Optical module and assembling method thereof

Abstract

The invention provides an optical module and an assembling method thereof, and relates to the technical field of optical devices, and the optical module comprises a pedestal which is provided with a mounting cavity and is provided with an opening communicated with the mounting cavity; the PCB is arranged in the mounting cavity, and the PCB is in contact with the base; the PCB is provided with an optical chip and an electric chip which are electrically connected with each other, the PCB is provided with a heat insulation piece, and the heat insulation piece is located between the optical chip and the electric chip; the cover plate is arranged on the base and seals the opening, and the face, away from the base, of the cover plate is used for making contact with heat dissipation airflow; and a heat transfer piece is arranged on the cover plate and is in contact with the PCB. According to the optical module and the assembly method thereof provided by the invention, the problem of poor use effect of the optical module in the related technology is solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of optical devices, in particular to an optical module and an assembling method thereof. BACKGROUND

[0002] The optical module is an optical device for high-speed data transmission, which is used to realize the mutual conversion between optical signals and electrical signals, so as to realize the transmission of data in a communication network.

[0003] In the related art, the optical module includes a base, a cover plate and a printed circuit board (PCB). The base has a mounting cavity with an upward opening. The PCB is installed in the mounting cavity. The cover plate is arranged at the upper end of the base and seals the opening of the mounting cavity. The PCB is provided with optical chips (such as optical transmitting chips or optical receiving chips) and electrical chips (such as transmitting driving electrical chips or receiving amplifying electrical chips) which are electrically connected to each other. When in use, a heat dissipation air duct is arranged on the top of the optical module to blow the upper surface of the cover plate through the heat dissipation airflow to carry away the heat generated by the PCB during operation, thereby realizing heat dissipation.

[0004] However, the heat generated by the PCB during operation needs to be first conducted downward from the bottom of the PCB to the base, then upward from the base to the cover plate above, and finally carried away by the heat dissipation airflow, thereby making the heat dissipation efficiency of the PCB relatively low. In addition, the optical chips are easily damaged due to the delayed heat dissipation, thereby affecting the overall use effect of the optical module. SUMMARY

[0005] The present application provides an optical module and an assembling method thereof to solve the problem of poor use effect of the optical module in the related art.

[0006] In one aspect, the present application provides an optical module, comprising:

[0007] a base, wherein the base is provided with a mounting cavity, and the base is provided with an opening which is in communication with the mounting cavity;

[0008] a PCB, wherein the PCB is arranged in the mounting cavity and in contact with the base, the PCB is provided with optical chips and electrical chips which are electrically connected to each other, and the PCB is provided with a heat insulation member which is located between the optical chips and the electrical chips;

[0009] a cover plate, wherein the cover plate is arranged on the base and seals the opening, one side of the cover plate away from the base is used to contact with a heat dissipation airflow, and the cover plate is provided with a heat transfer member which is in contact with the PCB.

[0010] In a possible implementation, the heat insulation member is a heat insulation groove formed on the PCB, and the heat insulation groove penetrates the PCB along the thickness direction of the PCB.

[0011] In a possible implementation, the heat insulation groove is curved, and the heat insulation groove is arranged around any one of the optical chip and the electrical chip.

[0012] In a possible implementation, the heat insulation groove comprises an intermediate segment and two bending segments, and the two bending segments are respectively connected to two ends of the intermediate segment in the extending direction of the intermediate segment, and the bending segments are arranged at an angle with the intermediate segment.

[0013] The intermediate segment is located between the optical chip and the electrical chip, the bending segments are located on a side of the intermediate segment facing the optical chip, and the optical chip is located between the two bending segments.

[0014] In a possible implementation, the heat insulation groove further comprises a dispensing layer, the dispensing layer is filled in the heat insulation groove, and the dispensing layer connects the opposite edges of the heat insulation groove.

[0015] In a possible implementation, the dispensing layer comprises a first dispensing layer and a second dispensing layer, the first dispensing layer is filled in the intermediate segment, and the second dispensing layer is filled in the bending segment.

[0016] In a possible implementation, the electrical chip is used for electrical connection with the optical chip, and one end of the electrical chip is located on the inner side of the heat insulation groove.

[0017] In a possible implementation, the optical module further comprises a lens and an optical fiber ribbon, one end of the optical fiber ribbon in the extending direction is connected to the lens, the other end of the optical fiber ribbon in the extending direction is provided with an optical fiber interface, the lens is arranged on the PCB, and the lens covers the optical chip and the electrical chip.

