Special curing device for SMT (Surface Mount Technology)

Abstract

The invention discloses a curing device special for SMT patches, the structure of the curing device comprises a cooling device, a placing device, a box door, a controller, a heating groove and a box body, the processed SMT patches are uniformly laid on the placing device, the cooling device and the heating groove are respectively arranged at the upper end and the lower end of the placing device, a switch is controlled through the controller, and the temperature of the SMT patches is controlled through the controller. According to the SMT placement device, the heating groove heats SMT patches in the placement device under the action of the controller, the SMT patches on the placement device are heated through the ultraviolet light source, then heat in the box body is dissipated through an air uniformizing assembly on the cooling device and by opening a box door, and the heat flows outwards along with the heat, so that the SMT patches can be placed in the box body, and the service life of the SMT patches is prolonged. And heat in the box body is prevented from being blown upwards and accumulated above the box body, so that the curing of the SMT patch is accelerated.

Description

Technical Field

[0001] This invention relates to the field of SMT (Surface Mount Technology) technology, and specifically to a curing device for SMT assembly. Background Technology

[0002] PCB stands for Printed Circuit Board, and SMT stands for Surface Mount Technology, the most popular technology and process in the electronics assembly industry. Surface mount technology for electronic circuits is also known as surface mount technology. It's a circuit assembly technology that mounts leadless or short-lead surface mount components (SMC / SMD, also called chip components) onto the surface of a printed circuit board or other substrate, and then solders them using methods such as reflow soldering or dip soldering. When processing SMT components, the SMT adhesive needs to be cured. Areas for improvement in SMT curing equipment include: When using an SMT (Surface Mount Technology) curing device, under normal circumstances, the control components allow the heating element to be switched on and off, facilitating the heating and curing of the SMT adhesive using a blower. The mounting components also allow for easy installation and removal of the heating element for maintenance. During operation, the processed SMT components are placed into the chamber for rapid heating and curing by controlling the heating element. After curing, a cooling component is needed to dissipate the heat. The rotating fan on the cooling component blows air upwards from the bottom into the chamber, causing the heat inside to accumulate on top, hindering rapid heat dissipation. This results in slow cooling efficiency and prolonged cooling time. Furthermore, multiple processed SMT components are directly laid on the tray, resulting in small gaps between them and some SMT components stacking together. This prevents the molten aluminum on the surface of the stacked SMT components from being heated and cured, further impacting overall work efficiency. Summary of the Invention

[0003] To address the shortcomings of existing technologies, this invention provides the following technical solution: a curing device specifically designed for SMT (Surface Mount Technology) components, comprising a cooling device, a placement device, a door, a controller, a heating tank, and a housing. The cooling device is installed at the lower end of the housing, with its upper end directly opposite the placement device. The placement device is positioned parallel to the middle of the housing, with a cooling device and a heating tank at its upper and lower ends, respectively. The heating tank, placement device, and cooling device are arranged sequentially from top to bottom inside the housing. The housing and door are connected by hinges. A controller is installed on the top of the housing and is electrically connected to the cooling device and the heating tank.

[0004] As a further optimization of the invention, the cooling device includes a uniform airflow assembly, telescopic baffles, a mounting ring, slide rails, an outer frame, and an assist rod. The uniform airflow assembly is installed in the middle of the mounting ring, and six telescopic baffles are connected to it on the outer ring of the mounting ring. An assist rod is connected through the middle of each of the six telescopic baffles, with one end of the assist rod connected to the end of the telescopic baffle and the other end connected to the slide rail for sliding connection. The six slide rails connect the mounting ring and the outer frame in a movable connection with the assist rod. The mounting ring is fixedly embedded in the middle of the outer frame.

[0005] As a further optimization of the invention, the uniform airflow assembly includes a connector, a dual-airflow assembly, a flow mesh plate, and a shell. The connector connects two dual-airflow assemblies, and multiple dual-airflow assemblies are connected in series through the connector to form a circular structure on the outer ring of the shell. A flow mesh plate that fits and connects to the shell is provided in the middle position inside the shell.

