Waveguide satellite front millimeter wave radar and manufacturing method thereof

Abstract

According to the waveguide satellite front millimeter wave radar and the manufacturing method thereof, a rear shell, a PIN needle and a heat dissipation middle frame are integrally formed through a base assembly, and installation is convenient and easy. And a plurality of sections of integrated injection molding bonding surfaces distributed in a whole circle are arranged between the rear shell and the heat dissipation middle frame, so that the connection stability of the rear shell and the heat dissipation middle frame is ensured. The joint of the rear shell and the heat dissipation middle frame is sealed through sealant, so that the sealing performance is guaranteed. The heat dissipation middle frame is provided with the heat dissipation boss, the heat dissipation boss is coated with the heat conduction glue, and then the heat dissipation boss makes contact with the PCBA, so that heat of the PCBA can be led out through the heat conduction glue, the heat dissipation boss and the heat dissipation middle frame / rear shell, and the heat dissipation performance is improved. The waveguide antenna assembly adopts a plastic metallization part and a metal sheet part, so that the waveguide transmission performance is ensured.

Description

Technical Field

[0001] This invention relates to the field of millimeter-wave radar technology, and in particular to a waveguide satellite front millimeter-wave radar and its manufacturing method. Background Technology

[0002] Waveguide satellite millimeter-wave radar is a new type of remote sensing device that combines waveguide technology with millimeter-wave radar, primarily used for high-precision detection and data acquisition on satellite platforms. The heat dissipation design of the front-mounted millimeter-wave radar on waveguide satellites is a key technology to ensure its stable operation in extreme space environments. Existing installation structures for front-mounted millimeter-wave radars on waveguide satellites cannot meet the requirements for heat dissipation design; relying solely on external cooling is insufficient. Summary of the Invention

[0003] In view of the above situation, it is necessary to propose a waveguide satellite front millimeter-wave radar with excellent heat dissipation performance and its manufacturing method.

[0004] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is: a waveguide satellite front millimeter-wave radar, comprising:

[0005] Antenna radome front cover;

[0006] The base assembly includes an integrally molded back shell, PIN pins, and a heat dissipation frame. The base assembly has a receiving groove that opens into the front shell of the radome. The heat dissipation frame is disposed in the receiving groove. The back shell and the heat dissipation frame have multiple integrally molded bonding surfaces distributed around the radome. The PIN pins are embedded in the back shell and exposed to form terminals. The joint between the heat dissipation frame and the back shell is provided with sealant. The heat dissipation frame has several heat dissipation protrusions that protrude towards the front shell of the radome. The heat dissipation protrusions are coated with thermally conductive adhesive. The front shell of the radome is connected to the back shell.

[0007] PCBA is fixedly connected to the base assembly and attached to the heat dissipation protrusion with thermally conductive adhesive, and the PIN pin is connected to the PCBA.

[0008] A waveguide antenna assembly is disposed on the PCBA. The waveguide antenna assembly includes a plastic metallized part and a metal sheet part from bottom to top. The plastic metallized part and the metal sheet part are soldered together by SMT to form their own independent cavities. The plastic metallized part is provided with a signal conversion interface, a transmission channel and an antenna transmitting / receiving unit. The metal sheet is provided with a clearance hole corresponding to the signal conversion interface. The plastic metallized part is electrically connected to the PCBA through the clearance hole.

[0009] Furthermore, the outer side wall of the rear shell is provided with a plurality of mounting ears, and the mounting ears are provided with fixing holes.

[0010] Furthermore, the rear shell has welding ribs on its end face, and the front shell of the antenna cover has welding grooves on its end face. The welding ribs and welding grooves are nested together and then welded together.

[0011] Furthermore, the plastic metallized portion and the metal sheet portion are bonded together by tinning a steel mesh and heating to form a closed waveguide cavity.

[0012] Furthermore, the plastic metallized part is provided with positioning posts, and the metal sheet part is provided with positioning holes that are adapted to the positioning posts.

[0013] Furthermore, the base assembly extends toward the front shell of the antenna cover with a plurality of connecting posts, and the PCBA and the waveguide antenna assembly are provided with connecting holes corresponding to the connecting posts, and the connecting posts are riveted to the connecting holes.

[0014] Furthermore, the connection hole on the waveguide antenna assembly is located on the positioning post.

[0015] Furthermore, the metal sheet portion has several process ventilation holes.

