Chip mass production test method and device, storage medium and electronic equipment

Abstract

The invention discloses a chip mass production testing method and device, a storage medium and electronic device.The chip mass production testing method comprises the steps that a testing interval is defined, and the testing interval comprises at least one sub-testing interval; selecting a plurality of chips from a chip set which is in the same batch and belongs to the same corner as observation samples, and taking the rest of chips as test objects; reading the temperature digital code values of the temperature sensor of the observation sample at the starting point and the ending point of the sub-test interval to obtain a starting point code and an ending point code; obtaining a first temperature variation according to the starting point code and the terminal point code; calculating a reference value and a deviation threshold value based on the first temperature change amount; acquiring a starting point code and an end point code of each test object in the sub-test interval to obtain a second temperature variation; and calculating the deviation between the second temperature variation and the reference value, and determining whether the test object is qualified or not according to the comparison between the deviation and a deviation threshold value. According to the embodiment of the invention, the efficiency of chip production measurement can be improved.

Description

TECHNICAL FIELD

[0001] Embodiments of the present application relate to the technical field of chip temperature testing, and in particular to a chip mass production testing method and device, a storage medium and an electronic device. BACKGROUND

[0002] With the continuous improvement of chip integration and the continuous increase of working frequency, the heat generated by the chip during operation gradually increases, and the temperature change has a significant impact on the performance and reliability of the chip. In order to realize the monitoring and dynamic adjustment of the internal temperature of the chip, the temperature sensor has become a common built-in functional module in the chip. The accuracy of the chip temperature sensor is directly related to the reliability of temperature compensation, dynamic power management and overheat protection functions, so it is usually necessary to remove the chips with abnormal measurement performance of the temperature sensor during the chip production test stage.

[0003] At present, the test of the temperature sensor mainly relies on external constant temperature equipment (such as a hot plate, a temperature control box, etc.), and the output code value of the temperature sensor is measured at multiple set temperature points to establish a temperature curve. However, the external constant temperature device needs tens of seconds or even minutes of heating or cooling time to realize the change of temperature, resulting in low production line efficiency. SUMMARY

[0004] Embodiments of the present application provide a chip mass production testing method and device, a storage medium and an electronic device, which can improve the efficiency of chip mass production testing.

[0005] In a first aspect, embodiments of the present application provide a chip mass production testing method, comprising: defining a test interval, the test interval comprising at least one sub-test interval, the sub-test interval corresponding to an interval with significant temperature change during chip production testing; selecting a plurality of chips from a chip set of the same batch and belonging to the same corner as observation samples, and the remaining chips as test objects; respectively reading the temperature digital code value of the temperature sensor of the observation sample at the start point and the end point of the sub-test interval to obtain the start point code and the end point code, and further obtaining a first temperature change; calculating a reference value and a deviation threshold based on the first temperature change; respectively reading the temperature digital code value of the temperature sensor of the test object at the start point and the end point of the sub-test interval to obtain the start point code and the end point code, and further obtaining a second temperature change; determining whether the test object is qualified according to the reference value, the deviation threshold and the second temperature change.

[0006] In the chip mass production test method provided in the embodiments of the present application, the reference value and the deviation threshold value are calculated based on the first temperature change amount, and the calculation includes: calculating a reference value according to the first temperature change amount; calculating a deviation threshold value according to the first temperature change amount and the reference value.

[0007] In the chip mass production test method provided in the embodiments of the present application, the reference value is calculated according to the first temperature change amount, and the calculation includes: removing the maximum value and the minimum value from a plurality of the first temperature change amounts to obtain a standard change value set; obtaining the average value of the standard change value set and taking it as the reference value.

[0008] In the chip mass production test method provided in the embodiments of the present application, the deviation threshold value is calculated according to the first temperature change amount and the reference value, and the calculation includes: calculating the deviation value of each observation sample relative to the reference value according to the first temperature change amount; performing arithmetic average on a plurality of the deviation values to obtain the deviation threshold value.

