Liquid cooling radiator and electronic equipment

Abstract

The invention provides a liquid cooling radiator and electronic equipment, and relates to the technical field of heat dissipation. The liquid cooling radiator comprises a vapor chamber, radiating fins, a liquid cooling plate assembly and a liquid pump. The heat dissipation fins are arranged on the uniform temperature plate, the liquid cooling plate assembly is arranged on the uniform temperature plate, and the liquid cooling plate assembly is used for being connected with a heating source. The liquid pump is provided with a liquid inlet and a liquid outlet, and the liquid inlet and the liquid outlet are both communicated with the liquid cooling plate assembly. The liquid cooling plate assembly is in direct contact with a heating source, the heat conduction link of a traditional heat dissipation block is omitted, and the heat resistance between the heating source and the vapor chamber is remarkably reduced. When the cooling liquid flows in the liquid cooling plate assembly, the heat generated by the heating source can be quickly absorbed, and the heat is directly conducted to the uniform temperature plate through the heat conduction path of the liquid cooling plate. In addition, continuous flowing of the cooling liquid is guaranteed under circulating driving of the liquid pump, and heat is prevented from being accumulated in the liquid cooling plate assembly.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and in particular to a liquid cooling system and electronic equipment. Background Technology

[0002] With technological advancements and hardware upgrades, the performance of electronic devices such as smartphones and laptops has improved rapidly, leading to the generation of dense heat under high loads on core components. Inadequate heat dissipation can cause device frequency reduction and component aging, directly impacting operational stability and lifespan. Heat dissipation has become a key bottleneck restricting the development of these devices.

[0003] In existing air-cooling systems, the heat from core components (such as CPU and GPU) is transferred to a vapor chamber via a heatsink, and then the vapor chamber conducts the heat to the heat sink fins. A high-speed rotating fan drives airflow through the gaps between the heat sink fins, using forced convection to remove the heat and thus cool down the core components.

[0004] However, the heat is transferred between the core components and the heat spreader by a heat sink, but the heat sink itself has low heat transfer efficiency, resulting in a large thermal resistance between the two. Summary of the Invention

[0005] This application provides a liquid-cooled heat sink and electronic device to solve the problems of low heat transfer efficiency of heat sink and large thermal resistance between core components and heat spreader.

[0006] In a first aspect, the liquid-cooled heat sink provided in the embodiments of this application includes:

[0007] Heat spreader;

[0008] Heat dissipation fins are mounted on a heat exchange plate.

[0009] Liquid cooling plate assembly, which is mounted on a heat exchange plate and is used to connect to a heat source;

[0010] The liquid pump has an inlet and an outlet, both of which are connected to the liquid cooling plate assembly.

[0011] In one possible implementation, the liquid-cooled radiator provided in this application embodiment includes a liquid-cooled plate assembly comprising a first liquid-cooled plate and a second liquid-cooled plate spaced apart. The first liquid-cooled plate has a first liquid inlet channel and a first liquid outlet channel, and the second liquid-cooled plate has a second liquid inlet channel and a second liquid outlet channel.

[0012] The liquid outlet, the first liquid inlet channel, the first liquid outlet channel, the second liquid inlet channel, the second liquid outlet channel, and the liquid inlet are connected in sequence to form a closed loop;

[0013] The first liquid cooling plate is used to connect to the heat source, and the second liquid cooling plate is set accordingly to the heat dissipation fins.

[0014] In one possible implementation, the liquid-cooled radiator provided in this application embodiment has liquid cooling channels in both the first liquid cooling plate and the second liquid cooling plate. The liquid cooling channels of the first liquid cooling plate are connected to the first liquid inlet channel and the first liquid outlet channel, and the liquid cooling channels of the second liquid cooling plate are connected to the second liquid inlet channel and the second liquid outlet channel.

[0015] The liquid cooling channel includes a main inlet channel, a main outlet channel, and multiple branch channels. The two ends of each branch channel are connected to the main inlet channel and the main outlet channel, respectively.

[0016] In one possible implementation, the liquid-cooled radiator provided in this application embodiment has each branch flow channel extending along a first direction, and multiple branch flow channels are sequentially spaced along a second direction intersecting the first direction.

