Display module and preparation method thereof

Abstract

The invention provides a display module and a preparation method thereof, the display module comprises a display panel, the display panel comprises a display area, a bending area, a chip area and a binding area, the bending area, the chip area and the binding area are sequentially distributed on one side of the display area in the first direction, a display driving chip and a plurality of components are arranged in the chip area, and the components are arranged in the binding area. The plurality of components comprise a first type of components and a second type of components, the first type of components are separately arranged on a conductive wire led out of the display driving chip, the second type of components are integrally packaged in a component packaging body, and the component packaging body is connected with the conductive wire led out of the display driving chip. The component packaging bodies and the display driving chips are distributed at intervals in the second direction, and the second direction intersects with the first direction.

Description

Technical Field

[0001] This disclosure relates to the field of display technology. More specifically, it relates to a display module and a method for manufacturing the same. Background Technology

[0002] With the continuous evolution of human-computer interaction technology, the display interface has become the core carrier of information transmission and user feedback. As a key component of the display imaging system, the display driver integrated circuit (DDIC) integrates multiple functional units such as signal processing, power driving, and voltage regulation. It is responsible for driving the display panel and controlling the driving current.

[0003] In traditional display modules, the display driver chip is directly mounted on the bottom bezel of the display panel. The peripheral components necessary for stable signal transmission, power decoupling, impedance matching and circuit protection are usually arranged on a flexible printed circuit (FPC) bonded to the DDIC chip or integrated and packaged on the bottom bezel.

[0004] However, both of the above architectures have certain drawbacks, such as the large size of the flexible circuit board leading to a smaller space occupied by the battery, decreased performance of peripheral components, heat generation from component accumulation, capacitor squealing, and decreased stability and reliability. Summary of the Invention

[0005] The purpose of this disclosure is to provide a display module and a method for manufacturing the same, so as to solve at least one of the above-mentioned technical problems.

[0006] To achieve the above objectives, the present disclosure adopts the following technical solution: This disclosure provides a first aspect of a display module, including a display panel. The display panel includes a display area and a bending area, a chip area, and a bonding area sequentially distributed along a first direction on one side of the display area. The chip area is provided with a display driver chip and a plurality of components. The plurality of components include a first type of component and a second type of component. The first type of component is disposed separately on a conductive line led out from the display driver chip. The second type of component is integrated and packaged in a component package. The component package is connected to the conductive line led out from the display driver chip. The component package and the display driver chip are spaced apart along a second direction, which intersects the first direction.

[0007] Optionally, the conductive lines led out from the display driver chip include power lines and signal lines, the first type of component is a component connected to the power line, and the second type of component is a component connected to the signal line.

[0008] Optionally, the first type of component is mounted on the conductive lines led out from the display driver chip via a surface mount method.

[0009] Optionally, the display driver chip includes a power pin, and the conductive line leading out from the power pin is the power line. The power pin is located on at least one side of the display driver chip in a first direction, and the first type of component is located on the same side of the display driver chip as the power pin.

[0010] Optionally, there are multiple power supply pins, which are located on opposite sides of the display driver chip in a first direction, and the first type of component is disposed on opposite sides of the display driver chip in the first direction.

[0011] Optionally, the display panel includes a plurality of display driver chips, which are spaced apart along a second direction, and a component package is disposed between two adjacent display driver chips in the second direction.

[0012] Optionally, the display module further includes a flexible circuit board and a battery. The flexible circuit board is disposed on the side of the bonding area away from the chip area, and the battery is disposed on the side of the flexible circuit board away from the chip area. The flexible circuit board is connected to the conductive line through the bonding area, and the bending area is bent from the display side of the display panel to the backlight side.

[0013] Optionally, the display driver chip further includes signal pins, the conductive lines leading out from the signal pins are the signal lines, the power lines include a first end connected to the power pins and a second end connected to the flexible circuit board, the trace segment between the first end and the second end is connected to the first type of components to form a power network, the signal lines include a third end connected to the signal pins and a fourth end connected to the flexible circuit board, the trace segment between the third end and the fourth end is connected to the second type of components in the component package to form a signal network.

[0014] Optionally, both the first type of component and the second type of component include one or more of capacitors, resistors, and diodes.

