Heat exchange part, heat exchange module and electronic equipment

Abstract

The embodiment of the invention discloses a heat exchange piece, a heat exchange module and electronic equipment, the heat exchange piece comprises a substrate layer and a cover plate layer, and the substrate layer is provided with a runner groove; the cover plate layer is connected with the substrate layer in a sealing manner, and a runner is formed at the runner groove; the cover plate layer comprises a first sealing layer and a blocking layer which are arranged in a stacked mode, the blocking layer is arranged close to the flow channel groove, and the first sealing layer is located on the side, away from the flow channel groove, of the blocking layer. In this way, the sealing effect of the cover plate layer can be enhanced through the blocking layer, water, dust and other foreign matter are prevented from entering the flow channel, and therefore the heat exchange effect of the heat exchange piece can be guaranteed.

Description

Technical Field

[0001] This invention relates to the field of heat transfer technology, and more specifically, to a heat exchanger, a heat exchange module, and an electronic device. Background Technology

[0002] As electronic devices become increasingly integrated, heat dissipation has become a key factor limiting their performance improvement. Liquid cooling plates, as a highly efficient heat dissipation component, are widely used in various high-power-density electronic devices.

[0003] In existing technologies, liquid cooling plates typically consist of a liquid cooling layer and a cover plate. The liquid cooling layer has flow channels, and the cover plate is placed on top of the liquid cooling layer to provide a seal. However, limitations in the cover plate's design result in variations in the sealing performance of the liquid cooling plate, which in turn affects its heat exchange efficiency. Summary of the Invention

[0004] In view of the shortcomings of the prior art, the purpose of this invention is to provide a novel heat exchanger, heat exchange module and electronic device.

[0005] According to one aspect of the present invention, a heat exchanger is provided.

[0006] The heat exchanger includes:

[0007] A substrate layer having flow channel grooves;

[0008] A cover plate layer, which is sealed to the substrate layer and forms a flow channel at the flow channel groove;

[0009] The cover plate layer includes a first sealing layer and a barrier layer stacked together. The barrier layer is disposed close to the flow channel groove, and the first sealing layer is located on the side of the barrier layer away from the flow channel groove.

[0010] Optionally, the projection of the barrier layer onto the substrate layer at least covers the flow channel groove.

[0011] Optionally, the barrier layer includes at least one of a metal layer and a metal oxide layer.

[0012] Optionally, the barrier layer is coated or bonded to the first sealing layer.

[0013] Optionally, the cover layer further includes an adhesive layer, one side of which is connected to the first sealing layer and the other side of which is connected to the barrier layer.

[0014] Optionally, the cover layer further includes a second sealing layer, which is disposed on the side of the barrier layer away from the first sealing layer.

[0015] Optionally, the cover plate layer further includes a first adhesive layer and a second adhesive layer, wherein the first adhesive layer is connected between the first sealing layer and a first side of the barrier layer, and the second adhesive layer is connected between the second sealing layer and a second side of the barrier layer.

[0016] Optionally, the second sealing layer includes a polymer material layer.

[0017] Optionally, the first sealing layer includes a polymer material layer.

[0018] Optionally, the flow channel groove is formed on the side of the substrate layer near the cover plate layer, and the cover plate layer and the substrate layer form the flow channel at the flow channel groove.

[0019] Optionally, the cover plate layer includes a first cover plate layer and a second cover plate layer, the flow channel groove is disposed through the thickness direction of the substrate layer, and the first cover plate layer and the second cover plate layer are respectively sealed to both sides of the substrate layer, so that the first cover plate layer, the second cover plate layer and the substrate layer form the flow channel at the flow channel groove.

[0020] Optionally, the thickness of the barrier layer is not less than 0.1 μm.

[0021] According to another aspect of the present invention, a heat exchange module is provided, comprising a micropump and the heat exchange element described above.

[0022] Optionally, the heat exchanger has a first working fluid inlet and a first working fluid outlet, and the micropump has a second working fluid inlet and a second working fluid outlet. The first working fluid inlet and the first working fluid outlet are respectively connected to the flow channel, and the first working fluid inlet is connected to the second working fluid outlet, and the first working fluid outlet is connected to the second working fluid inlet.

[0023] According to another aspect of the present invention, an electronic device is provided, including the heat exchanger or the heat exchange module described above.

[0024] One technical advantage of the embodiments disclosed herein is that:

[0025] The heat exchanger includes a base plate layer and a cover plate layer. The base plate layer has flow channel grooves. The cover plate layer is sealed to the base plate layer and forms a flow channel at the flow channel grooves. The cover plate layer includes a first sealing layer and a barrier layer stacked together. The barrier layer is disposed close to the flow channel grooves, and the first sealing layer is located on the side of the barrier layer away from the flow channel grooves. In this way, the barrier layer enhances the sealing effect of the cover plate layer, preventing water, dust, and other foreign matter from entering the flow channel, thereby ensuring the heat exchange effect of the heat exchanger.

