frequencies of the third geometrically necessary dislocation density were statistically analyzed, and the results are as follows: Figure 10 As shown in b. (As shown in...) Figure 10 As shown in b, most of the third geometric dislocation densities are distributed in (0, 25*10). 12 m -2 Within the given interval, the average value calculated shows that the average density of the third geometrically necessary dislocation is 13.1 * 10^6. 12 m -2 .

[0144] The single-crystal nickel-based alloy turbine blades subjected to solution heat treatment were characterized using scanning electron microscopy, and the results are as follows: Figure 11 As shown. Figure 11 As shown, the precipitate size (i.e., dimension) of the single-crystal nickel-based alloy turbine blade after solution heat treatment is 200 nm.

[0145] Based on the precipitated phase specifications, determine the subsequent heat treatment process parameters, specifically:

[0146] If the size of the precipitated phase is greater than 250 nm, the post-heat treatment process parameters are determined as follows: the first temperature is in the range of 1100-1130℃, the second temperature is in the range of 800-850℃, the first holding time is in the range of 2-10 min, and the second holding time is in the range of 10-35 min;

[0147] If the size of the precipitated phase is in the range of 150-250 nm, the post-heat treatment process parameters are determined as follows: the first temperature is in the range of 1100-1140℃, the second temperature is in the range of 830-880℃, the first holding time is in the range of 2-10 min, and the second holding time is in the range of 10-35 min;

[0148] If the size of the precipitated phase is less than 150 nm, the post-heat treatment process parameters are determined as follows: the first temperature is in the range of 1120-1150℃, the second temperature is in the range of 850-890℃, the first holding time is in the range of 2-10 min, and the second holding time is in the range of 10-35 min.

[0149] According to the post-heat treatment process parameters, the single-crystal nickel-based alloy turbine blade is subjected to post-heat treatment, specifically, first holding treatment at 1120℃ for 4 h, and then holding treatment at 870℃ for 12 h.

[0150] The single-crystal nickel-based alloy turbine blade subjected to post-heat treatment is characterized by a scanning electron microscope, and the results are shown in Figure 12 As shown in Figure 12 , after post-heat treatment, the size of the precipitated phase of the single-crystal nickel-based alloy turbine blade grows to 500 nm.

[0151] According to the "HB 5153-1996 Metal High Temperature Rotating Bending Fatigue Test Method", the high temperature fatigue life of the single-crystal nickel-based alloy turbine blade after electrochemical polishing treatment and before pre-heat treatment (i.e. without heat treatment) and the single-crystal nickel-based alloy turbine blade subjected to post-heat treatment is tested, and the results are shown in Figure 13 As shown in Figure 13 , compared with before treatment (i.e. without heat treatment), after treatment by the method of the present application (i.e. multi-stage heat treatment for life extension), the high temperature fatigue life of the single-crystal nickel-based alloy turbine blade is improved by 15%. The results show that the method of the present application can significantly prolong the service life of the single-crystal nickel-based alloy device.

[0152] In another specific embodiment (hereinafter named Comparative Example 1), the process parameters of the pre-heating treatment are: gradient heat treatment is performed on the single-crystal nickel-based alloy turbine blade in the temperature range of [1100℃, 1190℃], with an increase of 30℃ for each temperature, i.e. the heat treatment temperatures are 1100℃, 1130℃, 1160℃ and 1190℃, respectively, the holding time at each temperature is 10 min, the heating rate between adjacent temperatures is 6℃ / min, and the total heat treatment time (i.e. 10*4+30 / 6*3=55) is 55 min. That is, the difference between the present comparative example and Example 1 is that the final temperature and the total heat treatment time are different.