[0017] In one possible implementation, the liquid-cooled radiator provided in this application embodiment includes a first cover and a second cover, both of which are connected.

[0018] The first cover has a receiving groove, and multiple dividing ribs are provided in the receiving groove. The side walls of two adjacent dividing ribs, part of the first cover and part of the second cover together form a branch flow channel. The liquid inlet main channel and the liquid outlet main channel are located at the two ends of the dividing ribs respectively.

[0019] In one possible implementation, the liquid-cooled radiator provided in this application embodiment has a rectangular, trapezoidal, or circular cross-sectional shape for the branch flow channels.

[0020] In one possible implementation, the liquid-cooled radiator provided in this application embodiment has at least two inlet ports, two outlet ports, one first inlet channel, one first outlet channel, one second inlet channel, and one second outlet channel, so as to form at least two closed loops.

[0021] In one possible implementation, the liquid-cooled radiator provided in this application embodiment further includes multiple hoses, with the liquid pump and the liquid cooling plate assembly connected via corresponding hoses.

[0022] In one possible implementation, the liquid-cooled radiator provided in this application embodiment has the liquid cooling plate assembly and the heat dissipation fins located on opposite sides of the heat spreader.

[0023] Secondly, the electronic device provided in the embodiments of this application includes a device body and a liquid-cooled heat sink disposed on the device body as described above.

[0024] This application provides a liquid-cooled heat sink and electronic device. The liquid-cooled heat sink includes a vapor chamber, heat dissipation fins, a liquid cooling plate assembly, and a liquid pump. The heat dissipation fins are disposed on the vapor chamber, and the liquid cooling plate assembly is disposed on the vapor chamber and is used to connect to a heat source. The liquid pump has an inlet and an outlet, both of which are connected to the liquid cooling plate assembly. By directly contacting the heat source with the liquid cooling plate assembly, the heat conduction link of the traditional heat sink is eliminated, significantly reducing the thermal resistance between the heat source and the vapor chamber.

[0025] The metal substrate (such as copper or aluminum) of the liquid cooling plate assembly has high thermal conductivity. When the coolant flows inside the liquid cooling plate assembly, it can quickly absorb the heat generated by the heat source and directly conduct the heat to the heat spreader through the heat conduction path of the liquid cooling plate. Furthermore, the continuous flow of coolant is ensured by the circulation drive of the liquid pump, preventing heat from accumulating inside the liquid cooling plate assembly. Attached Figure Description

[0026] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0027] Figure 1 This is a schematic diagram of the liquid-cooled heat sink provided in this application;

[0028] Figure 2 for Figure 1 A structural schematic diagram of the liquid-cooled heat sink from another perspective;

[0029] Figure 3 for Figure 1 A schematic diagram of the liquid cooling plate assembly and liquid pump in the middle;

[0030] Figure 4 for Figure 3 A split view of the first liquid cooling plate in the middle;

[0031] Figure 5 for Figure 4 A schematic diagram of the structure of the first cover in the middle.

[0032] Explanation of reference numerals in the attached figures:

[0033] 100. Heat spreader;

[0034] 200. Heat dissipation fins;

[0035] 300. Liquid cooling plate assembly; 301. Liquid cooling channel; 3011. Main liquid inlet channel; 3012. Main liquid outlet channel; 3013. Branch channel; 310. First liquid cooling plate; 311. First liquid inlet channel; 312. First liquid outlet channel; 320. Second liquid cooling plate; 321. Second liquid inlet channel; 322. Second liquid outlet channel; 331. First cover; 3311. Receiving tank; 3312. Separating rib; 332. Second cover;

[0036] 400. Liquid pump; 410. Liquid inlet; 420. Liquid outlet;

[0037] 500. Hose.

[0038] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0039] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0040] The terms “first,” “second,” “third,” and “fourth,” etc. (if present), in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a particular order or sequence. It should be understood that such data can be interchanged where appropriate so that embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms “comprising” and “having,” and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0041] As mentioned in the background section, in existing air-cooled heat dissipation, the heat of core components (such as CPU and GPU) is transferred to the heat spreader through the heat sink, and then the heat spreader conducts the heat to the heat sink fins. A high-speed rotating fan drives the airflow through the gaps between the heat sink fins, and the heat is carried away by forced convection, thereby cooling the core components.