[0009] In the chip mass production test method provided in the embodiments of the present application, when the test interval includes one sub-test interval, the determination of whether the chip is qualified according to the reference value, the deviation threshold value and the second temperature change amount includes: calculating the absolute value of the difference between the second temperature change amount and the reference value; when the absolute value of the difference is greater than or equal to the deviation threshold value, determining that the chip is unqualified; when the absolute value of the difference is less than the deviation threshold value, determining that the chip is qualified.

[0010] In the chip mass production test method provided in the embodiments of the present application, when the test interval includes at least two sub-test intervals, the determination of whether the chip is qualified according to the reference value, the deviation threshold value and the second temperature change amount includes: calculating the absolute value of the difference between the second temperature change amount and the reference value; comparing the absolute value of the difference with the deviation threshold value, and determining the test mark of the chip in each sub-test interval according to the comparison result; when the first mark in the test mark is greater than a preset number, determining that the chip is unqualified.

[0011] In the chip mass production test method provided in the embodiments of the present application, the determination of the test mark of the chip in each sub-test interval according to the comparison result includes: determining the test mark of the chip in the corresponding sub-test interval as a first mark when the absolute value of the difference is greater than or equal to the deviation threshold value; determining the test mark of the chip in the corresponding sub-test interval as a second mark when the absolute value of the difference is less than the deviation threshold value.

[0012] In a second aspect, an embodiment of the present application provides a chip mass production testing device, comprising: a defining unit configured to define a test interval, wherein the test interval comprises at least one sub-test interval, and the sub-test interval corresponds to an interval with significant temperature change in a chip mass production process; a selecting unit configured to select a plurality of chips as observation samples from a chip set of the same batch and the same corner, and select the rest of the chips as test objects; a reading unit configured to read temperature digital code values of temperature sensors of the observation samples at a start point and an end point of the sub-test interval respectively, to obtain start point code and end point code, and further obtain a first temperature change amount; a calculating unit configured to calculate a reference value and a deviation threshold value based on the first temperature change amount; an obtaining unit configured to read temperature digital code values of temperature sensors of the test objects at the start point and the end point of the sub-test interval respectively, to obtain start point code and end point code, and further obtain a second temperature change amount; a determining unit configured to determine whether the test objects are qualified according to the reference value, the deviation threshold value and the second temperature change amount.

[0013] In a third aspect, the present application provides a storage medium, which stores a plurality of instructions, and the instructions are adapted to be loaded by a processor to execute the chip mass production testing method of any one of the above aspects.

[0014] In a fourth aspect, the present application provides an electronic device, which comprises a memory, a processor and a computer program stored in the memory and capable of running on the processor, wherein the processor implements the chip mass production testing method of any one of the above aspects when executing the computer program.

[0015] In summary, the chip mass production test method provided in the embodiments of the present application comprises defining a test interval, the test interval comprising at least one sub-test interval, the sub-test interval corresponding to an interval with significant temperature change in the chip production test process; selecting a plurality of chips from a same batch and a same corner as observation samples, and the rest of the chips as test objects; reading the temperature digital code values of the temperature sensors of the observation samples at the start point and the end point of the sub-test interval respectively, obtaining start point code and end point code, and then obtaining a first temperature change amount; calculating a reference value and a deviation threshold based on the first temperature change amount; reading the temperature digital code values of the temperature sensors of the test objects at the start point and the end point of the sub-test interval respectively, obtaining start point code and end point code, and then obtaining a second temperature change amount; and determining whether the test objects are qualified according to the reference value, the deviation threshold and the second temperature change amount. The embodiments of the present application use the self-heating in the chip production test process as the temperature sensor measurement condition to remove the chips with abnormal temperature sensors, and thus improve the efficiency of chip production test. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative effort.

[0017] Figure 1 is a flowchart of the chip mass production test method provided in the embodiments of the present application.

[0018] Figure 2 is a structural schematic diagram of the chip mass production test device provided in the embodiments of the present application.

[0019] Figure 3 is a structural schematic diagram of the electronic device provided in the embodiments of the present application. DETAILED DESCRIPTION

[0020] The exemplary embodiments will be described in detail hereinafter with reference to the drawings. Unless otherwise defined, the same numbers in different drawings indicate the same or similar elements throughout the various drawings. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application. Instead, they are merely examples of apparatuses and methods consistent with some aspects of the present application as detailed in the appended claims.

