Multi-station laser production device and method

Abstract

The invention discloses a multi-station laser production device and method, and relates to the technical field of laser production, the multi-station laser production device comprises a workbench, supporting legs are symmetrically installed at the bottom of the workbench, a fixed frame is fixedly installed at the top of the workbench, the multi-station laser production device further comprises a hydraulic push rod, a movable plate is fixedly installed at the top of the fixed frame, and a movable plate is arranged above the inner side of the fixed frame; the movable plate is arranged on the top of the workbench, guide rods are symmetrically installed on the top of the movable plate, the two guide rods are both in sliding connection with the fixing frame, the moving assembly is arranged above the workbench, and the moving assembly comprises a moving plate and fixing assemblies which are symmetrically arranged on the top of the workbench; whether the chips are firmly installed on the heat sink or not can be detected by applying rated thrust, so that after the multiple chips and the heat sink are assembled, the multiple chips can be detected at the same time, the firmness degree of assembly of the chips and the heat sink can be conveniently detected, the detection efficiency is improved, detection contingency is avoided, and the detection efficiency is improved.

Description

Technical Field

[0001] This invention relates to the field of laser manufacturing technology, specifically to a multi-station laser manufacturing apparatus and method. Background Technology

[0002] Currently, lasers are widely used in scientific research, industry, medicine, and military fields, greatly promoting the technological and industrial development of these fields. Due to their small size and high power, lasers generate heat during operation. If this heat is not dissipated in time, it will affect the laser's power, efficiency, lifespan, and other characteristics. Therefore, during laser manufacturing, the chip needs to be fixed to a heat sink through sintering, thereby dissipating heat through thermal conduction.

[0003] For example, in a high-efficiency multi-station laser production device disclosed in CN111446617B, compared to the method of pressing with tightened bolts, this invention requires prior adjustment before use. The height of the lifting plate is adjusted to an appropriate position so that the pressure exerted by the spring force of the third spring on the chip reaches the optimal force. During fixing, the pull rod is first pulled outward, and then the pressing rod is gently pulled. The pressing rod moves downward under the action of the third spring, and the pressure block presses the chip under the restoring force of the third spring. Finally, the pressing rod is pressed by the cooperation of the second limiting tooth and the first limiting tooth. Limiting the pressure on the chip eliminates the need for manual adjustment each time, making operation more convenient and reliable and greatly improving production efficiency. However, in actual use, after the chip and heat sink are assembled and fixed during laser production, it is not convenient to test the assembly firmness of the chip and heat sink, and the assembly quality of the chip and heat sink cannot be tested. If other testing equipment is used, additional testing steps are required, and only random sampling of the chip and heat sink can be performed. Random sampling has a certain degree of randomness, cannot guarantee the quality of testing, and has low testing efficiency, which has certain defects in use.

[0004] Therefore, we propose a multi-station laser production device and method to solve the problems mentioned above. Summary of the Invention

[0005] The purpose of this invention is to provide a multi-station laser production apparatus and method to solve the problem mentioned in the background art that after the chip and heat sink are assembled and fixed in the laser production process, it is not convenient to detect the assembly firmness of the chip and heat sink, and the assembly quality of the chip and heat sink cannot be detected.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a multi-station laser production device, including a worktable, with support legs symmetrically installed at the bottom of the worktable and a fixed frame fixedly installed at the top of the worktable; Also includes: A hydraulic push rod is fixedly installed on the top of the fixed frame. A movable plate is provided on the upper inner side of the fixed frame, and guide rods are symmetrically installed on the top of the movable plate. Both guide rods are slidably connected to the fixed frame. A movable component is positioned above the workbench; the movable component includes a movable plate. Fixed components are symmetrically arranged on the top of the worktable; A movable plate is set below the movable plate. Several sets of mounting brackets are symmetrically installed on the bottom of the movable plate. Movable rods are slidably connected to one side of the interior of each mounting bracket. Movable brackets are fixedly installed on the top of the movable rods. Support rods are fixedly installed on one side of the bottom of the movable brackets and are slidably connected to the mounting brackets. A support spring is sleeved on top of the movable rod. The two ends of the support spring are fixedly connected to the mounting frame and the movable frame, respectively. A sliding groove is provided inside the movable rod, and a sliding rod is slidably connected inside the sliding groove.

[0007] Preferably, the movable end of the hydraulic push rod passes through the fixed frame and is fixedly mounted with a mounting plate, and two sets of telescopic cylinders are symmetrically mounted between the mounting plate and the movable plate, and a pressure sensor is fixedly mounted between the mounting plate and the movable plate and between the two sets of telescopic cylinders.

[0008] By adopting the above technical solution, it is easy to know the pressure applied by the moving plate.