[0042] However, the heat is transferred between the core components and the heat spreader by a heat sink, but the heat sink itself has low heat transfer efficiency, resulting in a large thermal resistance between the two.

[0043] To address the aforementioned problems in the prior art, this invention provides a liquid-cooled heat sink and electronic device. The liquid-cooled heat sink includes a vapor chamber, heat dissipation fins, a liquid-cooled plate assembly, and a liquid pump. The heat dissipation fins are disposed on the vapor chamber, and the liquid-cooled plate assembly is disposed on the vapor chamber and connected to a heat source. The liquid pump has an inlet and an outlet, both of which are connected to the liquid-cooled plate assembly. By directly contacting the heat source with the liquid-cooled plate assembly, the heat conduction link of the traditional heat sink is eliminated, significantly reducing the thermal resistance between the heat source and the vapor chamber. The metal substrate (such as copper or aluminum) of the liquid-cooled plate assembly has high thermal conductivity. When the coolant flows inside the liquid-cooled plate assembly, it can quickly absorb the heat generated by the heat source and directly conduct the heat to the vapor chamber through the heat conduction path of the liquid-cooled plate. Furthermore, the continuous flow of coolant is ensured by the circulating drive of the liquid pump, preventing heat accumulation within the liquid-cooled plate assembly.

[0044] The following describes exemplary application scenarios of the present invention.

[0045] The liquid cooling radiator provided by this invention can be applied to electronic devices such as smartphones, laptops, tablets, and handheld game consoles.

[0046] The technical solution of this application and how the technical solution of this application solves the above-mentioned technical problems are described in detail below with specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments. The embodiments of this application will now be described with reference to the accompanying drawings.

[0047] Reference Figures 1 to 5 As shown, the liquid-cooled radiator provided in this embodiment includes a heat spreader 100, heat dissipation fins 200, a liquid cooling plate assembly 300, and a liquid pump 400.

[0048] Heat dissipation fins 200 are disposed on the heat spreader 100, and liquid cooling plate assembly 300 is disposed on the heat spreader 100. Liquid cooling plate assembly 300 is used to connect to the heat source. Liquid pump 400 has a liquid inlet 410 and a liquid outlet 420, both of which are connected to liquid cooling plate assembly 300.

[0049] It is understood that the liquid cooling radiator provided in this application embodiment can be used to dissipate heat and cool down the heat source of electronic devices, such as CPUs and GPUs. The liquid cooling plate assembly 300 is directly connected to the heat source, and contains coolant. A liquid pump 400 drives the coolant to circulate between the liquid cooling plate assembly 300, the inlet 410 of the liquid pump 400, and the outlet 420 of the liquid pump 400.

[0050] The heat generated by the heat source is directly conducted to the coolant within the liquid cooling plate assembly 300. The liquid pump 400 drives the coolant to circulate, efficiently transferring the heat to the heat spreader 100. The heat spreader 100 uses its internal phase change heat transfer mechanism (such as evaporation-condensation cycle) to evenly distribute the heat to the surface of the heat dissipation fins 200. Then, a fan built into the electronic device drives airflow through the heat dissipation fins 200, achieving final heat dissipation through forced convection. The connection between the liquid cooling plate assembly 300 and the heat spreader 100 ensures efficient heat transfer, and the circulation driven by the liquid pump 400 ensures continuous coolant flow, preventing heat accumulation within the liquid cooling plate assembly 300.

[0051] In this way, by directly contacting the heat source with the liquid cooling plate assembly 300, the heat conduction link of the traditional heat sink is eliminated, significantly reducing the thermal resistance between the heat source and the heat spreader 100. The metal substrate (such as copper or aluminum) of the liquid cooling plate assembly 300 has high thermal conductivity. When the coolant flows inside the liquid cooling plate assembly 300, it can quickly absorb the heat generated by the heat source and directly conduct the heat to the heat spreader 100 through the heat conduction path of the liquid cooling plate. Furthermore, the continuous flow of coolant is ensured by the circulation drive of the liquid pump 400, preventing heat from accumulating inside the liquid cooling plate assembly 300.

