Self-circulation semiconductor refrigeration cooling power cabinet

Abstract

The invention belongs to the technical field of electric power cabinets, and particularly discloses a self-circulation semiconductor refrigeration cooling electric power cabinet which comprises a cabinet body, the bottom of the cabinet body is fixedly connected with supporting legs used for supporting and lifting the space between the bottom of the cabinet body and the ground, and a mounting cavity is formed in one side of the cabinet body; one side of the cabinet body is provided with a cabinet door used for shielding the mounting cavity, the other side of the cabinet body is provided with wire outlet holes which are uniformly distributed and are communicated with the interior of the cabinet body, and the interior of the cabinet body is provided with a heat dissipation module; through the arrangement of the heat dissipation module and the auxiliary module, under the mutual cooperation of the heat dissipation module and the auxiliary module, residual pressure air after heat dissipation can be utilized to form a positive pressure barrier at a cabinet door sealing position and a cable outlet while air flow is guided to enter a mounting cavity for heat dissipation, so that external dust and moisture are effectively prevented from invading from gaps; cooperative unification of heat dissipation and sealing dust prevention is achieved, the environment in the cabinet is improved fundamentally, and a good working environment is provided for the environment in the cabinet.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of power cabinets, and particularly discloses a self-circulation semiconductor refrigeration cooling power cabinet. BACKGROUND

[0002] Once the power distribution station is put into operation, the high-voltage cabinet door is rarely opened for safety considerations, and most high-voltage cabinets are designed in a sealed manner, so that the ventilation condition in the high-voltage cabinet is poor, and the heat generated by the equipment in the high-voltage cabinet during operation is not easy to dissipate, which will cause a safety hazard to the operation of the equipment.

[0003] The common heat dissipation modes of the power cabinet mainly include natural convection heat dissipation and forced air cooling heat dissipation. The natural convection heat dissipation structure is simple and low in cost, but the heat dissipation capacity is limited, and it is suitable for occasions with small heat generation; the forced air cooling enhances the air flow by installing a fan to improve the heat dissipation efficiency, but the dust in the outside environment is easy to enter the cabinet along with the airflow and accumulate on the surface of the electrical components, affecting the heat dissipation and even causing a short circuit, and in addition, the power cabinet is usually installed in an industrial site or outdoors, so how to effectively realize the sealing and dust prevention of the cabinet body is also a key problem in the design of the power cabinet.

[0004] Therefore, the technical personnel in the art proposes a self-circulation semiconductor refrigeration cooling power cabinet to solve the above-mentioned problems. SUMMARY

[0005] Therefore, the technical personnel in the art proposes a self-circulation semiconductor refrigeration cooling power cabinet to solve the above-mentioned problems.

[0006] To achieve the above purpose, the application provides a self-circulation semiconductor refrigeration cooling power cabinet, which comprises a cabinet body, a supporting leg fixedly connected to the bottom of the cabinet body, an installation cavity formed in one side of the cabinet body, a cabinet door arranged on one side of the cabinet body for shielding the installation cavity, a plurality of wire outlet holes evenly distributed on the other side of the cabinet body and connected to the inside of the cabinet body, a heat dissipation module arranged in the inside of the cabinet body, and an auxiliary module arranged on the inner wall of the cabinet body. The auxiliary module comprises a sealing assembly arranged on the inner wall of the cabinet body and matched with the cabinet door, a wire outlet assembly arranged on the inner wall of the cabinet body and matched with the wire outlet hole, and an auxiliary assembly arranged in the inside of the sealing assembly and the wire outlet assembly.

[0007] In the above technical scheme, preferably, the heat dissipation module comprises a working cavity opened in the interior of the cabinet body, the inner bottom wall of the working cavity is provided with uniformly distributed through holes which are communicated with the mounting cavity, the interior of the working cavity is provided with a fan, the inner top wall of the working cavity is provided with uniformly distributed semiconductor refrigerating fins, the cold surface of the semiconductor refrigerating fin is located in the interior of the mounting cavity, the hot surface of the semiconductor refrigerating fin penetrates out of the working cavity and is provided with uniformly distributed heat dissipation fins, the inner wall of the working cavity is provided with uniformly distributed air inlet grooves which are communicated with the outside, and the two sides of the cabinet body are both provided with filter screens for shielding the air inlet grooves.

[0008] In the above technical scheme, preferably, the top of the cabinet body is fixedly connected with a baffle, and the heat dissipation fins are located on the inner side of the baffle.

