Main control board liquid cooling heat dissipation research and development debugging module and debugging method

Abstract

The invention relates to the technical field of liquid cooling heat dissipation, and discloses a main control board liquid cooling heat dissipation research and development debugging module and method.The module comprises a cooling box body, a turbulent flow column array, a turbulent flow driving assembly, a signal reading unit and a controller, the cooling box body is matched with main control boards with different layouts, and the turbulent flow column array is provided with an integrated temperature measuring unit; the unit is composed of temperature sensors independently arranged on the turbulent flow columns, the turbulent flow columns achieve sealed stretching and retracting relative to the cooling box body by externally applying preset driving force, the turbulent flow driving assembly achieves turbulent flow column adsorption through an electromagnetic ring, and the signal reading unit completes temperature signal collection, conversion and transmission. The controller is electrically connected with all the assemblies to achieve automatic control over all the assemblies, after a debugging method is combined, the module can automatically achieve iterative adjustment of the turbulent flow structure without replacing a mold, the debugging period is remarkably shortened, the research and development cost is reduced, and the liquid cooling heat dissipation research and development requirements of all kinds of high-heating electronic equipment are met.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of liquid cooling heat dissipation, and in particular to a main control board liquid cooling heat dissipation research and development debugging module and a debugging method. BACKGROUND

[0002] With the significant growth of demand for artificial intelligence and big data processing, the operation task of the controller main board is becoming heavier and heavier, and the power consumption and heat generation of the controller main board are also increasing. The traditional air cooling heat dissipation method has been unable to meet the heat dissipation demand, and the liquid cooling heat dissipation technology has become an important technical path to solve the heat dissipation problem of high-performance controller main boards. In the design of the liquid cooling heat sink, setting a turbulence structure inside the flow channel is a core means to strengthen heat exchange, and how to develop an optimal turbulence structure scheme for a controller main board with a specific component layout and a specific power spectrum to achieve uniform controllability of the whole board temperature and maximization of the heat dissipation efficiency is a core bottleneck in current research and development.

[0003] The prior art has the problems of long debugging cycle and high cost. Each iteration depends on the machining and testing of molds, but each set of molds only verifies a single and fixed turbulence structure scheme, the data acquisition efficiency is extremely low, the debugging cycle significantly increases with the increase of the number of iterations, and the cost is linearly increasing. SUMMARY

[0004] In view of the defects of long debugging cycle and high cost of the existing liquid cooling heat sink turbulence column, the first object of the present application is to provide a main control board liquid cooling heat dissipation research and development debugging module which significantly shortens the debugging cycle to reduce the research and development cost.

[0005] In order to solve the above technical problems, the present application solves the problems by the following technical solutions: A main control board liquid cooling heat dissipation research and development debugging module, comprising: A cooling box main body, which is internally provided with a cooling flow channel system, and the surface of the cooling flow channel system is replaceably assembled with a main control board, the main control board being a to-be-debugged object with different component layouts; A turbulence column array, which is composed of a plurality of independent turbulence columns capable of sealingly extending and retracting in the vertical direction, the extension and retraction of the turbulence columns requiring a preset driving force, the turbulence columns being arranged in the cooling flow channel system according to a preset array, and the end of the turbulence column away from the main control board being located outside the cooling box main body; A turbulence driving assembly, comprising a driving plate, a lifting driving part and a magnetic attraction gripping array; The driving plate is located on the side of the cooling box main body away from the main control board, and is driven by the lifting driving part to approach or move away from the cooling box main body; The magnetic attraction gripping array is fixed on the side of the driving plate close to the cooling box main body, and is composed of a plurality of magnetic attraction gripping parts corresponding to the turbulence columns, and the energization or de-energization of the magnetic attraction gripping parts can attract or release the corresponding turbulence columns; An integrated temperature measuring unit composed of temperature sensors independently arranged on each spoiler column; A signal reading unit arranged on the magnetic attraction gripping array, used to connect with the integrated temperature measuring unit when the magnetic attraction gripping component contacts the spoiler column, to read the data of the temperature sensor on the corresponding spoiler column; A controller electrically connected with the lifting driving component, the magnetic attraction gripping array, and the signal reading unit.

[0006] With the above scheme, the cooling box body supports the replaceable assembly of the main control board, which can adapt to different component layout of the object to be debugged, greatly improving the versatility of the module, and there is no need to design a separate debugging device for each main control board; the spoiler column array adopts an independent and vertically sealed telescopic structure, and the preset driving force for the telescopic spoiler column is clear, which not only ensures the sealing of the cooling flow channel, but also can stably maintain the preset height of the spoiler column after release, avoiding position deviation caused by external force, cooperating with the adsorption and release function of the magnetic attraction gripping array, realizing individual control of the spoiler column, and breaking the limitations of the traditional fixed spoiler structure; the temperature sensor is independently arranged on each spoiler column, and the real-time data acquisition of the signal reading unit can accurately capture the temperature distribution of each region in the cooling flow channel, providing data support for spoiler strategy optimization; the electrical connection of the controller and each component ensures the automatic linkage of lifting driving, magnetic attraction control, data acquisition and other actions, reduces manual intervention, and improves debugging efficiency. The overall architecture of the module integrates mechanical structure and electrical control system, realizes rapid reconstruction of the spoiler scheme and accurate evaluation of the heat dissipation effect, significantly shortens the research and development debugging cycle, and reduces the iteration cost.