[0052] For example, the liquid pump 400 can be a micropump, such as a piezoelectric micropump, an electromagnetic micropump, or an electrostatic micropump. A micropump is a fluid drive device based on microelectromechanical systems (MEMS) technology or miniaturized design. Its core function is to achieve precise and controllable delivery of liquids (or gases) in a small space. It is compact in size and adaptable to the integration needs of precision equipment.

[0053] Reference Figure 1 and Figure 3 As shown, in some embodiments, the liquid cooling plate assembly 300 includes a first liquid cooling plate 310 and a second liquid cooling plate 320 spaced apart. The first liquid cooling plate 310 has a first liquid inlet channel 311 and a first liquid outlet channel 312, and the second liquid cooling plate 320 has a second liquid inlet channel 321 and a second liquid outlet channel 322. The liquid outlet 420, the first liquid inlet channel 311, the first liquid outlet channel 312, the second liquid inlet channel 321, the second liquid outlet channel 322, and the liquid outlet 410 are sequentially connected to form a closed loop. The first liquid cooling plate 310 is used to connect to a heat source, and the second liquid cooling plate 320 is correspondingly arranged with the heat dissipation fins 200.

[0054] Understandably, under the action of the liquid pump 400, the coolant flows sequentially through the liquid pump 400 outlet 420, the first liquid inlet channel 311 of the first liquid cooling plate 310, the first liquid outlet channel 312 of the first liquid cooling plate 310, the second liquid inlet channel 321 of the second liquid cooling plate 320, the second liquid outlet channel 322 of the second liquid cooling plate 320, and the liquid pump 400 inlet, and then circulates again through the liquid pump 400 outlet 420.

[0055] In the above embodiments, the segmented conduction of heat from the heat source is achieved through the spaced and separate design of the first liquid cooling plate 310 and the second liquid cooling plate 320, which avoids the local accumulation of heat in the heat spreader 100 and improves the heat utilization efficiency of the heat spreader 100.

[0056] The first liquid cooling plate 310 serves as the main heat absorption unit, directly absorbing heat from the heat source. Part of the heat is directly conducted to the vapor chamber 100 through the first liquid cooling plate 310. The coolant absorbing heat within the first liquid cooling plate 310 flows into the second liquid cooling plate 320 under the drive of the liquid pump 400. The second liquid cooling plate 320 serves as an auxiliary heat dissipation unit, transferring heat from the coolant to the vapor chamber 100, while simultaneously expanding the heat dissipation range by utilizing its contact area with the vapor chamber 100.

[0057] The first liquid cooling plate 310 and the second liquid cooling plate 320 can both be bonded to the heat exchange plate 100 by thermally conductive adhesive, or welded to the heat exchange plate 100 by welding.

[0058] Reference Figure 3 , Figure 4 and Figure 5 As shown, in some embodiments, both the first liquid cooling plate 310 and the second liquid cooling plate 320 have liquid cooling channels 301. The liquid cooling channels 301 include an inlet main channel 3011, an outlet main channel 3012 and a plurality of branch channels 3013, with both ends of each branch channel 3013 connected to the inlet main channel 3011 and the outlet main channel 3012, respectively.

[0059] In the first liquid-cooled plate 310, the main inlet channel 3011 is connected to the first liquid inlet channel 311, and the main outlet channel 3012 is connected to the first liquid outlet channel 312. In the second liquid-cooled plate 320, the main inlet channel 3011 is connected to the second liquid inlet channel 321, and the main outlet channel 3012 is connected to the second liquid outlet channel 322. The liquid-cooled flow channel 301 receives coolant through the main inlet channel 3011 and distributes the coolant to multiple branch channels 3013. The coolant in each branch channel 3013 finally converges in the main outlet channel 3012 and flows out of the liquid-cooled flow channel 301.

[0060] In the above embodiment, after the coolant enters the main inlet channel 3011, it is simultaneously distributed into multiple shorter, parallel branch channels 3013. Each branch channel 3013 has a very short path, thus significantly reducing flow resistance. Although the total flow rate remains constant, the total system pressure drop is much lower than that of a single long channel.

