Bipolar plate processing control method, device and system and computer equipment

Abstract

The invention relates to a bipolar plate processing control method, device and system, computer equipment, a computer readable storage medium and a computer program product. The method comprises the steps of predicting a second processing result of the bipolar plate at a second moment after a first moment based on a first processing result of the bipolar plate at the first moment in the processing process of the bipolar plate; under the condition that the bipolar plate is determined to meet a processing adjustment condition based on the second processing result, adjusting the equipment parameters at the first moment based on the second processing result; and processing the bipolar plate at the second moment according to the adjusted equipment parameters. By adopting the method, the calibration efficiency and the calibration accuracy of the bipolar plate can be improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of automation, and in particular, relates to a bipolar plate processing control method, device and system, computer equipment, computer readable storage medium and computer program product. BACKGROUND

[0002] In a fuel cell system, a bipolar plate is one of the key components, and its performance directly affects the power output and efficiency of the fuel cell. With the continuous development of fuel cell technology and the mass production of bipolar plates, the precision requirements for bipolar plates are increasing.

[0003] In the existing manufacturing process, the bipolar plate is prone to position deviation and shape deviation during processing. Usually, manual experience is relied on for correction, but the correction accuracy is not accurate and the calibration efficiency is low. SUMMARY

[0004] Therefore, it is necessary to provide a bipolar plate processing control method, device and system, computer equipment, computer readable storage medium and computer program product capable of improving the calibration efficiency and accuracy of the bipolar plate and improving the processing efficiency of the bipolar plate.

[0005] In a first aspect, the present application provides a bipolar plate processing control method, comprising:

[0006] During the processing of the bipolar plate, based on a first processing result of the bipolar plate at a first time, a second processing result of the bipolar plate at a second time after the first time is predicted;

[0007] If it is determined that the bipolar plate meets the processing adjustment condition based on the second processing result, the device parameters at the first time are adjusted based on the second processing result;

[0008] The bipolar plate is processed at the second time with the adjusted device parameters.

[0009] In one embodiment, the first processing result includes a plurality of processing sub-results corresponding to a plurality of workpiece parameters respectively, and the second processing result includes a plurality of predicted results corresponding to the plurality of workpiece parameters respectively.

[0010] The second processing result of the bipolar plate at the second time after the first time is predicted based on the first processing result of the bipolar plate at the first time, comprising:

[0011] For a historical time before the first time, a historical processing result of each workpiece parameter at the historical time is obtained;

[0012] predict each of the prediction results of the bipolar plate at a second time after the first time based on each of the historical processing results and each of the processing sub-results.

[0013] In one of the embodiments, the determining that the bipolar plate meets the processing adjustment condition based on the second processing result comprises:

[0014] determining a target weight respectively matched with each of the workpiece parameters based on a mapping relationship between preset workpiece parameters and preset parameter weights;

[0015] performing weighted processing on each of the prediction results of the workpiece parameters and the target weight to obtain a processing score of the bipolar plate at the second time;

[0016] In a case where the processing score is less than or equal to a first score threshold, it is determined that the bipolar plate meets the processing adjustment condition.

[0017] In one of the embodiments, the number of the historical times is multiple;

[0018] The predicting each of the prediction results of the bipolar plate at a second time after the first time based on each of the historical processing results and each of the processing sub-results comprises:

[0019] For each of the workpiece parameters, determining a historical processing error between the historical processing result of the workpiece parameter and a theoretical result of the workpiece parameter, and a processing error between the processing sub-result of the workpiece parameter and the theoretical result of the workpiece parameter;

[0020] analyzing each of the historical processing errors of the historical times to obtain a processing error trend corresponding to the workpiece parameter;

[0021] matching the processing error trend corresponding to the workpiece parameter with the processing error corresponding to the workpiece parameter, and predicting the prediction result of the bipolar plate at a second time after the first time matched with the workpiece parameter according to a matching result.

[0022] In one of the embodiments, the number of the historical times is multiple;

[0023] The predicting each of the prediction results of the bipolar plate at a second time after the first time based on each of the historical processing results and each of the processing sub-results comprises:

[0024] For each of the historical times, determining a processing result trend corresponding to the historical time based on each of the historical processing results at the historical time;

[0025] determining a processing result trend corresponding to the first time based on each of the processing sub-results at the first time.

[0026] determining a trend similarity between the processing result trend corresponding to the first time and the processing result trend corresponding to the historical time;

[0027] determining the historical time with the maximum trend similarity as a reference time;

[0028] determining each of the historical processing results of the next historical time of the reference time as each of the predicted results of the bipolar plate at a second time after the first time.

[0029] In one of the embodiments, the predicting the second processing result of the bipolar plate at the second time after the first time based on the first processing result of the bipolar plate at the first time comprises:

[0030] obtaining each historical processing sub-result of each workpiece parameter of a historical bipolar plate which is in the same batch as the bipolar plate after the historical bipolar plate is processed;

[0031] selecting a target parameter from each of the workpiece parameters based on each historical processing sub-result of each of the workpiece parameters, the target parameter satisfying the processing adjustment condition;

[0032] selecting a target result from each processing sub-result of each of the workpiece parameters, the target result matching the target parameter;

[0033] predicting a predicted processing result of the bipolar plate at the second time corresponding to the target parameter based on the target result, the second processing result comprising the predicted processing result.

[0034] In one of the embodiments, the first processing result comprises each processing sub-result of each of the workpiece parameters, and the selecting the target parameter from each of the workpiece parameters based on each historical processing sub-result of each of the workpiece parameters comprises:

[0035] obtaining a first difference between each historical processing sub-result corresponding to each of the workpiece parameters and each theoretical result corresponding to each of the workpiece parameters;

[0036] when the first difference is greater than or equal to a first difference threshold, determining that a workpiece parameter matching the first difference satisfies the processing adjustment condition, and then determining the workpiece parameter matching the first difference as the target parameter.

[0037] In one of the embodiments, the first processing result comprises each processing sub-result of each of the workpiece parameters, and the selecting the target parameter from each of the workpiece parameters based on each historical processing sub-result of each of the workpiece parameters comprises:

[0038] For each of the workpiece parameters, a second difference between the processing sub-result corresponding to the workpiece parameter and the historical processing sub-result is obtained;

[0039] When the second difference is greater than or equal to a second difference threshold, it is determined that the workpiece parameter matched with the second difference satisfies the processing adjustment condition, and the workpiece parameter matched with the second difference is determined as the target parameter.

