Salient point packaging substrate positioning correction method

Abstract

The invention relates to a salient point packaging substrate positioning correction method, which comprises the following steps that a substrate is placed in a track of a packaging lower mold, and the packaging lower mold is provided with a front limiting block and a rear positioning stop block; a thrust jig is used for pushing the base plate in the first horizontal direction, the thrust jig comprises a supporting block, a material pushing block and a handle, the material pushing block and the handle are fixedly installed on the supporting block, when the base plate is pushed, the supporting block abuts against the limiting block, an in-place signal is sent, and at the moment, the base plate abuts against the positioning check block; and the base plate is shifted in the second horizontal direction through a shifting rod jig, so that the base plate abuts against the inner wall of the track, accurate positioning of the base plate is completed, and the first horizontal direction is perpendicular to the second horizontal direction. According to the correction method, the shifting rod jig is matched with the thrust jig, so that the substrate can be accurately positioned in two mutually perpendicular horizontal directions, and accurate positioning of the substrate is ensured.

Description

Technical Field

[0001] This application relates to circuit board packaging technology, specifically to a substrate positioning and correction method for bump packaging. Background Technology

[0002] In bump packaging, the surface of the package has a hemispherical bump, beneath which is a pressure sensing chip. During application, the bump absorbs pressure and then transmits it to the chip, requiring strict control over the bump's position. However, current methods still utilize conventional molding compounds. These molds, used for packages that don't require bumps, exhibit significant bump deviations in bump packaging, resulting in a yield of only about 20%, causing substantial waste and significantly reducing production efficiency. Therefore, a substrate correction method is urgently needed to achieve precise bump positioning in packaging. Summary of the Invention

[0003] To overcome the above-mentioned defects, this application provides a substrate positioning and correction method for bump packaging. In this correction method, the cooperation of a lever fixture and a push fixture is used to enable the substrate to be accurately positioned in two mutually perpendicular horizontal directions, ensuring accurate substrate positioning and thus achieving precise packaging of bump positions.

[0004] The technical solution adopted by this application to solve its technical problem is:

[0005] A method for positioning and correcting a substrate in a bump package includes the following steps:

[0006] Substrate placement: The substrate is placed into the track of the lower packaging mold, which is provided with a front limiting block and a rear positioning block.

[0007] Pushing the substrate: The substrate is pushed along the first horizontal direction using a thrust fixture. The thrust fixture includes a support block, a pusher block and a handle fixedly installed on the support block. When pushing the substrate, the support block abuts against the limit block as a positioning signal. At this time, the substrate abuts against the positioning block.

[0008] Moving the substrate: Using a lever fixture, the substrate is moved along the second horizontal direction to make it abut against the inner wall of the track, thereby completing the precise positioning of the substrate. The first horizontal direction and the second horizontal direction are perpendicular to each other.

[0009] Optionally, after the substrate is moved by the lever fixture, the substrate is then pressed tightly by the thrust fixture and held for 2-3 seconds.

[0010] Optionally, the pushing fixture further includes an adjusting block, the support block is provided with a limiting groove and an installation groove, the limiting groove is used to abut against the limiting block, the pushing block is fixedly installed in the installation groove, the adjusting block is fixedly connected to the pushing block, and the adjusting block can adjust the position of the pushing block;

[0011] During operation, the operator holds the handle and uses the pusher block to push the substrate until the substrate abuts against the positioning block, and the protrusion on the limiting block inserts into the limiting groove and abuts against the support block.

[0012] Optionally, the upper surface of the support block is provided with two mounting grooves, each of which has a first threaded hole. The pusher block is installed in the mounting groove and locked in the first threaded hole by a fixing screw, so as to fix the pusher block and the support block together.

[0013] Optionally, the handle is sleeved on the steel column, and a second threaded hole is opened on the support block, with the portion of the steel column extending out of the handle screwed into the second threaded hole.

[0014] Optionally, the upper surface of the pusher block is provided with a recessed portion, and the bottom surface of the recessed portion is provided with an elongated oval mounting hole. The pusher block is locked to the support block by a fixing screw, and the fixing screw passes through the mounting hole and is locked in the first threaded hole.