[0016] Furthermore, the rear shell is provided with a window, the bottom of the heat dissipation frame is exposed through the window, and the heat dissipation frame exposed through the window is provided with a number of heat dissipation ribs.

[0017] The present invention also provides a method for manufacturing the above-mentioned waveguide satellite front millimeter-wave radar, comprising the following steps:

[0018] The heat dissipation frame is formed by aluminum alloy die casting process; there are multiple integrated injection molding bonding surfaces distributed around the entire circle between the heat dissipation frame and the back shell. The heat dissipation frame is integrally injection molded with the back shell as an insert through the multiple integrated injection molding bonding surfaces and the PIN pins; after molding and cooling, sealant is applied to the inner surfaces of the heat dissipation frame and the back shell.

[0019] The plastic parts are metallized to form a plastic metallized part. Process ventilation holes are opened on the metal sheet. The plastic metallized part and the metal sheet part are assembled together by tinning the steel mesh, positioning posts and positioning holes, and heating and welding to form a closed waveguide cavity.

[0020] Components and PCBs are soldered together to form a PCBA;

[0021] Thermally conductive adhesive is applied to the heat dissipation protrusions of the heat dissipation frame;

[0022] The connecting holes on the soldered PCBA are passed through the connecting posts on the base assembly. The PIN pins are then passed through the crimping holes of the PCBA using a crimping tool, and the PCBA is brought into contact with the heat dissipation frame. The heat dissipation boss is brought into contact with the PCBA through thermal adhesive.

[0023] Install the waveguide antenna assembly, press the waveguide antenna assembly connection hole to the connection post, use metal riveting process to thicken the head of the connection post, and fix the waveguide antenna assembly to the PCBA;

[0024] After the welding groove on the front shell of the radome is pre-installed with the welding rib area on the rear shell, it is processed into a finished radar product using laser welding technology.

[0025] The beneficial effects of this invention are as follows: The base assembly integrates the back cover, PIN pins, and heat dissipation frame into a single unit, making installation convenient and simple. The back cover and heat dissipation frame have a multi-segment integral injection-molded bonding surface distributed around the entire circumference, ensuring the stability of the connection between the back cover and the heat dissipation frame. The joint between the back cover and the heat dissipation frame is sealed with sealant to ensure sealing performance. Heat dissipation protrusions are provided on the heat dissipation frame, coated with thermally conductive adhesive, and then in contact with the PCBA, allowing the heat from the PCBA to be dissipated through the thermally conductive adhesive, heat dissipation protrusions, and heat dissipation frame / back cover, improving heat dissipation performance. The waveguide antenna assembly utilizes plastic metallized parts and metal sheet parts to ensure waveguide transmission performance. Attached Figure Description

[0026] Figure 1 This is a schematic cross-sectional view of a waveguide satellite front millimeter-wave radar according to an embodiment of the present invention;

[0027] Figure 2 This is an exploded structural diagram of a waveguide satellite front millimeter-wave radar according to an embodiment of the present invention;

[0028] Figure 3 This is an exploded structural diagram of a waveguide satellite front millimeter-wave radar according to an embodiment of the present invention from another direction;

[0029] Figure 4 This is a schematic diagram of the base assembly of a waveguide satellite front millimeter-wave radar according to an embodiment of the present invention;

[0030] Figure 5 This is a schematic diagram of the structure inside the receiving slot of a waveguide satellite front millimeter-wave radar according to an embodiment of the present invention;

[0031] Figure 6 This is a schematic diagram of the structure of a waveguide antenna assembly for a waveguide satellite front millimeter-wave radar according to an embodiment of the present invention.

[0032] Label Explanation:

[0033] 100. Front shell of radome; 110. Welding groove; 200. Base assembly; 210. Rear shell;

[0034] 211. One-piece injection molded bonding surface; 212. Mounting ear; 2121. Fixing hole; 213. Welding rib;

[0035] 220, PIN pin; 230, heat dissipation frame; 231, heat dissipation boss; 232, stepped protrusion;

[0036] 2321. Heat dissipation fins; 233. Connecting posts; 234. Sealant; 240. Thermally conductive adhesive;

[0037] 300, PCBA; 310, Connecting hole; 400, Waveguide antenna assembly; 410, Plastic metallized part;

[0038] 411. Signal adapter; 412. Transmission channel; 413. Antenna transmitting / receiving unit;

[0039] 415. Antenna surface; 414. Positioning post; 420. Metal sheet section; 421. Clearance hole;

[0040] 422. Process ventilation hole; 423. Positioning hole. Detailed Implementation

[0041] To make the objectives, technical solutions, and advantages of this invention clearer, the following detailed description, in conjunction with the accompanying drawings and embodiments, provides a waveguide satellite front millimeter-wave radar and its manufacturing method. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of the invention.

