Heat dissipation piece and electronic equipment

Abstract

The invention discloses a heat dissipation piece and electronic equipment, the heat dissipation piece comprises a shell, a capillary structure layer and at least one film, the shell is provided with a closed cavity, and the outer surface of the shell is provided with at least one heat absorption area used for being connected with a heating component. The capillary structure layer is arranged on the inner wall of the cavity and can guide the phase change working medium to flow from the condensation area to the evaporation area corresponding to the heat absorption area. The thin film is arranged on the side, away from the inner wall of the cavity, of the capillary structure layer in a stacked mode, a plurality of first micropores are formed in a first area, corresponding to the evaporation area, of the thin film, the thin film is provided with a second area adjacent to the first area, a plurality of second micropores are formed in the second area, and the distribution density of the second micropores is not larger than that of the first micropores.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and in particular to a heat sink and an electronic device. Background Technology

[0002] With the development of technology, the heat density of heat-generating components in electronic devices continues to rise, placing higher demands on heat dissipation. Summary of the Invention

[0003] This application provides the following technical solution:

[0004] A heat sink, comprising:

[0005] A housing having a closed cavity, the outer surface of the housing having at least one heat-absorbing area for connection with a heating element;

[0006] A capillary structure layer is disposed on the inner wall of the cavity, and the capillary structure layer can guide the phase change working fluid from the condensation zone to the evaporation zone corresponding to the heat absorption zone;

[0007] At least one thin film is stacked on the side of the capillary structure layer away from the inner wall. The thin film has a plurality of first micropores in a first region corresponding to the evaporation zone. The thin film has a second region adjacent to the first region. The second region has a plurality of second micropores. The distribution density of the second micropores is not greater than the distribution density of the first micropores.

[0008] Optionally, in the above heat sink, the second region has a first sub-region that is a first distance away from the first region and a second sub-region that is a second distance away from the first region, the second distance being greater than the first distance, and the distribution density of the second micropores in the second sub-region being less than the distribution density in the first sub-region.

[0009] Optionally, in the above-mentioned heat dissipation device, at least a portion of the condensation zone is covered by a third region of the thin film, the third region having a third micropore, the size of the third micropore being larger than the size of the first micropore.

[0010] Optionally, in the above-mentioned heat dissipation component, the capillary layer has a transport region located between the condensation region and the evaporation region, and the area of ​​the thin film corresponding to the transport region is set as a non-porous closed region, or the area of ​​the thin film corresponding to the transport region is provided with a fourth micropore, the size of the fourth micropore being smaller than the size of the first micropore.

[0011] Optionally, in the above-mentioned heat dissipation component, the distribution density of the third micropore is less than the distribution density of the first micropore, and the distribution density of the fourth micropore is less than the distribution density of the third micropore.

[0012] Optionally, in the above-mentioned heat sink, the first micropores are arranged in rows and columns, with the first micropores in two adjacent rows staggered along the length direction of the first micropores, and the first micropores in two adjacent columns staggered along the width direction of the first micropores; and / or,

[0013] The second micropores are arranged in rows and columns, with the second micropores in adjacent rows being staggered along the length direction of the second micropores, and the second micropores in adjacent columns being staggered along the width direction of the second micropores.

[0014] Optionally, in the above-mentioned heat dissipation device, the surface hydrophilicity of the side of the thin film facing the capillary layer satisfies the condition that the droplet contact angle is not greater than 5°.

[0015] Optionally, in the above-mentioned heat dissipation device, the thickness of the thin film is 10 μm to 15 μm, the first micropore is rectangular, and the width of the first micropore is 30 μm to 100 μm.

[0016] Optionally, in the above-mentioned heat dissipation component, the capillary structure layer is configured as a single-layer metal mesh woven from metal wires, wherein the diameter of the metal wires in the metal mesh is 40μm~50μm, and the aperture of the mesh openings is 25μm~100μm.