[0015] A second aspect of this disclosure provides a method for manufacturing a display module, comprising the following steps: A display panel is fabricated, the display panel including a display area and a bending area, a chip area and a bonding area sequentially distributed along a first direction on one side of the display area. The chip area is provided with a display driver chip and a plurality of components. The plurality of components include a first type of components and a second type of components. The first type of components are separately disposed on the conductive lines led out from the display driver chip. The second type of components are integrated and packaged in a component package. The component package is connected to the conductive lines led out from the display driver chip. The component package and the display driver chip are distributed at intervals along a second direction, the second direction intersecting the first direction. The flexible circuit board is bonded to the display panel using the bonding area.

[0016] The beneficial effects of this disclosure are as follows: The display module of this disclosure has multiple components connected to the display driver chip arranged in the chip area, and the multiple components are divided into a first type of components and a second type of components. The first type of components are separately arranged on the conductive lines led out from the display driver chip, and the second type of components are integrated and packaged in the component package. The component package and the display driver chip are distributed at intervals along a second direction. This second direction is different from the arrangement direction of the bending area, the chip area and the bonding area. This arrangement can reduce the space occupied by the flexible circuit board and increase the space occupied by the battery while ensuring good electrical performance, reducing heat generation problems, and improving the reliability and stability of the display module. Attached Figure Description

[0017] The specific embodiments of this disclosure will be described in further detail below with reference to the accompanying drawings.

[0018] Figure 1 A schematic diagram of the display module structure when components are mounted on a flexible circuit board; Figure 2 for Figure 1 A schematic diagram of the display module in the overall machine state; Figure 3 A schematic diagram of the display module structure when components are integrated, packaged, and placed in the chip area; Figure 4 for Figure 3 A schematic diagram of the display module in the overall machine state; Figure 5 This is a schematic diagram of the structure of an embodiment of the display module provided in this disclosure; Figure 6 for Figure 5 A schematic diagram of the display module in the overall machine state; Figure 7 for Figure 5 The diagram shows a partial pinout of the driver chip. Figure 8 for Figure 3 A schematic diagram of the integrated packaging of all components in the scheme shown; Figure 9 This is a schematic diagram of another embodiment of the display module provided in this disclosure; Figure 10 This is a flowchart of an embodiment of the method for preparing a display module provided in this disclosure. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0020] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an,” “a,” or “the,” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “including,” “comprising,” or “containing,” and similar terms mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. The terms “connected,” “linked,” or similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms “upper,” “lower,” “left,” and “right,” etc., are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0021] In traditional display modules, when the peripheral components of the display driver chip are located on a flexible circuit board, the structural diagram of the display module is as follows: Figure 1 As shown, the display panel PNL includes a display area AA, a bending area BEA, a chip area DA, and a bonding area BOA arranged sequentially in the vertical direction. The chip area DA contains a display driver chip DDIC. The flexible circuit board FPC contains a component area W, and the aforementioned peripheral components are located in the component area W. The flexible circuit board FPC is connected to the display driver chip DDIC through the bonding area BOA to realize the signal interconnection between the peripheral components on the flexible circuit board FPC and the display driver chip DDIC.

[0022] However, Figure 1In the illustrated solution, the peripheral components on the flexible printed circuit board (FPC) occupy a significant amount of space, resulting in an excessively large actual size of the FPC. This leads to a reduction in the battery's footprint when the module is fully assembled. For details, please refer to [reference needed]. Figure 2 , Figure 2 To display a structural diagram of the module in its complete state, such as Figure 2 As shown, the bending area BEA bends from the display side of the display panel PNL to the backlight side, while the chip area DA, bonding area BOA, flexible circuit board FPC, and battery are all located on the backlight side. Figure 2 In the diagram, L1 represents the length of the chip area DA, the bonding area BOA, and the flexible circuit board FPC in the vertical direction Y. The area Q1 represents the area where the battery is located. It can be seen that increasing the size of the flexible circuit board FPC will lead to a decrease in the area Q1 where the battery is placed, which will limit the growth of battery capacity and prevent the battery life of display devices such as mobile phones from being further improved.

[0023] To address the aforementioned issue of limited battery space, a solution has been proposed to integrate and package peripheral components originally distributed on the flexible printed circuit board (FPC) and place them in the chip area (DA) of the display panel's PNL. This reduces the size of the FPC and increases the space available for battery placement. A schematic diagram of the display module structure is shown below. Figure 3 and Figure 4 As shown, Figure 4 for Figure 3 The diagram shows the structure of the display module in its overall state. Figure 3 and Figure 4 In the diagram, L2 represents the length of the chip area DA, the bonding area BOA, and the flexible circuit board FPC in the vertical Y direction, and Q2 represents the area where the battery is placed. It can be seen that by placing the component area W in the chip area DA, the battery placement space can be increased, that is, Q2 is greater than Q1.

