Optical module water-cooling heat dissipation mechanism

Abstract

The invention belongs to the technical field of optical communication, and relates to an optical module water-cooling heat dissipation mechanism which is installed in a switch, the lower surface of the optical module water-cooling heat dissipation mechanism is used for contacting and conducting heat generated by operation of an optical module, the optical module water-cooling heat dissipation mechanism comprises a spiral radiator and an outer ring radiator, the spiral radiator is installed in the outer ring radiator, and the outer wall of the spiral radiator is attached to the inner wall of the outer ring radiator for heat conduction; the spiral radiator comprises a plurality of radiating units, the radiating units are sequentially nested together from inside to outside, and every two adjacent radiating units are insulated from each other; each heat dissipation unit comprises a cooling pipeline which is spirally wound for multiple circles, every two adjacent circles are in contact with each other, one end of each cooling pipeline communicates with an external water pump, and the other end of each cooling pipeline communicates with an external cooling device; the heat dissipation mechanism has the advantages that the heat dissipation mechanism forms a plurality of independent heat dissipation centers in a very small space, the heat dissipation area is larger, the heat conduction effect is better, and the technical problems that the heat dissipation effect of an existing heat dissipation mechanism is not ideal, and the heat dissipation requirement of a high-power-consumption optical module is difficult to meet are solved.

Description

Technical Field

[0001] This invention relates to the field of optical communication technology, and in particular to a water-cooled heat dissipation mechanism for optical modules. Background Technology

[0002] The core function of an optical module is photoelectric / electro-optical conversion, and it contains electronic and optical components such as lasers, driver chips, modulators, and detectors. These components generate heat during operation, with the laser chip and driver chip being the main heat sources. As data transmission rates evolve from 10G and 25G to 400G, 800G, and even 1.6T, the power consumption and heat generation of optical modules increase dramatically. For example, early 10G optical modules consumed about 1W, while 400G modules can consume up to 15W, and 800G modules may reach around 24W. Excessive temperature not only affects the performance and stability of the optical module, leading to decreased signal transmission quality or packet loss, but also shortens its lifespan.

[0003] When high-power optical modules are densely inserted into a switch, the internal cooling system of the modules themselves is insufficient, necessitating the installation of a cooling system within the switch. Existing cooling solutions for optical modules in switches typically employ either air cooling or liquid cooling. However, with the continuous increase in data transmission rates of optical modules, existing cooling solutions are struggling to meet their cooling requirements.

[0004] For example, Chinese patent CN 116997157 A discloses a heat dissipation system, method, and apparatus for an optical module. The method includes: an optical module cage comprising a cage shell and a cavity enclosed by the cage shell, wherein the internal space of the cavity is used to accommodate the optical module; a heat-conducting module disposed on the cage shell and in contact with the optical module cage, with its other end connected to a heat-conducting pipe for transferring heat dissipated by the optical module to a water-cooled heat dissipation module; and a water-cooled heat dissipation module connected to the heat-conducting module via a heat-conducting pipe for water-cooling the heat transferred by the heat-conducting module. However, the heat dissipation efficiency of this system is still insufficient to meet the heat dissipation requirements of high-power optical modules.

[0005] Therefore, it is necessary to design a water-cooling heat dissipation mechanism for optical modules to efficiently dissipate heat from high-power optical modules. Summary of the Invention

[0006] (a) Technical problems to be solved In view of the above-mentioned shortcomings and deficiencies of the prior art, the present invention provides a water-cooled heat dissipation mechanism for optical modules, which solves the technical problem that the heat dissipation effect of the existing optical module heat dissipation mechanism is not ideal and it is difficult to meet the heat dissipation requirements of high-power optical modules.