[0021] It should be noted that the terms "comprise", "comprising", or any other variations thereof, are intended to cover a non-exclusive inclusion, such that processes, methods, articles, or apparatuses comprising a list of elements are not limited to those elements, but can include other elements not expressly listed or inherent to such processes, methods, articles, or apparatuses. Without further limitation, an element defined by the phrase "comprising a" does not exclude the existence of additional identical elements in the process, method, article, or apparatus including the element. In addition, components, features, elements with the same name in different embodiments of the present application can have the same meaning or different meanings, and the specific meaning thereof should be determined in conjunction with the explanation thereof in the specific embodiment or further in conjunction with the context in the specific embodiment.

[0022] It should be understood that the specific embodiments described herein are merely intended to explain the present application and are not intended to limit the present application.

[0023] In the following description, the suffix used for an element such as "module", "part", or "unit" is merely used to facilitate explanation of the present application, and does not have a specific meaning by itself. Thus, "module", "part", or "unit" can be mixedly used.

[0024] In the description of the present application, it should be noted that the terms "upper", "lower", "left", "right", "inner", "outer", and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are merely used to facilitate the description of the present application and simplify the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus cannot be understood as a limitation on the present application. In addition, the terms "first", "second", and the like are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0025] Currently, the test of temperature sensors mainly relies on external constant temperature equipment (such as hot plates, temperature control boxes, etc.), and the temperature curve is established by measuring the output code value of the temperature sensor at multiple set temperature points. However, the temperature response delay and thermal coupling difference between different devices or jigs will introduce system errors, resulting in low precision of the test results of the temperature sensor.

[0026] In addition, such a method has high requirements for the test environment, large equipment cost, and long test period, which is not conducive to large-scale implementation in the mass production stage.

[0027] Based on this, the chip mass production testing method, device, storage medium and electronic equipment are provided in the embodiments of the present application. Specifically, the chip mass production testing device can be integrated in an electronic equipment, which can be a server or a terminal or the like. The terminal can include a mobile phone, a wearable smart device, a tablet computer, a notebook computer, a personal computer (PC), and the like. The server can be a single server or a server cluster composed of multiple servers, and can be a physical server or a virtual server.

[0028] The technical solutions shown in the present application will be described in detail below through specific embodiments. It should be noted that the order of the following embodiments is not limited to the priority order of the embodiments.

[0029] Please refer to Figure 1 , Figure 1 is a flowchart of the chip mass production testing method provided by the embodiments of the present application. The specific process of the chip mass production testing method can be as follows: 101, define a test interval, the test interval includes at least one sub-test interval, the sub-test interval corresponds to the interval with significant temperature change in the chip production testing process.

[0030] In the embodiments of the present application, the test interval is used to determine the time range of temperature collection in the chip mass production testing process. By defining the test interval, a stable and repeatable temperature change process can be obtained during the self-heating of the chip, thereby avoiding the interference of external temperature control equipment. Wherein, the significant temperature change refers to that the temperature of the chip surface or inside changes obviously in a short time during the chip production testing process, and the change amplitude or change rate exceeds the preset threshold.

[0031] Wherein, when the test interval includes a sub-test interval, the sub-test interval can take the start time of the chip or a predetermined starting event as the starting point, and take the predetermined ending event of the chip as the ending point. Specifically, the predetermined starting event can be the power-on of the chip, system reset, completion of startup or entering a specific test mode, etc. The predetermined ending event can be that the chip reaches a stable workload, completes a specific test task or runs to a preset time threshold.

[0032] It should be noted that the determination of the starting point and the ending point can be automatically recognized and recorded by the test control system, or can be configured through an external test script.

[0033] In some embodiments, the sub-test interval can be preset with a length according to a heat generation curve or a power consumption model of the chip, such as 5 seconds, 10 seconds, or other adjustable time, to ensure that the temperature of the chip can produce an observable rising amplitude within the sub-test interval. Each sub-test interval corresponds to a time period or phase (interval) in which the temperature of the chip changes significantly during the production test process. For example, in the phase of starting up the chip, entering a high-power test mode, or executing a specific computing load, the internal power consumption of the chip rises, causing the temperature to rise rapidly. Such intervals can be divided into sub-test intervals. By observing in these representative temperature change intervals, the thermal response characteristics of the chip under typical workloads can be more accurately reflected.