[0061] Furthermore, the coolant is simultaneously distributed to each branch channel 3013 through the main inlet channel 3011. After absorbing heat in parallel, each branch channel 3013 converges to the main outlet channel 3012. The coolant temperature rise of all branch channels 3013 is basically the same, avoiding the problem of inefficient heat exchange at the end. At the same time, the increase in the number of branch channels 3013 can significantly expand the total heat exchange area and further improve the heat exchange efficiency.

[0062] Reference Figure 5 As shown, in some embodiments, each branch channel 3013 extends along a first direction, and multiple branch channels 3013 are arranged sequentially at intervals along a second direction that intersects with the first direction.

[0063] To facilitate understanding of the directions, an XY plane coordinate system is established in the accompanying drawings of the specification, wherein the direction of the X-axis is the first direction in the embodiments of this application, and the direction of the Y-axis is the second direction in the embodiments of this application.

[0064] In the above embodiment, the branch flow channels 3013 extend along the first direction, and the multiple branch flow channels 3013 are arranged at intervals along the second direction, so that the coolant forms a mesh flow path inside the liquid cooling flow channel 301, avoiding uneven coolant flow in local areas. This design improves the heat exchange efficiency of the coolant by optimizing the layout of the branch flow channels 3013, while ensuring that the heat from the heat source can be evenly transferred to the heat spreader 100.

[0065] Preferably, the first direction is perpendicular to the second direction. Specifically, in one embodiment, referring to... Figure 3 and Figure 5 As shown, the first direction is the length direction of the first liquid cooling plate 310, and the second direction is the width direction of the second liquid cooling plate 320. The second direction is the width direction of the first liquid cooling plate 310, and the third direction is the length direction of the second liquid cooling plate 320.

[0066] Reference Figure 4 and Figure 5 As shown, in some embodiments, both the first liquid cooling plate 310 and the second liquid cooling plate 320 include a first cover 331 and a second cover 332, with the first cover 331 connected to the second cover 332.

[0067] The first cover 331 has a receiving groove 3311, and multiple dividing ribs are provided in the receiving groove 3311. The side walls of two adjacent dividing ribs 3312, part of the first cover 331 and part of the second cover 332 together form a branch flow channel 3013. The liquid inlet main channel 3011 and the liquid outlet main channel 3012 are located at the two ends of the dividing ribs respectively.

[0068] The sidewalls of two adjacent dividing ribs 3312, a portion of the first cover 331 and a portion of the second cover 332 together form a branch flow channel 3013. One sidewall of the dividing rib 3312, a portion of the first cover 331 and a portion of the second cover 332 together form a liquid inlet main flow channel 3011. The other sidewall of the dividing rib 3312, a portion of the first cover 331 and a portion of the second cover 332 together form a liquid outlet main flow channel 3012.

[0069] In the above embodiments, the liquid inlet main channel 3011, the liquid outlet main channel 3012 and multiple branch channels 3013 are formed by the separator, which avoids the use of additional pipes or complex internal components. The overall structure is simple, compact and has low manufacturing cost.

[0070] The first cover 331 and the second cover 332 can be made of metal materials with high thermal conductivity, such as copper or copper-aluminum composite materials. Metal materials with high thermal conductivity can shorten the heat transfer time, ensure efficient heat transfer, and improve heat dissipation efficiency.

[0071] Specifically, the first cover 331 and the second cover 332 can be sealed together by adhesive or welding. The adhesive can be epoxy glue, polyurethane glue, or acrylic glue, etc.

[0072] Specifically, refer to Figure 5 As shown, the dividing rib 3312 is a long strip extending along the first direction.

[0073] In one embodiment, the branch channel 3013 has a rectangular cross-sectional shape. The rectangular channel structure is simple and easy to process, which can reduce the production cost and processing difficulty of the liquid cooling channel 301.

[0074] In one embodiment, the branch channel 3013 has a trapezoidal cross-sectional shape. The trapezoidal channel can increase the contact area between the coolant and the channel wall, thereby improving the heat exchange efficiency.

