Pulse power supply for multi-arc ion plating

Abstract

The invention relates to the field of vacuum coating, and discloses a pulse power supply for multi-arc ion plating, which comprises a direct-current power supply, a direct-current power supply matched power switch device and a plurality of low-power pulse power supplies, and the plurality of low-power pulse power supplies are connected in parallel to form a modularized multi-arc ion plating pulse plasma power supply. The low-power pulse power supply is realized by matching a direct-current power supply with a power switch device for chopping or directly selects the low-power pulse power supply or a combination of the two. By controlling the magnitude of the output current, the output frequency, the output pulse width and the output phase between the power supplies of each pulse power supply, abundant and diversified output waveforms can be formed, the output characteristics of the pulse power supply can be flexibly adjusted through the design that different waveforms are output through multi-module combination and are superposed, and in the multi-arc ion plating process, the production efficiency is greatly improved. By accurately controlling the output of each module, accurate regulation and control of the processes of ion generation, acceleration, bombardment and the like can be realized.

Description

Technical Field

[0001] This invention relates to the field of vacuum coating technology, specifically to a pulse power supply for multi-arc ion plating. Background Technology

[0002] Multi-arc ion plating is a method of depositing a film on a workpiece by exciting a target material with a plasma power source under vacuum conditions, based on the principle of physical vapor deposition (PVD). The plasma power source is one of the key pieces of equipment in multi-arc ion plating technology, and its output performance largely determines the performance of the deposited film.

[0003] Current plasma power supplies for multi-arc ion plating generally employ current mode, with two types: DC and pulse. In actual industrial production, DC mode is the primary method. Compared to DC mode, pulsed power supplies can improve ionization rate, reduce droplets, and optimize film performance to a certain extent, making it an important direction for the development of plasma power supplies for multi-arc ion plating.

[0004] Existing pulse power supplies for multi-arc ion plating generally adopt a single integrated design. The internal power devices must meet both the average current and peak current requirements, resulting in a large power supply size and high manufacturing cost. Therefore, it is necessary to develop a pulse power supply for multi-arc ion plating. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this invention provides a pulse power supply for multi-arc ion plating, which solves the problem that existing technologies generally adopt a single integrated design, where the internal power devices must meet both average current and peak current requirements, resulting in a large power supply size and high manufacturing cost.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a pulse power supply for multi-arc ion plating, comprising a DC power supply, a DC power supply combined with a power switching device, and a low-power pulse power supply. Multiple low-power pulse power supplies are connected in parallel to form a modular multi-arc ion plating pulse plasma power supply. The low-power pulse power supply is achieved by chopping with a DC power supply combined with a power switching device, or by directly selecting a low-power pulse power supply or a combination of both.

[0007] By adopting the above technical solutions, the pulse power supply achieves multiple optimizations in performance, process and cost through modular parallel and multi-combination design. At the same time, the modular parallel low-power pulse power supply enables flexible power expansion and fault redundancy, improving system reliability. The multiple implementation methods of the low-power pulse power supply take into account both cost and performance. Precise pulse control can optimize plasma characteristics, improve film quality, reduce defects, accelerate deposition efficiency, and reduce overall production costs.

[0008] Preferably, the output of the low-power pulse power supply has three superposition methods: phase control superposition, frequency mixing superposition, and pulse width modulation superposition.

[0009] Preferably, the phase control superposition adjusts the phase difference of the output pulses of each module for time-displaced waveform superposition.

[0010] Preferably, the frequency mixing and superposition is achieved by combining pulse power supplies of different frequencies to form a composite frequency waveform.

[0011] Preferably, the pulse width modulation superposition is used for spatial distribution control of energy density by independently controlling the pulse width of each module.

[0012] Preferably, the pulse power supply consists of a controller, a switch S1, a DC power module DC1, a DC power module DC2, and a pulse power module SP1, and the controller is electrically connected to the DC power module DC1, the DC power module DC2, and the pulse power module SP1.