[0006] As a further optimization of the invention, the processed SMT components are evenly laid on the placement device, and the controller operates the switch. The SMT components are heated by the internal components of the heating tank, and the ultraviolet light source heats the placement device. During heating, multiple telescopic baffles on the cooling device are aligned and connected together by the assist rod to seal and shield the mounting ring. After the heating tank finishes heating, the telescopic baffles are pulled outward by the assist rod moving on the slide, so that the air distribution component is exposed. The dual air distribution component operates simultaneously to generate two cold air streams to dissipate the heat inside the chamber. The heat then flows outward through the flow mesh plate, thereby accelerating the curing of the SMT components.

[0007] As a further optimization of the invention, the cooling device and the heating tank are respectively located at the upper and lower ends of the placement device. The heating tank heats the SMT pads inside the placement device under the action of the controller, and then the heat inside the box is dissipated by the cooling device and opening the box door.

[0008] As a further optimization of the invention, the outer frame of the cooling device is set parallel to the bottom of the box, and multiple telescopic baffles are equidistantly installed in a triangular structure on the mounting ring. The multiple telescopic baffles can be extended and retracted accordingly under the action of the assist rod.

[0009] According to the SMT chip mounting curing device as described in the claim, the inner wall of the mounting ring is connected to the outer shell, and multiple dual-air components are equidistantly arranged in a ring inside the outer shell through connectors, so that the multiple dual-air components are on the same plane and rotate.

[0010] As a further optimization of the invention, the dual-wind assembly is provided with a guide port, a barrier net, a rotating component, and a housing. There are two guide ports, which are respectively located at the upper and lower ends of the housing. A barrier net is installed on the guide port at the upper end of the housing and is connected to the inner wall of the end of the housing. A rotating component is installed in the middle position inside the housing.

[0011] As a further optimization of the invention, the rotating component is installed inside the housing and rotates. During the rotation, the rotating component generates two streams of cold air that flow into the housing through two guide ports, effectively and quickly dissipating the heat inside.

[0012] As a further optimization of the invention, the rotating assembly is provided with a connecting shaft, an upper rotating fan, a lower rotating fan, and a linkage. There are two connecting shafts, which are respectively connected to the upper rotating fan and the lower rotating fan. The linkage is connected through the two connecting shafts, and the two connecting shafts rotate through the linkage.

[0013] As a further optimization of the invention, the upper and lower rotating fans are installed with their blades facing opposite directions, and the upper and lower rotating fans rotate simultaneously through a connecting shaft and a linkage, which is beneficial to achieve synchronous heat dissipation from the upper and lower ends of the heating tank to the inside of the box.

[0014] As a further optimization of the invention, the placement device includes a processing frame, a heating tube, a cavity, an air outlet plate, and a positioning assembly. Air outlet plates are installed on both sides of the inner wall of the processing frame and are connected to the heating tube. Multiple heating tubes are provided and are arranged in parallel at the upper end of the processing frame. The lower end of the heating tube is directly opposite the positioning assembly, and multiple positioning assemblies are arranged in parallel at equal intervals at the lower end of the processing frame.

[0015] As a further optimization of the invention, the multiple card slot components are laid in parallel inside the processing frame, and the processed SMT components are stably placed on the corresponding card slot components. The heating tank is controlled by the controller, so that the heating tank runs to heat the heating tube. The heating tube and the air outlet plate work together to conduct heat to the card slot components to heat the SMT components.

[0016] As a further optimization of the invention, the positioning assembly includes a contact pad, a tensioning component, a movable adjusting component, a placement seat, and a spring strip. There are two contact pads, and the two contact pads are connected to the inner arc surfaces of the two movable adjusting components. The two movable adjusting components are symmetrically arranged on the left and right sides of the placement seat in a curved arc structure. Each of the two movable adjusting components has three tensioning components and spring strips arranged at equal intervals. The tensioning components are arranged in a triangular shape on the movable adjusting components.