[0007] (II) Technical Solution To achieve the above objectives, the main technical solutions adopted by the present invention include: This invention provides a water-cooled heat dissipation mechanism for an optical module, which is installed in a switch. Its lower surface is used to contact and conduct the heat generated by the optical module during operation. It includes a spiral heat sink and an outer ring heat sink. The spiral heat sink is installed in the outer ring heat sink, and its outer wall is in contact with the inner wall of the outer ring heat sink for heat conduction. The spiral heat sink includes multiple heat dissipation units, which are nested together from the inside to the outside and dissipate heat independently. Adjacent heat dissipation units are insulated from each other. Each heat dissipation unit includes a cooling pipe, which is spirally wound multiple times in the longitudinal direction, with adjacent turns in contact with each other. One end of the cooling pipe is connected to an external water pump, and the other end is connected to an external cooling device.

[0008] Optionally, the cooling pipe is provided with an inlet and an outlet, which are located above the spiral radiator. The inlet is connected to an external water pump, and the outlet is connected to an external cooling device. Coolant enters the cooling pipe from the inlet and is discharged from the outlet, carrying away the heat generated by the optical module. The external cooling device is connected to the external water pump.

[0009] Optionally, the spiral radiator includes a first heat dissipation unit, a second heat dissipation unit, and a third heat dissipation unit, wherein the cooling pipes of the first heat dissipation unit, the second heat dissipation unit, and the third heat dissipation unit are each supplied with coolant independently by a corresponding external water pump.

[0010] Optionally, a first heat-insulating body is provided between the first heat dissipation unit and the second heat dissipation unit, and a second heat-insulating body is provided between the second heat dissipation unit and the third heat dissipation unit, so that the first heat dissipation unit, the second heat dissipation unit and the third heat dissipation unit can dissipate heat independently and do not conduct heat to each other.

[0011] Optionally, the outer wall of the outer ring radiator is uniformly provided with multiple heat dissipation protrusions.

[0012] Optionally, the first heat dissipation unit, the second heat dissipation unit, and the third heat dissipation unit are all integrally formed using 3D printing technology.

[0013] Optionally, an external water pump pumps low-temperature coolant to a location near the optical module in the cooling pipe, where the coolant flows spirally along the cooling pipe and is then discharged.

[0014] Optionally, it also includes an electric lifting device, the upper end of which is connected to the switch and the lower end of which is connected to a cooling pipe. The longitudinal movement of the electric lifting device changes the height of the heat dissipation mechanism in the switch so that the heat dissipation mechanism is tightly attached to or detached from the optical module.

[0015] (III) Beneficial Effects The beneficial effects of this invention are: 1. The present invention provides a water-cooled heat dissipation mechanism for optical modules. The heat dissipation mechanism is equipped with multiple independent heat dissipation units, which are nested together from the inside to the outside. Adjacent heat dissipation units are insulated from each other. The cooling pipes of each heat dissipation unit are spirally coiled to form a cylindrical structure. The heat dissipation mechanism forms multiple independent heat dissipation centers in a very small space, resulting in a larger heat dissipation area and better heat conduction. Compared with the prior art, it solves the technical problem that the heat dissipation effect of existing optical module heat dissipation mechanisms is not ideal and it is difficult to meet the heat dissipation requirements of high-power optical modules.

[0016] 2. Because the cooling pipes of each heat dissipation unit are spirally coiled multiple times in the longitudinal direction, and the coolant of each heat dissipation unit is directly delivered to the bottom position of the heat dissipation mechanism to contact the optical module for heat conduction, and then flows upward along the cooling pipes and is discharged, the heat is conducted from the housing of the optical module to the bottom loop of the cooling pipe through contact, and is conducted upward along the pipe spiral, and also along the contact position of the two adjacent loops of pipe. Therefore, the heat generated by the optical module can be quickly conducted from the bottom to the top of each heat dissipation unit, and the coolant reaches the bottom of the heat dissipation mechanism to carry away the heat of the optical module, which accelerates the heat dissipation of the optical module and has a better heat dissipation effect.