[0017] An electronic device includes at least one heat-generating component and a heat sink for dissipating heat from the heat-generating component, the heat sink comprising:

[0018] The housing has a closed cavity, and the outer surface of the housing has a heat-absorbing area for connection with the heating element;

[0019] A capillary structure layer is disposed on the inner wall of the cavity, and the capillary structure layer can guide the phase change working fluid from the condensation zone to the evaporation zone corresponding to the heat absorption zone;

[0020] At least one thin film is stacked on the side of the capillary structure layer away from the inner wall. The thin film has a plurality of first micropores in a first region corresponding to the evaporation zone. The thin film has a second region adjacent to the first region. The second region has a plurality of second micropores. The distribution density of the second micropores is not greater than the distribution density of the first micropores. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0022] Figure 1 This is a cross-sectional view of a heat sink according to an embodiment of this application;

[0023] Figure 2 yes Figure 1 Another cross-sectional view of the heat sink shown;

[0024] Figure 3 yes Figure 2 The bottom view of the heat sink shown;

[0025] Figure 4 yes Figure 2 Top view of the thin film in the structure shown;

[0026] Figure 5 This is a partial schematic diagram of the capillary structure layer under an electron microscope according to an embodiment of this application;

[0027] Figure 6 This is a schematic diagram of the capillary structure layer transporting the phase change working fluid without a thin film.

[0028] Figure 7 This is a schematic diagram of capillary structure layers transporting phase change working fluid when a thin film is provided;

[0029] Figure 8 This is a cross-sectional view of a heat sink according to another embodiment of this application;

[0030] Figure 9 yes Figure 8 Another cross-sectional view of the heat sink shown;

[0031] Figure 10 yes Figure 9 A schematic diagram of the thin film structure shown;

[0032] Figure 11 This is a schematic diagram of another structural form of the thin film according to an embodiment of this application;

[0033] Figure 12 This is an exploded view of a heat sink according to yet another embodiment of this application;

[0034] Figure 13 yes Figure 12 A schematic diagram of the thin film;

[0035] Figure 14 yes Figure 13 An enlarged view of the first region in the middle;

[0036] Figure 15 This is a partial schematic diagram of an electronic device according to an embodiment of this application.

[0037] The diagram is marked as follows:

[0038] 110. First plate; 120. Second plate; 121. Support column; 130. Cavity;

[0039] 200, capillary layer; 210, metal wire; 220, mesh;

[0040] 300. Film;

[0041] 310. First area; 320. Second area; 330. Third area; 340. Fourth area;

[0042] 311, First micropore; 321, Second micropore; 331, Third micropore; 341, Fourth micropore;

[0043] 400, Phase change working fluid; 500, Heating component; 600, Heat dissipation component; A, Condensation zone; B, Transport zone; C, Evaporation zone; D, Heat absorption zone; H, Shell thickness; K1, First direction; K2, Second direction. Detailed Implementation

[0044] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0045] In the description of this application, the references to terms such as "one embodiment," "some embodiments," "example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of those different embodiments or examples.

[0046] In the description of this specification, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0047] See Figures 1-14 This application provides a heat dissipation component, which may include a housing, a capillary layer 200, and at least one thin film 300. The housing may have a closed cavity 130, and its outer surface may have at least one heat-absorbing region D for connection with a heat-generating component. The capillary layer 200 may be disposed on the inner wall of the cavity 130. The capillary layer 200 guides the phase change working fluid 400 from the condensation region A to the evaporation region C corresponding to the heat-absorbing region D. That is, the capillary layer 200 may include a condensation region A and an evaporation region C, with the evaporation region C corresponding to the heat-absorbing region D of the housing. The phase change working fluid 400 refers to a working medium that transfers heat through liquid-vapor phase change and circulating flow, such as pure water or acetone. The phase change working fluid 400, located in evaporation zone C, evaporates and vaporizes under the heating effect of the heating element. The vaporized phase change working fluid 400 flows along the cavity 130 of the shell to condensation zone A, where it releases heat and reverts to a liquid state. The released heat is dissipated outwards through the shell. The liquid phase change working fluid 400, under the capillary force of the capillary structure layer 200, flows back from condensation zone A to evaporation zone C, forming a cycle that dissipates heat from the heating element. The heating element refers to a component that generates heat during operation, such as a central processing unit, power supply module, or memory module.

