Fan rotating speed regulation method and electronic device

Abstract

This application provides a fan speed control method and electronic device, which can be applied to the field of heat dissipation technology. The method includes: when the controller detects a mismatch between the current configuration and the current heat dissipation strategy during the operation of the electronic device, for any first fan and a second fan adjacent to the first fan: the speed of the first fan is controlled to a first preset speed, and the speed of the second fan is increased from the first preset speed by a first preset step size; a first critical speed of the second fan is recorded when the actual speed of the first fan differs from the first preset speed; and a speed interference mapping relationship is generated based on the first preset speeds of each fan; a heat dissipation level mapping relationship is generated based on the heat dissipation level of the multiple fans for any component; a target heat dissipation strategy is determined based on the speed interference mapping relationship and the heat dissipation level mapping relationship; and the speeds of the multiple fans are controlled based on the temperature alarm levels of the multiple components.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and in particular to a fan speed control method and electronic device. Background Technology

[0002] As the amount of data processed by electronic devices continues to increase, these devices inevitably generate a significant amount of heat during high-speed operation (e.g., high-speed operation refers to data transfer rates exceeding 10 GB per second). Therefore, air cooling is commonly used to dissipate heat from electronic devices. In air cooling systems, a set of fans are placed side-by-side inside the electronic device to remove the generated heat through airflow. However, the internal space of the computer case is not an ideally uniform channel, resulting in inconsistent cooling performance from each fan.

[0003] Furthermore, within electronic devices, spatial constraints alter airflow direction, causing collisions between airflows from different directions and thus interfering with airflow over a wider area. Consequently, airflow increases in some areas and decreases in others. Moreover, as fan speed increases, the interference between different airflows intensifies, affecting heat dissipation and potentially even causing fan speed to decrease. Summary of the Invention

[0004] In view of the above problems, this application provides a fan speed control method and an electronic device.

[0005] According to a first aspect of this application, a fan speed control method is provided, applied to an electronic device equipped with fans. The electronic device includes a controller, multiple fans, and multiple components. The method includes: when the controller detects a mismatch between the current configuration of the electronic device and a current heat dissipation strategy during operation, for any first fan among the multiple fans and at least one second fan adjacent to the first fan, adjusting the speed of the first fan to a first preset speed, and increasing the speed of the second fan from the first preset speed by a first preset step size, recording a first critical speed of the second fan when the actual speed of the first fan differs from the first preset speed; generating a speed interference mapping relationship between adjacent fans based on the first preset speed and the first critical speed of each of the multiple fans; generating a heat dissipation level mapping relationship between the fans and the components based on the heat dissipation level of each of the multiple fans for any component in the current configuration; determining a target heat dissipation strategy matching the current configuration based on the speed interference mapping relationship and the heat dissipation level mapping relationship; and controlling the speed of the multiple fans based on the target heat dissipation strategy and the temperature alarm level of each component in the current configuration.

[0006] A second aspect of this application provides a fan speed control device, comprising: a speed increment module, a first generation module, a second generation module, a determination module, and a control module.

[0007] The speed increment module is used to, when it is detected during the operation of the electronic device that the current configuration of the electronic device does not match the current heat dissipation strategy, adjust the speed of the first fan to a first preset speed for any of the multiple fans and at least one second fan adjacent to the first fan, and increment the speed of the second fan from the first preset speed according to a first preset step size, and record the first critical speed of the second fan when the actual speed of the first fan is different from the first preset speed.

[0008] The first generation module is used to generate a speed interference mapping relationship between adjacent fans based on the first preset speed and the first critical speed of each of the above-mentioned multiple fans.

[0009] The second generation module is used to generate a heat dissipation level mapping relationship between the fans and the components based on the heat dissipation level of the multiple fans for any component in the current configuration.

[0010] The determination module is used to determine the target heat dissipation strategy that matches the current configuration based on the above-mentioned speed interference mapping relationship and heat dissipation level mapping relationship.

[0011] The control module is used to control the speed of the multiple fans based on the target heat dissipation strategy and the temperature alarm level of each component in the current configuration.

[0012] A third aspect of this application provides an electronic device including multiple fans, multiple components, and a controller, wherein the controller is used to execute the fan speed control method to control the speed of the multiple fans to dissipate heat from the multiple components.

[0013] A fourth aspect of this application also provides a computer-readable storage medium having a computer program or instructions stored thereon, which, when executed by a processor, implement the steps of the above-described method.

[0014] The fifth aspect of this application also provides a computer program product, including a computer program or instructions that, when executed by a processor, implement the steps of the above-described method.

[0015] According to the fan speed control method provided in this application, since the most significant influence on fan speed comes from its adjacent fans, for any first fan among multiple fans, the interference of the second fan on the first fan is detected based on its adjacent second fan. Furthermore, to obtain the interference status of the second fan on the first fan, the speed of the first fan is controlled to a first preset speed, and the speed of the second fan is increased incrementally from the first preset speed by a first preset step size. The first critical speed of the second fan is recorded when its actual speed differs from the first preset speed; that is, at this point, the airflow driven by the second fan interferes with the first fan. Based on this, a speed interference mapping relationship between adjacent fans is generated according to the first preset speed and the first critical speed of each fan. Moreover, since the current configuration of the electronic device changes, the speed of each fan is adjusted sequentially to dissipate heat from any component to determine the heat dissipation level of each fan for any component, thereby generating a heat dissipation level mapping relationship between the fan and the component. Thus, based on the speed interference mapping relationship and the heat dissipation level mapping relationship, a target heat dissipation strategy matching the current configuration is determined, so that when controlling the speed of multiple fans based on the target heat dissipation strategy, the interference between adjacent fans can be taken into account. Based on this, the heat dissipation effect of various components of electronic devices can be further improved. Attached Figure Description

[0016] Figure 1 A schematic diagram of the operation of a fan in air-cooled electronic devices in related technologies is shown;

[0017] Figure 2 A schematic diagram of airflow inside an air-cooled electronic device is shown;

[0018] Figure 3 A schematic diagram of airflow in reverse rotation of the internal fan of an air-cooled electronic device is shown;

[0019] Figure 4 An application scenario diagram of the fan speed control method according to an embodiment of this application is shown;

[0020] Figure 5 A flowchart of a fan speed control method according to an embodiment of this application is shown;

[0021] Figure 6 A flowchart illustrating the generation process of the speed interference mapping relationship between adjacent fans according to an embodiment of this application is shown;

[0022] Figure 7 A structural block diagram of a fan speed control device according to an embodiment of this application is shown;

[0023] Figure 8 A block diagram of an electronic device suitable for implementing a fan speed control method according to an embodiment of this application is shown. Detailed Implementation

[0024] The embodiments of this application will now be described with reference to the accompanying drawings. However, it should be understood that these descriptions are exemplary only and are not intended to limit the scope of this application. In the following detailed description, numerous specific details are set forth to provide a thorough understanding of the embodiments of this application for ease of explanation. However, it will be apparent that one or more embodiments may be implemented without these specific details. Furthermore, descriptions of well-known structures and technologies are omitted in the following description to avoid unnecessarily obscuring the concepts of this application.

[0025] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of this application. The terms “comprising,” “including,” etc., as used herein indicate the presence of the stated features, steps, operations, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, or components.

[0026] All terms used herein (including technical and scientific terms) have the meanings commonly understood by those skilled in the art, unless otherwise defined. It should be noted that the terms used herein are to be interpreted in a manner consistent with the context of this specification, and not in an idealized or overly rigid way.

[0027] When using expressions such as "at least one of A, B and C", they should generally be interpreted in accordance with the meaning that is commonly understood by those skilled in the art (e.g., "a system having at least one of A, B and C" should include, but is not limited to, a system having A alone, a system having B alone, a system having C alone, a system having A and B, a system having A and C, a system having B and C, and / or a system having A, B and C, etc.).

[0028] Electronic devices have a complex structure, including processors, hard drives, memory, and system buses. Their primary function is to respond to and process terminal service requests and store information. Therefore, electronic devices process a massive amount of data, inevitably generating a significant amount of heat during high-speed operation, particularly from components such as the CPU (Central Processing Unit), GPU (Graphics Processing Unit), memory, and hard drive. Prolonged operation at high temperatures (e.g., exceeding 85°C) can negatively impact performance and even cause irreparable damage. Therefore, electronic devices employ appropriate cooling systems to regulate their internal temperature.

[0029] In related technologies, heat dissipation methods for electronic devices include air cooling. Air cooling requires the placement of cooling fans inside the electronic device to dissipate heat through airflow and reduce the temperature inside the chassis. Air cooling can be further divided into blow-type cooling and suction-type cooling based on the location of the cooling fans and the direction of airflow.

[0030] Figure 1 A schematic diagram of the operation of a fan in an air-cooled electronic device in the related art is shown.