[0017] 3. Since the first, second, and third heat dissipation units dissipate heat independently, the temperature and pumping pressure of the coolant in the first, second, and third external water pumps can be adjusted according to the heat density of the optical module area that each heat dissipation unit contacts. This changes the flow rate and temperature of the coolant in each heat dissipation unit, thereby adjusting the heat conduction rate of each heat dissipation unit, controlling the temperature of each area of ​​the optical module housing, and achieving a temperature balance in each area to achieve the best heat dissipation effect.

[0018] 4. The heat dissipation mechanism of this application is small in size and is installed in the existing space between the switch and the optical module for heat dissipation. Multiple heat dissipation units are integrated in the extremely small heat dissipation mechanism, making full use of the internal space of the heat dissipation mechanism for rapid heat conduction. It has a large heat dissipation area and good heat conduction effect, which can meet the heat dissipation needs of various high-power optical modules. Attached Figure Description

[0019] Figure 1 This is a front view schematic diagram of a water-cooled heat dissipation mechanism for an optical module according to the present invention; Figure 2 This is an exploded view of a water-cooled heat dissipation mechanism for an optical module according to the present invention. Figure 3 This is a three-dimensional schematic diagram of a water-cooled heat dissipation mechanism for an optical module according to the present invention; Figure 4 This is a top view schematic diagram of a water-cooled heat dissipation mechanism for an optical module according to the present invention; Figure 5This is a cross-sectional schematic diagram of a water-cooled heat dissipation mechanism for an optical module according to the present invention; Figure 6 This is a bottom view schematic diagram of a water-cooled heat dissipation mechanism for an optical module according to the present invention; Figure 7 This is an enlarged schematic diagram of the third heat dissipation unit of a water-cooled heat dissipation mechanism for an optical module according to the present invention; Figure 8 This is a schematic diagram illustrating the assembly and use of a water-cooled heat dissipation mechanism for an optical module according to the present invention.

[0020] Explanation of reference numerals in the attached figures: 1. Outer ring radiator; 11. Heat dissipation ridge; 2. Spiral radiator; 201. Heat conductor; 202. Cooling pipe; 2021. Water inlet; 2022. Water outlet; 21. First heat dissipation unit; 22. Second heat dissipation unit; 23. Third heat dissipation unit; 24. First heat insulation element; 25. Second heat insulation material; 26. Thermal paste; 3. Electric lifting device; 100. Heat dissipation mechanism; 200. Switch; 300. Optical module. Detailed Implementation

[0021] To better explain and facilitate understanding of the present invention, a detailed description of the invention is provided below with reference to the accompanying drawings and specific embodiments. In this document, directional terms such as "upper" and "lower" are used interchangeably with other directional terms. Figure 3 Taking the orientation as a reference, the end where the water inlet 2021 is located is "up", the opposite end is "down", the direction where the first heat dissipation unit 21 is located is "inner", and the direction where the outer ring heat sink 1 is located is "outer".

[0022] This invention proposes a water-cooled heat dissipation mechanism for optical modules, installed in a switch. Its lower surface is used to contact and conduct heat generated by the optical module during operation. The mechanism includes a spiral heat sink and an outer ring heat sink. The spiral heat sink is installed within the outer ring heat sink, with its outer wall fitting against the inner wall of the outer ring heat sink for heat conduction. The spiral heat sink includes multiple heat dissipation units, nested sequentially from the inside out, each dissipating heat independently, with adjacent units insulated from each other. Each heat dissipation unit includes a cooling pipe, which spirals longitudinally multiple times, with adjacent turns contacting each other. One end of the cooling pipe is connected to an external water pump, and the other end is connected to an external cooling device. Compared to existing technologies, this heat dissipation mechanism forms multiple independent heat dissipation centers in a very small space, resulting in a larger heat dissipation area and better heat conduction. This solves the technical problem that existing optical module heat dissipation mechanisms have unsatisfactory heat dissipation effects and cannot meet the heat dissipation requirements of high-power optical modules.

[0023] To better understand the above technical solutions, exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present invention are shown in the drawings, it should be understood that the present invention can be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that the present invention can be understood more clearly and thoroughly, and that the scope of the present invention can be fully conveyed to those skilled in the art.