[0026] Other features and advantages of the invention will become clear from the following detailed description of exemplary embodiments of the invention with reference to the accompanying drawings. Attached Figure Description

[0027] The accompanying drawings, which form part of this specification, illustrate embodiments of the invention and, together with the specification, serve to explain the principles of the invention.

[0028] Figure 1 This is a schematic diagram of a heat exchanger according to an embodiment of the present disclosure;

[0029] Figure 2 This is a schematic diagram of another heat exchanger according to an embodiment of the present disclosure.

[0030] Explanation of reference numerals in the attached figures:

[0031] 1. Cover plate layer; 11. First sealing layer; 12. Barrier layer; 13. Second sealing layer; 2. Substrate layer; 21. Flow channel groove. Detailed Implementation

[0032] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the invention.

[0033] The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the invention or its application or use.

[0034] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and equipment should be considered part of the specification.

[0035] In all the examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values.

[0036] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.

[0037] This invention provides a heat exchange component that can be applied to heat exchange in small electronic devices such as tablets, laptops, VR (Virtual Reality) products, AR (Augmented Reality) products, and watches.

[0038] like Figure 1As shown, the heat exchanger provided in this embodiment of the invention includes:

[0039] Substrate layer 2, wherein the substrate layer 2 has flow channel grooves 21;

[0040] A cover plate layer 1 is sealed to the substrate layer 2 and forms a flow channel at the flow channel groove 21;

[0041] The cover plate layer 1 includes a first sealing layer 11 and a barrier layer 12 stacked together. The barrier layer 12 is disposed close to the flow channel groove 21, and the first sealing layer 11 is located on the side of the barrier layer 12 away from the flow channel groove 21.

[0042] like Figure 1 As shown, in this embodiment, a flow channel groove 21 can be formed on the side of the substrate layer 2 near the cover plate layer 1. That is, the flow channel groove 21 is a groove on the substrate layer 2, which allows the working fluid to flow smoothly in the flow channel 21 and fully contact the liquid cooling layer in the substrate layer 2, thereby achieving efficient heat conduction. Moreover, since the flow channel groove 21 is a groove on the substrate layer 2, the substrate layer 2 itself can also form a one-sided seal for the flow channel 21, thereby reducing the assembly difficulty of the heat exchanger and improving the assembly efficiency.

[0043] According to the actual design, the shape of the flow channel 21 includes, but is not limited to, straight, serpentine, and spiral shapes, to optimize the flow path of the working fluid and heat exchange efficiency. Corresponding connectors or interfaces can also be provided at the inlet and outlet of the flow channel to facilitate connection with external heat exchange systems such as micropumps and radiators, forming a complete heat exchange cycle.

[0044] The cover plate layer 1 can be sealed to the substrate layer 2 through processes such as bonding and welding, so that the cover plate layer 1 and the substrate layer 2 form a closed flow channel at the flow channel groove 21. The working fluid flows in the flow channel, thereby realizing the heat exchange function of the heat exchange component.

[0045] like Figure 1 As shown, in this embodiment, the cover layer 1 may include a first sealing layer 11 and a barrier layer 12 stacked along the thickness direction, that is, the cover layer 1 has a double-layer structure. The barrier layer 12 may be a barrier film made of metal or metal oxide, and the barrier layer 12 is stacked with the first sealing layer 11 to form the cover layer 1. The barrier layer 12 can prevent water, dust and other foreign objects from penetrating or entering the flow channel groove 21, so as to protect the flow channel in the heat exchanger, thereby ensuring the stability of the heat exchange effect of the heat exchanger, and also improving the sealing effect between the cover layer 1 and the substrate layer 2.

[0046] The barrier layer 12 is disposed close to the flow channel 21, and the first sealing layer 11 is located on the side of the barrier layer 12 away from the flow channel 21. Specifically, when the cover plate layer 1 is connected to the substrate layer 2 from the top, the barrier layer 12 is located below and the first sealing layer 11 is located above; when the cover plate layer 1 is connected to the substrate layer 2 from the bottom, the barrier layer 12 is located above and the first sealing layer 11 is located below. In both cases, the barrier layer 12 is located close to the flow channel 21, thereby providing good protection for the flow channel formed at the flow channel 21.

