High-precision IC die bonder and die bonding method thereof

Abstract

The application relates to the technical field of die bonder, in particular to a high-precision IC die bonder and a die bonding method thereof, which comprises a die bonder body, a die bonding swing arm mechanism installed on the die bonder body, a suction nozzle installed on the die bonding swing arm mechanism, a point glue mechanism installed on the die bonder body and a conveying table, wherein the conveying table is installed on the die bonder body; a supporting frame is arranged on the conveying table for conveying the substrate, a positioning mechanism is arranged on the supporting frame, a pushing mechanism is arranged on the die bonding swing arm mechanism, the pushing mechanism is matched with the positioning mechanism, the chip is placed on the die bonding position on the substrate at the suction nozzle of the die bonding swing arm mechanism, the positioning and auxiliary pressing of the chip can be realized, the non-parallel state of the chip and the substrate caused by adhesion can be prevented, the die bonding precision is further ensured, and the problems of uneven bonding strength, poor electrical contact or optical performance decline are effectively solved.

Description

Technical Field

[0001] This invention relates to the field of die bonder technology, specifically to a high-precision IC die bonder and its die bonding method. Background Technology

[0002] IC die bonders are key equipment in the semiconductor packaging process. Their core function is to precisely pick up the diced chips from the wafer and attach them to designated positions on a substrate (such as lead frames, PCBs, etc.). Mechanical fixation and electrical connection between the chip and the substrate are achieved through processes such as silver paste, eutectic bonding, or flip-chip bonding. This step directly affects the yield, performance, and reliability of chip packaging.

[0003] Existing IC die bonders often suffer from slight tilting of the contact surface between the nozzle and the chip during the die bonding process due to the small surface area and thinness of the chip. This causes the chip to deviate from its parallel state when picked up. Furthermore, as the positioning error of the die bonder's motion axes (such as X / Y / Z / θ axes) accumulates, the chip is not parallel to the substrate when placed, which further leads to uneven chip bonding strength, poor electrical contact, or degraded optical performance. To address these issues, we propose a high-precision IC die bonder and its die bonding method. Summary of the Invention

[0004] The purpose of this invention is to provide a high-precision IC die bonder and its die bonding method to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a high-precision IC die bonder, comprising a die bonder body, a die bonder arm mechanism mounted on the die bonder body, a nozzle mounted on the die bonder arm mechanism, a dispensing mechanism mounted on the die bonder body, and a transfer table. The transfer table is mounted on the die bonder body and is used to transfer substrates. A support frame is provided on the outside of the transfer table, and a lifting mechanism for connecting the support frame is mounted on the die bonder body.

[0006] The conveyor is provided with a first moving block and a second moving block above it, and the support frame is provided with a moving part for driving the first moving block and the second moving block.

[0007] An alignment mechanism is provided between the first moving block and the second moving block. A pushing mechanism is provided at the bottom of the die bonding arm mechanism and outside the nozzle. The pushing mechanism and the alignment mechanism cooperate with each other to stick the chip to the substrate in a parallel state.

[0008] Furthermore, the lifting mechanism includes an electric push rod, which is fixedly mounted on the die bonder body, and the output end of the electric push rod is fixedly connected to a support frame, which is U-shaped.

[0009] Further, the alignment mechanism comprises a gas guide frame, an alignment shell, an alignment piece and a gas guide piece, the gas guide frame is fixedly installed at the top between the first moving block and the second moving block, and the gas guide frame is in a meandering shape;

[0010] The alignment shell is provided with four alignment shells, and the four alignment shells are fixedly installed at the bottom of the gas guide frame, and the four alignment shells are located around the chip;

[0011] The alignment piece is installed on the alignment shell, and a plurality of alignment pieces are used to align the adhered chip;

[0012] The gas guide piece is arranged between the four alignment shells and the gas guide frame.

