Wafer performance nondestructive testing device

Abstract

The invention discloses a wafer performance non-destructive testing device, and relates to the technical field of performance non-destructive testing, the wafer performance non-destructive testing device comprises a testing box, an opening is formed in the side wall of the top end of the testing box, and a baffle is movably connected to the interior of the corresponding opening; the inner wall of the top end of the detection box is provided with a performance detection assembly used for detecting the performance of the inner walls of the four-side wafers. A first round rod can be driven to rotate through a third motor, the inclination angles of a mounting plate and a vacuum suction cup can be accurately adjusted to be completely matched with the inclination angles of the outer walls of the wafers on the four sides, self-adaptive positioning of the wafers on the outer walls with different inclination angles is achieved in cooperation with stable pushing of a third electric telescopic rod and uniform adsorption of the vacuum suction cup, and the positioning precision is high. Stress damage caused by mechanical clamping is avoided, meanwhile, it is ensured that the wafer is free of displacement and scratches in the positioning process through a vacuum adsorption mode, and it is ensured that the original performance of the wafer is not affected.

Description

Technical Field

[0001] This invention belongs to the field of non-destructive testing technology, and particularly relates to a non-destructive testing device for wafer performance. Background Technology

[0002] In the field of chip manufacturing and application, due to the special structural design of four-sided wafers, the detection of defects on the inner wall surface and optical performance is a key link to ensure product quality.

[0003] In existing optical inspection devices, custom-made positioning fixtures are often required for structures with tilted outer walls on all four sides of a wafer and tilted fixing blocks. These fixtures have poor adaptability and are prone to damaging the wafer. Furthermore, differences in the tilt angle of the fixing blocks and the arrangement of the mounting screw holes lead to frequent replacement of the fixing components, making the operation cumbersome and inefficient. In terms of inspection, traditional devices mostly rely on single-dimensional adjustment, making it difficult to achieve full coverage inspection of the inner walls of the wafer on all four sides, which easily creates blind spots. In addition, in existing technologies, surface defect inspection and optical performance inspection often need to be completed by separate equipment, resulting in a fragmented process and cumbersome data integration. At the same time, errors can easily be introduced during the inspection process due to human intervention, making it difficult to adapt to the high-efficiency inspection requirements of industrial mass production.

[0004] To address these issues, we propose a non-destructive testing device for wafer performance. Summary of the Invention

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A non-destructive testing device for wafer performance includes a testing box. The top side wall of the testing box has an opening, and a baffle is movably connected to the opening. The top inner wall of the testing box has a performance testing component for testing the performance of the inner walls of the four wafers. The inner walls at both ends of the testing box are fixedly connected to positioning components for adsorbing and positioning the outer walls of the four wafers. The inner wall at the bottom of the testing box has a fixing component for fixing the inner walls of the mounting screw holes on the inner walls of the fixing blocks on both sides of the four wafers.

[0007] Preferably, the performance testing component includes a first groove formed on the top side wall of the testing box, a first electric slide rail fixedly connected to the inner wall of the first groove, a first slide plate slidably connected to the bottom side wall of the first electric slide rail, a second electric slide rail fixedly connected to the bottom side wall of the first slide plate, and a second slide plate slidably connected to the bottom side wall of the second electric slide rail.

[0008] Preferably, a first motor is fixedly connected to the bottom side wall of the second slide plate, a first electric telescopic rod is fixedly connected to the output end of the first motor, a mounting frame is fixedly connected to the telescopic end of the first electric telescopic rod, and a rotating rod is rotatably connected to the inner wall of the mounting frame.

[0009] Preferably, a second motor is fixedly connected to the side wall of the mounting frame, and the output end of the second motor passes through the side wall of the mounting frame and is fixedly connected to one end of the rotating rod. Two second electric telescopic rods are symmetrically fixedly connected to the rod wall of the rotating rod. A laser interference sensor is fixedly connected to the telescopic end of one of the second electric telescopic rods, and a fiber optic spectral sensor is fixedly connected to the telescopic end of the other second electric telescopic rod.