[0013] Preferably, the controller is electrically connected to switch S1, one end of which is connected to the positive terminal of DC power module DC2, and the other end of which is connected to the output line of the overall pulse power supply. The controller controls whether DC power module DC2 is connected to the circuit through switch S1.

[0014] Preferably, the output terminal of the pulse power supply is composed of the positive terminal of DC power module DC1 and the positive terminal of pulse power module SP1 directly connected together, and the positive terminal of DC power module DC2 is connected to the output terminal through switch S1, thus forming the output of the pulse power supply. The output terminal of the pulse power supply is electrically connected to one end of the furnace body.

[0015] Preferably, the negative terminals of the DC power module DC2, DC power module DC1, and pulse power module SP1 are interconnected to form a common negative terminal line, which is then connected to the other end of the furnace body, thereby forming a complete current loop so that the pulse power supply can power the furnace body.

[0016] Preferably, the DC power module DC1 provides a DC current A0 to stabilize the arc, the DC power module DC2 outputs a pulse current with an amplitude of A1 through switch S1, and the pulse power module SP1 outputs a pulse current with an amplitude of A2.

[0017] Working principle: First, the controller can coordinate and control the operation of each module according to the output requirements of the overall pulse power supply. At the output end of the pulse power supply, the positive terminals of DC power module DC1 and pulse power module SP1 directly provide power to the output. The positive terminal of DC power module DC2 is connected to the output terminal through switch S1. When switch S1 is closed, the positive terminal of DC power module DC2 is connected to the output terminal and participates in the power output. When switch S1 is open, it does not participate, thus realizing flexible power output regulation.

[0018] DC power module DC1 provides DC current A0 to stabilize the arc. SP1 itself is a DC pulse power supply, generating a pulse current with amplitude A2 and pulse width t21. DC power module DC2 generates a pulse current with amplitude A1 through switch S1, but the pulse starts Δt later than SP2, resulting in a pulse current with pulse width t11. Figure 4 The waveform diagrams shown are the superimposed current waveforms of the three power supply modules. When neither SP1 nor DC2 outputs a pulse, the amplitude of the synthesized waveform current is A0. When DC1 and SP1 output simultaneously, the amplitude of the synthesized waveform current is A0+A2. When DC1, SP1, and DC2 output simultaneously, the amplitude of the synthesized waveform current is A0+A1+A2. This demonstrates both the temporal misalignment of pulses from different modules, reflecting phase control superposition, and the combination of different frequency pulses, exhibiting frequency mixing superposition characteristics. Furthermore, pulse width modulation superposition can be achieved through different pulse widths of each module. This represents a comprehensive superposition of phase control superposition, frequency mixing superposition, and pulse width modulation superposition. By combining different output states of each module, diverse modulation of the output current waveform can be achieved, meeting different process requirements in multi-arc ion plating. It can be applied to vacuum particle plating where short-duration peak pulses are superimposed on long pulses, controlling the ion evolution process, such as... Figure 5 The combined output waveform shown indicates that DC power module DC1 provides DC current A0, which acts as an arc stabilizer. SP1 outputs a pulse current with an amplitude of A2, and DC power module DC2 outputs a pulse current with an amplitude of A1 through switch S1. Both pulse currents have the same rising edge and pulse width, and the pulses from each module are synchronized in time, showing no phase difference. They also have the same frequency, without frequency mixing. The waveform is formed by directly adding the current amplitudes of each module, representing amplitude superposition. This is suitable for vacuum ion plating applications requiring short-duration, high-peak-current pulses and scenarios where a high ion density is generated throughout the process. Figure 6The combined output waveform diagram shown shows that DC power module DC1 provides DC current A0, which plays a role in stabilizing the arc. DC power module DC2 generates a pulse current with amplitude A1 and width t61 through switch S2. SP1 generates a pulse current with amplitude A2 and width t62. Switch S2 is used to further switch the different parameter modes of its output pulse after DC2 is connected. When SP1 and DC power module DC2 simultaneously output pulse current through switch S1, the amplitude of the synthesized waveform current is A0+A1+A2. After t62, the amplitude of the synthesized pulse current is A0+A1. This is applied to multi-arc particle plating processes where a large number of charged particles are quickly generated in the initial stage of the pulse, but not many charged particles are needed in the later stage of the pulse.