[0024] Reference Figures 1 to 8 This embodiment provides a water-cooled heat dissipation mechanism for an optical module. The heat dissipation mechanism 100 is installed in the switch 200. Its lower surface is used to contact and conduct the heat generated by the optical module 300 during operation. It includes a spiral heat sink 2 and an outer ring heat sink 1. The spiral heat sink 2 is installed in the outer ring heat sink 1, and its outer wall is attached to the inner wall of the outer ring heat sink 1 for heat conduction.

[0025] See Figure 2 and Figure 3 The spiral radiator 2 is provided with a first heat dissipation unit 21, a second heat dissipation unit 22 and a third heat dissipation unit 23 from the inside to the outside. The first heat dissipation unit 21, the second heat dissipation unit 22 and the third heat dissipation unit 23 have the same structure and their overall shape is cylindrical. The diameter of the cylindrical shape increases sequentially. The second heat dissipation unit 22 is sleeved on the first heat dissipation unit 21 and the third heat dissipation unit 23 is sleeved on the second heat dissipation unit 22. The three heat dissipate heat independently and the adjacent heat dissipation units are insulated from each other, forming three independent heat dissipation centers.

[0026] In actual production applications, the number of heat dissipation units in the spiral radiator 2 can be flexibly set according to actual heat dissipation needs, such as two, three, or four. In this embodiment, three heat dissipation units are used as an example: the first heat dissipation unit 21, the second heat dissipation unit 22, and the third heat dissipation unit 23.

[0027] See Figure 2 and Figure 7 The first heat dissipation unit 21, the second heat dissipation unit 22, and the third heat dissipation unit 23 all include a cooling pipe 202 and a heat conductor 201. The cooling pipe 202 is spirally wound multiple times in the longitudinal direction, and two adjacent longitudinal turns are in contact with each other. Therefore, the cooling pipe 202 as a whole forms a cylindrical structure, and the heat conductor 201 wraps around the surface of this cylindrical structure.

[0028] The two adjacent coils of cooling pipe 202 are in contact with each other. This serves two purposes: firstly, it allows for direct heat conduction between the adjacent coils, enabling vertical upward heat transfer with a shorter path, facilitating faster heat transfer from the bottom to the top of the heat dissipation unit and accelerating heat transfer to the optical module 300; secondly, it maximizes space utilization. With the volume of the spiral heat sink 2 remaining constant, the cooling pipe 202 in each heat dissipation unit can coil more times, allowing heat to be transferred spirally upwards along the pipes. This increases the contact area between the coolant and the pipes, resulting in more thorough contact and allowing the coolant to remove more heat per unit time. Based on this three-dimensional spiral structure of the cooling pipe 202, the heat from the optical module can be quickly conducted to the cooling pipe 202, allowing the coolant to quickly remove the heat, thus improving the heat dissipation effect of the heat dissipation unit. In other words, this application first rapidly conducts the heat from the optical module 300 to the three-dimensional spiral structure of the cooling pipe 202, and then the coolant removes the heat, resulting in higher overall heat dissipation efficiency of the heat dissipation unit. It is understandable that the name "spiral radiator 2" does not limit the overall shape of the radiator to a spiral shape, but rather limits the radiator's heat dissipation principle to provide a larger heat dissipation area and a shorter heat conduction path by spirally delivering coolant and spiral cooling pipes. The outer wall of the spiral radiator 2 is the heat conductor 201 of the outermost third heat dissipation unit 23.

[0029] One end of the cooling pipe 202 is connected to an external water pump, and the other end is connected to an external cooling device. Coolant continuously flows from the external water pump into the cooling pipe 202 and is discharged into the external cooling device. After being cooled to a preset temperature in the external cooling device, the coolant is returned to the external water pump. The coolant can be distilled water or other liquids with good thermal conductivity. The external cooling device uses commercially available cooling and refrigeration components, which can cool the coolant to the preset temperature. During the flow of the coolant in the cooling pipe 202, it carries away the heat generated by the optical module 300 during operation, achieving rapid heat dissipation from the optical module 300.