[0153] The single-crystal nickel-based alloy turbine blade subjected to the pre-heating treatment is characterized by electron backscatter diffraction technology, with the same parameters as above, to obtain the first geometric necessary dislocation density distribution diagram of the single-crystal nickel-based alloy turbine blade, as shown in Figure 14 a. As shown in Figure 14 a, the maximum value of the second geometric necessary dislocation density is 150*10 12 m -2 ; the distribution frequency of the second geometric necessary dislocation density is counted, and the result is shown in Figure 14 . As shown in Figure 14 b, most of the second geometric dislocation density is distributed in the interval (0, 50*10 12 m -2 ), and by further calculating the average value, the average value of the second geometric necessary dislocation density is 50.6*10 12 m -2 . The result shows that the release of dislocations is very limited by using the parameters of the present comparative example for pre-heating treatment, and there are still a large number of residual dislocations distributed in the single-crystal nickel-based alloy. If subsequent solid solution heat treatment is performed, recrystallization will be inevitably induced, thereby damaging the single-crystallinity of the single-crystal nickel-based alloy and being not conducive to prolonging the service life of the single-crystal nickel-based alloy device.

[0154] In another specific embodiment (hereinafter named Comparative Example 2), the process parameters of the pre-heating treatment are: gradient heat treatment is performed on the single-crystal nickel-based alloy turbine blade in the temperature range of [1220℃, 1280℃], with an increase of 30℃ for each temperature, i.e. the heat treatment temperatures are 1220℃, 1250℃ and 1280℃, respectively, the holding time at each temperature is 10 min, the heating rate between adjacent temperatures is 6℃ / min, and the total heat treatment time (i.e. 10*3+30 / 6*2=40) is 40 min. That is, the difference between the present comparative example and Example 1 is that the initial temperature and the total heat treatment time are different.

[0155] The single-crystal nickel-based alloy turbine blade subjected to the pre-heating treatment is characterized by electron backscatter diffraction technology to obtain the two-dimensional crystal orientation distribution diagram, as shown in Figure 15 . As shown in Figure 15It can be seen that the single crystal nickel-based alloy turbine blade has obvious recrystallization, and the single crystal of the nickel-based alloy is destroyed. The results show that if the preheating treatment is directly carried out at high temperature, the recrystallization will be promoted, and the service life of the single crystal nickel-based alloy device will not be prolonged.

[0156] In another specific embodiment (hereinafter referred to as Comparative Example 3), the process parameters of the solid solution heat treatment are: the single crystal nickel-based alloy turbine blade is treated at a temperature of 1250℃ for 30min, that is, the difference between the present comparative example and Example 1 is that the temperature (1250℃) of the solid solution heat treatment is lower than that of Example 1 (1300℃).

[0157] The single crystal nickel-based alloy turbine blade subjected to the solid solution heat treatment is characterized by a scanning electron microscope, and the results are shown in Figure 16 As shown in Figure 16 , only part of the precipitated phase is dissolved, and the solid solution is not complete, which is not conducive to the recovery of the performance of the single crystal nickel-based alloy.

[0158] In another specific embodiment (hereinafter referred to as Comparative Example 4), the process parameters of the solid solution heat treatment are: the single crystal nickel-based alloy turbine blade is treated at a temperature of 1350℃ for 30min, that is, the difference between the present comparative example and Example 1 is that the temperature (1350℃) of the solid solution heat treatment is higher than that of Example 1 (1300℃).

[0159] The single crystal nickel-based alloy turbine blade subjected to the solid solution heat treatment is characterized by a scanning electron microscope, and the results are shown in Figure 17 As shown in Figure 17 , the size of the precipitated phase of the single crystal nickel-based alloy after the solid solution heat treatment is about 100nm. The results show that if the temperature of the solid solution heat treatment is too high, the size of the precipitated phase will be too small, which is not conducive to the improvement of the comprehensive performance of the single crystal, and will increase the time and temperature of the subsequent heat treatment, and increase the processing cost.

[0160] In another specific embodiment (hereinafter referred to as Comparative Example 5), the process parameters of the subsequent heat treatment are: first treated at a temperature of 1000℃ for 2h, and then treated at a temperature of 800℃ for 10h, that is, the difference between the present comparative example and Example 1 is that in the subsequent heat treatment process, the first temperature (1000℃) and the second temperature (800℃) are lower than those of Example 1 (the first temperature is 1120℃, and the second temperature is 870℃), and the first holding time (2h) and the second holding time (10h) are lower than those of Example 1 (the first holding time is 4h, and the second holding time is 12h).

