Hot-pressing pasting head assembly for semiconductor nano-silver presintered paster production

Abstract

The invention relates to the technical field of chip mounters, in particular to a semiconductor nano-silver pre-sintered chip production hot-pressing pasting head assembly which comprises a base plate and a linear driving assembly for driving the base plate to move linearly, a rotating disc is rotationally arranged on the base plate, and a plurality of pasting head structures which are evenly distributed are detachably arranged on the rotating disc in the circumferential direction of the rotating disc. The base plate is provided with a pushing and pressing assembly used for conducting constant-pressure pushing on the pasting head structures, the outer side of each pasting head structure is detachably provided with a wire connecting structure, the rotating disc is provided with a position adjusting assembly used for adjusting the angle positions of the pasting head structures, and the pasting head structures are provided with vacuum adsorption structures. Detachable pasting head structures are uniformly distributed on the circumference of the turntable and are matched with the turntable driven by the first motor to rotate, so that different pasting heads can be quickly switched to working stations; according to the pasting head replacing structure, through the cooperative action of a second motor, a rotating cross beam and an electric telescopic rod, the pasting head can be automatically disassembled and assembled, the replacing time is greatly shortened, and the production continuity is guaranteed.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chip mounter, and particularly relates to a hot-pressing head assembly for semiconductor nano-silver pre-sintering chip production. BACKGROUND

[0002] With the continuous development of various industrial technologies, the chip mounter also needs to be improved according to the strict requirements of industrial manufacturing processes to meet the needs of high-efficiency and accurate chip mounting in industrial manufacturing, so that the chip mounter can achieve higher precision, faster speed and wider adaptability.

[0003] A nano-silver pre-sintering chip mounter with publication number CN120111871A includes a rack, a base material transportation device, a mounting head device, a heating and sintering chip platform, a crystal ring feeding device and a TRAY disc feeding device. The mounting head device is erected on the rack, the base material transportation device is arranged on the lower side of the mounting head device, and the heating platform is arranged in front of the base material transportation device. The crystal ring feeding device is arranged on the right side of the front end of the rack, and the TRAY disc feeding device is arranged on the left side of the front end of the rack.

[0004] In the production process of semiconductor nano-silver pre-sintering chips, the hot-pressing head assembly has many technical limitations. The main problem is the low efficiency of head switching. The traditional head is mainly fixedly assembled. When different specifications of chips need to be adapted or the head is damaged, manual disassembly and replacement are required, which leads to long standby time of the equipment and seriously affects the production continuity and overall efficiency.

[0005] The positioning accuracy is insufficient, the head angle adjusting mechanism is missing or the adjusting range is limited, and the precise fine adjustment cannot be made according to the alignment requirements of the chip and the substrate. Especially in the process of semiconductor nano-silver pre-sintering, small angle deviation can easily lead to poor sintering effect and reduce product yield. SUMMARY

[0006] (I) Technical problems solved The purpose of the present application is to provide a hot-pressing head assembly for semiconductor nano-silver pre-sintering chip production to solve the above problems.

[0007] (II) Technical solutions To achieve the above purpose, the present application provides the following technical solutions: The application provides a kind of semiconductor nano silver pre-sintering patch production hot-pressing head assembly, including seat plate and the linear drive component of driving seat plate linear movement, the rotating disc is rotationally arranged on the seat plate, the rotating disc is detachably provided with several head structures that are uniformly distributed along its circumferential direction, the seat plate is provided with push assembly for constant pressure pushing head structure, the outside of each head structure is detachably provided with connecting structure, the rotating disc is provided with position adjusting assembly for adjusting the angle position of head structure, the head structure is provided with vacuum adsorption structure.

[0008] Further, the outside of the rotating disc is provided with several uniformly distributed guide holes for inserting the head structure along its circumferential direction, the upper end of the guide hole is provided with a sleeve, the head structure includes a head column, the outside of the upper end of the head column is protruded with a shoulder, the shoulder is slidingly arranged in the sleeve, the outside of the head column between the rotating disc and the shoulder is nested with a spring.

[0009] Further, the linear drive component includes a first cylinder, the outside of the first cylinder is fixedly provided with a support seat, the support seat is provided with a first fixed seat, the head end of the push rod of the first cylinder is fixedly connected with the seat plate, the two sides of the first cylinder are provided with two guide rods that are symmetrically distributed with the first cylinder as the center, one end of the two guide rods is fixedly connected with the seat plate, the other end of the two guide rods is slidingly connected to the guide sliding hole provided in the corresponding position of the support seat.

