Multi-pin film capacitor structure and electronic equipment

Abstract

The invention discloses a multi-pin film capacitor structure and electronic equipment, the multi-pin film capacitor structure comprises a shell, a pouring sealant and at least one capacitor core, the capacitor core is installed in the shell, the pouring sealant is filled between the capacitor core and the shell, and the capacitor core is provided with a plurality of leading-out terminals; the electric connector further comprises a positioning cover plate, the positioning cover plate is provided with a plurality of opening grooves used for containing and positioning the leading-out terminals, and the positioning cover plate is installed in the shell and used for fixing the positions of the leading-out terminals relative to the shell. According to the utility model, the positioning cover plate with the open slot is additionally arranged in the shell, and the open slot can carry out one-time clamping positioning on the leading-out terminal, so that tool-free operation is realized, the problems of product damage or position deviation caused by fixture adhesion by pouring sealant and fixture disassembly are thoroughly avoided, and the production efficiency is greatly improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic equipment, and in particular to a multi-pin film capacitor structure and electronic equipment. BACKGROUND

[0002] The film capacitor, especially the pin-type multi-pin film capacitor, is a key basic element in electronic equipment. Its traditional structure usually includes a capacitor core, a plurality of lead terminals (pins) electrically connected with the core, a shell, and a potting glue. In the production process, in order to ensure that the plurality of lead terminals can be accurately aligned with the corresponding pads or through holes on the circuit board, the position of the lead terminals must be corrected (i.e., "pin correction").

[0003] The prior art generally uses an external tooling fixture to complete this pin correction positioning process: that is, before the potting glue solidifies, the capacitor semi-finished product is placed in a special fixture with positioning holes matched with the target position to fix the spatial position of all lead terminals, and then the fixture is removed after the potting glue solidifies and sets. However, this technical solution relying on an external independent tooling has significant defects: first, each product needs to be individually clamped, corrected, and disassembled, the correction process is complicated, time-consuming, and seriously restricts production efficiency, becoming a production bottleneck; second, moving the product or disassembling the fixture when the potting glue has not completely solidified can easily cause the lead terminals to shift due to product shaking, affecting product precision and consistency; third, the potting glue (such as epoxy resin) may seep into or adhere to the positioning holes of the fixture during the solidification process, not only causing difficulty in cleaning the fixture and shortening its service life, but also possibly damaging the product terminals or the solidified glue when disassembling. Therefore, there is a lack of a positioning solution in the prior art that can start from the structure of the capacitor itself to achieve fast and accurate correction of multi-pin without external tooling fixtures. SUMMARY

[0004] The purpose of the present application is to overcome the shortcomings of the prior art and provide a multi-pin film capacitor structure and electronic equipment, aiming to achieve fast and accurate correction of multi-pin film capacitors without external tooling.

[0005] To achieve the above-mentioned purpose, the present application adopts the following technical solutions: On the one hand, the present application provides a multi-pin film capacitor structure, which includes a shell, a potting glue, and at least one capacitor core, the capacitor core is installed in the shell, the potting glue is filled between the capacitor core and the shell, and the capacitor core is provided with a plurality of lead terminals; further comprising a positioning cover plate, the positioning cover plate is provided with a plurality of open slots for accommodating and positioning the lead terminals, and the positioning cover plate is installed in the shell to fix the position of the lead terminals relative to the shell.

[0006] Further, the opening groove is arranged on the side edge of the positioning cover plate.

[0007] Further, the opening groove is in C shape.

[0008] Further, the positioning cover plate comprises a plurality of split cover plate units, and the opening grooves are arranged on the cover plate units.

[0009] Further, the installation height of the positioning cover plate is lower than the wall height of the shell.

[0010] Further, the inner wall of the shell is provided with a reinforcing rib corresponding to the position of the opening groove, and the reinforcing rib can be clamped into the opening groove.

[0011] Further, the height of the reinforcing rib is the same as the height of the positioning cover plate.

[0012] Further, at least one partition plate is arranged in the shell, the partition plate divides the shell into a plurality of chambers, each chamber contains at least one capacitor core, and the positioning cover plate is connected with the partition plate.