[0007] As a preferred, the cooling flow channel system includes a cooling flow channel, which is a rectangular reciprocating serpentine flow channel, and the spoiler columns are distributed in a staggered manner along the extension direction of the cooling flow channel.

[0008] With the above scheme, the rectangular reciprocating serpentine flow channel can greatly lengthen the flow path of the cooling medium in a limited space, increase the heat exchange time with the main control board, improve the overall heat dissipation uniformity, and avoid local heat accumulation; compared with uniform arrangement, the staggered distribution design of the spoiler column can generate more turbulent regions, enhance the fluid disturbance intensity, and improve the heat transfer coefficient.

[0009] As a preferred, the integrated temperature measuring unit includes a contact assembly arranged at the end of each spoiler column away from the main control board, and the contact assembly includes concentrically distributed inner circle contacts and outer circle contacts, and the inner circle contacts and the outer circle contacts are respectively electrically connected with two electrodes of the temperature sensor.

[0010] With the above scheme, the concentric distribution structure ensures the docking accuracy of the contact and the signal reading unit, and maintains the reliability of the contact connection.

[0011] As a preferred, the signal reading unit includes: The contact connection module comprises a probe assembly corresponding to the contact assembly, and is used for electrical connection with the contact assembly when the magnetic suction gripping component is adsorbed to the spoiler column; The signal acquisition and conversion module is electrically connected with the contact connection module, and is used for providing an excitation signal to the temperature sensor and receiving a sensing signal generated by the temperature sensor, and converting the sensing signal into digital temperature data; The data communication module is connected with the signal acquisition and conversion module, and is used for sending the digital temperature data to the controller.

[0012] According to the above scheme, the probe assembly of the contact connection module corresponds to the contact assembly one by one, realizing fast and reliable electrical connection when the magnetic suction gripping component is adsorbed to the spoiler column, and providing a stable foundation for temperature signal acquisition; the signal acquisition and conversion module provides an excitation signal, receives a sensing signal and converts it into digital temperature data, and the digital signal can more accurately reflect the actual temperature value; the data communication module ensures efficient transmission of digital temperature data to the controller, ensuring that the controller obtains temperature information of each spoiler column position in time, providing timely and reliable data support for subsequent development and adjustment of spoiler strategy.

[0013] Preferably, the signal acquisition and conversion module comprises: A plurality of signal conditioning sub-boards are connected to different probe assemblies respectively, each signal conditioning sub-board constitutes an independent signal acquisition channel, and comprises a constant current source, an amplification circuit and a data converter; The local processing unit is connected with each signal conditioning sub-board, and is used for coordinating signal acquisition timing and preliminary processing of data of each signal acquisition channel.

[0014] According to the above scheme, each signal conditioning sub-board is equipped with a constant current source, an amplification circuit and a data converter, the constant current source provides stable working current for the temperature sensor, ensuring the consistency of the sensor output signal; the amplification circuit can amplify the weak sensing signal, improving the signal-to-noise ratio; the data converter realizes accurate conversion from analog signal to digital signal, ensuring the accuracy of temperature data. A plurality of signal conditioning sub-boards correspond to different probe assemblies respectively, supporting multi-channel parallel acquisition, avoiding the congestion problem of single-channel acquisition, and simultaneously acquiring temperature data of all spoiler column positions. The local processing unit coordinates the acquisition timing of each channel to avoid signal interference, and simultaneously performs preliminary data processing, thereby reducing the computational pressure of the controller and ensuring the efficiency of data processing. This design can adapt to the temperature measurement demand of large-scale spoiler column array, and provide solid technical support for quickly drawing temperature distribution map and timely adjusting spoiler strategy.

[0015] Preferably, the probe assembly comprises a center probe and an outer ring probe corresponding to the inner ring contact and the outer ring contact respectively.

[0016] Adopting the above scheme, the probe and the contact are precisely connected, and the reliability of temperature signal transmission is ensured.

[0017] As preferred, the magnetic attraction gripping component comprises a moving column fixed on the driving plate and an electromagnetic ring fixed on the side of the moving column close to the cooling box body, and a positioning ring is protruded on the end of the moving column in the electromagnetic ring; the center probe is inserted into the positioning ring, and the outer ring probe is sleeved outside the positioning ring, and the outer ring probe is matched with the inner wall of the electromagnetic ring at a distance; the center probe and the outer ring probe are respectively elastically stretched and contracted relative to the magnetic attraction gripping component through a spring.