[0013] Further, the alignment piece comprises a moving inclined block, a pushing piece, a connecting piece, a pushing block, a contact sliding sleeve and a pressing piece, the alignment shell is a hollow cavity, and the side of the alignment shell close to the chip is provided with a pushing port, the moving inclined block is slidingly connected at the hollow cavity, the pushing piece is arranged on the alignment shell, and the pushing block pushes the moving inclined block through the pushing mechanism;

[0014] The connecting piece is arranged at the top of one end of the moving inclined block, and the connecting piece is connected with the alignment shell, the pushing block slidingly penetrates the pushing port, and the pushing block is fixedly connected with the moving inclined block, the contact sliding sleeve is located outside the pushing port, and the contact sliding sleeve slidingly covers the outside of the pushing block, and the contact sliding sleeve and the pushing block are provided with a buffer piece therebetween;

[0015] The pressing piece is arranged on the moving inclined block, and the alignment piece is provided to adjust the chip.

[0016] Further, the pushing piece comprises a contact inclined block, a pushing rod, a pushing plate and a pushing spring, the contact inclined block is located in the alignment shell, a plurality of pushing rods are provided, the plurality of pushing rods slidingly penetrate the top of the alignment shell, one end of the plurality of pushing rods is fixedly connected with the contact inclined block, and the other end of the plurality of pushing rods is fixedly connected with the pushing plate, the pushing spring covers the outside of the pushing rod, and the two ends of the pushing spring are fixedly connected with the pushing plate and the alignment shell respectively, and the pushing piece is provided to push the moving inclined block.

[0017] Further, the pushing mechanism comprises a fixed frame and a pressing plate, the fixed frame is fixedly installed on the die bonding swing arm mechanism, and the fixed frame is located above the suction nozzle, the pressing plate is provided with four pressing plates, the four pressing plates are fixedly installed on the fixed frame, and the pressing plate is used to press and push the pushing plate, and the pushing mechanism is provided to simultaneously press and push the four pushing plates.

[0018] Further, the connecting piece comprises an extension plate and connecting springs, one end of the extension plate is fixedly installed at one end of the moving inclined block, a moving opening corresponding to the position of the extension plate is arranged on the counterposition shell, and the extension plate slides through the moving opening, and a plurality of the connecting springs are arranged, one end of the plurality of connecting springs is fixedly connected with the counterposition shell, and the other end of the plurality of connecting springs is fixedly connected with the extension plate, and the connecting piece is arranged, so that the moving inclined block is connected.

[0019] Further, the lower pressing piece comprises a lower pressing block, the lower pressing block is fixedly installed on one side of the moving inclined block, and the lower pressing block slides through the pushing opening, and the side of the lower pressing block close to the chip is provided with a pushing inclined surface, and the lower pressing piece is arranged, so that the chip is vertically downwardly pressed.

[0020] Further, the moving inclined block is internally provided with an air inlet cavity, and the pushing block is internally provided with an air outlet cavity, and the bottom of the contact sliding sleeve is provided with an air outlet inclined opening;

[0021] The air guide piece comprises air guide pipes arranged at four corners of the air guide frame bottom, the air guide pipes are communicated with first telescopic pipes, and one end of the first telescopic pipes is communicated with the air inlet cavity;

[0022] The second moving block is internally provided with a through hole, and the through hole is communicated with second telescopic pipes at both ends, the second moving block is further communicated with a gas supply pipe, and the gas supply pipe is communicated with the air guide frame, one end of one of the second telescopic pipes is communicated with a fixing pipe, and the fixing pipe penetrates one side of the support frame, and the other end of the fixing pipe is communicated with an external cooling gas supply device, and the air guide piece is arranged, so that the cooling speed of the glue and the chip can be accelerated during die bonding, and the stable adhesion of the chip is ensured.

[0023] A die bonding method of a high-precision IC die bonder, comprising the following steps:

[0024] Step one: the substrate is conveyed by the conveying table, and then the dispensing mechanism is used for dispensing glue on the substrate;

[0025] Step two: the substrate after dispensing glue is conveyed to the die bonding swing arm mechanism by the conveying table, the die bonding swing arm mechanism sucks the chip by the suction nozzle, and the alignment mechanism moves to the die bonding position above the substrate at the same time;

[0026] Step three: then, the die bonding swing arm mechanism vertically places the chip on the die bonding position on the substrate by the suction nozzle, and at the same time, the chip is stably and quickly adhered to the substrate by the cooperation of the pushing mechanism and the alignment mechanism.