[0015] Optionally, a clearance groove is formed on the lower surface of the pusher block, the adjusting block is fixed to the first end of the pusher block, and the second end of the pusher block is reduced in size to form a head.

[0016] Optionally, the adjusting block has a fixing hole and an adjusting hole. The fixing screw passes through the fixing hole to fix the adjusting block to the first end of the pusher block. The adjusting hole is provided with an adjusting bolt, which abuts against the support block.

[0017] Optionally, the lever fixture includes a lever and a dial head fixedly installed on the lever. A lever sleeve is fixedly sleeved on the lever. During operation, the operator holds the lever sleeve and uses the dial head to move the base plate.

[0018] Optionally, the support block, the pusher block, the adjusting block, and the lever are all made of brass, the handle and the lever sleeve are both made of plastic, and the lever is made of aluminum.

[0019] The beneficial effects of this application are as follows: This substrate positioning and correction method uses a push jig and a lever jig to adjust the position of the substrate. First, the push block in the push jig pushes the substrate along the first horizontal direction to adjust its position until the limiting block abuts against the support block and the substrate abuts against the positioning stop. Then, the lever jig moves the substrate along the second horizontal direction so that the substrate abuts against the inner wall of the track. The first horizontal direction and the second horizontal direction are perpendicular to each other, thereby completing the precise positioning of the substrate. Since the substrate is positioned based on the hard collision between the limiting block and the support block during the action of the push jig, the positioning is more accurate and avoids the mold blockage caused by insufficient push. By using the cooperation of the lever jig and the push jig, the substrate can be accurately positioned in two mutually perpendicular horizontal directions, further improving the positioning accuracy. Therefore, this substrate positioning and correction method can ensure accurate substrate positioning, thereby achieving precise packaging of the bump position. Attached Figure Description

[0020] Figure 1 This is one of the structural schematic diagrams of the thrust fixture in this application;

[0021] Figure 2 This is the second structural schematic diagram of the thrust fixture in this application;

[0022] Figure 3 This is the third schematic diagram of the thrust fixture in this application;

[0023] Figure 4 This is an assembly diagram of the pusher block and adjusting block in this application;

[0024] Figure 5 This is one of the structural schematic diagrams of the support block in this application;

[0025] Figure 6 This is the second structural schematic diagram of the support block in this application;

[0026] Figure 7 This is one of the structural schematic diagrams of the pusher block in this application;

[0027] Figure 8 This is the second schematic diagram of the pusher block in this application;

[0028] Figure 9 This is a schematic diagram of the structure of the adjustment block in this application;

[0029] Figure 10 This is a schematic diagram of the handle structure in this application;

[0030] Figure 11 This is a schematic diagram of the lever fixture in this application;

[0031] In the diagram: 100-Thrust jig, 110-Support block, 111-Limiting groove, 112-Mounting groove, 113-First threaded hole, 114-Second threaded hole, 120-Push block, 121-Recessed part, 122-Mounting hole, 123-Leaning groove, 124-Head, 130-Adjusting block, 131-Fixing hole, 132-Adjusting hole, 140-Adjusting bolt, 150-Handle, 151-Steel column, 152-External thread, 160-Fixing screw, 200-Toggle jig, 210-Toggle lever, 220-Toggle head, 230-Toggle lever sleeve. Detailed Implementation

[0032] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the embodiments of this application. Obviously, the embodiments described in this application are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0033] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such uses of the terms can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0034] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0035] like Figure 1-11 As shown, a method for positioning and correcting a substrate in a bump package includes the following steps:

[0036] Substrate placement: The substrate is placed into the track of the lower packaging mold, which is provided with a front limiting block and a rear positioning block.

[0037] Pushing the substrate: The substrate is pushed along the first horizontal direction using a thrust fixture 100. The thrust fixture 100 includes a support block 110, a pusher block 120 and a handle 150 fixedly installed on the support block 110. When pushing the substrate, the support block 110 abuts against the limit block as a positioning signal, and at this time the substrate abuts against the positioning block.

[0038] Moving the substrate: Using the lever fixture 200, the substrate is moved along the second horizontal direction, so that the substrate abuts against the inner wall of the track, thereby completing the precise positioning of the substrate, wherein the first horizontal direction and the second horizontal direction are perpendicular to each other.