[0010] Preferably, the positioning component includes two third electric telescopic rods symmetrically and fixedly connected to the inner walls of both ends of the detection box. The telescopic ends of the third electric telescopic rods are all fixedly connected to a U-plate, and the inner wall of the U-plate is rotatably connected to a first round rod.

[0011] Preferably, a third motor is fixedly connected to the side wall of the U-plate, the output end of the third motor passes through the side wall of the U-plate and is fixedly connected to one end of the first round rod, a connecting rod is fixedly connected to the rod wall of the first round rod, a mounting plate is fixedly connected to one end of the connecting rod, and multiple vacuum suction cups are fixedly connected to the side wall of the mounting plate.

[0012] Preferably, the fixing component includes two second grooves symmetrically opened on the inner wall of the bottom of the detection box, the inner wall of each second groove is fixedly connected to a third electric slide rail, the top side wall of each third electric slide rail is slidably connected to a third sliding plate, and the top side wall of each third sliding plate is fixedly connected to a support rod.

[0013] Preferably, one end of the support rod is fixedly connected to a connecting frame, and two second round rods are symmetrically rotatably connected to the inner wall of the connecting frame. Two fourth motors are symmetrically fixedly connected to the side walls of the connecting frame, and the output ends of the fourth motors pass through the side walls of the connecting frame and are fixedly connected to one end of the corresponding second round rod.

[0014] Preferably, a fourth electric telescopic rod is fixedly connected to the wall of the second round rod, and a fourth electric slide rail is fixedly connected to the telescopic end of the fourth electric telescopic rod. Multiple fourth slide plates are slidably connected to the side wall of the fourth electric slide rail.

[0015] Preferably, a fifth electric telescopic rod is fixedly connected to the side wall of the fourth slide plate, a connecting block is fixedly connected to the telescopic end of the fifth electric telescopic rod, a sixth electric telescopic rod is fixedly connected to the inner wall of both ends of the connecting block, and a locking block is fixedly connected to the telescopic end of the sixth electric telescopic rod.

[0016] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0017] The performance detection, positioning, and fixing components, driven by a third motor, allow for precise adjustment of the tilt angles of the mounting plate and vacuum suction cup, ensuring perfect alignment with the tilt angles of the four wafer outer walls. Combined with the smooth pushing of the third electric telescopic rod and the uniform adsorption of the vacuum suction cup, adaptive positioning of wafers with different tilt angles is achieved, avoiding stress damage from mechanical clamping. Simultaneously, the vacuum adsorption method ensures no wafer displacement or scratches during positioning, preserving the original performance of the wafer. The third electric slide rail adjusts the position of the connecting frame, the fourth motor adjusts the tilt angle of the fourth electric slide rail, the fourth electric telescopic rod adjusts the insertion depth, and the fourth electric slide rail adjusts the lateral position of the locking block. This multi-dimensional coordinated action precisely adapts to fixing blocks with different tilt angles and mounting screw holes with different arrangements, eliminating the need for manual replacement of fixing components. The sixth electric telescopic rod drives the locking block to securely clamp the inner wall of the mounting screw hole, achieving dual fixation of the fixing block and wafer. This significantly improves the device's versatility for wafers of different specifications. Furthermore, the first electric slide rail (X-axis) and the second electric slide rail (Y-axis) can also be used for positioning. The device employs a dual-axis linkage (Z-axis) to achieve precise planar adjustment of the detection position; flexible adjustment of the detection height is achieved via a first electric telescopic rod (Z-axis); the first motor drives the mounting frame to rotate around the Z-axis, enabling switching detection of each inner wall surface of the four wafers; a second motor drives a rotating rod to adjust the detection angles of the laser interferometer and fiber optic spectroscopy sensor, ensuring the detection end is perpendicular to the wafer surface. This multi-dimensional adjustment and coordinated operation achieves full coverage detection of wafer inner wall surface defects and optical performance, eliminating blind spots and ensuring comprehensive detection results. Furthermore, all motors, electric slide rails, and telescopic rods in this invention are precisely controlled by a control system, exhibiting clear motion logic and strong coordination. The connection structure of each component is robust, eliminating the risk of mechanical interference during operation. The enclosed detection environment further ensures the stability of the equipment operation, avoiding detection interruptions caused by external environmental factors. It also enables simultaneous detection of wafer surface defects and optical performance, avoiding the need for separate equipment to perform two types of detection. This adapts to the batch and continuous detection needs in industrial production, enhancing the industrial applicability of the device. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0019] Figure 2 This is a partial structural diagram of the present invention. Figure 1 ;

