Substrate processing apparatus and substrate processing method

Abstract

The technology disclosed in the specification of the present application is a technology for suppressing damage to an electrolytic cell in substrate processing. A substrate processing apparatus related to the technology disclosed in the specification of the present application includes a substrate processing unit, a supply tank, a generation unit, a recovery unit, a first supply path for supplying a processing liquid generated by the generation unit to the supply tank, and a second supply path for supplying the processing liquid generated by the generation unit to the recovery unit. The recovery unit supplies, to the generation unit, the post-processing liquid in which the processing liquid supplied through the second supply path is mixed.

Description

Technical Field

[0001] The technology disclosed in this application relates to a substrate processing technology. Substrates that can be processed include, for example, semiconductor wafers, glass substrates for liquid crystal display devices, substrates for flat panel displays (FPDs) such as organic EL (electroluminescence) display devices, substrates for optical discs, substrates for magnetic disks, substrates for magneto-optical discs, glass substrates for photomasks, ceramic substrates, substrates for field emission displays (FEDs), or substrates for solar cells. Background Technology

[0002] Conventionally, a mixed solution of sulfuric acid and hydrogen peroxide (SPM) has been used as a processing solution in substrate processing (see, for example, Patent Document 1). SPM is a processing solution that generates oxidizing power by mixing hydrogen peroxide with sulfuric acid, and is mainly used for substrate processing such as removing resists formed on the upper surface of the substrate.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2018-163977 Summary of the Invention

[0006] The problem the invention aims to solve

[0007] On the other hand, electrolytic sulfuric acid can be used as the processing solution for substrate treatment, replacing the use of SPM, which generates a large amount of wastewater. After being used for substrate treatment, the electrolytic sulfuric acid can be reused as a processing solution through re-electrolysis, thus reducing the amount of wastewater discharged.

[0008] However, the following problem exists: when the electrolytic sulfuric acid used for substrate treatment is electrolyzed again, if the resist and other substances generated during substrate treatment remain in the liquid, it will damage the electrolytic cell and cause losses.

[0009] The technology disclosed in this application specification was made in view of the problems described above, and is a technology for suppressing damage to the electrolytic cell during substrate processing.

[0010] Technical means for solving problems

[0011] A substrate processing apparatus, as a first embodiment of the technology disclosed in this application, comprises: a substrate processing unit for processing a substrate using a processing liquid; a supply tank for storing the processing liquid supplied to the substrate processing unit; a generation unit for generating the processing liquid by electrolysis; a recovery unit for recovering the processing liquid, i.e., the processed liquid, supplied to the substrate processing unit and supplying the processed liquid to the generation unit; a first supply path for supplying the processing liquid generated by the generation unit to the supply tank; and a second supply path for supplying the processing liquid generated by the generation unit to the recovery unit, wherein the second supply path is a path different from the first supply path; the recovery unit supplies the processed liquid, after mixing with the processing liquid supplied via the second supply path, to the generation unit.

[0012] As a second embodiment of the substrate processing apparatus disclosed in this application, related to the first embodiment of the substrate processing apparatus, the substrate processing apparatus further includes a first measuring unit that measures the volume of the processed liquid in the recovery unit and outputs a measurement result, and the generating unit controls the flow rate of the processed liquid supplied to the recovery unit based on the measurement result.

[0013] As a third-party substrate processing apparatus of the technology disclosed in this application specification, related to a substrate processing apparatus of the first or second type, the generation unit has a first temperature adjustment unit for adjusting the processed liquid and the generated processing liquid to an electrolysis temperature, wherein the electrolysis temperature is the temperature used to generate the processing liquid by electrolysis.

[0014] As a fourth type of substrate processing apparatus disclosed in this application specification, which is related to a substrate processing apparatus of any one of the first to third types, the recovery unit has a second temperature adjustment unit for adjusting the processed liquid to an electrolysis temperature, wherein the electrolysis temperature is the temperature at which the processed liquid is generated by electrolysis.

[0015] As a fifth aspect of the technology disclosed in this application specification, the substrate processing apparatus, which is related to any of the first to fourth aspects of the substrate processing apparatus, further includes a second measuring unit that measures the total organic carbon concentration of the processed liquid in the recovery unit and outputs the measurement result, and the generating unit controls the flow rate of the processed liquid supplied to the recovery unit based on the measurement result.