[0010] Further, the push assembly includes a second cylinder, the second cylinder is fixedly arranged on the rotating disc through a mounting seat, the head end of the push rod of the second cylinder passes through the rotating disc and is connected with a push column, the push column is provided with a constant force controller.

[0011] Further, the lower end of the head column is provided with a conical touch pressure suction head, the lower end of the touch pressure suction head is provided with several uniformly distributed negative pressure air holes, the touch pressure suction head is provided with an annular air cavity that is communicated with the negative pressure air hole, the head column is provided with a vacuum air pump, the air inlet of the vacuum air pump is connected with the annular air cavity through a gas guide pipe.

[0012] Further, the head column is provided with an electric heater, one end of the electric heater extends into the touch pressure suction head, the head column adopts heat insulation material, and the touch pressure suction head adopts heat conduction material.

[0013] Further, the connecting structure includes an outer ring frame, the upper side of the outer ring frame is fixedly connected with a hanging bracket, the upper end of the hanging bracket is fixedly connected with the seat plate, the lower side of the outer ring frame is connected with a spring lead wire that corresponds to the head structure one by one, the lower end of each spring lead wire is connected with a plug, and the head column is provided with a jack that is connected with the plug.

[0014] Further, the head replacing structure comprises a second motor, an output shaft end of the second motor is connected with a rotary cross beam, electric telescopic rods are arranged on both sides of the rotary cross beam along the width direction of the rotary cross beam, the electric telescopic rods are double-shaft electric push rods, clamping grooves matched with push rods of the electric telescopic rods are arranged on both sides of the upper end of the head column, and second fixing bases are arranged on both sides of the second motor.

[0015] Further, the outer side of the seat plate is provided with a gap for the head structure to be taken out from the guide hole, and a central column table is fixedly arranged on the lower side of the seat plate, and the central column table is provided with a first motor for driving the rotating disc to rotate.

[0016] Further, the position adjusting assembly comprises an annular groove arranged on the outer side of the head column, and a gear ring is arranged in the annular groove, a third motor is fixedly arranged on the rotating disc, and a gear is arranged at the output shaft end of the third motor, when the rotating disc is driven to rotate by the first motor, the gear rings on the head columns are sequentially and meshingly connected with the gear, and the thickness of the gear ring is greater than the thickness of the gear.

[0017] (Three) beneficial effects Compared with the prior art, the beneficial effects of the present application are that: 1. The rotating disc is uniformly provided with detachable head structures, and the rotating disc is driven to rotate by the first motor, so that different heads can be quickly switched to the working station; the head replacing structure can automatically complete the dismounting and mounting of the head through the cooperative action of the second motor, the rotary cross beam and the electric telescopic rod, so that the replacement time is greatly shortened and the production continuity is ensured.

[0018] 2. The push assembly is provided with a constant force controller, the push column is driven by the second cylinder to apply stable pressure to the head, the pressure parameter required for nano-silver presintering is accurately matched, and the fitting defects caused by uneven pressure are avoided; the head column is made of heat insulation material, the touch pressure suction head is made of heat conduction material, and the electric heater directly extends into the suction head, so that the heat is accurately conducted, the heat loss is reduced, and the sintering temperature is stable.

[0019] 3. The linear driving assembly is driven to stably ascend and descend along the vertical direction through the cooperation of the first cylinder and the symmetrical guide rods, and the plane positioning is realized through the cooperation of the XY servo workbench of the chip mounter; the position adjusting assembly is meshingly connected through the gear ring and the gear, the angle of each head entering the working station can be individually adjusted, and the precise alignment of the chip and the substrate is ensured.

[0020] 4. The detachable design of the spring wire and the plug connector is adopted in the wire connection structure, and the wire connection structure is reciprocally rotated by 0-360 degrees, so that the wire winding problem in the movement process is effectively avoided. BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description only constitute some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained from these drawings without any creative effort.