[0034] When the test interval includes at least two sub-test intervals, each sub-test interval can correspond to a time period or functional phase during the operation of the chip, such as a startup phase, a power-on phase, or a load stabilization phase. By collecting and calculating the temperature in multiple sub-test intervals respectively, multi-dimensional information of the temperature change of the chip can be obtained, so that the response consistency of the temperature sensor under different thermal states can be more accurately evaluated.

[0035] In another embodiment, to avoid time errors caused by manual operation, the start point of the sub-test interval can be triggered by an automatic timing control module. For example, after the chip is powered on, the test controller can automatically time, issue a sampling signal at a preset time point, and read the temperature digital code value of the temperature sensor. This automatic control method can ensure that the test time windows of different chips are strictly consistent, thereby improving the comparability between samples.

[0036] In addition, the sub-test interval can also be bound with existing functional test items in the production test process, such as the "power-on test", "current consumption test", "logic function verification", and other links. By reusing the time windows of these phases for temperature sensor sampling, there is no need to extend the test period, thereby realizing efficient integration of the test process.

[0037] Through the above settings, not only the standardization of the temperature sampling time window can be realized, but also the consistency of different chips in the test conditions, heat generation states, and sampling timing can be ensured. This consistency is the basis for subsequent calculation of reference values and deviation thresholds, thereby providing a guarantee for the accuracy and repeatability of the temperature sensor test results.

[0038] 102、Select several chips from the chip set of the same batch and belonging to the same corner as observation samples, and the remaining chips as test objects.

[0039] To establish a statistical model of temperature changes, a number of chips need to be selected from the chip set under test as observation samples, while the remaining chips are used as test objects. The chip set should come from the same production batch and belong to the same corner, that is, under the same combination of process parameters, voltage, and temperature conditions, to ensure that the measured temperature characteristics can reflect the true chip performance without being interfered with by process or environmental deviations.

[0040] It should be noted that the number of observation samples should be no less than 1 / 10 of the number of chips in the batch to ensure the representativeness of the statistical results. The selection of observation samples can be carried out by random sampling or equal sampling according to the wafer distribution to ensure that the samples can cover the overall characteristics of the batch.

[0041] Understandably, since the observed samples and the test objects belong to the same batch, the same corner, and the same test interval, a reliable statistical reference can be obtained by using the average performance of the observed samples, effectively eliminating the influence of process and environmental factors on single-chip data.

[0042] 103. Read the temperature digital code values ​​of the temperature sensor of the observed sample at the start and end points of the sub-test interval respectively to obtain the start code and end code, and then obtain the first temperature change.

[0043] In this embodiment, the temperature digital code value of the temperature sensor of each observed sample chip can be read at the beginning and end of each sub-test interval. This temperature digital code value is the digital measurement result output by the internal temperature sensor of the chip, and can be read through the on-chip register interface or an external test machine.

[0044] To ensure consistent sampling time points, the sampling process is triggered by an automatic timer or test control module. The system can start timing after the chip is powered on and automatically execute sampling commands at each preset time point. Sampling data can be uploaded to a host computer or production test server in real time for recording.

[0045] It is important to note that during temperature acquisition, the test environment should be kept stable, ensuring that all observed samples are under the same operating conditions. For example, the test power supply voltage, clock frequency, and load should all remain consistent. By standardizing the sampling timing and environmental conditions, data fluctuations caused by non-temperature factors can be minimized, providing highly consistent raw data for subsequent calculations.

[0046] After obtaining the starting and ending codes, the first temperature change can be obtained. Specifically, this can be determined based on the starting code. and the destination code Calculate the temperature change for each observed sample. ,Right now .

[0047] 104、calculating a reference value and a deviation threshold based on the first temperature change amount.

[0048] Specifically, the reference value can be calculated according to the first temperature change amount calculating a reference value; calculating a deviation threshold according to the first temperature change amount and the reference value . .

[0049] In some embodiments, the maximum and minimum values of the first temperature change amounts can be removed to obtain a standard change value set; then the average value of the standard change value set is obtained and taken as the reference value.