[0018] Adopting the above scheme, the electromagnetic ring adsorbs and releases the spoiler column through power-on adsorption and power-off release, the control mode is simple and efficient, the adsorption force is stable, and the spoiler column can be ensured not to fall off and deviate during lifting.

[0019] As preferred, the lifting driving component is a servo electric push rod or a servo linear module.

[0020] Adopting the above scheme, the servo electric push rod and the servo linear module have the core advantages of high positioning accuracy, stable operation and fast response speed, can accurately control the moving distance and speed of the driving plate, and ensure that the lifting movement of the spoiler column strictly meets the debugging strategy requirements.

[0021] The second object of the application is to provide a debugging method applied to the master control board liquid cooling heat dissipation development and debugging module, comprising the following steps: S1, control the driving plate to move, so that the signal reading unit contacts the integrated temperature measuring unit on the spoiler column, collect the temperature data of all spoiler columns in the initial non-disturbance state, and generate a preliminary temperature distribution map; S2, based on the preliminary temperature distribution map generated in S1, execute automatic spoiler array reconstruction to form a differentiated spoiler height configuration, specifically including: S21, control the driving plate to be close to the cooling box body, adsorb all the spoiler columns through the magnetic attraction gripping array, and drive the spoiler columns to move synchronously to the inside of the cooling box body until the bottom ends of all the spoiler columns abut against the inner wall of the cooling flow channel close to the master control board, and the position is taken as the unified zero point reference for calculating the extension amount of all the spoiler columns; S22, control the driving plate to carry all the adsorbed spoiler columns to move synchronously, and based on the debugging strategy formulated based on the preliminary temperature distribution map, selectively control the magnetic attraction gripping component to be powered off to release the corresponding spoiler column at different height positions; S23. Under the new turbulence height distribution formed in step S22, the system is brought to thermal equilibrium. Step S1 is executed again to obtain a new temperature distribution map to evaluate the heat dissipation effect. If the evaluation result does not meet the preset optimization target, the new temperature distribution map is used as input to adjust the debugging strategy and return to step S21 to execute the next iteration until a turbulence height distribution that meets the optimization target is obtained.

[0022] The above scheme achieves automated and intelligent iterative optimization of the turbulence scheme based on the module's hardware structure, changing the inefficient debugging mode that relies on manual design, mold processing, and repeated testing. Step S1, drawing the initial temperature distribution map, collects temperature data under turbulence-free conditions, providing a clear benchmark for subsequent turbulence strategy formulation, making turbulence optimization more targeted. Step S2, configuring the differentiated turbulence height, achieves automated reconstruction and iterative optimization of the turbulence array through a closed-loop process formed by establishing a unified zero-point benchmark in S21, strategic extension in S22, and effect evaluation and optimization in S23. Establishing a unified benchmark ensures consistency in the calculation of the extension amount of all turbulence columns, avoiding uneven turbulence effects caused by individual deviations; strategic extension is based on temperature distribution to achieve targeted turbulence enhancement; effect evaluation and optimization continuously approach the optimal heat dissipation effect through repeated iterations. The entire method does not require mold replacement; the turbulence structure can be quickly adjusted through the electronic control system, significantly shortening the debugging cycle and reducing R&D costs. Simultaneously, it can formulate personalized turbulence schemes for the heat dissipation characteristics of different main control boards, improving the accuracy and reliability of heat dissipation.

[0023] Preferably, a release position threshold or release time threshold is set for each turbulence column. The value of the threshold is determined based on the temperature value at the corresponding position in the preliminary temperature distribution map. The higher the temperature value, the smaller the set release threshold. When the real-time position or rise time of the drive board reaches the release threshold of any turbulence column, the corresponding magnetic gripping component is de-energized to release the turbulence column.

[0024] By adopting the above scheme, the debugging strategy of step S22 is clarified. By linking the release threshold with the temperature value, the turbulence height can be precisely and differentiatedly configured, thereby enhancing the heat dissipation effect of the high-heat area.

[0025] The application has remarkable technical effects due to the above technical scheme: through module structure innovation and debugging method optimization, the automatic rapid iteration debugging of the main control board liquid cooling heat dissipation is realized. The cooling box main body can adapt to main control boards with different layouts, cooperate with the turbulence column array and magnetic attraction driving assembly which can be independently sealed and stretched and need to be preset with driving force, quickly reconfigure the turbulence structure without replacing the mold, greatly shorten the debugging cycle and significantly reduce the research and development cost; the integrated temperature measurement unit and signal reading unit accurately capture the temperature distribution in the cooling flow channel, combined with the differentiated configuration strategy and iteration optimization process of "the higher the temperature, the stronger the turbulence", effectively improve the main control board whole board temperature uniformity and heat dissipation efficiency; after the controller is electrically connected with each component, a full-process automatic control closed loop is constructed, manual intervention and operation error are reduced, and the debugging accuracy is guaranteed; the module structure design considers the sealing, stability and universality, can be expanded to the liquid cooling heat dissipation scheme research and development of various high-heat electronic equipment, has multiple core advantages such as high efficiency, high adaptability, precision and economy. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1 is a front view of a main control board liquid cooling heat dissipation research and development debugging module of the embodiment; Figure 2 is a sectional view of A-A of Figure 1 Figure 3 is a sectional view of B-B of Figure 2 Figure 4 is an axonometric view of a driving board and a magnetic attraction gripping array assembled thereon of the embodiment; Figure 5 is an axonometric view of a driving board and a signal acquisition and conversion module assembled thereon of the embodiment; Figure 6 is an axonometric view of a turbulence column of the embodiment; Figure 7 is a main control board liquid cooling heat dissipation research and development debugging method flowchart of the embodiment.