[0022] Figure 1 is a front view structural schematic diagram of the present application; Figure 2 is a first direction perspective structural schematic diagram of the present application; Figure 1 Figure 3 is an A-A cross-sectional structural schematic diagram of the present application; Figure 1 Figure 4 is a B local enlarged structural schematic diagram of the present application; Figure 3 Figure 5 is a C local enlarged structural schematic diagram of the present application; Figure 3 Figure 6 is a D local enlarged structural schematic diagram of the present application; Figure 3 Figure 7 is a second direction perspective structural schematic diagram of the present application; Figure 1 Figure 8 is an E local enlarged structural schematic diagram of the present application. Figure 7

[0023] The following is a description of the reference signs: 1, seat plate; 101, notch; 102, center column table; 2, straight line driving assembly; 201, first air cylinder; 202, support seat; 203, guide rod; 204, first fixed seat; 3, rotary disc; 301, first motor; 302, sleeve; 303, guide through hole; 4, head sticking structure; 401, head sticking column; 402, touch pressure suction head; 403, clamping groove; 404, shoulder; 405, spring; 406, insertion hole; 5, connecting line structure; 501, outer ring frame; 502, spring guide wire; 503, plug; 504, hanger; 6, head sticking replacement structure; 601, second motor; 602, rotary cross beam; 603, electric telescopic rod; 604, second fixed seat; 7, position adjusting assembly; 701, annular groove; 702, gear ring; 703, third motor; 704, gear; 8, push assembly; 801, second air cylinder; 802, mounting seat; 803, push column; 804, constant force controller; 9, electric heater; 10, vacuum air pump; 11, annular air cavity; 12, air guide pipe; 13, negative pressure air hole. DETAILED DESCRIPTION ​​​​​​​

[0024] In order to make the purposes, technical solutions and advantages of the present application clearer, the technical solutions of the present application will be described in detail below. Obviously, the described embodiments are only some of the embodiments of the present application, not all. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work belong to the scope of protection of the present application.

[0025] Referring to Figures 1-8 As shown in the drawings, the present application provides a semiconductor nano-silver presintering patch production hot-pressing head assembly, which comprises a seat plate 1, a head replacement structure 6 and a linear drive assembly 2 for driving the linear movement of the seat plate 1, a rotating disc 3 is rotatably arranged on the seat plate 1, a plurality of head structures 4 are detachably arranged on the rotating disc 3 along the circumferential direction thereof, the rotating disc is rotated to quickly switch the working head, thereby reducing the equipment downtime waiting time and improving the production efficiency, a pushing assembly 8 for constantly pushing the head structure 4 is arranged on the seat plate 1, a connecting line structure 5 is detachably arranged on the outer side of each head structure 4, a position adjusting assembly 7 for adjusting the angular position of the head structure 4 is arranged on the rotating disc 3, and a vacuum adsorption structure is arranged on the head structure 4.

[0026] In actual application, the Z-axis lifting displacement is realized by the linear drive assembly 2, the planar positioning is completed by cooperating with the XY servo workbench of the chip mounter, and the head angle fine adjustment is realized by the position adjusting assembly 7, thereby meeting the high-precision alignment requirement of the patch and the substrate.

[0027] As shown in the drawings, Figure 2 , Figure 4 and Figure 6 As shown in the drawings, a plurality of guide through holes 303 for inserting and placing the head structure 4 are arranged on the outer side of the rotating disc 3 along the circumferential direction thereof, a sleeve 302 is arranged at the upper end of the guide through hole 303, the head structure 4 comprises a head column 401, a shoulder 404 is protrusively arranged on the outer side of the upper end of the head column 401, the shoulder 404 is slidingly arranged in the sleeve 302, a spring 405 is nested on the outer side of the head column 401 between the rotating disc 3 and the shoulder 404, and the spring 405 is compressed when the head structure 4 is pressed and is reset after the pressure is removed. The detachable assembly of the head structure 4 and the rotating disc 3 is realized by the guide through hole 303, different head structures 4 are quickly switched to the working position by cooperating with the rotation of the rotating disc 3, and the production efficiency is improved. Moreover, the sleeve 302 and the shoulder 404 are slidingly matched, the head column 401 is limited to move only in the vertical direction, the head is prevented from deviating during the hot-pressing or adsorption process, and the patch alignment accuracy is ensured.