[0048] The thin film 300 can be stacked on the inner wall of the capillary structure layer 200 away from the cavity 130. The thin film 300 has multiple first micropores 311 in a first region 310 corresponding to the evaporation zone C. That is, the first region 310 of the thin film 300 corresponds to the evaporation zone C of the capillary structure layer 200, and the first region 310 has multiple first micropores 311 (multiple means two or more). The thin film 300 may have a second region 320 adjacent to the first region 310. The second region 320 has multiple second micropores 321, and the distribution density of the second micropores 321 is not greater than the distribution density of the first micropores 311. The second region 320 of the thin film 300 does not overlap with the first region 310, and the second region 320 covers all other locations of the capillary structure layer 200 except for the evaporation zone C. The distribution density reflects the density of the arrangement; a higher distribution density indicates a denser arrangement, and a lower distribution density indicates a sparser arrangement. The distribution density of the second micropore 321 is not greater than that of the first micropore 311. That is, the arrangement of micropores in the second region 320 of the thin film 300 is comparable to or even sparser than that in the first region 310.

[0049] It should be noted that the first micropores 311 in the first region 310 of the thin film 300 can be uniformly distributed or non-uniformly distributed. That is, the distribution density of the first micropores 311 in the first region 310 can be the same everywhere, or the distribution density of the first micropores 311 can be different at at least two locations. When the first micropores 311 are non-uniformly distributed, when comparing the distribution density of the second micropores 321 with the distribution density of the first micropores 311, the distribution density of the first micropores 311 refers to the minimum value of the distribution density of the first micropores 311 in the first region 310 of the thin film 300. The second micropores 321 in the second region 320 of the thin film 300 can also be uniformly distributed or non-uniformly distributed. That is, the distribution density of the second micropores 321 in the second region 320 can be the same everywhere, or the distribution density of the second micropores 321 can be different at at least two locations. When the second micropore 321 is non-uniformly distributed, comparing the distribution density of the second micropore 321 with that of the first micropore 311, the distribution density of the second micropore 321 refers to the maximum value of the distribution density of the second micropore 321 within the second region 320 of the thin film 300. For example, when both the first micropore 311 and the second micropore 321 are non-uniformly distributed, the distribution density of the second micropore 321 not being greater than the distribution density of the first micropore 311 means that the maximum value of the distribution density of the second micropore 321 within the second region 320 of the thin film 300 is not greater than the minimum value of the distribution density of the first micropore 311 within the first region 310 of the thin film 300.

[0050] The working principle of the heat sink component in this application to improve heat dissipation effect is described below. (See attached document.) Figure 6Without a thin film 300 on the surface of the capillary layer 200, as the liquid phase change working medium 400 moves further away from the condensation zone A along the transport direction (i.e., from the condensation zone A to the evaporation zone C of the capillary layer 200), the liquid surface of the phase change working medium 400 degrades from being saturated in the condensation zone A to... Figure 6 The exhibited liquid surface defects are particularly severe in evaporation zone C, where the degradation of the liquid surface is even more pronounced. (See also...) Figure 7 This application provides a thin film 300 on the surface of the capillary layer 200. The thin film 300 has a first region 310 corresponding to the evaporation zone C and a second region 320 adjacent to the first region 310. The first region 310 has multiple first micropores 311. In this way, during the operation of the heat sink, the thin film 300 and the capillary layer 200 can generate a biomimetic evaporation effect, continuously transporting the liquid phase change working medium 400 at a full liquid surface. Moreover, under the biomimetic evaporation effect, the flow rate of the phase change working medium 400 is faster. In other words, by setting the thin film 300, not only is the reflux rate of the phase change working medium 400 improved, but the phase change working medium 400 is also kept at a full liquid surface from the condensation zone A to the evaporation zone C, resulting in higher heat dissipation efficiency compared with traditional heat sinks.