[0039] The surface of the substrate is rectangular. The first horizontal direction is defined as the length direction of the substrate, and the second horizontal direction is the width direction of the substrate. When the push fixture 100 pushes the substrate, it moves the substrate along the length direction until one of the short sides of the substrate abuts against the positioning block. When the lever fixture 200 moves the substrate, it moves the substrate along the width direction until one of the long sides of the substrate abuts against the inner side of the track, thereby accurately positioning the substrate.

[0040] In current products, the accuracy requirements for bump placement are extremely stringent. Experiments show that the center of the bump must be within 100μm of the package center. The bumps are formed directly by the molding die during the molding process. The molding die uses the customer's product substrate. In one possible implementation, the substrate is 189mm long and 68mm wide. This substrate is molded into two blocks at once, each block having 27*40 units, resulting in 2160 packages per substrate after a single molding process. The bumps of each package must be within 100μm of the center of each unit.

[0041] The encapsulation mold includes an upper encapsulation mold and a lower encapsulation mold. The substrate is placed in the lower encapsulation mold. The substrate has three positioning holes. The upper encapsulation mold is machined with concave and convex points. The upper encapsulation mold is equipped with three positioning pins accordingly. The lower encapsulation mold has a planar structure. During the molding process, the lower encapsulation mold firmly holds the substrate. After the mold is closed, the molding material melts and is squeezed into the mold cavity, finally forming the encapsulated body.

[0042] The current lamination process includes the following steps:

[0043] The substrate is placed into the molding die; a rod-type pusher pushes the substrate in; the substrate stops when it contacts the positioning block of the lower die; the mold is closed and a vacuum is drawn to firmly hold the substrate in place; during the mold closing process, positioning pins are inserted into the edge holes of the substrate; after the positioning pins correct the substrate, the molding die is filled with molding die as the molding die is pushed in; after thermosetting, a certain pressure is maintained to allow the thermosetting molding die to cure; the mold is opened and the sealed substrate block product is taken out; after curing, each unit is laser-printed; and a fully automatic product cutting machine is used to cut out individual product units.

[0044] The accuracy of substrate positioning plays a crucial role in the placement of the bumps. Currently, during the positioning process, a rod-type pusher pushes the substrate until it abuts against the positioning stop as a positioning signal. However, because the substrate softens at high temperatures, it is difficult for operators to determine whether the substrate is in place. In actual operation, relying solely on the operator's feel for the pusher and the pushing force often results in the substrate popping out or not being pushed into place due to substrate deviation, substrate elasticity, and the smoothness of the guide rail. This frequently leads to mold blockage during molding, requiring mold disassembly and cleaning, significantly reducing efficiency and affecting yield.

[0045] This substrate positioning and correction method utilizes a push jig and a lever jig to adjust the substrate's position. First, the pusher block 120 in the push jig 100 pushes the substrate along the first horizontal direction to adjust its position until the limiting block abuts against the support block 110 and the substrate abuts against the positioning stop. Then, the lever jig 200 moves the substrate along the second horizontal direction, causing the substrate to abut against the inner wall of the track. The first and second horizontal directions are perpendicular to each other, thus completing the precise positioning of the substrate. Since the substrate's positioning is determined by the hard impact of the limiting block against the support block 10 during the operation of the push jig 100, the positioning is more accurate, avoiding mold blockage caused by insufficient push. The cooperation between the lever jig 200 and the push jig 100 enables the substrate to be precisely positioned in two mutually perpendicular horizontal directions, further improving the positioning accuracy. Therefore, this substrate positioning and correction method can ensure accurate substrate positioning, thereby achieving precise packaging of the bump positions.

[0046] After the substrate is moved by the lever fixture 200, the substrate is then pressed tightly by the push fixture 100 and held for 2-3 seconds. This allows the substrate to fully heat and expand, preventing it from shifting during subsequent mold closing and ensuring the stability of the basic positioning.

[0047] like Figure 1-5As shown, the pushing fixture 100 also includes an adjusting block 130. The support block 110 is provided with a limiting groove 111 and a mounting groove 112. The limiting groove 111 is used to abut against the limiting block. The pushing block 120 is fixedly installed in the mounting groove 112. The adjusting block 130 is fixedly connected to the pushing block 120, and the adjusting block 130 can adjust the position of the pushing block 120.