[0013] Further, the positioning cover plate and the partition plate are connected through the clamping structure, the clamping structure comprises a convex rib arranged on the partition plate and a clamping groove arranged on the positioning cover plate, and the clamping groove is connected with the convex rib.

[0014] Further, a gap is formed between the positioning cover plate and the inner wall of the shell, and the gap constitutes a first pouring port for pouring the pouring glue.

[0015] Further, the positioning cover plate is also provided with a second pouring port, and the second pouring port is arranged near the position of the clamping groove.

[0016] On the other hand, the application also provides an electronic device comprising the above multi-pin thin film capacitor structure.

[0017] Compared with the prior art, the application has the following beneficial effects: a multi-pin thin film capacitor structure comprises a shell, pouring glue and at least one capacitor core, the capacitor core is installed in the shell, the pouring glue is filled between the capacitor core and the shell, and a plurality of lead terminals are arranged on the capacitor core; the structure further comprises a positioning cover plate, the positioning cover plate is provided with a plurality of opening grooves for accommodating and positioning the lead terminals, the positioning cover plate is installed in the shell, and is used for fixing the position of the lead terminals relative to the shell. By additionally arranging the positioning cover plate with the opening groove in the shell, the opening groove can clampingly position the lead terminals once, realizes the operation without tooling, completely avoids the product damage or position deviation caused by the adhesion of the pouring glue to the fixture and the disassembly of the fixture, and greatly improves the production efficiency.

[0018] The above description is only a summary of the technical scheme of the present application. In order to make the technical means of the present application more clearly understood, the content of the description can be implemented, and in order to make the above and other purpose features and advantages of the present application more obvious and easy to understand, the following preferred embodiments are described in detail as follows. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the technical scheme of the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced as follows. Obviously, the drawings in the following description are some embodiments of the present application, and those skilled in the art can also obtain other drawings according to these drawings without creative labor.

[0020] Figure 1 An exploded view of a multi-pin film capacitor structure provided for the specific embodiment of the present application Figure 1 ; Figure 2 An exploded view of a multi-pin film capacitor structure provided for the specific embodiment of the present application Figure 2 ; Figure 3 An assembly drawing of a multi-pin film capacitor structure provided for the specific embodiment of the present application Figure 4 A structural schematic view of a split cover plate unit provided for the specific embodiment of the present application Figure 5 A partial enlarged view of part A in Figure 4 ; Figure 6 A structural schematic view of a shell provided for the specific embodiment of the present application Figure 7 A front view of a multi-pin film capacitor structure provided for the specific embodiment of the present application Figure 8 A partial enlarged view of part A in Figure 7 ; Figure 9 A plan view of a multi-pin film capacitor structure provided for the specific embodiment of the present application Figure 10 A partial enlarged view of part A in Figure 9 .

[0021] LIST OF REFERENCE NUMERALS 1, shell; 11, partition; 111, convex rib; 12, reinforcing rib; 13, cavity; 2, potting glue; 3, capacitor core; 31, lead terminal; 4, positioning cover plate; 41, cover plate unit; 411, first potting opening; 412, second potting opening; 413, opening slot; 414, clamping slot. DETAILED DESCRIPTION

[0022] The technical solutions of the present application will be described clearly and completely below in combination with the specific embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present application.

[0023] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like is based on the orientation or positional relationship shown in the drawings, and is only for the purpose of facilitating the description of the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0024] In addition, the terms "first" and "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first" and "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise explicitly specified and limited.

[0025] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connecting", "fixing" and the like should be understood in a broad sense, for example, it can be fixed connection, or detachable connection, or integral; it can be mechanical connection, or electrical connection; it can be direct connection, or indirect connection through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise explicitly limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0026] In the present application, unless otherwise explicitly specified and limited, the first feature "on" or "under" the second feature can be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature "above", "over" and "on" the second feature can be that the first feature is directly above or obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "under" and "under" the second feature can be that the first feature is directly below or obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0027] It is to be noted that when an element is referred to as being "on" or "connected to" another element, it can be directly on the other element or intervening elements can also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements can also be present. The terms "vertical", "horizontal", "upper", "lower", "left", "right", and the like as used herein are used for illustration only and are not intended to be limiting.