[0027] ​​The part names referred to by the numbers in the above drawings are as follows: 1, cooling box body; 101, box body; 1011, cooling flow channel; 1012, inlet; 1013, outlet; 102, cover body; 2, main control board; 3, drive board; 301, guide block; 4, magnetic attraction gripping part; 401, moving column; 4011, positioning ring; 402, electromagnetic ring; 5, assembly board; 6, servo electric push rod; 7, base; 8, support frame; 9, controller; 10, signal conditioning sub-board; 11, local processing unit; 12, turbulence column; 121, turbulence body; 122, working end cover; 1221, assembly section; 1222, matching groove; 13, temperature sensor; 14, contact assembly; 141, inner ring contact; 142, outer ring contact; 15, probe assembly; 151, center probe; 152, outer ring probe; 16, spring. DETAILED DESCRIPTION

[0028] The application will be further described in detail below with reference to the drawings and examples.

[0029] A main control board liquid cooling heat dissipation research and development debugging module, referring to Figures 1-6 as shown, comprising a cooling box body 1, a turbulence column array, a turbulence driving assembly, an integrated temperature measurement unit, a signal reading unit and a controller 9.

[0030] The cooling box body 1 is formed by the box body 101 and the cover body 102 made of aluminum alloy material through bolt fixing, and the two enclose a closed space to accommodate the cooling flow channel system. The cooling flow channel system is a cooling flow channel 1011, which is a rectangular reciprocating serpentine flow channel. The inlet 1012 and the outlet 1013 of the cooling flow channel 1011 are arranged at the two ends of the side wall of the box body 101, facilitating the circulation of the cooling medium. The cover body 102 is provided with 6x6 array distributed mounting holes for assembling the turbulence column array. The surface of the box body 101 away from the cover body 102 is replaceably assembled with the main control board 2 to be debugged through bolts. The main control board 2 is provided with connecting blocks with mounting holes on both sides, which correspond to the connecting blocks on both sides of the box body 101 and the cover body 102. The three are fixed synchronously through the same bolt, which can adapt to the debugging needs of the main control board 2 with different component layouts.

[0031] The turbulence column array is composed of 36 independent turbulence columns 12. Each turbulence column 12 is correspondingly and sealingly inserted into the mounting hole of the cover body 102. The turbulence column array is integrated with an integrated temperature measurement unit. The integrated temperature measurement unit includes a temperature sensor 13 and a contact assembly 14 arranged in each turbulence column 12. The temperature sensor 13 is a micro NTC temperature sensor.

[0032] The turbulence column 12 comprises a turbulence body 121 and a working end cover 122, the turbulence body 121 is made of 304 stainless steel and has a hollow cylindrical structure, and an inner wall of an end of the turbulence body 121 away from the main control plate 2 is provided with an internal thread; the working end cover 122 is also made of 304 stainless steel and comprises an assembly section 1221 inserted into the inside of the turbulence body 121 and matched with the internal thread, and a matching groove 1222 into which the electromagnetic ring 402 can be concentrically introduced, an opening end of the matching groove 1222 is provided in a conical ring shape to facilitate the introduction of the electromagnetic ring 402, and the assembly section 1221 and the matching groove 1222 are respectively located at two ends of the working end cover 122. After the assembly section 1221 is screwed into the turbulence body 121 through thread cooperation, a temperature sensor 13 installation space is reserved between an end of the assembly section 1221 and an end of the turbulence body 121 close to the main control plate 2, the temperature sensor 13 is embedded in the space, and heat-conducting silicone grease is filled between the temperature sensor 13 and the inner wall of the turbulence body 121 to strengthen heat conduction.

[0033] The contact assembly 14 comprises inner circle contacts 141 and outer circle contacts 142 concentrically distributed, and the matching groove 1222 is provided with an insulating liner made of polytetrafluoroethylene and fixed at the bottom of the matching groove 1222 by high-temperature resistant epoxy glue, a surface of the insulating liner is provided with installation stations matched with the inner circle contacts 141 and the outer circle contacts 142 to realize electrical insulation between the contact assembly 14 and the working end cover 122; two electrode leads of the temperature sensor 13 extend to the matching groove 1222 along a hollow channel in the inside of the turbulence body 121 and are welded and fixed with the inner circle contacts 141 and the outer circle contacts 142 respectively, and the welding positions are packaged by insulating sealing glue to prevent the cooling medium from penetrating and further strengthen the insulation effect.