[0040] In one of the embodiments, the predicting, based on the target result, a predicted processing result of the bipolar plate at a second time corresponding to the target parameter comprises:

[0041] For each historical time before the first time, a historical processing result corresponding to the target parameter at the historical time and a historical processing error are obtained;

[0042] Based on each of the historical processing errors, the historical processing result corresponding to each of the historical processing errors, and the target result, a predicted processing result of the bipolar plate at a second time corresponding to the target parameter is predicted.

[0043] In a second aspect, the present application provides a bipolar plate processing control device, the device comprising:

[0044] A prediction module is configured to, in a processing process of a bipolar plate, predict a second processing result of the bipolar plate at a second time after a first time based on a first processing result of the bipolar plate at the first time.

[0045] A processing module is configured to, in a case where it is determined that the bipolar plate satisfies a processing adjustment condition based on the second processing result, adjust a device parameter at the first time based on the second processing result.

[0046] A control module is configured to process the bipolar plate at the second time based on the adjusted device parameter.

[0047] In a third aspect, the present application provides a bipolar plate processing control system, the system comprising:

[0048] A detection system is configured to obtain a first processing result of a bipolar plate at a first time.

[0049] A control system is configured to, in a processing process of a bipolar plate, predict a second processing result of the bipolar plate at a second time after a first time based on a first processing result of the bipolar plate at the first time, and in a case where it is determined that the bipolar plate satisfies a processing adjustment condition based on the second processing result, adjust a device parameter at the first time based on the second processing result.

[0050] a processing device for processing the bipolar plate at the second time instant with the adjusted device parameter.

[0051] In a fourth aspect, the present application provides a computer device, comprising a memory and a processor, wherein the memory stores a computer program, and the processor implements the following steps when executing the computer program:

[0052] In a processing process of the bipolar plate, a second processing result of the bipolar plate at a second time instant after the first time instant is predicted based on a first processing result of the bipolar plate at the first time instant;

[0053] In a case where it is determined that the bipolar plate satisfies a processing adjustment condition based on the second processing result, a device parameter of the first time instant is adjusted based on the second processing result;

[0054] The bipolar plate is processed at the second time instant with the adjusted device parameter.

[0055] In a fifth aspect, the present application provides a computer readable storage medium, which stores a computer program, and the computer program is executed by a processor to implement the following steps:

[0056] In a processing process of the bipolar plate, a second processing result of the bipolar plate at a second time instant after the first time instant is predicted based on a first processing result of the bipolar plate at the first time instant;

[0057] In a case where it is determined that the bipolar plate satisfies a processing adjustment condition based on the second processing result, a device parameter of the first time instant is adjusted based on the second processing result;

[0058] The bipolar plate is processed at the second time instant with the adjusted device parameter.

[0059] In a sixth aspect, the present application provides a computer program product, comprising a computer program, and the computer program is executed by a processor to implement the following steps:

[0060] In a processing process of the bipolar plate, a second processing result of the bipolar plate at a second time instant after the first time instant is predicted based on a first processing result of the bipolar plate at the first time instant;

[0061] In a case where it is determined that the bipolar plate satisfies a processing adjustment condition based on the second processing result, a device parameter of the first time instant is adjusted based on the second processing result;

[0062] The bipolar plate is processed at the second time instant with the adjusted device parameter.

[0063] The bipolar plate processing control method, device and system, computer device, computer readable storage medium and computer program product can improve the processing efficiency of the bipolar plate by predicting the second processing result of the bipolar plate at the second time after the first time based on the first processing result of the bipolar plate at the first time in the processing process of the bipolar plate, and adjusting the equipment parameters at the first time based on the second processing result in the case that the bipolar plate meets the processing adjustment condition, and processing the bipolar plate at the second time with the adjusted equipment parameters, so that the used equipment parameters can be automatically adjusted based on the predicted processing result, the calibration efficiency and calibration accuracy in the processing process of the bipolar plate can be improved, the unqualified bipolar plates in subsequent processing can be avoided, the processing accuracy of the bipolar plate is improved, and the loss cost is reduced. BRIEF DESCRIPTION OF DRAWINGS

[0064] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the related art, the drawings needed to be used in the description of the embodiments of the present application or the related art will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other related drawings can be obtained by those skilled in the art without creative labor.

[0065] Figure 1 The structure block diagram of the bipolar plate processing control system in an embodiment is shown in the figure.

[0066] Figure 2 The flowchart of the bipolar plate processing control method in an embodiment is shown in the figure.

[0067] Figure 3 The flowchart of predicting the second processing result of the bipolar plate at the second time after the first time based on the first processing result of the bipolar plate at the first time in an embodiment is shown in the figure.

[0068] Figure 4 The flowchart of determining that the bipolar plate meets the processing adjustment condition based on the second processing result in an embodiment is shown in the figure.

[0069] Figure 5 The flowchart of predicting the second processing result of the bipolar plate at the second time after the first time based on the first processing result of the bipolar plate at the first time in an embodiment is shown in the figure.

[0070] Figure 6 The flowchart of the bipolar plate processing control method in another embodiment is shown in the figure.

[0071] Figure 7 The structure block diagram of the bipolar plate processing control device in an embodiment is shown in the figure.

[0072] Figure 8 This is an internal structural diagram of a computer device in one embodiment. Detailed Implementation

[0073] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0074] The embodiments of the technical solution of this application will now be described in detail with reference to the accompanying drawings. These embodiments are only used to more clearly illustrate the technical solution of this application and are therefore merely examples, and should not be used to limit the scope of protection of this application.

[0075] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having”, and any variations thereof, in the specification, claims, and foregoing description of the drawings are intended to cover non-exclusive inclusion.

[0076] In the description of the embodiments of this application, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined.

[0077] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0078] like Figure 1 As shown, a structural block diagram of a bipolar plate processing control system is provided. The bipolar plate processing control system 10 includes: a detection system 102 for acquiring a first processing result of the bipolar plate at a first moment; a control system 104 for predicting a second processing result of the bipolar plate at a second moment after the first moment based on the first processing result of the bipolar plate at the first moment during the processing of the bipolar plate; and adjusting the equipment parameters at the first moment based on the second processing result if it is determined that the bipolar plate meets the processing adjustment conditions; and a processing device 106 for processing the bipolar plate at the second moment with the adjusted equipment parameters.

[0079] For example, the detection system 102 can include a three-coordinate measurement positioning system, so that the flow channel width, depth, spacing (directly affecting the uniformity of gas distribution), flow guide hole diameter and position degree (affecting the sealing of the fuel cell stack), geometric tolerance, flatness (flatness of the sealing surface to prevent gas leakage), parallelism (deviation of the two surfaces of the bipolar plate, affecting the stack assembly), profile degree (matching degree of the complex flow channel curve and the CAD model), surface quality, roughness, etc. are measured by the three-coordinate measurement positioning system.