[0051] See Figure 1 In some embodiments, the thin film 300 may not cover the condensation zone A of the capillary structure layer 200. The distance W between the edge of the thin film 300 and the edge of the condensation zone A can be set as needed. It should be noted that the distance W should be less than the transport distance at which the liquid surface of the phase change working fluid 400 degrades. That is, without the thin film 300, the phase change working fluid 400 will only experience liquid surface degradation after flowing from the condensation zone A along the transport direction for a distance greater than W under the capillary force of the capillary structure layer 200. In other words, the thin film 300 extends from the evaporation zone C to the position before the liquid surface of the phase change working fluid 400 degrades.

[0052] See Figures 8-10In some embodiments, at least a portion of the condensation region A of the capillary layer 200 is covered by a third region 330 of the film 300. The third region 330 may have a third micropore 331, the size of which may be larger than the size of the first micropore 311. The third region 330 of the film 300 can be understood as a part of the second region 320, that is, the third region 330 is the portion of the second region 320 corresponding to the location of the condensation region A of the capillary layer 200, and the third micropore 331 can be understood as the second micropore 321 located in the third region 330. The third region 330 can cover part or all of the condensation zone A of the capillary structure layer 200. The size of the third micropore 331 being larger than the size of the first micropore 311 means that the nominal size of the third micropore 331 is larger than the nominal size of the first micropore 311. It should be noted that the "nominal size" mentioned in this text refers to the size that has a major impact on liquid permeability. Taking a rectangular micropore as an example, liquid permeability is mainly affected by the width of the micropore; therefore, the nominal size of a rectangular micropore is its width. Because the third region 330 of the thin film 300 has the third micropore 331, the portion of the thin film 300 covering the condensation zone A will not significantly affect the return of the phase change working fluid 400, which has become liquid, from the cavity 130 to the capillary structure layer 200.

[0053] The capillary layer 200 may have a transport region B located between the condensation region A and the evaporation region C. When the thin film 300 has a third region 330, the portion of the thin film 300 located between the first region 310 and the third region 330 corresponds to the transport region B of the capillary layer 200. In some embodiments, this portion of the thin film 300 may be configured as a non-porous, closed region; that is, the region of the thin film 300 corresponding to the transport region B may be without openings. Figure 10 As shown. Of course, this area of ​​the thin film 300 can also have openings, see [reference]. Figure 11 The thin film 300 may include a fourth region 340 corresponding to the transport region B. The fourth region 340 may have a fourth micropore 341, the size of which may be smaller than the size of the first micropore 311. The fourth region 340 of the thin film 300 can be understood as a part of the second region 320, that is, the fourth region 340 is the portion of the second region 320 corresponding to the transport region B of the capillary structure layer 200. The fourth micropore 341 can be understood as a second micropore 321 located in the fourth region 340. The fact that the size of the fourth micropore 341 is smaller than the size of the first micropore 311 means that the nominal size of the fourth micropore 341 is smaller than the nominal size of the first micropore 311.

[0054] See Figure 11In some embodiments, the distribution density of the third micropore 331 can be less than that of the first micropore 311, and the distribution density of the fourth micropore 341 can be less than that of the third micropore 331. That is, when the thin film 300 includes the first micropore 311, the third micropore 331, and the fourth micropore 341, the fourth micropore 341 can be set to have the sparsest arrangement. This is beneficial for most of the transport region B of the capillary structure layer 200 to be covered by the thin film 300, so that the transport region B has a strong transport capacity.