[0034] An elastic layer made of high-elasticity damping rubber is fixedly sleeved on the outer side wall of the turbulence body 121, the elastic layer is tightly attached to the inner wall of the mounting through-hole of the cover body 102 to realize sealing and prevent leakage and provide damping for the expansion and contraction of the turbulence column 12, and a driving force needs to be preset to realize the driving of the turbulence column 12. The driving force is greater than the contact elastic force of the subsequent probe assembly 15 and the friction force when the electromagnetic ring 402 is inserted, so that the turbulence column 12 can be stably kept at a preset height after being released. All the turbulence columns 12 are distributed in a staggered manner along the extension direction of the flow channel in the cooling flow channel and realize independent sealing and expansion, and the end of the matching groove 1222 of the working end cover 122 extends out of the cooling box main body 1 to facilitate cooperation with the subsequent magnetic attraction gripping array.

[0035] The turbulence driving assembly is arranged on the side of the cover 102 away from the box body 101, and comprises a driving plate 3, a lifting driving component, and a magnetic attraction gripping array. The lifting driving component is a servo electric push rod 6 fixed on the base 7 of the module, and the output shaft is vertically upwardly and bolted to the center of the driving plate 3. The module is provided with a support frame 8 fixed in parallel on the base 7, and the opposite sides of the support frame 8 are provided with vertical guide grooves, and the two ends of the driving plate 3 are guided and slidably arranged in the vertical guide grooves through guide blocks 301.

[0036] The upper end of the support frame 8 is further provided with a threaded hole, and the connecting blocks on the two sides of the main control plate 2, the box body 101 and the cover 102 are provided with upper and lower corresponding mounting holes. The mounting holes are opposite to the threaded hole, and the main control plate 2, the box body 101 and the cover 102 can be tightly fitted with the threaded hole on the support frame 8 through the same bolt, so as to realize the installation of the main control plate 2 on the cooling box body 1, the sealing assembly of the cooling box body 1, and the fixed assembly of the main control plate 2 and the cooling box body 1 on the support frame 8.

[0037] The magnetic attraction gripping array is composed of 36 magnetic attraction gripping components 4 corresponding to 36 turbulence columns 12. Each magnetic attraction gripping component 4 comprises a moving column 401 fixed on the driving plate 3 and an electromagnetic ring 402. The moving column 401 is fixed on the driving plate 3, and the electromagnetic ring 402 is threadedly fixed on one end of the moving column 401 close to the cooling box body 1. An annular positioning ring 4011 is protruded on the end of the moving column 401 and inside the electromagnetic ring 402, which is used to guide the probe assembly 15. The electromagnetic ring 402 can be concentrically introduced into the matching groove 1222 of the working end cover 122 of the turbulence column 12 after being electrified, so as to realize the stable adsorption of the turbulence column 12.

[0038] The signal reading unit is integrated on the magnetic attraction gripping component 4, and comprises a contact connection module, a signal acquisition and conversion module, and a data communication module. The contact connection module is a probe assembly 15 matched with the contact assembly 14. Each probe assembly 15 comprises a center probe 151 and an outer ring probe 152. The center probe 151 is guided and inserted into the positioning ring 4011, and the outer ring probe 152 is guided and sleeved outside the positioning ring 4011 and matched with the inner wall of the electromagnetic ring 402 at a distance. The rear ends of the two probes are fixed with springs 16, and the ends of the springs 16 away from the probes are fixed on a fixed ring which is fixedly embedded on the moving column 401. Through the above arrangement, the center probe 151 and the outer ring probe 152 can realize elastic expansion and be partially located outside the electromagnetic ring 402 in normal state, so that the center probe 151 and the outer ring probe 152 can be in close contact with the inner ring contact 141 and the outer ring contact 142 respectively when the electromagnetic ring 402 is inserted into the bottom of the matching groove 1222.

[0039] The signal acquisition and conversion module includes six signal conditioning sub-boards 10 and a local processing unit 11. Each signal conditioning sub-board 10 is connected to a probe assembly 15 of a row of six turbulence columns 12, and each signal conditioning sub-board 10 is integrated with a constant current source, an amplification circuit and a data converter. The constant current source provides stable excitation for the temperature sensor 13, the amplification circuit is used to amplify weak sensing signals, and the data converter converts analog signals into digital temperature data. The local processing unit 11 adopts an STM32 single-chip microcomputer and is connected to each signal conditioning sub-board 10 through an SPI bus to coordinate the timing of each channel acquisition and perform preliminary filtering of data. The data communication module adopts an RS485 communication module and is electrically connected to the local processing unit 11 to transmit digital temperature data to the controller 9.