[0019] This invention provides a pulsed power supply for multi-arc ion plating. It has the following beneficial effects:

[0020] 1. This invention, by controlling the output current, output frequency, output pulse width, and output phase between each pulse power supply, can generate a rich variety of output waveforms. Through the design of combining and superimposing different waveforms from multiple modules, the pulse power supply can flexibly adjust its output characteristics. In multi-arc ion plating processes, by precisely controlling the output of each module, the generation, acceleration, and bombardment of ions can be precisely controlled, thereby optimizing the composition, structure, thickness, and performance of the film and meeting the diverse requirements of different workpieces and application scenarios for coating.

[0021] 2. In the coating process of this invention, when it is necessary to enhance the adhesion of the film layer, the controller closes the switch S1 to enable the DC power module DC2 to provide an additional DC bias voltage, thereby increasing the ion bombardment energy. When it is necessary to reduce the stress of the film layer, the switch S1 is opened to reduce the DC component. The DC bias of the composite waveform can be adjusted by connecting the DC power module DC2.

[0022] 3. This invention provides a continuous DC current through the DC power module DC1 to ensure the stability of the electric arc during multi-arc ion plating. In multi-arc ion plating, a stable electric arc is the key to ensuring the quality of the coating. The pulse power supply can precisely control the on / off state and magnitude of the current. Compared with traditional power supplies, it can reduce the fluctuation, extinction and reignition of the electric arc. For example, during long-term coating processes, it can maintain stable arc combustion and avoid problems such as uneven film thickness and composition deviation caused by unstable electric arc.

[0023] 4. This invention enables these power modules to work together, each outputting a specific current, playing different roles in the multi-arc ion plating process, and jointly ensuring the high efficiency and high quality of the coating process. Attached Figure Description

[0024] Figure 1 This is the main circuit connection diagram of the present invention;

[0025] Figure 2 This is a schematic diagram of the circuit connection of the pulse power supply module of the present invention;

[0026] Figure 3 This is a schematic diagram of the DC power supply module circuit connection of the present invention;

[0027] Figure 4 This is a schematic diagram of the first combined output waveform of the present invention;

[0028] Figure 5 This is a schematic diagram of the second combined output waveform of the present invention;

[0029] Figure 6 This is a schematic diagram of the third combined output waveform of the present invention. Detailed Implementation

[0030] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0031] Please see the appendix Figure 1 - Appendix Figure 3 This invention provides a pulse power supply for multi-arc ion plating, including a DC power supply, a DC power supply combined with a power switching device, and a low-power pulse power supply. Multiple low-power pulse power supplies are connected in parallel to form a modular multi-arc ion plating pulse plasma power supply. The low-power pulse power supply is achieved by chopping with a DC power supply combined with a power switching device, or by directly selecting a low-power pulse power supply or a combination of both.

[0032] Specifically, low-power pulse power supplies can be implemented in several ways: by using a DC power supply with power switching devices for chopping, by directly selecting a low-power pulse power supply, or by combining both. This allows for flexible configuration based on actual needs. For example, in cost-sensitive scenarios, a self-made low-power pulse power supply can be made using a DC power supply with power switching devices for chopping. For high-end coating processes with high requirements for stability and precision, a ready-made low-power pulse power supply or a combination of both can be selected to meet diverse process requirements. By connecting multiple low-power pulse power supplies in parallel to form a modular multi-arc ion plating pulse plasma power supply, power expansion can be achieved. Compared to a single power supply, it can provide greater power output to meet the needs of large-scale multi-arc ion plating equipment. At the same time, the modular design facilitates maintenance and upgrades. If a low-power pulse power supply fails, only the corresponding module needs to be replaced without affecting the operation of the entire system.