[0030] To clearly illustrate the winding path of the cooling pipe 202, in Figure 2 and Figure 7 The heat conductor 201 is represented by a dashed line. Figures 3 to 6The heat conductor 201 is not shown. The heat conductor 201 encloses the cooling pipe 202 and is cylindrical in shape, with an inner hole for accommodating another heat dissipation unit within it. The heat conductor 201 is made of either pure copper or thermally conductive silicone. During production, when the heat conductor 201 is made of pure copper, the cooling pipe 202 and the heat conductor 201 are 3D printed, meaning that each heat dissipation unit is entirely 3D printed. When the heat conductor 201 is made of thermally conductive silicone, thermally conductive silicone is injection molded onto the outer surface of the 3D-printed cooling pipe 202. After the thermally conductive silicone cures, an integrated structure of the cooling pipe 202 and the heat conductor 201 is obtained. This integrated structure is cylindrical, meaning the heat conductor 201 has a cylindrical shape.

[0031] In some feasible solutions, the bottom surface of the heat conductor 201 is flush with the bottom surface of the lowest ring of the cooling pipe 202, and the lowest ring of the cooling pipe 202 and the heat conductor 201 are in direct contact with the optical module 300. Therefore, the lower surface of the heat dissipation mechanism 100 includes the lower surface of the heat conductor 201 of each heat dissipation unit and the bottom surface of the lowest ring of the cooling pipe 202, as well as the lower surface of the outer ring heat sink 1. These areas together constitute the contact surface with the optical module 300.

[0032] In some feasible solutions, the bottom ring of the cooling pipe 202 is recessed upward relative to the heat conductor 201, and only the bottom surface of the heat conductor 201 can directly contact the optical module; therefore, the lower surface of the heat dissipation mechanism 100 includes the lower surface of the heat conductor 201 of each heat dissipation unit, as well as the lower surface of the outer ring heat sink 1, and these areas together constitute the contact surface with the optical module 300.

[0033] See Figures 3 to 7The cooling pipe 202 has an inlet 2021 and an outlet 2022, which are located above the spiral radiator 2. The inlet 2021 connects to an external water pump, and the outlet 2022 connects to an external cooling device. The coolant flows directly from the inlet 2021 to the area at the bottom of the spiral radiator 2 that contacts the optical module 300 housing, then spirals upwards from bottom to top, exiting through the outlet 2022 into the external cooling device. The low-temperature coolant directly reaches the area where the heat dissipation mechanism 100 contacts the optical module 300 (i.e., the area with the highest temperature), resulting in better, more direct, and efficient heat dissipation for the optical module 300. The two adjacent loops of the cooling pipe 202 conduct heat through direct contact and also through the heat conductor 201. The heat from the optical module 300 is conducted to the lowest ring of the cooling pipes 202 and spirals upwards along the pipes. Simultaneously, heat is conducted from the next ring of pipes to the previous ring through direct contact and the heat conductor 201. Overall, heat is conducted upwards from the bottom of each heat dissipation unit. All three heat dissipation units use copper pipes of the same size, meaning the outer diameter of the cooling pipes 202 in all three units is the same. The cooling pipes 202 in the first heat dissipation unit 21 spiral clockwise from bottom to top, the cooling pipes 202 in the second heat dissipation unit 22 spiral counterclockwise from bottom to top, and the cooling pipes 202 in the third heat dissipation unit 23 spiral clockwise from bottom to top. This means the spiral flow direction of the coolant in adjacent heat dissipation units is opposite, suppressing and counteracting vibrations caused by the external water pump supply. This ensures smoother operation of the entire spiral radiator 2, preventing vibrations from affecting the optical path alignment of the optical module 300 and ensuring stable operation of the optical module 300.