[0080] In one embodiment, the bipolar plate machining control system 10 can also include a mechanical structure, a transmission system, and a laser interferometric measurement system. The mechanical structure provides stability and accuracy for the machining process of the bipolar plate. The transmission device is used to convert power into precise motion to control the relative motion of the machining device and the bipolar plate. The laser interferometric measurement system is used to monitor the motion accuracy of the machining device in real time, ensuring that the dynamic performance of the mechanical structure and the transmission system meets the micron-level or even nanometer-level machining requirements.

[0081] In addition to using a laser interferometric measurement system, an atomic interferometric positioning system can also be used. In addition to using a three-coordinate measurement positioning system, an Optical Coherence Tomography (OCT) measurement system, a laser tracker measurement system, etc. can also be used.

[0082] In one embodiment, at least one of the detection system, the control system, the machining device, the mechanical structure, the transmission system, and the laser interferometric measurement system can be calibrated before use. For example, a standard block gauge is used to check the accuracy of the laser interferometric measurement system to ensure that the measurement error is within ±0.1 microns. A standard ball is used to calibrate the accuracy of the three-coordinate measurement positioning system to ensure that the indication error is within ±0.5 microns.

[0083] In one embodiment, the bipolar plate can be cleaned before being machined. For example, the bipolar plate is first cleaned by an ultrasonic cleaner for a preset period of time. The preset period of time can be any value within a preset period of time range. The upper limit of the preset period of time range is 30 minutes, and the lower limit is 10 minutes. In this application, the preset period of time can be 15 minutes. Finally, the bipolar plate is dried in a dust-free environment to ensure that there are no oil stains, impurities, or other factors that affect positioning and machining accuracy.

[0084] In one embodiment, the bipolar plate processing control system 10 can further include a tooling fixture installed on the worktable of the processing equipment, ensuring that the parallelism error between the positioning surface of the tooling fixture and the coordinate axis of the processing equipment is within ±0.5 microns. Among them, the clamping force of the tooling fixture at different positions can be measured and adjusted by a force gauge, so that the clamping force deviation of each point is controlled within ±0.5 Newton (N), ensuring that the clamping force on the bipolar plate is uniform and stable.

[0085] Among them, the material of the tooling fixture is not limited, for example, the tooling fixture can be made of elastic material or memory alloy, so that the clamping force distribution can be automatically adjusted according to the shape of the bipolar plate, and the positioning surface of the tooling fixture is subjected to high-precision grinding processing, so that the flatness is controlled within 1 micron. The type of tooling fixture is not limited, for example, the tooling fixture can be a magneto-rheological elastomer tooling fixture, or other settings.

[0086] For example, after the bipolar plate is placed on the tooling fixture, the laser interference measurement system can collect the three-dimensional coordinate data of the bipolar plate in real time at a frequency of 10 times per second to determine the position of the bipolar plate. If the deviation between the position of the bipolar plate and the theoretical position exceeds the allowed preset deviation range, such as ±3 microns or ±5 microns, the control system generates corresponding physical instructions by calculating the difference between the position of the bipolar plate and the theoretical position, to start the micro-displacement platform to accurately adjust the bipolar plate, so that the position of the bipolar plate is within the allowed preset deviation range.

[0087] In one embodiment, as shown in Figure 2 A bipolar plate processing control method is provided, which is applied to the bipolar plate processing control system as an example for illustration, including the following steps:

[0088] S202, in the processing process of the bipolar plate, based on the first processing result of the bipolar plate at the first time, predicting the second processing result of the bipolar plate at the second time after the first time.

[0089] Among them, the first processing result refers to the processing result presented after processing the bipolar plate at the first time, and the first processing result includes a plurality of processing sub-results corresponding to a plurality of workpiece parameters respectively. The processing sub-result is used to represent the parameter value corresponding to the workpiece parameter. The workpiece parameter includes but is not limited to: the flatness, width and depth of the flow channel in the bipolar plate, the size and position of the hole diameter, and the clamping force of the work fixture on the bipolar plate at different positions. Similarly, the content of the second processing result can be adapted to describe the content of the first processing result.

[0090] For example, after the flow channel processing of the bipolar plate is completed, the flatness and width, depth size of the flow channel can be measured; after the hollow hole (referring to the positioning hole, air inlet and outlet hole, water inlet and outlet hole on both sides of the bipolar plate, the shape of the hole is matched according to the version design) processing is completed, the size and position of the hole diameter can be measured.

[0091] The manner of predicting the second machining result of the bipolar plate at the second time after the first time based on the first machining result of the bipolar plate at the first time is not limited, and is exemplarily described below.

[0092] In one embodiment, the first machining result of the bipolar plate at the first time can be input into the trained prediction model to obtain the second machining result of the bipolar plate at the second time after the first time. The prediction model is trained based on a plurality of historical machining results of a plurality of workpiece parameters of the bipolar plate.

[0093] S204, in the case where it is determined that the bipolar plate satisfies the machining adjustment condition based on the second machining result, adjusting the equipment parameter at the first time based on the second machining result.

[0094] S206, machining the bipolar plate at the second time with the adjusted equipment parameter.

[0095] The first machining result includes a plurality of machining sub-results corresponding to a plurality of workpiece parameters respectively, and the second machining result includes a plurality of predicted results corresponding to the plurality of workpiece parameters respectively, and the predicted result refers to a predicted parameter value of the workpiece parameter.

[0096] Exemplarily, a preset machining threshold corresponding to each workpiece parameter is obtained; if the difference between the predicted result corresponding to at least one workpiece parameter and the machining sub-result corresponding to the workpiece parameter is greater than the preset threshold corresponding to the workpiece parameter, it is determined that the bipolar plate satisfies the machining adjustment condition.

[0097] Exemplarily, a preset machining threshold corresponding to each workpiece parameter is obtained; when the difference between the predicted result corresponding to the workpiece parameter and the machining sub-result corresponding to the workpiece parameter is greater than the preset threshold corresponding to the workpiece parameter, the workpiece parameter is determined to be an abnormal parameter; when the number of abnormal parameters is greater than a number threshold, it is determined that the bipolar plate satisfies the machining adjustment condition.

[0098] The number threshold can be greater than or equal to a preset proportion of the total number of workpiece parameters, and the preset proportion can be one-half, one-third or other values. Alternatively, the number threshold can be a preset threshold, or other settings can be made.

[0099] The preset machining threshold corresponding to all workpiece parameters can be the same, for example, the preset machining threshold can be any value less than or equal to 10 microns; or the preset machining thresholds corresponding to different workpiece parameters can be different, which can be set based on actual application scenarios.