[0016] The sixth type of substrate processing method disclosed in this application discloses a method for processing a substrate using a processing liquid, comprising: a step of storing the processing liquid supplied to a substrate processing unit in a supply tank; a step of processing the substrate using the processing liquid in the substrate processing unit; a step of recovering the processing liquid supplied to the substrate processing unit, i.e., the processed liquid, to a recovery unit and then supplying it to a generation unit; and a step of generating the processing liquid from a liquid containing the processed liquid by electrolysis in the generation unit; having: a first supply path for supplying the processing liquid generated by the generation unit to the supply tank; and a second supply path for supplying the processing liquid generated by the generation unit to the recovery unit, the second supply path being a path different from the first supply path; the step of supplying the processed liquid to the generation unit is a step of supplying the processed liquid mixed with the processing liquid supplied via the second supply path to the generation unit.

[0017] The effects of the invention

[0018] According to at least the first and sixth methods of the technology disclosed in this application, the decomposition of resists and the like in the liquid can be promoted by supplying a treatment liquid from the generating tank. This allows the treated liquid to be supplied to the electrolytic cell, thereby reducing damage to the electrolytic cell during electrolysis.

[0019] Furthermore, the objects, features, aspects, and advantages related to the technology disclosed in this application will become clearer through the following detailed description and the accompanying drawings. Attached Figure Description

[0020] Figure 1 This is a diagram illustrating an example of the structure of a substrate processing apparatus according to an embodiment.

[0021] Figure 2 It is a conceptual representation Figure 1 A diagram illustrating an example of the structure of the control unit.

[0022] Figure 3 This is a diagram that schematically illustrates an example of a processing unit and related structure in a substrate processing apparatus according to an embodiment.

[0023] Figure 4 This is a cross-sectional view showing an example of the internal structure of an ejector nozzle.

[0024] Figure 5 This is a diagram illustrating an example of the structure of a substrate processing apparatus in a cyclic state of ejecting nozzles.

[0025] Figure 6 This is a diagram illustrating an example of the structure of a substrate processing apparatus in the ejection state of the ejection nozzle.

[0026] Figure 7 This diagram illustrates an example of a case where the treated liquid is circulated to a recovery tank while the nozzle is in the ejection state. Detailed Implementation

[0027] Hereinafter, embodiments will be described with reference to the accompanying drawings. In the following embodiments, detailed features are shown for illustrative purposes, but these are illustrative examples and are not all features necessary for implementing the embodiments.

[0028] Furthermore, the accompanying drawings are presented in a generalized manner, and for ease of explanation, structures may be omitted or simplified as appropriate. Additionally, the sizes and relative positions of structures shown in different drawings may not be accurately depicted and may be appropriately modified. Furthermore, sometimes in drawings such as top views (which are not sectional views), shading lines are used to aid in understanding the embodiments.

[0029] Furthermore, in the following description, the same structural components are illustrated using the same reference numerals, and their names and functions are also the same. Therefore, detailed descriptions of them are sometimes omitted to avoid repetition.

[0030] Furthermore, in the descriptions contained in this application, the use of terms such as "possessing," "including," or "having" a certain structural member does not constitute an exclusive statement excluding the existence of other structural members unless otherwise specified in advance.

[0031] Furthermore, although ordinal numbers such as "first" or "second" are sometimes used in the description described in this application, these terms are used to facilitate understanding of the content of the embodiments, and the content of the embodiments is not limited to the order that can be generated by these ordinal numbers.

[0032] Furthermore, although terms such as "upper," "lower," "left," "right," "side," "bottom," "top," or "back" that indicate a specific position or direction are sometimes used in the description of this application, these terms are used to facilitate understanding of the content of the embodiments and are unrelated to the position or direction in which the embodiments are actually implemented.

[0033] Furthermore, in the description of this application, when referred to as "...the upper surface" or "...the lower surface," it includes not only the upper or lower surface of the structural member being targeted, but also the state where other structural members are formed on the upper or lower surface of the structural member being targeted. That is, for example, when described as "B provided on the upper surface of A," it does not preclude the provision of another structural member "C" between A and B.

[0034] <Implementation Method>

[0035] The substrate processing apparatus and substrate processing method of this embodiment will be described below.