[0009] In the above technical scheme, preferably, the sealing assembly comprises a sealing frame fixedly connected to the inner wall of the mounting cavity, the side of the sealing frame close to the cabinet door is provided with a groove, the side of the sealing frame away from the cabinet door is provided with an air inlet hole communicated with the groove, the bottom of the cabinet body is provided with uniformly distributed and mutually communicated air exhaust cavities, the inner wall of the air exhaust cavity is fixedly connected with a heat conduction plate, and the surface of the heat conduction plate is provided with an air exhaust hole.

[0010] In the above technical scheme, preferably, the interior of the cabinet body is provided with an air outlet hole communicated with the air exhaust cavity, and the groove is communicated with the air exhaust cavity through the air outlet hole.

[0011] In the above technical scheme, preferably, the wire outlet assembly comprises a mounting plate fixedly connected to the inner wall of the mounting cavity, the surface of the mounting plate is fixedly connected with uniformly distributed wire outlet pipes, the other end of the wire outlet pipe penetrates into the interior of the adjacent wire outlet hole, the inner side of the wire outlet pipe is embedded with a mounting ring, and the inner side of the mounting ring is fixedly connected with an adjusting bag.

[0012] In the above technical scheme, preferably, the surface of the mounting plate is provided with a guide hole communicated with the interior of the mounting ring, the other side of the mounting ring is provided with an air outlet channel communicated with the wire outlet pipe, and the auxiliary assembly is arranged in the interior of the air outlet hole and the air outlet channel.

[0013] In the above technical scheme, preferably, the auxiliary assembly comprises a fixed plate, a connecting rod and a sealing ring, wherein, the connecting rod is fixedly connected to one side of the fixed plate, the sealing ring is slidingly connected to the surface of the connecting rod, and a spring is fixedly connected between the sealing ring and the fixed plate.

[0014] In the above technical scheme, preferably, the surface of the connecting rod is provided with a through groove between the fixed plate and the sealing ring.

[0015] Compared with the prior art, the present application has the following beneficial effects: 1、By setting the heat dissipation module and auxiliary module, the air flow can be guided into the installation cavity for heat dissipation, and the residual pressure air after heat dissipation can form a positive pressure barrier at the cabinet door sealing place and the cable outlet, effectively preventing external dust and moisture from entering from the gap, realizing the cooperation and unity of heat dissipation and dustproof sealing, and fundamentally improving the cabinet environment, providing a good working environment for the cabinet environment; 2、By setting the heat dissipation module and auxiliary module, the air with rising temperature after heat exchange is guided to the exhaust cavity at the bottom of the cabinet body, and the residual heat is used to continuously heat and dry the bottom of the cabinet, preventing the influence of ground humidity, and at the same time, the inflatable adjusting bag in the interior of the exhaust cavity can be inflated to adaptively close the cable outlet with different diameters, ensuring efficient sealing while reducing energy loss, improving overall energy efficiency and environmental adaptability. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 is a structural schematic view of the present application; Figure 2 is a separation schematic view of the cabinet body and the cabinet door of the present application; Figure 3 is Figure 2 an enlarged view of A; Figure 4 is a sectional view of the cabinet body of the present application; Figure 5 is a structural schematic view of the outlet assembly of the present application; Figure 6 is Figure 5 an enlarged view of B; Figure 7 is a structural schematic view of the sealing frame of the present application; Figure 8 is a distribution schematic view of the heat conduction plate and the air outlet hole of the present application; Figure 9 is Figure 8 an enlarged view of C.

[0017] In the figure: 1, cabinet body; 101, cabinet door; 102, supporting leg; 103, outlet hole; 2, heat dissipation module; 201, filter screen; 202, baffle; 203, fan; 204, semiconductor refrigerating sheet; 205, heat dissipation fin; 3, auxiliary module; 3101, sealing frame; 3102, groove; 3103, air inlet hole; 3104, heat conduction plate; 3105, air outlet hole; 3106, sealing ring; 3107, connecting rod; 3108, through slot; 3109, spring; 3110, fixed plate; 3111, exhaust hole; 32, outlet assembly; 3201, mounting plate; 3202, outlet pipe; 3203, mounting ring; 3204, air outlet channel; 3205, adjusting bag; 3206, inlet hole. DETAILED DESCRIPTION

[0018] In order to more clearly understand the above-mentioned purposes, features and advantages of the present application, the present application will be further described in detail below in conjunction with the drawings and specific embodiments.

[0019] In the following description, a large number of specific details are set forth in order to facilitate a thorough understanding of the present application, but the present application can also be implemented in other ways different from those described herein, and therefore the present application is not limited to the specific embodiments disclosed below.