[0031] like Figure 1 As shown, air-cooling solutions for electronic devices typically involve placing a group of fans side-by-side inside the device, such as fans 1 to 4. These fans can be placed on the air inlet or outlet side of the device's chassis, or in a suitable location within the chassis, to dissipate heat from internal components, such as CPU0 and CPU1. CPU0 and CPU1 are both high-heat-generating components; for example, high-heat-generating components are characterized by temperatures exceeding 85°C. Furthermore, all fans use the same speed control, ensuring that all fan speeds remain almost constant.

[0032] The interior of a computer chassis is not an ideally uniform airflow path. To increase airflow to areas with high-heat components and avoid high-temperature airflow to temperature-sensitive components, air ducts can be added inside the chassis to modify the airflow. For example, high-temperature airflow refers to airflow with a temperature exceeding 70°C. However, adding or removing components inside the chassis will also alter the airflow path. Therefore, the cooling effect of each fan inside an electronic device is not consistent for the entire system. Furthermore, the airflow generated by the fans inside electronic devices can interfere with each other, affecting the achievement of optimal control strategies even when controlling the fans at the same speed.

[0033] Figure 2 A schematic diagram of airflow inside an air-cooled electronic device is shown.

[0034] exist Figure 2 In the diagram, each arrow represents an airflow, and the direction of the arrow indicates the direction of airflow. Figure 2 The chassis shown does not have an ideal, uniform channel. The chassis contains not only high-heat-generating components but also other parts, such as... Figure 2 The structural components 1 to 4 are shown in the diagram. Structural components 1 to 4 may be the same or different. Figure 2 The layout and component types of the internal components of the electronic device, such as CPU0, CPU1, and structural components 1 to 4, are merely illustrative embodiments.

[0035] like Figure 2As shown, in localized areas, spatial obstructions alter airflow direction, causing collisions between airflows from different directions. This, in turn, interferes with airflow over a wider area, resulting in increased airflow in some regions and decreased airflow in others. Furthermore, the faster the fan rotates, the greater the interference between different airflows.

[0036] Figure 3 A schematic diagram of airflow reversal of the internal fan of an air-cooled electronic device is shown, under the same speed control strategy.

[0037] When the fans inside an electronic device are all running at 0 or low speeds, and then suddenly all the fans are switched to full speed, the speed changes cannot be perfectly synchronized due to differences between individual fans.

[0038] like Figure 3 As shown, some fans, such as fan 1, fan 2 and fan 4, will quickly reach full speed, while fans with slower response, such as fan 3, will remain at 0 speed or low speed. Therefore, the air outlet of the fan that quickly reaches full speed will form high-pressure zone 1 and high-pressure zone 2, which have higher air pressure than the air outlet of the fan with slower response. The air outlet of the fan with slower response will form low-pressure zone 3, which has lower air pressure than the air outlet of the fan that quickly reaches full speed.

[0039] Because the air pressure in low-pressure zone 3 is higher than that in low-pressure zone 2, air will flow from high-pressure zones 1 and 2 to low-pressure zone 3, and even from low-pressure zone 3 to low-pressure zone 2, causing the fan to reverse. Conversely, the air pressure in low-pressure zone 1 is lower than that in high-pressure zone 1, so air will flow from low-pressure zone 1 to high-pressure zone 1, but not from high-pressure zone 1 to low-pressure zone 1. Furthermore, after the fan reverses, increasing the fan speed will only cause it to accelerate in the reverse direction.

[0040] Therefore, embodiments of this application provide a fan speed control method, which adjusts the fan speed to dissipate heat from various components within the electronic device, taking into account the mutual interference between the speeds of adjacent fans.

[0041] Figure 4 The diagram illustrates an application scenario of the fan speed control method according to an embodiment of this application.

[0042] like Figure 4 As shown, this fan speed control method is applied in an electronic device 400, which may include a controller 410, multiple fans, and multiple components. Among them, the multiple fans are as follows: Figure 4 As shown in the diagram, there are multiple components such as fan 1, fan 2, ..., fan N. Figure 4 Components 1, 2, ..., M are shown in the diagram. M and N are both positive integers greater than 1. However, Figure 4The fan and component layouts shown are for illustrative purposes only.

[0043] During the operation of the electronic device 400, the controller 410 can obtain the current heat dissipation strategy for the electronic device from the operating system of the electronic device 400 and determine whether the current configuration of the electronic device 400 matches the current heat dissipation strategy.

[0044] In one embodiment, controller 410 may be a BMC (Baseboard Management Controller).

[0045] If the controller 410 detects a mismatch between the current configuration for the electronic device and the current cooling strategy, it will target any one of the multiple fans (first fan) and at least one second fan adjacent to the first fan:

[0046] The speed of the first fan is adjusted to a first preset speed, and the speed of the second fan is increased incrementally from the first preset speed according to a first preset step size. The first critical speed of the second fan when the actual speed of the first fan differs from the first preset speed is recorded. Based on the first preset speed and the first critical speed of each of the multiple fans, a speed interference mapping relationship is generated between adjacent fans. Furthermore, based on the heat dissipation level of each fan for any component in the current configuration, a heat dissipation level mapping relationship is generated between the fans and the component. Finally, based on the speed interference mapping relationship and the heat dissipation level mapping relationship, a target heat dissipation strategy matching the current configuration can be determined, and based on the target heat dissipation strategy and the temperature alarm level of each component in the current configuration, the speeds of the multiple fans are adjusted.

[0047] The following will be based on Figure 4 The described scene, through Figures 5-6 The fan speed control method of the embodiments of this application will be described in detail.

[0048] Figure 5 A flowchart of a fan speed control method according to an embodiment of this application is shown.

[0049] like Figure 5 As shown, the fan speed control method 500 includes operations S510 to S550.

[0050] According to an embodiment of this application, the fan speed control method 500 is applied to an electronic device equipped with a fan. The electronic device includes a controller, multiple fans, and multiple components. The controller can be used to execute the fan speed control method 500, that is, to execute operations S510 to S550.

[0051] In one embodiment, it is possible to utilize, such as Figure 4The electronic device 400 shown executes the fan speed control method 500.

[0052] In one embodiment, multiple fans in the electronic device use independent speed control. The electronic device can be a server, switch, storage device, PC (Personal Computer), or other device equipped with fans.

[0053] In operation S510, when the controller detects that the current configuration of the electronic device does not match the current heat dissipation strategy during the operation of the electronic device, for any first fan among multiple fans and at least one second fan adjacent to the first fan, the speed of the first fan is adjusted to a first preset speed, and the speed of the second fan is increased from the first preset speed according to a first preset step size, and the first critical speed of the second fan is recorded when the actual speed of the first fan is different from the first preset speed.

[0054] According to embodiments of this application, the current configuration of an electronic device represents the various components included in the electronic device; the current heat dissipation strategy of the electronic device represents a strategy for determining which fan to use and at what speed to dissipate heat from a component at what temperature.

[0055] According to embodiments of this application, the operation of an electronic device refers to powering on the electronic device. During operation, it is necessary to detect whether the current configuration of the electronic device matches the current heat dissipation strategy. The current heat dissipation strategy is the strategy used during the previous operation of the electronic device. A mismatch between the current configuration and the current heat dissipation strategy means that the configuration of the electronic device has changed during this operation, i.e., the components within the electronic device have changed, such as reducing, adding, or replacing components. Furthermore, since changes to the internal components of the electronic device affect the airflow path generated by the fan rotation, the current heat dissipation strategy is not suitable for cooling the current configuration, and a new heat dissipation strategy matching the current configuration needs to be determined.

[0056] In another embodiment, if it is detected that the current configuration for the electronic device matches the current heat dissipation strategy, it indicates that the configuration of the electronic device has not changed compared to the previous operation, and the current heat dissipation strategy can be used to dissipate heat from the current configuration of the electronic device.

[0057] Since the fan that has the greatest impact on each fan in an electronic device is its neighboring fan, for any first fan among multiple fans, the interference of the second fan on the first fan is detected by at least one second fan adjacent to the first fan.

[0058] For example, such as Figure 4As shown, if the first fan is fan 1, then the second fan adjacent to it is fan 2; if the first fan is fan 2, then the second fans adjacent to it are fan 1 and fan 3.

[0059] According to an embodiment of this application, the first preset step size is set as needed. The full rotational speed of each fan in the electronic device is the same. The first preset step size can be, for example, 20%, and it increases by 20% of the full rotational speed each time, that is, the rotational speed after each increase can be 20% of the full rotational speed, 40% of the full rotational speed, etc.

[0060] According to an embodiment of this application, in order to detect the interference of the second fan on the first fan, the first fan needs to be at a certain speed. The influence of the second fan on the first fan at different speeds needs to be detected, that is, to determine whether the airflow driven by the second fan when it rotates causes the speed of the first fan to decrease.