[0161] The single crystal nickel-based alloy turbine blade subjected to the solid solution heat treatment is characterized by a scanning electron microscope, and the results are shown in Figure 18 As shown in Figure 18As shown, the precipitated phase grows slightly, exhibiting a cubic morphology with a size between 200-300 nm. The small size of the precipitated phase is detrimental to the improvement of the overall performance of the single crystal (e.g., creep resistance). This result indicates that excessively low post-heat treatment temperatures lead to less precipitated phase growth, which is detrimental to the improvement of the overall performance of the single crystal and the extension of its service life.

[0162] In another specific embodiment (hereinafter referred to as Comparative Example 6), the process parameters for the post-heat treatment are as follows: first, heat treatment at 1150°C for 10 hours, and then heat treatment at 1000°C for 35 hours. That is, the difference between this comparative example and Example 1 is that: during the post-heat treatment, the first temperature (1150°C) and the second temperature (1000°C) are higher than those in Example 1 (the first temperature is 1120°C and the second temperature is 870°C), and the first heat treatment duration (10 hours) and the second heat treatment duration (35 hours) are higher than those in Example 1 (the first heat treatment duration is 4 hours and the second heat treatment duration is 12 hours).

[0163] The single-crystal nickel-based alloy turbine blades subjected to solution heat treatment were characterized using scanning electron microscopy, and the results are as follows: Figure 19 As shown. Figure 19 As shown, after post-heat treatment, the precipitates in the single-crystal nickel-based alloy turbine blades merge and grow, with a very large overall size, even reaching 2-3 μm. The coarse precipitates reduce the grain boundary area's resistance to dislocation movement, thus shortening the service life of single-crystal nickel-based alloy devices.

[0164] Please see Figure 20 , Figure 20 A block diagram illustrating a system for extending the lifespan of a single-crystal nickel-based alloy device, as shown in an exemplary embodiment of this application.

[0165] like Figure 20 As shown, in an exemplary embodiment of the present invention, the system M2000 for extending the service life of a single-crystal nickel-based alloy device includes:

[0166] The electrochemical polishing module M2001 is used to perform electrochemical polishing on the device to be processed.

[0167] The first characterization module M2002 is used to characterize the device to be processed after electrochemical polishing to obtain the first geometrically necessary dislocation density distribution.

[0168] The preheating process parameter determination module M2003 is used to determine the preheating process parameters based on the first geometrically necessary dislocation density distribution.

[0169] The preheating module M2004 is used to preheat the device to be processed according to the preheating process parameters.

[0170] The second characterization module M2005 is configured to characterize the preheated device to be processed to obtain a second geometrically necessary dislocation density distribution.

[0171] The solution heat treatment process parameter determination module M2006 is configured to determine solution heat treatment process parameters based on the second geometrically necessary dislocation density distribution.

[0172] The solution heat treatment module M2007 is configured to perform solution heat treatment on the device to be processed according to the solution heat treatment process parameters.

[0173] The third characterization module M2008 is configured to characterize the device to be processed after the solution heat treatment to obtain a precipitate specification.

[0174] The post-heat treatment process parameter determination module M2009 is configured to determine post-heat treatment process parameters according to the precipitate specification.

[0175] The post-heat treatment module M2010 is configured to perform post-heat treatment on the device to be processed according to the post-heat treatment process parameters.

[0176] It should be noted that the system for prolonging the service life of a single-crystal nickel-based alloy device provided in the above embodiments and the method for prolonging the service life of a single-crystal nickel-based alloy device provided in the above embodiments belong to the same concept, and the specific manner in which each module and unit performs operations has been described in detail in the method embodiments, which will not be repeated here. The system for prolonging the service life of a single-crystal nickel-based alloy device provided in the above embodiments can allocate the above functions to different functional modules for completion in actual application, that is, the internal structure of the device is divided into different functional modules to complete all or part of the functions described above, and this is not limited herein.

[0177] Embodiments of the present application also provide an electronic device, comprising: one or more processors; a storage device configured to store one or more programs, which, when executed by the one or more processors, cause the electronic device to implement the method for prolonging the service life of a single-crystal nickel-based alloy device provided in each of the above embodiments.

[0178] Figure 21 The structure of a computer system of an electronic device suitable for implementing embodiments of the present application is shown. It should be noted that, Figure 21 The computer system 2100 of the electronic device shown is only an example and should not limit the functions and use range of embodiments of the present application.

