PCB drilling processing optimization method and device, terminal and storage medium

Abstract

The invention discloses a PCB (Printed Circuit Board) drilling processing optimization method and device, a terminal and a storage medium in the technical field of PCB processing, and aims to solve the problem that the actual drilling effect is influenced due to the lack of optimization compensation for each layer of drilling position of a PCB in the prior art. And meanwhile, as the copper layer number or the copper thickness of each drilled hole cannot be obtained, unified machining can only be carried out in a mode of passing through the most layers. The method comprises the steps of drilling optimization and drilling parameter optimization, wherein the drilling optimization comprises the steps of obtaining a laminated structure of the PCB, and determining passing layers according to the laminated structure of the PCB; obtaining position coordinates of a drill hole, and forming a first copper area calculation circle according to the position coordinates of the drill hole; according to the method, optimization compensation is carried out on each passing layer, so that drilling optimization is realized, and the drilling effect is ensured; meanwhile, different drilling parameters are customized by calculating the theoretical copper thickness needing to be processed by the blade length of the drill point and combining the type of the blade length of the drill point, and the method is suitable for actual working requirements.

Description

Technical Field

[0001] This invention relates to a method, apparatus, terminal, and storage medium for optimizing PCB drilling, belonging to the field of PCB processing technology. Background Technology

[0002] With the upgrade of data communication products, such as routers and switches, from 51.2T (112Gbps) to 102.4T (224Gbps), the board thickness has increased from 5.0mm to about 6.0~6.6mm, and the number of PCB layers has increased from an average of 32 layers to more than 40 layers. The inner layer copper has increased from 32OZ (the sum of copper layers) to more than 40OZ. This poses a huge challenge to the drilling process, which can easily lead to drill bit breakage and poor hole wall quality, resulting in scrap. Therefore, it is necessary to develop specialized tools to analyze the copper layers that each hole passes through during the drilling process, and to optimize the design and customize the processing parameters.

[0003] Currently, professional PCB design software abroad can perform this part of the analysis, but it uses the internal interconnection network logic of the PCB to analyze and generate results. When non-functional data is added after processing and design, the accuracy of the analysis will decrease, and the execution efficiency is poor and the secondary development cost is high.

[0004] Existing PCB drilling processes lack optimization compensation for drilling locations on each layer of the PCB board, affecting the actual drilling effect. At the same time, since it is impossible to obtain the number of copper layers or the copper thickness through each hole, the processing can only be uniformly processed based on the number of layers through, resulting in low production efficiency, high cost, and difficulty in controlling drilling parameters. Summary of the Invention

[0005] The purpose of this invention is to overcome the shortcomings of the prior art and provide a PCB drilling process optimization method, device, terminal and storage medium. By measuring the copper area of ​​the drilled hole corresponding to each layer, the invention determines whether the drilling is in a high-risk state and optimizes and compensates each layer based on the drilling mechanism, thereby achieving drilling optimization and ensuring drilling effect. At the same time, this invention calculates the theoretical copper thickness that needs to be processed by the drill bit length and customizes different drilling parameters according to the type of drill bit length, which is suitable for actual work needs and avoids phenomena such as PAD pulling, drilling deviation, and needle breakage.

[0006] To solve the above-mentioned technical problems, the present invention is implemented using the following technical solution:

[0007] In a first aspect, the present invention provides a PCB drilling process optimization method, including drilling optimization and drilling parameter optimization:

[0008] The drilling optimization includes:

[0009] Obtain the PCB board stack-up structure and determine the layers involved based on the PCB board stack-up structure;

[0010] Obtain the location coordinates of the drill hole, and form the first copper area calculation circle based on the location coordinates of the drill hole;

[0011] Based on the first copper area calculation circle and working data, obtain the copper area of ​​the corresponding drill hole for each layer;

[0012] The copper area of ​​the drilled hole corresponding to the layer is compared with a preset threshold, and the drilled hole is judged to be in a high-risk state based on the comparison result.

[0013] If the borehole is in a high-risk state, the multi-axis slicing method is used to analyze the borehole and obtain its structural state.