[0048] During operation, the operator holds the handle 150 and uses the pusher block 120 to push the substrate until the substrate abuts against the positioning block, and the protrusion on the limiting block inserts into the limiting groove 111 and abuts against the support block 110.

[0049] The support block 110 is used to support the pusher block 120 and the handle 150. The handle 150 is made of heat-insulating material to ensure the safety of the operator. The adjustment block 130 is used to adjust the position of the pusher block 120 on the support block 110 so that when the substrate is pushed into place, the protrusion on the limiting block just inserts into the limiting groove 111 of the support block 110 and abuts against the side wall of the support block 110. During operation, the operator holds the handle 150, places the pusher fixture in the preset position of the packaging mold, and then pushes the pusher fixture. The pusher block 120 pushes the substrate directly into place, that is, the substrate abuts against the positioning block on the packaging mold. At the same time, the protrusion on the limiting block inserts into the limiting groove 111 and abuts against the support block 110. Therefore, in this application, the substrate positioning is determined by the hard collision of the limiting block against the support block 110. Compared with the traditional method of judging the substrate positioning by the feeling of the substrate hitting the positioning block, the substrate positioning in this application is more accurate and avoids the mold blockage caused by insufficient pusher placement, thereby achieving precise packaging of the protrusion position.

[0050] In this application, the width of the limiting groove 111 on the support block 110 is referenced to the size of the protrusion on the limiting block, and the position and size of the limiting groove 111 and the limiting block are designed with consideration for the ease of operation during manual alignment.

[0051] like Figure 5-6 As shown, the upper surface of the support block 110 is provided with two mounting grooves 112, each of which has a first threaded hole 113. The pusher block 120 is installed in the mounting groove 112 and locked in the first threaded hole 113 by a fixing screw 160, thereby fixing the pusher block 120 to the support block 110. Optionally, the width of the pusher block 120 is equal to the width of the mounting groove 112; or the width of the pusher block 120 is slightly smaller than the width of the mounting groove 112. This ensures that the pusher block 120 will not wobble left and right on the support block 110. Installing two pusher blocks 120 on the support block 110, i.e., adopting a double-arm structure, improves the stability of pushing the substrate and prevents the substrate from being pushed off-center.

[0052] like Figure 10 As shown, the handle 150 is sleeved on the steel column 151. A second threaded hole 114 is formed on the support block 110, and the portion of the steel column 151 extending beyond the handle 150 is screwed into the second threaded hole 114. The outer surface of the portion of the steel column 151 extending beyond the handle 150 is provided with an external thread 152, which mates with the second threaded hole 114 to mount the handle 150 onto the support block 110. Optionally, the steel column 151 is a columnar or polyhedral structure. Figure 5-6 As shown, the limiting groove 111 and the second threaded hole 114 are respectively located on two oppositely arranged sidewalls of the support block 110.

[0053] like Figure 1 , Figure 5-8 As shown, the upper surface of the pusher block 120 is provided with a recessed portion 121, and the bottom surface of the recessed portion 121 has an elongated oval mounting hole 122. The pusher block 120 is locked to the support block 110 by a fixing screw 160, which passes through the mounting hole 122 and is locked in the first threaded hole 113. The elongated oval mounting hole 122 allows for convenient adjustment of the pusher block 120's front-to-back position to accommodate minor changes in the front-to-back position of the substrate, or to meet the fixing requirements of substrates of different sizes.

[0054] like Figure 4 , Figure 7-8 As shown, a clearance groove 123 is formed on the lower surface of the pusher block 120. The adjusting block 130 is fixed to the first end of the pusher block 120, and the second end of the pusher block 120 is reduced in size to form a head 124. The clearance groove 123 on the pusher block 120 ensures that both ends of the pusher block 120 directly contact the mold, preventing the pusher block 120 from warping backwards on the mold, thus preventing it from failing to contact the thin substrate. The narrowed head of the pusher block 120 prevents the substrate from becoming non-perpendicular to the guide rail due to angular wobbling. Optionally, the pusher block 120 is made of brass with a thickness and width of 10mm. This ensures that it will not deform over long-term use and that the weight of the pusher fixture is not too heavy, facilitating operator use.