[0179] As Figure 21As shown, the computer system 2100 includes a central processing unit (CPU) 2101 which can execute various appropriate actions and processes in accordance with a program stored in a read-only memory (ROM) 2102 or a program loaded from the storage section 2108 into a random access memory (RAM) 2103, such as the methods described in the above embodiments. Various programs and data required for the operation of the system are also stored in the RAM 2103. The CPU 2101, the ROM 2102, and the RAM 2103 are connected to each other through a bus 2104. An input / output (I / O) interface 2105 is also connected to the bus 2104.

[0180] Connected to the I / O interface 2105 are an input section 2106 including a keyboard, a mouse, etc.; an output section 2107 including a display such as a cathode ray tube (CRT), a liquid crystal display (LCD), etc., and a speaker, etc.; a storage section 2108 including a hard disk, etc.; and a communication section 2109 including a network interface card such as a LAN (Local Area Network) card, a modem, etc. The communication section 2109 performs communication processing via a network such as the Internet. A drive 2110 is also connected to the I / O interface 2105 as necessary. A removable recording medium 2111 such as a magnetic disk, an optical disk, a magneto-optical disk, a semiconductor memory, etc. is attached to the drive 2110 as necessary, so that a computer program read therefrom is installed into the storage section 2108 as necessary.

[0181] In particular, according to embodiments of the present application, the processes described above with reference to the flowcharts can be implemented as a computer software program. For example, embodiments of the present application include a computer program product comprising a computer program carried on a computer readable medium, the computer program containing a computer program for executing the methods shown in the flowcharts. In such embodiments, the computer program can be downloaded and installed from a network via the communication section 2109, and / or installed from the removable recording medium 2111. When the computer program is executed by the central processing unit (CPU) 2101, various functions defined in the system of the present application are executed.

[0182] It should be noted that the computer-readable medium in the embodiments of the present application can be a computer-readable signal medium or a computer-readable storage medium or any combination thereof. The computer-readable storage medium may, for example, be an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, device or apparatus, or any combination thereof. More specific examples of the computer-readable storage medium can include, but are not limited to, an electrical connection having one or more wires, a portable computer diskette, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM), a flash memory, an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination thereof. In this application, the computer-readable signal medium can include a data signal propagated in a baseband or as a carrier wave in a propagated data signal, in which the computer-readable computer program is carried. Such a propagated data signal can take on many forms, including but not limited to an electromagnetic signal, an optical signal, or any suitable combination thereof. The computer-readable signal medium can also be any computer-readable medium other than the computer-readable storage medium, which can send, propagate, or transmit the program for use by or in connection with an instruction execution system, apparatus, or device. The computer program contained on the computer-readable medium can be transmitted in any suitable medium, including but not limited to wireless, wired, or the like, or any suitable combination thereof.

[0183] The flowcharts and block diagrams in the drawings illustrate the possible architectures, functions, and operations of systems, methods, and computer program products according to various embodiments of the present application. Each block in the flowcharts or block diagrams can represent a module, a program segment, or a portion of code, which contains one or more executable instructions for implementing the specified logical functions. It should also be noted that in some alternative implementations, the functions noted in the blocks can occur in a different order than that shown in the figures. For example, two blocks noted in succession can actually be executed substantially concurrently, or they can sometimes be executed in reverse order, depending on the functionality involved. It should also be noted that each block in the flowcharts or block diagrams, and combinations of blocks in the flowcharts or block diagrams, can be implemented by special-purpose hardware-based systems, which perform the specified functions or operations, or can be implemented by a combination of special-purpose hardware and computer instructions.

[0184] The units described in the embodiments of the present application can be implemented in the form of software, or can be implemented in the form of hardware, and the described units can also be arranged in a processor. In some cases, the names of the units do not constitute a limitation on the units themselves.

[0185] Another aspect of the present application also provides a computer readable storage medium, which stores a computer program. When the computer program is executed by a processor of a computer, the computer performs the method for prolonging the service life of a single-crystal nickel-based alloy device as described above. The computer readable storage medium can be included in the electronic device described in the above embodiments, or can exist separately and not be assembled into the electronic device.