[0042] Please refer to Figures 1-6 A waveguide satellite-mounted millimeter-wave radar, comprising:

[0043] Antenna radome front cover 100;

[0044] The base assembly 200 includes an integrally molded rear shell 210, PIN pins 220, and a heat dissipation frame 230. The base assembly 200 has a receiving groove that opens toward the front shell 100 of the radome. The heat dissipation frame 230 is disposed in the receiving groove. There are multiple integral injection-molded bonding surfaces 211 distributed around the entire circle between the rear shell 210 and the heat dissipation frame 230. The PIN pins 220 are embedded in the rear shell 210 and exposed to form terminals. A sealant 234 is provided at the joint between the heat dissipation frame 230 and the rear shell 210. The heat dissipation frame 230 has several heat dissipation bosses 231 that protrude toward the front shell 100 of the radome. Thermally conductive adhesive 240 is coated on the heat dissipation bosses 231. The front shell 100 of the radome is connected to the rear shell 210.

[0045] PCBA300 is fixedly connected to the base assembly 100 and attached to the heat dissipation boss 231 by thermally conductive adhesive 240. The pin 220 is connected to PCBA300.

[0046] The waveguide antenna assembly 400 is mounted on the PCBA 300. From bottom to top, the waveguide antenna assembly 400 includes a plastic metallized part 410 and a metal sheet part 420. The plastic metallized part 410 and the metal sheet part 420 are soldered together by SMT and form their own independent cavities (these cavities together form a closed waveguide cavity). The plastic metallized part 410 is provided with a signal conversion interface 411, a transmission channel 412 and an antenna transmitting / receiving unit 413. The metal sheet is provided with a clearance hole 421 corresponding to the signal conversion interface 411. The plastic metallized part 410 is electrically connected to the PCBA 300 through the clearance hole 421.

[0047] The base assembly 200 integrates the back cover 210, PIN pins 220, and heat dissipation frame 230 into a single unit, making installation convenient and simple. The back cover 210 and the heat dissipation frame 230 have a multi-segment integrated injection-molded bonding surface 211 distributed around the entire circle, ensuring the stability of the connection between the back cover 210 and the heat dissipation frame 230. The joint between the back cover 210 and the heat dissipation frame 230 is sealed with sealant 234 to ensure sealing performance. A heat dissipation boss 231 is provided on the heat dissipation frame 230, coated with thermally conductive adhesive 240, and then in contact with the PCBA 300. This allows heat from the PCBA 300 to be dissipated through the thermally conductive adhesive 240, the heat dissipation boss 231, and the heat dissipation frame 230 / back cover 210, improving heat dissipation performance. The waveguide antenna assembly 400 uses a plastic metallized portion 410 and a metal sheet portion 420, ensuring waveguide transmission performance while reducing weight compared to traditional antennas.

[0048] Please refer to Figures 2-5 The outer side wall of the rear shell 210 is provided with several mounting ears 212, and the mounting ears 212 are provided with fixing holes 2121. The mounting ears 212 on the outer side wall of the rear shell 210 facilitate bolt connection or snap connection with other external components.

[0049] Please refer to Figures 2-5 The rear shell 210 has a welding rib 213 on its end face, and the front shell 100 of the radome has a welding groove 110 on its end face. The welding rib 213 and the welding groove 110 are nested and welded together to ensure the stability and sealing performance of the weld. Understandably, laser welding is generally used for this welding.

[0050] Preferably, the plastic metallized portion 410 and the metal sheet portion 420 are bonded together by tinning a steel mesh and heating to form a closed waveguide cavity. The plastic metallized portion 410 is made by metallizing a plastic part, typically using engineering plastics such as PPO (polyphenylene oxide) / PPS (polyphenylene sulfide) / PEEK (polyether ether ketone) as the substrate. The surface is metallized by electroplating, physical vapor deposition (PVD), or chemical plating to form a metallized coating (copper-nickel alloy, silver layer, etc.), which is about 40% lighter than aluminum-magnesium alloy.