[0055] like Figure 4 and Figure 9As shown, the adjusting block 130 has a fixing hole 131 and an adjusting hole 132. The fixing screw 160 passes through the fixing hole 131 to fix the adjusting block 130 to the first end of the pusher block 120. The adjusting hole 132 is provided with an adjusting bolt 140, which abuts against the support block 110. The adjusting block 130 is fixed to the pusher block 120 by the fixing screw 160, and the adjusting bolt 140 is used to adjust the position of the pusher block 120. Initially, the substrate is abutted against the positioning block on the packaging mold, the pushing fixture is placed in the guide rail of the packaging mold, and the limiting block abuts against the support block 110. Then, the fixing screw 160 connecting the pusher block 120 to the support block 110 is loosened, and the adjusting bolt 140 is rotated to finely adjust the front and rear position of the pusher block 120 so that the head 124 of the pusher block 120 abuts against the substrate. In this way, when pushing a substrate of the same size again, the limiting block abuts against the support block 110 as a positioning signal, which facilitates control and enables the substrate to be pushed all the way to the bottom.

[0056] like Figure 11 As shown, the lever fixture 200 includes a lever 210 and a lever head 220 fixedly mounted on the lever 210. A lever sleeve 230 is fixedly sleeved on the lever 210. During operation, the operator holds the lever sleeve 230 and uses the lever head 220 to move the base plate. Optionally, two lever heads 220 are fixedly mounted on the lever 210. To ensure that the base plate smoothly enters the track, a small gap is maintained between the long side of the base plate and the inner wall of the track. To ensure that the three positioning holes and positioning pins on the base plate are accurately positioned and to prevent the positioning pins from piercing the base plate, the lever fixture moves the base plate so that one long side of the base plate abuts against the inside of the track, thus further improving the positioning accuracy. Equipping the base plate with two lever heads 220 to move it at two points can avoid the base plate rotating when moved at a single point.

[0057] Optionally, the support block 110, the pusher block 120, the adjusting block 130, and the lever 210 are all made of brass, while the handle 150 and the lever sleeve 230 are made of plastic, and the lever 210 is made of aluminum. This satisfies the strength and durability requirements of the thrust fixture 100, preventing scratches on the mold, while minimizing the weight of the thrust fixture for ease of use by operators. Furthermore, the handle 150 and the lever sleeve 230 are both made of phenolic resin, also known as bakelite, an early type of plastic formed by hot pressing phenolic resin and wood powder. It has excellent insulation properties, can withstand voltages up to 10kV / mm, is heat-resistant, has good mechanical strength, and is typically brownish-black in color.

[0058] The handle 150 is made of high-temperature resistant plastic, with an M10 stainless steel column 151 passing through the middle. On the one hand, the high-temperature resistant plastic can withstand the high temperature of 175 degrees Celsius of the mold, so that direct heat transfer caused by direct contact with the stainless steel will not affect the operator's operation. On the other hand, the M10 stainless steel column 151 is strong enough to prevent the handle from falling or dropping during operation and causing damage.

[0059] The dial 220 is made of brass to avoid excessive wear when in contact with the mold, without damaging the mold.

[0060] Example 1: A method for positioning and correcting a substrate in a bump package, comprising the following steps:

[0061] Step 1: Place the substrate: Place the substrate into the track of the lower packaging mold, which is provided with a front limiting block and a rear positioning block.

[0062] Step 2: Pushing the substrate: The operator holds the handle 150 and places the pusher 100 in the preset position of the lower packaging mold. Then, the pusher 100 is pushed and the substrate is moved along the first horizontal direction, i.e. the X-axis direction, by the pusher block 20 and pushed directly into place. That is, the substrate abuts against the positioning block on the packaging mold, and at the same time, the limiting block abuts against the support block 10.

[0063] Step 3: Move the base plate: The operator holds the lever sleeve 230 and uses the lever head 220 to move the base plate, so that the base plate moves along the second horizontal direction, i.e. the Y-axis direction, and the base plate abuts against the inner wall of the track.