[0033] Please see the appendix Figure 1 - Appendix Figure 6The output of the low-power pulse power supply has three superposition methods: phase control superposition, frequency mixing superposition, and pulse width modulation superposition.

[0034] Specifically, the modular multi-arc ion plating pulsed plasma power supply can improve ionization rate, reduce droplets, and optimize film performance by providing a variety of waveforms.

[0035] Please see the appendix Figure 1 -Appendix Figure 6 Phase control superposition adjusts the phase difference of the output pulses of each module to superimpose waveforms with time misalignment.

[0036] Specifically, phase control superposition adjusts the phase difference of the output pulses of each module, so that different pulses are superimposed in a staggered manner on the time axis, thereby synthesizing a composite waveform with specific timing characteristics. In multi-arc ion plating, this method can reduce the "tip effect" in the film deposition process. For example, if the film is too thick at the edge of the workpiece, timing control can make ions cover the workpiece surface more evenly, improving the consistency of film thickness and composition.

[0037] Please see the appendix Figure 1 -Appendix Figure 6 Frequency mixing and superposition combines pulse power supplies of different frequencies to form a composite frequency waveform;

[0038] Specifically, by mixing and superimposing frequencies, the ion concentration during the coating process can be guaranteed, and the bombardment effect of ions on the workpiece surface can be enhanced, thereby improving the density and adhesion of the film. By combining pulse power supplies of different frequencies to form a composite frequency waveform, the energy distribution and bombardment frequency of the plasma can be controlled. Pulses of different frequencies have different effects on the ionization efficiency and ion energy of the target material. High-frequency pulses can increase plasma density, while low-frequency pulses can increase ion bombardment energy.

[0039] Please see the appendix Figure 1 -Appendix Figure 6 Pulse width modulation superposition controls the spatial distribution of energy density by independently controlling the pulse width of each module.

[0040] Specifically, by superimposing pulse width modulation, the energy density can be adjusted in segments during the same coating process. For example, wide pulse width pulses can be used to clean the oxides on the workpiece surface first, and then narrow pulse width pulses can be used to deposit a high-quality film layer, realizing integrated control of "cleaning-deposition" and improving the flexibility and adaptability of the coating process. The pulse width determines the energy release duration of a single pulse. Wide pulse width corresponds to continuous high energy input, which can enhance the sputtering and cleaning effect of ions on the workpiece surface.

[0041] Please see the appendix Figure 1The pulse power supply consists of a controller, a switch S1, a DC power supply module DC1, a DC power supply module DC2, and a pulse power supply module SP1. The controller is electrically connected to the DC power supply module DC1, the DC power supply module DC2, and the pulse power supply module SP1.

[0042] Specifically, the controller serves as the core of the power system, electrically connecting each power module to support coordinated operation, enabling precise control of its output parameters, real-time monitoring of each module's operating status, ensuring safe and stable system operation, and dynamically adjusting the output parameters of each module according to coating process requirements, such as the arc current of DC1 and the pulse frequency of SP1, to optimize plasma characteristics. The controller can control the opening and closing of switch S1 by sending electrical signals. When the pulse power supply needs to output different waveforms or power, the controller can automatically switch the on / off state of switch S1 according to preset programs or real-time feedback signals to adjust the connection status of DC power module DC2.

[0043] Please see the appendix Figure 1 The controller is electrically connected to switch S1. One end of switch S1 is connected to the positive terminal of DC power module DC2, and the other end of switch S1 is connected to the output line of the overall pulse power supply. The controller controls whether DC power module DC2 is connected to the circuit through switch S1.