[0017] As a further optimization of the invention, the placement base is fixedly connected to the lower end of the processing frame. The processed SMT patch is placed parallel on the placement base, and the movable adjustment parts on both sides can open in a straight line with the placement base. The opening and closing parts on the movable adjustment parts will retract inward and overlap together. The spring strip can assist the opening and closing parts in restraining the movable adjustment parts to a flat state, so that the two movable adjustment parts can be pressed against the sides of the SMT patch with the placement base. The sides of the SMT patch will then come into contact with the contact pads, which effectively protect the patch. Beneficial effects

[0018] This invention provides a curing device specifically for SMT (Surface Mount Technology) assembly, which has the following advantages: 1. This invention involves evenly laying the processed SMT components on a placement device. A cooling device and a heating tank are respectively located at the upper and lower ends of the placement device. The device is controlled by a controller. Under the control of the controller, the heating tank heats the SMT components inside the placement device by using an ultraviolet light source. Then, the heat inside the device is dissipated by the air distribution component on the cooling device and by opening the door. The heat flows outward, preventing the heat inside the device from being blown upward and accumulating on top, thereby accelerating the curing of the SMT components.

[0019] 2. In this invention, the lower rotating fan is installed at the lower end of the upper rotating fan via a connecting shaft. The blades of the upper and lower rotating fans are installed in opposite directions. The lower rotating fan rotates clockwise under the action of wind energy, and drives the upper rotating fan to rotate counterclockwise using a linkage component, thereby generating two streams of wind energy. Since the upper and lower rotating fans are installed in a staggered manner, the wind energy they generate can be transmitted between each other, so that multiple dual-wind mechanisms inside the outer shell rotate in unison. This effectively achieves uniform heat dissipation in the upper and lower parts of the box, improves the cooling efficiency of the curing box, and effectively shortens its cooling time.

[0020] 3. In this invention, the processing frame on the placement device is installed parallel and stably in the middle of the box. Multiple positioning components are laid parallel inside the processing frame. The processed SMT components are stably placed on the corresponding positioning components. The heating tank is controlled by the controller, so that the heating tank runs to heat the heating tube. The heating tube and the air outlet plate work together to conduct heat to the positioning components to heat the SMT components. The placement seat on the positioning component is fixedly connected to the lower end of the processing frame. The processed SMT components are placed parallel on the placement seat, which effectively avoids the stacking phenomenon of multiple SMT components being directly laid on the processing frame. This allows the heating tube and the air outlet plate to work together to uniformly heat and cure multiple SMT components. Attached Figure Description

[0021] Other features, objects, and advantages of the present invention will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings: Figure 1 This is a structural schematic diagram of a curing device specifically designed for SMT (Surface Mount Technology). Figure 2 This is a top view schematic diagram of an improved cooling device.

[0022] Figure 3 This is a schematic diagram of the internal structure of an improved wind distribution component.

[0023] Figure 4 This is a schematic diagram of a three-dimensional structure of an improved dual-wind component.

[0024] Figure 5 This is a schematic diagram of a three-dimensional structure of an improved rotating component.

[0025] Figure 6 This is a schematic diagram of the improved internal structure of a placement device.

[0026] Figure 7 This is a top view diagram of an improved positioning component.

[0027] In the diagram: Cooling device-1, Placement device-2, Door-3, Controller-4, Heating tank-5, Box body-6; Wind distribution component-11, telescopic baffle-12, mounting ring-13, slide rail-14, outer frame-15, booster rod-16; Connector-111, Dual-wind assembly-112, Flowing mesh plate-113, Outer shell-114; Flow guide - 1121, barrier mesh - 1122, rotating assembly - 1123, housing - 1124; Connecting shaft-1231, upper rotating fan-1232, lower rotating fan-1233, linkage component-1234; Processing frame-21, heating tube-22, cavity-23, air outlet plate-24, positioning assembly-25; Contact pad-251, opening and closing parts-252, movable adjustment parts-253, placement seat-254, spring strip-255. Detailed Implementation

[0028] To make the technical means, creative features, objectives and effects of this invention easier to understand, the invention will be further described below in conjunction with specific embodiments.