[0020] As shown in Figures 1-9 A self-circulation semiconductor refrigeration cooling power cabinet, comprising a cabinet body 1, the bottom of the cabinet body 1 is fixedly connected with a support leg 102 for supporting and lifting the distance between the bottom of the cabinet body 1 and the ground, one side of the cabinet body 1 is provided with a mounting cavity, one side of the cabinet body 1 is provided with a cabinet door 101 for shielding the mounting cavity, the other side of the cabinet body 1 is provided with a plurality of wire outlet holes 103 which are uniformly distributed and communicate with the inside of the cabinet body 1, the inside of the cabinet body 1 is provided with a heat dissipation module 2, and the inner wall of the cabinet body 1 is provided with an auxiliary module 3. The auxiliary module 3 comprises a sealing assembly 31 arranged on the inner wall of the cabinet body 1 and cooperating with the cabinet door 101, the inner wall of the cabinet body 1 is provided with a wire outlet assembly 32 for cooperating with the wire outlet hole 103, and the inside of the sealing assembly 31 and the wire outlet assembly 32 is provided with an auxiliary assembly.

[0021] The support leg 102 is arranged to raise the distance between the cabinet body 1 and the ground, so as to avoid the influence of the damp ground, and the mounting cavity is arranged for the installation of electrical elements.

[0022] As shown in Figures 1-9 The heat dissipation module 2 comprises a working cavity arranged in the inside of the cabinet body 1, the inner bottom wall of the working cavity is provided with a plurality of through holes which are uniformly distributed and communicate with the mounting cavity, the inside of the working cavity is provided with a fan 203, the inner top wall of the working cavity is provided with a plurality of semiconductor refrigeration pieces 204 which are uniformly distributed, the cold surface of the semiconductor refrigeration piece 204 is located in the inside of the mounting cavity, the hot surface of the semiconductor refrigeration piece 204 penetrates out of the working cavity and is provided with a plurality of heat dissipation fins 205 which are uniformly distributed, the inner wall of the working cavity is provided with a plurality of air inlet grooves which are uniformly distributed and communicate with the outside, and the two sides of the cabinet body 1 are provided with a filter screen 201 for shielding the air inlet grooves.

[0023] The top of the cabinet body 1 is fixedly connected with a blocking frame 202, and the heat dissipation fins 205 are located on the inner side of the blocking frame 202.

[0024] By starting the fan 203 and the semiconductor refrigeration piece 204, external gas can be guided to pass through the filter screen 201 and the air inlet groove to enter the inside of the working cavity, in the process, the cold surface of the semiconductor refrigeration piece 204 can cool the airflow, the cooled gas can be guided to enter the inside of the mounting cavity through the through hole to cool and heat dissipate the inside, and the heat of the hot surface of the semiconductor refrigeration piece 204 can be dissipated to the outside through the heat dissipation fins 205. The setting of the baffle 202 is used to reduce the adhesion of dust on the surface of the heat dissipation fins 205 to affect the heat exchange effect.

[0025] As shown in Figures 1-9 The sealing assembly 31 comprises a sealing frame 3101 fixedly connected to the inner wall of the mounting cavity, a groove 3102 is formed on the side of the sealing frame 3101 close to the cabinet door 101, an air inlet hole 3103 is formed on the side of the sealing frame 3101 away from the cabinet door 101 and communicates with the groove 3102, and the bottom of the cabinet body 1 is provided with uniformly distributed and mutually communicating air outlet cavities. The inner wall of the air outlet cavity is fixedly connected with a heat conduction plate 3104, and the surface of the heat conduction plate 3104 is provided with an air outlet hole 3111.

[0026] The inside of the cabinet body 1 is provided with an air outlet hole 3105 communicating with the air outlet cavity, and the groove 3102 communicates with the air outlet cavity through the air outlet hole 3105.

[0027] After the cabinet door 101 is closed, the sealing frame 3101 is tightly attached to the surface of the cabinet door 101, so that the groove 3102 is shielded by the cabinet door 101, and the air introduced into the inside of the mounting cavity can be injected into the inside of the groove 3102 through the air inlet hole 3103 after sinking, so that the air pressure in the inside of the groove 3102 is greater than the external air pressure, dust is prevented from entering the joint gap between the cabinet door 101 and the cabinet body 1, and the heat exchange air can be discharged through the groove 3102, the air outlet hole 3105, the air outlet cavity and the air outlet hole 3105. In the process, the airflow after absorbing the heat in the inside of the mounting cavity can heat and dry the bottom of the cabinet body 1, so as to avoid moisture accumulation at the bottom.