[0020] Figure 3 This is a partial structural diagram of the present invention. Figure 2 ;

[0021] Figure 4 This is a partial structural diagram of the present invention. Figure 3 ;

[0022] Figure 5 This is a partial structural diagram of the present invention. Figure 4 ;

[0023] Figure 6 This is a partial structural diagram of the present invention. Figure 5 ;

[0024] Figure 7 This is a partial structural diagram of the present invention. Figure 6 .

[0025] In the diagram: 1. Testing box; 2. Baffle; 3. Performance testing component; 31. First groove; 32. First electric slide rail; 33. First slide plate; 34. Second electric slide rail; 35. Second slide plate; 36. First motor; 37. First electric telescopic rod; 38. Mounting frame; 39. Rotating rod; 310. Second motor; 311. Second electric telescopic rod; 312. Laser interferometer sensor; 313. Fiber optic spectral sensor; 4. Positioning component; 41. Third electric telescopic rod; 42. U-plate; 43. First round rod; 44. Third motor; 45. Connecting rod; 46. Mounting plate; 47. Vacuum suction cup; 5. Fixing assembly; 51. Second groove; 52. Third electric slide rail; 53. Third sliding plate; 54. Support rod; 55. Connecting frame; 56. Second round rod; 57. Fourth motor; 58. Fourth electric telescopic rod; 59. Fourth electric slide rail; 510. Fourth sliding plate; 511. Fifth electric telescopic rod; 512. Connecting block; 513. Sixth electric telescopic rod; 514. Locking block. Detailed Implementation

[0026] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0027] The following electrical components are all electrically connected to the external PLC controller.

[0028] Reference Figures 1-7 A non-destructive testing device for wafer performance includes a testing box 1. The top side wall of the testing box 1 has an opening, and a baffle 2 is movably connected to the opening. The top inner wall of the testing box 1 has a performance testing component 3 for testing the performance of the inner walls of the four wafers. The inner walls at both ends of the testing box 1 are fixedly connected to positioning components 4 for adsorbing and positioning the outer walls of the four wafers. The bottom inner wall of the testing box 1 has a fixing component 5 for fixing the inner walls of the mounting screw holes opened on the inner walls of the fixing blocks on both sides of the four wafers.

[0029] In this embodiment, the performance testing component 3 includes a first groove 31 opened on the top side wall of the testing box 1, a first electric slide rail 32 fixedly connected to the inner wall of the first groove 31, a first slide plate 33 slidably connected to the bottom side wall of the first electric slide rail 32, a second electric slide rail 34 fixedly connected to the bottom side wall of the first slide plate 33, and a second slide plate 35 slidably connected to the bottom side wall of the second electric slide rail 34.

[0030] The bottom side wall of the second slide plate 35 is fixedly connected to the first motor 36, the output end of the first motor 36 is fixedly connected to the first electric telescopic rod 37, the telescopic end of the first electric telescopic rod 37 is fixedly connected to the mounting frame 38, and the inner wall of the mounting frame 38 is rotatably connected to the rotating rod 39.

[0031] A second motor 310 is fixedly connected to the side wall of the mounting frame 38. The output end of the second motor 310 passes through the side wall of the mounting frame 38 and is fixedly connected to one end of the rotating rod 39. Two second electric telescopic rods 311 are symmetrically fixedly connected to the rod wall of the rotating rod 39. A laser interference sensor 312 is fixedly connected to the telescopic end of one of the second electric telescopic rods 311, and a fiber optic spectral sensor 313 is fixedly connected to the telescopic end of the other second electric telescopic rod 311.