[0061] Therefore, the speed of the first fan can be adjusted to a first preset speed. The first preset speed is set as needed, and the speed of the second fan is increased incrementally from the first preset speed according to a first preset step size.

[0062] For example, if the first preset speed of the first fan is 40% of its full speed, then the speed of the second fan will be increased starting from 40% of its full speed.

[0063] According to an embodiment of this application, when the airflow driven by the second fan causes the actual speed of the first fan to be different from the first preset speed, it indicates that the airflow driven by the second fan at the current speed has interfered with the speed of the first fan. Therefore, the first critical speed of the second fan when the actual speed of the first fan is different from the first preset speed is recorded.

[0064] For example, the first preset speed of the first fan is 40% of its full speed. When the second fan increases to 80% of its full speed, the speed of the first fan decreases to 39% of its full speed. Record the first critical speed of the second fan at 80% when the actual speed of the first fan is different from the first preset speed.

[0065] In operation S520, a speed interference mapping relationship between adjacent fans is generated based on the first preset speed and the first critical speed of each fan among multiple fans.

[0066] According to an embodiment of this application, when any first fan among a plurality of fans detects interference from the second fan through its adjacent second fan, a speed interference mapping relationship between adjacent fans can be generated based on the first preset speed and the first critical speed of each of the plurality of fans.

[0067] In one embodiment, based on the rotational speed interference mapping relationship, it can be determined at what speed the second fan will interfere with the first fan when the first fan is at a first preset speed.

[0068] When operating the S530, a heat dissipation level mapping relationship between the fans and the components is generated based on the heat dissipation level of each fan for any component in the current configuration.

[0069] According to embodiments of this application, a fan is used to dissipate heat from components. However, electronic devices contain multiple fans and multiple components. Therefore, when dissipating heat from components, it is necessary to determine which fan to use. Since the fan dissipates heat from the components, the heat dissipation level of each fan in the electronic device can be determined first, and the fan used to dissipate heat from the components can be determined accordingly to improve the heat dissipation efficiency of the components.

[0070] According to embodiments of this application, any component can be kept at a certain temperature, and the heat dissipation level of any fan for any component can be determined by adjusting the speed of any fan. The heat dissipation level characterizes the speed at which the fan dissipates heat from the component.

[0071] According to an embodiment of this application, when the heat dissipation level of any component in the current configuration is determined by any one of multiple fans, a heat dissipation level mapping relationship between fans and components can be generated based on the heat dissipation levels of multiple fans for each component.

[0072] When operating the S540, a target heat dissipation strategy matching the current configuration is determined based on the speed interference mapping relationship and the heat dissipation level mapping relationship.

[0073] According to an embodiment of this application, a target heat dissipation strategy matching the current configuration can be determined based on the rotational speed interference mapping relationship and the heat dissipation level mapping relationship. The target heat dissipation strategy includes heat dissipation strategies for each of the multiple components.

[0074] When operating the S550, the speed of multiple fans is adjusted based on the target heat dissipation strategy and the temperature alarm levels of each component in the current configuration.

[0075] According to the embodiments of this application, the heat generated by each component in the electronic device is different, that is, the temperature alarm level of each component is different. Therefore, based on the temperature alarm level of each component, the speed of multiple fans can be adjusted according to the target heat dissipation strategy to achieve heat dissipation of multiple components.

[0076] According to an embodiment of this application, since the adjacent fans have the greatest impact on fan speed, for any first fan among multiple fans, the interference of the second fan on the first fan is detected based on the adjacent second fan. Furthermore, to obtain the interference of the second fan on the first fan, the speed of the first fan is adjusted to a first preset speed, and the speed of the second fan is increased incrementally from the first preset speed by a first preset step size. A first critical speed of the second fan is recorded when the actual speed of the first fan differs from the first preset speed; that is, at this point, the airflow driven by the second fan interferes with the first fan. Based on this, a speed interference mapping relationship between adjacent fans is generated according to the first preset speed and the first critical speed of each fan. Moreover, since the current configuration of the electronic device changes, the speed of each fan is adjusted sequentially to dissipate heat from any component to determine the heat dissipation level of each fan for any component, thereby generating a heat dissipation level mapping relationship between the fan and the component. Thus, based on the speed interference mapping relationship and the heat dissipation level mapping relationship, a target heat dissipation strategy matching the current configuration is determined, so that when the speed of multiple fans is adjusted based on the target heat dissipation strategy, the interference between adjacent fans can be taken into account. Based on this, the heat dissipation effect of various components in electronic devices can be further improved.

[0077] According to an embodiment of this application, the rotational speed of the first fan is adjusted to a first preset speed, and the rotational speed of the second fan is increased from the first preset speed according to a first preset step size. The first critical speed of the second fan when the actual speed of the first fan is different from the first preset speed is recorded. This includes: increasing the rotational speed of the first fan multiple times from the initial speed according to a second preset step size until the rotational speed of the first fan reaches the target speed after any increase; for any increase in the multiple increases of the first fan, increasing the rotational speed of the second fan from the rotational speed of the first fan after any increase according to the first preset step size until the airflow driven by the second fan makes the actual speed of the first fan different from its rotational speed after any increase, thereby obtaining the rotational speed of the first fan after any increase and the first critical speed of the second fan when the actual speed of the first fan is different from the preset speed.

[0078] The first preset speed includes multiple speeds of the first fan that are increased in increments.

[0079] According to the embodiments of this application, the second preset step size is set as needed, and the first preset step size and the second preset step size may be the same or different.

[0080] Figure 6 A flowchart illustrating the generation process of the speed interference mapping relationship between adjacent fans according to an embodiment of this application is shown.

[0081] like Figure 6As shown, the method 600 for generating the speed interference mapping relationship between adjacent fans includes operations S610 to S620.

[0082] In operation S610, for any first fan among a plurality of fans and at least one second fan adjacent to the first fan.

[0083] When operating S611, adjust the speed of the first fan to the initial speed.

[0084] When operating S612, adjust the speed of the second fan to the initial speed.

[0085] Since any of the multiple fans will check for interference from the second fan by examining its adjacent second fan, for example, when fan 2 is the first fan, if fan 3 starts increasing its speed from 40% when fan 2's speed is 40%, and when fan 3 is the first fan, if fan 2 starts increasing its speed from 20% when fan 3's speed is 20%, there will be a situation where fan 2's speed is 40% when fan 3's speed is 20%. Therefore, the first fan's increased speed is 40% full speed, and the second fan's speed does not need to start increasing from 20% full speed. Based on this, the operation process has been simplified.

[0086] In one embodiment, after the electronic device is powered on, even if the current cooling strategy is not suitable for the current configuration, the speeds of multiple fans will be adjusted according to the current cooling strategy. Therefore, the initial speed is the speed of the first fan adjusted according to the current cooling strategy.

[0087] According to the embodiments of this application, since the speed of the second fan is increased from the same speed as the current speed of the first fan, when the speed of the first fan is adjusted to the initial speed, the speed of the second fan is also adjusted to the initial speed.

[0088] When operating S613, determine whether the speed of the first fan has changed.

[0089] According to an embodiment of this application, if the rotation speed of the first fan does not change, that is, the airflow driven by the second fan does not cause the actual rotation speed of the first fan to be different from its any incremented rotation speed, operation S614 is executed; if the rotation speed of the first fan changes, that is, the airflow driven by the second fan causes the actual rotation speed of the first fan to be different from its any incremented rotation speed, operation S616 is executed.

[0090] When operating S614, determine whether the speed of the second fan has reached the target speed.

[0091] According to an embodiment of this application, if the speed of the second fan does not reach the target speed, operation S615 is executed; if the speed of the second fan reaches the target speed, operation S616 is executed.

[0092] According to embodiments of this application, the target rotational speed can characterize the full rotational speed of the fan.

[0093] According to the embodiments of this application, for any one of the multiple increments of the first fan, the speed of the second fan can be increased by a first preset step size from any increment of the first fan speed, as shown in operations S613 to S615 and S619.

[0094] For example, if the speed of the first fan increases to 40% of its full speed in any of the multiple increments, then the speed of the second fan will be increased starting from 40% of its full speed.

[0095] According to an embodiment of this application, the first fan increases its speed multiple times from the initial speed according to a second preset step size, as shown in operations S617 to S618.

[0096] When operating S615, the speed of the second fan is increased incrementally according to the first preset step size.

[0097] In operation S616, the first critical speed of the second fan is recorded when any incremented speed of the first fan is obtained, and when the actual speed of the first fan is different from any incremented speed of the second fan.

[0098] To obtain the interference of the second fan on the first fan, we only need to record any increment of the first fan's speed, since the speed after the speed decreases is already the speed after the interference.