[0044] Specifically, by electrically connecting the controller to the DC power module DC2, the voltage, current, and other parameters of the DC power module DC2 can be obtained to determine whether it is working properly. The controller can not only control the opening and closing of switch S1, but also adjust the output parameters of the DC power module DC2 itself. When switch S1 is closed, DC2, DC1, and SP1 output together to form a composite waveform of "DC + pulse", which is suitable for the high-energy coating stage. When switch S1 is open, only DC1 and SP1 work, outputting a pure pulse waveform or low-energy DC, which is suitable for fine deposition or workpiece preheating stages. Disconnecting S1 when high power output of DC2 is not required can reduce energy consumption and extend the service life of DC2. By controlling the opening and closing of switch S1, the DC power module DC2 can be connected when needed and disconnected when not needed, improving the flexibility of the power supply.

[0045] Please see the appendix Figure 1 The output terminal of the pulse power supply is composed of the positive terminal of DC power module DC1 and the positive terminal of pulse power module SP1 directly connected. The positive terminal of DC power module DC2 is connected to the output terminal through switch S1, thus forming the output of the pulse power supply. The output terminal of the pulse power supply is electrically connected to one end of the furnace body.

[0046] Specifically, a basic output circuit is formed by directly connecting the positive terminals of DC power module DC1 and pulse power module SP1 to the output terminals. This allows the DC component of DC power module DC1 and the pulse component of pulse power module SP1 to be directly superimposed, forming a composite output substrate of "DC + pulse". DC power module DC1 provides continuous DC current to stabilize the arc, ensuring the stability of the arc during multi-arc ion plating. Pulse power module SP1 superimposes pulse current, enhancing the ionization rate and ion bombardment energy of the plasma through high-frequency, high-amplitude pulses. The direct parallel connection of the two avoids energy loss due to circuit impedance differences, ensuring the purity of the output waveform. DC power module DC2... As a switchable auxiliary power supply, it is controlled by switch S1 to connect to the output circuit, realizing "on-demand superposition" of energy. When switch S1 is closed, DC power module DC2, DC power module DC1, and pulse power module SP1 are connected in parallel to output, increasing the total power. This is suitable for coating stages that require high energy density. When switch S1 is open, only DC power module DC1 and pulse power module SP1 work, reducing energy output. This is suitable for thin film finishing or low-power processes. Current flows into the furnace through the output terminal and excites the target atoms under the action of the electric field, converting electrical energy into plasma energy to drive the coating process. The low impedance design of the circuit can reduce voltage drop and ensure ionization efficiency.

[0047] Please see the appendix Figure 1 The negative terminals of DC power module DC2, DC power module DC1, and pulse power module SP1 are interconnected to form a common negative terminal line, which is then connected to the other end of the furnace body, thus forming a complete current loop that enables the pulse power supply to power the furnace body.

[0048] Specifically, by interconnecting the negative terminals of DC power modules DC2, DC1, and SP1 to form a common negative circuit, and connecting it to the other end of the furnace body, and cooperating with the positive terminals of each power module connected to one end of the furnace body, a complete circuit can be formed, allowing the current to start from the positive terminal of the power supply, pass through the furnace body, and return to the power supply via the common negative circuit, thus meeting the basic circuit requirements for the pulse power supply to power the furnace body.

[0049] Please see the appendix Figure 1 -Appendix Figure 6 DC power module DC1 provides DC current A0, which plays a role in stabilizing the arc. DC power module DC2 outputs a pulse current with an amplitude of A1 through switch S1. Pulse power module SP1 outputs a pulse current with an amplitude of A2.