[0050] In some embodiments, the deviation value of each observation sample relative to the reference value can be calculated according to the first temperature change amount; the deviation threshold is obtained by arithmetically averaging a plurality of deviation values.

[0051] In addition, the sample standard deviation of the deviation value can also be calculated to evaluate the dispersion degree; when the sample standard deviation or the deviation mean value exceeds the preset range, the corresponding abnormal observation sample can be removed, and the reference value and the deviation threshold are recalculated based on the remaining observation samples.

[0052] The arithmetically averaging a plurality of deviation values to obtain the deviation threshold can be specifically as follows: .

[0053] The sample standard deviation of the deviation value can be specifically as follows: .

[0054] In the above manner, the abnormal points can be automatically filtered out, and the reference value and the threshold accurately reflect the temperature rise characteristics of the normal chip.

[0055] 105、respectively reading the temperature digital code value of the temperature sensor of the test object at the start point and the end point of the sub-test interval to obtain the start point code and the end point code, and further obtaining the second temperature change amount.

[0056] The temperature sensor temperature digital code value of each test object can be respectively read at the start point and the end point of the sub-test interval corresponding to each test object, and the difference between the two is calculated to obtain the second temperature change amount of each test object in the sub-test interval.

[0057] 106、determining whether the test object is qualified according to the reference value, the deviation threshold and the second temperature change amount.

[0058] In some embodiments, when the test interval includes one sub-test interval, the absolute value of the difference between the second temperature change amount and the reference value can be calculated first; when the absolute value of the difference is greater than or equal to the deviation threshold, the chip is determined to be unqualified; and when the absolute value of the difference is less than the deviation threshold, the chip is determined to be qualified.

[0059] In another embodiment, when the test interval includes at least two sub-test intervals, the absolute value of the difference between the second temperature change amount and the reference value can be calculated first; then the absolute value of the difference is compared with the deviation threshold, and the test marks of the chip in each sub-test interval are determined according to the comparison result; when the first mark in the test marks is greater than a preset number, the chip is determined to be unqualified.

[0060] Specifically, when the absolute value of the difference is greater than or equal to the deviation threshold, the test mark of the chip in the corresponding sub-test interval is determined to be the first mark; and when the absolute value of the difference is less than the deviation threshold, the test mark of the chip in the corresponding sub-test interval is determined to be the second mark.

[0061] In some embodiments, the theoretical temperature rise amount of the chip in a specific test interval can also be obtained directly according to laboratory simulation or theoretical analysis. This theoretical value can be used as a reference value for subsequent chip temperature rise determination. Similarly, when the theoretical temperature rise amount is used as a reference value, the deviation threshold is no longer obtained by observing samples, but is determined by process experience, theoretical model error or safety margin. Since the reference value is derived from a theoretical model, there is no need to calculate the average value and the deviation threshold by observing samples, so steps 102, 103 and 104 in the original process can be omitted.

[0062] In summary, the chip mass production test method provided in the embodiments of the present application comprises defining a test interval, the test interval comprising at least one sub-test interval, the sub-test interval corresponding to an interval with significant temperature change in the chip production test process; selecting a plurality of chips from a chip set of the same batch and belonging to the same corner as observation samples, and the rest of the chips as test objects; reading the temperature digital code values of the temperature sensors of the observation samples at the start point and the end point of the sub-test interval respectively to obtain start point code and end point code, and then obtaining a first temperature change amount; calculating a reference value and a deviation threshold based on the first temperature change amount; reading the temperature digital code values of the temperature sensors of the test objects at the start point and the end point of the sub-test interval respectively to obtain start point code and end point code, and then obtaining a second temperature change amount; and determining whether the test objects are qualified according to the reference value, the deviation threshold and the second temperature change amount. The embodiments of the present application define a unified test interval during chip self-heating, and collect the temperature digital code values at the start point and the end point on the chips of the same batch and the same corner, calculate the reference value and the deviation threshold by using statistical methods, and realize dynamic evaluation of the output consistency of the temperature sensor. Since the test interval is fixed, the sample source is consistent, and the mean value and the standard deviation are calculated comprehensively, the influence of test environment differences, process fluctuations and manual operation errors is effectively reduced, so that the calculation of the reference value and the deviation threshold is stable and reliable. Since the selection of the sub-test interval reuses other test items of the chip on the production line, no additional test time is required, and no external second-level or even minute-level temperature environment change time is required, so that the test efficiency of the chip temperature sensor can be improved without increasing additional test cost, and the efficiency of the chip mass production test can be improved.