[0075] In one embodiment, the branch channel 3013 has a circular cross-sectional shape. In addition to increasing the contact area between the coolant and the channel wall, the circular channel can also reduce the resistance of the coolant during the flow process, reduce energy consumption, and improve the overall efficiency of the system.

[0076] Specifically, in addition to the cross-sectional shape of the liquid cooling channel 301, in order to improve the heat dissipation effect, the width, depth and branch angle of the coolant channel can be optimized through computational fluid dynamics (CFD) simulation to ensure smooth coolant flow and reduce pressure drop.

[0077] Reference Figure 3 As shown, in some embodiments, the number of inlet 410, outlet 420, first inlet channel 311, first outlet channel 312, second inlet channel 321 and second outlet channel 322 are all at least two, so as to form at least two closed loops.

[0078] In the above embodiment, this structural design ensures multi-path flow of coolant within the liquid cooling plate assembly 300. The multiple channels prevent coolant flow interruptions caused by single-point blockages, while parallel flow improves coolant circulation efficiency. The liquid pump 400 drives the coolant to flow synchronously through multiple channels, ensuring uniform heat absorption and conduction.

[0079] Specifically, refer to Figure 3 As shown, there are two inlet ports 410, two outlet ports 420, two first inlet channels 311, two first outlet channels 312, two second inlet channels 321, and two second outlet channels 322, so as to form at least two closed loops.

[0080] Reference Figure 1 and Figure 3 As shown, in some embodiments, the liquid-cooled radiator provided in this application also includes a plurality of hoses 500, and the liquid pump 400 and the liquid cooling plate assembly 300 are connected to each other via the hoses 500.

[0081] The outlet 420 of the liquid pump 400 is connected to the first liquid cooling plate 310, the first liquid cooling plate 310 is connected to the second liquid cooling plate 320, and the second liquid cooling plate 320 is connected to the inlet 410 of the liquid pump 400 via hoses 500.

[0082] In the above embodiment, the flexible connection of the hose 500 enables reliable communication between the liquid pump 400 and the liquid cooling plate assembly 300. At the same time, the flexible hose 500 can also adapt to the compact layout requirements of electronic devices and avoid taking up space.

[0083] The hose 500 can be made of high-temperature resistant materials, such as fluororubber hose, silicone hose and perfluoroether rubber hose, to ensure that the coolant will not deform or leak due to temperature changes during circulation.

[0084] Reference Figure 1 and Figure 2 As shown, in some embodiments, the liquid cooling plate assembly 300 and the heat dissipation fins 200 are located on opposite sides of the heat spreader 100.

[0085] In the above embodiments, the liquid cooling plate assembly 300 and the heat dissipation fins 200 are located on both sides of the heat exchange plate 100, which not only ensures that the liquid cooling plate assembly 300 is in close contact with the heat source, but also avoids the airflow of the heat dissipation fins 200 from disturbing the heat exchange process of the liquid cooling plate assembly 300, thereby improving the overall heat dissipation stability.

[0086] Reference Figure 1 and Figure 3 As shown, in some embodiments, the number of liquid cooling plate assembly 300 and liquid pump 400 is at least two.

[0087] In the above embodiments, there are at least two liquid cooling plate assemblies 300 and two liquid pumps 400, and the coolant forms a parallel circulation path between the two liquid cooling plate assemblies 300 and the two liquid pumps 400. Each liquid cooling plate assembly 300 independently absorbs heat from the heat source and drives the coolant circulation through the corresponding liquid pump 400. This design improves the circulation efficiency of the coolant through the parallel structure, while avoiding heat dissipation failure caused by the failure of a single liquid cooling plate assembly 300 or liquid pump 400.

[0088] For example, refer to Figure 1 and Figure 3 As shown, there are two liquid cooling plate assemblies 300 and two liquid pumps 400. The first liquid cooling plate 310 of one liquid cooling plate assembly 300 is used to connect to the CPU of the electronic device, and the first liquid cooling plate 310 of the other liquid cooling plate assembly 300 is used to connect to the GPU of the electronic device.

[0089] The electronic device provided in this application includes a device body and a liquid-cooled heat sink disposed on the device body as described above.