[0009] Preferably, a tension spring is sleeved on the upper outer side of the sliding rod, and the two ends of the tension spring are fixedly connected to the sliding groove and the sliding rod respectively. A pressure plate is fixedly installed at the bottom of the sliding rod, and several rubber protrusions are fixedly installed at the bottom of the pressure plate.

[0010] By adopting the above technical solution, pressure can be applied to the chip, which facilitates the assembly of the chip and the heat sink.

[0011] Preferably, two sets of mounting blocks are symmetrically installed on the top of the movable plate, and a fixed rod is fixedly installed between the two mounting blocks in each set. A movable block is slidably connected to the outer side of the fixed rod, and the movable block is fixedly connected to the movable plate. A telescopic spring is sleeved on the outer side of the fixed rod on the side of the movable block, and the two ends of the telescopic spring are fixedly connected to the movable block and the mounting block on one side, respectively.

[0012] By adopting the above technical solution, the movable plate can automatically reset after being moved to the side.

[0013] Preferably, limit frames are symmetrically installed on one side of the bottom of the movable plate, and a column is fixedly installed between the two limit frames below, and a guide frame is slidably connected to the outside of the column.

[0014] By adopting the above technical solution, the movement of the moving plate can be guided.

[0015] Preferably, a movable block is fixedly installed on one side of the guide frame, and a through groove is opened through the lower side of one side of the fixed frame. The movable block is slidably connected to the through groove. At the same time, a threaded rod is threadedly connected to one side of the movable block, and both ends of the threaded rod are rotatably connected to positioning blocks. Both positioning blocks are fixedly connected to the fixed frame. One end of the threaded rod passes through the upper positioning block through a rotating shaft and is fixedly installed with a knob. At the same time, a support plate is fixedly installed on the other side of the guide frame. Limit rods are symmetrically slidably connected to one side of the support plate, and two connecting blocks are fixedly installed at both ends of the two limit rods. Both connecting blocks are fixedly connected to the fixed frame.

[0016] By adopting the above technical solution, the height of the support plate can be adjusted according to the height of the chip.

[0017] Preferably, the interior of the movable frame is threaded to one side of the support rod, and the bottom of the support rod is hinged with ball bearings.

[0018] By adopting the above technical solution, the pressure of the pressure plate on the chip can be prevented from increasing further during the testing process.

[0019] Preferably, the fixing assembly includes several placement platforms symmetrically installed on the top of the workbench and located below several pressure plates. Each of the placement platforms is rotatably connected to a rotating ring on its outer upper surface. The top of the rotating ring is circumferentially provided with several movable slots. Each of the movable slots is slidably connected to a column block. A movable frame is fixedly installed on the top of the column block. Positioning rods are symmetrically slidably connected inside the movable frame. One end of each of the two positioning rods is fixedly connected to a placement platform. A return spring is sleeved on one side of each of the two positioning rods. The two ends of the return spring are fixedly connected to the positioning rod and the movable frame, respectively. A rubber plate is fixedly installed on one side of the movable frame.

[0020] By adopting the above technical solution, it is convenient to fix the heat sink.

[0021] Preferably, a connecting frame is fixedly installed on one side of the rotating ring, and a rubber rope is fixedly installed on one side of the connecting frame. A vertical frame is fixedly installed at the end of the rubber rope away from the connecting frame. The top of the vertical frame is fixedly connected to the moving plate. Rectangular slots are opened through several vertical frames on the top of the workbench, and the vertical frames are adapted to the rectangular slots.

[0022] By adopting the above technical solution, the downward movement of the moving plate can drive the rotating ring to rotate.