[0034] Therefore, it can be seen that the cooling pipe 202 is spirally coiled in three dimensions and wrapped and fixed by the heat conductor 201 to form a complete three-dimensional heat dissipation unit. The heat of the optical module 300 is conducted to each heat dissipation unit. The cooling pipe 202 is not only a heat conduction device, but also a pipe through which the coolant flows and carries away the heat.

[0035] It should be noted that the first heat dissipation unit 21, the second heat dissipation unit 22 and the third heat dissipation unit 23 dissipate heat independently of each other.

[0036] On the one hand, refer to Figure 3The cooling pipes 202 of the first heat dissipation unit 21, the second heat dissipation unit 22, and the third heat dissipation unit 23 are independent of each other. The first heat dissipation unit 21 is supplied with coolant by a first external water pump, the second heat dissipation unit 22 by a second external water pump, and the third heat dissipation unit 23 by a third external water pump. These external water pumps are independent of each other. Therefore, the coolant in the first heat dissipation unit 21, the second heat dissipation unit 22, and the third heat dissipation unit 23 dissipates heat independently without interference. Three external cooling devices can be provided, or only one can be provided.

[0037] Secondly, see Figure 2 and Figure 5 A first heat-insulating body 24 is provided between the first heat dissipation unit 21 and the second heat dissipation unit 22, and a second heat-insulating body 25 is provided between the second heat dissipation unit 22 and the third heat dissipation unit 23, so that the first heat dissipation unit 21, the second heat dissipation unit 22, and the third heat dissipation unit 23 can dissipate heat independently of each other and do not conduct heat to each other. The first heat dissipation unit 21, the first heat-insulating body 24, the second heat dissipation unit 22, the second heat-insulating body 25, the third heat dissipation unit 23, and the outer ring radiator 1 are sequentially nested together and tightly fitted together to form a whole. The first heat-insulating body 24 and the second heat-insulating body 25 are usually made of elastic heat-insulating materials, such as rubber.

[0038] Since the first heat dissipation unit 21, the second heat dissipation unit 22, and the third heat dissipation unit 23 dissipate heat independently, the temperature of the coolant in the first external water pump, the second external water pump, and the third external water pump and the operating parameters of each water pump can be adjusted according to the heat density of the corresponding contact area of ​​the optical module 300. This changes the flow rate, unit flow rate, and temperature of the coolant in each heat dissipation unit, thereby adjusting the heat conduction rate of each heat dissipation unit, controlling the operating temperature of each area of ​​the optical module 300, and achieving a temperature balance in each area to achieve the best heat dissipation effect.

[0039] By employing independent first heat dissipation unit 21, second heat dissipation unit 22, and third heat dissipation unit 23, the top surface of the optical module 300 housing is cooled in zones. This effectively prevents the formation of "hot spots" due to high heat density caused by the integration of various heat-generating chips in a certain area, ensuring that the temperature of each area of ​​the optical module 300 is more uniform and achieving balanced heat dissipation. Furthermore, the use of independent first heat dissipation unit 21, second heat dissipation unit 22, and third heat dissipation unit 23 forms multiple independent three-dimensional heat dissipation centers. This allows each area of ​​the top surface of the optical module 300 housing to contact the low-temperature coolant supplied by the external water pump, rather than contacting coolant already carrying heat that has flowed through a certain area of ​​the optical module 300 housing. Since the contact area between the optical module 300 and the heat dissipation mechanism 100 cannot be changed, this contact surface is fully utilized, transforming planar heat conduction into three-dimensional heat conduction. This fully utilizes the internal space of the heat dissipation mechanism 100, resulting in a larger heat dissipation area and better heat conduction. The contact surface between the optical module 300 and the heat dissipation mechanism 100 is the collection of the areas of the optical module 300 that each heat dissipation unit contacts.

[0040] In practical applications, the contact surface between the optical module 300 and the heat dissipation mechanism 100 is coated with a thermally conductive layer, which can be diamond thermal paste 26 or other materials with good thermal conductivity. The optical module 300 is equipped with an external optical module cage.