[0032] Specifically, the planar adjustment of the detection position is achieved through the dual-axis linkage of the first electric slide rail 32 (X-axis) and the second electric slide rail 34 (Y-axis); the detection height is flexibly adjusted through the first electric telescopic rod 37 (Z-axis); the first motor 36 drives the mounting frame 38 to rotate around the Z-axis, enabling switching detection of each inner wall surface of the four wafers; the second motor 310 drives the rotating rod 39 to adjust the detection angle of the laser interference sensor 312 and the fiber optic spectral sensor 313, ensuring that the detection end is perpendicular to the wafer surface. This multi-dimensional adjustment and coordination achieves full coverage detection of defects and optical properties on the inner wall surface of the wafer, with no blind spots, ensuring the comprehensiveness of the detection results.

[0033] In this embodiment, the positioning component 4 includes two third electric telescopic rods 41 that are symmetrically and fixedly connected to the inner walls of both ends of the detection box 1. The telescopic ends of the third electric telescopic rods 41 are all fixedly connected to U-plates 42, and the inner walls of the U-plates 42 are rotatably connected to first round rods 43.

[0034] A third motor 44 is fixedly connected to the side wall of the U-plate 42. The output end of the third motor 44 passes through the side wall of the U-plate 42 and is fixedly connected to one end of the first round rod 43. A connecting rod 45 is fixedly connected to the rod wall of the first round rod 43. A mounting plate 46 is fixedly connected to one end of the connecting rod 45. Multiple vacuum suction cups 47 are fixedly connected to the side wall of the mounting plate 46.

[0035] Specifically, the first round rod 43 can be driven to rotate by the third motor 44, which can precisely adjust the tilt angle of the mounting plate 46 and the vacuum suction cup 47 so that they are perfectly matched with the tilt angle of the four-sided wafer outer wall. Combined with the smooth push of the third electric telescopic rod 41 and the uniform adsorption of the vacuum suction cup 47, adaptive positioning of wafers with different tilt angles can be achieved, avoiding stress damage caused by mechanical clamping. At the same time, the vacuum adsorption method ensures that the wafer is not displaced or scratched during the positioning process, ensuring that the original performance of the wafer is not affected.

[0036] In this embodiment, the fixing component 5 includes two second grooves 51 symmetrically opened on the inner wall of the bottom end of the detection box 1. The inner wall of each second groove 51 is fixedly connected to a third electric slide rail 52. The top side wall of each third electric slide rail 52 is slidably connected to a third sliding plate 53. The top side wall of the third sliding plate 53 is fixedly connected to a support rod 54.

[0037] One end of the support rod 54 is fixedly connected to a connecting frame 55. The inner wall of the connecting frame 55 is symmetrically rotatably connected to two second round rods 56. The side walls of the connecting frame 55 are symmetrically fixedly connected to two fourth motors 57. The output ends of the fourth motors 57 pass through the side walls of the connecting frame 55 and are fixedly connected to one end of the corresponding second round rod 56.

[0038] The second round rod 56 is fixedly connected to the wall of the rod with a fourth electric telescopic rod 58, and the telescopic end of the fourth electric telescopic rod 58 is fixedly connected to a fourth electric slide rail 59. Multiple fourth slide plates 510 are slidably connected to the side wall of the fourth electric slide rail 59.

[0039] The side walls of the fourth slide plate 510 are all fixedly connected to the fifth electric telescopic rod 511. The telescopic ends of the fifth electric telescopic rod 511 are all fixedly connected to the connecting block 512. The inner walls of both ends of the connecting block 512 are all fixedly connected to the sixth electric telescopic rod 513. The telescopic ends of the sixth electric telescopic rod 513 are all fixedly connected to the locking block 514.

[0040] Specifically, the third electric slide rail 52 adjusts the position of the connecting frame 55, the fourth motor 57 adjusts the tilt angle of the fourth electric slide rail 59, the fourth electric telescopic rod 58 adjusts the insertion depth, and the fourth electric slide rail 59 adjusts the lateral position of the locking block 514. Through multi-dimensional coordinated action, it can accurately adapt to fixing blocks with different tilt angles and mounting screw holes with different arrangements. There is no need for staff to manually replace the fixing parts. The sixth electric telescopic rod 513 drives the locking block 514 to achieve a stable clamping of the inner wall of the mounting screw hole, completing the dual fixation of the fixing block and the wafer, which greatly improves the versatility of the device for wafers of different specifications.