[0023] A method for manufacturing a multi-station laser, the specific steps of which are as follows: Step 1: In the production process of lasers, when assembling chips with heat sinks, after the heat sink is placed, a hydraulic push rod is activated to move the mounting plate downwards, which in turn moves the movable plate downwards. This downward movement of the movable plate causes the sliding plate to move downwards, bringing the pressure plate into contact with the chip on the heat sink. As the sliding plate continues to move downwards, the elastic potential energy of the support spring is much greater than that of the tension spring, allowing the sliding rod to slide within the sliding groove and causing the tension spring to deform. This, in turn, applies pressure to the chip via the pressure plate, assisting in the assembly of the chip and heat sink. During the pressure application process, a pressure sensor detects the pressure value. Once the required value is reached, the rigid sliding plate moves downwards. Then, rotating the threaded rod moves the sliding block, thus... The guide frame moves, placing the column at its bend. After the chip and heat sink are assembled, the moving plate continues to move downwards, causing the column between the limiting frames to move downwards. During this downward movement, the column moves to the right under the guidance of the guide frame. Since the pressure plate abuts against the top of the chip, it does not move, allowing the movable block to slide on the fixed rod and stretch the telescopic spring. A pushing force can be applied to the chip through the pressure plate, and the applied pushing force can be detected by a pressure sensor. The application of a rated pushing force can then be used to check whether the chip is securely installed on the heat sink. This allows for simultaneous testing of multiple chips after assembly with the heat sink, facilitating the detection of the chip's secure assembly with the heat sink, improving testing efficiency, avoiding randomness in the detection process, and enhancing overall testing efficiency. Step Two: During chip assembly, pressure is applied to the chip by moving the movable plate. When pressure is applied, the upright can be rotated. The upright can move through the threaded connection with the movable frame, so that the ball bearing at the bottom of the upright abuts against the support plate during the pressure application. During chip testing, the movable plate moves downward, causing the mounting frame to move downward. At this time, the ball bearing at the bottom of the upright abuts against the support plate, preventing the movable frame from moving. The movable plate continues to move downward, causing the mounting frame to slide on the movable rod and stretch the support spring. This prevents the stretching spring from deforming further and avoids applying more downward pressure to the pressure plate, thus preventing damage to the chip due to excessive downward pressure from the pressure plate and improving practicality. Step 3: During the assembly of the heat sink and the chip, the heat sink is placed on top of the placement platform. Then, the movable plate moves downwards, causing the upright to move downwards as well. The downward movement of the upright pulls on a rubber rope, which in turn pulls a rotating ring. The rotating ring, through a sliding connection between a movable slot and a column, moves the column, causing the movable frame to slide on a positioning rod and stretch a return spring. This allows multiple movable frames to approach simultaneously, enabling the rubber plate to clamp and fix the heat sink, placing it at the center of the placement platform. The movable plate then moves the upright further downwards, stretching the rubber rope and allowing the upright to pass through a rectangular slot. Once inside the slot, the rubber rope does not rub against the inner wall of the slot. The fixing components facilitate the fixation of the heat sink, ensuring it remains centered on the placement platform for easier assembly and preventing movement during testing, thus improving practicality.

[0024] Compared with the prior art, the beneficial effects of the present invention are: the multi-station laser production apparatus and method can detect whether the chip is firmly installed on the heat sink by applying a rated thrust, so that after assembling multiple chips with the heat sink, multiple chips can be tested at the same time, which facilitates the detection of the firmness of the chip and heat sink assembly, improves the detection efficiency, avoids the occurrence of randomness in the detection, and improves the detection efficiency. 1. In the production process of lasers, when assembling the chip with the heat sink, after placing the heat sink, the hydraulic push rod is activated to move the mounting plate downwards, which in turn moves the movable plate downwards. This downward movement of the movable plate causes the sliding plate to move downwards, bringing the pressure plate into contact with the chip on the heat sink. As the sliding plate continues to move downwards, the elastic potential energy of the support spring is much greater than that of the tension spring, allowing the sliding rod to slide within the sliding groove and causing the tension spring to deform. This allows the pressure plate to apply pressure to the chip, thus assisting in the assembly of the chip with the heat sink. During the pressure application process, a pressure sensor detects the pressure value. Once the required value is reached, the rigid sliding plate moves downwards. Then, rotating the threaded rod moves the sliding block, proceeding further... The guide frame moves, placing the column at its bend. After the chip and heat sink are assembled, the moving plate continues to move downwards, causing the column between the limiting frames to move downwards. During this downward movement, the column moves to the right under the guidance of the guide frame. Since the pressure plate abuts against the top of the chip, it does not move, allowing the movable block to slide on the fixed rod and stretch the telescopic spring. The pressure plate can apply a pushing force to the chip, and the applied pushing force can be detected by a pressure sensor. By applying the rated pushing force, the chip's secure installation on the heat sink can be checked. This allows for simultaneous testing of multiple chips after assembly with the heat sink, facilitating the detection of the chip's secure assembly with the heat sink, improving testing efficiency, avoiding randomness in the detection process, and enhancing overall testing efficiency. 2. During chip assembly, pressure can be applied to the chip by moving the movable plate. When pressure is applied, the upright can be rotated. The upright can be moved through the threaded connection with the movable frame. This allows the ball bearings at the bottom of the upright to abut against the support plate during the application of pressure to the chip. During chip testing, the movable plate moves downward, causing the mounting frame to move downward. At this time, the ball bearings at the bottom of the upright abut against the support plate prevent the movable frame from moving. The movable plate continues to move downward, causing the mounting frame to slide on the movable rod and stretch the support spring. This prevents the stretching spring from deforming further and avoids applying excessive downward pressure to the pressure plate, which could damage the chip and improve practicality. 3. During the assembly of the heat sink and the chip, the heat sink is placed on top of the placement platform. The moving plate then moves downwards, causing the upright to move as well. The downward movement of the upright pulls the rubber rope, which in turn pulls the rotating ring. The rotating ring, through the sliding connection between the movable slot and the column, moves the column, causing the movable frame to slide on the positioning rod and stretch the return spring. This allows multiple movable frames to approach simultaneously, enabling the rubber plate to clamp and fix the heat sink, placing it at the center of the top of the placement platform. The moving plate then moves the upright further downwards, stretching the rubber rope and allowing the upright to pass through the rectangular slot. Once inside the slot, the rubber rope does not rub against the inner wall of the slot. The fixing components facilitate the fixation of the heat sink, ensuring it remains centered on the placement platform for easier assembly and preventing movement during testing, thus improving practicality. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the overall structure of the invention from another perspective; Figure 3 For the present invention Figure 1 Enlarged structural diagram of region A in the middle; Figure 4 This is a schematic diagram of the mounting frame structure of the present invention; Figure 5 This is a schematic diagram of the cross-sectional structure of the movable rod of the present invention; Figure 6 For the present invention Figure 1 Enlarged structural diagram of region B in the middle; Figure 7 This is a schematic cross-sectional view of the guide frame structure of the present invention; Figure 8 This is a schematic diagram of the fixed component structure of the present invention; Figure 9 This is a schematic diagram of the fixed component of the present invention from another perspective; Figure 10 For the present invention Figure 2 A magnified structural diagram of region C in the middle.