[0055] It should be noted that the third micropore 331 in the third region 330 of the thin film 300 can be uniformly distributed or non-uniformly distributed. That is, the distribution density of the third micropore 331 can be the same everywhere in the third region 330, or the distribution density of the third micropore 331 can be different at at least two locations. When the third micropore 331 is non-uniformly distributed, when comparing the distribution density of the fourth micropore 341 with the distribution density of the third micropore 331, the distribution density of the third micropore 331 refers to the minimum value of the distribution density of the third micropore 331 within the third region 330 of the thin film 300. The fourth micropore 341 in the fourth region 340 of the thin film 300 can also be uniformly distributed or non-uniformly distributed. That is, the distribution density of the fourth micropore 341 in the fourth region 340 can be the same everywhere, or the distribution density of the fourth micropore 341 can be different at at least two locations. When the fourth micropore 341 is non-uniformly distributed, comparing the distribution density of the fourth micropore 341 with that of the third micropore 331, the distribution density of the fourth micropore 341 refers to the maximum value of the distribution density of the fourth micropore 341 within the fourth region 340 of the film 300. For example, when both the third micropore 331 and the fourth micropore 341 are non-uniformly distributed, the distribution density of the fourth micropore 341 being less than that of the third micropore 331 means that the maximum value of the distribution density of the fourth micropore 341 within the fourth region 340 of the film 300 is less than the minimum value of the distribution density of the third micropore 331 within the third region 330 of the film 300.

[0056] In some embodiments, the first micropores 311 can be arranged in a grid pattern. For example, the first micropores 311 can be elongated and arranged in a direction that satisfies the parallel condition with the transport direction, that is, the first micropores 311 can be arranged such that their width direction is parallel to the direction from the condensation zone A to the evaporation zone C. Of course, the arrangement direction of the first micropores 311 can also be inclined or perpendicular to the transport direction. For example, the first micropores 311 can be arranged such that their arrangement direction (i.e., the width direction of the first micropores 311) is at 45° to the direction from the condensation zone A to the evaporation zone C.

[0057] Similar to the first micro-orifice 311, the third micro-orifice 331 can be arranged in a grid pattern. For example, the third micro-orifice 331 can be elongated and arranged along a direction that satisfies the condition of parallelism with the transport direction. Of course, the arrangement direction of the third micro-orifice 331 can also be inclined or perpendicular to the transport direction.

[0058] Considering that the fourth region 340 of the thin film 300 corresponds to the transport region B of the capillary structure layer 200, the fourth micropores 341 are arranged as parallel as possible to the transport direction. For example, if the fourth micropores 341 are elongated, they can be arranged along their width, and the angle between the arrangement direction and the transport direction (i.e., from the condensation region A to the evaporation region C) should not exceed 5°. This arrangement avoids long open sections along the transport direction in the transport region B of the capillary structure layer 200, which is beneficial for better biomimetic transpiration and allows the transport region B to achieve better transport capacity.

[0059] In some embodiments, the micropores formed on the thin film 300 can be configured in other shapes. For example, the first micropore 311 can be configured in other shapes such as circles or triangles, as long as the combination of the thin film 300 and the capillary layer 200 can produce a biomimetic evaporation effect. To enable the phase change working fluid 400 to flow back to the evaporation zone C at a faster rate, the surface of the thin film 300 can be treated to improve its hydrophilicity. For example, in some embodiments, the surface hydrophilicity of the side of the thin film 300 facing the capillary layer 200 can be set to satisfy the condition that the droplet contact angle is no greater than 5°. Of course, the surface hydrophilicity of the side of the thin film 300 facing the capillary layer 200 can also be set to satisfy the condition that the droplet contact angle is no greater than 5°. Depending on the material of the thin film 300, the surface of the thin film 300 can be treated to improve its hydrophilicity by methods such as plasma surface activation treatment or chemical oxidation.