[0063] To better implement the chip mass production test method provided in the embodiments of the present application, the embodiments of the present application further provide a chip mass production test device. The meanings of the terms are the same as those in the above chip mass production test method, and the specific implementation details can be referred to the description in the method embodiments.

[0064] Please refer to Figure 2 , Figure 2 is a structural schematic diagram of the chip mass production test device provided in the embodiments of the present application. The chip mass production test device can comprise a defining unit 201, a selecting unit 202, a reading unit 203, a calculating unit 204, an obtaining unit 205 and a determining unit 206. Among them, The defining unit 201 is configured to define a test interval, the test interval comprising at least one sub-test interval, the sub-test interval corresponding to an interval with significant temperature change in the chip production test process; The selecting unit 202 is configured to select a plurality of chips from a chip set of the same batch and belonging to the same corner as observation samples, and the rest of the chips as test objects; The reading unit 203 is used to read the temperature digital code value of the temperature sensor of the observed sample at the start and end of the sub-test interval, respectively, to obtain the start code and end code, and then to obtain the first temperature change. Calculation unit 204 is used to calculate a reference value and a deviation threshold based on the first temperature change. The acquisition unit 205 is used to read the temperature digital code value of the temperature sensor of the test object at the start and end of the sub-test interval respectively, to obtain the start code and end code, and then to obtain the second temperature change amount; The determination unit 206 is used to determine whether the test object is qualified based on the reference value, the deviation threshold, and the second temperature change.

[0065] For specific implementation methods of each of the above units, please refer to the embodiments of the chip mass production testing method described above, which will not be repeated here.

[0066] In summary, the chip mass production testing apparatus provided in this application embodiment can define a test interval through the definition unit 201. The test interval includes at least one sub-test interval, which corresponds to the interval where the temperature changes significantly during chip production testing. The selection unit 202 selects several chips from a set of chips in the same batch and belonging to the same corner as observation samples, and the remaining chips as test objects. The reading unit 203 reads the temperature digital code values ​​of the temperature sensors of the observation samples at the start and end points of the sub-test intervals to obtain the start code and end code, thereby obtaining the first temperature change. The calculation unit 204 calculates a reference value and a deviation threshold based on the first temperature change. The acquisition unit 205 reads the temperature digital code values ​​of the temperature sensors of the test objects at the start and end points of the sub-test intervals to obtain the start code and end code, thereby obtaining the second temperature change. The determination unit 206 determines whether the test object is qualified based on the reference value, the deviation threshold, and the second temperature change. This application's embodiments define a unified test interval during the chip's self-heating process and collect temperature digital codes at the start and end points from chips in the same batch and at the same corner. Statistical methods are used to calculate reference values ​​and deviation thresholds, achieving dynamic evaluation of the temperature sensor's output consistency. Because the test interval is fixed, the sample source is consistent, and the calculation uses a combination of mean and standard deviation, the impact of differences in the testing environment, process fluctuations, and human error is effectively reduced. Therefore, the calculation of reference values ​​and deviation thresholds is stable and reliable. Since the selection of sub-test intervals reuses other test items on the chip production line, no additional testing time or external temperature environment change times at the second or even minute level are required. Therefore, the testing efficiency of the chip temperature sensor can be improved without increasing additional testing costs, thereby improving the efficiency of chip mass production testing.