[0026] In the diagram: 1. Workbench; 101. Support leg; 102. Fixing frame; 103. Hydraulic push rod; 104. Mounting plate; 105. Guide rod; 106. Movable plate; 107. Telescopic cylinder; 108. Pressure sensor; 2. Moving assembly; 201. Movable plate; 202. Mounting frame; 203. Movable rod; 204. Moving frame; 205. Support spring; 206. Support rod; 207. Sliding groove; 208. Sliding rod; 209. Tension spring; 210. Pressure plate; 211. Mounting block; 212. Fixing rod; 213. Telescopic spring; 214. 1. Movable block; 215. Limiting frame; 216. Guide frame; 217. Column; 218. Moving block; 219. Positioning block; 220. Threaded rod; 221. Support plate; 222. Limiting rod; 223. Connecting block; 224. Upright; 225. Ball bearing; 3. Fixing assembly; 301. Placement platform; 302. Rotating ring; 303. Movable groove; 304. Column block; 305. Movable frame; 306. Positioning rod; 307. Return spring; 308. Rubber plate; 309. Upright frame; 310. Rubber rope; 311. Connecting frame; 312. Rectangular groove. Detailed Implementation

[0027] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0028] Please see Figures 1-10 The present invention provides a technical solution: a multi-station laser production device, including a workbench 1, with support legs 101 symmetrically installed on the bottom of the workbench 1, and a fixing frame 102 fixedly installed on the top of the workbench 1. Also includes: A hydraulic push rod 103 is fixedly installed on the top of a fixed frame 102. A movable plate 106 is provided on the upper inner side of the fixed frame 102, and guide rods 105 are symmetrically installed on the top of the movable plate 106. Both guide rods 105 are slidably connected to the fixed frame 102. The movable component 2 is disposed above the workbench 1, and the movable component 2 includes a movable plate 201; A movable plate 201 is disposed below the movable plate 106. Several sets of mounting brackets 202 are symmetrically installed on the bottom of the movable plate 201. Movable rods 203 are slidably connected to one side of the interior of each mounting bracket 202. A movable frame 204 is fixedly installed on the top of the movable rod 203. A support rod 206 is fixedly installed on one side of the bottom of the movable frame 204. The support rod 206 is slidably connected to the mounting bracket 202. A support spring 205 is sleeved on top of the movable rod 203. The two ends of the support spring 205 are fixedly connected to the mounting frame 202 and the movable frame 204 respectively. A sliding groove 207 is provided inside the movable rod 203, and a sliding rod 208 is slidably connected inside the sliding groove 207. The movable end of the hydraulic push rod 103 passes through the fixed frame 102 and is fixedly installed with the mounting plate 104. Two sets of telescopic cylinders 107 are symmetrically installed between the mounting plate 104 and the movable plate 106. A pressure sensor 108 is fixedly installed between the mounting plate 104 and the movable plate 106 and between the two sets of telescopic cylinders 107. A tension spring 209 is sleeved on the upper part of the sliding rod 208, and the two ends of the tension spring 209 are fixedly connected to the sliding groove 207 and the sliding rod 208 respectively. A pressure plate 210 is fixedly installed at the bottom of the sliding rod 208, and several rubber protrusions are fixedly installed at the bottom of the pressure plate 210. Two sets of mounting blocks 211 are symmetrically installed on the top of the movable plate 201, and a fixed rod 212 is fixedly installed between the two mounting blocks 211 in each set. A movable block 214 is slidably connected to the outer side of the fixed rod 212. The movable block 214 is fixedly connected to the movable plate 106. A telescopic spring 213 is sleeved on the outer side of the fixed rod 212 on one side of the movable block 214. The two ends of the telescopic spring 213 are fixedly connected to the movable block 214 and the mounting block 211 on one side, respectively. A limit frame 215 is symmetrically installed on one side of the bottom of the movable plate 201, and a column rod 217 is fixedly installed between the two limit frames 215. A guide frame 216 is slidably connected to the outside of the column rod 217. A movable block 218 is fixedly installed on one side of the guide frame 216, and a through groove is opened through the lower side of one side of the fixed frame 102. The movable block 218 is slidably connected to the through groove. At the same time, a threaded rod 220 is threadedly connected to one side of the movable block 218. Both ends of the threaded rod 220 are rotatably connected to positioning blocks 219. Both positioning blocks 219 are fixedly connected to the fixed frame 102. One end of the threaded rod 220 passes through the upper positioning block 219 through a rotating shaft and is fixedly installed with a knob. At the same time, a support plate 221 is fixedly installed on the other side of the guide frame 216. A limit rod 222 is symmetrically slidably connected to one side of the support plate 221. Both ends of the two limit rods 222 are fixedly installed with two connecting blocks 223. Both connecting blocks 223 are fixedly connected to the fixed frame 102.