[0060] The material of the thin film 300 can be selected from various options. In some embodiments, the thin film 300 can be a metal foil, such as copper foil, copper alloy foil, gold foil, etc. The thickness of the thin film 300 can be 10 μm to 15 μm, for example, 12 μm. When the first micropore 311 is rectangular, the width of the first micropore 311 can be 30 μm to 100 μm, for example, 50 μm, 60 μm, 80 μm, etc. When the first micropores 311 are arranged in a striped grid pattern, the spacing between the first micropores 311 can be 100 μm to 1000 μm, for example, 400 μm, 500 μm, 600 μm, 800 μm, etc. The microporous structures on the thin film 300 (e.g., the first micropore 311 and the second micropore 321) can be fabricated by methods such as laser cutting or die stamping. The thin film 300 is attached to the capillary structure layer 200 and can be fixed by welding or capillary adsorption of a small amount of phase change working fluid 400. See also Figure 2 In some embodiments, the inner wall of the cavity 130 of the housing may be provided with support pillars 121. That is, the housing may include a first plate 110 and a second plate 120 stacked together. The capillary layer 200 may be disposed in the groove of the first plate 110, and the support pillars 121 may be disposed in the groove of the second plate 120. After the first plate 110 and the second plate 120 are encapsulated, the support pillars 121 may abut against one side of the capillary layer 200 on the back of the film 300, so that the film 300 is stabilized in the cavity 130 of the housing. The support pillars 121 in the cavity 130 may be distributed in a lattice. The support pillars 121 can play the role of supporting the cavity 130 and prevent the thickness of the cavity 130 from being too small in some areas.

[0061] The capillary layer 200 can have various structural forms, such as etched trench structures or metal mesh. See also Figure 5 and Figure 7 In some embodiments, the capillary layer 200 can be configured as a single-layer metal mesh woven from metal wires 210, the diameter of which can be 40μm to 50μm, for example, 45μm. The mesh openings 220 of the metal mesh can have an aperture of 25μm to 100μm, for example, 40μm, 50μm, 60μm, 80μm, etc.

[0062] See Figure 1 Because the thin film 300 enhances the transport capacity of the capillary layer 200, the heat sink of this application can achieve good heat dissipation while maintaining a relatively small shell thickness H. In some embodiments, the shell thickness H can be set to no more than 0.5 mm, for example, 0.4 mm. The shape of the shell can be flexibly configured according to arrangement requirements; see [reference needed]. Figure 12 In some embodiments, the shapes of the first plate 110 and the second plate 120 constituting the housing can be irregular. Of course, the housing can also be configured as a regular shape, such as a rectangle or a circle. Figures 1-3 In the exemplary embodiment shown, the housing may be rectangular.

[0063] See Figure 4 , Figure 10 and Figure 11In some embodiments, the second region 320 may have a first sub-region that is a first distance away from the first region 310 and a second sub-region that is a second distance away from the first region 310. The second distance may be greater than the first distance, that is, the second sub-region is farther away from the first region 310 of the film 300 than the first sub-region. The second micropores 321 may be configured such that the distribution density of the second micropores 321 in the second sub-region is less than the distribution density in the first sub-region. In other words, the arrangement of the second micropores 321 in the second sub-region is sparser than the arrangement in the first sub-region. The positions of the first and second sub-regions on the thin film 300 can vary. For example, when the thin film 300 has a third region 330, the third region 330 can be a part of the second region 320, and the first and second sub-regions can be two parts of the third region 330. That is, when the third micropores 331 are non-uniformly distributed, the third micropores 331 can be configured such that their distribution density decreases as the distance between their position and the first region 310 increases (i.e., their arrangement becomes sparser). As another example, when the thin film 300 has a fourth region 340, the fourth region 340 can be a part of the second region 320, and the first and second sub-regions can be two parts of the fourth region 340. That is, when the fourth micropores 341 are non-uniformly distributed, the fourth micropores 341 can be configured such that their distribution density decreases as the distance between their position and the first region 310 increases (i.e., their arrangement becomes sparser).