[0028] Figures 1 to 10 As shown, the embodiment of the present application provides a multi-pin thin film capacitor structure, which comprises a shell 1, a potting glue 2 and at least one capacitor core 3, the capacitor core 3 is installed in the shell 1, the potting glue 2 is filled between the capacitor core 3 and the shell 1, and the capacitor core 3 is provided with a plurality of lead terminals 31; further comprising a positioning cover plate 4, the positioning cover plate 4 is provided with a plurality of opening grooves 413 for accommodating and positioning the lead terminals 31, and the positioning cover plate 4 is installed in the shell 1 to fix the position of the lead terminals 31 relative to the shell 1.

[0029] Specifically, the shell 1 serves as the bearing and protection matrix of the entire capacitor, which is integrally formed by using plastic materials with good mechanical strength, high temperature resistance and insulation performance, preferably engineering plastics such as PP, PET or PPS. The shell 1 is in the form of a cavity structure with an open upper end, and the internal space size is reasonably designed according to the number, specifications of the capacitor core 3 and the layout of the lead terminals 31, so as to ensure that the components can be smoothly assembled and sufficient space for filling the potting glue 2 is reserved.

[0030] The capacitor core 3 is a key component for realizing core electrical properties such as energy storage and filtering of the capacitor, and the number thereof can be flexibly set according to the power demand of the actual application scene, which can be a single large-capacity core or an integrated structure formed by combining multiple cores. When multiple cores are combined, the power density of the product can be effectively improved, and the BOM usage can be reduced, which is suitable for the development trend of miniaturization and integration of electronic devices. A metal material is attached to the surface of the capacitor core 3 by spraying to form a gold-plated surface, which serves as a welding layer to provide a reliable conductive interface for the connection of the lead terminals 31. Each capacitor core 3 is provided with a plurality of lead terminals 31, which are made of metal materials, preferably tinned copper wire or tinned copper clad steel wire, which can ensure stable electrical connection between the capacitor and the external PCB. The lead terminals 31 are firmly connected to the gold-plated surface of the capacitor core 3 by special welding methods such as resistance welding and soldering, which ensures the conductive performance and mechanical strength of the welding place and avoids problems such as false welding and welding.

[0031] The positioning cover plate 4 is integrally formed of the same or compatible plastic material as the shell 1, has mechanical strength and high temperature resistance matching the shell 1, and ensures no deformation during the subsequent use process. The overall shape of the positioning cover plate 4 is adapted to the cross section of the inner cavity of the shell 1, and can be smoothly installed at the pre-set installation position inside the shell 1.

[0032] The positioning cover plate 4 is provided with a plurality of opening grooves 413, the number, size and distribution position of which correspond one-to-one to the lead terminals 31 on the capacitor core 3. The groove width of the opening grooves 413 is slightly larger than the diameter of the lead terminals 31, which can not only smoothly accommodate the lead terminals 31, but also achieve precise positioning by the fit of the groove wall and the lead terminals 31, limit the displacement of the lead terminals 31 in the horizontal and vertical directions, and ensure the positional consistency of all lead terminals 31 relative to the shell 1, meeting the dimensional tolerance requirements for subsequent welding with the PCB.

[0033] During actual installation, the positioning cover plate 4 is located inside the shell 1 near the open end of the shell 1. After installation, the positioning cover plate 4 covers the capacitor core 3, and all lead terminals 31 extend upward through their respective opening grooves 413. Through the embracing or restraining effect of the side wall of the opening groove 413 on the shaft of the lead terminal 31, the freedom of all lead terminals 31 in the X and Y horizontal directions is effectively limited, thereby accurately fixing their planar positions relative to the shell 1.

[0034] The installation position of the positioning cover plate 4 is first to place the capacitor core 3 with the welded lead terminals 31 into the shell 1 in the assembly process. Then, the positioning cover plate 4 is aligned and installed in place, and in this process, the operator can guide all lead terminals 31 into the corresponding opening grooves 413 at one time to complete the clamping. This step instantly completes the needle alignment and pre-fixing of all pins, replacing the traditional tedious adjustment and external fixture fixing process. Subsequently, the pouring process is performed.