[0028] As shown in the drawings, Figure 1 and Figure 2As shown, the linear drive assembly 2 includes a first cylinder 201, and a support seat 202 is fixed outside the first cylinder 201. The support seat 202 is provided with a first fixing seat 204. The head end of the push rod of the first cylinder 201 is fixedly connected with the seat plate 1. The two sides of the first cylinder 201 are provided with two guide rods 203 which are symmetrically distributed with the first cylinder 201 as the center. One end of the two guide rods 203 is fixedly connected with the seat plate 1, and the other end of the two guide rods 203 is slidingly connected to the guide sliding hole provided in the corresponding position of the support seat 202. Through the above specific structural design, the linear drive assembly 2 can drive the seat plate 1, the rotating disc 3 and the head sticking structure 4 to stably move in the vertical direction, so as to meet the height adjustment requirement in the process of patch adsorption and hot-press bonding. In addition, the head sticking structure 4 can also be replaced by cooperating with the head replacement structure 6.

[0029] As shown in the accompanying drawings of the specification Figure 2 and Figure 3 As shown, the push assembly 8 includes a second cylinder 801, and the second cylinder 801 is fixedly arranged on the rotating disc 3 through a mounting seat 802. The head end of the push rod of the second cylinder 801 penetrates through the rotating disc 3 and is connected with a push column 803. The push column 803 is provided with a constant force controller 804. Through the rotation of the rotating disc 3, the push assembly 8 can be matched with different head sticking structures 4.

[0030] As shown in the accompanying drawings of the specification Figure 2 , Figure 3 and Figure 6 As shown, the lower end of the head sticking column 401 is provided with a conical touch pressure suction head 402. The lower end of the touch pressure suction head 402 is provided with a plurality of negative pressure air holes 13 which are uniformly distributed. The touch pressure suction head 402 is provided with an annular air cavity 11 which is in communication with the negative pressure air holes 13. The head sticking column 401 is provided with a vacuum air pump 10. The air inlet of the vacuum air pump 10 is connected with the annular air cavity 11 through a gas guide pipe 12. The head sticking column 401 is provided with an electric heater 9. One end of the electric heater 9 extends into the touch pressure suction head 402. The head sticking column 401 is made of heat insulation material, and the touch pressure suction head 402 is made of heat conduction material. In actual application, through the cooperation of the vacuum air pump 10, the gas guide pipe 12, the annular air cavity 11 and the negative pressure air holes 13, uniform negative pressure is formed at the lower end of the touch pressure suction head 402, so that the to-be-processed patch can be quickly and stably adsorbed, and the position of the patch can be kept fixed during the transfer process, thereby providing guarantee for subsequent alignment and bonding. The conical touch pressure suction head 402 is convenient for accurate alignment with the patch. The touch pressure suction head 402 has heat conduction and adsorption capacity, and can realize hot-press bonding and position fixation of the patch under the pressure of the push assembly 8, so as to meet the strict requirements of temperature, pressure and positioning accuracy in the production of semiconductor nanosilver pre-sintering patches.

[0031] As shown in the accompanying drawings of the specification Figure 1 , Figure 2 and Figure 5As shown, the connecting structure 5 comprises an outer ring frame 501, the upper side of the outer ring frame 501 is fixedly connected with a hanging frame 504, the upper end of the hanging frame 504 is fixedly connected with the seat plate 1, the lower side of the outer ring frame 501 is connected with a spring wire 502 corresponding to the head sticking structure 4, the lower end of each spring wire 502 is connected with a plug-in connector 503, and the head sticking column 401 is provided with a jack 406 matched with the plug-in connector 503.

[0032] As shown in the accompanying drawings Figure 3 and Figure 7 As shown, the head replacing structure 6 comprises a second motor 601, the output shaft end of the second motor 601 is connected with a rotating cross beam 602, the rotating cross beam 602 is provided with an electric telescopic rod 603 on both sides along the width direction thereof, the electric telescopic rod 603 adopts a double-shaft electric push rod, the upper end of the head sticking column 401 is provided with a clamping groove 403 matched with the push rod of the electric telescopic rod 603 on both sides, and the two sides of the second motor 601 are provided with a second fixed seat 604.

[0033] The outer side of the seat plate 1 is provided with a gap 101 for the head sticking structure 4 to be taken out from the guide hole 303, and the lower side of the seat plate 1 is fixedly provided with a center column table 102, and the center column table 102 is provided with a first motor 301 for driving the rotating disc 3 to rotate.

[0034] As shown in the accompanying drawings Figure 8 As shown, the position adjusting assembly 7 comprises an annular groove 701 provided on the outer side of the head sticking column 401, the annular groove 701 is provided with a gear ring 702, a third motor 703 is fixedly arranged on the rotating disc 3, and the output shaft end of the third motor 703 is provided with a gear 704. When the rotating disc 3 is driven to rotate by the first motor 301, the gear rings 702 on the head sticking columns 401 are sequentially connected with the gear 704 in meshing connection, and the thickness of the gear ring 702 is greater than the thickness of the gear 704.