[0029] Example 1 Please see Figures 1-5 , This invention provides a curing device specifically for SMT (Surface Mount Technology) assembly. A curing device for SMT (Surface Mount Technology) assembly includes a cooling device 1, a placement device 2, a door 3, a controller 4, a heating tank 5, and a housing 6. The cooling device 1 is installed at the lower end of the housing 6, with its upper end directly facing the placement device 2. The placement device 2 is positioned parallel to the middle of the housing 6, with the cooling device 1 and the heating tank 5 respectively located at its upper and lower ends. The heating tank 5, placement device 2, and cooling device 1 are arranged sequentially from top to bottom inside the housing 6. The housing 6 and the door 3 are connected by hinges. The controller 4 is installed on the top of the housing 6 and is electrically connected to the cooling device 1 and the heating tank 5.

[0030] The cooling device 1 includes a uniform airflow assembly 11, telescopic baffles 12, a mounting ring 13, a slide rail 14, an outer frame 15, and an assist rod 16. The uniform airflow assembly 11 is installed in the middle of the mounting ring 13, and six telescopic baffles 12 are connected to it on the outer ring of the mounting ring 13. An assist rod 16 is connected through the middle of each of the six telescopic baffles 12, with one end of the assist rod 16 connected to the end of the telescopic baffle 12 and the other end connected to the slide rail 14 for sliding connection. The six slide rails 14 connect the mounting ring 13 and the outer frame 15 in a movable connection with the assist rod 16. The mounting ring 13 is fixed in the middle of the outer frame 15.

[0031] The uniform airflow assembly 11 includes a connector 111, a dual-airflow assembly 112, a flow mesh plate 113, and a housing 114. The connector 111 connects two dual-airflow assemblies 112, and multiple dual-airflow assemblies 112 are connected in series through the connector 111 to form a circular structure on the outer ring of the housing 114. The flow mesh plate 113 is provided in the middle of the interior of the housing 114 and is connected to it.

[0032] The prepared SMT components are evenly laid on the placement device 2. The controller 4 controls the switch, and the components inside the heating tank 5 heat the SMT components. The heating is carried out by an ultraviolet light source. At the same time, multiple telescopic baffles 12 on the cooling device 1 will fit together under the action of the assist rod 16 to seal and shield the mounting ring 13. After the heating tank 5 finishes heating, the assist rod 16 moves on the slide 14 to pull the telescopic baffles 12 outward, so that the air distribution component 11 is exposed. The dual air component 112 on the air distribution component 11 operates simultaneously to generate two cold airs to dissipate the heat inside the box 6. The heat will then flow outward through the flow mesh plate 113, thereby accelerating the curing of the SMT components.

[0033] The cooling device 1 and the heating tank 5 are respectively located at the upper and lower ends of the placement device 2. The heating tank 5 heats the SMT pads inside the placement device 2 under the action of the controller 4, and then the heat inside the cabinet 6 is dissipated by the cooling device 1 and the opening of the cabinet door 3.

[0034] The outer frame 15 of the cooling device 1 is set parallel to the bottom of the box 6. Multiple telescopic baffles 12 are all arranged in a triangular structure and are equidistantly installed in a ring on the mounting ring 13. The multiple telescopic baffles 12 can be extended and retracted under the action of the assist rod 16.

[0035] According to claim 1, the SMT mounting device is characterized in that: the inner wall of the mounting ring 13 is connected to the outer shell 114, and multiple dual-air components 112 are equidistantly arranged in a ring inside the outer shell 114 through connectors 111, so that the multiple dual-air components 112 are on the same plane and rotate.

[0036] The dual-wind assembly 112 is provided with a guide port 1121, a barrier net 1122, a rotating assembly 1123, and a housing 1124. There are two guide ports 1121, which are respectively located at the upper and lower ends of the housing 1124. A barrier net 1122 is installed on the guide port 1121 at the upper end of the housing 1124, and the barrier net 1122 is connected to the inner wall of the end of the housing 1124. A rotating assembly 1123 is installed in the middle position inside the housing 1124.