[0067] This application also provides an electronic device that may integrate the chip mass production testing device of this application, such as... Figure 3 As shown, it illustrates a structural schematic diagram of the electronic device involved in the embodiments of this application, specifically: The electronic device may include components such as a processor 301 with one or more processing cores and a memory 302 with one or more computer-readable storage media. Those skilled in the art will understand that... Figure 3 The electronic device structure shown does not constitute a limitation on the electronic device and may include more or fewer components than shown, or combine certain components, or have different component arrangements. Wherein: The processor 301 is the control center of the electronic device. It connects various parts of the electronic device via various interfaces and lines. By running or executing software programs stored in the memory 302 and / or this application, and by calling data stored in the memory 302, it performs various functions and processes data, thereby providing overall monitoring of the electronic device. Optionally, the processor 301 may include one or more processing cores; preferably, the processor 301 may integrate an application processor and a modem processor, wherein the application processor mainly handles the operation of the storage medium, user interface, and application programs, while the modem processor mainly handles wireless communication. It is understood that the modem processor may not be integrated into the processor 301.

[0068] The memory 302 can be used to store software programs and this application. The processor 301 executes various functional applications and data processing by running the software programs and this application stored in the memory 302. The memory 302 may mainly include a program storage area and a data storage area. The program storage area may store applications required for operating the storage medium and at least one function; the data storage area may store data created based on the use of the electronic device. In addition, the memory 302 may include high-speed random access memory and may also include non-volatile memory, such as at least one disk storage device, flash memory device, or other volatile solid-state storage device. Accordingly, the memory 302 may also include a memory controller to provide the processor 301 with access to the memory 302.

[0069] Although not shown, the electronic device may also include a display unit, an input unit, and a power supply, etc., which will not be described in detail here. Specifically, in this embodiment, the processor 301 in the electronic device loads the executable files corresponding to the processes of one or more application programs into the memory 302 according to the following instructions, and the processor 301 runs the application programs stored in the memory 302 to realize various functions, as follows: defining a test interval, the test interval including at least one sub-test interval, the sub-test interval corresponding to a temperature variation significant interval in a chip production test process; selecting a plurality of chips as observation samples from a chip set of the same batch and belonging to the same corner, and the rest of the chips as test objects; reading temperature digital code values of temperature sensors of the observation samples at a start point and an end point of the sub-test interval respectively to obtain start point code and end point code, and further obtain a first temperature variation; calculating a reference value and a deviation threshold based on the first temperature variation; reading temperature digital code values of temperature sensors of the test objects at the start point and the end point of the sub-test interval respectively to obtain start point code and end point code, and further obtain a second temperature variation; determining whether the test objects are qualified according to the reference value, the deviation threshold and the second temperature variation.

[0070] Those skilled in the art can understand that all or part of the steps in the various methods of the above embodiments can be completed by instructions, or by related hardware controlled by the instructions, which can be stored in a computer readable storage medium and loaded and executed by a processor.

[0071] To this end, the embodiments of the present application provide a storage medium, which stores a plurality of instructions, the instructions can be loaded by a processor to execute the steps in any method provided by the embodiments of the present application. For example, the instructions can execute the following steps: defining a test interval, the test interval including at least one sub-test interval, the sub-test interval corresponding to a temperature variation significant interval in a chip production test process; selecting a plurality of chips as observation samples from a chip set of the same batch and belonging to the same corner, and the rest of the chips as test objects; reading temperature digital code values of temperature sensors of the observation samples at a start point and an end point of the sub-test interval respectively to obtain start point code and end point code, and further obtain a first temperature variation; calculating a reference value and a deviation threshold based on the first temperature variation; reading temperature digital code values of temperature sensors of the test objects at the start point and the end point of the sub-test interval respectively to obtain start point code and end point code, and further obtain a second temperature variation; determining whether the test objects are qualified according to the reference value, the deviation threshold and the second temperature variation.

[0072] The specific implementation of each operation can be referred to the foregoing embodiments, which will not be described here.

[0073] The storage medium can include a read-only memory (ROM), a random access memory (RAM), a magnetic disk, an optical disk, or the like.

[0074] Due to the instructions stored in the storage medium, the steps in any method provided by the embodiments of the present application can be executed, thus achieving the beneficial effects of any method provided by the embodiments of the present application. Details are shown in the foregoing embodiments, which will not be repeated here.

[0075] The chip mass production test method, device, storage medium and electronic equipment provided by the present application are described in detail above, and the principles and implementation manners of the present application are described by applying specific examples. The above embodiment is only used to help understand the core idea of the present application; at the same time, for those skilled in the art, according to the idea of the present application, the specific implementation manner and application range will be changed; in summary, the content of the specification should not be understood as a limitation of the present application.