[0024] However, Figure 3 and Figure 4 While the integrated packaging solution shown can increase the space for battery placement, it also leads to new problems, including but not limited to: excessively long wiring distances during actual circuit routing, which severely weakens or even completely disables the actual circuit performance of peripheral components, resulting in deterioration of power integrity and signal integrity, affecting the product's performance stability, reliability, and normal use, and may also shorten the lifespan of the flexible printed circuit board (FPC); in addition, the integrated packaging of multiple components may also generate capacitor whistling, and the concentrated distribution of all components will also lead to heat concentration, making it difficult to dissipate heat effectively.

[0025] Therefore, how to ensure that the display module has good electrical performance, thermal performance, acoustic performance, reliability, stability and service life while increasing the space occupied by the battery is an urgent technical problem to be solved.

[0026] To address the aforementioned technical problems, this disclosure provides a display module and its fabrication method.

[0027] For example, please refer to Figures 5 to 7 , Figure 5 This is a schematic diagram of the structure of an embodiment of the display module provided in this disclosure. Figure 6 for Figure 5 The diagram shows the structure of the display module in the overall device configuration. Figure 7 for Figure 5 The diagram shows a partial pinout of the driver chip, such as... Figures 5 to 7 As shown, the display module includes a display panel 100, which includes a display area AA and a bending area 11, a chip area 12, and a bonding area 13 sequentially distributed along a first direction D1 on one side of the display area AA. The chip area 12 is provided with a display driver chip 121 and a plurality of components. The plurality of components include a first type of component and a second type of component. The first type of component is separately disposed on the conductive lines 123 led out from the display driver chip 121. The second type of component is integrated and packaged in a component package 124. The component package 124 is connected to the conductive lines 123 led out from the display driver chip 121. The component package 124 and the display driver chip 121 are distributed at intervals along a second direction D2, and the second direction D2 intersects the first direction D1.

[0028] Wherein, the first direction D1 is the distribution direction of the bending area 11, the chip area 12, and the bonding area 13, in Figure 5 In the embodiment shown, the bending area 11, the display area 12, and the binding area 13 are located below the display area AA, and the first direction D1 is the vertical direction Y, specifically the direction away from the display area AA in the vertical direction Y.

[0029] The intersection of the second direction D2 and the first direction D1 indicates that the first direction D1 and the second direction D2 are different. For example, the second direction D2 is perpendicular to the first direction D1, and the second direction D2 is a horizontal direction X. It can be understood that in other embodiments, if the first direction D1 is a horizontal direction X, then the second direction D2 is a vertical direction Y, and the principle is the same. Figure 5 The principle behind the illustrated embodiments is the same, and will not be repeated here.

[0030] The conductive line 123 led out from the display driver chip 121 refers to the conductive line connected to the pins of the display driver chip 121. The display driver chip 121 is connected to the flexible circuit board 200 or to the pixel driving circuit in the display area AA through the conductive line 123.

[0031] Specifically, the display area AA has multiple pixels and a pixel driving circuit for driving the display of each pixel. In addition to being connected to the flexible circuit board 200, the display driving chip 121 also needs to be connected to the pixel driving circuit in the display area AA to provide driving signals, such as data signals, to each pixel. This embodiment does not limit whether the conductive line 123 led out from the display driving chip 121 is connected to the flexible circuit board 200 or to the pixel driving circuit in the display area AA.