[0041] The operating principle of the present invention is now described as follows:

[0042] In this invention, the operator smoothly places the four-sided wafer into the testing box 1 through the opening on the top side wall of the testing box 1, and then controls the baffle 2 at the opening to move and close, forming a closed testing environment to avoid interference from external light, dust and other factors on the optical testing accuracy.

[0043] The positioning component 4 is activated for automated positioning. First, the third motor 44 is started. The output of the third motor 44 drives the first round rod 43 to rotate around its own axis. During the rotation of the first round rod 43, the connecting rod 45 and the mounting plate 46 are driven to rotate simultaneously. The vacuum suction cups 47 on the mounting plate 46 adjust their posture synchronously with the mounting plate 46, so that the tilt angle of the mounting plate 46 matches the tilt angle of the corresponding outer wall of the four wafers. When the two angles are perfectly matched, the control system automatically controls the third motor 44 to shut down. Then, the third electric telescopic rod 41 is activated, and its telescopic end pushes the mounting plate 46 to move smoothly towards the outer wall of the four wafers until the suction ends of the multiple vacuum suction cups 47 precisely contact the outer wall of the four wafers. At this time, the multiple vacuum suction cups 47 are controlled to... Suction cup 47 is activated synchronously, using the principle of vacuum negative pressure adsorption to uniformly adsorb the outer walls of the four wafers, achieving stable positioning of the four wafers and ensuring that the wafers do not shift or get damaged during the inspection process. After positioning, the fixing component 5 is activated to fix the fixing blocks on both sides of the four wafers. First, the third electric slide rail 52 is activated, and the third electric slide rail 52 drives the third slide plate 53 to move along the inner wall of the second groove 51. The third slide plate 53 drives the connecting frame 55 to move synchronously through the support rod 54 until the openings on both sides of the connecting frame 55 are precisely aligned with the openings of the four wafers' outer fixing blocks. Then, the fourth motor 57 is activated, and the output end of the fourth motor 57 drives the corresponding second round rod 56 to rotate. During the rotation of the second round rod 56, the fourth motor 57 drives the fourth round rod 56 to rotate. The electric telescopic rod 58 and the fourth electric slide rail 59 rotate synchronously. The tilt angle of the fourth electric slide rail 59 is monitored in real time by the angle sensing unit. When the tilt angle matches the tilt angle of the corresponding fixed block, the fourth motor 57 automatically stops. Then, the fourth electric telescopic rod 58 is started, and its telescopic end pushes the fourth electric slide rail 59 into the opening of the fixed block until the fourth electric slide rail 59 is fully inserted into the opening of the fixed block, and the telescopic end of the fifth electric telescopic rod 511 is precisely aligned with the mounting screw hole opened on the inner wall of the fixed block. Then, the fourth electric slide rail 59 is started, driving multiple fourth slide plates 510 to move along the slide rail direction, so that the connecting block 512 is aligned with the corresponding mounting screw hole. When the connecting block 512 is precisely positioned in the corresponding mounting screw hole, When the fourth electric slide rail 59 stops running, the fifth electric telescopic rod 511 is started, and its telescopic end pushes the connecting block 512 to slowly extend into the corresponding mounting screw hole. After the connecting block 512 reaches the preset fixed position, the sixth electric telescopic rod 513 is started. The telescopic end of the sixth electric telescopic rod 513 drives the locking block 514 to extend towards the inner wall of the mounting screw hole until the locking block 514 is in close contact with the inner wall of the mounting screw hole. The mechanical locking action of the locking block 514 is used to fix the inner wall of the mounting screw hole, thereby completing the double stable fixation of the fixing block and the four-sided chip. There is no need for the staff to change the adapter fixing parts according to the tilt angle of the fixing block and the arrangement of the mounting screw holes. The whole process is automatically adaptive and adjusted, improving the fixing efficiency and accuracy.