[0035] By adding the positioning cover plate 4 with opening grooves 413 inside the shell 1, the opening grooves 413 can one-time clamp and position the lead terminals 31, realize tool-free operation, completely avoid product damage or position deviation caused by pouring glue 2 adhesion and disassembly of fixtures, and greatly improve production efficiency.

[0036] In Figure 5In the shown embodiment, the open slot 413 is provided at the side edge of the positioning cover plate 4. Specifically, the positioning cover plate 4 has a top surface, a bottom surface, and a side surface surrounding the periphery thereof. The side surface constitutes the boundary of the positioning cover plate 4 in the horizontal direction. The open slot 413 is not opened in the central region of the top surface or the bottom surface of the positioning cover plate 4, but is instead slotted inwardly from the side surface, such that the slot opening is directly exposed to at least one side edge of the positioning cover plate 4. Specifically, each open slot 413 starts from a specific side edge and extends inwardly (i.e. towards the interior of the positioning cover plate 4) in a direction substantially perpendicular to the edge, to a certain depth, thereby forming a passage allowing the lead terminal 31 to enter. The open slots 413 can be linearly arranged along a single side edge of the positioning cover plate 4, or can be distributed on two, three, or all four side edges according to the actual layout of the lead terminals 31. The shape and size of each open slot 413 are matched with the outer diameter of the lead terminal 31 to be positioned, being slightly larger than the diameter of the lead terminal 31 to allow it to be smoothly inserted, but small enough to effectively constrain the lead terminal 31 in the radial direction after it is inserted.

[0037] In the assembly process, the operator does not need to require the lead terminal 31 to be absolutely accurately aligned from directly above the positioning cover plate 4 and vertically inserted into a closed hole in the interior of the cover plate as in the conventional way. Instead, the lead terminals 31 can be roughly aligned as a whole with the cavity of the housing 1 first, and then the positioning cover plate 4 is moved from the side to approach, so that all the lead terminals 31 respectively enter their corresponding open slots 413 which are open at the side edge. This action is similar to inserting the teeth (lead terminals 31) of one comb into the tooth gap of another comb (the edge slot of the positioning cover plate 4). When the lead terminal 31 is completely inserted into the open slot 413, the shaft thereof is surrounded by the inner wall of the slot. Since the open slot 413 extends inwardly from the edge, the inner end of the open slot 413 (i.e. the bottom of the open slot 413) constitutes a stop for the inward movement of the lead terminal 31, and the two side walls of the open slot 413 limit the movement of the lead terminal 31 in the direction of the edge of the positioning cover plate 4. In this way, the two translational degrees of freedom of each lead terminal 31 in the horizontal plane are effectively limited, achieving accurate positioning.

[0038] Providing the open slot 413 at the side edge of the positioning cover plate 4 achieves the side insertion type installation of the lead terminal 31, replacing the more difficult vertical insertion type installation. This reduces the stringent requirement for operation accuracy, thereby reducing the operation difficulty and improving the operation efficiency.

[0039] In Figure 5In the shown embodiment, the opening slot 413 is in the shape of a C letter, i.e. starting from the side edge of the positioning cover plate 4, extending inwardly in a direction substantially perpendicular to the edge, while the extension path is not a straight line, but an arc line in the shape of an approximate semicircle or greater than a semicircle, thereby forming a shape similar to the English letter C on the horizontal projection plane. The C-shaped slot includes a slot opening on the side edge of the positioning cover plate 4, the slot opening has a width slightly greater than the diameter of the lead-out terminal 31 to be positioned, so as to facilitate the initial introduction of the terminal; an arc-shaped side wall extending inwardly from the slot opening, the center of curvature of the arc-shaped side wall substantially corresponds to the position of the axis of the lead-out terminal 31 when the lead-out terminal 31 is fully inserted, so that the arc-shaped side wall can form good surface contact or approximate line contact with the cylindrical outer surface of the lead-out terminal 31; and a slot bottom connecting the two ends of the arc-shaped side wall, which constitutes a mechanical stop for the inward movement of the lead-out terminal 31. The central angle of the C-shaped slot is generally greater than 180 degrees, thereby forming more than half a circle of coverage to the lead-out terminal 31. For example, the central angle can be between 200 degrees and 300 degrees to achieve an optimal balance between stable holding and convenient slotting.