[0090] In the above structural configuration, since the device body adopts the liquid cooling heat sink in the above embodiment, it also has the advantages and benefits brought by the liquid cooling heat sink, that is, the heat source is directly contacted by the liquid cooling plate assembly 300, eliminating the heat conduction link of the traditional heat sink, significantly reducing the thermal resistance between the heat source and the heat spreader 100, so as to improve the heat dissipation efficiency of the heat source in the electronic device.

[0091] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of the disclosure herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this application are indicated by the following claims.

[0092] It should be understood that this application is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.

Claims

1. A liquid-cooled heat sink, characterized in that, include: Temperature distribution plate (100); Heat dissipation fins (200) are disposed on the heat exchange plate (100); A liquid cooling plate assembly (300) is disposed on the heat exchange plate (100) and is used to connect to a heat source; A liquid pump (400) has an inlet (410) and an outlet (420), both of which are connected to the liquid cooling plate assembly (300).

2. The liquid-cooled heat sink according to claim 1, characterized in that, The liquid cooling plate assembly (300) includes a first liquid cooling plate (310) and a second liquid cooling plate (320) spaced apart. The first liquid cooling plate (310) has a first liquid inlet channel (311) and a first liquid outlet channel (312), and the second liquid cooling plate (320) has a second liquid inlet channel (321) and a second liquid outlet channel (322). The liquid outlet (420), the first liquid inlet channel (311), the first liquid outlet channel (312), the second liquid inlet channel (321), the second liquid outlet channel (322) and the liquid inlet (410) are connected in sequence to form a closed loop; The first liquid cooling plate (310) is used to connect to the heat source, and the second liquid cooling plate (320) is correspondingly arranged with the heat dissipation fins (200).

3. The liquid-cooled radiator according to claim 2, characterized in that, Both the first liquid cooling plate (310) and the second liquid cooling plate (320) have liquid cooling channels (301). The liquid cooling channel (301) of the first liquid cooling plate (310) is connected to the first liquid inlet channel (311) and the first liquid outlet channel (312). The liquid cooling channel (301) of the second liquid cooling plate (320) is connected to the second liquid inlet channel (321) and the second liquid outlet channel (322). The liquid cooling channel (301) includes an inlet main channel (3011), an outlet main channel (3012), and multiple branch channels (3013), with each branch channel (3013) having its two ends connected to the inlet main channel (3011) and the outlet main channel (3012), respectively.

4. The liquid-cooled radiator according to claim 3, characterized in that, Each of the branch channels (3013) extends along a first direction, and the multiple branch channels (3013) are arranged sequentially at intervals along a second direction that intersects with the first direction.

5. The liquid-cooled radiator according to claim 3 or 4, characterized in that, Both the first liquid cooling plate (310) and the second liquid cooling plate (320) include a first cover (331) and a second cover (332), with the first cover (331) and the second cover (332) connected together; The first cover (331) has a receiving groove (3311), and a plurality of dividing ribs are provided in the receiving groove (3311). The sidewalls of two adjacent dividing ribs (3312), part of the first cover (331) and part of the second cover (332) together form the branch flow channel (3013). The liquid inlet main channel (3011) and the liquid outlet main channel (3012) are located at both ends of the dividing ribs, respectively.

6. The liquid-cooled radiator according to claim 3 or 4, characterized in that, The cross-sectional shape of the branch channel (3013) is rectangular, trapezoidal or circular.

7. The liquid-cooled radiator according to any one of claims 2 to 4, characterized in that, The number of the liquid inlet (410), the liquid outlet (420), the first liquid inlet channel (311), the first liquid outlet channel (312), the second liquid inlet channel (321), and the second liquid outlet channel (322) are all at least two, so as to form at least two closed loops.

8. The liquid-cooled radiator according to any one of claims 1 to 4, characterized in that, It also includes multiple hoses (500), through which the liquid pump (400) and the liquid cooling plate assembly (300) are connected respectively.

9. The liquid-cooled radiator according to any one of claims 1 to 4, characterized in that, The liquid cooling plate assembly (300) and the heat dissipation fins (200) are located on opposite sides of the heat spreader (100).

10. An electronic device, characterized in that, It includes a device body and a liquid-cooled heat sink as described in any one of claims 1 to 9 disposed on the device body.

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