[0064] To enhance the biomimetic transpiration effect, the arrangement structure of the first micropore 311 and the second micropore 321 can be designed. See [link / reference needed] Figure 12 and Figure 13 In some embodiments, the second micropores 321 can be arranged in rows and columns. Second micropores 321 in adjacent rows can be staggered along their length, and second micropores 321 in adjacent columns can be staggered along their width. For example, the second micropores 321 can be arranged in rows along a first direction K1 and in columns along a second direction K2. The length of the second micropores 321 is parallel to the first direction K1, and the width of the second micropores 321 is parallel to the second direction K2. Second micropores 321 in adjacent rows are alternately arranged along the first direction K1, thus creating a staggered arrangement in the first direction K1, and second micropores 321 in adjacent columns are alternately arranged along the second direction K2, thus creating a staggered arrangement in the second direction K2.

[0065] See Figure 12 and Figure 14In some embodiments, the first micropores 311 can be arranged in rows and columns. The first micropores 311 in two adjacent rows can be staggered along the length direction of the first micropores 311, and the first micropores 311 in two adjacent columns can be staggered along the width direction of the first micropores 311. For example, the first micropores 311 can be arranged in rows along the second direction K2 and in columns along the first direction K1. The length direction of the first micropores 311 is parallel to the second direction K2, and the width direction of the first micropores 311 is parallel to the first direction K1. The first micropores 311 in two adjacent rows are alternately arranged along the second direction K2, thereby forming a stagger in the second direction K2, and the first micropores 311 in two adjacent columns are alternately arranged along the first direction K1, thereby forming a stagger in the first direction K1.

[0066] See Figure 13 and Figure 14 In some embodiments, the first micropores 311 and the second micropores 321 can be arranged in rows and columns, and the length directions of the first micropores 311 and the second micropores 321 can be set to satisfy a perpendicular condition. For example, in the plane where the thin film 300 is located, the first direction K1 and the second direction K2 satisfy a perpendicular condition, the length direction of the first micropores 311 can be set along the second direction K2, and the length direction of the second micropores 321 can be set along the first direction K1. Of course, in other embodiments, the length directions of the first micropores 311 and the second micropores 321 can be set at an acute angle, for example, the angle between the length directions of the first micropores 311 and the second micropores 321 can be set to angle values ​​such as 60°, 45°, and 30°.

[0067] See Figures 1-15 This application provides an electronic device that may include at least one heat-generating component 500 and a heat sink 600 for dissipating heat from the heat-generating component 500. The heat sink 600 may include a housing, a capillary layer 200, and at least one thin film 300. The housing may have a closed cavity 130, and its outer surface has at least one heat-absorbing region D for connection with the heat-generating component 500, meaning the heat-generating component 500 is thermally connected to the heat-absorbing region D on the outer surface of the housing. The capillary layer 200 is disposed on the inner wall of the cavity 130 and can guide the phase change working fluid 400 from the condensation region A to the evaporation region C corresponding to the heat-absorbing region D. The thin film 300 is stacked on the side of the capillary structure layer 200 away from the inner wall of the cavity 130. The thin film 300 has a plurality of first micropores 311 in the first region 310 corresponding to the evaporation zone C. The thin film 300 has a second region 320 adjacent to the first region 310. The second region 320 has a plurality of second micropores 321. The distribution density of the second micropores 321 is not greater than the distribution density of the first micropores 311.

[0068] The structure and working principle of the heat sink 600 can be referred to the previous introduction of heat sinks, and will not be repeated here. Since the heat sink 600 has the above-mentioned technical effects, electronic devices having the heat sink 600 also have the above-mentioned technical effects, and will not be repeated here. In some embodiments, the heat absorption zone D of the heat sink 600 can be set as multiple, and correspondingly, the evaporation zone C of the capillary structure layer 200 can be multiple. When there are multiple heat absorption zones D of the heat sink 600, different heat absorption zones D can be connected to different heat-generating components 500, or to different parts of the same heat-generating component 500. The electronic device can be of various types, such as a mobile phone, tablet computer, or laptop computer, and the heat-generating component 500 can be of various types, such as a central processing unit, power supply module, or memory module; this application does not limit this.