[0099] According to an embodiment of this application, if the speed of the second fan reaches the target speed but the speed of the first fan remains unchanged, only the speed of the first fan after any increment and the target speed of the second fan need to be recorded.

[0100] Specifically, when the first fan is at a certain speed, the speed of the second fan is increased incrementally until the second fan reaches the target speed or the speed of the first fan changes. Therefore, after the incremental increase of the second fan speed when the first fan is at a certain speed is completed, the speed of the first fan needs to be increased again.

[0101] According to an embodiment of this application, when the rotational speed of the second fan is the first critical speed, it indicates that the rotational speed of the first fan after this increment has been disturbed by the airflow driven by the rotation of the second fan. That is, the interference of the second fan on the first fan after this increment has been detected and the next increment can proceed.

[0102] According to an embodiment of this application, since the rotational speed of the first fan is increased, it is necessary to consider whether the rotational speed of the first fan has reached the target rotational speed. That is, operation S617 needs to be performed before the rotational speed of the first fan is increased again.

[0103] When operating S617, determine whether the speed of the first fan has reached the target speed.

[0104] According to an embodiment of this application, if the speed of the first fan reaches the target speed, operation S620 is executed; if the speed of the first fan does not reach the target speed, operation S618 is executed.

[0105] When operating S618, the speed of the first fan is increased incrementally according to the second preset step size.

[0106] When operating S619, the speed of the second fan is adjusted to be the increased speed of the first fan.

[0107] According to the embodiments of this application, the speed of the second fan is increased starting from the same speed as the current speed of the first fan. Therefore, after the speed of the first fan is increased, the speed of the second fan is adjusted to the increased speed of the first fan.

[0108] In operation S620, a speed interference mapping relationship between adjacent fans is generated based on any incremental speed of each fan and the first critical speed.

[0109] For a given first fan, the interference mapping relationship between its adjacent second fan and the speed interference mapping relationship can be shown in Table 1 below.

[0110] Table 1

[0111]

[0112] Based on Table 1 above, it can be clearly determined at what speed the second fan will interfere with the first fan when the first fan is at a certain speed.

[0113] According to an embodiment of this application, the rotational speed of the first fan is increased multiple times from its initial speed according to a second preset step size. For any one of these increases, if the rotational speed of the second fan reaches a first critical speed, it indicates that the first fan has passed the adjacent interference detection for this increase and can proceed to the next increase. However, since the highest achievable speed of the first fan is the target speed, it is necessary to determine before proceeding to the next increase whether the rotational speed of the first fan has reached the target speed after any increase. This avoids damaging the first fan by indiscriminately increasing its rotational speed.

[0114] According to an embodiment of this application, a heat dissipation level mapping relationship between fans and components is generated based on the heat dissipation level of multiple fans for any component in the current configuration. This includes: for any preset temperature range among multiple preset temperature ranges in which any component is located, determining the heat dissipation level of any fan for any component in any speed range by adjusting the speed of any fan to any speed range among multiple speed ranges; and for any fan in multiple speed ranges, determining a heat dissipation level mapping relationship based on the heat dissipation level of any component in any preset temperature range. The heat dissipation level mapping relationship can be used to characterize the mapping relationship between any fan, the speed of any fan, and the temperature of any component and the heat dissipation level.

[0115] According to embodiments of this application, for any component, different fans, fan speeds, and the component's own temperature all affect the fan's heat dissipation effect on the component. Therefore, the fan's heat dissipation level is considered from the perspective of the fan, fan speed, and component temperature.

[0116] In one embodiment, both the preset temperature range and the speed range are set as needed. For example, multiple preset temperature ranges can be 30℃~40℃, 40℃~50℃, 50℃~60℃, etc.; multiple speed ranges can be 20%~25% full speed, 25%~30% full speed, 30%~35% full speed, etc.

[0117] According to the embodiments of this application, for any component in any preset temperature range, by adjusting the speed of any fan to any speed range, the heat dissipation level of any fan in any speed range for any component in any preset temperature range can be determined.

[0118] According to embodiments of this application, for multiple speed ranges of any fan and multiple preset temperature ranges of any component, a heat dissipation level mapping relationship can be determined based on the heat dissipation level of any component within any preset temperature range. This heat dissipation level mapping relationship reflects the heat dissipation level of the fan on the component at different fan speeds and component temperatures.

[0119] For example, the heat dissipation level mapping relationship can include the following: For fan A, when the fan speed is 30% of its full speed and the temperature of component M is 30°C, the heat dissipation level of fan A for component B is level 1; For fan B, when the fan speed is 40% of its full speed and the temperature of component M is 30°C, the heat dissipation level of fan B for component M is level 2.

[0120] According to embodiments of this application, a heat dissipation level mapping relationship is generated based on considerations of different fans, different fan speeds, and component temperatures. This relationship characterizes the mapping relationship between fans, fan speeds, component temperatures, and heat dissipation levels. The target heat dissipation strategy determined based on the heat dissipation level mapping relationship can determine the fan used to dissipate heat from the component based on the component temperature, fan speed, and different fans, thereby improving the heat dissipation effect on the component.

[0121] According to an embodiment of this application, determining the heat dissipation level of any fan for any component within a given speed range by adjusting the speed of any fan to any speed range among multiple speed ranges includes: adjusting the speed of multiple fans to a second preset speed; adjusting the speed of any fan among the multiple fans from the second preset speed to any speed range; using the airflow generated by the rotation of any fan within the given speed range to dissipate heat from any component, and determining the heat dissipation rate of any fan for any component; and determining the heat dissipation level of any fan for any component within the given speed range based on the heat dissipation rate of any fan for any component.

[0122] According to embodiments of this application, in determining the heat dissipation level of a component, the rotational speeds of multiple fans within the electronic device can be adjusted to a second preset speed, ensuring that the fans within the electronic device maintain the same rotational speed. This avoids the influence of fans with different rotational speeds on the determination of the heat dissipation level of the component, thus ensuring the accuracy of the heat dissipation level determination. Furthermore, for any component to be tested, a pressure test can be performed on any component to raise its temperature to any preset temperature range.

[0123] According to an embodiment of this application, for any one of a plurality of fans, after measuring the heat dissipation level of any one fan on a component, the speed of any one fan is adjusted from a second preset speed to any speed range, so that the airflow driven by any one fan rotating in any speed range can be used to dissipate heat on any component, and the heat dissipation rate of any one fan on any component can be determined.

[0124] In one embodiment, the heat dissipation rate characterizes the rate at which a fan cools a component. Specifically, the heat dissipation rate of any fan for any component can be determined by fixing the heat dissipation time and the temperature reduction of any component within that fixed heat dissipation time; alternatively, the heat dissipation rate of any fan for any component can be determined by fixing the temperature reduction value and the time taken to reduce the temperature of any component by that fixed temperature reduction value.

[0125] According to embodiments of this application, the heat dissipation level of any fan for any component can be determined within any speed range based on the heat dissipation rate of any fan for any component. Specifically, the higher the heat dissipation rate, the higher the heat dissipation level of any fan for any component.

[0126] In one embodiment, different preset rate ranges can be set for different heat dissipation levels. Based on the heat dissipation rate of any fan for any component, the preset rate range in which the heat dissipation rate falls can be determined, thereby determining the heat dissipation level of any fan for any component.

[0127] For example, if the heat dissipation rate of any fan to any component is 0.5℃ / s, the heat dissipation level of any fan to any component can be determined as level 3.

[0128] According to embodiments of this application, to determine the heat dissipation level of a fan on a component, it is necessary to measure the heat dissipation rate of the fan on the component, i.e., the cooling rate of the fan on the component. Therefore, by adjusting the speed of any fan from a second preset speed to any speed range, the fan at that speed is used to dissipate heat from the component, thereby determining the heat dissipation rate of any fan on any component. Based on this, the heat dissipation level of any fan on any component is determined, serving as the basis for selecting subsequent fans for heat dissipation of the component, further improving heat dissipation efficiency.

[0129] According to an embodiment of this application, the target heat dissipation strategy includes heat dissipation strategies for each component; determining a target heat dissipation strategy that matches the current configuration based on a speed interference mapping relationship and a heat dissipation level mapping relationship includes: determining, according to the heat dissipation level mapping relationship, the fans used to dissipate heat from multiple components and their speeds; determining, according to the speed interference mapping relationship, the speed ranges of adjacent fans of the fans used to dissipate heat from multiple components; and determining a heat dissipation strategy for each component based on the fans used to dissipate heat from multiple components and their speeds, as well as the speed ranges of adjacent fans.