[0037] The rotating component 1123 is installed inside the housing 1124 and rotates. During the rotation, the rotating component 1123 generates two streams of cold air that flow into the housing 6 through two guide ports 1121, effectively and quickly dissipating the heat inside.

[0038] The rotating assembly 1123 is provided with a connecting shaft 1231, an upper rotating fan 1232, a lower rotating fan 1233, and a linkage 1234. There are two connecting shafts 1231, and the two connecting shafts 1231 are respectively connected to the upper rotating fan 1232 and the lower rotating fan 1233. The linkage 1234 is connected through the two connecting shafts 1231, and the two connecting shafts 1231 rotate through the linkage 1234.

[0039] The upper rotating fan 1232 and the lower rotating fan 1233 are installed with their blades facing opposite directions. The upper rotating fan 1232 and the lower rotating fan 1233 are connected by a connecting shaft 1231 and a linkage 1234 to rotate simultaneously, which is beneficial to achieve synchronous heat dissipation from the upper and lower ends of the heating tank 5 to the inside of the box 6.

[0040] The working principle of the above technical solution is explained below: In use, the prepared SMT components are evenly laid on the placement device 2. The cooling device 1 and heating tank 5 are respectively located at the upper and lower ends of the placement device 2. The controller 4 controls the switching on and off. Under the control of the controller 4, the heating tank 5 heats the SMT components inside the placement device 2 using ultraviolet light. Then, the cooling device 1 and the door 3 are opened to dissipate the heat inside the enclosure 6. While the heating tank 5 is heating the placement device 2, multiple telescopic baffles 12 on the cooling device 1 will fit together under the action of the assist rod 16 to seal and shield the mounting ring 13. After the heating tank 5 finishes heating, the telescopic baffles 12, under the action of the assist rod 16... Driven by the slide rail 14, the telescopic baffle 12 is pulled outward, causing multiple telescopic baffles 12 to separate and be arranged in a ring outside the mounting ring 13. Under the restraint of the assist rod 16, the telescopic baffles 12 will retract segment by segment, allowing the uniform air distribution assembly 11 installed inside the mounting ring 13 to be exposed. Multiple dual-air components 112 on the uniform air distribution assembly 11 are connected in series via connectors 111 and are arranged in a ring at equal intervals inside the outer shell 114, allowing the multiple dual-air components 112 to operate on the same plane. A flow mesh plate 113 is provided in the middle of the inner shell 114 to assist the dual-air components 112 in dissipating heat inside the housing 6. The heat will flow outward through the flow mesh plate 113, thereby accelerating the dissipation of heat. The MT patch is cured. Multiple dual-air components 112 have housings 1124 equidistantly mounted inside the outer casing 114. The rotating components 1123 inside these components rotate within the housings 1124. During rotation, the rotating components 1123 generate two streams of cool air that flow through two guide ports 1121 into the housing 6. The barrier mesh 1122 provides protection and effectively works in conjunction with the rotating components 1123 to quickly dissipate heat from inside the housing 6. The upper rotating fan 1232 on the rotating components 1123 is mounted in the upper part of the housing 1124, and the lower rotating fan 1233 is mounted below the upper rotating fan 1232 via a connecting shaft 1231. The blades of the upper and lower rotating fans 1232 are installed in opposite directions. The lower rotating fan 1233 rotates clockwise under the influence of wind energy, and drives the upper rotating fan 1232 to rotate counterclockwise via the linkage 1234, thus generating two streams of wind energy. Since the upper rotating fan 1232 and the lower rotating fan 1233 are installed in a staggered manner, the wind energy they generate can be transmitted between each other, causing the multiple dual-wind mechanisms 112 inside the outer shell 114 to rotate in unison. This effectively achieves uniform heat dissipation from the upper and lower parts of the chamber 6, and simultaneously opens the chamber door 3 on the chamber 6, effectively accelerating the dissipation of heat inside the chamber 6 and preventing heat from being blown upwards and accumulating on top. This facilitates the simultaneous dissipation of heat from the upper and lower parts of the chamber 6 by the heating tank 5, improving the cooling efficiency of the curing chamber 6.This also effectively shortens its cooling time.