[0029] Example 1: As Figures 1-5 and Figure 7As shown, during the laser production process, when assembling the chip with the heat sink, after placing the heat sink, the hydraulic push rod 103 is activated to move the mounting plate 104 downwards, which in turn moves the movable plate 106 downwards. The movable plate 106 then moves the moving plate 201 downwards, causing the pressure plate 210 to contact the chip on the heat sink. The moving plate 201 continues to move downwards. The elastic potential energy of the support spring 205 is much greater than that of the tension spring 209, allowing the sliding rod 208 to slide within the sliding groove 207 and causing the tension spring 209 to deform. This allows pressure to be applied to the chip via the pressure plate 210, thus assisting in the assembly of the chip with the heat sink. During the pressure application process, the pressure sensor 108 detects the pressure value. Once the required value is reached, the rigid moving plate 201 moves downwards. Then, the threaded rod 220 can be rotated, moving the moving block 218 forwards. The movement causes the guide frame 216 to move, and after the guide frame 216 moves, the column rod 217 is positioned at the bend of the guide frame 216. After the chip and heat sink are assembled, the moving plate 201 can continue to move downward, causing the column rod 217 between the limiting frames 215 to move downward. During the downward movement, the column rod 217 can move to the right under the guidance of the guide frame 216. Since the pressure plate 210 abuts against the top of the chip, the pressure plate 210 will not move, causing the movable block 214 to slide on the fixed rod 212 and stretch the telescopic spring 213. The pressure plate 210 can apply a pushing force to the chip, and the pressure sensor 108 can detect the applied pushing force. The rated pushing force can be applied to detect whether the chip is firmly installed on the heat sink. After assembling multiple chips and heat sinks, multiple chips can be tested simultaneously, which facilitates the detection of the firmness of the chip and heat sink assembly, improves the detection efficiency, avoids randomness in the detection, and improves the detection efficiency.

[0030] Inside the movable frame 204, on one side of the support rod 206, there is a threaded connection to the upright rod 224, and the bottom of the upright rod 224 is hinged with a ball bearing 225.

[0031] Example 2: Figure 2 and Figures 4-7As shown, during chip assembly, pressure can be applied to the chip by moving the movable plate 201. When pressure is applied, the upright rod 224 can be rotated. The upright rod 224 can be moved through the threaded connection with the movable frame 204, so that the ball bearing 225 at the bottom of the upright rod 224 abuts against the support plate 221 during the application of pressure to the chip. During chip testing, the downward movement of the movable plate 201 will drive the mounting frame 202 to move downward. At this time, due to the abutment between the ball bearing 225 at the bottom of the upright rod 224 and the support plate 221, the movable frame 204 will not move. The continued downward movement of the movable plate 201 causes the mounting frame 202 to slide on the movable rod 203 and stretch the support spring 205, thereby preventing the stretching spring 209 from deforming further and preventing further downward pressure on the pressure plate 210. This avoids excessive downward pressure on the chip by the pressure plate 210, which could damage the chip and improves practicality.

[0032] Fixed components 3 are symmetrically arranged on the top of the workbench 1; The fixing component 3 includes several placement platforms 301 symmetrically installed on the top of the workbench 1 and located below several pressure plates 210. Each of the placement platforms 301 is rotatably connected to a rotating ring 302 on its outer upper part. The top of the rotating ring 302 is circumferentially provided with several movable grooves 303. The interior of each movable groove 303 is slidably connected with a column block 304. The top of the column block 304 is fixedly installed with a movable frame 305. The interior of the movable frame 305 is symmetrically slidably connected with positioning rods 306. One end of each positioning rod 306 is fixedly connected to the placement platform 301. A return spring 307 is sleeved on one side of each positioning rod 306. The two ends of the return spring 307 are fixedly connected to the positioning rod 306 and the movable frame 305, respectively. A rubber plate 308 is fixedly installed on one side of the movable frame 305. A connecting frame 311 is fixedly installed on one side of the rotating ring 302, and a rubber rope 310 is fixedly installed on one side of the connecting frame 311. A stand 309 is fixedly installed at the end of the rubber rope 310 away from the connecting frame 311. The top of the stand 309 is fixedly connected to the moving plate 201. Rectangular slots 312 are opened through several stands 309 on the top of the workbench 1, and the stands 309 are adapted to the rectangular slots 312.