[0069] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0070] The above description of the disclosed embodiments enables those skilled in the art to make or use this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A heat sink, comprising: A housing having a closed cavity, the outer surface of the housing having at least one heat-absorbing area for connection with a heating element; A capillary structure layer is disposed on the inner wall of the cavity, and the capillary structure layer can guide the phase change working fluid from the condensation zone to the evaporation zone corresponding to the heat absorption zone; At least one thin film is stacked on the side of the capillary structure layer away from the inner wall. The thin film has a plurality of first micropores in a first region corresponding to the evaporation zone. The thin film has a second region adjacent to the first region. The second region has a plurality of second micropores. The distribution density of the second micropores is not greater than the distribution density of the first micropores.

2. The heat sink according to claim 1, wherein the second region has a first sub-region at a first distance from the first region and a second sub-region at a second distance from the first region, the second distance being greater than the first distance, and the distribution density of the second micropores in the second sub-region being less than the distribution density in the first sub-region.

3. The heat sink according to claim 1, wherein at least a portion of the condensation zone is covered by a third region of the thin film, the third region having a third micropore, the size of the third micropore being larger than the size of the first micropore.

4. The heat dissipation component according to claim 3, wherein the capillary structure layer has a transport region located between the condensation region and the evaporation region, and the area of ​​the thin film corresponding to the transport region is set as a non-porous closed region, or, the area of ​​the thin film corresponding to the transport region is provided with a fourth micropore, the size of the fourth micropore being smaller than the size of the first micropore.

5. The heat dissipation component according to claim 4, wherein the distribution density of the third micropore is less than the distribution density of the first micropore, and the distribution density of the fourth micropore is less than the distribution density of the third micropore.

6. The heat sink according to claim 1, wherein the first micropores are arranged in rows and columns, the first micropores in adjacent rows are staggered along the length direction of the first micropores, and the first micropores in adjacent columns are staggered along the width direction of the first micropores; and / or, The second micropores are arranged in rows and columns, with the second micropores in adjacent rows being staggered along the length direction of the second micropores, and the second micropores in adjacent columns being staggered along the width direction of the second micropores.

7. The heat dissipation component according to any one of claims 1 to 6, wherein the surface hydrophilicity of the side of the thin film facing the capillary layer satisfies the condition that the droplet contact angle is not greater than 5°.

8. The heat dissipation component according to claim 7, wherein the thickness of the thin film is 10 μm to 15 μm, the first micropore is rectangular, and the width of the first micropore is 30 μm to 100 μm.

9. The heat dissipation component according to claim 7, wherein the capillary structure layer is configured as a single-layer metal wire mesh woven from metal wires, wherein the diameter of the metal wires in the metal wire mesh is 40μm~50μm, and the aperture of the mesh openings is 25μm~100μm.

10. An electronic device, comprising at least one heat-generating component and a heat sink for dissipating heat from the heat-generating component, the heat sink comprising: The housing has a closed cavity, and the outer surface of the housing has a heat-absorbing area for connection with the heating element; A capillary structure layer is disposed on the inner wall of the cavity, and the capillary structure layer can guide the phase change working fluid from the condensation zone to the evaporation zone corresponding to the heat absorption zone; At least one thin film is stacked on the side of the capillary structure layer away from the inner wall. The thin film has a plurality of first micropores in a first region corresponding to the evaporation zone. The thin film has a second region adjacent to the first region. The second region has a plurality of second micropores. The distribution density of the second micropores is not greater than the distribution density of the first micropores.

Images