[0041] See Figure 3 The bottom wall of the outer ring heat sink 1 is in contact with the optical module 300 for heat conduction, and its inner wall is in contact with the third heat dissipation unit 23 for heat conduction. Its outer wall is uniformly provided with multiple heat dissipation protrusions 11, which further increases the heat dissipation area of ​​the third heat dissipation unit 23 and improves the heat dissipation efficiency of the third heat dissipation unit 23. The overall heat dissipation effect of the heat dissipation mechanism 100 is better.

[0042] The cooling pipe 202 and the outer ring radiator 1 are made of pure copper, but other materials with good thermal conductivity can also be used.

[0043] See Figure 2 and Figure 3 In actual production, the first heat dissipation unit 21, the second heat dissipation unit 22, and the third heat dissipation unit 23 are all integrally formed using pure copper as raw material through 3D printing technology; alternatively, the first heat dissipation unit 21, the second heat dissipation unit 22, and the third heat dissipation unit 23 are made by wrapping thermally conductive silicone around a cylindrical cooling pipe 202, which is then solidified to form an integrated structure. The first heat dissipation unit 21, the first heat insulation body 24, the second heat dissipation unit 22, the second heat insulation body 25, the third heat dissipation unit 23, and the outer ring heat sink 1 are sequentially nested from the inside out and encapsulated and fixed together to form a whole. To clearly demonstrate the internal structure of the heat dissipation mechanism 100, Figure 3 The image shows the heat dissipation mechanism 100 in its unsealed state.

[0044] See Figure 8 The heat dissipation mechanism 100 also includes an electric lifting device 3. The upper end of the electric lifting device 3 is connected to the inner wall of the switch 200, and its lower end is connected to the cooling pipe 202. The electric lifting device 3 moves longitudinally to change the height of the heat dissipation mechanism 100 in the switch 200, so that the heat dissipation mechanism 100 is in close contact with the optical module 300 or is released from contact with the optical module 300.

[0045] It should be noted that the electric lifting device 3 is equipped with a pressure sensor. When the area on the surface of the switch 200 opposite to the electric lifting device 3 is pressed, the pressure sensor converts the external pressure into an electrical signal and transmits it to the electric lifting device 3, causing the electric lifting device 3 to move upward. This causes the heat dissipation mechanism 100 to move upward and detach from the optical module 300, at which point the optical module 300 can be pulled out. Pressing the area on the surface of the switch 200 opposite to the electric lifting device 3 again causes the electric lifting device 3 to move downward, causing the heat dissipation mechanism 100 to move downward and come into tight contact with the optical module 300. The electric lifting device 3 uses existing technology and will not be described in detail here.

[0046] The heat dissipation mechanism 100 employs three independently operating heat dissipation units: a first heat dissipation unit 21, a second heat dissipation unit 22, and a third heat dissipation unit 23. These units conduct heat to the top surface of the optical module 300 housing in designated zones. The temperature of the coolant in the external water pump can be measured, and the temperature of the coolant pumped into each heat dissipation unit can be adjusted as needed to change the heat conduction and efficiency of one or all of the heat dissipation units, meeting the heat dissipation requirements of various types of high-power optical modules 300. Each heat dissipation unit uses a longitudinally spirally wound cooling pipe 202 to contact the optical module 300 and conduct heat. The liquid coolant actively carries away heat through the cooling pipe 202, conducting heat to the corresponding area of ​​the optical module 300. The heat generated by the optical module 300 reaches the heat conductor 201 and the cooling pipe 202, and is conducted longitudinally along each heat dissipation unit. The heat conduction speed of each heat dissipation unit is faster, resulting in a better heat dissipation effect for the heat dissipation mechanism 100. Compared to existing technologies, it can dissipate the heat generated by the optical module 300 more quickly. The heat dissipation mechanism 100 of this application adopts a scheme of spiral winding of cooling pipe 202 and layer-by-layer nesting of heat dissipation units. The overall size is small and can be installed in the original space between the switch 200 and the optical module 300 for heat dissipation. Multiple heat dissipation units are integrated in the extremely small heat dissipation mechanism 100, making full use of the internal space of the heat dissipation mechanism 100 for rapid heat conduction. The heat dissipation area is large and the heat conduction effect is good.