[0018] In another aspect, the application provides an assembling method for assembling the optical module of any one of the above-mentioned embodiments, comprising the following steps:

[0019] The optical chip and the electrical chip are both mounted on the PCB, the heat insulation member is arranged on the PCB, and the heat insulation member is located between the optical chip and the electrical chip;

[0020] The PCB is arranged in the mounting cavity of the base, and the PCB is in contact with the base;

[0021] The cover plate is arranged on the base and covers the opening on the base, and the heat conduction member on the cover plate is in contact with the PCB.

[0022] In a possible implementation, the mounting the optical chip and the electrical chip on the PCB board and disposing the heat insulation member on the PCB board and between the optical chip and the electrical chip comprises:

[0023] The heat insulation groove is formed on the PCB board, and the heat insulation groove comprises a middle section and two bending sections;

[0024] The first dispensing layer is filled in the middle section before the optical chip and the electrical chip are mounted on the PCB board;

[0025] The second dispensing layer is filled in the bending section after the optical chip and the electrical chip are mounted on the PCB board.

[0026] The application provides an optical module and an assembling method thereof. The optical module comprises a base, an installation cavity is arranged on the base, and the base is provided with an opening communicating with the installation cavity; a PCB board is arranged in the installation cavity and in contact with the base; the PCB board is provided with an optical chip and an electrical chip which are electrically connected to each other; a heat insulation member is arranged on the PCB board and between the optical chip and the electrical chip; a cover plate is arranged on the base and closes the opening, and a side of the cover plate away from the base is used to contact a heat dissipation airflow; and a heat transfer member is arranged on the cover plate and in contact with the PCB board. In this way, the heat on the PCB board can be transmitted to the cover plate through the base, and at least part of the heat on the PCB board can also be transmitted to the cover plate through the heat transfer member, thereby effectively improving the efficiency of heat transmission from the PCB board to the cover plate. Finally, the heat on the cover plate is taken away by the heat dissipation airflow, and the heat dissipation efficiency of the PCB board is improved. In addition, since the electrical chip generates a large amount of heat during operation, the heat insulation member can effectively block the heat generated by the electrical chip from being directly transmitted to the optical chip (a heat-sensitive device), thereby reducing the possibility of damage to the optical chip caused by heat conduction. Therefore, the use effect of the optical module is improved, and the problem of poor use effect of the optical module in the related art is solved. BRIEF DESCRIPTION OF DRAWINGS

[0027] The accompanying drawings, which are incorporated into and form a part of the specification, illustrate an embodiment consistent with the present application and, together with the description, serve to explain the principles of the application.

[0028] Figure 1 A structural schematic diagram of an optical module provided in an embodiment of the application;

[0029] Figure 2 A structural schematic diagram of a PCB board; Figure 1

[0030] A structural schematic diagram of a cover plate; Figure 3 Figure 1 A structural schematic diagram of a cover plate;​

[0031] Figure 4 for Figure 1 Fig. 2 is a schematic view of the mounting structure of the heat dissipation fins on the middle cover plate;

[0032] Figure 5 for Figure 2 Fig. 3 is a schematic view of the partial structure of the PCB plate;

[0033] Figure 6 for Figure 2 Fig. 4 is a schematic view of the mounting structure of the lens on the PCB plate;

[0034] Figure 7 for Figure 6 Fig. 5 is a schematic view of the lens in the light emitting path;

[0035] Figure 8 for Figure 6 Fig. 6 is a schematic view of the lens in the light receiving path.

[0036] BRIEF DESCRIPTION OF DRAWINGS

[0037] 100 - base; 110 - mounting cavity;

[0038] 200 - PCB plate; 210 - heat insulation member; 211 - middle section; 212 - bent section; 220 - gold finger;

[0039] 300 - photoelectric unit; 310 - optical chip; 311 - light emitting chip; 312 - light receiving chip; 320 - electric chip; 321 - emitting driving electric chip; 322 - receiving amplifying electric chip;

[0040] 400 - cover plate; 410 - heat dissipation fin;

[0041] 500 - heat transfer member;

[0042] 600 - dispensing layer; 610 - first dispensing layer; 620 - second dispensing layer;

[0043] 700 - lens; 800 - optical fiber ribbon; 810 - optical fiber interface.

[0044] The specific embodiments of the present application have been shown in the above drawings, and will be described in more detail hereinafter. These drawings and written descriptions are not intended to limit the scope of the concept of the present application in any way, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0045] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0046] In related technologies, an optical module is an optical device used for high-speed data transmission. Its function is to realize the mutual conversion between optical signals and electrical signals, thereby enabling data transmission in communication networks.