[0027] The present application has at least the following advantages:

[0028] 1、The present application in use, by the support frame provided on the conveying table for conveying the substrate, and the support frame is provided with the alignment mechanism, at the same time, the push mechanism is provided at the flip chip swing arm mechanism, the push mechanism cooperates with the alignment mechanism, the chip is placed on the flip chip position on the substrate at the suction nozzle of the flip chip swing arm mechanism, the positioning and auxiliary pressing of the chip can be realized, the non-parallel state of the chip sticking to the substrate is prevented, the flip chip precision is further ensured, and the problems of uneven chip bonding strength, poor electrical contact or optical performance decline are effectively solved;

[0029] 2、The present application is provided with the air guide piece, so that the speed of accelerating the glue and the chip on the substrate is ensured during the flip chip, and the stable flip chip of the chip is ensured. BRIEF DESCRIPTION OF DRAWINGS

[0030] Figure 1 It is the overall structure schematic diagram of the present application;

[0031] Figure 2 It is the overall structure side view of the present application;

[0032] Figure 3 It is the overall structure side view of the present application;

[0033] Figure 4 It is the overall structure side view of the present application;

[0034] Figure 5 It is the overall structure side view of the present application;

[0035] Figure 6 It is the overall structure side view of the present application; Figure 5 It is the overall structure side view of the present application;

[0036] Figure 7 It is the overall structure side view of the present application;

[0037] Figure 8 It is the overall structure side view of the present application; Figure 7 It is the overall structure side view of the present application;

[0038] Figure 9 It is the overall structure side view of the present application;

[0039] Figure 10 It is the overall structure side view of the present application;

[0040] Figure 11 It is the overall structure side view of the present application;

[0041] Figure 12 It is the overall structure side view of the present application;

[0042] Figure 13The schematic diagram of the pushing block structure of the present application;

[0043] Figure 14 The schematic diagram of the contact sliding sleeve structure of the present application.

[0044] In the figure: 1-crystal fixing machine body; 2-crystal fixing swing arm mechanism; 21-suction nozzle; 3-dispensing mechanism; 4-conveying table; 41-first moving block; 42-second moving block; 43-heat preservation shell; 431-heating coil; 432-connection plate; 5-support frame; 6-lifting mechanism; 61-electric push rod; 7-moving piece; 8-alignment mechanism; 81-air guide frame; 82-alignment shell; 83-alignment piece; 831-moving inclined block; 8311-air inlet cavity; 832-push piece; 8321-contact inclined block; 8322-push rod; 8323-push plate; 8324-push spring; 833-connection piece; 8331-extension plate; 8332-connection spring; 834-push block; 8341-air outlet cavity; 835-contact sliding sleeve; 8351-air outlet inclined mouth; 836-pressing piece; 8361-pressing block; 8362-push inclined surface; 837-buffer piece; 8371-buffer spring; 84-air guide piece; 841-air guide pipe; 842-first telescopic pipe; 843-second telescopic pipe; 844-air supply pipe; 845-fixed pipe; 9-pushing mechanism; 91-fixed frame; 92-pressing plate. DETAILED DESCRIPTION

[0045] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present application.

[0046] Embodiment one

[0047] Please refer to Figures 1 to 3 A high-precision IC die bonder includes a die bonder body 1, a die bonder swing arm mechanism 2 installed on the die bonder body 1, a suction nozzle 21 installed on the die bonder swing arm mechanism 2, a dispensing mechanism 3 installed on the die bonder body 1, and a conveying table 4. The conveying table 4 is installed on the die bonder body 1 and is used for conveying a substrate. In this embodiment, the conveying table 4 is an existing conveying table 4, which conveys the substrate through a conveying belt thereon. Meanwhile, a guide groove is arranged on the conveying table 4 to clamp and guide the substrate during conveying, thereby ensuring the stability of the substrate conveying.

[0048] Please refer to Figures 4 to 5 A support frame 5 is arranged outside the conveying table 4, and a lifting mechanism 6 for connecting the support frame 5 is installed on the die bonder body 1.

[0049] The lifting mechanism 6 comprises an electric push rod 61 fixedly installed on the die bonding machine body 1, and the output end of the electric push rod 61 is fixedly connected with the support frame 5 which is in U shape.