[0014] Based on the copper area of ​​the borehole corresponding to the layer and the structural state of the borehole, the borehole through the layer is optimized and compensated to achieve borehole optimization.

[0015] The drilling parameter optimization is based on the drilling optimization, which includes:

[0016] Obtain the PCB board thickness and material, and determine the type of drill bit length required for drilling based on the PCB board thickness and material;

[0017] Calculate the theoretical copper thickness required to process the drill bit length based on the PCB board's stack-up structure and the type of drill bit tip length.

[0018] Based on the type of drill bit length, the theoretical copper thickness to be processed by the drill bit length, the drilling hole, and the preset parameter table, the drilling parameters are determined to achieve drilling parameter optimization.

[0019] PCB drilling process optimization is achieved through drilling optimization and drilling parameter optimization.

[0020] Furthermore, the diameter of the first copper area calculation circle is the sum of the borehole diameter, the borehole ring width, and the compensation value, and the center of the first copper area calculation circle coincides with the center of the borehole.

[0021] The borehole diameter is obtained by the position coordinates of the borehole;

[0022] The hole ring width and the compensation value are obtained from the working data.

[0023] Furthermore, the step of comparing the copper area of ​​the drilled hole corresponding to the layer with a preset threshold, and determining whether the drilled hole is in a high-risk state based on the comparison result, includes:

[0024] If the copper area of ​​the corresponding drilled hole is through the layer Or the copper area corresponding to the drilled hole through the layer If the borehole is not in a high-risk state, then it is determined that the borehole is not in a high-risk state; where D is the borehole diameter, which is obtained through the location coordinates of the borehole.

[0025] Otherwise, the borehole is judged to be in a high-risk state.

[0026] Furthermore, if the borehole is not in a high-risk state, the borehole optimization ends.

[0027] Furthermore, the analysis of the borehole using a multi-axis slicing method to obtain the structural state of the borehole includes:

[0028] With the center of the borehole as the center, the compensation pattern is divided into two parts by multiple cutting axes passing through the center, and two cutting areas are obtained. Based on the two cutting areas, the area difference is calculated, thereby obtaining the area difference corresponding to each cutting axis.

[0029] The compensation diagram includes the borehole, the hole ring, and the compensation value.

[0030] The area difference corresponding to each dividing axis is compared with the preset value. If the area difference corresponding to each dividing axis is less than the preset value, the structure of the borehole is a symmetrical structure.

[0031] If there exists an area difference corresponding to a certain dividing axis that is not less than a preset value, then the structure of the borehole is an asymmetric structure.

[0032] Furthermore, the optimization compensation for the drilled holes through the layer, based on the copper area and structural state of the drilled holes, includes:

[0033] If the borehole structure is symmetrical, then determine whether the copper area of ​​the borehole corresponding to the layer is less than 1 / 3. ;

[0034] If the judgment result is negative, the drilling optimization ends.

[0035] If the judgment result is yes, then adjust the working data and re-acquire the copper area of ​​the corresponding drilled hole through the layer, so that the re-acquired copper area of ​​the corresponding drilled hole through the layer is not less than ;

[0036] If the structure of the borehole is asymmetrical, then obtain the minimum distance from the borehole to the edge of the compensation pattern, and determine whether the minimum distance from the borehole to the edge of the compensation pattern is less than the preset hole ring distance.

[0037] If the judgment result is negative, the drilling optimization ends.

[0038] If the judgment result is yes, then adjust the compensation value so that the minimum distance from the drill hole to the edge of the compensation pattern is not less than the preset hole ring distance.