[0047] AI, 5G, cloud services, and the expansion of data centers, along with technological advancements, have jointly driven the continuous improvement of optical module speeds, from 10G / 25G / 100G to today's 400G / 800G / 1.6T. This increase in speed has led to a continuous increase in the power consumption and heat generation of optical modules.

[0048] The optical module includes a base, a cover, and a printed circuit board (PCB). The base has an upward-opening mounting cavity, within which the PCB is installed. The cover is positioned on top of the base and closes the opening of the mounting cavity. The PCB houses electrically connected optical chips (such as optical transmitter chips or optical receiver chips) and electrical chips (such as transmitter driver chips or receiver amplification chips). During operation, a heat dissipation duct is installed on the top of the optical module to allow airflow to pass over the upper surface of the cover, carrying away the heat generated by the PCB during operation.

[0049] However, the heat generated during PCB operation (mainly from the operation of the electronic chips) must first be conducted downwards from the bottom of the PCB to the base, then upwards from the base to the upper cover, and finally carried away by the cooling airflow. This results in low heat dissipation efficiency for the PCB. Furthermore, insufficient heat dissipation can easily damage the optical chips (which are heat-sensitive devices and highly susceptible to heat damage), affecting the overall performance of the optical module.

[0050] Based on this, this application provides an optical module and its assembly method. The optical module includes: a base with a mounting cavity and an opening communicating with the mounting cavity; a PCB board disposed within the mounting cavity and in contact with the base; an optical chip and an electrical chip electrically connected to each other on the PCB board; a heat insulation component disposed on the PCB board between the optical chip and the electrical chip; a cover plate disposed on the base and closing the opening, with the side of the cover plate facing away from the base in contact with the heat dissipation airflow; and a heat transfer component disposed on the cover plate in contact with the PCB board. Thus, heat on the PCB board can be transferred to the cover plate through the base. Simultaneously, by providing the heat transfer component, at least a portion of the heat on the PCB board can also be transferred to the cover plate, effectively improving the efficiency of heat transfer from the PCB board to the cover plate. Finally, the heat on the cover plate is carried away by the heat dissipation airflow, improving the heat dissipation efficiency of the PCB board. Furthermore, since the electrical chip generates a large amount of heat during operation, the heat insulation component effectively prevents the heat from the electrical chip from being directly transferred to the optical chip (heat-sensitive device), reducing the possibility of heat conduction damaging the optical chip. This improves the performance of optical modules and solves the problem of poor performance of optical modules in related technologies.

[0051] The technical solution of this application and how the technical solution of this application solves the above-mentioned technical problems are described in detail below with specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments. The embodiments of this application will now be described with reference to the accompanying drawings.

[0052] like Figure 1 and Figure 2 As shown in the embodiment of this application, an optical module includes:

[0053] The base 100 has a mounting cavity 110 and an opening that communicates with the mounting cavity 110.

[0054] PCB board 200 is disposed in mounting cavity 110 and is in contact with base 100; PCB board 200 has optical chip 310 and electrical chip 320 electrically connected to each other; heat insulation component 210 is disposed on PCB board 200 and is located between optical chip 310 and electrical chip 320.

[0055] A cover plate 400 is disposed on the base 100 and closes the opening. The side of the cover plate 400 facing away from the base 100 is used to contact the heat dissipation airflow. A heat transfer element 500 is disposed on the cover plate 400 and contacts the PCB board 200.

[0056] In this embodiment, the base 100 has an internal mounting cavity 110, and the base 100 also has an upward-facing opening that communicates with the mounting cavity 110. This allows the PCB board 200 or other components to be installed into the mounting cavity 110 from top to bottom through the opening. Furthermore, the PCB board 200 can be connected to the base 100 by screws, snap-fit ​​connections, or other means, with the lower surface of the PCB board 200 abutting against the bottom wall of the base 100.

[0057] The PCB board 200 has several sets of optoelectronic units 300, each of which includes an optical chip 310 and an electrical chip 320 that are electrically connected to each other. Both the optical chip 310 and the electrical chip 320 can be fixed to the upper surface of the PCB board 200 by bonding, soldering, or other methods. In practice, the optical chip 310 and the electrical chip 320 can be electrically connected via bonding wires.

[0058] Because the electrical chip 320 generates a significant amount of heat during operation, accounting for approximately 50% to 80% of the total power consumption of the optical module, it is the main heat source inside the optical module, while the optical chip 310 is a heat-sensitive device. Therefore, a heat insulation component 210 is installed on the PCB board 200, located between the optical chip 310 and the electrical chip 320.