[0040] The signal acquisition and conversion module is fixed on the side of the drive plate 3 away from the magnetic attraction gripping array. In order to assemble the servo electric push rod 6, an assembly plate 5 is fixed on the side of the drive plate 3 away from the magnetic attraction gripping array. An assembly space for assembling the signal acquisition and conversion module exists between the assembly plate 5 and the drive plate 3. The output shaft of the servo electric push rod 6 is fixedly connected to the assembly plate 5.

[0041] The controller 9 selects a PLC controller and is installed on the side of the support frame 8. The controller 9 is electrically connected to the servo electric push rod 6, the electromagnetic ring 402, the signal conditioning sub-boards 10 and the data communication module through wires.

[0042] Referring to Figure 7 When the module of the embodiment is debugged, the debugging method is as follows: S1, the drive plate 3 is controlled to move so that the signal reading unit contacts the integrated temperature measurement unit on the turbulence column 12, and the temperature data of all turbulence columns 12 in the initial turbulence-free state is collected to generate a preliminary temperature distribution map, which specifically includes: S11, after the turbulence-free state runs to a thermal equilibrium state, the probe assembly 15 of the signal reading unit precisely docks with the contact assembly 14 of the turbulence column 12, the constant current source of the signal conditioning sub-board 10 provides stable excitation current for the temperature sensor 13, the temperature sensor 13 converts temperature changes into weak resistance change signals, which are amplified by the amplification circuit and converted into digital temperature data by the data converter. The local processing unit coordinates the timing of the 36 independent signal acquisition channels to avoid data conflicts, and filters and denoises the original data to ensure data reliability.

[0043] S12, the local processing unit 11 transmits 36 discrete temperature data to the controller 9 through the RS485 communication module. The controller 9 first coordinates the data, and binds each temperature data to the physical coordinates of the spoiler column 12 in the cooling flow channel 1011; then it performs data normalization processing, maps all temperature values to a unified range, 0-100℃ in this embodiment, eliminating the range deviation caused by individual errors of the temperature sensor 13; finally, it completes the discrete data through the interpolation algorithm, fills in the temperature data blank between the spoilers, and forms a continuous temperature data matrix.

[0044] S13, the controller 9 maps the standardized temperature data matrix to the physical model of the cooling flow channel 1011 in space, and determines the actual position of each data point in the cooling flow channel 1011; then it renders the rules through the heat map, and corresponds different temperature values to different color gradients, in this embodiment, low temperature corresponds to blue, medium temperature corresponds to yellow, and high temperature corresponds to red, finally generates a heat map that intuitively reflects the temperature distribution in the cooling flow channel, and clearly presents the high-heat area and the temperature uniformity state.

[0045] S2, based on the preliminary temperature distribution map generated in S1, perform automatic spoiler array reconstruction to form a differentiated spoiler height configuration, which specifically includes: S21, control the driving board 3 to approach the cooling box main body 1, adsorb all the spoiler columns 12 through the magnetic suction gripping array, and drive the spoiler columns 12 to move synchronously to the inside of the cooling box main body 1 until the bottom ends of all the spoiler columns 12 abut against the inner wall of the cooling flow channel near the main control board 2, and take this position as the unified zero point reference for calculating the extension amount of all the spoiler columns 12.

[0046] S22, control the driving board 3 to carry all the adsorbed spoiler columns 12 to rise synchronously, and based on the debugging strategy formulated according to the preliminary temperature distribution map, selectively control the magnetic suction gripping part 4 to lose power at different height positions to release the corresponding spoiler column 12, which specifically includes: S221, the controller 9 receives the temperature data matrix corresponding to the initial temperature distribution map, takes the position of all the spoiler columns 12 "abutting against the inner wall of the cooling flow channel" as the unified zero point reference, establishes the calculation coordinate system of the extension amount of the spoiler columns 12, and extension amount = driving board rising distance - distance corresponding to release threshold, to ensure that the height adjustment of all the spoiler columns 12 has a unified reference standard.

[0047] S222, the controller 9 extracts the temperature value of each coordinate point, and assigns the release position threshold according to the principle of "the higher the temperature, the smaller the release threshold". If the temperature of a certain area in the cooling channel is 80 DEG C, it is a high temperature area, and the release position threshold is set to 5 mm; if the temperature of a certain area is 40 DEG C, it is a low temperature area, and the release position threshold is set to 15 mm. The threshold and temperature value are linearly and negatively correlated, threshold = K - Delta T x alpha, wherein K is the maximum release distance constant, Delta T is the difference between the measured temperature and the reference temperature, and alpha is the proportional coefficient.

[0048] S223, the controller 9 sends the extension command to the servo electric push rod 6, and drives the driving plate 3 to drive all the adsorbed spoiler columns 12 to approach the cover body 102 synchronously. The algorithm collects the real-time position data of the driving plate 3 in real time, and feeds back through the encoder of the servo electric push rod 6. When the real-time position reaches the release threshold of a certain spoiler column 12, a power-off signal is immediately sent to the electromagnetic ring 402 of the corresponding magnetic suction gripping part 4, the electromagnetic ring 402 loses the adsorption force, and the spoiler column 12 stably maintains the current extension height under the sealing damping action of the elastic damping rubber, realizing the differential spoiler configuration.