[0039] Furthermore, the calculation of the theoretical copper thickness required to process the drill bit length based on the PCB board's stack-up structure and the type of drill bit tip length includes:

[0040] Based on the PCB board's layer stack-up structure and the type of drill bit length, the actual copper thickness to be processed by the required drill bit length is calculated. The specific expression is as follows:

[0041]

[0042] In the formula: The actual copper thickness required to process for the drill bit cutting length; This refers to the types of drill bit cutting lengths; i represents different drill bit cutting lengths. This refers to the number of layers on the PCB board. Indicates the first The thickness of the copper foil layer; K represents a coefficient; The actual copper thickness required to process for the drill bit cutting length of the previous type;

[0043] Specifically, a second copper area calculation circle is formed based on the location coordinates of the borehole. Based on the second copper area calculation circle and the working data, the copper ratio of the borehole corresponding to each layer is obtained. When the copper ratio = 100%, K is 1; when the copper ratio = 0%, K is 0; when 100% > copper ratio > 0%, K is a preset ratio value.

[0044] And for the calculated The theoretical copper thickness required to process the drill bit is obtained by using a round-robin method.

[0045] Secondly, the present invention provides a PCB drilling process optimization device, comprising:

[0046] Drilling optimization module: used to obtain the PCB board stack-up structure, determine the layers to be passed based on the PCB board stack-up structure; obtain the position coordinates of the drill holes, and form the first copper area calculation circle based on the position coordinates of the drill holes;

[0047] Based on the first copper area calculation circle and working data, obtain the copper area of ​​the corresponding drill hole for each layer; compare the copper area of ​​the corresponding drill hole for each layer with a preset threshold, and determine whether the drill hole is in a high-risk state based on the comparison result; if the drill hole is in a high-risk state, use multi-axis slicing method to analyze the drill hole and obtain the structural state of the drill hole; based on the copper area of ​​the corresponding drill hole for each layer and the structural state of the drill hole, optimize and compensate the drill hole for each layer to achieve drill hole optimization.

[0048] Drilling parameter optimization module: Used to obtain PCB board thickness and material, determine the type of drill bit length required for drilling based on the PCB board thickness and material; calculate the theoretical copper thickness to be processed by the drill bit length based on the PCB board stack-up structure and the type of drill bit length; determine drilling parameters based on the type of drill bit length, the theoretical copper thickness to be processed by the drill bit length, drilling, and preset parameter table, and realize drilling parameter optimization.

[0049] PCB Drilling Optimization Module: Optimizes PCB drilling processes based on drilling optimization and drilling parameter optimization.

[0050] Thirdly, the present invention provides a terminal, including a processor and a storage medium;

[0051] The storage medium is used to store instructions;

[0052] The processor is configured to operate according to the instructions to perform the steps of the method according to the first aspect.

[0053] Fourthly, a computer-readable storage medium having a computer program stored thereon that, when executed by a processor, implements the steps of the method described in the first aspect.

[0054] Compared with the prior art, the beneficial effects achieved by the present invention are as follows:

[0055] This PCB drilling optimization method determines whether the drilling is in a high-risk state by measuring the copper area of ​​the holes corresponding to each layer. It also optimizes and compensates for each layer based on the drilling mechanism, thereby optimizing the drilling and ensuring drilling results. At the same time, this invention calculates the theoretical copper thickness that needs to be processed by the drill bit length and customizes different drilling parameters according to the type of drill bit length, making it suitable for actual work needs and avoiding phenomena such as pad pulling, drilling deviation, and needle breakage. Attached Figure Description

[0056] Figure 1 This is a flowchart illustrating an optimized PCB drilling process according to an embodiment of the present invention.

[0057] Figure 2 This is a schematic diagram of the compensation between the line and the PAD according to an embodiment of the present invention;

[0058] Figure 3 This is a schematic diagram of compensation for Anti-PAD provided according to an embodiment of the present invention;

[0059] Figure 4 This is a schematic diagram of a symmetrical design provided according to an embodiment of the present invention;

[0060] Figure 5 This is a schematic diagram of an asymmetric design provided according to an embodiment of the present invention;

[0061] Figure 6 This is a schematic diagram of the padless design provided according to an embodiment of the present invention;

[0062] Figure 7 This is a schematic diagram of the structure of the cutting axis provided in an embodiment of the present invention;

[0063] Figure 8 This is a schematic diagram of optimized compensation for layered drilling in a symmetrical structure according to an embodiment of the present invention;

[0064] Figure 9 This is a schematic diagram of optimized compensation for layer drilling in an asymmetric structure according to an embodiment of the present invention. Detailed Implementation

[0065] The technical solution of the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the embodiments of the present invention and the specific features in the embodiments are detailed descriptions of the technical solution of the present invention, rather than limitations thereof. In the absence of conflict, the embodiments of the present invention and the technical features in the embodiments can be combined with each other.