[0051] Please refer to Figure 2 , Figure 3 and Figure 6 The plastic metallized part 410 is provided with a positioning post 414, and the metal sheet part 420 is provided with a positioning hole 423 that matches the positioning post 414. Positioning is achieved through the positioning post 414 and the positioning hole 423, which facilitates subsequent welding.

[0052] Please refer to Figures 1-3 The base assembly 200 extends towards the front shell 100 of the radome with several connecting posts 233. The PCBA 300 and the waveguide antenna assembly 400 are provided with connecting holes 310 corresponding to the connecting posts 233. The connecting posts 233 are riveted to the connecting holes 310. A metal riveting process is used to thicken the head of the connecting post 233, thereby enabling the riveting connection. It is understood that the connecting posts 233 can be formed by the rear shell 210 or by the heat dissipation frame 230.

[0053] Please refer to Figures 2-3 and Figure 6 The connection hole 310 on the waveguide antenna assembly 400 is provided on the positioning post 414. Alternatively, riveting holes can be provided on the plastic metallized part 410 and the metal sheet part 420.

[0054] Please refer to Figure 6 The metal sheet 420 has several process ventilation holes 422. These are used to prevent gas leakage during the welding process and ensure welding quality.

[0055] Please refer to Figure 1 and Figure 2 The rear shell 210 has a window, through which the bottom of the heat dissipation frame 230 is exposed. Several heat dissipation ribs 2321 are provided on the heat dissipation frame 230 exposed through the window. Specifically, the bottom of the heat dissipation frame 230 has a stepped protrusion 232, which protrudes through the window and is provided with several heat dissipation ribs 2321. The direct exposure of the heat dissipation frame 230 facilitates better heat dissipation.

[0056] Preferably, the distance between the antenna surface of the waveguide antenna assembly 400 and the front shell 100 of the radome is 1.8-2.4 mm, and the thickness of the front shell 100 of the radome is 1.5-2.5 mm. This ensures antenna performance.

[0057] Typically, the antenna surface 415 of the waveguide antenna assembly 400 is located on the side of the plastic metallized portion 410 facing away from the PCBA 300.

[0058] Typically, the rear shell 210 is made of high-temperature resistant plastic, while the heat dissipation frame 230 is made of aluminum alloy. The front shell 100 of the radome is also generally made of plastic. The metal sheet 420 is generally made of copper. The sealant 234 is made of high-temperature resistant sealant.

[0059] Preferably, the chip of PCBA300 is attached to the heat dissipation boss 231.

[0060] Understandably, pin 220 can form a Fakra connector to facilitate power supply and signal transmission to PCBA300.

[0061] Understandably, the shape and size of the heat dissipation boss 231 and the heat dissipation rib 2321 can be set as needed, and the attached drawings in the manual are only for illustrative purposes.

[0062] The integral injection-molded bonding surface 211 is multi-segmented, which means that... Figure 1 As shown, its cross-section consists of multiple continuous lines, rather than a straight line. This method provides stable adhesion, prevents detachment, and ensures a strong seal.

[0063] The heat generated by the chip on PCBA300 is conducted through the heat dissipation protrusions 231 and thermal adhesive 240 on the heat dissipation frame 230; the heat is exchanged with the atmospheric environment through heat convection and heat radiation between the heat dissipation frame 230 and the outer surface of the outer shell (antenna radome front shell 100, rear shell 210); and the heat is conducted to the product mounting bracket through the product mounting ears 212 and other contact areas.

[0064] Specifically, the heat dissipation protrusion 231 is positioned to correspond to areas on PCBA300 where local heat is relatively high, such as the RF front-end chip, baseband and digital processing chip, and power management module.

[0065] The present invention also provides a method for manufacturing the above-mentioned waveguide satellite front millimeter-wave radar, comprising the following steps:

[0066] The heat dissipation frame 230 is formed by aluminum alloy die casting process; there are multiple segments of integral injection molding bonding surface 211 distributed in a circle between the heat dissipation frame 230 and the back shell 210. The heat dissipation frame 230 is integrally injection molded with the back shell 210 as an insert through the multiple segments of integral injection molding bonding surface 211 and PIN pin 220; after molding and cooling, sealant is applied to the inner surface of the heat dissipation frame 230 and the back shell 210.