[0186] Another aspect of the present application also provides a computer program product or a computer program, which includes computer instructions stored in a computer readable storage medium. A processor of a computer device reads the computer instructions from the computer readable storage medium, and the processor executes the computer instructions, so that the computer device performs the method for prolonging the service life of a single-crystal nickel-based alloy device provided in each of the above embodiments.

[0187] The above embodiments only exemplarily illustrate the principles and effects of the present application, and are not used to limit the present application. Any person skilled in the art can modify or change the above embodiments without departing from the spirit and scope of the present application. Therefore, all equivalent modifications or changes completed by those skilled in the art without departing from the spirit and technical thought disclosed by the present application should be covered by the claims of the present application.

Claims

1. A method for extending the service life of single-crystal nickel-based alloy devices, characterized in that, Includes the following steps: Electrochemical polishing treatment is performed on the device to be processed; The device to be processed after electrochemical polishing was characterized to obtain the first geometrically necessary dislocation density distribution. Based on the first geometrically necessary dislocation density distribution, determine the preheating process parameters; The device to be processed is preheated according to the preheating process parameters described above. The device to be processed after the preheating treatment is characterized to obtain the second geometrically necessary dislocation density distribution. Based on the second geometrically necessary dislocation density distribution, the solid solution heat treatment process parameters are determined. The device to be treated is subjected to solution heat treatment according to the aforementioned solution heat treatment process parameters. The device to be treated after the solution heat treatment was characterized to obtain the precipitate specifications. Based on the precipitated phase specifications, determine the subsequent heat treatment process parameters; The device to be processed is subjected to post-heat treatment according to the post-heat treatment process parameters.

2. The method for extending the service life of single-crystal nickel-based alloy devices as described in claim 1, characterized in that, Based on the first geometrically necessary dislocation density distribution, the preheating process parameters are determined, including: Based on the first geometrically necessary dislocation density distribution, determine the maximum value of the first geometrically necessary dislocation density; The preheating process parameters are determined based on the maximum value of the first geometrically required dislocation density.

3. The method for extending the service life of single-crystal nickel-based alloy devices as described in claim 2, characterized in that, The preheating process parameters include initial temperature, temperature increment per step, holding time at each temperature, heating rate between adjacent temperatures, total heat treatment time, and final temperature. These preheating process parameters are determined based on the maximum value of the first geometrically necessary dislocation density, including: If the maximum value of the first geometrically necessary dislocation density is greater than 300*10 12 m -2 The preheating process parameters are determined as follows: the initial temperature is in the range of 1000-1100℃, the temperature increase is in the range of 10-20℃, the holding time at each temperature is in the range of 10-120min, the heating rate between adjacent temperatures is less than 5℃ / min, the total heat treatment time is in the range of 60-180min, and the final temperature is in the range of 1280-1300℃. If the maximum value of the first geometrically necessary dislocation density is 150*10 12 m -2 -300*10 12 m -2 Within the specified range, the preheating process parameters are determined as follows: the initial temperature is in the range of 1050-1150℃, the temperature increase range is in the range of 10-50℃, the holding time at each temperature is in the range of 10-120min, the heating rate between adjacent temperatures is less than 10℃ / min, the total heat treatment time is in the range of 60-180min, and the final temperature is in the range of 1270-1300℃. If the maximum value of the first geometrically necessary dislocation density is less than 150*10 12 m -2 The preheating process parameters are determined as follows: the initial temperature is in the range of 1000-1100℃, the temperature increase is in the range of 10-100℃, the holding time at each temperature is in the range of 10-120min, the heating rate between adjacent temperatures is less than 20℃ / min, the total heat treatment time is in the range of 60-180min, and the final temperature is in the range of 1260-1300℃.

4. The method for extending the service life of single-crystal nickel-based alloy devices as described in claim 1, characterized in that, Based on the second geometrically necessary dislocation density distribution, the solid solution heat treatment process parameters are determined, including: Based on the second geometrically necessary dislocation density distribution, determine the maximum value of the second geometrically necessary dislocation density; The solution heat treatment process parameters are determined based on the maximum value of the second geometrically required dislocation density.