[0066] The term "and / or" simply describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone. Additionally, the character " / " generally indicates that the preceding and following related objects have an "or" relationship.

[0067] Example 1:

[0068] like Figure 1 As shown, this invention provides a PCB drilling process optimization method, including drilling optimization and drilling parameter optimization:

[0069] The drilling optimization includes:

[0070] Obtain the PCB board stack-up structure and determine the layers involved based on the PCB board stack-up structure;

[0071] Obtain the location coordinates of the drill hole, and form the first copper area calculation circle based on the location coordinates of the drill hole;

[0072] Based on the first copper area calculation circle and working data, obtain the copper area of ​​the corresponding drill hole for each layer;

[0073] The copper area of ​​the drilled hole corresponding to the layer is compared with a preset threshold, and the drilled hole is judged to be in a high-risk state based on the comparison result.

[0074] If the borehole is in a high-risk state, the multi-axis slicing method is used to analyze the borehole and obtain its structural state.

[0075] Based on the copper area of ​​the borehole corresponding to the layer and the structural state of the borehole, the borehole through the layer is optimized and compensated to achieve borehole optimization.

[0076] Specifically, the original PCB inner layer graphic data is processed according to the factory's PCB processing capabilities, including circuit and graphic compensation and the addition of non-functional graphics to form production work data. This is done to meet the requirements for circuit accuracy, lamination and filling, and PCB surface flatness after processing. This includes various compensation methods, such as... Figure 2 As shown, the size of the line after compensation with the PAD (original graphic) = PAD + compensation value; for example... Figure 3 As shown, for the Anti-PAD (isolation pad) of the power and ground layers, the compensated Anti-PAD = original pattern - compensation value; the size of non-functional patterns needs to be greater than the PAD + pattern compensation value; among them, the hole ring of the drilled hole includes a symmetrical design (such as...). Figure 4 As shown), asymmetric design (such as) Figure 5 (as shown) and padless design (such as) Figure 6 As shown in the figure, the center of the hole ring is usually in the same position as the center of the drill hole, i.e., a symmetrical design.

[0077] In one embodiment, the diameter of the first copper area calculation circle is the sum of the borehole diameter, the borehole ring width, and the compensation value, and the center of the first copper area calculation circle coincides with the center of the borehole.

[0078] The borehole diameter is obtained by the position coordinates of the borehole;

[0079] The hole ring width and the compensation value are obtained from the working data.

[0080] Specifically, the position coordinates H(D, X, Y) of the borehole are defined according to the working data, where H represents the borehole, D represents the diameter of the borehole, X represents the horizontal coordinate of the borehole center, and Y represents the vertical coordinate of the borehole center. Based on the first copper area calculation circle and the working data, the copper area of ​​the corresponding borehole for each layer is obtained. Based on the working data, the copper area of ​​each layer within the first copper area calculation circle is obtained.

[0081] In one embodiment, comparing the copper area of ​​the drilled hole corresponding to the layer with a preset threshold, and determining whether the drilled hole is in a high-risk state based on the comparison result, includes:

[0082] If the copper area of ​​the corresponding drilled hole is through the layer Or the copper area corresponding to the drilled hole through the layer If the borehole is not in a high-risk state, then it is determined that the borehole is not in a high-risk state; where D is the borehole diameter, which is obtained through the location coordinates of the borehole.

[0083] Otherwise, the borehole is judged to be in a high-risk state.

[0084] Specifically, the judgment is as follows:

[0085] ;

[0086] Where S is the copper area of ​​the hole corresponding to the layer;

[0087] If any one of the above conditions is met, the borehole is determined not to be in a high-risk state; otherwise, the borehole is determined to be in a high-risk state.