[0028] As shown in Figures 1-9 The outlet assembly 32 comprises a mounting plate 3201 fixedly connected to the inner wall of the mounting cavity, the surface of the mounting plate 3201 is fixedly connected with uniformly distributed outlet pipes 3202, the other end of the outlet pipe 3202 penetrates into the inside of the adjacent outlet hole 103, the inside of the outlet pipe 3202 is embedded with a mounting ring 3203, and the inside of the mounting ring 3203 is fixedly connected with an adjusting bag 3205.

[0029] The surface of the mounting plate 3201 is provided with an import hole 3206 communicating with the inside of the mounting ring 3203, the other side of the mounting ring 3203 is provided with an air outlet channel 3204 communicating with the outlet pipe 3202, and the auxiliary assembly is arranged in the inside of the air outlet hole 3105 and the air outlet channel 3204.

[0030] Part of the gas injection process can be injected through the hole 3206 into the inside of the mounting ring 3203, so that the mounting ring 3203 is inflated to adjust the bag 3205, the inflated adjustment bag 3205 can wrap the connecting line through the inside of the outlet pipe 3202, the outlet pipe 3202 is provided with the outlet channel 3204, which can guide the gas from the inside of the adjustment bag 3205 to the outside of the outlet pipe 3202, so as to avoid the dust entering the inside of the mounting cavity through the place, further improving the dustproof strength of the power cabinet.

[0031] As shown in Figures 1-9 The auxiliary assembly includes a fixed plate 3110, a connecting rod 3107 and a sealing ring 3106, wherein, The connecting rod 3107 is fixedly connected to one side of the fixed plate 3110, and the sealing ring 3106 is slidably connected to the surface of the connecting rod 3107. The sealing ring 3106 and the fixed plate 3110 are fixedly connected with the spring 3109.

[0032] The surface of the connecting rod 3107 is provided with a through slot 3108 between the fixed plate 3110 and the sealing ring 3106.

[0033] The fixed plate 3110 and the inner wall of the gas outlet hole 3105 and the gas outlet channel 3204 are described below with the auxiliary assembly at the gas outlet hole 3105. Air can push the sealing ring 3106 to move towards the fixed plate 3110, and in this process, the spring 3109 can be squeezed. When the sealing ring 3106 moves to the position where the through slot 3108 is opened, the gas can bypass the sealing ring 3106 through the through slot 3108 and be discharged through the gas outlet hole 3105. Due to the arrangement of the spring 3109, it can ensure that a certain air pressure is required to push the sealing ring 3106 to move, which can ensure that the air pressure inside the cabinet body 1 is always greater than the outside air pressure, thereby ensuring that the outside air cannot enter the inside of the cabinet body 1 through the connecting gap and the outlet hole 103 of the cabinet body 1, and ensuring that the outside dust enters the inside of the cabinet body 1.

[0034] Working principle: by starting the fan 203 and semiconductor refrigeration piece 204, can guide the outside gas through filter screen 201 and air inlet groove guide into the inside of working cavity, in this process can be through the cold face of semiconductor refrigeration piece 204 to the airflow cooling, the gas after cooling is guided into the inside of mounting cavity through the through hole and is cooled to the inside, and the heat of the hot face of semiconductor refrigeration piece 204 can be dissipated to the outside through the heat dissipation fin 205, the setting of the baffle 202 is used to reduce the dust adhesion on the surface of the heat dissipation fin 205 and influence the heat exchange effect, after the cabinet door 101 is closed, the sealing frame 3101 is tightly attached to the surface of the cabinet door 101, so that the recess 3102 is blocked by the cabinet door 101, and the air introduced into the inside of the mounting cavity can be injected into the inside of the recess 3102 through the air inlet hole 3103 after sinking, so that the air pressure in the recess 3102 is greater than the outside air pressure, to avoid the dust entering the joint gap between the cabinet door 101 and the cabinet 1, the air after heat exchange can be discharged through the recess 3102, the air outlet hole 3105, the exhaust cavity and the air outlet hole 3105, in the process, the airflow after absorbing the heat in the inside of the mounting cavity can heat and dry the bottom of the cabinet 1, to avoid the bottom from being damp, part of the gas injection process can be injected into the inside of the mounting ring 3203 through the inlet hole 3206, so that the adjusting bag 3205 is inflated, the inflated adjusting bag 3205 can wrap the connecting line passing through the inside of the outlet pipe 3202, the setting of the air outlet channel 3204 can guide the gas from the inside of the adjusting bag 3205 to the outlet pipe 3202, to avoid the dust from entering the inside of the mounting cavity through the place, further improve the dustproof strength of the electric power cabinet.