[0047] Furthermore, the outer first sealing layer 11 can also protect the barrier layer 12, prevent the barrier layer 12 from being exposed, reduce the risk of damage or corrosion to the barrier layer 12, and also improve the structural reliability of the cover layer 1 and extend the service life of the cover layer 1.

[0048] Depending on the dimensional relationship between the barrier layer 12 and the first sealing layer 11, the first sealing layer 11 or the barrier layer 12 can be sealed to the substrate layer 2 to form a flow channel. For example, when the size of the barrier layer 12 is less than or equal to the size of the first sealing layer 11, the first sealing layer 11 can be sealed to the substrate layer 2 to form a flow channel; when the size of the barrier layer 12 is greater than the size of the first sealing layer 11, the barrier layer 12 can be sealed to the substrate layer 2 to form a flow channel.

[0049] Furthermore, the sealing effect of the cover layer 1 is improved due to the barrier layer 12. The first sealing layer 11 can be thinned as needed to reduce the thickness of the cover layer 1, thereby reducing the thickness of the heat exchanger and facilitating the thinning requirements of electronic devices using this heat exchanger. Specifically, the cover layer 1 can be thinned to 30μm to 50μm according to the design.

[0050] Optionally, the projection of the barrier layer 12 onto the substrate layer 2 at least covers the flow channel 21.

[0051] In this embodiment, the projection of the barrier layer 12 on the substrate layer 2 can be configured to cover only the flow channel 21, or the projection of the barrier layer 12 on the substrate layer 2 can cover both the flow channel 21 and part of the structure of the substrate layer 2. Both configurations enable the barrier layer 12 to provide good protection for the flow channel formed at the flow channel 21.

[0052] For example, the barrier layer 12 can be configured to match the shape of the flow channel 21, that is, the barrier layer 12 and the first sealing layer 11 have different shapes. In this case, the barrier layer 12 can be first placed on the flow channel 21 of the substrate layer 2, and then the first sealing layer 11 can be connected. Alternatively, the barrier layer 12 can be configured to match the shape of the first sealing layer 11. In this case, the barrier layer 12 and the first sealing layer 11 can be first connected to form the cover layer 1, and then the cover layer 1 can be placed on the substrate layer 2.

[0053] Optionally, the barrier layer 12 includes at least one of a metal layer and a metal oxide layer.

[0054] In this embodiment, the barrier layer 12 includes, but is not limited to, a metal coating formed by coating pure metal, other metal oxides such as aluminum oxide, silicon oxide, and silicon nitride, as well as a combination of metal coating and metal oxide. All of these can prevent foreign objects such as water and dust from penetrating or entering the flow channel groove 21, so as to protect the flow channel in the heat exchanger, thereby ensuring the stability of the heat exchange effect of the heat exchanger and improving the sealing effect between the cover plate layer 1 and the substrate layer 2.

[0055] Optionally, the barrier layer 12 is coated or bonded to the first sealing layer 11.

[0056] In this embodiment, the barrier layer 12 can be coated onto the first sealing layer 11 using electroplating, chemical plating, thermal spraying, or other methods, so that the barrier layer 12 and the first sealing layer 11 are connected to form the cover layer 1. This can reduce the thickness of the cover layer 1 while ensuring the barrier effect of the barrier layer 12, thereby reducing the thickness of the heat exchange component and making it easier to meet the requirements of thinner and lighter electronic devices using this heat exchange component.

[0057] Alternatively, the barrier layer 12 can be connected to the first sealing layer 11 by an adhesive bonding process, so that the barrier layer 12 and the first sealing layer 11 are connected to form the cover layer 1. This can ensure the barrier effect of the barrier layer 12 while simplifying the processing technology of the cover layer 1, thereby reducing the processing difficulty of the heat exchanger.

[0058] Optionally, the cover layer 1 further includes an adhesive layer, one side of which is connected to the first sealing layer 11, and the other side of which is connected to the barrier layer 12.

[0059] In this embodiment, the cover layer 1 is a three-layer structure consisting of a barrier layer 12, an adhesive layer, and a first sealing layer 11. The cover layer 1 can prevent water, dust, and other foreign objects from seeping into or entering the flow channel 21, thereby protecting the flow channel inside the heat exchanger and ensuring the stability of the heat exchange effect of the heat exchanger. It can also improve the sealing effect between the cover layer 1 and the substrate layer 2.

[0060] The adhesive layer allows for direct bonding of the barrier layer 12 to the first sealing layer 11, simplifying the processing of the cover layer 1 and reducing the manufacturing difficulty of the heat exchanger. The adhesive layer includes, but is not limited to, polyolefin elastomer adhesive, polyurethane adhesive, butyl adhesive, pressure-sensitive adhesive, pressure-sensitive hot melt composite adhesive film, hot melt adhesive, or thermosetting adhesive.