[0088] In one embodiment, the method of analyzing the borehole using a multi-axis slicing method to obtain the structural state of the borehole includes:

[0089] With the center of the borehole as the center, the compensation pattern is divided into two parts by multiple cutting axes passing through the center, and two cutting areas are obtained. Based on the two cutting areas, the area difference is calculated, thereby obtaining the area difference corresponding to each cutting axis.

[0090] The compensation diagram includes the borehole, the hole ring, and the compensation value.

[0091] The area difference corresponding to each dividing axis is compared with the preset value. If the area difference corresponding to each dividing axis is less than the preset value, the structure of the borehole is a symmetrical structure.

[0092] If there exists an area difference corresponding to a certain dividing axis that is not less than a preset value, then the structure of the borehole is an asymmetric structure.

[0093] Specifically, the borehole is analyzed using a multi-axis slicing method to calculate the area of ​​the corresponding compensation graphic that is divided into two parts. and ;

[0094] Where l is the dividing axis, centered on the borehole center, the compensation graphic is divided; due to the existence of an axisymmetric structure, the axis division calculation is required to be performed at least twice to avoid misjudgment caused by the axisymmetric structure. Therefore, l is an integer greater than 1, meaning that the division work is performed through multiple different dividing axes. Due to computational efficiency reasons, l is less than or equal to 5; Figure 7 As shown, the cutting axis may include cutting axis 1 and cutting axis 2;

[0095] Compare the area difference with a preset value, including:

[0096] ;

[0097] like The structure is symmetrical.

[0098] like The structure is asymmetric.

[0099] in, The difference in area is K, which is a preset value.

[0100] In this embodiment, the optimization and compensation of the drilled holes through the layer based on the copper area and structural state of the drilled holes includes:

[0101] like Figure 8 As shown, if the structure of the drilled hole is symmetrical, then it is determined whether the copper area of ​​the drilled hole corresponding to the layer is less than 1 / 3. ;

[0102] If the judgment result is negative, the drilling optimization ends.

[0103] If the judgment result is yes, then adjust the working data and re-obtain the copper area of ​​the corresponding drilled hole through the layer until the re-obtained copper area of ​​the corresponding drilled hole through the layer is not less than This satisfies the minimum requirements.

[0104] like Figure 9 As shown, if the borehole structure is asymmetrical, then the minimum distance from the borehole to the edge of the compensation pattern is obtained. And determine the minimum distance from the drill hole to the edge of the compensation pattern. Is it less than the preset hole ring distance? ;

[0105] If the judgment result is negative, the drilling optimization ends.

[0106] If the judgment result is yes, then adjust the compensation value until the minimum distance from the drill hole to the edge of the compensation pattern is not less than the preset hole ring distance, thereby meeting the minimum requirements.

[0107] In this embodiment, the drilling parameter optimization is based on the drilling optimization, which includes:

[0108] Obtain the PCB board thickness and material, and determine the type of drill bit length required for drilling based on the PCB board thickness and material;

[0109] Calculate the theoretical copper thickness required to process the drill bit length based on the PCB board's stack-up structure and the type of drill bit tip length.

[0110] Based on the type of drill bit length, the theoretical copper thickness to be processed by the drill bit length, the drilling hole, and the preset parameter table, the drilling parameters are determined to achieve drilling parameter optimization.

[0111] PCB drilling process optimization is achieved through drilling optimization and drilling parameter optimization.

[0112] Specifically, obtain the PCB board thickness and material, and determine the type of drill bit length required for drilling based on the PCB board thickness and material. A specific example is as follows:

[0113] Determine the required drill bit length and type based on the plate thickness and material. 'i' represents different drill bit lengths: For example, if the board thickness is 5.0mm and the hole diameter is 0.2mm, the required drill bit lengths are 1.0mm / 4.0mm / 5.5mm. When drilling, first use a drill bit with a 1.0mm length to drill a hole to a depth of about 1.0mm, then use a drill bit with a 4.0mm length to drill a hole to a depth of about 4.0mm, and finally use a drill bit with a 5.5mm length to drill through the PCB board. The copper thickness processed by drill bits with different lengths is different.