[0130] According to the embodiments of this application, since the heat dissipation level mapping relationship characterizes the relationship between the fan, the fan speed, and the component temperature and the heat dissipation level, given the current temperature of the component, the fan used for heat dissipation of multiple components and its speed can be determined based on the heat dissipation level mapping relationship.

[0131] According to an embodiment of this application, since the rotational speed interference mapping relationship characterizes whether there is interference between any increased speed of the first fan and the first critical speed of the second fan when the actual speed of the first fan is different from any increased speed of the second fan, the rotational speed range of the adjacent fans of the fan is determined based on the determination of the fans used to dissipate heat from multiple components and their speeds.

[0132] The speed range of adjacent fans represents the speed range within which adjacent fans will not interfere with the fan. In other words, if the speed of adjacent fans is controlled within this range, it will not interfere with the fan.

[0133] In one embodiment, the speed interference mapping relationship can be used to limit the speed of adjacent fans of a fan in order to avoid interference between adjacent fans.

[0134] Based on this, a cooling strategy for each component can be determined according to the fans used to cool multiple components, their speeds, and the speed ranges of adjacent fans.

[0135] For example, if the rotational speed of fan A is determined to be 60% of its full speed based on the speed interference mapping relationship, and the adjacent fan B rotates at 90% of its full speed, fan B will interfere with fan A. Therefore, when fan A needs to be set to 60% of its full speed, the rotational speed of fan B needs to be limited to a range less than 90% of its full speed.

[0136] According to embodiments of this application, based on heat dissipation level mapping relationships and speed interference mapping relationships, heat dissipation strategies for each component can be determined, ensuring that the fans and their speeds determined by this heat dissipation strategy for cooling the components achieve the best heat dissipation effect. Furthermore, since the speed ranges of adjacent fans used for cooling the components are determined through speed interference mapping relationships, while adjusting the fan speed, the speeds of adjacent fans can be appropriately adjusted, preventing interference from adjacent fans during the process of adjusting fan speeds to cool the components, thus avoiding impact on the heat dissipation effect.

[0137] According to an embodiment of this application, the rotation speed of multiple fans is adjusted based on a target heat dissipation strategy and the temperature alarm levels of each component in the current configuration, including: determining the temperature alarm level of each component based on the acquired temperature of each component; identifying at least one component among the multiple components whose temperature alarm level meets a preset condition; and adjusting the rotation speed of the fan used to dissipate heat for at least one component, according to the heat dissipation strategy for at least one component in the target heat dissipation strategy, provided that there is no conflict between the heat dissipation strategies of at least one component.

[0138] According to embodiments of this application, the heat generated by different components inside an electronic device varies. Therefore, some components generate a significant amount of heat, requiring urgent heat dissipation to prevent performance degradation or even damage. Conversely, some components generate less heat, thus requiring less heat dissipation. Furthermore, the degree of impact of temperature on different components varies; for example, component A may be affected at 60°C, while component B may only be affected at 80°C.

[0139] Based on this, temperature alarm level classification rules can be set for different components.

[0140] According to an embodiment of this application, the temperature alarm level of each component can be determined based on the obtained temperature of each component.

[0141] In one embodiment, for component A, when component A is at 50°C, the temperature alarm level of component A is determined to be level 3; when component A is at 60°C, the temperature alarm level of component A is determined to be level 4.

[0142] For example, a CPU at 90°C is classified as Level 3, which is a low-risk alarm level; a network card at 60°C is classified as Level 4, which is a high-risk alarm level.

[0143] According to embodiments of this application, since the higher the temperature alarm level, the greater the impact of the component on the performance of the electronic device and even on the component itself, at least one component among multiple components whose temperature alarm level meets preset conditions can be identified as needing heat dissipation. Here, the component to be heat dissipated represents the component that requires heat dissipation.

[0144] In one embodiment, a preset condition can indicate that the temperature alarm level of a component exceeds a preset level, which is set according to requirements. For example, the temperature alarm level of a component is divided into 5 levels, and the preset condition can indicate that the temperature alarm level of a component exceeds level 3. Thus, if the temperature alarm level of a component is level 4, the component can be identified as a component that needs to be cooled; if the temperature alarm level of a component is level 2, the component does not need to be cooled.

[0145] According to an embodiment of this application, when there is only one component to be cooled, the speed of the fan used to cool the component can be adjusted according to the cooling strategy for the component in the target cooling strategy, so as to cool the component.

[0146] When there are multiple components to be cooled, interference can occur between adjacent fans. Therefore, it is necessary to first determine whether the fans used to cool each component are adjacent fans. If none of the fans used to cool each component are adjacent fans, it indicates that there is no conflict in the cooling strategies for the multiple components. Therefore, the speed of the fans used to cool the multiple components can be adjusted according to the individual cooling strategies for each component in the target cooling strategy.

[0147] If fans A and B are adjacent and used to cool multiple components, with fan A cooling component M and fan B cooling component N, then based on the cooling strategy for component M, the speed of fan A and the speed range 1 that its adjacent fan should fall within can be determined; similarly, based on the cooling strategy for component N, the speed of fan B and the speed range 2 that its adjacent fan should fall within can be determined. If the determined speed of fan A falls within speed range 2 and the speed of fan B falls within speed range 1, it indicates that there is no conflict between the cooling strategies for components M and N.

[0148] Therefore, if there is no conflict between the heat dissipation strategies of multiple heat dissipation components, the heat dissipation strategies of each heat dissipation component can be executed simultaneously.

[0149] According to embodiments of this application, since a higher temperature alarm level results in a greater impact of the component on the performance of the electronic device and even on the component itself, the temperature alarm level of each component can be determined based on its temperature. Components whose temperature alarm levels meet preset conditions can then be identified for heat dissipation. This allows for timely heat dissipation of these components, preventing untimely heat dissipation from affecting the performance of the electronic device or even damaging the components. Furthermore, when there are multiple components to be cooled, it is necessary to first determine whether there are conflicts in the heat dissipation strategies between them. This prevents interference from adjacent fans during the simultaneous execution of heat dissipation strategies for multiple components, which could hinder the heat dissipation effect.

[0150] According to an embodiment of this application, the above-mentioned fan speed control method further includes: when there is a conflict between the heat dissipation strategies of the first component and the second component among at least one component to be cooled, determining the component with the highest temperature alarm level among the first component and the second component as the first target component, and determining the other component as the second target component; and controlling the speed of the fan used to cool the first target component and the speed of the fan used to cool the second target component according to the heat dissipation strategy for the first target component.

[0151] The fan used to cool the second target component is an adjacent fan to the fan used to cool the first target component.

[0152] According to embodiments of this application, based on the heat dissipation strategy for the first component, the rotational speed of the fan used to dissipate heat from the first component and the rotational speed range 1 of its adjacent fans can be determined; based on the heat dissipation strategy for the second component, the rotational speed of the fan used to dissipate heat from the second component and the rotational speed range 2 of its adjacent fans can be determined. If the fan used to dissipate heat from the first component is an adjacent fan to the fan used to dissipate heat from the first component, and the rotational speed of the fan used to dissipate heat from the second component is outside rotational speed range 1 or the rotational speed of the fan used to dissipate heat from the first component is outside rotational speed range 2, it indicates that there is a conflict between the heat dissipation strategies for the first component and the second component.

[0153] Since the higher the temperature alarm level, the greater the impact of the component on the performance of electronic equipment or even the component itself, when there is a conflict between the speed of the fan cooling the first component and the speed of the fan cooling the second component, the cooling strategy of the component with the highest temperature alarm is prioritized.

[0154] Based on this, the component with the highest temperature alarm level among the first and second components is identified as the first target component, and the other component is identified as the second target component. Following the heat dissipation strategy for the first target component, the speeds of the fans used to cool the first target component and the fans used to cool the second target component are adjusted.

[0155] The heat dissipation requirements of the first target component are higher than those of the second target component.

[0156] According to an embodiment of this application, once the temperature alarm level of the first target component decreases, the first target component is then cooled according to the cooling strategy for the second target component. Thus, in the event of a conflict between the cooling strategies of the components, the cooling strategy for the component with the higher temperature alarm level is prioritized and executed first, while the cooling strategy for the other component is only temporarily suspended.

[0157] In one embodiment, based on the heat dissipation strategy for component M0, the fan used to dissipate heat for component M0 can be determined as fan A and its speed X, and the allowable range of the speed of the adjacent fan B of fan A is the speed range (X1, X2); based on the heat dissipation strategy for component M1, the fan used to dissipate heat for component M1 can be determined as fan B and its speed Y, and the allowable range of the speed of the adjacent fan C / fan A of fan B is the speed range (Y1, Y2); based on the heat dissipation strategy for component M2, the fan used to dissipate heat for component M2 can be determined as fan C and its speed Z, and the allowable range of the speed of the adjacent fan D / fan B of fan C is the speed range (Z1, Z2).