[0050] In this application, the lifting mechanism 6 is arranged, that is, when the substrate is conveyed with the conveying table 4, the electric push rod 61 operates to make the support frame 5 move upward relative to the conveying table 4, so that when the next row of dispensing positions or fixed positions on the substrate are adjusted, the alignment mechanism 8 on the support frame 5 does not affect the movement of the substrate.

[0051] The conveying table 4 is provided with a first moving block 41 and a second moving block 42, and the support frame 5 is provided with a moving piece 7 for driving the first moving block 41 and the second moving block 42.

[0052] As a supplement, the moving piece 7 comprises a moving lead screw, a driving motor and a guide plate, the moving lead screw is located above the conveying table 4, and both ends of the moving lead screw are rotatably connected with the support frame 5, the first moving block 41 is threadedly sleeved outside the moving lead screw, the driving motor is fixedly installed on one side of the support frame 5, and the driving motor is used to drive the moving lead screw.

[0053] The guide plate is fixedly installed on the support frame 5, the second moving block 42 is provided with a sliding hole corresponding to the position of the guide plate, and the second moving block 42 is slidably sleeved outside the guide plate through the sliding hole.

[0054] Therefore, when the first moving block 41 and the second moving block 42 are synchronously driven, the moving lead screw is rotated by the forward and reverse rotation of the driving motor, and when the moving lead screw rotates, the driving force of the first moving block 41 is provided, and under the limiting action of the alignment mechanism 8 and the guide plate, the first moving block 41 and the second moving block 42 move horizontally and reciprocally relative to the top of the substrate.

[0055] Please refer to Figures 5 to 14 , the first moving block 41 and the second moving block 42 are provided with the alignment mechanism 8, the bottom of the die bonding swing arm mechanism 2 and the outside of the suction nozzle 21 are provided with the pushing mechanism 9, the pushing mechanism 9 cooperates with the alignment mechanism 8, and is used to adhere the chip in parallel state on the substrate.

[0056] The alignment mechanism 8 comprises a gas guide frame 81, an alignment shell 82, an alignment piece 83 and a gas guide piece 84, the gas guide frame 81 is fixedly installed on the top between the first moving block 41 and the second moving block 42, and the gas guide frame 81 is in a meandering shape.

[0057] The alignment shell 82 is provided with four, the four alignment shells 82 are fixedly installed on the bottom of the gas guide frame 81, and the four alignment shells 82 are located around the chip.

[0058] The alignment member 83 is mounted on the alignment shell 82, and a plurality of alignment members 83 align the adhered chip with each other.

[0059] The air guide member 84 is arranged between the four alignment shells 82 and the air guide frame 81.

[0060] The alignment member 83 comprises a moving inclined block 831, a pushing member 832, a connecting member 833, a pushing block 834, a contact sliding sleeve 835, and a pressing member 836. The alignment shell 82 is internally hollow, and a pushing opening is arranged on the side of the alignment shell 82 close to the chip. The moving inclined block 831 is slidingly connected at the hollow cavity. The pushing member 832 is arranged on the alignment shell 82, and the pushing block 834 pushes the moving inclined block 831 through the pushing mechanism 9.

[0061] The connecting member 833 is arranged on the top of one end of the moving inclined block 831, and the connecting member 833 is connected with the alignment shell 82. The pushing block 834 slidingly penetrates the pushing opening, and the pushing block 834 is fixedly connected with the moving inclined block 831. The contact sliding sleeve 835 is located outside the pushing opening, and the contact sliding sleeve 835 slidingly sheaths the outside of the pushing block 834. A buffer member 837 is arranged between the contact sliding sleeve 835 and the pushing block 834. As a supplement, the buffer member 837 comprises a plurality of buffer springs 8371. One end of the plurality of buffer springs 8371 is fixedly connected with the pushing block 834, and the other end of the plurality of buffer springs 8371 is connected with the contact sliding sleeve 835. In this embodiment, the contact sliding sleeve 835 is made of rubber material, and the contact sliding sleeve 835 slidingly sheaths the outside of the pushing block 834, so that the contact sliding sleeve 835 and the pushing block 834 can be kept in a relatively sealed state.