[0114] The calculation of the theoretical copper thickness required to process the drill bit length based on the PCB board's stack-up structure and the type of drill bit length includes:

[0115] Based on the PCB board's layer stack-up structure and the type of drill bit length, the actual copper thickness to be processed by the required drill bit length is calculated. The specific expression is as follows:

[0116]

[0117] In the formula: The actual copper thickness required to process for the drill bit cutting length; This refers to the types of drill bit cutting lengths; i represents different drill bit cutting lengths. This refers to the number of layers on the PCB board. Indicates the first The thickness of the copper foil layer; K represents a coefficient; The actual copper thickness required to process for the drill bit cutting length of the previous type;

[0118] The process involves forming a second copper area calculation circle based on the location coordinates of the drilled holes. Using this circle and the working data, the copper ratio of each drilled hole corresponding to each layer is obtained. When the copper ratio is 100%, K is 1; when the copper ratio is 0%, K is 0; and when 100% > copper ratio > 0%, K is a preset ratio value. Here, K is an empirical value from production and processing, and the specific ratio and corresponding value can be refined according to the actual processing conditions. Optionally, K is 0.5.

[0119] And for the calculated The theoretical copper thickness required to process the drill bit cutting edge is obtained by using a round-off method.

[0120] When i=1, it means that only one type of drill bit length is needed, and the formula can be simplified to:

[0121]

[0122] At the same time, for the calculated The process is performed using a rounding-with-carry method.

[0123] Based on the type of drill bit length, the theoretical copper thickness to be processed for that drill bit length, the drilling depth, and the preset parameter table, the drilling parameters are determined to optimize the drilling parameters. The preset parameter table is as follows:

[0124] Preset parameter table:

[0125]

[0126] In the table: Program(D, i, n) represents the preset drilling operation parameters, including drilling diameter D, drilling coordinates, feed and retraction speeds, depth, number of holes, etc.; n represents the theoretical copper thickness that the drill bit needs to process. Thus, different drilling parameters can be determined according to the type of drill bit length, the theoretical copper thickness that the drill bit needs to process, and the number of holes to achieve drilling optimization. Drilling programs are generated by classifying the holes according to the hole diameter and drilling parameters and using CNC software.

[0127] This invention determines whether a drilling operation is in a high-risk state by measuring the copper area of ​​the corresponding drilled holes at each layer, and optimizes and compensates for each layer based on the drilling mechanism, thereby achieving drilling optimization and ensuring drilling results. At the same time, this invention calculates the theoretical copper thickness that needs to be processed by the drill bit length and customizes different drilling parameters according to the type of drill bit length, which is suitable for actual working needs and avoids phenomena such as PAD pulling, drilling deviation, and drill bit breakage.

[0128] Example 2:

[0129] This invention provides a PCB drilling optimization device, comprising:

[0130] Drilling optimization module: used to obtain the PCB board stack-up structure, determine the layers to be passed based on the PCB board stack-up structure; obtain the position coordinates of the drill holes, and form the first copper area calculation circle based on the position coordinates of the drill holes;

[0131] Based on the first copper area calculation circle and working data, obtain the copper area of ​​the corresponding drill hole for each layer; compare the copper area of ​​the corresponding drill hole for each layer with a preset threshold, and determine whether the drill hole is in a high-risk state based on the comparison result; if the drill hole is in a high-risk state, use multi-axis slicing method to analyze the drill hole and obtain the structural state of the drill hole; based on the copper area of ​​the corresponding drill hole for each layer and the structural state of the drill hole, optimize and compensate the drill hole for each layer to achieve drill hole optimization.

[0132] Drilling parameter optimization module: Used to obtain PCB board thickness and material, determine the type of drill bit length required for drilling based on the PCB board thickness and material; calculate the theoretical copper thickness to be processed by the drill bit length based on the PCB board stack-up structure and the type of drill bit length; determine drilling parameters based on the type of drill bit length, the theoretical copper thickness to be processed by the drill bit length, drilling, and preset parameter table, and realize drilling parameter optimization.