[0059] Therefore, by using the heat insulation component 210 to block the heat transfer between the corresponding optical chip 310 area and the corresponding electrical chip 320 area of ​​the PCB board 200, the heat at the electrical chip 320 is prevented from being directly transferred to the optical chip 310 (which is equivalent to reducing the heat transferred from the electrical chip 320 to the optical chip 310), thus reducing the possibility of heat conduction causing damage to the optical chip 310.

[0060] Secondly, the cover plate 400 can be installed on the upper end of the base 100 by snap-fit, screw-fit, or other means, and closes the opening, thereby sealing the mounting cavity 110. The side of the cover plate 400 facing away from the base 100 is used to contact the heat dissipation airflow, so as to dissipate heat from the entire optical module through the heat dissipation airflow.

[0061] Based on this, a heat transfer element 500 is provided on the side of the cover plate 400 facing the mounting cavity 110. The heat transfer element 500 can be connected to the cover plate 400 by welding, screwing, bonding, or other methods. The heat transfer element 500 can be made of high thermal conductivity materials such as high thermal conductivity graphite, high thermal conductivity ceramic, or thermal grease. The shape of the heat transfer element 500 is not limited; for example, it can be a boss structure, a sheet structure, or a plate structure, as long as the heat transfer element 500 is in contact with the PCB board 200. Figure 3 As shown, in this embodiment, the heat transfer element 500 has a boss structure. Preferably, the heat transfer element 500 is in contact with the bare copper area on the upper surface of the PCB board 200.

[0062] Therefore, the heat on the PCB board 200 can be transferred to the cover plate 400 through the base 100, and at least part of the heat on the PCB board 200 can also be transferred to the cover plate 400 through the heat transfer element 500, thereby effectively improving the efficiency of heat transfer from the PCB board 200 to the cover plate 400. Finally, the heat on the cover plate 400 is carried away by the heat dissipation airflow, thereby improving the heat dissipation efficiency of the PCB board 200.

[0063] In summary, the heat transfer component 500 effectively improves the heat dissipation efficiency of the PCB board 200, and the heat insulation component 210 effectively reduces the possibility of damage to the optical chip 310 caused by the heat generated by the electrical chip 320. This improves the performance of the optical module and solves the problem of poor performance of optical modules in related technologies.

[0064] For example, during implementation, a fan or heat dissipation duct can be installed on the side of the cover plate 400 away from the base 100 to form a heat dissipation airflow on that side, thereby achieving the purpose of heat dissipation for the entire optical module. Furthermore, as... Figure 4 As shown, during implementation, multiple heat dissipation fins 410 arranged side by side and spaced apart can also be formed on the side of the cover plate 400 away from the base 100 to form multiple airflow channels and optimize the flow effect of heat dissipation airflow.

[0065] It should be noted that the optical chip 310 can be an optical transmitter chip 311 or an optical receiver chip 312, etc., and the electrical chip 320 can be a transmitter driver electrical chip 321 or a receiver amplifier electrical chip 322, etc.

[0066] like Figure 5 As shown, in this embodiment, a light emitting chip 311, a light receiving chip 312, a transmitting driver chip 321, and a receiving amplifier chip 322 are simultaneously disposed on the PCB board 200. The light emitting chip 311 and the light receiving chip 312 are arranged side by side on one side of the heat insulation member 210, and the transmitting driver chip 321 and the receiving amplifier chip 322 are arranged side by side on the opposite side of the heat insulation member 210. The light emitting chip 311 and the transmitting driver chip 321 are electrically connected by bonding wires, and the light receiving chip 312 and the receiving amplifier chip 322 are electrically connected by bonding wires, and the four together form a set of optoelectronic units 300.

[0067] In this embodiment, two sets of the above-mentioned photoelectric units 300 are provided on the PCB board 200, and a gold finger 220 is also provided at one end of the PCB board 200 in the extension direction. The gold finger 220 can adopt the existing structure, and its structure is not limited.

[0068] The transmitter driver chip 321 shapes, modulates, and outputs the high-speed data electrical signal input from the external device via the gold finger 220 to the optical transmitter chip 311. The optical transmitter chip 311 converts the electrical signal into an optical signal. The optical receiver chip 312 converts the optical signal back into an electrical signal. The receiver amplification chip 322 amplifies and shapes the electrical signal converted by the optical receiver chip 312 and outputs it to the external device via the gold finger 220.

[0069] In this embodiment, the heat insulation component 210 is a heat insulation groove opened on the PCB board 200, and the heat insulation groove penetrates the PCB board 200 along the thickness direction of the PCB board 200.