[0032] Conductive lines 123 typically connect to various components, including resistors, capacitors, and diodes, which perform different functions in the circuit. For example, capacitors can act as decoupling and filtering devices. Connecting a capacitor to the power supply pin of a display driver chip can stabilize the power supply voltage, reduce power supply noise and ripple, filter out high-frequency noise in the power supply, ensure power supply purity, and thus improve the performance of the display driver chip. Resistors can serve functions such as current limiting, matching, biasing, stabilizing, or protecting. Current limiting restricts the current magnitude to prevent excessive current from damaging the chip. Matching, for example, involves impedance matching to ensure that signals are not reflected or distorted during transmission. Biasing provides bias voltage or current to ensure the circuit operates at the correct operating point. Stabilization can occur when resistors work with capacitors to form an RC filter circuit, further stabilizing the voltage. Figure 3 and Figure 4 As shown in the diagram, when these components are integrated, packaged, and placed in the chip area of ​​the display panel, the actual physical wiring distance between them and the specific functional pins on the display driver chip may increase significantly. Excessively long traces introduce non-negligible parasitic inductance, resistance, and capacitance, leading to a sharp decrease in decoupling effect, shift in filter cutoff frequency, impedance mismatch, and increased signal reflection and delay. Consequently, the actual circuit performance of these components is severely weakened, or even completely rendered ineffective.

[0033] This disclosure embodiment and Figure 3 and Figure 4 Compared to the illustrated embodiment, the improvement lies in classifying the multiple components connected to the display driver chip 121 and employing different mounting or arrangement methods for different components, including the following two points: First point: Figure 3 and Figure 4 The scheme shown, where integrating all components would cause the electrical performance of the display driver chip to deteriorate or significantly decrease during operation, is classified as the first type of component. These first-type components are directly connected to their corresponding conductive lines 123 in a discrete manner, rather than being integrated into a single package. Figure 5 and Figure 6In the diagram, 1251, 1252, 1253, and 1254 represent the distribution areas of the first type of components, Q3 represents the area where the battery is placed, and L3 represents the length of the chip area (DA), bonding area (BOA), and flexible circuit board (FPC) in the vertical Y direction. Figure 7 The diagram illustrates some of the first-class components, such as... Figure 7 As shown in components P1 and P2, it should be noted that... Figure 7 Components P1 and P2 are for illustrative purposes only and do not represent their actual placement or type (e.g., capacitor, resistor, diode, etc.). Figure 7 In the example shown, multiple conductive lines 123 are connected to component P2.

[0034] Optionally, the first type of component is mounted on the conductive line 123 of the display driver chip 121 via a surface mount method. Further, the first type of component is mounted close to the conductive line 123 of the display driver chip 121; "close to" here means near the corresponding pin of the display driver chip 121.

[0035] In this context, "surface mount" can be understood as surface mounting. The first type of component mounted on a surface mount is typically a flat rectangle with metal pads at both ends, directly attached and soldered to the copper foil on the PCB surface. In this embodiment, the first type of component is directly connected to the conductive line via the metal pads at both ends. This means that the first type of component (such as a resistor or capacitor) is no longer a branch located around the conductive line, but rather becomes part of the conductive line. This arrangement optimizes the wiring area to a minimum, minimizing the space occupied by the chip area 12 and the flexible circuit board 200, and increasing the space for battery placement. Furthermore, it effectively shortens the wiring length of the conductive line, ensuring that the first type of component maintains good electrical performance. For example, for a power decoupling capacitor, directly attaching it to the power network next to the power pin of the display driver chip 121 can effectively suppress power noise and voltage ripple, thus better utilizing the component's role in the circuit.

[0036] Second point: Figure 3 and Figure 4 In the illustrated scheme, components that have minimal impact on the electrical performance of the display driver chip after all components are integrated and packaged are designated as the second type of components. These second type of components are integrated and packaged within a component package 124. Since the integrated packaging of the second type of components has little impact on electrical performance, these components can be packaged together. This reduces the space occupied by the discrete placement or placement of the second type of components on the flexible circuit board 200 while maintaining good electrical performance, thereby increasing the space occupied by the battery and improving the battery life of the display module.

[0037] Understandable, Figure 5The diagram only roughly illustrates the distribution area of ​​the first type of components and the component package 124, without illustrating the circuit connection relationship between the conductive line 123 and each component. The connection relationship between the conductive line and each component is determined by the circuit design of the display driver chip 121, and this embodiment does not improve upon it.

[0038] The component package 124 and the display driver chip 121 are spaced apart in the horizontal direction X. In specific implementation, in order to minimize the length of the chip area 12 in the vertical direction Y, the component package 124 and the display driver chip 121 are positioned directly opposite each other in the vertical direction Y to reduce the problem of increased size of the chip area 12 in the vertical direction Y caused by misalignment.