[0049] S23, under the new spoiler height distribution formed in step S22, the system runs to a thermal equilibrium state, step S1 is executed again to obtain a new temperature distribution map to evaluate the heat dissipation effect; if the evaluation result does not reach the preset optimization target, the new temperature distribution map is taken as input, the debugging strategy is adjusted, and step S21 is returned to execute the next iteration until the spoiler height distribution meeting the optimization target is obtained, specifically including: S231, after the new spoiler height configuration is completed, the algorithm control system runs for a preset time, which is 30 minutes in this embodiment, and monitors the change rate of the temperature data matrix in real time. When the fluctuation amplitude of all temperature data is less than or equal to 0.5 DEG C within 5 consecutive minutes, it is determined that the system reaches a thermal equilibrium state.

[0050] S232, the temperature data after thermal equilibrium is extracted, a new temperature distribution map is generated, and two core evaluation indexes are calculated: one is the maximum temperature of the whole plate, which is set to be less than or equal to 60 DEG C in this embodiment, and the other is the temperature standard deviation, which is set to be less than or equal to 5 DEG C in this embodiment. If both indexes meet the requirements, the algorithm outputs the optimal spoiler height configuration scheme; if not, the new temperature distribution map is taken as input, the release threshold of each area is recalculated, the release threshold of the spoiler column still in the high temperature area is further reduced, the extension amount is increased, and step S21 is returned to start the next iteration until the optimization target is reached.

[0051] The features involved in this embodiment are explained as follows: Non-interference state: refers to the state that all the turbulence columns 12 in the cooling channel 1011 are in the fully retracted position and do not extend into the cooling channel 1011 to disturb the flow of the cooling medium. At this time, the cooling medium only receives the influence of the channel structure itself in the cooling channel 1011 and flows in the form of smooth laminar flow or weak turbulent flow, without being actively disturbed by the turbulence column 12. It is the benchmark state for evaluating the natural heat distribution of the main control board.

[0052] Thermal equilibrium state: refers to the state that the heat power of the main control board 2 and the heat dissipation power of the liquid cooling heat dissipation system reach dynamic balance, and the temperature of each region in the cooling channel 1011 no longer changes significantly with time. The core criterion is that the fluctuation amplitude of all temperature data is controlled within the preset threshold within a continuous preset time length, and in the embodiment, it is that the temperature fluctuation is ≤±0.5°C within 5 minutes.

[0053] Unified zero point reference: a unified reference starting point set for calculating the extension amount of all turbulence columns, specifically the position that the bottom end of the turbulence column 12 is in complete abutment with the inner wall of the side of the cooling channel 1011 close to the main control board 2. The extension amount of all the turbulence columns 12 is calculated based on this position, that is, the extension amount = the driving plate rising distance - the distance corresponding to the release threshold.

[0054] The above is only the preferred embodiment of the present application, and the protection scope of the present application is not limited to the above-mentioned embodiments. Any technical solution falling within the concept of the present application shall fall within the protection scope of the present application. It should be noted that for ordinary technical personnel in the technical field, some improvements and decorations without departing from the principles of the present application shall also be considered as the protection scope of the present application.

Claims

1. A main control board liquid cooling heat dissipation research and debugging module, characterized in that, include: The cooling box body (1) has a cooling channel system inside, and its surface is replaceably equipped with a main control board (2). The main control board (2) is an object to be debugged with different component layouts. The turbulence column array consists of several independent turbulence columns (12) that can be sealed and extended in the vertical direction. The extension and retraction of the turbulence columns (12) requires a preset driving force. The turbulence columns (12) are arranged in the cooling channel system according to a preset array. The end of the turbulence column (12) away from the main control board (2) is located outside the cooling box body (1). The turbulence drive assembly includes a drive plate (3), a lifting drive component, and a magnetic gripping array; The drive board (3) is located on the side of the cooling box body (1) away from the main control board (2). As the lifting drive component is driven, it moves closer to or further away from the cooling box body (1). The magnetic gripping array is fixed on the side of the drive plate (3) near the cooling box body (1). It consists of multiple magnetic gripping components (4) that correspond one-to-one with the turbulence column (12). The magnetic gripping component (4) can attract or release the corresponding turbulence column (12) when it is energized or de-energized. The integrated temperature measurement unit consists of temperature sensors (13) independently installed on each of the turbulence columns (12); The signal reading unit is set on the magnetic gripping array and is used to connect with the integrated temperature measurement unit when the magnetic gripping component (4) contacts the turbulence column (12) to read the data of the temperature sensor (13) on the corresponding turbulence column (12); The controller (9) is electrically connected to the lifting drive component, the magnetic grip array, and the signal reading unit.