[0047] In the description of this invention, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0048] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0049] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first and second features are in direct contact, or that they are in indirect contact through an intermediate medium. Furthermore, "above," "over," or "on top" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," or "beneath" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0050] In the description of this specification, the terms "one embodiment," "some embodiments," "embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0051] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make modifications, alterations, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A water-cooled heat dissipation mechanism for an optical module, characterized in that: The heat dissipation mechanism (100) is installed in the switch (200), and its lower surface is used to contact and conduct the heat generated by the optical module (300) during operation. The heat dissipation mechanism (100) includes a spiral heat sink (2) and an outer ring heat sink (1). The spiral heat sink (2) is installed in the outer ring heat sink (1), and its outer wall is attached to the inner wall of the outer ring heat sink (1) for heat conduction. The spiral radiator (2) includes multiple heat dissipation units, each heat dissipation unit is nested together from the inside out and dissipates heat independently, and two adjacent heat dissipation units are insulated from each other; Each heat dissipation unit includes a cooling pipe (202), which is spirally wound multiple times in the longitudinal direction, and two adjacent turns are in contact with each other to conduct heat. One end of the cooling pipe (202) is connected to an external water pump, and the other end is connected to an external cooling device.

2. The optical module water-cooling heat dissipation mechanism as described in claim 1, characterized in that: The cooling pipe (202) is provided with an inlet (2021) and an outlet (2022). The inlet (2021) and the outlet (2022) are both located above the spiral radiator (2). The inlet (2021) is connected to the external water pump, and the outlet (2022) is connected to the external cooling device. The coolant from the external water pump enters the cooling pipe (202) from the inlet (2021) and is discharged from the outlet (2022), carrying away the heat generated by the optical module (300) during operation. The external cooling device is connected to the external water pump.

3. The optical module water-cooling heat dissipation mechanism as described in claim 1, characterized in that: The spiral radiator (2) includes a first heat dissipation unit (21), a second heat dissipation unit (22) and a third heat dissipation unit (23). The cooling pipes (202) of the first heat dissipation unit (21), the second heat dissipation unit (22) and the third heat dissipation unit (23) are respectively supplied with coolant by corresponding external water pumps.

4. The optical module water-cooling heat dissipation mechanism as described in claim 3, characterized in that: A first heat insulation body (24) is provided between the first heat dissipation unit (21) and the second heat dissipation unit (22), and a second heat insulation body (25) is provided between the second heat dissipation unit (22) and the third heat dissipation unit (23), so that the first heat dissipation unit (21), the second heat dissipation unit (22) and the third heat dissipation unit (23) can dissipate heat independently and do not conduct heat to each other.

5. The optical module water-cooling heat dissipation mechanism as described in claim 1, characterized in that: The outer ring radiator (1) has a plurality of heat dissipation protrusions (11) evenly distributed on its outer wall.

6. The optical module water-cooling heat dissipation mechanism as described in claim 3, characterized in that: The first heat dissipation unit (21), the second heat dissipation unit (22) and the third heat dissipation unit (23) are all integrally formed using 3D printing technology.

7. The optical module water-cooling heat dissipation mechanism as described in claim 3, characterized in that: The external water pump pumps the low-temperature coolant to the cooling pipe (202) near the optical module (300), and the coolant flows spirally upward along the cooling pipe (202) and is discharged.

8. The optical module water-cooling heat dissipation mechanism as described in claim 1, characterized in that: It also includes an electric lifting device (3), the upper end of which is connected to the switch (200), and the lower end of which is connected to the cooling pipe (202). The electric lifting device (3) moves longitudinally to change the height of the heat dissipation mechanism (100) in the switch (200) so that the heat dissipation mechanism (100) is tightly attached to the optical module (300) or detached from the optical module (300).

Images