[0100] The device parameter at the first time refers to the parameter used by the processing device when processing the bipolar plate at the first time, including but not limited to: cutting depth and feed speed of the tool, etc. The cutting depth of the tool refers to the vertical depth of the tool in the workpiece parameter in one cutting, and the unit can be millimeter; the feed speed of the tool refers to the speed of the tool moving in the cutting direction, and the unit can be feed per minute (mm / min) or feed per revolution (mm / rev).

[0101] For example, the mapping relationship between the preset workpiece parameter, the preset difference value and the preset device adjustment ratio is obtained; for the workpiece parameter whose prediction result is greater than the processing sub-result, the preset device adjustment ratio matched with the workpiece parameter is determined as the target adjustment ratio based on the difference value between the prediction result corresponding to the workpiece parameter and the processing sub-result corresponding to the workpiece parameter; and the product of the target adjustment ratio and the device parameter corresponding to the workpiece parameter at the first time is determined as the adjusted device parameter corresponding to the workpiece parameter at the first time.

[0102] It should be understood that, taking the flatness of the workpiece parameter as the flow channel and the device parameters as the cutting depth and the feed speed as an example, the flatness can be corrected by adjusting the cutting depth and the feed speed, and the flatness is corrected.

[0103] Based on Figure 2 As shown in the content, by predicting the second processing result of the bipolar plate at the second time after the first time based on the first processing result of the bipolar plate at the first time in the processing process of the bipolar plate, the processing efficiency of the bipolar plate can be improved by adjusting the device parameters in advance after knowing the processing result in advance; in the case that the bipolar plate meets the processing adjustment condition based on the second processing result, the device parameters at the first time are adjusted based on the second processing result, and the bipolar plate is processed at the second time with the adjusted device parameters, so that the calibration efficiency and the calibration accuracy in the processing process of the bipolar plate can be improved by automatically adjusting the used device parameters based on the predicted processing result, the unqualified situation of the subsequent processing bipolar plate is avoided, the processing accuracy of the bipolar plate is improved, and the loss cost is reduced.

[0104] In one embodiment, the first processing result includes a plurality of processing sub-results corresponding to each of the workpiece parameters, and the second processing result includes a prediction result corresponding to each of the workpiece parameters. For example, the implementation of predicting the second processing result of the bipolar plate at the second time after the first time based on the first processing result of the bipolar plate at the first time (i.e. S202) can be as shown in Figure 3 As shown, it includes:

[0105] S302, for a historical time before the first time, obtaining a historical processing result of each workpiece parameter at the historical time.

[0106] The number of historical time points can be one or more. For example, when the number of historical time points is one, the historical time point can refer to a time point adjacent to the first time point before the first time point, or the historical time point can refer to any time point before the first time point.

[0107] The historical machining result of the workpiece parameter can refer to a measurement result of the workpiece parameter after machining, or can refer to a result obtained by measuring the workpiece parameter after calibration of the equipment parameter corresponding to the workpiece parameter, or can have other settings.

[0108] S304, based on each historical machining result and each machining sub-result, predicting each prediction result of the bipolar plate at a second time point after the first time point.

[0109] The manner of predicting each prediction result of the bipolar plate at a second time point after the first time point based on each historical machining result and each machining sub-result is not limited, and is exemplarily described below.

[0110] In one embodiment, the number of historical time points is multiple, and specifically, for each workpiece parameter, a historical machining error between the historical machining result of the workpiece parameter and the theoretical result of the workpiece parameter, and a machining error between the machining sub-result of the workpiece parameter and the theoretical result of the workpiece parameter are determined; the historical machining error of each historical time point is analyzed to obtain a machining error trend corresponding to the workpiece parameter; the machining error trend corresponding to the workpiece parameter is matched with the machining error corresponding to the workpiece parameter, and according to the matching result, a prediction result of the bipolar plate matched with the workpiece parameter at a second time point after the first time point is predicted. Thus, by determining the machining error trend corresponding to the workpiece parameter, the machining error trend can reflect the machining of the workpiece parameter, so that when the machining result of the workpiece parameter is predicted based on the machining error trend, the prediction accuracy can be improved.

[0111] For example, when the matching result represents that the machining error matches the historical machining error on the machining error trend, the next historical machining error of the historical machining error matched on the machining error trend is determined as the prediction result of the bipolar plate matched with the workpiece parameter at a second time point after the first time point.

[0112] For example, when the matching result represents that the machining error does not match the historical machining error on the machining error trend, a target machining error is determined from the multiple historical machining errors, the target machining error being a historical machining error with the smallest difference from the machining error among the multiple historical machining errors; the next historical machining error of the target machining error on the machining error trend is determined as the prediction result of the bipolar plate matched with the workpiece parameter at a second time point after the first time point.

[0113] In one embodiment, the number of historical time points is multiple, specifically, for each historical time point, a processing result trend corresponding to the historical time point is determined based on historical processing results at the historical time point; a processing result trend corresponding to the first time point is determined based on the first time point processing sub-results; a trend similarity between the processing result trend corresponding to the first time point and the processing result trend corresponding to the historical time point is determined; the historical time point with the largest trend similarity is determined as the reference time point; and historical processing results of the next historical time point of the reference time point are determined as predicted results of the bipolar plate at the second time point after the first time point. Thus, by screening the historical time point with the largest trend similarity of the processing results as the reference time point, the processing results of the reference time point match the processing results of the first time point, so that when predicting based on the historical processing results of the reference time point, the prediction accuracy of the processing results at the second time point after the first time point can be improved.

[0114] The processing result trend corresponding to the historical time point is used to represent the overall trend of the processing results of the plurality of workpiece parameters at the historical time point.

[0115] For example, the historical processing results of the next historical time point of the reference time point include historical processing results of each workpiece parameter, and for each workpiece parameter, the historical processing result of the workpiece parameter is determined as the predicted result of the workpiece parameter at the second time point.

[0116] Based on Figure 3 As shown, by predicting based on the historical processing results of each workpiece parameter at the historical time point before the first time point, the prediction accuracy can be improved when predicting in combination with the actual processing situation.

[0117] In one embodiment, the implementation of determining that the bipolar plate satisfies the processing adjustment condition based on the second processing result (i.e., S204) can include the following steps: Figure 4 As shown, the implementation includes the following steps:

[0118] S402, determining a target weight matched with each workpiece parameter based on a mapping relationship between the preset workpiece parameter and the preset parameter weight.

[0119] For example, for each workpiece parameter, the preset parameter weight corresponding to the preset workpiece parameter matched with the workpiece parameter is determined as the target weight matched with the workpiece parameter based on the mapping relationship between the preset workpiece parameter and the preset parameter weight.