[0062] The pressing member 836 is arranged on the moving inclined block 831.

[0063] Please refer to Figures 11 to 12 The pushing member 832 comprises a contact inclined block 8321, a plurality of pushing rods 8322, a pushing plate 8323, and a pushing spring 8324. The contact inclined block 8321 is located inside the alignment shell 82. The plurality of pushing rods 8322 slidingly penetrates the top of the alignment shell 82. One end of the plurality of pushing rods 8322 is fixedly connected with the contact inclined block 8321, and the other end of the plurality of pushing rods 8322 is fixedly connected with the pushing plate 8323. The pushing spring 8324 sheaths the outside of the pushing rod 8322, and the two ends of the pushing spring 8324 are fixedly connected with the pushing plate 8323 and the alignment shell 82, respectively.

[0064] The pushing mechanism 9 comprises a fixing frame 91 and four downward pressing plates 92, the fixing frame 91 is fixedly installed on the die bonding swing arm mechanism 2 and located above the suction nozzle 21, and the four downward pressing plates 92 are fixedly installed on the fixing frame 91 and used for downward pressing and pushing the pushing plates 823.

[0065] The connecting piece 833 comprises an extension plate 8331 and multiple connecting springs 8332, the extension plate 8331 is fixedly installed at one end of the moving ramp block 831, the position corresponding to the extension plate 8331 of the alignment shell 82 is provided with a moving opening, and the extension plate 8331 slides through the moving opening, and one end of the multiple connecting springs 8332 is fixedly connected with the alignment shell 82 and the other end is fixedly connected with the extension plate 8331.

[0066] The downward pressing piece 836 comprises a downward pressing block 8361, the downward pressing block 8361 is fixedly installed at one side of the moving ramp block 831 and slides through the pushing opening, and the side close to the chip of the downward pressing block 8361 is provided with a pushing inclined surface 8362.

[0067] Specific implementation process: when the die bonding swing arm mechanism 2 sucks the chip through the suction nozzle 21, one end of the fixed swing arm mechanism moves to the position directly above the substrate die bonding position, then the die bonding swing arm mechanism 2 is vertically pressed, first, the four downward pressing plates 92 at the fixing frame 91 respectively contact the four pushing plates 823 and vertically press the pushing plates 823, when the pushing plates 823 are pushed, the contact inclined block 821 is pushed through the pushing rod 822, when the contact inclined block 821 moves downward, the moving ramp block 831 is pushed, when the chip vertically moves to the position of the same plane as the four contact sliding sleeves 835, with the movement of the moving ramp block 831, the four contact sliding sleeves 835 move towards each other and clamp and position the chip, with the continuous downward movement of the suction nozzle 21, the chip is adhered along the die bonding position, at the same time, the moving ramp block 831 continuously moves, the contact sliding sleeve 835 clamps the outside of the chip, the pushing block 834 moves at the contact sliding sleeve 835, at the same time, the four downward pressing blocks 8361 contact the chip above and vertically press and push the chip, so that the chip is separated from the suction nozzle 21, and the chip is quickly and stably adhered to the die bonding position.

[0068] The moving ramp block 831 is internally provided with an air inlet cavity 8311, the pushing block 834 is internally provided with an air outlet cavity 8341, and the bottom of the contact sliding sleeve 835 is provided with an air outlet inclined opening 8351.

[0069] The air guide piece 84 comprises air guide pipes 841 arranged at the four corners of the bottom of the air guide frame 81, and a first telescopic pipe 842 is communicated with the air guide pipes 841, and one end of the first telescopic pipe 842 is communicated with the air inlet cavity 8311.

[0070] The second moving block 42 is internally provided with a through hole, and both ends of the through hole are communicated with second telescopic pipes 843, and a gas supply pipe 844 is further arranged on the second moving block 42 and communicated with the air guide frame 81, and the other end of one of the second telescopic pipes 843 is communicated with a fixed pipe 845 which penetrates through one side of the support frame 5, and the other end of the fixed pipe 845 is communicated with an external cooling gas supply device, and an electromagnetic valve is further arranged on the fixed pipe 845, and in the embodiment, the external cooling gas supply device is an existing mechanism, such as a micro vapor compression refrigeration system or a micro semiconductor refrigeration system, and therefore, no more description is made.