[0039] Compared with related technologies, the display module of this disclosure sets multiple components connected to the display driver chip in the chip area, and divides the multiple components into a first type of component and a second type of component. The first type of component is set separately on the conductive lines led out from the display driver chip, and the second type of component is integrated and packaged in the component package. The component package and the display driver chip are distributed at intervals along a second direction. This second direction is different from the arrangement direction of the bending area, the chip area and the bonding area. This arrangement can reduce the space occupied by the flexible circuit board and increase the space occupied by the battery while ensuring good electrical performance, reducing heat generation problems and improving the reliability and stability of the display module.

[0040] The display driver chip 121 has at least two main categories of pins: power pins and signal pins. Correspondingly, based on the pin type, the conductive lines 123 connected to the pins of the display driver chip 121 in this embodiment are divided into two categories: power lines and signal lines.

[0041] The inventors discovered through research that, for various components around the display driver chip, the wiring distance of components connected to power pins has a significant impact on electrical performance, while the wiring of components connected to signal pins has a smaller impact on electrical performance. Therefore, in this embodiment, components connected to power pins are designated as the first type of components, which are connected to the power line in a discrete manner, while the remaining components are designated as the second type of components and integrated into a single package.

[0042] Optionally, the conductive lines led out from the display driver chip include power lines and signal lines, the first type of component is a component connected to the power line, and the second type of component is a component connected to the signal line.

[0043] In this embodiment of the disclosure, by placing the components in the chip area 12 and using a combination of placing the first type of components related to the power pins on the chip nearby and integrating the remaining components into the package, the components can be arranged to increase the battery placement space while ensuring good electrical performance. This avoids the problems of heat generation, capacitor squealing, and weakened or even failed electrical performance caused by the integrated packaging of all components.

[0044] The number of display driver chips 121 can be one, two, three or more.

[0045] In a specific example, the display panel 100 includes two display driver chips 121, that is, the display panel 100 adopts dual DDIC driving. The list of peripheral components of the display driver chip 121 is shown in Table 1. According to Table 1, the display panel includes a total of 58 components, including 4 resistors R1~R4, 50 capacitors C1~C50, and 4 diodes D1-D4.

[0046] Table 1 Component list for dual DDIC drive

[0047] In Table 1, the network name indicates whether the network to which the component is connected is a power network or a signal network. It can also be understood as whether the component is connected to the power pin or the signal pin of the display driver chip. The Value indicates the package size model of each component, which includes two types: 0201 and 0402. 0201 indicates a package size of 0.9×0.35mm, and 0402 indicates a package size of 0.5×1.11mm. It is independent of the placement of the component. According to Table 1, out of the 58 components, there are 35 with a package size of 0201 and 23 with a package size of 0402.

[0048] When using Figure 3 and Figure 4 When the scheme shown integrates and packages all components, its package structure is as follows: Figure 8 As shown, assuming the minimum spacing between adjacent components is 0.15mm, the overall size of the package is 7.55mm × 5.4mm.

[0049] In this embodiment, the first type of components refers to components connected to the power supply line, and the second type of components refers to components connected to the signal line. For the dual DDIC driven display panel shown in Table 1, the first type of components includes 46 components, namely capacitors C1~C24, C29~C46 and diodes D1~D4. The second type of components includes 12 components, namely C25~C28, C47~C50 and resistors R1~R4. The 46 first type of components are attached to the conductive lines led out from the display driver chip 121. The component package 14 obtained after the 12 second type of components are packaged has a size of 3.15mm×2.25mm.

[0050] It can be seen that, compared with the embodiments disclosed herein... Figure 3 and Figure 4 In the embodiment shown, the packaging area of ​​the component package 14 can be reduced by more than 50%, thus leaving more wiring positions, minimizing the space occupied by the flexible circuit board 200, better utilizing the function of the components in the circuit, and avoiding the heat generation problem caused by component clustering.

[0051] In one possible implementation, the display driver chip 121 includes a power pin, and a conductive line 123 leading out from the power pin is the power line. The power pin is located on at least one side of the display driver chip 121 in a first direction, and the first type of component is located on the same side of the display driver chip 121 as the power pin.

[0052] The display driver chip 121 typically includes two rows of pins. In this embodiment, the two rows of pins are distributed on two horizontal sides of the display driver chip 121. At least one row of pins includes a power supply pin. Correspondingly, to achieve close-proximity surface mount connection with the power supply pin, the first type of component is positioned on the same side as the power supply pin.

[0053] For example, in the vertical Y direction, the power supply pin is located above the display driver chip 121, and the first type of components are distributed above the display driver chip 121.