[0033] Example 3: Figures 1-2 and Figures 8-10As shown, during the assembly of the heat sink and the chip, the heat sink is placed on top of the placement platform 301. Then, the movable plate 201 moves downwards, causing the upright frame 309 to move downwards as well. After the upright frame 309 moves downwards, it pulls the rubber rope 310, which in turn pulls the rotating ring 302 to continue rotating. After the rotating ring 302 rotates, it moves the column block 304 through the sliding connection between the movable groove 303 and the column block 304. This causes the movable frame 305 to slide on the positioning rod 306 and stretch the return spring 307, thereby causing multiple movable frames 305 to move closer together simultaneously. The rubber plate 308 can clamp and fix the heat sink, and can make the heat sink position at the top center of the placement platform 301. Subsequently, the moving plate 201 drives the upright 309 to continue to move down, so that the rubber rope 310 can be stretched, and the upright 309 can be inserted into the rectangular groove 312. After the upright 309 is inserted into the rectangular groove 312, the rubber rope 310 will not rub against the inner wall of the rectangular groove 312. The fixing component 3 can easily fix the heat sink, so that the heat sink can be positioned at the center of the placement platform 301, which is convenient for subsequent assembly and prevents the heat sink from moving during the test, thus improving practicality.

[0034] Working principle: When using this multi-station laser production device, firstly, according to... Figures 1-10As shown, during the laser manufacturing process, when assembling the chip with the heat sink, after placing the heat sink, the hydraulic push rod 103 is activated to move the mounting plate 104 downwards, which in turn moves the movable plate 106 downwards. The movable plate 106 then moves the moving plate 201 downwards, causing the pressure plate 210 to contact the chip on the heat sink. The moving plate 201 continues to move downwards. Since the elastic potential energy of the support spring 205 is much greater than that of the tension spring 209, the sliding rod 208 can slide inside the sliding groove 207, causing the tension spring 209 to deform. This allows the pressure plate 210 to apply pressure to the chip, thus assisting in the assembly of the chip with the heat sink. During the pressure application process, the pressure sensor 108 detects the pressure value, and the pressure is adjusted accordingly when the desired value is reached. After the rigid moving plate 201 moves down, the threaded rod 220 can be rotated, which can drive the moving block 218 to move, thereby causing the guide frame 216 to move. After the guide frame 216 moves, the column rod 217 is located at the bend of the guide frame 216. After the chip and the heat sink are assembled, the moving plate 201 can continue to move down, causing the column rod 217 between the limit frame 215 to move down. During the downward movement, the column rod 217 can move to the right under the guidance of the guide frame 216. Since the pressure plate 210 abuts against the top of the chip, the pressure plate 210 will not move, allowing the movable block 214 to slide on the fixed rod 212 and stretch the telescopic spring 213. The pressure plate 210 can apply a pushing force to the chip, and the pressure sensor 108 can detect the applied pushing force. Then, the chip can be detected as to whether it is firmly installed on the heat sink by applying the rated pushing force. During chip assembly, pressure is applied to the chip by moving the movable plate 201. When pressure is applied, the upright rod 224 can be rotated. The upright rod 224 can move via a threaded connection with the movable frame 204, causing the ball bearing 225 at the bottom of the upright rod 224 to abut against the support plate 221 during chip pressure application. During chip testing, the downward movement of the movable plate 201 causes the mounting frame 202 to move downward. At this time, due to the abutment between the ball bearing 225 at the bottom of the upright rod 224 and the support plate 221, the movable frame 204 will not move. The continued downward movement of the movable plate 201 causes the mounting frame 202 to slide on the movable rod 203, stretching the support spring 205. This prevents further deformation of the stretching spring 209 and avoids applying excessive downward pressure to the pressure plate 210, preventing chip damage. During the assembly of the heat sink and the chip, The heat sink is placed on top of the placement platform 301, and then the movable plate 201 moves down, which in turn moves the upright 309 down. After the upright 309 moves down, it can pull the rubber rope 310 to move, and then the rubber rope 310 can pull the rotating ring 302 to continue to rotate. After the rotating ring 302 rotates, it can drive the column block 304 to move through the sliding connection between the movable groove 303 and the column block 304, so that the movable frame 305 slides on the positioning rod 306 and stretches the return spring 307. This causes multiple movable frames 305 to move closer together at the same time, so that the rubber plate 308 can clamp and fix the heat sink, and can make the heat sink position at the top center of the placement platform 301. Subsequently, the movable plate 201 moves the upright 309 down, which can stretch the rubber rope 310, and the upright 309 can pass into the rectangular groove 312. After the upright 309 passes into the rectangular groove 312, the rubber rope 310 will not rub against the inner wall of the rectangular groove 312.