[0041] Example 2 Please see Figures 6-7 , This invention provides a curing device specifically for SMT (Surface Mount Technology) assembly. The placement device 2 includes a processing frame 21, a heating tube 22, a cavity 23, an air outlet plate 24, and a positioning assembly 25. The processing frame 21 has air outlet plates 24 installed on both sides of its inner wall, and the air outlet plates 24 are connected to the heating tubes 22. There are multiple heating tubes 22, and multiple heating tubes 22 are arranged in parallel on the upper end of the processing frame 21. The lower end of the heating tubes 22 faces the positioning assembly 25, and multiple positioning assemblies 25 are arranged in parallel at equal intervals inside the lower end of the processing frame 21.

[0042] The multiple slotting components 25 are laid in parallel inside the processing frame 21. The processed SMT components are stably placed on the corresponding slotting components 25. The controller 4 controls the heating tank 5, so that the heating tank 5 runs to heat the heating tube 22. The heating tube 22 and the air outlet plate 24 work together to conduct heat to the slotting components 25 to heat the SMT components.

[0043] The positioning assembly 25 includes a contact pad 251, a tensioning member 252, a movable adjustment member 253, a placement seat 254, and a spring strip 255. There are two contact pads 251, and the two contact pads 251 are connected to the inner arc surfaces of the two movable adjustment members 253. The two movable adjustment members 253 are symmetrically arranged on the left and right sides of the placement seat 254 in a curved arc structure. Each of the two movable adjustment members 253 has three tensioning members 252 and spring strips 255 arranged at equal intervals. The tensioning members 252 are arranged in a triangular shape on the movable adjustment members 253.

[0044] The placement base 254 is fixedly connected to the lower end of the processing frame 21. The processed SMT patch is placed parallel on the placement base 254. The movable adjustment pieces 253 on both sides can open in a straight line with the placement base 254. The opening and closing pieces 252 on the movable adjustment pieces 253 will retract inward and overlap together. The elastic strip 255 can assist the opening and closing pieces 252 to restrain the movable adjustment pieces 253 to a flat state, so that the two movable adjustment pieces 253 can press against the sides of the SMT patch with the placement base 254. The sides of the SMT patch will then contact the contact pads 251, which effectively protect the patch.

[0045] The working principle of the above technical solution is explained below: In use, the processing frame 21 of the placement device 2 is installed parallel and stably in the middle of the box 6. Multiple positioning components 25 are laid parallel inside the processing frame 21. The processed SMT components are stably placed on the corresponding positioning components 25. The heating tank 5 is controlled by the controller 4, causing it to run and heat the heating tube 22. The heating tube 22 and the air outlet plate 24 work together to conduct heat to the positioning components 25 to heat the SMT components. The placement seat 254 on the positioning component 25 is fixedly connected to the lower end of the processing frame 21. The processed SMT components are placed parallel on the placement seat 254, and the SMT components fit snugly onto the placement seat 254. The two sides of the SMT components are connected to the movable adjustment component 253 through the placement seat 254, generating a certain amount of pressure. After being pressed, the movable adjustment component 253 will open in a straight line in accordance with the placement seat 254, and the opening and closing component 252 on the movable adjustment component 253 will return inward. When folded together, the elastic strip 255 assists the tensioning component 252 in restraining the movable adjustment component 253 to a flat state. The elastic strip 255 has good elasticity, and its two ends are connected to the movable adjustment component 253, effectively restraining the movable adjustment component 253 inward. With the cooperation of the elastic strip 255, the tensioning component 252 can pull the movable adjustment component 253, so that the two movable adjustment components 253 can be placed against the sides of the SMT patch along with the placement seat 254. The sides of the SMT patch will then come into contact with the contact pad 251. The contact pad 251 is made of flexible material, which can effectively protect the SMT patch when in contact with it. This allows multiple SMT patches to be arranged sequentially on the corresponding placement seat 254, effectively avoiding the stacking phenomenon caused by multiple SMT patches being directly laid on the processing frame 21. This allows the heating tube 22 and the air outlet plate 24 to work together to uniformly heat and cure multiple SMT patches, effectively improving the overall working efficiency of the equipment.