Claims

1. A method of mass testing of chips, characterized by, include: Define a test interval, which includes at least one sub-test interval, and the sub-test interval corresponds to the interval where the temperature changes significantly during chip production testing; Several chips were selected from the same batch of chips belonging to the same corner as observation samples, and the remaining chips were used as test objects. The temperature digital code values ​​of the temperature sensor of the observed sample are read at the beginning and end of the sub-test interval respectively to obtain the start code and end code, and then the first temperature change is obtained. Calculate the reference value and deviation threshold based on the first temperature change; The temperature digital code values ​​of the temperature sensor of the test object are read at the beginning and end of the sub-test interval respectively to obtain the start code and end code, and then the second temperature change is obtained. The test object is deemed qualified based on the reference value, the deviation threshold, and the second temperature change.

2. The chip production test method according to Claim 1, wherein The calculation of the reference value and deviation threshold based on the first temperature change includes: Calculate the reference value based on the first temperature change; The deviation threshold is calculated based on the first temperature change and the reference value.

3. The chip production test method according to Claim 2, wherein The calculation of the reference value based on the first temperature change includes: By removing the maximum and minimum values ​​from several of the first temperature changes, a set of standard change values ​​is obtained; Obtain the average value of the standard set of change values ​​and use it as a reference value.

4. The chip mass production test method according to Claim 2, wherein The step of calculating the deviation threshold based on the first temperature change and the reference value includes: Calculate the deviation value of each observed sample relative to the reference value based on the first temperature change; The deviation threshold is obtained by taking the arithmetic mean of several deviation values.

5. The chip production test method according to Claim 1, wherein When the test interval includes a sub-test interval, determining whether the chip is qualified based on the reference value, the deviation threshold, and the second temperature change includes: Calculate the absolute value of the difference between the second temperature change and the reference value; When the absolute value of the difference is greater than or equal to the deviation threshold, the chip is determined to be defective. When the absolute value of the difference is less than the deviation threshold, the chip is determined to be qualified.

6. The chip production test method according to Claim 1, wherein When the test interval includes at least two sub-test intervals, determining whether the chip is qualified based on the reference value, the deviation threshold, and the second temperature change includes: Calculate the absolute value of the difference between the second temperature change and the reference value; The absolute value of the difference is compared with the deviation threshold, and the test mark of the chip in each sub-test interval is determined based on the comparison result; When the first mark in the test marks is greater than a preset number, the chip is determined to be defective.

7. The chip production test method according to Claim 6, wherein The test marker for the chip in each sub-test interval is determined based on the comparison results, including: When the absolute value of the difference is greater than or equal to the deviation threshold, the test mark of the chip in the corresponding sub-test interval is determined as the first mark; When the absolute value of the difference is less than the deviation threshold, the test mark of the chip in the corresponding sub-test interval is determined as the second mark.

8. A chip mass production testing apparatus characterized by comprising: include: A definition unit is used to define a test interval, which includes at least one sub-test interval, and the sub-test interval corresponds to the interval where the temperature changes significantly during chip production testing; The selection unit is used to select a number of chips as observation samples from a chip set that is from the same batch and belongs to the same corner, while the remaining chips are used as test objects. The reading unit is used to read the temperature digital code value of the temperature sensor of the observed sample at the start and end of the sub-test interval respectively, to obtain the start code and end code, and then to obtain the first temperature change. The calculation unit is used to calculate a reference value and a deviation threshold based on the first temperature change. The acquisition unit is used to read the temperature digital code value of the temperature sensor of the test object at the start and end of the sub-test interval respectively, to obtain the start code and end code, and then to obtain the second temperature change amount; The determining unit is used to determine whether the test object is qualified based on the reference value, the deviation threshold and the second temperature change.

9. A storage medium, characterized in that, The storage medium stores multiple instructions, which are adapted for loading by a processor to execute the chip mass production testing method according to any one of claims 1-7.

10. An electronic device, characterized in that, It includes a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the chip mass production testing method as described in any one of claims 1-7.

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