[0044] After the wafer is fixed, the performance testing component 3 is activated to perform multi-dimensional non-destructive testing. The specific process is as follows:

[0045] First, surface defect optical inspection is performed: the first electric slide rail 32 and the second electric slide rail 34 are activated in tandem. The first electric slide rail 32 moves the first slide plate 33 along the X-axis, and the second electric slide rail 34 moves the second slide plate 35 along the Y-axis. The planar position of the mounting frame 38 is precisely adjusted through dual-axis linkage. Then, the first electric telescopic rod 37 is activated, and its telescopic end pushes the mounting frame 38 and the laser interference sensor 312 downward along the Z-axis, so that the detection end of the laser interference sensor 312 reaches the preset initial detection position on the inner wall of the wafer on all four sides. The second motor 310 is activated, and the output end of the second motor 310 drives the rotating rod 39 to rotate around its own axis. The rotating rod 39 drives the two second electric telescopic rods 311 to rotate synchronously to adjust the detection angle of the laser interference sensor 312 until the detection end is perpendicular to the inner wall of the wafer to be inspected. At this time, the second motor 310 is turned off. The laser interference sensor 312 is activated, and a reference light and a detection light are formed by emitting a low-power laser. The detection light is calibrated by an adaptive lens and then incident perpendicularly on the inner wall surface of the wafer. The reflected detection light... The light and reference light form stable interference fringes inside the sensor. When there are defects on the wafer surface or the curvature of the surface changes, the interference fringes will be distorted. The laser interference sensor 312 captures the distorted signal through the built-in photoelectric conversion module and converts it into three-dimensional morphological digital data to achieve high-precision detection of defects on the wafer surface. During the detection process, the detection position of the laser interference sensor 312 is adjusted by the continuous linkage of the first electric slide rail 32 and the second electric slide rail 34. At the same time, the first motor 36 is started. The first motor 36 drives the first electric telescopic rod 37, the mounting frame 38 and the laser interference sensor 312 to rotate around the Z-axis to achieve full coverage defect detection of the remaining inner wall surfaces of the wafer on all four sides. The detection data is transmitted to the control system in real time for storage and analysis.

[0046] Next, optical performance testing is performed: following the above surface defect detection operation steps, the control system switches the detection mode and controls the second motor 310, the first electric telescopic rod 37, the first motor 36, and each electric slide rail to work together to adjust the position and detection angle of the fiber optic spectral sensor 313, ensuring that the detection end of the fiber optic spectral sensor 313 is perpendicularly aligned with the surface of the wafer to be tested; the fiber optic spectral sensor 313 is activated, and by collecting the reflection spectrum and transmission spectrum signals of the wafer surface, the built-in spectral analysis algorithm is used to accurately detect key optical performance parameters of the wafer such as optical transmittance, refractive index, and spectral response. The detection data and the surface defect detection data form a complete wafer performance test report, ultimately achieving comprehensive, non-destructive, and intelligent testing of the wafer performance on all four sides.

[0047] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A device for non-destructive testing of wafer properties, comprising a testing chamber (1), characterized in that, The top end side wall of the detection box (1) is provided with an opening, and a baffle (2) is movably connected inside the opening, the top end inner wall of the detection box (1) is provided with a performance detection assembly (3) for detecting the performance of the inner wall of the four-sided wafer, and the two end inner walls of the detection box (1) are fixedly connected with positioning assemblies (4) for adsorbing and positioning the outer wall of the four-sided wafer, and the bottom end inner wall of the detection box (1) is provided with a fixing assembly (5) for fixing the mounting screw hole in the inner wall of the two side fixing blocks of the four-sided wafer.

2. The apparatus of claim 1, wherein The performance detection assembly (3) comprises a first groove (31) formed in the top end side wall of the detection box (1), a first electric sliding rail (32) fixedly connected to the inner wall of the first groove (31), a first sliding plate (33) slidably connected to the bottom end side wall of the first electric sliding rail (32), a second electric sliding rail (34) fixedly connected to the bottom end side wall of the first sliding plate (33), and a second sliding plate (35) slidably connected to the bottom end side wall of the second electric sliding rail (34).