[0046] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the scope of the invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0047] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A special curing device for SMT patch, which structure comprises cooling device (1), placing device (2), box door (3), controller (4), heating groove (5) and box body (6), the cooling device (1) is installed at the low end inside the box body (6) and the upper end of the cooling device (1) is opposite to the placing device (2), the placing device (2) is arranged in parallel at the middle position inside the box body (6) and the upper and lower ends of the placing device (2) are respectively provided with the cooling device (1) and the heating groove (5), the heating groove (5), the placing device (2) and the cooling device (1) are sequentially arranged from top to bottom inside the box body (6), the box body (6) is movably connected with the box door (3) through a hinge, the controller (4) is installed on the top of the box body (6) and the controller (4) is electrically connected with the cooling device (1) and the heating groove (5), characterized in that: the cooling device (1) is provided with uniform wind assembly (11), telescopic baffle (12), mounting ring (13), slide (14), outer frame (15) and booster rod (16), the uniform wind assembly (11) is mounted at the middle position inside the mounting ring (13) and six telescopic baffles (12) are arranged on the outer ring of the mounting ring (13), the middle positions of the six telescopic baffles (12) are all penetrated and connected with the booster rod (16), one end of the booster rod (16) is connected with the end of the telescopic baffle (12) and the other end is connected with the slide (14) for sliding connection, the six slides (14) are connected with the mounting ring (13) and the outer frame (15) to movably connect the booster rod (16), and the mounting ring (13) is embedded in the middle position of the outer frame (15); the uniform wind assembly (11) is provided with connecting piece (111), double wind assembly (112), flow net plate (113) and outer shell (114), the connecting piece (111) is connected between the two double wind assemblies (112) and a plurality of double wind assemblies (112) are connected in series through the connecting piece (111) to form a circular ring structure arranged on the outer ring of the outer shell (114), and the flow net plate (113) is arranged on the middle position inside the outer shell (114) and connected with the outer shell (114); the processed SMT patch is uniformly laid on the placing device (2), the controller (4) is used for switching, the components inside the heating groove (5) are used for heating the SMT patch, the ultraviolet light source is used for heating the placing device (2), the telescopic baffles (12) on the cooling device (1) are connected together under the action of the booster rod (16) to seal and shield the mounting ring (13), the telescopic baffles (12) are pulled out when the heating groove (5) is heated, the booster rod (16) moves on the slide (14), the uniform wind assembly (11) is presented, the double wind assemblies (112) on the uniform wind assembly (11) are operated to generate two cold air to dissipate the heat inside the box body (6), the heat is discharged outside through the flow net plate (113), and the curing of the SMT patch is accelerated. ​ 2. The SMT patch dedicated curing device according to claim 1, characterized in that: The cooling device (1) and the heating groove (5) are respectively arranged at the upper and lower ends of the placing device (2), the heating groove (5) heats the SMT patch inside the placing device (2) under the action of the controller (4), and then the heat inside the box (6) is dissipated through the cooling device (1) and the opening of the door (3).

3. The SMT patch dedicated curing device according to claim 1, characterized in that: The outer frame (15) on the cooling device (1) is arranged in parallel at the bottom of the box (6), a plurality of telescopic baffles (12) are installed in equidistant annular structure on the mounting ring (13), and the telescopic baffles (12) can be adjusted in extension and retraction under the action of the booster rod (16).

4. The SMT patch dedicated curing device according to claim 1, characterized in that: The inner wall of the mounting ring (13) is connected with the shell (114), and a plurality of double air assemblies (112) are arranged in equidistant annular structure in the shell (114) through the connecting piece (111), so that the plurality of double air assemblies (112) are rotated in the same plane.