[0070] It should be noted that a heat insulation groove can be set in the same group of photoelectric units 300 to block the heat transfer between the corresponding area of ​​the optical chip 310 and the corresponding area of ​​the electrical chip 320 on the PCB board 200, thereby preventing the heat at the electrical chip 320 from being directly transferred to the optical chip 310 and reducing the possibility of heat conduction causing damage to the optical chip 310.

[0071] In other embodiments, the heat insulation element 210 may also be a heat insulation strip embedded in the PCB board 200, so as to block the heat transfer between the corresponding optical chip 310 area and the corresponding electrical chip 320 area of ​​the PCB board 200 through the heat insulation strip.

[0072] Furthermore, the heat insulation groove can be bent and extended, and the heat insulation groove can be wrapped around either the optical chip 310 or the electrical chip 320.

[0073] It should be noted that the light emitting chip 311, the light receiving chip 312, the transmitting driver chip 321, and the receiving amplification chip 322 together form a single optoelectronic unit 300. In this embodiment, the heat insulation groove can be simultaneously wound around the light emitting chip 311 and the light receiving chip 312 in the same optoelectronic unit 300. In other embodiments, the heat insulation groove can be simultaneously wound around the transmitting driver chip 321 and the receiving amplification chip 322 in the same optoelectronic unit 300.

[0074] Therefore, by bending and extending the heat insulation groove and simultaneously wrapping it around the light emitting chip 311 and the light receiving chip 312, the length of the heat insulation groove can be effectively increased, and heat can be blocked from being transferred to the light chip 310 from multiple directions, resulting in better heat insulation effect.

[0075] Specifically, such as Figure 5As shown, the heat insulation groove includes a middle section 211 and two bent sections 212. The two bent sections 212 are respectively connected to the two ends of the extension direction of the middle section 211, and the bent sections 212 are set at an angle to the middle section 211. In this embodiment, the bent sections 212 and the middle section 211 form a 90° angle, making the heat insulation groove have a U-shaped structure. In other embodiments, the bent sections 212 and the middle section 211 can also form an angle of 30°, 60°, 80°, etc., and there is no limitation on this.

[0076] The middle section 211 is located between the optical chip 310 and the electrical chip 320, the bent section 212 is located on the side of the middle section 211 facing the optical chip 310, and the optical chip 310 (including the optical emitting chip 311 and the optical receiving chip 312) is located between the two bent sections 212.

[0077] Therefore, the heat is blocked from being transferred to the optical chip 310 from multiple directions through the middle section 211 and the two bent sections 212 of the heat insulation groove, resulting in good heat insulation effect.

[0078] In some embodiments, such as Figure 5 As shown, the optical module also includes an adhesive layer 600, which fills the heat insulation groove and connects the two opposite edges of the heat insulation groove.

[0079] The adhesive layer 600 can be formed by filling the heat insulation groove with insulating adhesive and curing it. The insulating adhesive can be a common ultraviolet curing adhesive. The adhesive layer 600 then connects the two opposite edges of the heat insulation groove.

[0080] Therefore, the adhesive layer 600 can reinforce the area of ​​the PCB board 200 corresponding to the heat insulation groove. This reduces the possibility of mechanical strength reduction and relative deformation on both sides of the PCB board 200 corresponding to the heat insulation groove due to the groove, thus providing better support for the optical chip 310 and the electrical chip 320. This results in better stability of the optical chip 310 and the electrical chip 320 when installed on the PCB board 200 (on both sides of the heat insulation groove), while reducing the possibility of damage to the optical chip 310 or the electrical chip 320 during bonding wire installation, and also ensuring the stability of the electrical connection between the optical chip 310 and the electrical chip 320.

[0081] In other words, the PCB board 200 located on both sides of the heat insulation groove can be cured into a whole by the adhesive layer 600, which reduces the relative deformation of the PCB board 200 located on both sides of the heat insulation groove and affects the optical path stability when the subsequent optoelectronic unit 300 is coupled.

[0082] Specifically, such as Figure 5As shown, the adhesive layer 600 includes a first adhesive layer 610 and a second adhesive layer 620, both of which are made of insulating adhesive and cured. The first adhesive layer 610 fills the middle section 211, and the second adhesive layer 620 fills the bent section 212.

[0083] Therefore, the middle section 211 and the bent section 212 can be filled by the first adhesive layer 610 and the second adhesive layer 620 respectively, thereby ensuring the mechanical strength and load-bearing capacity of the PCB board 200.