2. The main control board liquid cooling heat dissipation R&D and debugging module according to claim 1, characterized in that, The cooling channel system includes a cooling channel (1011), which is a rectangular reciprocating serpentine channel, and the turbulence columns (12) are staggered in the cooling channel (1011) along its extension direction.

3. The main control board liquid cooling heat dissipation R&D and debugging module according to claim 1, characterized in that, The integrated temperature measurement unit includes a contact assembly (14) located at the end of each turbulence column (12) away from the main control board (2). The contact assembly (14) includes concentrically distributed inner ring contacts (141) and outer ring contacts (142). The inner ring contacts (141) and outer ring contacts (142) are fixedly connected to the two electrodes of the temperature sensor (13), respectively.

4. The main control board liquid cooling heat dissipation R&D and debugging module according to claim 3, characterized in that, The signal reading unit includes: The contact connection module includes a probe assembly (15) corresponding to the contact assembly (14) for electrically connecting with the contact assembly (14) when the magnetic gripping component (4) adsorbs the turbulence column (12); The signal acquisition and conversion module is electrically connected to the contact connection module and is used to provide an excitation signal to the temperature sensor (13), receive the sensing signal generated by it, and convert the sensing signal into digital temperature data. The data communication module is connected to the signal acquisition and conversion module and is used to send digital temperature data to the controller (9).

5. The main control board liquid cooling heat dissipation R&D and debugging module according to claim 4, characterized in that, The signal acquisition and conversion module includes: Multiple signal conditioning sub-boards (10) are connected to different probe assemblies (15). Each signal conditioning sub-board (10) constitutes an independent signal acquisition channel and includes a constant current source, an amplifier circuit and a data converter. The local processing unit (11) is connected to each signal conditioning sub-board (10) and is used to coordinate the signal acquisition timing and preliminary data processing of each signal acquisition channel.

6. The main control board liquid cooling heat dissipation R&D and debugging module according to claim 4, characterized in that, The probe assembly (15) includes a center probe (151) and an outer probe (152) corresponding to the inner ring contact (141) and the outer ring contact (142), respectively.

7. A main control board liquid cooling heat dissipation R&D and debugging module according to claim 6, characterized in that, The magnetic gripping component (4) includes a movable column (401) fixed on the drive plate (3) and an electromagnetic ring (402). The electromagnetic ring (402) is fixed on the side of the movable column (401) near the cooling box body (1). A positioning ring (4011) is protruding from the end of the movable column (401) inside the electromagnetic ring (402). The center probe (151) is inserted into the positioning ring (4011), and the outer ring probe (152) is sleeved on the outside of the positioning ring (4011). The distance between the outer ring probe (152) and the inner wall of the electromagnetic ring (402) is matched. The center probe (151) and the outer ring probe (152) are elastically extended and retracted relative to the magnetic gripping component (4) by a spring (16).

8. The main control board liquid cooling heat dissipation R&D and debugging module according to claim 1, characterized in that: The lifting drive component is a servo electric push rod (6) or a servo linear module.

9. A debugging method, applied to the main control board liquid cooling heat dissipation R&D debugging module as described in any one of claims 1-8, characterized in that, Includes the following steps: S1. Control the drive board (3) to move so that the signal reading unit contacts the integrated temperature measuring unit on the turbulence column (12), collect the temperature data of all turbulence columns (12) in the initial turbulence-free state, and generate a preliminary temperature distribution map; S2. Based on the preliminary temperature distribution map generated in S1, perform automated turbulence array reconstruction to form a differentiated turbulence height configuration, specifically including: S21. The control drive board (3) approaches the cooling box body (1) and uses a magnetic gripping array to attract all the turbulence columns (12). It then drives the turbulence columns (12) to move synchronously into the cooling box body (1) until the bottom of all the turbulence columns (12) abuts against the inner wall of the cooling channel near the main control board (2). This position is used as the unified zero-point reference for calculating the extension of all the turbulence columns (12). S22, the control drive board (3) carries all the adsorbed turbulence columns (12) to rise synchronously, and based on the debugging strategy formulated by the preliminary temperature distribution map, selectively controls the magnetic gripping component (4) to de-energize at different height positions to release the corresponding turbulence column (12). S23. Under the new turbulence height distribution formed in step S22, the system is brought to thermal equilibrium. Step S1 is executed again to obtain a new temperature distribution map to evaluate the heat dissipation effect. If the evaluation result does not meet the preset optimization target, the new temperature distribution map is used as input to adjust the debugging strategy and return to step S21 to execute the next iteration until a turbulence height distribution that meets the optimization target is obtained.

10. A debugging method according to claim 9, characterized in that, The debugging strategy of S22 includes: setting a release position threshold or release time threshold for each turbulence column (12), the size of which is determined according to the temperature value of the corresponding position in the preliminary temperature distribution diagram; wherein, the higher the temperature value, the smaller the set release threshold; when the real-time position or rise time of the drive board (3) reaches the release threshold of any turbulence column (12), the corresponding magnetic gripping component (4) is de-energized to release the turbulence column (12).

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