[0035] The basic principle, main features and advantages of the present application are shown and described above. Those skilled in the art should understand that the present application is not limited to the above-mentioned embodiments, and the above-mentioned embodiments and descriptions in the specification are only the principles of the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and these changes and improvements all fall within the scope of the claimed present application. The scope of protection claimed by the present application is defined by the appended claims and their equivalents.

Claims

1. A self-circulating semiconductor cooling power cabinet, comprising a cabinet body (1), wherein the bottom of the cabinet body (1) is fixedly connected to a support leg (102), a mounting cavity is provided on one side of the cabinet body (1), a cabinet door (101) for covering the mounting cavity is provided on one side of the cabinet body (1), and cable outlet holes (103) evenly distributed and communicating with the interior of the cabinet body (1) are provided on the other side of the cabinet body (1), and a heat dissipation module (2) is provided inside the cabinet body (1), characterized in that, The inner wall of the cabinet (1) is provided with an auxiliary module (3); The auxiliary module (3) includes a sealing component (31) disposed on the inner wall of the cabinet (1) and used in conjunction with the cabinet door (101). The inner wall of the cabinet (1) is provided with a cable outlet component (32) used in conjunction with the cable outlet hole (103). Both the sealing component (31) and the cable outlet component (32) are provided with auxiliary components inside.

2. The self-circulating semiconductor cooling power cabinet according to claim 1, characterized in that, The heat dissipation module (2) includes a working cavity opened inside the cabinet (1). The bottom wall of the working cavity has uniformly distributed through holes that are connected to the mounting cavity. A fan (203) is installed inside the working cavity. The top wall of the working cavity has uniformly distributed semiconductor cooling chips (204). The cold side of the semiconductor cooling chip (204) is located inside the mounting cavity. The hot side of the semiconductor cooling chip (204) extends out of the working cavity and has uniformly distributed heat dissipation fins (205). The inner wall of the working cavity has uniformly distributed air inlet slots that are connected to the outside. Filters (201) for blocking the air inlet slots are provided on both sides of the cabinet (1).

3. The self-circulating semiconductor cooling power cabinet according to claim 2, characterized in that, A baffle (202) is fixedly connected to the top of the cabinet (1), and the heat dissipation fins (205) are located inside the baffle (202).

4. The self-circulating semiconductor cooling power cabinet according to claim 1, characterized in that, The sealing assembly (31) includes a sealing frame (3101) fixedly connected to the inner wall of the mounting cavity. The sealing frame (3101) has a groove (3102) on the side near the cabinet door (101) and an air inlet (3103) connected to the groove (3102) on the side away from the cabinet door (101). The bottom of the cabinet (1) has evenly distributed and interconnected exhaust chambers. The inner wall of the exhaust chamber is fixedly connected to a heat-conducting plate (3104), and the surface of the heat-conducting plate (3104) has an exhaust hole (3111).

5. A self-circulating semiconductor cooling power cabinet according to claim 4, characterized in that, The cabinet (1) has an air outlet (3105) inside that communicates with the exhaust chamber, and the groove (3102) is connected to the exhaust chamber through the air outlet (3105).

6. The self-circulating semiconductor cooling power cabinet according to claim 5, characterized in that, The cable outlet assembly (32) includes a mounting plate (3201) fixedly connected to the inner wall of the mounting cavity. The surface of the mounting plate (3201) is fixedly connected with evenly distributed cable outlet tubes (3202). The other end of the cable outlet tubes (3202) extends into the interior of the adjacent cable outlet hole (103). An installation ring (3203) is embedded in the inner side of the cable outlet tubes (3202). An adjustment bladder (3205) is fixedly connected to the inner side of the installation ring (3203).

7. A self-circulating semiconductor cooling power cabinet according to claim 6, characterized in that, The mounting plate (3201) has an inlet hole (3206) that communicates with the inside of the mounting ring (3203) on its surface. The mounting ring (3203) has an outlet channel (3204) that communicates with the outlet pipe (3202) on its other side. The auxiliary component is disposed inside the outlet hole (3105) and the outlet channel (3204).

8. A self-circulating semiconductor cooling power cabinet according to claim 7, characterized in that, The auxiliary components include a fixing plate (3110), a connecting rod (3107), and a sealing ring (3106), wherein, The connecting rod (3107) is fixedly connected to one side of the fixing plate (3110), the sealing ring (3106) is slidably connected to the surface of the connecting rod (3107), and a spring (3109) is fixedly connected between the sealing ring (3106) and the fixing plate (3110).

9. A self-circulating semiconductor cooling power cabinet according to claim 8, characterized in that, The surface of the connecting rod (3107) is provided with a through groove (3108) located between the fixing plate (3110) and the sealing ring (3106).

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