[0120] S404, weighting the predicted results of each workpiece parameter and the target weight to obtain a processing score of the bipolar plate at the second time point.

[0121] For example, for each workpiece parameter, the product of the prediction result of the workpiece parameter and the target weight is obtained; the sum of the products is counted to obtain the processing score of the bipolar plate at the second time.

[0122] For example, taking the workpiece parameters of flatness, width, depth, and position as examples, the processing score satisfies:

[0123] Processing score = flatness x W1 + width x W2 + depth x W3 + position x W4

[0124] S406, in the case where the processing score is less than or equal to the first score threshold, it is determined that the bipolar plate satisfies the processing adjustment condition.

[0125] In one embodiment, in the case where the processing score is greater than the second score threshold, it is determined that the bipolar plate does not satisfy the processing adjustment condition.

[0126] The first score threshold and the second score threshold can be the same or different. For example, the first score threshold is less than the second score threshold, the first score threshold and the second score threshold are values in a preset score range, the upper limit value of the preset score range is less than or equal to 1, and the lower limit value is greater than or equal to 0.5. For example, the first score threshold can be 0.6 and the second score threshold can be 0.8.

[0127] Based on Figure 4 As shown in the content, by weighting the prediction result of each workpiece parameter and the target weight, the processing score of the bipolar plate at the second time is obtained, so that by considering the prediction result of each workpiece parameter as a whole, the detection accuracy can be improved.

[0128] In one embodiment, based on the first processing result of the bipolar plate at the first time, the implementation manner of predicting the second processing result of the bipolar plate at the second time after the first time (i.e., S204) can be as shown in Figure 5 The implementation manner includes the following steps:

[0129] S502, for the historical bipolar plate in the same batch as the bipolar plate, the historical processing sub-result of each workpiece parameter of the historical bipolar plate after processing is obtained.

[0130] For example, after the historical bipolar plate is processed, by measuring each workpiece parameter, the historical processing sub-result of each workpiece parameter can be obtained.

[0131] It can be understood that the historical processing sub-result of the workpiece parameter of the historical bipolar plate after processing is the detection result obtained after calibrating the equipment parameters, and therefore, when predicting based on this result, the prediction accuracy can be improved.

[0132] S504, screen the target parameter meeting the machining adjustment condition from the workpiece parameters based on the historical machining sub-results of the workpiece parameters respectively.

[0133] The target parameter meets the machining adjustment condition, that is, the target parameter is an abnormal workpiece parameter. The manner of screening the target parameter meeting the machining adjustment condition from the workpiece parameters based on the historical machining sub-results of the workpiece parameters is not limited, and is exemplarily described below.

[0134] In one embodiment, the first machining result includes: machining sub-results of the workpiece parameters respectively, specifically, for each workpiece parameter, a first difference between the historical machining sub-result corresponding to the workpiece parameter and the theoretical result corresponding to the workpiece parameter is obtained; when the first difference is greater than or equal to a first difference threshold, it is determined that the workpiece parameter matched with the first difference meets the machining adjustment condition, and then the workpiece parameter matched with the first difference is determined as the target parameter. Thus, by comparing the historical machining sub-result corresponding to the workpiece parameter with the theoretical result corresponding to the workpiece parameter, the abnormal workpiece parameter can be determined intuitively, and by adjusting the machining result of the abnormal workpiece parameter, the calibration efficiency can be improved.

[0135] In one embodiment, the first machining result includes: machining sub-results of the workpiece parameters respectively, specifically, for each workpiece parameter, a second difference between the machining sub-result corresponding to the workpiece parameter and the historical machining sub-result is obtained; when the second difference is greater than or equal to a second difference threshold, it is determined that the workpiece parameter matched with the second difference meets the machining adjustment condition, and then the workpiece parameter matched with the second difference is determined as the target parameter. Thus, by comparing the machining sub-result corresponding to the workpiece parameter with the historical machining sub-result, the abnormal workpiece parameter can be determined with reference to the actual machining process, and by adjusting the machining result of the abnormal workpiece parameter, the calibration efficiency can be improved.

[0136] S506, screen the target result matched with the target parameter from the machining sub-results of the workpiece parameters respectively.

[0137] The number of target parameters is at least one. Exemplarily, the machining sub-result consistent with the target parameter in the workpiece parameters is determined as the target result.

[0138] S508, for a second time after the first time, predict the predicted machining result corresponding to the target parameter of the bipolar plate at the second time based on the target result; the second machining result includes the predicted machining result.

[0139] The manner of predicting the predicted machining result corresponding to the target parameter of the bipolar plate at the second time based on the target result is not limited, and is exemplarily described below.

[0140] In one embodiment, for each historical moment before the first moment, a historical processing result corresponding to the target parameter and a historical processing error are obtained; based on the historical processing errors, the historical processing result corresponding to each historical processing error, and the target result, a predicted processing result of the bipolar plate at the second moment corresponding to the target parameter is predicted. Thus, by predicting the predicted processing result of the abnormal workpiece parameter (i.e., the target parameter) at the second moment, and then adjusting the processing result of the abnormal workpiece parameter, the calibration efficiency can be improved.

[0141] Exemplarily, the difference between the historical processing result corresponding to the target parameter and the theoretical result corresponding to the target parameter is determined as the historical processing error corresponding to the target parameter.

[0142] Exemplarily, based on the historical processing errors and the historical processing result corresponding to each historical processing error, a processing prediction model is constructed; the target result is input into the processing prediction model to obtain a target processing error corresponding to the target result; and the sum of the processing sub-result corresponding to the target parameter at the first moment and the target processing error is determined as the predicted processing result of the bipolar plate at the second moment corresponding to the target parameter.

[0143] In one embodiment, based on the mapping relationship between the preset processing result and the preset predicted result, the preset predicted result matched with the target result is determined as the predicted processing result of the bipolar plate at the second moment corresponding to the target parameter.

[0144] Based on Figure 5 As shown, by predicting the predicted processing result of the abnormal workpiece parameter (i.e., the target parameter that does not meet the processing adjustment condition) in combination with the historical processing result, and then adjusting the processing process of the abnormal workpiece parameter, the calibration efficiency can be improved.

[0145] In one embodiment, the number of target parameters is at least one, and specifically, determining that the bipolar plate meets the processing adjustment condition based on the second processing result includes: if the difference between the predicted processing result of at least one target parameter and the theoretical result of the target parameter is outside the preset deviation range allowed by the target parameter, it is determined that the bipolar plate meets the processing adjustment condition.

