Semiconductor isostatic pressing graphite packaging method

Abstract

The invention relates to a semiconductor isostatic pressing graphite packaging method, which relates to the technical field of isostatic pressing graphite, and comprises the following steps: a placing step: placing isostatic pressing graphite into a container; a positive pressure step, wherein the container is sealed, and the interior of the container is in a positive pressure state; and a detection step of detecting the pressure in the container and performing leakage notification when the pressure becomes small. The method has the advantage that whether the isostatic pressing graphite is in a good packaging and storing state or not can be visually judged.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of isostatic graphite, in particular to a packaging method of semiconductor isostatic graphite. BACKGROUND

[0002] The isostatic graphite is a porous material of "powder forming + high-temperature sintering", and the pores can adsorb moisture in the air. Especially for the isostatic graphite used in semiconductors, the temperature is relatively high, and the moisture in the gap is gasified, which causes the damage of the isostatic graphite. Therefore, in the process of packaging and storage, it is necessary to prevent moisture and impact to ensure the performance of the isostatic graphite in use. The existing packaging method (such as using film material to wrap) cannot directly determine whether the isostatic graphite is in a good packaging and storage state. SUMMARY

[0003] In view of the deficiencies in the prior art, one of the purposes of the present application is to provide a packaging method of semiconductor isostatic graphite, which has the advantage that whether the isostatic graphite is in a good packaging and storage state can be directly determined.

[0004] The above purpose of the present application is realized by the following technical scheme: A packaging method of semiconductor isostatic graphite, comprising the following steps: a placing step of placing the isostatic graphite into a container; a positive pressure step of sealing the container and making the inside of the container in a positive pressure state; and a detecting step of detecting the pressure in the container, and giving a leakage notification when the pressure decreases.

[0005] By adopting the above technical scheme, in use, whether the isostatic graphite is in a good packaging and storage state can be determined by detecting the pressure in the container, and the container sealed by the sealing setting can play a good dustproof and anti-impact effect on the isostatic graphite.

[0006] In a preferred example, the container can be further configured to have at least one side of flexible material, and in the positive pressure step, the flexible material is deformed under the action of pressure.

[0007] By adopting the above technical scheme, the presence of the flexible material makes it more convenient to judge the pressure in the container.

[0008] In a preferred example, the container can be further configured to have at least one side of flexible material, and in the positive pressure step, the flexible material is deformed under the action of pressure.

[0009] By adopting the above technical scheme, in use, when the pressure decreases, the gas is introduced into the container, so as to play a good protection effect on the isostatic graphite.

[0010] The application can be further configured in a preferred example to detect the pressure in the container after the gas is introduced into the container at time X, if the pressure becomes smaller, a pressure relief notification is performed, if the pressure is equal to the preset value, no pressure relief notification is performed.

[0011] By adopting the technical scheme, if the pressure in the container becomes smaller at time X, it indicates that the sealing of the container fails and needs to be maintained.

[0012] The application can be further configured in a preferred example to include a bottom surface and a top surface, the top surface and the bottom surface are made of non-flexible material, the top surface and the ground are connected through a side surface, the side surface is made of flexible material, and the top surface includes a connecting frame and a cover plate detachably and sealingly connected with the connecting frame.

[0013] By adopting the technical scheme, in use, the existence of the bottom surface makes it convenient to transport the packaged isostatic graphite.

[0014] The application can be further configured in a preferred example to place the bottom surface on a support in the placing step, detach the cover plate, so that the connecting frame falls on the bottom surface, place the isostatic graphite on the bottom plate, until a preset number of isostatic graphites are placed on the bottom plate, then pull the connecting frame upward to a preset position, and then connect the cover plate and the connecting frame.

[0015] By adopting the technical scheme, in use, the above scheme makes the packaging of isostatic graphite more convenient. DETAILED DESCRIPTION

[0016] The application discloses a packaging method for semiconductor isostatic graphite, which adopts a container, at least one side of which is made of flexible material, in the embodiment, the container is in the shape of a cuboid, the bottom surface and the top surface are made of non-flexible material, such as plastic material, the top surface includes a connecting frame and a cover plate detachably and sealingly connected with the connecting frame, and the cover plate is provided with a one-way valve for one-way conduction towards the interior of the container. The packaging method includes the following steps: In the placing step, the bottom surface is placed on a support, the cover plate is detached, so that the connecting frame falls on the bottom surface, the isostatic graphite is placed on the bottom plate, until a preset number of isostatic graphites are placed on the bottom plate, then the connecting frame is pulled upward to a preset position, and then the cover plate and the connecting frame are connected. The positive pressure step: seal the container, introduce clean and humidity-standard gas into the container, and make the interior of the container in a positive pressure state, the pressure at this time is a standard pressure. The detecting step detects the pressure in the container, if the pressure reduction value of the multiple containers is in the interval A, the temperature when the gas is filled and the current temperature are obtained, if the difference between the current temperature and the temperature when the gas is filled is greater than a preset value, the current gas pressure is set as the standard pressure; if the pressure of a single container is reduced, the gas is filled into the container, the pressure in the container is maintained at a preset value (the standard pressure in the positive pressure step), the pressure in the container is detected after time X, if the pressure is reduced, the pressure relief notification is performed, if the pressure is equal to the preset value, the pressure relief notification is not performed.

[0017] The implementation principle of the embodiment is that: by placing the isostatic pressure graphite in the container and maintaining the positive pressure of the container, in use, the probability of the moisture in the air entering the gap of the isostatic pressure graphite can be greatly reduced, and the isostatic pressure graphite can also be protected.

[0018] The embodiments of the specific embodiment are the preferred embodiments of the application, and are not intended to limit the protection scope of the application, so that: any equivalent changes made according to the structure, shape and principle of the application should be covered within the protection scope of the application.

Claims

1. A method for packaging semiconductor isostatically pressed graphite, characterized in that: The process includes the following steps: placement step, placing isostatic graphite into the container; positive pressure step, sealing the container and ensuring the inside of the container is under positive pressure; detection step, detecting the pressure inside the container, and issuing a leak notification if the pressure decreases.

2. The semiconductor isostatic pressing graphite packaging method according to claim 1, characterized in that: The container has at least one side made of a flexible material, which deforms under pressure during the positive pressure step.

3. The semiconductor isostatic pressing graphite packaging method according to claim 2, characterized in that: During the testing process, when the pressure inside the container decreases, gas is introduced into the container to maintain the pressure inside the container at a preset value.

4. The semiconductor isostatic pressing graphite packaging method according to claim 3, characterized in that: After gas is introduced into the container, the pressure inside the container is detected after time X. If the pressure decreases, a pressure relief notification is issued; if the pressure is equal to the preset value, no pressure relief notification is issued.

5. The semiconductor isostatic pressing graphite packaging method according to claim 2, characterized in that: The container includes a bottom surface and a top surface, both of which are made of non-flexible materials. The top surface is connected to the ground via a side surface, which is made of flexible material. The top surface includes a connecting frame and a cover plate that is detachably and sealingly connected to the connecting frame.

6. The semiconductor isostatic pressing graphite packaging method according to claim 5, characterized in that: In the placement step, place the bottom surface on the support, remove the cover plate so that the connecting frame falls on the bottom surface, place the isostatic graphite on the bottom plate until a preset number of isostatic graphite are placed on the bottom plate, then pull the connecting frame upward to the preset position, and then connect the cover plate and the connecting frame.