[0061] Optionally, the cover layer 1 further includes a second sealing layer 13, which is disposed on the side of the barrier layer 12 away from the first sealing layer 11.

[0062] like Figure 2 In this embodiment, the cover plate layer 1 has a sandwich structure consisting of a first sealing layer 11, a barrier layer 12, and a second sealing layer 13. On one hand, the middle barrier layer 12 can prevent foreign objects such as water and dust from entering the flow channel groove 21, thus protecting the flow channel inside the heat exchanger. On the other hand, the two outer sealing layers can further enhance the sealing capability of the cover plate layer 1 itself, thereby improving the reliability of the sealed connection between the cover plate layer 1 and the substrate layer 2.

[0063] Furthermore, the first sealing layer 11 and the second sealing layer 13 on the outside can also protect the barrier layer 12, prevent the barrier layer 12 from being exposed, reduce the risk of damage or corrosion to the barrier layer 12, and also improve the structural reliability of the cover layer 1 and extend the service life of the cover layer 1.

[0064] Optionally, the cover layer 1 further includes a first adhesive layer and a second adhesive layer, wherein the first adhesive layer is connected between the first sealing layer 11 and the first side of the barrier layer 12, and the second adhesive layer is connected between the second sealing layer 13 and the second side of the barrier layer 12.

[0065] In this embodiment, the provision of the first adhesive layer and the second adhesive layer allows the first sealing layer 11 and the second sealing layer 13 to be directly bonded to the barrier layer 12, simplifying the processing technology of the cover layer 1 and thus reducing the processing difficulty of the heat exchanger. The first adhesive layer includes, but is not limited to, polyolefin elastomer adhesive, polyurethane adhesive, butyl adhesive, pressure-sensitive adhesive, pressure-sensitive hot melt composite adhesive film, hot melt adhesive, or thermosetting adhesive. The second adhesive layer includes, but is not limited to, polyolefin elastomer adhesive, polyurethane adhesive, butyl adhesive, pressure-sensitive adhesive, pressure-sensitive hot melt composite adhesive film, hot melt adhesive, or thermosetting adhesive.

[0066] Optionally, the second sealing layer 13 includes a polymer material layer.

[0067] In this embodiment, the second sealing layer 13 may be provided as a polymer material layer made of polymer materials such as PET (polyethylene terephthalate) and PBT (polybutylene terephthalate). The lightweight nature of polymer materials can be used to reduce the weight of the cover layer 1, thereby reducing the total weight of the heat exchanger and facilitating the lightweight development of electronic devices using this heat exchanger.

[0068] In another embodiment, the second sealing layer 13 may also be a composite layer formed by a polymer material layer and a metal layer, which can also improve the overall strength and thermal conductivity of the cover layer 1, thereby ensuring the stability of the electronic device with the heat exchanger in complex working environments and reducing the operating temperature of the electronic device.

[0069] Optionally, the first sealing layer 11 includes a polymer material layer.

[0070] In this embodiment, the first sealing layer 11 may be a polymer material layer made of polymer materials such as PET (polyethylene terephthalate) and PBT (polybutylene terephthalate). The lightweight nature of polymer materials can be used to reduce the weight of the cover layer 1, thereby reducing the total weight of the heat exchanger and facilitating the lightweight development of electronic devices using this heat exchanger.

[0071] In another embodiment, the first sealing layer 11 may also include a composite layer formed by a polymer material layer and a metal layer, which can also improve the overall strength and thermal conductivity of the cover layer 1, thereby ensuring the stability of the electronic device with the heat exchanger in complex working environments and reducing the operating temperature of the electronic device.

[0072] Optionally, the substrate layer 2 has a flow channel groove 21 on the side near the cover plate layer 1, and the cover plate layer 1 and the substrate layer 2 form the flow channel at the flow channel groove 21.

[0073] In this embodiment, a flow channel groove 21 can be formed on the side of the substrate layer 2 near the cover plate layer 1. That is, the flow channel groove 21 is a groove on the substrate layer 2, which allows the working fluid to flow smoothly in the flow channel 21 and make full contact with the liquid cooling layer in the substrate layer 2, thereby achieving efficient heat conduction. Moreover, since the flow channel groove 21 is a groove on the substrate layer 2, the substrate layer 2 itself can also form a one-sided seal for the flow channel 21, thereby reducing the assembly difficulty of the heat exchanger and improving the assembly efficiency.