[0035] Working principle and technical effects of the application: In use, the first fixed seat 204 of the linear drive assembly 2 is fixedly installed on the XY servo workbench of the chip mounter, for position adjustment in the plane, and the displacement adjustment in the Z axis is realized by the linear drive assembly 2. Specifically, the first cylinder 201 of the linear drive assembly 2 pushes the seat plate 1 to move linearly along the guide rod 203, so as to realize the overall position adjustment of the assembly. The first motor 301 in the central column table 102 drives the rotating disc 3 to rotate, so that the head structure 4 in the guide hole 303 on the rotating disc 3 is switched to a working station corresponding to the position of the pushing assembly 8, and the pushing assembly 8 is used to realize the pushing of the head structure 4. At this time, the gear ring 702 on the head structure 4 is also engaged with the gear 704. The head column 401 of the head structure 4 slides in the sleeve 302 through the shoulder 404, and the outside spring 405 provides a reset. After the vacuum pump 10 in the head column 401 is started, the annular air cavity 11 in the touch pressure suction head 402 forms a negative pressure through the air guide pipe 12, and cooperates with the negative pressure hole 13 to adsorb the to-be-processed chip; at the same time, the electric heater 9 heats the touch pressure suction head 402, and the heat insulation material of the head column 401 reduces heat loss.

[0036] The second cylinder 801 of the pushing assembly 8 drives the pushing column 803 to press down the head structure 4, and the constant force controller 804 ensures the stability of the pressure. In position adjustment, the rotating disc 3 is rotated to make the gear ring 702 in the annular groove 701 of the head column 401 engage with the gear 704, and the head angle is adjusted by rotating the gear 704. The outer ring frame 501 of the connecting structure 5 is fixed to the seat plate 1 through the hanger 504, the spring wire 502 is connected with the jack 406 of the head column 401 through the plug-in connector 503 to realize power supply and signal transmission, in order to avoid the winding of the spring wire 502, the rotating disc 3 is driven by the first motor 301 to rotate reciprocatingly at 0-360°, so that the winding is avoided. When the head structure 4 is replaced, the second motor 601 is fixed on the chip mounter through the second fixed seat 604, drives the rotating cross beam 602 to rotate, the push rod of the electric telescopic rod 603 is inserted into the clamping groove 403 of the head column 401, and the seat plate 1 is driven to descend by the linear drive assembly 2, so that the head structure 4 is taken out from the gap 101 of the seat plate 1 for replacement.

[0037] The above is only a specific embodiment of the present application, but the protection scope of the present application is not limited to this. Any person skilled in the art can easily think of changes or replacements within the technical range disclosed by the present application, which should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A hot press patch assembly for producing a semiconductor nanosilver pre-sintered patch, characterized in that: The application relates to a head pasting device, which comprises a seat plate (1) and a linear driving assembly (2) for driving the linear movement of the seat plate (1), the seat plate (1) is provided with a rotating disc (3) rotatingly arranged thereon, a plurality of head pasting structures (4) are detachably arranged on the rotating disc (3) in a circumferential direction of the rotating disc (3), a pushing assembly (8) for constantly pushing the head pasting structures (4) is arranged on the seat plate (1), the outer side of each head pasting structure (4) is detachably provided with a connecting line structure (5), a position adjusting assembly (7) for adjusting the angle position of the head pasting structures (4) is arranged on the rotating disc (3), and a vacuum adsorption structure is arranged on the head pasting structure (4).

2. The hot-pressing patch assembly for producing semiconductor nano-silver pre-sintered patches according to claim 1, characterized in that: A plurality of guide through holes (303) for inserting the head pasting structures (4) are formed on the outer side of the rotating disc (3) in the circumferential direction of the rotating disc (3), sleeves (302) are arranged at the upper ends of the guide through holes (303), the head pasting structure (4) comprises a head pasting column (401), a convex shoulder (404) is protrudedly arranged at the outer side of the upper end of the head pasting column (401), the convex shoulder (404) is slidingly arranged in the sleeve (302), and a spring (405) is nested on the outer side of the head pasting column (401) between the rotating disc (3) and the convex shoulder (404).