[0054] For example, in the vertical direction Y, the power supply pin is located below the display driver chip 121, and the first type of components are distributed below the display driver chip 121.

[0055] Optionally, there are multiple power supply pins, which are located on opposite sides of the display driver chip 121 in the first direction D1, and the first type of component is disposed on opposite sides of the display driver chip 121 in the first direction D1.

[0056] For example, such as Figure 5 As shown, Figure 5 The distribution area of ​​the first type of components is shown in 151~154. In the vertical direction Y, some power supply pins are located above the display driver chip 121, and some power supply pins are located below the display driver chip 121. At this time, some of the first type of components are distributed above the display driver chip 121, and some of the first type of components are distributed below the display driver chip 121.

[0057] In one possible implementation, the display panel includes a plurality of display driver chips 121, which are spaced apart along a second direction D2, and a component package 124 is disposed between two adjacent display driver chips 121 in the second direction D2.

[0058] exist Figure 5 In the illustrated embodiment, the display panel includes two display driver chips 121, and a component package 124 is disposed between the two display driver chips 121. When there are three or more display driver chips 121, a component package 124 can be disposed between each adjacent display driver chip 121.

[0059] For example, please refer to Figure 9 , Figure 9 This is a schematic diagram of another embodiment of the display module provided in this disclosure, as shown below. Figure 9 As shown, when the display panel includes four display driver chips 121, three component packages 124 can be provided. For any component package 124, at least some of the second type components corresponding to the two adjacent display driver chips 121 are integrated inside it, and all the second type components corresponding to the four display driver chips 121 are integrated and packaged inside the three component packages 124.

[0060] In one possible implementation, the display module further includes a flexible circuit board 200 and a battery 300. The flexible circuit board 200 is disposed on the side of the bonding area 13 away from the chip area 12, and the battery 300 is disposed on the side of the flexible circuit board 200 away from the chip area 12. The flexible circuit board 200 is connected to the conductive line through the bonding area 13, and the bending area 11 is bent from the display side of the display panel to the backlight side.

[0061] Specifically, the bending area 11 bends from the display side of the display panel to the backlight side, as shown in the figure below. Figure 6 As shown, the bonding area 13, the flexible circuit board 200, and the battery 300 are all located on the backlight side. The flexible circuit board 200 is electrically connected to the display driver chip 121 through the bonding area 13. Specifically, based on the bonding area 13, the flexible circuit board 200 is connected to the display driver chip 121 through conductive lines 123.

[0062] It is understood that the principle of binding the flexible circuit board 200 to the display driver chip 121 is the same as the traditional solution. The main improvement of this embodiment is that the component placement position, the component integrated packaging structure, and the component connection to the conductive line are changed, without improving other technologies. Therefore, they will not be described in detail here.

[0063] In one possible implementation, the display driver chip further includes a signal pin, the conductive line leading out from the signal pin being the signal line, the power line including a first end connected to the power pin and a second end connected to the flexible circuit board 200, the trace segment between the first end and the second end being connected to the first type of component to form a power network, the signal line including a third end connected to the signal pin and a fourth end connected to the flexible circuit board 200, the trace segment between the third end and the fourth end being connected to the second type of component within the component package 14 to form a signal network.

[0064] In this embodiment, the wiring network connecting the power pins of the display driver chip 121 to the power / ground layer of the flexible circuit board 200 is referred to as the power network, and the wiring network connecting the signal pins of the display driver chip 121 to the processor / controller of the flexible circuit board 200 is referred to as the signal network. The power network includes power lines and first-type components as described above; similarly, the signal network includes signal lines and second-type components as described above.

[0065] In some embodiments, both the first type of component and the second type of component include one or more of capacitors, resistors, and diodes.

[0066] Optionally, the first type of components includes capacitors and diodes, and the second type of components includes resistors and capacitors.

[0067] It is understandable that the first type of components and the second type of components are distinguished by whether they are connected to a power network or a signal network. Depending on the actual peripheral circuit of the display driver chip 121, the first type of components may also include other types of components, such as resistors and transistors. Similarly, the second type of components may also include other types of components, and are not limited to resistors, capacitors or diodes as described above.

[0068] The display module in this embodiment can be an OLED display panel. It is understood that different types of display panels can also be used depending on actual needs; for example, the display module can also be a quantum dot light-emitting diode (QLED) display panel or a micro light-emitting diode (Micro LED) display panel, etc.