[0158] Based on this, if the speed Y of fan B is within (X1, X2) and (Z1, Z2), the speed X of fan A is within (Y1, Y2), and the speed Z of fan C is within (Y1, Y2), then the heat dissipation strategies of these three components do not conflict and can operate simultaneously.

[0159] If the fan speed X is outside (Y1, Y2), it indicates a conflict between cooling strategies. Based on this, the strategy of the component with the higher temperature alarm level will be prioritized.

[0160] In one embodiment, component M1 overheats. To prioritize cooling component M1, the speed of fan B is adjusted to speed Y, and the speed of fan A is adjusted to within (Y1, Y2). Once the temperature alarm level of component M1 decreases, the speed of fan A is then adjusted to speed X to cool component M0.

[0161] For example, the cooling strategy for component M requires fan A to operate at 90% of its full speed, and the speed of its adjacent fan B cannot exceed or equal to 70% of its full speed. The cooling strategy for component N requires fan B to operate at 70% of its full speed, and fan A cannot exceed or equal to 90% of its full speed. Therefore, when fan A is operating at 90% of its full speed and fan B is operating at 70% of its full speed, they will mutually obstruct each other. If the temperature alarm level of component M is higher than that of component N, the speed of fan A will be adjusted to 90% of its full speed, and the speed of fan B will be adjusted to 60%.

[0162] According to the embodiments of this application, in the event of a conflict between the heat dissipation strategy for the first target component and the heat dissipation strategy for the second target component, since the temperature alarm level of the first target component is the highest and heat dissipation is required in a timely manner, the heat dissipation strategy for the first target component needs to be executed first in order to dissipate heat on the component with the highest heat dissipation requirement in a timely manner, so as to avoid the component from affecting the performance of the electronic device or even the component itself.

[0163] According to the embodiments of this application, during the process of heat dissipation for multiple components, the temperature of the components to be cooled will gradually decrease. While the temperature of the components to be cooled decreases, the temperature of other components may also increase, that is, the temperature alarm levels of the multiple components will change.

[0164] Based on this, the temperature alarm levels of multiple components can be redefined according to the re-acquired temperatures of each component, thus updating the temperature alarm levels of multiple components.

[0165] According to embodiments of this application, when a new component to be cooled is determined based on the updated temperature alarm levels of each component, it can be first determined whether there is a conflict between the cooling strategy for the new component and the cooling strategy for the original component. If the fan used to cool the new component and the fan used to cool the original component are not adjacent, then there is no conflict between the cooling strategies for the new and original components, and the cooling strategies for both components can be executed simultaneously.

[0166] If the fan used to cool the new component is adjacent to the fan used to cool the original component, and the fan speed for the new component falls within the speed range of the adjacent fan used for the original component, and vice versa, then there is no conflict between the cooling strategies for the new and original components, and both strategies can be executed simultaneously. Otherwise, if the fan speed for the new component does not match the cooling strategy for the original component, the cooling strategy for the component with the highest temperature alarm level will be prioritized.

[0167] Based on this, since there is a conflict between the heat dissipation strategies for the new component and the original component, although the heat dissipation of the original component has not yet been completed, the temperature alarm level of the new component is the highest, meaning that the new component urgently needs cooling more than the original component. Therefore, the speed of the fan used to cool the new component and the speed of its adjacent fan are adjusted according to the heat dissipation strategy for the new component. The adjacent fan is used to cool the original component.

[0168] Specifically, components with high temperature alarm levels are prioritized. When the temperature of component M0 drops from a high-risk level to a low-risk level, while the temperature of component M1 reaches a high-risk level, and there is a conflict between the heat dissipation strategies for components M0 and M1, the heat dissipation control strategy quickly switches from the heat dissipation strategy for M0 to the heat dissipation strategy for M1. Even without triggering an over-temperature alarm, it can also autonomously switch between different heat dissipation strategies to slow down the aging and failure rate of fans operating at high speeds for extended periods.

[0169] In one embodiment, the absence of an over-temperature alarm indicates that the component needs heat dissipation, but the temperature alarm level has not yet reached a high level. For example, if the component's temperature alarm level is 5 levels, when the component's temperature alarm level is level 3, the component needs heat dissipation but the over-temperature alarm is not triggered; when the component's temperature alarm level is level 5, the over-temperature alarm is triggered.

[0170] According to an embodiment of this application, determining a fan for cooling multiple components based on a heat dissipation level mapping relationship includes: for any one of the multiple components, determining the fan with the highest heat dissipation level for that component as the fan matching that component, based on the heat dissipation level mapping relationship; if the fan matching that component operates normally, determining the fan matching that component as the fan used to cool that component; if the fan matching that component operates abnormally, determining the fan with the second highest heat dissipation level for that component as the fan used to cool that component.

[0171] According to embodiments of this application, based on a heat dissipation level mapping relationship, the fan with the highest heat dissipation level for any component among multiple fans can be determined as the fan matching that component. Before using the fan matching that component to dissipate heat from any component, it is first determined whether the fan matching that component is operating normally.

[0172] According to an embodiment of this application, when the fan matching any component is operating normally, the fan matching any component can be identified as the fan used to cool down any component; when the fan matching any component is operating abnormally, the fan with the second highest cooling level for any component among a plurality of fans can be identified as the fan used to cool down any component.

[0173] According to embodiments of this application, after determining a fan that matches any component, it is also necessary to determine whether the fan is operating normally to avoid ineffective heat dissipation of the component in the event of fan malfunction. Furthermore, by selecting the fan with the highest heat dissipation rating to cool the component, effective heat dissipation can be achieved solely by this fan, avoiding the use of multiple fans to cool the same component and reducing power consumption.

[0174] Based on the above, and according to the heat dissipation level mapping relationship, this can be used in the following scenarios: When only CPU1 is overheating, only the fan speed corresponding to CPU1 needs to be increased, while the fan corresponding to CPU0 does not need to be adjusted. When a dual-CPU model is shipped with only CPU0, the fan at the CPU1 location can always be kept at a low speed.

[0175] According to an embodiment of this application, the above-mentioned fan speed control method further includes: for any increment of the first fan, increasing the speed of the second fan by a second preset step size until the speed of the second fan increases to a target speed or the speed of the second fan causes the rotation direction of the first fan to reverse; recording the second critical speed of the second fan when the rotation direction of the first fan reverses and the speed of the first fan after any increment; generating a speed reversal mapping relationship between adjacent fans based on any incremented speed and the second critical speed of each fan among the multiple fans; and determining a target heat dissipation strategy that matches the current configuration based on the speed reversal mapping relationship, the speed interference mapping relationship, and the heat dissipation level mapping relationship.

[0176] According to an embodiment of this application, in addition to taking into account the critical speed of rotational interference between adjacent fans, the critical speed of adjacent fans that causes the rotation direction of the fans to reverse can also be considered to eliminate the possibility of fan reversal.

[0177] According to an embodiment of this application, for any increment of the first fan, the rotational speed of the second fan is increased by a second preset step size until the rotational speed of the second fan increases to the target speed or the rotational speed of the second fan causes the rotational direction of the first fan to reverse.

[0178] Based on this, the second critical speed of the second fan and any incremented speed of the first fan can be obtained when the rotation direction of the first fan is reversed. Based on this, and based on any incremented speed and the second critical speed of each of the multiple fans, a speed reversal mapping relationship between adjacent fans is generated. Based on the speed reversal mapping relationship, the speed interference mapping relationship, and the heat dissipation level mapping relationship, a target heat dissipation strategy matching the current electronic device configuration is determined.

[0179] In one embodiment, based on the heat dissipation level mapping relationship, the fans used to dissipate heat for multiple components and their speeds are determined; based on the speed interference mapping relationship and the speed reversal mapping relationship, the speed ranges of adjacent fans used to dissipate heat for multiple components are determined; based on the fans used to dissipate heat for multiple components and their speeds, as well as the speed ranges of adjacent fans, a heat dissipation strategy for each component is determined.

[0180] For example, if the rotational speed of fan A is set to 60% of its full speed based on a speed interference mapping relationship, and the adjacent fan B rotates at 90% of its full speed, fan B will interfere with fan A. Conversely, if the rotational speed of fan A is set to 60% of its full speed based on a speed reversal mapping relationship, and fan B rotates at 10% of its full speed, fan B risks reversing. Therefore, when fan A needs to be set to 60% of its full speed, the rotational speed of fan B needs to be limited to the range of 10% to 90% of its full speed.

[0181] According to an embodiment of this application, when the second fan speed reaches the second critical speed, the first fan speed may approach 0, meaning there is a risk of the first fan reversing. Based on this, a target heat dissipation strategy can be generated by considering the mapping relationship between the second critical speed (which carries the risk of reversal between adjacent fans) and any incrementally increasing speed regarding the risk of reversal. Therefore, adjusting the fan speed based on the target heat dissipation strategy can prevent fan reversal.