[0146] In one embodiment, the device parameter at the first time is adjusted based on the second processing result, comprising: obtaining a mapping relationship between a preset workpiece parameter, a preset difference value and a preset device adjustment ratio; determining the preset device adjustment ratio matched with the target parameter as a reference adjustment ratio based on a difference between a predicted processing result of the target parameter and a theoretical result of the target parameter; and determining a product of the reference adjustment ratio and the device parameter corresponding to the target parameter at the first time as the device parameter corresponding to the adjusted target parameter at the first time. Further, the bipolar plate is processed with the device parameter corresponding to the adjusted target parameter at the second time, so that the calibration efficiency can be improved by adjusting the device parameter corresponding to the abnormal target parameter while the device parameters corresponding to other workpiece parameters remain unchanged.

[0147] It can be known from the above that the bipolar plate can be processed and corrected by using the above method during the processing of the bipolar plate. After the processing of the bipolar plate is completed, the quality of the processed bipolar plate can be detected and evaluated, so that the bipolar plate is determined to be qualified before entering the next process.

[0148] For example, the appearance of the bipolar plate is checked by using optical instruments to ensure that there is no scratch or deformation caused by collision.

[0149] For example, after the processing of the bipolar plate is completed, the full-size measurement of the bipolar plate is performed by using a three-coordinate measurement system, and the measurement result is compared with standard data. If the comparison result is within a preset range, the processed bipolar plate is determined to be qualified. For example, the three-coordinate measurement system automatically collects geometric data of the bipolar plate, such as flatness, width, depth and position accuracy. Taking the flatness as an example, the control system compares the current measurement value with the standard tolerance value. If the flatness deviation between the current measurement value and the standard tolerance value exceeds ±10 microns, the flatness deviation can be written into the processing code by the control system, and the processing program is restarted, so that the local trimming of the deviation area corresponding to the flatness can be realized.

[0150] For example, the bipolar plate processing control system can further include a test fixture. The processed bipolar plate is installed on the test fixture, test gas (such as helium) with a preset pressure is introduced into the bipolar plate after sealing, and the actual gas permeability measurement value is recorded based on a gas permeability tester. If the deviation between the actual gas permeability measurement value and the design target value does not exceed the allowable tolerance range, and the actual gas permeability measurement value is less than or equal to the maximum design allowable value, the bipolar plate is determined to be qualified. Thus, the use quality of the bipolar plate can be improved by performing the air tightness detection on the bipolar plate.

[0151] In one embodiment, as shown in Figure 6 FIG. 1 shows a schematic diagram of a bipolar plate processing control method, wherein:

[0152] S602, performing preparation work to calibrate the equipment and systems in the bipolar plate processing control system, and cleaning and drying raw materials.

[0153] S604, installing tooling fixtures and debugging the tooling fixtures to debug clamping force.

[0154] S606, during the processing of the bipolar plate, predicting a second processing result of the bipolar plate at a second time after the first time based on a first processing result of the bipolar plate at the first time.

[0155] S608, in the case where the bipolar plate meets the processing adjustment condition based on the second processing result, adjusting the equipment parameters at the first time based on the second processing result.

[0156] S610, processing the bipolar plate at the second time with the adjusted equipment parameters.

[0157] S612, performing quality and evaluation on the processed bipolar plate.

[0158] The contents of S602-S612 are described above and will not be repeated here.

[0159] As described above, the method provided by the present application can solve the problem of low calibration accuracy and low calibration efficiency in the prior art, and can also solve the problem of low positioning accuracy of the bipolar plate and difficulty in controlling the shape and position tolerance within 10 microns, which affects the performance of the fuel cell. Through the method of the present application, high-precision positioning of the bipolar plate during processing and assembly can be achieved, and the shape and position tolerance can be effectively controlled, thereby improving the quality and consistency of the bipolar plate and improving the overall performance and reliability of the fuel cell. In addition, by precisely controlling the shape and position tolerance of the bipolar plate, including the parameters of each workpiece, the sealing performance of the flow channel and the uniformity of gas distribution can be ensured, thereby improving the power output and efficiency of the fuel cell. Moreover, high-precision positioning and shape and position tolerance control can effectively ensure the quality of each bipolar plate, significantly improve the consistency of the product, and reduce the product failure rate in mass production. In addition, through the automatic measurement and feedback system, manual intervention and adjustment time are reduced, and production efficiency is improved.

[0160] It should be understood that, although the steps in the flowcharts involved in the embodiments described above are shown in sequence according to the arrows, the steps are not necessarily executed in the order indicated by the arrows. Unless otherwise specified herein, the execution of the steps is not strictly limited in sequence, and the steps can be executed in other sequences. Moreover, at least some of the steps in the flowcharts involved in the embodiments described above can include multiple steps or multiple stages, which are not necessarily executed at the same time, but can be executed at different times, and the execution sequence of the steps or stages is not necessarily sequential, but can be executed alternately or alternately with at least part of other steps or steps or stages in other steps.

[0161] Based on the same inventive concept, the embodiments of the present application also provide a bipolar plate processing control device for implementing the bipolar plate processing control method described above. The implementation scheme for solving the problem provided by the device is similar to the implementation scheme described in the above method, so the specific limitations in one or more bipolar plate processing control device embodiments provided below can refer to the limitations of the bipolar plate processing control method described above, which will not be repeated here.

[0162] In one exemplary embodiment, as shown in Figure 7 A bipolar plate processing control device is provided, including a prediction module 702, a processing module 704 and a control module 706, wherein the prediction module 702 is configured to predict a second processing result of a bipolar plate at a second time after a first time based on a first processing result of the bipolar plate at the first time during processing of the bipolar plate; the processing module 704 is configured to adjust a device parameter at the first time based on the second processing result in a case where it is determined that the bipolar plate satisfies a processing adjustment condition based on the second processing result; and the control module 706 is configured to process the bipolar plate at the second time with the adjusted device parameter.

[0163] In one embodiment, the first processing result includes a plurality of processing sub-results each corresponding to a respective workpiece parameter, and the second processing result includes a plurality of predicted results each corresponding to a respective workpiece parameter; the prediction module 702 is further configured to obtain a historical processing result of each workpiece parameter at a historical time before the first time for each workpiece parameter at the historical time; and predict the plurality of predicted results of the bipolar plate at the second time after the first time based on the plurality of historical processing results and the plurality of processing sub-results.

[0164] In one of the embodiments, the processing module 704 is further configured to: determine a target weight matched with each of the workpiece parameters based on a mapping relationship between the preset workpiece parameters and preset parameter weights; and perform weighted processing on the prediction result of each of the workpiece parameters and the target weight to obtain a processing score of the bipolar plate at the second time point; and determine that the bipolar plate meets the processing adjustment condition in a case where the processing score is less than or equal to a first score threshold.