[0035] The contents not described in detail in this specification are existing technologies known to those skilled in the art.

[0036] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A multi-station laser production apparatus, comprising a workbench (1), wherein support legs (101) are symmetrically installed on the bottom of the workbench (1), and a fixed frame (102) is fixedly installed on the top of the workbench (1). Its features are, Also includes: A hydraulic push rod (103) is fixedly installed on the top of a fixed frame (102). A movable plate (106) is provided on the upper inner side of the fixed frame (102), and guide rods (105) are symmetrically installed on the top of the movable plate (106). Both guide rods (105) are slidably connected to the fixed frame (102). A movable component (2) is disposed above the workbench (1), the movable component (2) including a movable plate (201). Fixed components (3) are symmetrically arranged on the top of the workbench (1); A movable plate (201) is disposed below the movable plate (106). Several sets of mounting brackets (202) are symmetrically installed on the bottom of the movable plate (201). Movable rods (203) are slidably connected to one side of the interior of each of the mounting brackets (202). A movable frame (204) is fixedly installed on the top of the movable rod (203). A support rod (206) is fixedly installed on one side of the bottom of the movable frame (204). The support rod (206) is slidably connected to the mounting bracket (202). A support spring (205) is sleeved on the top of the movable rod (203). The two ends of the support spring (205) are fixedly connected to the mounting frame (202) and the movable frame (204) respectively. A sliding groove (207) is provided inside the movable rod (203), and a sliding rod (208) is slidably connected inside the sliding groove (207).

2. The multi-station laser production apparatus according to claim 1, characterized in that: The movable end of the hydraulic push rod (103) passes through the fixed frame (102) and is fixedly installed with the mounting plate (104). Two sets of telescopic cylinders (107) are symmetrically installed between the mounting plate (104) and the movable plate (106). A pressure sensor (108) is fixedly installed between the mounting plate (104) and the movable plate (106) between the two sets of telescopic cylinders (107).

3. The multi-station laser production apparatus according to claim 2, characterized in that: A tension spring (209) is sleeved on the upper part of the sliding rod (208), and the two ends of the tension spring (209) are fixedly connected to the sliding groove (207) and the sliding rod (208) respectively. A pressure plate (210) is fixedly installed at the bottom of the sliding rod (208), and several rubber protrusions are fixedly installed at the bottom of the pressure plate (210).

4. The multi-station laser production apparatus according to claim 3, characterized in that: Two sets of mounting blocks (211) are symmetrically installed on the top of the movable plate (201), and a fixing rod (212) is fixedly installed between the two mounting blocks (211) in each set. A movable block (214) is slidably connected to the outer side of the fixing rod (212), and the movable block (214) is fixedly connected to the movable plate (106). A telescopic spring (213) is sleeved on the outer side of the fixing rod (212) on one side of the movable block (214), and the two ends of the telescopic spring (213) are fixedly connected to the movable block (214) and the mounting block (211) on one side, respectively.

5. A multi-station laser production apparatus according to claim 4, characterized in that: The bottom side of the movable plate (201) is symmetrically equipped with a limiting frame (215), and a column rod (217) is fixedly installed between the two limiting frames (215) below, and a guide frame (216) is slidably connected to the outside of the column rod (217).

6. The multi-station laser production apparatus according to claim 5, characterized in that: A movable block (218) is fixedly installed on one side of the guide frame (216), and a through groove is opened through one side of the fixed frame (102). The movable block (218) is slidably connected to the through groove. At the same time, a threaded rod (220) is threadedly connected to one side of the movable block (218), and both ends of the threaded rod (220) are rotatably connected to positioning blocks (219). Both positioning blocks (219) are fixedly connected to the fixed frame (102). One end of the threaded rod (220) passes through the upper positioning block (219) through a rotating shaft and is fixedly installed with a knob. At the same time, a support plate (221) is fixedly installed on the other side of the guide frame (216), and a limit rod (222) is symmetrically slidably connected to one side of the support plate (221). Both ends of the two limit rods (222) are fixedly installed with two connecting blocks (223), and both connecting blocks (223) are fixedly connected to the fixed frame (102).

7. A multi-station laser production apparatus according to claim 1, characterized in that: The interior of the movable frame (204) is threadedly connected to a vertical rod (224) on one side of the support rod (206), and a ball bearing (225) is hinged to the bottom of the vertical rod (224).