[0040] With the design of the C-shaped opening slot 413, a continuous operation path is provided from the open side to the arc-shaped path guidance and finally to the closed position, which reduces the difficulty of operation.

[0041] In Figure 3 In the shown embodiment, the positioning cover plate 4 includes a plurality of split cover plate units 41, i.e. the functional structure of the positioning cover plate 4 is composed of two or more physically independent and separable cover plate units 41, for example, when a plurality of capacitor cores 3 are arranged inside the shell 1, a part of the capacitor cores 3 share the same cover plate unit 41, and another part of the capacitor cores 3 share another cover plate unit 41, each cover plate unit 41 is provided with opening slots 413 consistent with the number of lead-out terminals 31 of the corresponding part of the capacitor cores 3, and during installation, the plurality of cover plate units 41 are arranged on the same plane, and there can be gaps between the cover plate units 41 or the edges can abut each other.

[0042] With the design of the split cover plate unit 41, the single complex large cover plate installation task is divided into a plurality of simple small cover plate unit 41 installation tasks. This reduces the requirements for operation space and one-time operation precision, and when facing a scenario with a large number of capacitor cores 3 and a large number of lead-out terminals 31, it can be operated in zones, greatly reducing the difficulty of installing the positioning cover plate 4 and improving the installation efficiency.

[0043] In some embodiments, the installation height of the positioning cover plate 4 is lower than the wall height of the shell 1, i.e. there is a vertical gap or height difference between the top surface of the positioning cover plate 4 and the top surface of the shell 1 after the positioning cover plate 4 is installed. The height difference makes the top surface of the positioning cover plate 4 sink or recess relative to the top surface of the shell 1. Generally, the height difference is designed to be 2-4 mm.

[0044] During the potting process, when the potting glue 2 (e.g. epoxy resin) is injected from a potting opening, the glue first fills all the space below the positioning cover plate 4, covering the lower part of the capacitor core 3 and the lead terminal 31. As the amount of glue increases, the liquid level rises to the top surface of the positioning cover plate 4. Since the top surface of the cover plate is lower than the top surface of the shell 1, the glue will overflow from the top surface of the cover plate, but not directly reach the top of the shell 1, but first flow into the annular or regional gap space formed by the vertical gap between the top surface of the cover plate and the top surface of the shell 1. This gap space acts as a "buffer zone" or "transfer pool", allowing the glue to collect and level here, and continue to flow around and upwards at a relatively stable and controllable speed, until the entire inner cavity of the shell 1 is finally completely filled and reaches a level approximately flush with the top surface of the shell 1 or a preset potting liquid level. During this process, the part of the shell 1 wall above the height difference area actually acts as a cofferdam.

[0045] In the embodiments shown in FIGS. 11-13, the inner wall of the shell 1 is provided with a reinforcing rib 12 corresponding to the position of the opening slot 413, which can be clamped into the opening slot 413. Figure 9 and Figure 10 In the embodiments shown in FIGS. 11-13, the inner wall of the shell 1 is provided with a reinforcing rib 12 corresponding to the position of the opening slot 413, which can be clamped into the opening slot 413.

[0046] The reinforcing rib 12 and each opening slot 413 on the positioning cover plate 4 maintain a strict positional correspondence in the circumferential and axial directions. That is, when the positioning cover plate 4 is installed to its preset height, the top end or a specific part of each reinforcing rib 12 overlaps or aligns with a specific opening slot 413 area on the horizontal projection plane. The cross-sectional shape of the reinforcing rib 12 is designed to be complementary to and tightly fit the internal space shape of the opening slot 413. For example, when the opening slot 413 is C-shaped, the top end of the corresponding reinforcing rib 12 can be designed as a convex arc shape, a wedge shape or a columnar structure with a corresponding lateral guide surface, which is adapted to the inner arc surface of the C-shaped slot, so that during the installation of the positioning cover plate 4, the reinforcing rib 12 can be accurately inserted and abut against the arc-shaped back area of the C-shaped slot.