[0074] Optionally, the cover plate layer 1 includes a first cover plate layer and a second cover plate layer, and the flow channel groove 21 is disposed through the thickness direction of the substrate layer 2. The first cover plate layer and the second cover plate layer are respectively sealed to both sides of the substrate layer 2, so that the first cover plate layer, the second cover plate layer and the substrate layer 2 form the flow channel at the flow channel groove 21.

[0075] In this embodiment, the flow channel 21 extends through the thickness direction of the substrate layer 2, allowing the working fluid to flow smoothly within the flow channel 21 and fully contact the liquid cooling layer within the substrate layer 2, thereby achieving efficient heat conduction. The flow channel 21 is a through-slot on the substrate layer 2, which also simplifies the process of creating the flow channel 21.

[0076] The first cover plate layer and the second cover plate layer are respectively disposed on both sides of the substrate layer 2, so that the first cover plate layer, the second cover plate layer and the substrate layer 2 form a closed flow channel. The first cover plate layer and the second cover plate layer can form a sealed connection to the substrate layer 2 from both sides, thereby enhancing the reliability of the sealing connection. In addition, the barrier layer 12 in the first cover plate layer and the barrier layer 12 in the second cover plate layer can prevent water, dust and other foreign objects from seeping into or entering the flow channel groove 21 from both sides, so as to provide reliable protection for the flow channel in the heat exchanger.

[0077] Optionally, the thickness of the barrier layer 12 is not less than 0.1 μm.

[0078] In this embodiment, the thickness of the barrier layer 12 is greater than or equal to 0.1 μm, for example, the thickness of the barrier layer 12 can be set between 0.1 μm and 10 μm. On the one hand, the barrier layer 12 can prevent water, dust and other foreign objects from seeping into or entering the flow channel groove 21, thereby protecting the flow channel inside the heat exchanger and ensuring the stability of the heat exchange effect of the heat exchanger, as well as improving the sealing effect between the cover plate layer 1 and the substrate layer 2. On the other hand, by controlling the thickness of the barrier layer 12, the thickness of the cover plate layer 1 itself can be controlled, thereby reducing the thickness of the heat exchanger and making it easier to meet the requirements of thinner and lighter electronic devices using this heat exchanger.

[0079] This invention also provides a heat exchange module, including a micropump and the aforementioned heat exchange components. Corresponding connectors or interfaces can be provided at the inlet and outlet of the flow channel to facilitate connection with the micropump and form a complete heat exchange cycle.

[0080] Optionally, the heat exchanger has a first working fluid inlet and a first working fluid outlet, and the micropump has a second working fluid inlet and a second working fluid outlet. The first working fluid inlet and the first working fluid outlet are respectively connected to the flow channel, and the first working fluid inlet is connected to the second working fluid outlet, and the first working fluid outlet is connected to the second working fluid inlet. Thus, the working fluid can enter the flow channel through the second working fluid outlet and the first working fluid inlet, and return to the micropump from the flow channel through the first working fluid outlet and the second working fluid inlet, thereby achieving working fluid circulation.

[0081] This invention also provides an electronic device, including the aforementioned heat exchanger or heat exchange module. This electronic device can be a small electronic device, such as a tablet computer, laptop computer, smart glasses, smartwatch, or smart headband.

[0082] The above embodiments mainly describe the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. For the sake of brevity, they will not be elaborated here.

[0083] While specific embodiments of the invention have been described in detail by way of examples, those skilled in the art should understand that the examples are for illustrative purposes only and not intended to limit the scope of the invention. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.

Claims

1. A heat exchanging member, characterized by, The application relates to a heat exchange component. The application relates to a heat exchange component. The application relates to a heat exchange component. The application relates to a heat exchange component.

2. The heat exchanging member according to claim 1, characterized by The application relates to a heat exchange component.

3. The heat exchange member according to claim 1, characterized by The application relates to a heat exchange component.

4. The heat exchange member according to claim 1, characterized by The application relates to a heat exchange component.

5. The heat exchange member according to claim 4, characterized by The application relates to a heat exchange component.

6. The heat exchange member according to claim 1, wherein The application relates to a heat exchange component.

7. The heat exchange member according to claim 6, characterized by The application relates to a heat exchange component.

8. The heat exchange member according to claim 6, wherein The application relates to a heat exchange component.

9. The heat exchange member of claim 1, wherein The application relates to a heat exchange component.

10. The heat exchange member of claim 1, wherein The application relates to a heat exchange component.

11. The heat exchange member of claim 1, wherein The application relates to a heat exchange component.

12. The heat exchange member of claim 1, wherein The application relates to a heat exchange component.

13. A heat exchange module, characterized by The application relates to a heat exchange component.

14. The heat exchange module of claim 13, wherein, The application relates to a heat exchange component.

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