[0182] Based on the aforementioned speed interference and speed reversal mapping relationships, the following judgment criteria can be used: When a fan reaches a certain speed, further increasing the speed will cause the airflow generated by this fan to obstruct the airflow of other fans. This obstruction can be reduced by increasing the speed of the fan itself and decreasing the speed of adjacent fans, thereby achieving a localized increase in wind speed. Whether the speeds of adjacent fans are still within a safe range and will not cause fan reversal malfunctions. When a fan stops, how much can the speed of adjacent fans be increased to compensate for the impact of the fan malfunction? When a fan's speed feedback is abnormal, the actual operating status of the fan can be indirectly determined by the speed deviation of adjacent fans.

[0183] In one embodiment, based on the heat dissipation level mapping relationship, the main cooling fan of component M0 is F0. Through speed interference mapping and speed reversal mapping relationships, it is determined that fan F1 and fan F0 have a significant obstructive effect when their speeds are greater than V1. The high-risk temperature level of component M0 is defined as t1, and the low-risk temperature level as t2 (t1>t2). When the temperature of component M0 is higher than t1, fan F0 increases to its full speed, and fan F1 decreases its speed to below V1. When the temperature of component M0 is lower than t1 but higher than t2, the speed of fan F0 can be adjusted to be slightly higher than V1, and the speed of fan F1 can be adjusted to be slightly lower than V1. Here, fan F1 and fan F0 are adjacent fans.

[0184] The fan speed control method of this application, through the target heat dissipation strategy generated by the speed interference mapping relationship and the heat dissipation level mapping relationship, can accurately dissipate heat on various components inside electronic devices, achieving targeted control and adopting personalized heat dissipation strategies for better heat dissipation effect. Furthermore, the target heat dissipation strategy generated based on the speed interference mapping relationship and the speed reversal mapping relationship can effectively solve the problems of mutual interference between adjacent fans and fan reversal in related technologies. At the same time, based on the heat dissipation level of multiple fans for any component in the heat dissipation level mapping relationship, other fans can be temporarily selected to execute the corresponding heat dissipation strategy when some fans fail. Moreover, in this application, the fans do not need to maintain the same speed, which reduces resonance at the same frequency, reduces noise, and the fans do not need to maintain full speed for a long time, resulting in lower power consumption.

[0185] This application also provides an electronic device, including a controller, multiple fans, and multiple components. The controller is used to execute the fan speed control method described above.

[0186] Since the electronic device includes a controller, it has the beneficial effects of the aforementioned fan speed control method, which will not be elaborated further here.

[0187] Based on the above-described fan speed control method, this application also provides a fan speed control device. The following will be combined with... Figure 7 The device is described in detail.

[0188] Figure 7 A structural block diagram of a fan speed control device according to an embodiment of this application is shown.

[0189] like Figure 7 As shown, the fan speed control device 700 of this embodiment is deployed in the controller of an electronic device, and the fan speed control device 700 includes a speed increment module 710, a first generation module 720, a second generation module 730, a determination module 740 and a control module 750.

[0190] The speed increment module 710 is used to, when detecting a mismatch between the current configuration and the current heat dissipation strategy of the electronic device during operation, adjust the speed of any first fan among a plurality of fans and at least one second fan adjacent to the first fan to a first preset speed, and increment the speed of the second fan from the first preset speed according to a first preset step size, and record the first critical speed of the second fan when the actual speed of the first fan is different from the first preset speed. In one embodiment, the speed increment module 710 can be used to perform the operation S510 described above, which will not be repeated here.

[0191] The first generation module 720 is used to generate a speed interference mapping relationship between adjacent fans based on the first preset speed and the first critical speed of each fan among the multiple fans. In one embodiment, the first generation module 720 can be used to perform the operation S520 described above, which will not be repeated here.

[0192] The second generation module 730 is used to generate a heat dissipation level mapping relationship between fans and components based on the heat dissipation level of each fan for any component in the current configuration. In one embodiment, the second generation module 730 can be used to perform the operation S530 described above, which will not be repeated here.

[0193] The determining module 740 is used to determine a target heat dissipation strategy that matches the current configuration based on the rotational speed interference mapping relationship and the heat dissipation level mapping relationship. In one embodiment, the determining module 740 can be used to perform the operation S540 described above, which will not be repeated here.

[0194] The control module 750 is used to control the speed of multiple fans based on the target heat dissipation strategy and the temperature alarm levels of each component in the current configuration. In one embodiment, the control module 750 can be used to perform the operation S550 described above, which will not be repeated here.

[0195] According to embodiments of this application, any multiple modules among the speed increment module 710, the first generation module 720, the second generation module 730, the determination module 740, and the control module 750 can be combined into one module, or any one of these modules can be split into multiple modules. Alternatively, at least some of the functions of one or more of these modules can be combined with at least some of the functions of other modules and implemented in one module. According to embodiments of this application, at least one of the speed increment module 710, the first generation module 720, the second generation module 730, the determination module 740, and the control module 750 can be at least partially implemented as hardware circuitry, such as a field-programmable gate array (FPGA), a programmable logic array (PLA), a system-on-a-chip, a system-on-a-substrate, a system-on-package, an application-specific integrated circuit (ASIC), or implemented in hardware or firmware by any other reasonable means of integrating or packaging the circuitry, or implemented in software, hardware, or firmware, or in any suitable combination of any of these three implementation methods. Alternatively, at least one of the speed increment module 710, the first generation module 720, the second generation module 730, the determination module 740, and the control module 750 can be at least partially implemented as a computer program module, which can perform corresponding functions when the computer program module is run.

[0196] Figure 8 A block diagram of an electronic device suitable for implementing a fan speed control method according to an embodiment of this application is shown.

[0197] like Figure 8 As shown, an electronic device 800 according to an embodiment of this application includes a processor 801, which can perform various appropriate actions and processes according to a program stored in a read-only memory (ROM) 802 or a program loaded from a storage portion 808 into a random access memory (RAM) 803. The processor 801 may include, for example, a general-purpose microprocessor (e.g., a CPU), an instruction set processor and / or an associated chipset and / or a special-purpose microprocessor (e.g., an application-specific integrated circuit (ASIC)), etc. The processor 801 may also include onboard memory for caching purposes. The processor 801 may include a single processing unit or multiple processing units for performing different actions of the method flow according to an embodiment of this application.

[0198] RAM 803 stores various programs and data required for the operation of electronic device 800. Processor 801, ROM 802, and RAM 803 are interconnected via bus 804. Processor 801 executes various operations of the method flow according to embodiments of this application by executing programs in ROM 802 and / or RAM 803. It should be noted that the programs may also be stored in one or more memories other than ROM 802 and RAM 803. Processor 801 may also execute various operations of the method flow according to embodiments of this application by executing programs stored in said one or more memories.

[0199] According to embodiments of this application, the electronic device 800 may further include an input / output (I / O) interface 805, which is also connected to a bus 804. The electronic device 800 may also include one or more of the following components connected to the input / output (I / O) interface 805: an input section 806 including a keyboard, mouse, etc.; an output section 807 including a cathode ray tube (CRT), liquid crystal display (LCD), etc., and a speaker, etc.; a storage section 808 including a hard disk, etc.; and a communication section 809 including a network interface card such as a LAN card, modem, etc. The communication section 809 performs communication processing via a network such as the Internet. A drive 810 is also connected to the input / output (I / O) interface 805 as needed. A removable medium 811, such as a disk, optical disk, magneto-optical disk, semiconductor memory, etc., is installed on the drive 810 as needed so that computer programs read from it can be installed into the storage section 808 as needed.

[0200] This application also provides a computer-readable storage medium, which may be included in the device / apparatus / system described in the above embodiments; or it may exist independently and not assembled into the device / apparatus / system. The computer-readable storage medium carries one or more programs, which, when executed, implement the method according to the embodiments of this application.

[0201] According to embodiments of this application, the computer-readable storage medium can be a non-volatile computer-readable storage medium, such as including but not limited to: portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination thereof. In this application, the computer-readable storage medium can be any tangible medium containing or storing a program that can be used by or in conjunction with an instruction execution system, apparatus, or device. For example, according to embodiments of this application, the computer-readable storage medium may include ROM 802 and / or RAM 803 and / or one or more memories other than ROM 802 and RAM 803 described above.

[0202] Embodiments of this application also include a computer program product comprising a computer program containing program code for performing the methods shown in the flowchart. When the computer program product is run on a computer system, the program code is used to cause the computer system to implement the methods provided in the embodiments of this application.