[0165] In one of the embodiments, the number of the historical time points is multiple; and the prediction module 702 is further configured to: for each of the workpiece parameters, determine a historical processing error between a historical processing result of the workpiece parameter and a theoretical result of the workpiece parameter, and a processing error between a processing sub-result of the workpiece parameter and the theoretical result of the workpiece parameter; analyze the historical processing error of each of the historical time points to obtain a processing error trend corresponding to the workpiece parameter; match the processing error trend corresponding to the workpiece parameter with the processing error corresponding to the workpiece parameter, and predict the prediction result of the bipolar plate at the second time point after the first time point according to a matching result.

[0166] In one of the embodiments, the number of the historical time points is multiple; and the prediction module 702 is further configured to: for each of the historical time points, determine a processing result trend corresponding to the historical time point based on each of the historical processing results at the historical time point; determine a processing result trend corresponding to the first time point based on each of the processing sub-results at the first time point; determine a trend similarity between the processing result trend corresponding to the first time point and the processing result trend corresponding to the historical time point; determine a reference time point as the historical time point with the maximum trend similarity; and determine each of the historical processing results of a next historical time point of the reference time point as each of the prediction results of the bipolar plate at the second time point after the first time point.

[0167] In one of the embodiments, the prediction module 702 is further configured to: for a historical bipolar plate in the same batch as the bipolar plate, obtain each of the historical processing sub-results of each of the workpiece parameters after the historical bipolar plate is processed; select a target parameter meeting the processing adjustment condition from each of the workpiece parameters based on each of the historical processing sub-results of each of the workpiece parameters; select a target result matched with the target parameter from each of the processing sub-results of each of the workpiece parameters; and predict a prediction processing result of the bipolar plate at the second time point corresponding to the target parameter based on the target result for the bipolar plate at the second time point after the first time point; and the second processing result includes the prediction processing result.

[0168] In one of the embodiments, the first processing result comprises a processing sub-result of each of the workpiece parameters; the prediction module 702 is further configured to: for each of the workpiece parameters, obtain a first difference between a historical processing sub-result corresponding to the workpiece parameter and a theoretical result corresponding to the workpiece parameter; and when the first difference is greater than or equal to a first difference threshold, determine that a workpiece parameter matched with the first difference satisfies the processing adjustment condition, and then determine the workpiece parameter matched with the first difference as the target parameter.

[0169] In one of the embodiments, the first processing result comprises a processing sub-result of each of the workpiece parameters; the prediction module 702 is further configured to: for each of the workpiece parameters, obtain a second difference between the processing sub-result corresponding to the workpiece parameter and a historical processing sub-result; and when the second difference is greater than or equal to a second difference threshold, determine that a workpiece parameter matched with the second difference satisfies the processing adjustment condition, and then determine the workpiece parameter matched with the second difference as the target parameter.

[0170] In one of the embodiments, the prediction module 702 is further configured to: for each of the historical time points before the first time point, obtain a historical processing result corresponding to the target parameter at the historical time point and a historical processing error at the historical time point; and based on each of the historical processing errors, a historical processing result corresponding to each of the historical processing errors, and the target result, predict a prediction processing result corresponding to the target parameter of the bipolar plate at the second time point.

[0171] Each of the modules in the bipolar plate processing control device can be realized by software, hardware, or a combination thereof, in whole or in part. Each of the modules can be embedded in or independent of a processor in a computer device in a hardware form, or can be stored in a memory in a computer device in a software form, so as to be called and executed by a processor to perform operations corresponding to each of the modules.

[0172] In one of the embodiments, a computer device is provided, which can be a bipolar plate processing control system, and an internal structure diagram of the computer device can be as shown in FIG. 6. Figure 8As shown in the figure. The computer device includes a processor, a memory, an input / output interface (Input / Output, referred to as I / O) and a communication interface. Among them, the processor, the memory and the input / output interface are connected through the system bus, and the communication interface is connected to the system bus through the input / output interface. Among them, the processor of the computer device is used to provide computing and control capability. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program and a database. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The database of the computer device is used to store data such as first processing results. The input / output interface of the computer device is used to exchange information between the processor and external devices. The communication interface of the computer device is used to communicate with the terminal outside through network connection. The computer program is executed by the processor to realize a bipolar plate processing control method.

[0173] Those skilled in the art can understand that, Figure 8 The structure shown in the figure is only a block diagram of part of the structure related to the scheme of the present application, and does not constitute a limitation on the computer device to which the scheme of the present application is applied. The specific computer device can include more or fewer components than those shown in the figure, or combine certain components, or have a different component arrangement.

[0174] In one embodiment, a computer device is also provided, including a memory and a processor, the memory storing a computer program, and the processor executing the computer program to realize the steps in each of the above method embodiments.

[0175] In one embodiment, a computer readable storage medium is provided, which stores a computer program, and the computer program is executed by the processor to realize the steps in each of the above method embodiments.

[0176] In one embodiment, a computer program product is provided, including a computer program, and the computer program is executed by the processor to realize the steps in each of the above method embodiments.

[0177] It should be noted that the user information (including but not limited to user equipment information, user personal information, etc.) and data (including but not limited to data for analysis, stored data, displayed data, etc.) involved in the present application are all information and data authorized by the user or authorized by all parties, and the collection, use and processing of related data need to comply with relevant regulations.

[0178] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program. The computer program can be stored in a non-volatile computer readable storage medium, and when executed, can include the processes of the above-mentioned embodiment methods. Any reference to memory, database or other medium used in the embodiments provided in the present application can include at least one of non-volatile memory and volatile memory. The non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical storage, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetoresistive random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. The volatile memory can include random access memory (RAM) or external cache memory, etc. As an illustration but not limitation, the RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM), etc. The database involved in the embodiments provided in the present application can include at least one of a relational database and a non-relational database. The non-relational database can include a distributed database based on a block chain, etc., without being limited thereto. The processor involved in the embodiments provided in the present application can be a general-purpose processor, a central processing unit, a graphics processing unit, a digital signal processor, a programmable logic device, a data processing logic device based on quantum computing, an artificial intelligence (AI) processor, etc., without being limited thereto.

[0179] The technical features of the above embodiments can be combined arbitrarily. In order to make the description simple, all possible combinations of the technical features in the above embodiments are not described, however, as long as the combinations of the technical features do not exist contradictory, they should be considered as the scope of the present application.