[0067] The plastic part is metallized to form a plastic metallized part 410. Process ventilation holes 422 are opened on the metal sheet. The plastic metallized part 410 and the metal sheet part 420 are assembled and heated together by tinning the steel mesh, positioning post 414 and positioning hole to form a closed waveguide cavity.

[0068] Components and PCBs are soldered together to form PCBA300;

[0069] Thermal adhesive 240 is applied to the heat dissipation boss 231 of the heat dissipation frame 230;

[0070] The connecting hole 310 on the soldered PCBA300 is passed through the connecting post 233 on the base assembly 200. The PIN pin 220 is passed through the crimping hole of the PCBA300 through the crimping tool, and the PCBA300 is brought into contact with the heat dissipation frame 230. The heat dissipation boss 231 is brought into contact with the PCBA300 through the thermally conductive adhesive 240.

[0071] Install the waveguide antenna assembly 400, press the connecting hole 310 of the waveguide antenna assembly 400 to the connecting post 233, and use a metal riveting process to thicken the head of the connecting post 233 to fix the waveguide antenna assembly 400 onto the PCBA 300; in particular, apply pressure when installing the waveguide antenna assembly 400, with a pressure of about 5-10 kg, and use a metal riveting process on the head of the connecting post 233 under pressure, and hold the pressure for about 1 minute after completion.

[0072] After the welding groove 110 on the front shell 100 of the radome is pre-installed with the welding rib 213 area on the rear shell 210, it is processed into a finished radar product using laser welding technology.

[0073] The integral injection-molded bonding surface 211 can be treated physically, chemically, or by cleaning. Physical treatment involves grinding / sandblasting to remove the surface oxide layer and create a micro-uneven structure; or, high-frequency, high-voltage discharge to break the molecular chains on the plastic surface, generating free radicals and introducing polar groups such as hydroxyl and carboxyl groups, while increasing the surface micro-roughness. Chemical treatment is generally achieved using strong solvents (such as cyclohexanone for ABS, tetrahydrofuran for PC, etc.), or by plasma treatment (such as oxygen or nitrogen plasma bombardment of the surface) or flame treatment (rapidly sweeping the surface with a high-temperature flame for 0.5–2 seconds) to enhance surface polarity and activity. Cleaning treatment generally involves wiping the surface with isopropanol, anhydrous ethanol, or a special cleaning agent to remove mold release agents (such as silicone-based or fluorine-based mold release agents) and oil stains, and ultrasonic cleaning (frequency 20–40 kHz) to remove microscopic dust.

[0074] The adhesive used for the integral injection-molded bonding surface 211 can be an epoxy resin adhesive. Alternatively, the heat dissipation frame 230 and the rear shell 210 can be connected via the integral injection-molded bonding surface 211 through ultrasonic welding or laser welding.

[0075] It should be noted that if the embodiments of the present invention involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0076] Furthermore, if the embodiments of the present invention involve descriptions such as "first" or "second," such descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature.

[0077] In summary, this invention provides a waveguide satellite front-mounted millimeter-wave radar and its manufacturing method. The base assembly integrates the back shell, PIN pins, and heat dissipation frame into a single unit, making installation convenient and simple. A multi-segment integrated injection-molded bonding surface is distributed around the back shell and heat dissipation frame, ensuring the stability of the connection between them. The PIN pins penetrate the back shell and are sealed with sealant, facilitating PCBA connection to the outside world and ensuring sealing performance. Heat dissipation bosses are provided on the heat dissipation frame, coated with thermally conductive adhesive, and then in contact with the PCBA. This allows heat from the PCBA to be dissipated through the thermally conductive adhesive, heat dissipation bosses, and heat dissipation frame / back shell, improving heat dissipation performance. The waveguide antenna assembly utilizes plastic metallized parts and metal sheet parts, ensuring waveguide transmission performance while reducing weight compared to traditional antennas.

[0078] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present invention. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of the present invention without departing from the scope of the present invention shall still fall within the scope of the present invention.

Claims

1. A waveguide satellite front-mounted millimeter wave radar, characterized by, The application relates to an antenna device. The antenna device comprises an antenna cover front shell, a base assembly, a PCBA and a waveguide antenna assembly. The base assembly comprises an integrally-formed rear shell, a PIN pin and a heat-dissipating middle frame. The base assembly has a containing groove which is open to the antenna cover front shell. The heat-dissipating middle frame is arranged in the containing groove.