[0071] Specific implementation process: when the four pressing blocks 8361 are in contact with the upper surface of the chip and press and adhere the die, the electromagnetic valve on the fixed pipe 845 is opened, the cooling gas enters the through hole through the second telescopic pipe 843, then enters the air guide frame 81 through the gas supply pipe 844, and then enters the four air guide pipes 841 through the air guide frame 81, and finally, the cooling gas is sprayed to the bottom of the chip adhered with the adhesive through the air inlet cavity 8311, the air outlet cavity 8341 and the air outlet inclined mouth 8351, so as to accelerate the curing of the adhesive and make the chip and the substrate be quickly and stably connected, and then the suction nozzle 21 is vertically moved upward, and the next chip is sucked and die-bonded by the die-bonding swing arm mechanism 2.

[0072] A die-bonding method of a high-precision IC die bonder, comprising the following steps:

[0073] Step one: the substrate is conveyed by the conveying table 4, and then the dispensing mechanism 3 is used to automatically recognize and dispense the dispensing position of the substrate.

[0074] Step two: the substrate after dispensing is conveyed to the die-bonding swing arm mechanism 2 by the conveying table 4, and then the die-bonding swing arm mechanism 2 sucks the chip by the suction nozzle 21, and at the same time, the alignment mechanism 8 moves to the die-bonding position above the substrate.

[0075] Step three: then, the die-bonding swing arm mechanism 2 vertically places the chip on the die-bonding position on the substrate by the suction nozzle 21, and at the same time, the chip is stably and quickly adhered to the substrate by the cooperation of the pushing mechanism 9 and the alignment mechanism 8.

[0076] Embodiment two

[0077] Please refer to Figures 7 to 8, embodiment two is further supplemented to embodiment one, and specifically, the conveying table 4 is further provided with a plurality of heat preservation shells 43, the heat preservation shells 43 are provided downwards, and the heat preservation shells 43 are provided with heating coils 431 inside, the heating coils 431 correspond to the shape of the glue distributed on the substrate, the heat preservation shells 43 are fixedly connected with connecting plates 432, and one end of the two connecting plates 432 close to the two sides of the conveying table 4 is fixedly connected with the supporting frame 5.

[0078] Therefore, the substrate with the glue is moved through the conveying table 4, and the substrate is first moved to below the plurality of heat preservation shells 43, the heating coils 431 in the heat preservation shells 43 correspond to the shape of the glue, so as to heat the glue and prevent the glue from solidifying, and facilitate stable adhesion between the chip and the glue.

[0079] It should be noted that in this text, the relationship terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between the entities or operations. Moreover, the terms "include", "contain" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or equipment.