[0047] The reinforcing rib 12 not only increases the overall strength of the shell 1, but also can position the lead terminal 31 in cooperation with the opening slot 413 of the positioning cover plate 4.

[0048] In some embodiments, the height of the reinforcing ribs 12 is the same as the height of the positioning cover plate 4. With such a design, during the filling process of the potting glue 2, when the glue liquid rises and attempts to pass over the top surface of the positioning cover plate 4, it will simultaneously encounter a large-area and continuous blocking plane formed by the top surface of the cover plate and the top surfaces of the reinforcing ribs 12. This plane greatly increases the resistance of the glue liquid to quickly rise upward along any single path (especially close to the surface of the lead-out terminal 31). The glue liquid must pass over this wide threshold in its entirety and relatively slowly to enter the upper cavity. This fundamentally suppresses the risk of the glue liquid preferentially climbing the dense pins due to capillary phenomenon, ensuring the cleanliness of all lead-out terminals 31 in the soldering section.

[0049] In Figure 6 In the illustrated embodiment, at least one partition plate 11 is provided in the shell 1, which divides the shell 1 into multiple chambers 13, each chamber 13 containing at least one capacitor core 3, and the positioning cover plate 4 is connected with the partition plate 11.

[0050] Specifically, the partition plate 11 is an important component of the internal structure of the shell 1, and is integrally injection molded with the main body of the shell 1, extending inward from the bottom surface or side wall of the shell 1 as a plate-shaped or wall-shaped structure. The at least one partition plate 11 divides an originally continuous large space into two or more spatially substantially isolated independent chambers 13 in the internal main accommodation space of the shell 1. These chambers 13 can have the same or different volumes and shapes, for example, two chambers 13 are formed by a longitudinal partition plate 11, four quadrant chambers 13 are formed by cross-shaped partition plates 11, or a series of parallel strip-shaped chambers 13 are formed by multiple parallel partition plates 11. Each independent chamber 13 constitutes a sub-encapsulation unit for accommodating a single capacitor core 3 or a group of capacitor cores 3 connected in a specific manner (such as in parallel). This design enables a single capacitor shell 1 to integrate multiple capacitor units, which is a key structural basis for achieving high volume power density and reducing the number of external parallel connections.

[0051] In Figure 7 And Figure 8 In the illustrated embodiment, the positioning cover plate 4 is connected with the partition plate 11 through the provided snap structure, which includes a convex rib 111 provided on the partition plate 11 and a clamping groove 414 provided on the positioning cover plate 4, and the clamping groove 414 is connected with the convex rib 111 through clamping.

[0052] The convex rib 111 is arranged on the partition plate 11 near the top edge of the partition plate 11, and is a continuous long strip-shaped convex in the length direction of the partition plate 11, or a plurality of independent convex sequences arranged at intervals. The cross-sectional shape of the convex rib 111 can be trapezoidal, semicircular, rectangular or special-shaped with a barb, and the convex rib 111 has one or more guide slopes and a locking surface. The guide slope facilitates the sliding of the matching part, and the locking surface is used to prevent reverse disengagement after engagement. The clamping groove 414 is correspondingly arranged on the positioning cover plate 4, and the position corresponds to the convex rib 111 on the top of the partition plate 11. The clamping groove 414 is a recessed structure formed on the positioning cover plate 4, and is usually located on the bottom surface of the positioning cover plate 4 and opens downward. The clamping groove 414 is designed in a shape complementary to the cross-sectional shape of the convex rib 111 to ensure that the two can be closely fitted. The entrance of the clamping groove 414 is usually also designed with a guide flared or slope to facilitate the introduction of the convex rib 111.