[0084] During implementation, before the optical chip 310 and electrical chip 320 are both mounted on the PCB board 200, a first layer of adhesive 610 can be filled into the middle section 211. This provides support for the parts on both sides of the corresponding middle section 211 of the PCB board 200, ensuring the stability of the optical chip 310 and electrical chip 320 during subsequent installation and reducing the possibility of damaging the optical chip 310 or electrical chip 320 during bonding wire installation.

[0085] After the optical chip 310 and the electrical chip 320 are mounted on the PCB board 200, a second adhesive layer 620 is filled into the bending section 212. This further improves the stability of the PCB board 200 at the corresponding heat insulation groove, while reducing the possibility of external debris accumulating in the bending section 212, thus improving the performance. Furthermore, the first adhesive layer 610 and the second adhesive layer 620 together completely seal the heat insulation groove, protecting the bonding wire, optical chip 310, and electrical chip 320 from dust and moisture in the environment.

[0086] In some embodiments, such as Figure 5 As shown, the end of the electrical chip 320 that can be electrically connected to the optical chip 310 is located inside the heat insulation groove.

[0087] In other words, when installing the optical chip 310 and the electrical chip 320, the electrical chip 320 can be moved a certain distance toward the optical chip 310 (the two are not in direct contact), so that the end of the electrical chip 320 used for electrical connection with the optical chip 310 is located inside the middle section 211 of the heat insulation groove. Finally, the electrical chip 320 and the optical chip 310 are electrically connected by a bonding wire.

[0088] Therefore, while ensuring that the heat insulation groove provides better heat insulation between the optical chip 310 and the electrical chip 320, the length of the bonding wire can be reduced, thus optimizing the product's performance.

[0089] In some embodiments, such as Figure 6 As shown, the optical module also includes a lens 700 and an optical fiber ribbon 800. One end of the optical fiber ribbon 800 is connected to the lens 700 in the extension direction, and the other end of the optical fiber ribbon 800 is provided with an optical fiber interface 810. The lens 700 is mounted on the PCB board 200 and covers the optical chip 310 and the electrical chip 320.

[0090] It should be noted that the number of lenses 700 is the same as the number of photoelectric units 300, so that the lenses 700 can simultaneously cover the photoelectric units 300 in the same group, that is, simultaneously cover the light emitting chip 311, light receiving chip 312, emitting driving chip 321 and receiving amplifying chip 322 in the same group of photoelectric units 300.

[0091] In this embodiment, the number of lenses 700 corresponds to the number of photoelectric units 300, which is set to two. One end of the fiber optic strip 800 extending in the direction of extension is divided into two internal interfaces, which are respectively connected to the two lenses 700. The other end of the fiber optic strip 800 extending in the direction of extension is provided with a fiber optic interface 810 for connection to an external fiber optic line. In other embodiments, the number of fiber optic strips 800 can be the same as the number of lenses 700.

[0092] Therefore, lens 700 provides a stable optical path for the emitted light from optical emitting chip 311 (i.e., laser) and the received light from optical receiving chip 312 (PD). This allows the emitted light from optical emitting chip 311 to be coupled into optical fiber strip 800 via the emission optical path of lens 700, and to output an optical signal carrying high-speed data. (See [reference needed]). Figure 7 The transmitting optical path in the optical fiber 800 can also allow externally input optical signals to pass through the receiving optical path of the lens 700 and be input to the optical receiver chip 312, converting the optical signal carrying high-speed data into an electrical signal. (See also...) Figure 8 The receiving optical path in the middle.

[0093] In addition, lens 700 can also protect the bonding wire, optical chip 310 and electrical chip 320 from the effects of dust and moisture in the environment.

[0094] In implementation, the lens 700 can be fixed to the PCB board 200 by bonding, screwing, or other means. The lens 700, fiber optic ribbon 800, and fiber optic interface 810 can all be existing products, and there are no restrictions on their internal structure.

[0095] In summary, the optical module provided in this application embodiment effectively improves the heat dissipation efficiency of the PCB board 200 through the heat transfer component 500, and effectively reduces the possibility of damage to the optical chip 310 caused by the heat generated by the electrical chip 320 through the heat insulation component 210. This improves the performance of the optical module and solves the problem of poor performance of optical modules in related technologies.

[0096] Furthermore, without increasing the difficulty of the production process and manufacturing costs, it can also isolate or increase the heat conduction path on the PCB board 200, improve the overall heat conduction efficiency of the optical module, and enhance the full-temperature performance of the optical module, especially its performance and long-term reliability at high temperatures.