[0064] Step 4: Use the push block of the push jig 100 to push the substrate again and hold for 2-3 seconds to complete the precise positioning of the substrate.

[0065] It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the scope of protection of this application. Therefore, the scope of protection of this patent application shall be determined by the appended claims.

Claims

1. A method for positioning and correcting a substrate in a bump-packaged assembly, characterized in that: Includes the following steps: Substrate placement: The substrate is placed into the track of the lower packaging mold, which is provided with a front limiting block and a rear positioning block. Pushing the substrate: The substrate is pushed along the first horizontal direction using a thrust jig (100). The thrust jig (100) includes a support block (110) and a pusher block (120) and a handle (150) fixedly installed on the support block (110). When pushing the substrate, the support block (110) abuts against the limit block as a positioning signal. At this time, the substrate abuts against the positioning block. Moving the substrate: Using a lever fixture (200), the substrate is moved along the second horizontal direction to make the substrate abut against the inner wall of the track, thereby completing the precise positioning of the substrate, wherein the first horizontal direction and the second horizontal direction are perpendicular to each other.

2. The substrate positioning and correction method for bump packaging according to claim 1, characterized in that: After the substrate is moved by the lever fixture (200), the substrate is then pressed tightly by the thrust fixture (100) and held for 2-3 seconds.

3. The substrate positioning and correction method for bump packaging according to claim 1, characterized in that: The pusher fixture (100) further includes an adjusting block (130). The support block (110) is provided with a limiting groove (111) and an installation groove (112). The limiting groove (111) is used to abut against the limiting block. The pusher block (120) is fixedly installed in the installation groove (112). The adjusting block (130) is fixedly connected to the pusher block (120), and the adjusting block (130) can adjust the position of the pusher block (120). During operation, the operator holds the handle (150) and uses the push block (120) to push the substrate until the substrate abuts against the positioning block, and the protrusion on the limiting block inserts into the limiting groove (111) and abuts against the support block (110).

4. The substrate positioning and correction method for bump packaging according to claim 3, characterized in that: The upper surface of the support block (110) is provided with two mounting grooves (112), and each mounting groove (112) is provided with a first threaded hole (113). The pusher block (120) is installed in the mounting groove (112) and locked in the first threaded hole (113) by a fixing screw (160) to fix the pusher block (120) and the support block (110).

5. The substrate positioning and correction method for bump packaging according to claim 3, characterized in that: The handle (150) is sleeved on the steel column (151), and a second threaded hole (114) is opened on the support block (110). The part of the steel column (151) extending out of the handle (150) is screwed into the second threaded hole (114).

6. The substrate positioning and correction method for bump packaging according to claim 3, characterized in that: The upper surface of the pusher block (120) is provided with a recess (121), and the bottom surface of the recess (121) is provided with an elongated mounting hole (122). The pusher block (120) is locked to the support block (110) by a fixing screw (160). The fixing screw (160) passes through the mounting hole (122) and is locked in the first threaded hole (113).

7. The substrate positioning and correction method for bump packaging according to claim 3, characterized in that: The lower surface of the pusher block (120) has a clearance groove (123), the adjusting block (130) is fixed to the first end of the pusher block (120), and the second end of the pusher block (120) is reduced in size to form a head (124).

8. The substrate positioning and correction method for bump packaging according to claim 3, characterized in that: The adjusting block (130) has a fixing hole (131) and an adjusting hole (132). The fixing screw (160) passes through the fixing hole (131) to fix the adjusting block (130) to the first end of the pusher block (120). The adjusting hole (132) is provided with an adjusting bolt (140), which abuts against the support block (110).

9. The substrate positioning and correction method for bump packaging according to claim 3, characterized in that: The lever fixture (200) includes a lever (210) and a dial head (220) fixedly installed on the lever (210). A lever sleeve (230) is fixedly sleeved on the lever (210). During operation, the operator holds the lever sleeve (230) and uses the dial head (220) to move the base plate.

10. The substrate positioning and correction method for bump packaging according to claim 9, characterized in that: The support block (110), the pusher block (120), the adjusting block (130) and the lever (210) are all made of brass, the handle (150) and the lever sleeve (230) are both made of plastic, and the lever (210) is made of aluminum.

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