5. The SMT patch dedicated curing device according to claim 1, characterized in that: The double air assembly (112) is provided with a flow guide port (1121), a barrier net (1122), a rotating assembly (1123) and a shell (1124), the flow guide port (1121) is provided with two flow guide ports (1121) arranged at the upper and lower ends of the shell (1124), the flow guide port (1121) at the upper end of the shell (1124) is provided with the barrier net (1122) which is connected with the inner wall of the shell (1124), and the rotating assembly (1123) is arranged at the middle position of the shell (1124). The rotating assembly (1123) is arranged in the shell (1124) and rotates, and two cold air streams are generated in the rotating process of the rotating assembly (1123) and flow into the box (6) through the two flow guide ports (1121), so that the heat inside the box (6) is effectively and quickly dissipated.

6. The SMT patch dedicated curing device according to claim 5, characterized in that: The rotating assembly (1123) is provided with a connecting shaft (1231), an upper rotating fan (1232), a lower rotating fan (1233) and a linkage (1234), the connecting shaft (1231) is provided with two connecting shafts (1231) connected with the upper rotating fan (1232) and the lower rotating fan (1233), and the linkage (1234) is connected between the two connecting shafts (1231) and rotates the two connecting shafts (1231) through the linkage (1234); The fan blades of the upper rotating fan (1232) and the lower rotating fan (1233) are installed in opposite directions, the upper rotating fan (1232) and the lower rotating fan (1233) rotate at the same time through the cooperation of the connecting shaft (1231) and the linkage (1234), which is conducive to realizing the synchronous heat dissipation of the heating groove (5) to the upper and lower ends of the box (6).

7. The SMT patch dedicated curing device according to claim 1, characterized in that: The placing device (2) is provided with a processing frame (21), a heating pipe (22), a cavity (23), an air outlet plate (24), and a clamping assembly (25). The air outlet plate (24) is installed on both sides of the inner wall of the processing frame (21) and is connected with the heating pipe (22). The heating pipe (22) is provided with a plurality of heating pipes (22) which are arranged in parallel on the upper end of the processing frame (21). The lower end of the heating pipe (22) is opposite to the clamping assembly (25), and a plurality of clamping assemblies (25) are arranged in parallel at equal intervals in the inner low end of the processing frame (21). The plurality of clamping assemblies (25) are arranged in parallel in the processing frame (21), and the processed SMT patch is stably placed on the corresponding clamping assembly (25). The controller (4) controls the heating groove (5) to heat the heating pipe (22), and the heating pipe (22) and the air outlet plate (24) cooperate to conduct heat to the clamping assembly (25) to heat the SMT patch.

8. The SMT patch dedicated curing device according to claim 7, characterized in that: The clamping assembly (25) is provided with a contact soft pad (251), a tensioning piece (252), a movable adjusting piece (253), a placing seat (254), and a spring strip (255). The contact soft pad (251) is provided with two contact soft pads (251) which are connected with the inner arc surfaces of the two movable adjusting pieces (253). The two movable adjusting pieces (253) are symmetrically arranged in a curved arc structure on the left and right sides of the placing seat (254), and each of the two movable adjusting pieces (253) is provided with three tensioning pieces (252) and spring strips (255) arranged at equal intervals. The tensioning piece (252) is arranged in a triangular state on the movable adjusting piece (253). The placing seat (254) is fixedly connected to the inner low end of the processing frame (21), and the processed SMT patch is placed in parallel on the placing seat (254). The movable adjusting pieces (253) on both sides of the placing seat (254) can be opened to a straight state in cooperation with the placing seat (254), and the tensioning pieces (252) on the movable adjusting pieces (253) can be retracted inward to overlap together. The spring strip (255) can assist the tensioning piece (252) to restrain the movable adjusting piece (253) to a flat state, so that the two movable adjusting pieces (253) can be placed on both sides of the SMT patch in cooperation with the placing seat (254). The two sides of the SMT patch are in contact with the contact soft pad (251), and the contact soft pad (251) effectively protects the SMT patch.

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