[0053] In the assembly operation, when the positioning cover plate 4 is placed in the mounting position and pressure is applied downward, the convex rib 111 on the top of the partition plate 11 starts to enter the entrance of the clamping groove 414 on the bottom surface of the positioning cover plate 4 under the action of the guide slope. As the pressure continues, when the convex rib 111 completely slides into the clamping groove 414 and reaches the predetermined position, the locking surface of the convex rib 111 abuts against the locking step in the clamping groove 414, and at the same time, the material of the positioning cover plate 4 rebounds to restore the clamping groove 414 to its original state or tightly hold the convex rib 111. At this time, an interference fit or shape interlocking is formed between the convex rib 111 and the clamping groove 414.

[0054] In Figure 3 In the embodiment shown, a gap is formed between the positioning cover plate 4 and the inner wall of the shell 1, and the gap constitutes a first pouring port 411 for pouring the potting glue 2. The positioning cover plate 4 is also provided with a second pouring port 412 arranged near the position of the clamping groove 414. By using the first pouring port 411 and the second pouring port 412, multi-channel pouring is achieved, which is beneficial to the uniformity of pouring.

[0055] The embodiment of the present application also provides an electronic device comprising the multi-pin film capacitor structure described above. In addition to the multi-pin film capacitor structure described above, the remaining structure of the electronic device can be the same as that in the prior art, and the remaining structure will not be described here.

[0056] It should be noted that the electronic device provided by the embodiment of the present application comprises the multi-pin film capacitor structure described above, and therefore has all the beneficial effects of the multi-pin film capacitor structure described above, which will not be described here.

[0057] The above merely illustrates the specific embodiments of the present application, but the protection scope of the present application is not limited thereto, and any skilled person in the art can easily think of various equivalent modifications or replacements within the technical range disclosed by the present application, and these modifications or replacements shall be covered within the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A multi-pin thin-film capacitor structure, comprising a housing, a potting compound, and at least one capacitor core, wherein the capacitor core is mounted within the housing, the potting compound fills the space between the capacitor core and the housing, and the capacitor core has a plurality of lead-out terminals; characterized in that, It also includes a positioning cover plate, which is provided with a plurality of opening slots for accommodating and positioning the lead-out terminals. The positioning cover plate is installed inside the housing and is used to fix the position of the lead-out terminals relative to the housing.

2. The multi-pin thin-film capacitor structure according to claim 1, characterized in that, The opening slot is located on the side edge of the positioning cover plate.

3. The multi-pin thin-film capacitor structure according to claim 1, characterized in that, The opening groove is C-shaped.

4. The multi-pin thin-film capacitor structure according to claim 1, characterized in that, The positioning cover plate includes multiple split cover plate units, and the opening slots are distributed on the cover plate units.

5. The multi-pin thin-film capacitor structure according to claim 1, characterized in that, The installation height of the positioning cover is lower than the wall height of the outer casing.

6. The multi-pin thin-film capacitor structure according to claim 1, characterized in that, The inner wall of the outer shell is provided with reinforcing ribs corresponding to the position of the opening slot, and the reinforcing ribs can be inserted into the opening slot.

7. A multi-pin thin-film capacitor structure according to claim 6, characterized in that, The height of the reinforcing rib is the same as the height of the positioning cover plate.

8. The multi-pin thin-film capacitor structure according to claim 1, characterized in that, The housing is provided with at least one partition, which divides the interior of the housing into multiple chambers, each of which accommodates at least one capacitor core, and the positioning cover is connected to the partition.

9. A multi-pin thin-film capacitor structure according to claim 8, characterized in that, The positioning cover plate and the partition plate are connected by a snap-fit ​​structure, which includes a protruding ridge on the partition plate and a snap-fit ​​groove on the positioning cover plate, and the snap-fit ​​groove is snapped into the protruding ridge.

10. A multi-pin thin-film capacitor structure according to claim 1, characterized in that, A gap is formed between the positioning cover plate and the inner wall of the outer shell, and the gap constitutes a first potting port for injecting the potting compound.

11. A multi-pin thin-film capacitor structure according to claim 9, characterized in that, The positioning cover plate is also provided with a second filling port, which is arranged close to the location of the card slot.

12. An electronic device, characterized in that, Includes the multi-pin thin-film capacitor structure according to any one of claims 1-11.

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