[0133] PCB Drilling Optimization Module: Optimizes PCB drilling processes based on drilling optimization and drilling parameter optimization.

[0134] Example 3:

[0135] This invention also provides a terminal, including a processor and a storage medium;

[0136] The storage medium is used to store instructions;

[0137] The processor is configured to operate according to the instructions to execute the steps of the method described in Embodiment 1.

[0138] Example 4:

[0139] This invention also provides a computer-readable storage medium storing a computer program thereon, which, when executed by a processor, implements the steps of the method described in Embodiment 1.

[0140] Since the storage medium provided in this embodiment of the invention can execute the method provided in Embodiment 1 of the invention, it has the corresponding functional modules and beneficial effects for executing the method.

[0141] Those skilled in the art will understand that embodiments of this application can be provided as methods, systems, or computer program products. Therefore, this application can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, this application can take the form of a computer program product embodied on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0142] This application is described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of this application. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, generate instructions for implementing the flowchart... Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0143] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0144] These computer program instructions may also be loaded onto a computer or other programmable data processing equipment to cause a series of operational steps to be performed on the computer or other programmable equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0145] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. An optimized method for PCB drilling, characterized in that, This includes borehole optimization and borehole parameter optimization: The drilling optimization includes: Obtain the PCB board stack-up structure and determine the layers involved based on the PCB board stack-up structure; Obtain the location coordinates of the drill hole, and form the first copper area calculation circle based on the location coordinates of the drill hole; Based on the first copper area calculation circle and working data, obtain the copper area of ​​the corresponding drill hole for each layer; The copper area of ​​the drilled hole corresponding to the layer is compared with a preset threshold, and the drilled hole is judged to be in a high-risk state based on the comparison result. If the borehole is in a high-risk state, the multi-axis slicing method is used to analyze the borehole and obtain its structural state. Based on the copper area of ​​the borehole corresponding to the layer and the structural state of the borehole, the borehole through the layer is optimized and compensated to achieve borehole optimization; The drilling parameter optimization is based on the drilling optimization, which includes: Obtain the PCB board thickness and material, and determine the type of drill bit length required for drilling based on the PCB board thickness and material; Calculate the theoretical copper thickness required to process the drill bit based on the PCB board's stack-up structure and the type of drill bit tip length. Based on the type of drill bit length, the theoretical copper thickness to be processed by the drill bit length, the drilling hole, and the preset parameter table, the drilling parameters are determined to achieve drilling parameter optimization. PCB drilling process optimization is achieved through drilling optimization and drilling parameter optimization.

2. The PCB drilling optimization method according to claim 1, characterized in that, The diameter of the first copper area calculation circle is the sum of the borehole diameter, the borehole ring width, and the compensation value, and the center of the first copper area calculation circle coincides with the center of the borehole. The borehole diameter is obtained by the position coordinates of the borehole; The hole ring width and the compensation value are obtained from the working data.

3. The PCB drilling optimization method according to claim 1, characterized in that, The step of comparing the copper area of ​​the drilled hole corresponding to the layer with a preset threshold and determining whether the drilled hole is in a high-risk state based on the comparison result includes: If the copper area of ​​the corresponding drilled hole is through the layer Or the copper area corresponding to the drilled hole through the layer If the borehole is not in a high-risk state, then it is determined that the borehole is not in a high-risk state; where D is the borehole diameter, which is obtained through the location coordinates of the borehole. Otherwise, the borehole is judged to be in a high-risk state.

4. The PCB drilling optimization method according to claim 1, characterized in that, If the borehole is not in a high-risk state, the borehole optimization ends.

5. The PCB drilling optimization method according to claim 2, characterized in that, The method of analyzing boreholes using multi-axis slicing to obtain the structural state of the boreholes includes: With the center of the borehole as the center, the compensation pattern is divided into two parts by multiple cutting axes passing through the center, and two cutting areas are obtained. Based on the two cutting areas, the area difference is calculated, thereby obtaining the area difference corresponding to each cutting axis. The compensation diagram includes the borehole, the hole ring, and the compensation value. The area difference corresponding to each dividing axis is compared with the preset value. If the area difference corresponding to each dividing axis is less than the preset value, the structure of the borehole is a symmetrical structure. If there exists an area difference corresponding to a certain dividing axis that is not less than a preset value, then the structure of the borehole is an asymmetric structure.