[0097] This application provides an assembly method for assembling optical modules in any of the above embodiments, comprising the following steps:

[0098] The optical chip 310 (including the optical transmitter chip 311 and the optical receiver chip 312) and the electrical chip 320 (including the transmitter driver electrical chip 321 and the receiver amplifier electrical chip 322) are both mounted on the PCB board 200, and a heat insulation component 210 is provided on the PCB board 200, with the heat insulation component 210 located between the optical chip 310 and the electrical chip 320.

[0099] The PCB board 200 is placed in the mounting cavity 110 of the base 100, and the PCB board 200 is in contact with the base 100; specifically, the lower surface of the PCB board 200 can be in contact with the bottom wall of the base 100.

[0100] The cover plate 400 is placed on the base 100 and covers the opening on the base 100, and the heat transfer element 500 on the cover plate 400 is in contact with the PCB board 200; specifically, the heat transfer element 500 can be in contact with the bare copper area on the upper surface of the PCB board 200.

[0101] Thus, the optical module is formed as a whole, and the heat transfer component 500 can effectively improve the heat dissipation efficiency of the PCB board 200, while the heat insulation component 210 can effectively reduce the possibility of damage to the optical chip 310 caused by the heat generated by the electrical chip 320. This improves the performance of the optical module and solves the problem of poor performance of optical modules in related technologies.

[0102] The optical chip 310 and the electrical chip 320 are both mounted on the PCB board 200, and a heat insulation component 210 is provided on the PCB board 200, with the heat insulation component 210 located between the optical chip 310 and the electrical chip 320, including:

[0103] A heat insulation groove is formed on the PCB board 200. The heat insulation groove includes a middle section 211 and two bent sections 212. The specific structure of the heat insulation groove is described in detail in the above embodiments and will not be repeated here.

[0104] Before the optical chip 310 and the electrical chip 320 are both mounted on the PCB board 200 (or after the optical chip 310 and the electrical chip 320 are both mounted on the PCB board 200 and before the bonding wire), a first adhesive layer 610 is filled in the middle section 211; the first adhesive layer 610 supports the PCB board 200 and the mounting of the optical chip 310 and the electrical chip 320, ensuring the stability of the mounting process, and reducing the possibility of damaging the optical chip 310 or the electrical chip 320 when bonding the wire;

[0105] After the optical chip 310 and the electrical chip 320 are both mounted on the PCB board 200, a second adhesive layer 620 is filled into the bending section 212.

[0106] It should be noted that both the optical chip 310 and the electrical chip 320 can be mounted on the PCB board 200 using adhesive. The adhesive can be silver paste with high thermal conductivity, or ordinary UV-curable adhesive.

[0107] In addition, the assembly method includes bonding the inner interface of the optical fiber strip 800 to the lens 700, bonding the edge of the lens 700 to the PCB board 200, and making the lens 700 cover the entire optoelectronic unit 300. Ordinary UV-curable adhesive can be used.

[0108] Specifically, mounting the optical chip 310 and the electrical chip 320 on the PCB board 200 may include the following steps:

[0109] The light emitting chip 311 and the light receiving chip 312 are glued to the left side of the corresponding heat insulation groove in the middle section 211 of the PCB board 200. The right edges of the light emitting chip 311 and the light receiving chip 312 are aligned with the left edge of the middle section 211.

[0110] The transmitting driver chip 321 and the receiving amplifier chip 322 are glued to the right side of the corresponding heat insulation groove middle section 211 of the PCB board 200, with the left edges of both chips aligned with the right edge of the middle section 211. Alternatively, the transmitting driver chip 321 and the receiving amplifier chip 322 can be moved to the left by a certain distance to reduce the distance between the light emitting chip 311 and the transmitting driver chip 321, and to reduce the distance between the light receiving chip 312 and the receiving amplifier chip 322.

[0111] After each chip is mounted, gold wire bonding is performed on the four chips (optical transmitter chip 311, optical receiver chip 312, transmitter driver chip 321, and receiver amplifier chip 322). Specifically, insulating glue is first filled into the middle section 211 of the heat insulation groove from the reverse side of the PCB board 200 (i.e. the side away from the chip) and cured. After the glue has cured, gold wire bonding is performed.

[0112] After the gold wire bonding is completed, align the inner interface on the fiber optic strip 800 with the lens 700 and glue them together. The bonding points are above and on both sides of the bonding point, and no glue is applied to the bottom for the time being.