[0080] Although the embodiments of the present application have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and spirits of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A high-precision IC die bonder, comprising a die bonder body, a die bonder arm mechanism mounted on the die bonder body, a nozzle mounted on the die bonder arm mechanism, a dispensing mechanism mounted on the die bonder body, and a transfer table, wherein the transfer table is mounted on the die bonder body and is used for conveying substrates, characterized in that: The support frame is provided outside the conveying table, and the lifting mechanism for connecting the support frame is installed on the die bonder body; The first moving block and the second moving block are provided above the conveying table, and the moving piece for driving the first moving block and the second moving block is provided on the support frame; The alignment mechanism is provided between the first moving block and the second moving block, the push mechanism is provided at the bottom of the die bonder swing arm mechanism and outside the suction nozzle, and the push mechanism cooperates with the alignment mechanism to adhere the chip in parallel on the substrate; The alignment mechanism comprises a gas guide frame, an alignment shell, an alignment piece and a gas guide piece, the gas guide frame is fixedly installed at the top between the first moving block and the second moving block, and the gas guide frame is in a meandering shape; The alignment shell is provided with four alignment shells, and the four alignment shells are fixedly installed at the bottom of the gas guide frame and located around the chip; The alignment piece is installed on the alignment shell, and a plurality of alignment pieces are aligned with the adhered chip; The gas guide piece is arranged between the four alignment shells and the gas guide frame; The alignment piece comprises a moving inclined block, a push piece, a connecting piece, a push block, a contact sliding sleeve and a pressing piece, the alignment shell is a hollow cavity, one side of the alignment shell close to the chip is provided with a push port, the moving inclined block is slidably connected at the hollow cavity, the push piece is arranged on the alignment shell, and the push block pushes the moving inclined block through the push mechanism; The connecting piece is arranged at the top of one end of the moving inclined block, and the connecting piece is connected with the alignment shell, the push block is slidably penetrated through the push port, and the push block is fixedly connected with the moving inclined block, the contact sliding sleeve is located outside the push port, and the contact sliding sleeve is slidably sleeved outside the push block, and the buffer piece is arranged between the contact sliding sleeve and the push block; The pressing piece is arranged on the moving inclined block; The push piece comprises a contact inclined block, a push rod, a push plate and a push spring, the contact inclined block is located in the alignment shell, a plurality of push rods are provided, the plurality of push rods are slidably penetrated through the top of the alignment shell, one end of the plurality of push rods is fixedly connected with the contact inclined block, and the other end of the plurality of push rods is fixedly connected with the push plate, the push spring is sleeved outside the push rod, and the two ends of the push spring are fixedly connected with the push plate and the alignment shell respectively; The push mechanism comprises a fixed frame and a pressing plate, the fixed frame is fixedly installed on the die bonder swing arm mechanism, and the fixed frame is located above the suction nozzle, the pressing plate is provided with four pressing plates, the four pressing plates are fixedly installed on the fixed frame, and the pressing plate is used for pressing the push plate.

2. The high-precision IC die bonding machine according to claim 1, wherein: The lifting mechanism comprises an electric push rod, the electric push rod is fixedly installed on the die bonder body, and the output end of the electric push rod is fixedly connected with the support frame, and the support frame is in a U shape.

3. The high-precision IC die bonding machine of claim 1, wherein: The connecting piece comprises an extension plate and a connecting spring, the extension plate is fixedly installed at one end of the moving inclined block, the alignment shell is provided with a moving port corresponding to the position of the extension plate, and the extension plate is slidably penetrated through the moving port, and the connecting spring is provided with a plurality of connecting springs, one end of the plurality of connecting springs is fixedly connected with the alignment shell, and the other end of the plurality of connecting springs is fixedly connected with the extension plate.

4. The high-precision IC die bonding machine according to claim 3, wherein: The lower pressing piece comprises a lower pressing block fixedly installed on one side of the moving inclined block and slidingly penetrating the pushing opening, and the side of the lower pressing block close to the chip is provided with a pushing inclined surface.

5. The high-precision IC die bonding machine according to claim 4, wherein: The moving inclined block is internally provided with an air inlet cavity, and the pushing block is internally provided with an air outlet cavity, and the bottom of the contact sliding sleeve is provided with an air outlet inclined opening; The air guide piece comprises air guide pipes arranged at four corners of the bottom of the air guide frame, the air guide pipes are communicated with first telescopic pipes, and one end of the first telescopic pipes is communicated with the air inlet cavity; The second moving block is internally provided with a through hole, and the through hole is communicated with second telescopic pipes at both ends, the second moving block is further communicated with a gas supply pipe, and the gas supply pipe is communicated with the air guide frame, one end of one of the second telescopic pipes is communicated with a fixed pipe, and the fixed pipe penetrates one side of the support frame, and the other end of the fixed pipe is communicated with an external cooling gas supply device.

6. A die bonding method using the high-precision IC die bonder according to any one of claims 1 to 5, characterized by, The method comprises the following steps: Step one: the substrate is conveyed by the conveying table, and then the dispensing mechanism is used for dispensing, and the dispensing mechanism automatically identifies the dispensing position of the substrate; Step two: the substrate after dispensing is conveyed to the die bonding swing arm mechanism by the conveying table, the die bonding swing arm mechanism sucks the chip by the suction nozzle, and the chip is sucked at the same time, and the alignment mechanism moves to the die bonding position above the substrate; Step three: then, the die bonding swing arm mechanism vertically places the chip on the die bonding position of the substrate by the suction nozzle, and at the same time, the chip is stably and quickly adhered to the substrate by the cooperation of the pushing mechanism and the alignment mechanism.

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