6. The PCB drilling optimization method according to claim 5, characterized in that, The optimization and compensation of the drilled holes through the layer, based on the copper area and structural state of the drilled holes, includes: If the borehole structure is symmetrical, then determine whether the copper area of ​​the borehole corresponding to the layer is less than 1 / 3. Where D is the borehole diameter; If the judgment result is negative, the drilling optimization ends. If the judgment result is yes, then adjust the working data and re-acquire the copper area of ​​the corresponding drilled hole through the layer, so that the re-acquired copper area of ​​the corresponding drilled hole through the layer is not less than ; If the structure of the borehole is asymmetrical, then obtain the minimum distance from the borehole to the edge of the compensation pattern, and determine whether the minimum distance from the borehole to the edge of the compensation pattern is less than the preset hole ring distance. If the judgment result is negative, the drilling optimization ends. If the judgment result is yes, then adjust the compensation value so that the minimum distance from the drill hole to the edge of the compensation pattern is not less than the preset hole ring distance.

7. The PCB drilling optimization method according to claim 1, characterized in that, The calculation of the theoretical copper thickness required to process the drill bit length based on the PCB board's stack-up structure and the type of drill bit length includes: Based on the PCB board's layer stack-up structure and the type of drill bit length, the actual copper thickness to be processed by the required drill bit length is calculated. The specific expression is as follows: In the formula: The actual copper thickness required to process for the drill bit cutting length; This refers to the types of drill bit cutting lengths; i represents different drill bit cutting lengths. This refers to the number of layers on the PCB board. Indicates the first The thickness of the copper foil layer; K represents a coefficient; The actual copper thickness required to process for the drill bit cutting length of the previous type; Specifically, a second copper area calculation circle is formed based on the location coordinates of the borehole. Based on the second copper area calculation circle and the working data, the copper ratio of the borehole corresponding to each layer is obtained. When the copper ratio = 100%, K is 1; when the copper ratio = 0%, K is 0; when 100% > copper ratio > 0%, K is a preset ratio value. And for the calculated The theoretical copper thickness required to process the drill bit is obtained by using a round-robin method.

8. A PCB drilling optimization device, characterized in that, include: Drilling optimization module: used to obtain the PCB board stack-up structure and determine the layers to be drilled based on the PCB board stack-up structure; Obtain the location coordinates of the drill hole, and form the first copper area calculation circle based on the location coordinates of the drill hole; Based on the first copper area calculation circle and working data, obtain the copper area of ​​the corresponding drill hole for each layer; compare the copper area of ​​the corresponding drill hole for each layer with a preset threshold, and determine whether the drill hole is in a high-risk state based on the comparison result. If the borehole is in a high-risk state, the multi-axis slicing method is used to analyze the borehole and obtain its structural state. Based on the copper area of ​​the borehole corresponding to the layer and the structural state of the borehole, the borehole through the layer is optimized and compensated to achieve borehole optimization. Drilling parameter optimization module: used to obtain PCB board thickness and material, and determine the type of drill bit length required for drilling based on the PCB board thickness and material; Based on the PCB board's stack-up structure and the type of drill bit length, calculate the theoretical copper thickness that the drill bit length needs to process; based on the type of drill bit length, the theoretical copper thickness that the drill bit length needs to process, the drilling hole, and the preset parameter table, determine the drilling parameters and optimize the drilling parameters. PCB Drilling Optimization Module: Optimizes PCB drilling processes based on drilling optimization and drilling parameter optimization.

9. A terminal, characterized in that, Including processor and storage media; The storage medium is used to store instructions; The processor is configured to operate according to the instructions to perform the steps of the method according to any one of claims 1 to 7.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that, When executed by a processor, the program implements the steps of the method according to any one of claims 1 to 7.

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