3. The apparatus of claim 2, wherein the apparatus is configured to perform the non-destructive testing of the wafer performance by: The bottom end side wall of the second sliding plate (35) is fixedly connected with a first motor (36), the output end of the first motor (36) is fixedly connected with a first electric telescopic rod (37), the telescopic end of the first electric telescopic rod (37) is fixedly connected with a mounting frame (38), and the inner wall of the mounting frame (38) is rotatably connected with a rotating rod (39). ​ 4. The apparatus of claim 3, wherein the at least one sensor is a laser Doppler sensor. The side wall of the mounting frame (38) is fixedly connected with a second motor (310), the output end of the second motor (310) penetrates the side wall of the mounting frame (38) and is fixedly connected with one end of the rotating rod (39), the rod wall of the rotating rod (39) is fixedly connected with two second electric telescopic rods (311) in a symmetrical manner, one of the second electric telescopic rods (311) is fixedly connected with a laser interference sensor (312) at the telescopic end, and the other second electric telescopic rod (311) is fixedly connected with a fiber spectrum sensor (313) at the telescopic end.

5. The apparatus of claim 1, wherein the apparatus is configured to perform non-destructive testing of a wafer. The two end inner walls of the detection box (1) are fixedly connected with two third electric telescopic rods (41) in a symmetrical manner, the telescopic ends of the third electric telescopic rods (41) are fixedly connected with U plates (42), and the inner walls of the U plates (42) are rotatably connected with first circular rods (43).

6. The apparatus of claim 5, wherein the apparatus is configured to perform the nondestructive testing of the wafer performance by measuring the wafer performance at a plurality of locations on the wafer. The side wall of the U plate (42) is fixedly connected with a third motor (44), the output end of the third motor (44) penetrates the side wall of the U plate (42) and is fixedly connected with one end of the first circular rod (43), the rod wall of the first circular rod (43) is fixedly connected with a connecting rod (45), one end of the connecting rod (45) is fixedly connected with a mounting plate (46), and the side wall of the mounting plate (46) is fixedly connected with a plurality of vacuum suction cups (47).

7. The apparatus of claim 1, wherein the apparatus is configured to perform non-destructive testing of a wafer. The bottom end inner wall of the detection box (1) is provided with two second grooves (51) formed in a symmetrical manner, the inner walls of the second grooves (51) are fixedly connected with third electric sliding rails (52), the top end side walls of the third electric sliding rails (52) are slidably connected with third sliding plates (53), and the top end side walls of the third sliding plates (53) are fixedly connected with supporting rods (54).

8. The apparatus of claim 7, wherein the apparatus is configured to perform the non-destructive testing of the wafer performance by: One end of the supporting rod (54) is fixedly connected with a connecting frame (55), the inner wall of the connecting frame (55) is symmetrically and rotatably connected with two second circular rods (56), the side wall of the connecting frame (55) is fixedly connected with two fourth motors (57) in pairs, and the output end of the fourth motor (57) penetrates through the side wall of the connecting frame (55) and is fixedly connected with one end of the corresponding second circular rod (56). ​ 9. The apparatus of claim 8, wherein the apparatus is configured to perform the non-destructive testing of the wafer performance by measuring the wafer performance at a plurality of locations on the wafer. The rod wall of the second circular rod (56) is fixedly connected with a fourth electric telescopic rod (58), the telescopic end of the fourth electric telescopic rod (58) is fixedly connected with a fourth electric sliding rail (59), and the side wall of the fourth electric sliding rail (59) is slidably connected with a plurality of fourth sliding plates (510).

10. The apparatus of claim 9, wherein the apparatus is configured to perform the non-destructive testing of the wafer performance by: The side wall of the fourth sliding plate (510) is fixedly connected with a fifth electric telescopic rod (511), the telescopic end of the fifth electric telescopic rod (511) is fixedly connected with a connecting block (512), the inner wall of the two ends of the connecting block (512) is fixedly connected with a sixth electric telescopic rod (513), and the telescopic end of the sixth electric telescopic rod (513) is fixedly connected with a clamping block (514). ​

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