5. The method for extending the service life of single-crystal nickel-based alloy devices as described in claim 4, characterized in that, The solution heat treatment process parameters include the solution heat treatment temperature and the solution heat treatment duration. These parameters are determined based on the maximum value of the second geometrically necessary dislocation density, including: If the maximum value of the second geometrically required dislocation density is greater than 150*10 12 m -2 The process parameters for the solution heat treatment are determined as follows: the temperature of the solution heat treatment is in the range of 1300-1350℃, and the duration of the solution heat treatment is in the range of 10-60min. If the maximum value of the second geometrically necessary dislocation density is 50*10 12 m -2 -150*10 12 m -2 Within the specified range, the solution heat treatment process parameters are determined as follows: the solution heat treatment temperature is within the range of 1270-1320℃, and the solution heat treatment duration is within the range of 10-60min. If the maximum value of the second geometrically required dislocation density is less than 50*10 12 m -2 The process parameters for the solution heat treatment are determined as follows: the temperature of the solution heat treatment is in the range of 1250-1300℃, and the duration of the solution heat treatment is in the range of 10-60min.

6. The method for extending the service life of single-crystal nickel-based alloy devices as described in claim 1, characterized in that, The post-heat treatment process parameters include a first temperature, a second temperature, a first holding time at the first temperature, and a second holding time at the second temperature. The first temperature is greater than the second temperature. The post-heat treatment process parameters are determined based on the precipitated phase specifications, including: If the precipitated phase has a size greater than 250 nm, the post-heat treatment process parameters are determined as follows: the first temperature is in the range of 1100-1130℃, the second temperature is in the range of 800-850℃, the first holding time is in the range of 2-10 min, and the second holding time is in the range of 10-35 min.

7. The method for extending the service life of single-crystal nickel-based alloy devices as described in claim 6, characterized in that, Based on the precipitated phase specifications, the subsequent heat treatment process parameters are determined, including: If the precipitated phase size is in the range of 150-250nm, the post-heat treatment process parameters are determined as follows: the first temperature is in the range of 1100-1140℃, the second temperature is in the range of 830-880℃, the first holding time is in the range of 2-10min, and the second holding time is in the range of 10-35min. If the precipitated phase size is less than 150 nm, the post-heat treatment process parameters are determined as follows: the first temperature is in the range of 1120-1150℃, the second temperature is in the range of 850-890℃, the first holding time is in the range of 2-10 min, and the second holding time is in the range of 10-35 min.

8. A system for extending the service life of single-crystal nickel-based alloy devices, characterized in that, The system for extending the service life of single-crystal nickel-based alloy devices includes: An electrochemical polishing module is used to perform electrochemical polishing on the devices to be processed. The first characterization module is used to characterize the device to be processed after electrochemical polishing to obtain the first geometrically necessary dislocation density distribution. The preheating process parameter determination module is used to determine the preheating process parameters based on the first geometrically necessary dislocation density distribution. A preheating module is used to preheat the device to be processed according to the preheating process parameters. The second characterization module is used to characterize the device to be processed after the preheating treatment to obtain the second geometrically necessary dislocation density distribution. The solution heat treatment process parameter determination module is used to determine the solution heat treatment process parameters based on the second geometrically necessary dislocation density distribution. A solution heat treatment module is used to perform solution heat treatment on the device to be treated according to the solution heat treatment process parameters. The third characterization module is used to characterize the device to be treated after the solution heat treatment to obtain the precipitate specifications; The post-heat treatment process parameter determination module is used to determine the post-heat treatment process parameters based on the precipitated phase specifications. The post-heat treatment module is used to perform post-heat treatment on the device to be treated according to the post-heat treatment process parameters.

9. An electronic device, characterized in that, The electronic device includes: One or more processors; A storage device for storing one or more programs, which, when executed by one or more processors, cause the electronic device to perform the method for extending the service life of a single-crystal nickel-based alloy device as described in any one of claims 1-7.

10. A computer-readable storage medium, characterized in that, It stores a computer program that, when executed by the computer's processor, causes the computer to perform the method for extending the service life of a single-crystal nickel-based alloy device as described in any one of claims 1-7.