[0050] Specifically, in some equipment that requires the generation of an electric arc, such as welding equipment or plasma equipment, a stable electric arc is the key to ensuring the normal operation of the equipment. After the DC current A0 is output from the DC power module DC1, it can provide a stable energy source for the electric arc. The DC current A0 output by the DC power module DC1 serves as the "arc stabilizing current" and must maintain the ionization state and energy balance of the electric arc at all times. By controlling the on / off state of DC2 through switch S1, a pulse current with an amplitude of A1 can be superimposed on the power output as needed. When enhanced ion bombardment energy and improved film density are required, switch S1 is closed to activate DC2. During stages where film growth rate requirements are lower, switch S1 is opened to reduce energy input, thus achieving dynamic control of the deposition process. The pulsed current A2 generates a high-frequency pulsed electric field. Under this field, target atoms are more easily ionized to form plasma, increasing plasma density and activity, providing a sufficient ion source for deposition, and ensuring deposition efficiency. By adjusting parameters such as the amplitude, frequency, and pulse width of A2, the ion energy and deposition rate can be precisely controlled, achieving fine control over film thickness, composition, structure, and surface morphology. For example, changing the pulse frequency can adjust the ion bombardment interval, thus affecting the film growth mode; adjusting the amplitude can control the ion bombardment energy, affecting properties such as film hardness and wear resistance.

[0051] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A pulse power supply for multi-arc ion plating, comprising a DC power supply, a DC power supply coupled with power switching devices, and a low-power pulse power supply, characterized in that: Multiple low-power pulse power supplies are connected in parallel to form a modular multi-arc ion plating pulse plasma power supply. The low-power pulse power supply is achieved by using a DC power supply with a power switching device for chopping, or by directly selecting a low-power pulse power supply or a combination of both.

2. The pulse power supply for multi-arc ion plating according to claim 1, characterized in that: The output of the low-power pulse power supply has three superposition methods: phase control superposition, frequency mixing superposition, and pulse width modulation superposition.

3. The pulse power supply for multi-arc ion plating according to claim 2, characterized in that: The phase control superposition adjusts the phase difference of the output pulses of each module to achieve time-displacement superposition of waveforms.

4. A pulse power supply for multi-arc ion plating according to claim 2, characterized in that: The frequency mixing and superposition combines pulse power supplies of different frequencies to form a composite frequency waveform.

5. A pulse power supply for multi-arc ion plating according to claim 2, characterized in that: The pulse width modulation superposition uses independent control of the pulse width of each module to control the spatial distribution of energy density.

6. A pulse power supply for multi-arc ion plating according to claim 1, characterized in that: The pulse power supply consists of a controller, a switch S1, a DC power supply module DC1, a DC power supply module DC2, and a pulse power supply module SP1. The controller is electrically connected to the DC power supply module DC1, the DC power supply module DC2, and the pulse power supply module SP1.

7. A pulse power supply for multi-arc ion plating according to claim 6, characterized in that: The controller is electrically connected to switch S1. One end of switch S1 is connected to the positive terminal of DC power module DC2, and the other end of switch S1 is connected to the output line of the overall pulse power supply. The controller controls whether DC power module DC2 is connected to the circuit through switch S1.

8. A pulse power supply for multi-arc ion plating according to claim 1, characterized in that: The output terminal of the pulse power supply is composed of the positive terminals of DC power module DC1 and pulse power module SP1 directly connected together. The positive terminal of DC power module DC2 is connected to the output terminal through switch S1, thus forming the output of the pulse power supply. The output terminal of the pulse power supply is electrically connected to one end of the furnace body.

9. A pulse power supply for multi-arc ion plating according to claim 1, characterized in that: The negative terminals of the DC power module DC2, DC power module DC1, and pulse power module SP1 are interconnected to form a common negative terminal line, which is then connected to the other end of the furnace body, thus forming a complete current loop that enables the pulse power supply to power the furnace body.

10. A pulse power supply for multi-arc ion plating according to claim 1, characterized in that: The DC power supply module DC1 provides DC current A0 to stabilize the arc. The DC power supply module DC2 outputs a pulse current with an amplitude of A1 through switch S1. The pulse power supply module SP1 outputs a pulse current with an amplitude of A2.

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