2. The waveguide satellite front-mounted millimeter wave radar according to claim 1, characterized in that, The rear shell and the heat-dissipating middle frame have a plurality of integral injection-molding bonding surfaces which are distributed in a whole circle.

3. The waveguide satellite front-mounted millimeter wave radar of claim 1, wherein, The PIN pin is embedded in the rear shell and forms a terminal.

4. The waveguide satellite front-mounted millimeter wave radar of claim 1, wherein, The joint of the heat-dissipating middle frame and the rear shell is provided with sealing glue.

5. The waveguide satellite front-mounted millimeter wave radar of claim 1, wherein, The heat-dissipating middle frame has a plurality of heat-dissipating bosses which protrude towards the antenna cover front shell.

6. The waveguide satellite front-mounted millimeter wave radar according to claim 5, characterized in that, The heat-dissipating bosses are coated with heat-conducting glue.

7. The waveguide satellite front-mounted millimeter wave radar of claim 6, wherein, The antenna cover front shell is connected with the rear shell.

8. The waveguide satellite front-mounted millimeter wave radar of claim 1, wherein, The PCBA is fixedly connected with the base assembly and is attached to the heat-dissipating bosses through heat-conducting glue.

9. The waveguide satellite front-mounted millimeter wave radar of claim 1, wherein, The PIN pin is connected with the PCBA through butt joint.

10. A method of manufacturing a waveguide satellite front-mounted millimeter wave radar according to any one of claims 1-9, characterized in that, The waveguide antenna assembly is arranged on the PCBA. The waveguide antenna assembly comprises a plastic metalized part and a metal sheet part from bottom to top. The plastic metalized part and the metal sheet part are welded together through SMT and form independent cavities. The plastic metalized part is provided with a signal adapter, a transmission channel and an antenna transmitting / receiving unit. The metal sheet is provided with an avoiding hole corresponding to the signal adapter. The plastic metalized part is electrically connected with the PCBA through the avoiding hole. The outer side wall of the rear shell is provided with a plurality of mounting ears. The mounting ears are provided with fixing holes. The end surface of the rear shell is provided with a welding rib. The end surface of the antenna cover front shell is provided with a welding groove. The welding rib and the welding groove are nested and connected after welding. The plastic metalized part and the metal sheet part are welded together after steel mesh brushing and heating to form a closed waveguide cavity. The plastic metalized part is provided with a positioning column. The metal sheet part is provided with a positioning hole matched with the positioning column. The base assembly extends towards the antenna cover front shell and has a plurality of connecting columns. The PCBA and the waveguide antenna assembly are provided with connecting holes matched with the connecting columns. The connecting holes on the waveguide antenna assembly are arranged on the positioning column. A plurality of process air holes are formed on the metal sheet part. The rear shell is provided with a window. The bottom of the heat-dissipating middle frame is exposed from the window. A plurality of heat-dissipating ribs are arranged on the heat-dissipating middle frame exposed from the window. The application comprises the following steps: An aluminum alloy die-casting process is adopted to form a heat-dissipating middle frame. A plurality of integral injection-molding bonding surfaces are distributed in a whole circle between the heat-dissipating middle frame and a rear shell. The heat-dissipating middle frame and a PIN pin are integrally injection molded with the rear shell as an embedded part through the integral injection-molding bonding surfaces. Sealing glue is dripped and coated on the inner surfaces of the heat-dissipating middle frame and the rear shell after cooling. A plastic metalized part is formed through plastic metalization treatment. A plurality of process air holes are formed on a metal sheet. The plastic metalized part and the metal sheet part are positioned and assembled through steel mesh brushing, a positioning column and a positioning hole and are welded together after heating to form a closed waveguide cavity. Components and PCBs are welded to form a PCBA. Heat-conducting glue is coated on the heat-dissipating bosses of the heat-dissipating middle frame. The connecting hole on the completed PCBA is passed through the connecting column on the base assembly, the PIN needle is passed through the crimping hole of the PCBA through a crimping tool, and the PCBA is in contact with the heat dissipation middle frame, and the heat dissipation boss is in contact with the PCBA through heat conductive glue; The waveguide antenna assembly is installed, the waveguide antenna assembly connecting hole is crimped with the connecting column, the metal riveting process is used to thicken the head of the connecting column, and the waveguide antenna assembly is fixed to the PCBA; After the antenna cover front shell welding groove and the welding rib area on the rear shell are pre-installed, a laser welding process is used to process the radar product.

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