3. The hot-pressing patch head assembly for producing semiconductor nano-silver pre-sintered patches according to claim 1, characterized in that: The linear driving assembly (2) comprises a first air cylinder (201), a supporting seat (202) is fixedly arranged on the outer side of the first air cylinder (201), a first fixing seat (204) is arranged on the supporting seat (202), the head end of the push rod of the first air cylinder (201) is fixedly connected with the seat plate (1), two guide rods (203) are symmetrically arranged on the two sides of the first air cylinder (201) and centered on the first air cylinder (201), one end of each guide rod (203) is fixedly connected with the seat plate (1), and the other end of each guide rod (203) is slidingly connected to a guide sliding hole formed in the corresponding position of the supporting seat (202).

4. The hot-pressing patch head assembly for producing semiconductor nano-silver pre-sintered patches according to claim 1, characterized in that: The pushing assembly (8) comprises a second air cylinder (801), the second air cylinder (801) is fixedly arranged on the rotating disc (3) through a mounting seat (802), the head end of the push rod of the second air cylinder (801) penetrates through the rotating disc (3) and is connected with a pushing column (803), and a constant force controller (804) is arranged on the pushing column (803).

5. The hot-pressing patch head assembly for producing semiconductor nano-silver pre-sintered patches according to claim 2, characterized in that: The lower end of the head pasting column (401) is provided with a conical touch pressure suction head (402), a plurality of negative pressure air holes (13) are formed on the lower end of the touch pressure suction head (402) in a uniform distribution mode, an annular air cavity (11) in communication with the negative pressure air holes (13) is arranged in the touch pressure suction head (402), a vacuum air pump (10) is arranged in the head pasting column (401), and the air inlet of the vacuum air pump (10) is connected with the annular air cavity (11) through a gas guide pipe (12).

6. The hot-pressing patch assembly for producing semiconductor nano-silver pre-sintered patches according to claim 2, characterized in that: An electric heater (9) is arranged in the head pasting column (401), one end of the electric heater (9) extends into the touch pressure suction head (402), the head pasting column (401) is made of heat insulation material, and the touch pressure suction head (402) is made of heat conduction material.

7. The hot-pressing patch assembly for producing semiconductor nano-silver pre-sintered patches according to claim 2, characterized in that: The connecting structure (5) comprises an outer ring frame (501), the upper side of the outer ring frame (501) is fixedly connected with a hanging bracket (504), the upper end of the hanging bracket (504) and the seat plate (1) are fixedly connected with each other, the lower side of the outer ring frame (501) is connected with a spring lead wire (502) corresponding to the head sticking structure (4), the lower end of each spring lead wire (502) is connected with a plug (503), and the head sticking column (401) is provided with a jack (406) matched with the plug (503).

8. The hot-pressing patch assembly for producing semiconductor nano-silver pre-sintered patches according to claim 2, characterized in that: The head replacing structure (6) comprises a second motor (601), the output shaft end of the second motor (601) is connected with a rotating cross beam (602), the rotating cross beam (602) is provided with an electric telescopic rod (603) on both sides along the width direction thereof, the electric telescopic rod (603) adopts a double-shaft electric push rod, the upper end of the head sticking column (401) is provided with a clamping groove (403) matched with the push rod of the electric telescopic rod (603) on both sides, and the two sides of the second motor (601) are provided with a second fixing seat (604).

9. The hot-pressing patch assembly for producing semiconductor nano-silver pre-sintered patches according to claim 2, characterized in that: The outer side of the seat plate (1) is provided with a gap (101) for the head sticking structure (4) to be taken out from the guide perforation (303), the lower side of the seat plate (1) is fixedly provided with a center column table (102), and the center column table (102) is provided with a first motor (301) for driving the rotating disc (3) to rotate.

10. The hot-pressing patch assembly for producing semiconductor nano-silver pre-sintered patches according to claim 9, characterized in that: The position adjusting assembly (7) comprises an annular groove (701) provided on the outer side of the head sticking column (401), the annular groove (701) is provided with a gear ring (702), the rotating disc (3) is fixedly provided with a third motor (703), the output shaft end of the third motor (703) is provided with a gear (704), when the first motor (301) drives the rotating disc (3) to rotate, the gear ring (702) on each head sticking column (401) is sequentially matched and engaged with the gear (704), and the thickness of the gear ring (702) is greater than that of the gear (704).

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