[0113] After the adhesive has cured, lens 700 is placed over photoelectric unit 300. By changing the horizontal coordinates and vertical pitch angle of lens 700, and coupling the light emitting chip 311 and light receiving chip 312 using fiber optic ribbon 800 and lens 700, the maximum points of light emission and input reception can be found. Lens 700 is fixed in place. Adhesive is applied and cured at the contact edge between lens 700 and PCB board 200, and below the interface between fiber optic ribbon 800 and lens 700.

[0114] Finally, cover and fill the remaining area of ​​the heat insulation groove from the bottom of the PCB board 200 with glue, leaving no gaps. However, do not use too much glue to reduce the possibility of glue overflowing onto the front of the PCB board 200.

[0115] Finally, it should be noted that other embodiments of the invention will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This invention is intended to cover any variations, uses, or adaptations of the invention that follow the general principles of the invention and include common knowledge or customary techniques in the art not disclosed herein, and is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of the invention is limited only by the appended claims.

Claims

1. An optical module, characterized in that, include: A base (100) is provided with a mounting cavity (110) and an opening communicating with the mounting cavity (110). A PCB board (200) is disposed in the mounting cavity (110) and is in contact with the base (100); The PCB board (200) has an optical chip (310) and an electrical chip (320) that are electrically connected to each other. A heat insulation component (210) is provided on the PCB board (200) and the heat insulation component (210) is located between the optical chip (310) and the electrical chip (320). A cover plate (400) is disposed on the base (100) and closes the opening. The side of the cover plate (400) facing away from the base (100) is used to contact the heat dissipation airflow. A heat transfer element (500) is disposed on the cover plate (400) and the heat transfer element (500) is in contact with the PCB board (200).

2. The optical module according to claim 1, characterized in that, The heat insulation component (210) is a heat insulation groove opened on the PCB board (200), and the heat insulation groove penetrates the PCB board (200) along the thickness direction of the PCB board (200).

3. The optical module according to claim 2, characterized in that, The heat insulation groove is curved and extended, and the heat insulation groove is wound around either the optical chip (310) or the electrical chip (320).

4. The optical module according to claim 3, characterized in that, The heat insulation groove includes a middle section (211) and two bent sections (212). The two bent sections (212) are respectively connected to the two ends of the extension direction of the middle section (211). The bent sections (212) are set at an angle to the middle section (211). The intermediate segment (211) is located between the optical chip (310) and the electrical chip (320), the bent segment (212) is located on the side of the intermediate segment (211) facing the optical chip (310), and the optical chip (310) is located between the two bent segments (212).

5. The optical module according to claim 4, characterized in that, It also includes an adhesive layer (600) that fills the heat insulation groove and connects the two opposite edges of the heat insulation groove.

6. The optical module according to claim 5, characterized in that, The adhesive layer (600) includes a first adhesive layer (610) and a second adhesive layer (620), wherein the first adhesive layer (610) fills the middle section (211) and the second adhesive layer (620) fills the bending section (212).

7. The optical module according to claim 2, characterized in that, The end of the electrical chip (320) that is electrically connected to the optical chip (310) is located inside the heat insulation groove.

8. The optical module according to any one of claims 1-7, characterized in that, It also includes a lens (700) and an optical fiber ribbon (800), one end of the optical fiber ribbon (800) is connected to the lens (700) in the extension direction, and the other end of the optical fiber ribbon (800) is provided with an optical fiber interface (810). The lens (700) is disposed on the PCB board (200) and covers the optical chip (310) and the electrical chip (320).

9. An assembly method for assembling the optical module according to any one of claims 1-8, characterized in that, Includes the following steps: The optical chip (310) and the electrical chip (320) are both mounted on the PCB board (200), and a heat insulation component (210) is provided on the PCB board (200) and the heat insulation component (210) is located between the optical chip (310) and the electrical chip (320); The PCB board (200) is placed in the mounting cavity (110) of the base (100) and the PCB board (200) is in contact with the base (100); The cover plate (400) is placed on the base (100) and covers the opening on the base (100), and the heat transfer element (500) on the cover plate (400) is in contact with the PCB board (200).

10. The assembly method according to claim 9, characterized in that, The step of mounting both the optical chip (310) and the electrical chip (320) on a PCB board (200), and providing a heat insulation component (210) on the PCB board (200), with the heat insulation component (210) positioned between the optical chip (310) and the electrical chip (320), includes: A heat insulation groove is formed on the PCB board (200), the heat insulation groove including a middle section (211) and two bent sections (212). Before the optical chip (310) and the electrical chip (320) are both mounted on the PCB board (200), a first adhesive layer (610) is filled in the middle section (211). After the optical chip (310) and the electrical chip (320) are both mounted on the PCB board (200), a second adhesive layer (620) is filled in the bent section (212).

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