[0180] The above-described embodiments are merely illustrative of several embodiments of the present application, and the description is relatively specific and detailed, but should not be understood as a limitation on the scope of the patent. It should be noted that for those skilled in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which are all within the scope of the present application. Therefore, the scope of protection of the present application should be subject to the appended claims.

Claims

1. A method for controlling the processing of bipolar plates, characterized in that, The method includes: During the processing of the bipolar plate, based on the first processing result of the bipolar plate at a first moment, the second processing result of the bipolar plate at a second moment after the first moment is predicted; If the bipolar plate meets the processing adjustment conditions based on the second processing result, the equipment parameters at the first moment are adjusted based on the second processing result. The bipolar plate is processed with the adjusted equipment parameters at the second time point.

2. The method according to claim 1, characterized in that, The first processing result includes: processing sub-results corresponding to each of the multiple workpiece parameters; the second processing result includes the prediction results for each of the workpiece parameters. The step of predicting the second processing result of the bipolar plate at a second time after the first time, based on the first processing result of the bipolar plate at a first time, includes: For historical moments prior to the first moment, obtain the historical processing results for each workpiece parameter at each historical moment; Based on the historical processing results and the processing sub-results, the prediction results of the bipolar plate at the second time after the first time are predicted.

3. The method according to claim 2, characterized in that, The step of determining that the bipolar plate meets the processing adjustment conditions based on the second processing result includes: Based on the mapping relationship between preset workpiece parameters and preset parameter weights, the target weights that match each of the workpiece parameters are determined respectively. The prediction results and target weights of each workpiece parameter are weighted to obtain the processing score of the bipolar plate at the second time step. If the processing score is less than or equal to the first score threshold, the bipolar plate is determined to meet the processing adjustment conditions.

4. The method according to claim 2, characterized in that, The number of historical moments mentioned is multiple; The prediction of the bipolar plate at a second time after the first time, based on the historical processing results and the processing sub-results, includes: For each workpiece parameter, determine the historical processing error between the historical processing results and the theoretical results of the workpiece parameter, and the processing error between the processing sub-results of the workpiece parameter and the theoretical results of the workpiece parameter; Analyze the historical processing errors at each of the historical moments to obtain the processing error trends corresponding to the workpiece parameters; The machining error trend corresponding to the workpiece parameters is matched with the machining error corresponding to the workpiece parameters. Based on the matching result, the prediction result of the bipolar plate matching the workpiece parameters at the second time after the first time is obtained.

5. The method according to claim 2, characterized in that, The number of historical moments mentioned is multiple; The prediction of the bipolar plate at a second time after the first time, based on the historical processing results and the processing sub-results, includes: For each historical moment, based on the historical processing results at that historical moment, determine the processing result trend corresponding to that historical moment; Based on the processing sub-results at the first time point, determine the processing result trend corresponding to the first time point; Determine the trend similarity between the processing result trend corresponding to the first time point and the processing result trend corresponding to the historical time point; The historical moment with the highest trend similarity is determined as the reference moment; The historical processing results of each historical moment following the reference moment are determined as the prediction results of each bipolar plate at the second moment after the first moment.

6. The method according to claim 1, characterized in that, The step of predicting the second processing result of the bipolar plate at a second time after the first time, based on the first processing result of the bipolar plate at a first time, includes: For historical bipolar plates from the same batch as the bipolar plate, obtain the historical processing sub-results of each workpiece parameter after the historical bipolar plate has been processed; Based on the historical processing sub-results of each of the workpiece parameters, target parameters that meet the processing adjustment conditions are selected from each of the workpiece parameters; Target results that match the target parameters are selected from the respective processing sub-results of each workpiece parameter; For the bipolar plate at a second time after the first time, based on the target result, a predicted processing result corresponding to the target parameters is predicted for the bipolar plate at the second time; the second processing result includes the predicted processing result.

7. The method according to claim 6, characterized in that, The first processing result includes: processing sub-results for each of the workpiece parameters; the step of selecting target parameters for the processing adjustment conditions from the workpiece parameters based on their respective historical processing sub-results includes: For each workpiece parameter, a first difference is obtained between the historical processing sub-results corresponding to the workpiece parameter and the theoretical results corresponding to the workpiece parameter; When the first difference is greater than or equal to the first difference threshold, if it is determined that the workpiece parameters matching the first difference satisfy the processing adjustment conditions, then the workpiece parameters matching the first difference are determined as target parameters.

8. The method according to claim 6, characterized in that, The first processing result includes: processing sub-results for each of the workpiece parameters; the step of selecting target parameters for the processing adjustment conditions from the workpiece parameters based on their respective historical processing sub-results includes: For each workpiece parameter, a second difference is obtained between the machining sub-result corresponding to the workpiece parameter and the historical machining sub-result; When the second difference is greater than or equal to the second difference threshold, if the workpiece parameters that match the second difference satisfy the processing adjustment conditions, then the workpiece parameters that match the second difference are determined as target parameters.

9. The method according to claim 6, characterized in that, The step of predicting the processing result of the bipolar plate at the second time corresponding to the target parameters based on the target result includes: For each historical moment prior to the first moment, obtain the historical processing result and historical processing error corresponding to the target parameter at the historical moment; Based on each of the historical processing errors, the historical processing results corresponding to each of the historical processing errors, and the target result, the predicted processing result of the bipolar plate at the second time corresponding to the target parameters is predicted.

10. A bipolar plate processing control device, characterized in that, The device includes: The prediction module is used to predict, based on the first processing result of the bipolar plate at a first moment, the second processing result of the bipolar plate at a second moment after the first moment during the processing of the bipolar plate. The processing module is used to adjust the equipment parameters at the first moment based on the second processing result, when it is determined that the bipolar plate meets the processing adjustment conditions based on the second processing result. A control module is used to process the bipolar plate with the adjusted device parameters at the second time.

11. A bipolar plate processing control system, characterized in that, The system includes: The detection system is used to obtain the first processing result of the bipolar plate at the first moment; A control system is configured to, during the processing of a bipolar plate, predict a second processing result of the bipolar plate at a second time after the first time, based on a first processing result of the bipolar plate at a first time; and, if it is determined based on the second processing result that the bipolar plate meets the processing adjustment conditions, adjust the equipment parameters at the first time based on the second processing result. Processing equipment for processing the bipolar plate at the second time point with the adjusted equipment parameters.

12. A computer device comprising a memory and a processor, wherein the memory stores a computer program, characterized in that, When the processor executes the computer program, it implements the steps of the method according to any one of claims 1 to 9.

13. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by a processor, it implements the steps of the method according to any one of claims 1 to 9.

14. A computer program product, comprising a computer program, characterized in that, When the computer program is executed by a processor, it implements the steps of the method according to any one of claims 1 to 9.

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