[0203] When the computer program is executed by the processor 801, it performs the functions defined in the system / apparatus of this application embodiment. According to the embodiments of this application, the systems, apparatuses, modules, units, etc., described above can be implemented by computer program modules.

[0204] In one embodiment, the computer program may rely on a tangible storage medium such as an optical storage device or a magnetic storage device. In another embodiment, the computer program may also be transmitted and distributed in the form of signals over a network medium, and may be downloaded and installed via the communication section 809, and / or installed from a removable medium 811. The program code contained in the computer program can be transmitted using any suitable network medium, including but not limited to: wireless, wired, etc., or any suitable combination thereof.

[0205] In such an embodiment, the computer program can be downloaded and installed from a network via the communication section 809, and / or installed from the removable medium 811. When the computer program is executed by the processor 801, it performs the functions defined in the system of this application embodiment. According to the embodiments of this application, the systems, devices, apparatuses, modules, units, etc., described above can be implemented by computer program modules.

[0206] According to embodiments of this application, program code for executing the computer programs provided in the embodiments of this application can be written in any combination of one or more programming languages. Specifically, these computational programs can be implemented using high-level procedural and / or object-oriented programming languages, and / or assembly / machine languages. Programming languages ​​include, but are not limited to, languages ​​such as Java, C++, Python, "C", or similar programming languages. The program code can be executed entirely on the user's computing device, partially on the user's device, partially on a remote computing device, or entirely on a remote computing device or server. In cases involving remote computing devices, the remote computing device can be connected to the user's computing device via any type of network, including a local area network (LAN) or a wide area network (WAN), or it can be connected to an external computing device (e.g., via the Internet using an Internet service provider).

[0207] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of this application. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions indicated in the blocks may occur in a different order than those indicated in the drawings. For example, two consecutively indicated blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in a block diagram or flowchart, and combinations of blocks in a block diagram or flowchart, may be implemented using a dedicated hardware-based system that performs the specified function or operation, or using a combination of dedicated hardware and computer instructions.

[0208] Those skilled in the art will understand that the features described in the various embodiments of this application can be combined and / or combined in various ways, even if such combinations or combinations are not explicitly described in this application. In particular, the features described in the various embodiments of this application can be combined and / or combined in various ways without departing from the spirit and teachings of this application. All such combinations and / or combinations fall within the scope of this application.

[0209] The embodiments of this application have been described above. However, these embodiments are merely illustrative and not intended to limit the scope of this application. Although various embodiments have been described above, this does not mean that the measures in the various embodiments cannot be used advantageously in combination. Without departing from the scope of this application, those skilled in the art can make various substitutions and modifications, all of which should fall within the scope of this application.

Claims

1. A fan rotation speed regulation method applied to an electronic device provided with a fan, the electronic device comprising a controller, a plurality of fans and a plurality of components, characterized in that, The method includes: If the controller detects a mismatch between the current configuration and the current cooling strategy of the electronic device during its operation, it will, for any one of the plurality of fans (first fan) and at least one second fan adjacent to the first fan, The speed of the first fan is adjusted to a first preset speed, and the speed of the second fan is increased from the first preset speed according to a first preset step size. The first critical speed of the second fan when the actual speed of the first fan is different from the first preset speed is recorded. Based on the first preset speed and the first critical speed of each of the multiple fans, a speed interference mapping relationship is generated between adjacent fans; Based on the heat dissipation level of each of the multiple fans for any component in the current configuration, a heat dissipation level mapping relationship between the fans and the components is generated. Based on the speed interference mapping relationship and the heat dissipation level mapping relationship, a target heat dissipation strategy matching the current configuration is determined; Based on the target heat dissipation strategy and the temperature alarm levels of each component in the current configuration, the speed of the multiple fans is adjusted.

2. The method of claim 1, wherein, The step of adjusting the speed of the first fan to a first preset speed, and increasing the speed of the second fan from the first preset speed in increments according to a first preset step size, and recording the first critical speed of the second fan when the actual speed of the first fan differs from the first preset speed, includes: According to the second preset step size, the speed of the first fan is increased multiple times from the initial speed until the speed of the first fan reaches the target speed after any increment. For any one of the multiple increments of the first fan, the speed of the second fan is increased by the first preset step size from any increment of the first fan speed until the airflow driven by the second fan makes the actual speed of the first fan different from its speed after any increment. This yields the speed of the first fan after any increment and the first critical speed of the second fan when the actual speed of the first fan is different from the preset speed. The first preset speed includes multiple speeds of the first fan that are increased multiple times.

3. The method of claim 1, wherein, The step of generating a heat dissipation level mapping relationship between the fans and the components based on the heat dissipation level of each of the plurality of fans for any component in the current configuration includes: For any preset temperature range among multiple preset temperature ranges in which any component is located, the heat dissipation level of any fan in any speed range is determined by adjusting the speed of any fan to any speed range among multiple speed ranges. For any fan in multiple speed ranges, based on the heat dissipation level of any component in any preset temperature range, a heat dissipation level mapping relationship is determined, wherein the heat dissipation level mapping relationship characterizes the mapping relationship between any fan, the speed of any fan, and the temperature of any component and the heat dissipation level.

4. The method of claim 3, wherein, The step of determining the heat dissipation level of any fan for any component within any speed range by adjusting the speed of any fan to any speed range among multiple speed ranges includes: The speeds of the plurality of fans are adjusted to the second preset speeds respectively; Adjust the speed of any one of the plurality of fans from the second preset speed to any one of the speed ranges; The airflow generated by any fan rotating within any speed range is used to dissipate heat from any component, and the heat dissipation rate of any fan for any component is determined. Based on the heat dissipation rate of any fan for any component, determine the heat dissipation level of any fan for any component within any speed range.

5. The method of claim 3, wherein, The target heat dissipation strategy includes heat dissipation strategies for each component; determining the target heat dissipation strategy that matches the current configuration based on the rotational speed interference mapping relationship and the heat dissipation level mapping relationship includes: Based on the heat dissipation level mapping relationship, determine the fans used to dissipate heat from the multiple components and their speeds. Based on the speed interference mapping relationship, determine the speed range of adjacent fans of the fans used to dissipate heat from the multiple components respectively; A cooling strategy for each component is determined based on the fans used to cool the multiple components, their speeds, and the speed ranges of adjacent fans.

6. The method of claim 5, wherein, The step of adjusting the speed of the multiple fans based on the target heat dissipation strategy and the temperature alarm levels of each component in the current configuration includes: Based on the acquired temperatures of each component, determine the temperature alarm level for each of the multiple components; Identify at least one component among the plurality of components whose temperature alarm level meets preset conditions for heat dissipation; If there is no conflict in the heat dissipation strategies between at least one component to be cooled, the speed of the fan used to cool the at least one component to be cooled is adjusted according to the heat dissipation strategy for the at least one component to be cooled in the target heat dissipation strategy.

7. The method of claim 6, wherein, The method further includes: If there is a conflict between the heat dissipation strategies of the first component and the second component among the at least one component to be cooled, the component with the highest temperature alarm level among the first component and the second component shall be identified as the first target component, and the other component shall be identified as the second target component. According to the heat dissipation strategy for the first target component, the speed of the fan used to dissipate heat for the first target component and the speed of the fan used to dissipate heat for the second target component are adjusted, wherein the fan used to dissipate heat for the second target component is an adjacent fan to the fan used to dissipate heat for the first target component.

8. The method of claim 5, wherein, Based on the heat dissipation level mapping relationship, determine the fans used to dissipate heat for each of the plurality of components, including: for any one of the plurality of components, Based on the heat dissipation level mapping relationship, the fan with the highest heat dissipation level for any component among the plurality of fans is determined as the fan that matches any component; If the fan matched with any of the components is operating normally, the fan matched with any of the components shall be determined as the fan used to dissipate heat from any of the components. If the fan matched with any of the components malfunctions, the fan with the second highest heat dissipation level for any of the components among the plurality of fans shall be determined as the fan used to dissipate heat from any of the components.

9. The method of claim 1, wherein, The method further includes: For any increment of the first fan, the speed of the second fan is increased by the first preset step size until the speed of the second fan increases to the target speed or the speed of the second fan causes the rotation direction of the first fan to reverse. Record the second critical speed of the second fan and any incremental speed of the first fan when the rotation direction of the first fan is reversed; Based on any incremented rotational speed of each of the plurality of fans and the second critical rotational speed, a rotational speed reversal mapping relationship is generated between adjacent fans; Based on the speed reversal mapping relationship, the speed interference mapping relationship, and the heat dissipation level mapping relationship, a target heat dissipation strategy that matches the current configuration is determined.

10. An electronic device, comprising: It includes multiple fans, multiple components, and a controller, the controller being used to perform the method as described in any one of claims 1 to 9 to control the rotational speed of the multiple fans to dissipate heat from the multiple components.

Images