8. A multi-station laser production apparatus according to claim 3, characterized in that: The fixing component (3) includes several placement platforms (301) symmetrically installed on the top of the workbench (1) and located below several pressure plates (210). A rotating ring (302) is rotatably connected to the upper outer surface of each of the placement platforms (301). Several movable slots (303) are circumferentially opened on the top of each rotating ring (302), and a column block (304) is slidably connected inside each of the movable slots (303). A movable... The movable frame (305) has a symmetrical sliding connection of positioning rods (306) inside, and one end of each of the two positioning rods (306) is fixedly connected to the placement platform (301). A return spring (307) is sleeved on one side of each of the two positioning rods (306), and the two ends of the return spring (307) are fixedly connected to the positioning rod (306) and the movable frame (305) respectively. A rubber plate (308) is fixedly installed on the upper side of one side of the movable frame (305).

9. A multi-station laser production apparatus according to claim 8, characterized in that: A connecting frame (311) is fixedly installed on one side of the rotating ring (302), and a rubber rope (310) is fixedly installed on one side of the connecting frame (311). A stand (309) is fixedly installed at the end of the rubber rope (310) away from the connecting frame (311). The top of the stand (309) is fixedly connected to the moving plate (201). A rectangular groove (312) is opened through several stands (309) on the top of the workbench (1). The stands (309) are adapted to the rectangular grooves (312).

10. A method for producing a multi-station laser, using the multi-station laser production apparatus as described in claim 9, characterized in that, The specific usage steps are as follows: Step 1: When assembling a chip with a heat sink during the production process of a laser, after placing the heat sink, the hydraulic push rod (103) is activated to move the mounting plate (104) downward, which in turn moves the movable plate (106) downward. After the movable plate (106) moves downward, the moving plate (201) moves downward, causing the pressure plate (210) to abut against the chip on the heat sink. Then, the moving plate (201) continues to move downward. The elastic potential energy of the support spring (205) is much greater than that of the tension spring (209), so that after the moving plate (201) continues to move downward, the sliding rod (208) can slide inside the sliding groove (207) and cause the tension spring (209) to deform. Then, pressure can be applied to the chip through the pressure plate (210), which can assist in the assembly of the chip with the heat sink. During the pressure application process, the pressure sensor (108) can detect the pressure. After the force value reaches the required value, the rigid moving plate (201) moves down, and then the threaded rod (220) can be rotated, which can drive the moving block (218) to move, thereby causing the guide frame (216) to move. After the guide frame (216) moves, the column rod (217) is at the bend of the guide frame (216). After the chip and heat sink are assembled, the moving plate (201) can continue to move down, causing the column rod (217) between the limit frame (215) to move down. During the downward movement, the column rod (217) can move to the right under the guidance of the guide frame (216). Since the pressure plate (210) abuts against the top of the chip, the pressure plate (210) will not move, so that the movable block (214) slides on the fixed rod (212) and stretches the telescopic spring (213). The pressure plate (210) can apply a push force to the chip, and the applied push force can be known through the pressure sensor (108). Step Two: During chip assembly, pressure can be applied to the chip by moving the movable plate (201). When pressure is applied, the upright rod (224) can be rotated. The upright rod (224) can be moved by the threaded connection with the movable frame (204). Thus, during the process of applying pressure to the chip, the ball bearing (225) at the bottom of the upright rod (224) abuts against the support plate (221). During chip testing, the downward movement of the movable plate (201) will drive the mounting frame (202) to move downward. At this time, due to the abutment between the ball bearing (225) at the bottom of the upright rod (224) and the support plate (221), the movable frame (204) will not move. The moving plate (201) continues to move downward, causing the mounting frame (202) to slide on the movable rod (203) and stretch the support spring (205). Step 3: During the assembly of the heat sink and the chip, the heat sink is placed on top of the placement platform (301), and then the movable plate (201) is moved down, which drives the upright frame (309) to move down. After the upright frame (309) moves down, it can pull the rubber rope (310) to move, and then the rubber rope (310) can pull the rotating ring (302) to continue rotating. After the rotating ring (302) rotates, it can drive the column block (304) to move through the sliding connection between the movable groove (303) and the column block (304), so that the movable frame (305) slides on the positioning rod (306) and stretches the return spring (307), thereby making Multiple movable frames (305) are brought close together at the same time, so that the rubber plate (308) can clamp and fix the heat sink, and the heat sink can be placed at the top center of the placement platform (301). The subsequent moving plate (201) drives the upright (309) to continue to move down, so that the rubber rope (310) can be stretched, and the upright (309) can be inserted into the rectangular groove (312). After the upright (309) is inserted into the rectangular groove (312), the rubber rope (310) will not rub against the inner wall of the rectangular groove (312). The heat sink can be easily fixed by the fixing component (3), so that the heat sink can be placed at the center of the placement platform (301).

Images