[0069] Based on the same inventive concept, a second aspect of this disclosure provides a method for manufacturing a display module, used to manufacture the display module as described above, such as... Figure 10 As shown, it includes the following steps: Step S101: Prepare a display panel. The display panel includes a display area and a bending area, a chip area, and a bonding area that are sequentially distributed along a first direction on one side of the display area. The chip area is provided with a display driver chip and multiple components. The multiple components include a first type of component and a second type of component. The first type of component is separately disposed on the conductive lines led out from the display driver chip. The second type of component is integrated and packaged in a component package. The component package is connected to the conductive lines led out from the display driver chip. The component package and the display driver chip are distributed at intervals along a second direction, and the second direction intersects the first direction. Step S102: Use the bonding area to bond the flexible circuit board to the display panel.

[0070] It is understood that the display module prepared according to the embodiments of this disclosure has the same or corresponding technical features as the display module described above, which will not be repeated here.

[0071] Obviously, the above embodiments of this disclosure are merely examples for clearly illustrating this disclosure, and are not intended to limit the implementation of this disclosure. For those skilled in the art, other variations or modifications can be made based on the above description. It is impossible to exhaustively list all implementation methods here. Any obvious variations or modifications derived from the technical solutions of this disclosure are still within the protection scope of this disclosure.

Claims

1. A display module, characterized by The display panel comprises a display area and a bending area, a chip area and a binding area arranged in sequence along a first direction on one side of the display area, the chip area is provided with a display driving chip and a plurality of components, the plurality of components comprises first type components and second type components, the first type components are separately arranged on conductive lines led out by the display driving chip, the second type components are integrated and packaged in a component package, the component package is connected with the conductive lines led out by the display driving chip, and the component package and the display driving chip are spaced apart along a second direction intersecting the first direction.

2. The display module of claim 1, wherein, The conductive lines led out by the display driving chip comprise power lines and signal lines, the first type components are components connected with the power lines, and the second type components are components connected with the signal lines.

3. The display module of claim 2, wherein, The first type components are arranged on the conductive lines led out by the display driving chip in a patch manner.

4. The display module of claim 2, wherein, The display driving chip comprises power pins, the conductive lines led out by the power pins are the power lines, the power pins are located on at least one side of the display driving chip in the first direction, and the first type components are located on the same side of the display driving chip as the power pins.

5. The display module of claim 4, wherein, The number of the power pins is plural, the plural power pins are located on opposite sides of the display driving chip in the first direction, and the first type components are arranged on the opposite sides of the display driving chip in the first direction.

6. The display module of claim 1, wherein, The display panel comprises a plurality of display driving chips, and the plurality of display driving chips are spaced apart along a second direction, and one component package is arranged between adjacent two display driving chips in the second direction.

7. The display module of claim 2, wherein, The display module further comprises a flexible circuit board and a battery, the flexible circuit board is arranged on a side of the binding area away from the chip area, the battery is arranged on a side of the flexible circuit board away from the chip area, the flexible circuit board is connected with the conductive lines through the binding area, and the bending area is bent from a display side of the display panel to a backlight side.

8. The display module of claim 2, wherein, The display driving chip further comprises signal pins, the conductive lines led out by the signal pins are the signal lines, the power lines comprise a first end connected with the power pins and a second end connected with the flexible circuit board, a wire segment between the first end and the second end is connected with the first type components to form a power network, the signal lines comprise a third end connected with the signal pins and a fourth end connected with the flexible circuit board, a wire segment between the third end and the fourth end is connected with the second type components in the component package to form a signal network.

9. The display module of claim 3, wherein, The first type components and the second type components each comprise one or more of a capacitor, a resistor and a diode.

10. A method for manufacturing a display module, characterized by, The method comprises the following steps: A display panel is prepared, which comprises a display area and a bending area, a chip area and a binding area arranged in sequence along a first direction on one side of the display area, the chip area is provided with a display driving chip and a plurality of components, the plurality of components comprises first type components and second type components, the first type components are separately arranged on conductive lines led out by the display driving chip, the second type components are integrated and packaged in a component package, the component package is connected with the conductive lines led out by the display driving chip, and the component package and the display driving chip are spaced apart along a second direction intersecting the first direction. The flexible circuit board is bound with the display panel by the binding area.

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