[0036] <Structure of the substrate processing apparatus>

[0037] Figure 1 This is a diagram illustrating an example of the structure of the substrate processing apparatus according to this embodiment. (See diagram for example.) Figure 1 As illustrated, the substrate processing apparatus 1 includes a plurality of processing units 600, a supply tank 10, a generation tank 20A and a generation tank 20B, an electrolytic cell 21A and an electrolytic cell 21B, a recovery tank 30, a discharge tank 40 for discharging processing liquids, and a control unit 90.

[0038] The processing unit 600 processes the substrate using the supplied processing liquid. A detailed description of the structure of the processing unit 600 will follow later. Furthermore, the number of processing units 600 is not limited to this. Figure 1 The number shown.

[0039] Supply tank 10 stores the processed liquid supplied from generation tank 20A or generation tank 20B via supply piping 100. Furthermore, supply tank 10 supplies this processed liquid to processing unit 600. Additionally, pure water (DIW), hydrogen peroxide water, or ozone water is supplied to supply tank 10 from pure water supply source 12. The flow rate of pure water, etc., supplied from pure water supply source 12 can be adjusted by controlling valve 12A via control unit 90. Alternatively, a pure water supply source 12 may not be included.

[0040] The piping for supplying the processing fluid from the supply tank 10 includes a circulation piping 102 connected to the supply tank 10 and circulating the processing fluid through the supply tank 10; a measuring piping 104 branching from the circulation piping 102 to return the processing fluid to the supply tank 10; a supply piping 106 branching from the circulation piping 102 to supply the processing fluid to each processing unit 600; a return piping 108 branching at the downstream end of each supply piping 106 to return the processing fluid to the supply tank 10; and a circulation piping 110 returning the processing fluid converging from each return piping 108 to the supply tank 10.

[0041] A flow meter 112 for measuring the flow rate of the processed liquid, a pump 114 for flowing the processed liquid, a heater 116 for heating the processed liquid, a thermometer 117 for measuring the temperature of the processed liquid, a heat exchanger 116A for cooling the processed liquid, a thermometer 117A for measuring the temperature of the processed liquid, and an electrolytic cell 118 for electrolyzing the processed liquid are installed upstream of the branch point of the circulating piping 102 compared to the branch point of the measuring piping 104. Alternatively, the electrolytic cell 118 may be omitted if the self-decomposition of the processed liquid is sufficiently suppressed. Furthermore, the heater may be replaced with a temperature-regulating mechanism that includes cooling, and is not limited to heating. The same applies to the heaters shown below.

[0042] A concentration meter 120 is installed in the measuring pipe 104 to measure the concentration (e.g., total organic carbon concentration, i.e., TOC concentration) of the treated liquid flowing in the measuring pipe 104. If the concentration of the treated liquid measured by the concentration meter 120 is higher than the desired concentration, pure water or the like is supplied from the pure water supply source 12 to the supply tank 10 under the control of the control unit 90, thereby reducing the concentration of the treated liquid. Conversely, if the concentration of the treated liquid measured by the concentration meter 120 is lower than the desired concentration, the treated liquid is electrolyzed in the electrolytic cell 118 under the control of the control unit 90. Water is electrolyzed simultaneously during this process, thereby increasing the concentration of the treated liquid. Furthermore, the water produced by electrolysis can be used as feed water.

[0043] A filter 119 for removing particles and the like from the processing liquid is provided on the downstream side of the circulation pipe 102 compared to the branch position at the measuring pipe 104, and a valve 102A for adjusting the flow rate of the processing liquid circulating in the circulation pipe 102 by means of the control unit 90.

[0044] A valve 106A is provided in the supply pipe 106, which can be controlled by the control unit 90 to regulate the flow rate of the processing fluid flowing in the supply pipe 106. A portion of the flow rate of the processing fluid flowing in the circulation pipe 102 flows to the supply pipe 106.

[0045] A valve 108A is provided in the return pipe 108, which can be controlled by the control unit 90 to adjust the flow rate of the processing liquid flowing in the return pipe 108.

[0046] Additionally, the return pipe 108 is installed in the ejector nozzle 106B of the processing unit 600 at a branch point from the supply pipe 106. The ejector nozzle 106B is also connected to a mixing pipe 200, which mixes the treatment liquid (DIW), hydrogen peroxide water, or ozone water, i.e., the supply water, in the supply pipe 106. A valve 200A is provided in the mixing pipe 200, which can be controlled by the control unit 90 to adjust the flow rate of the supply water flowing in the mixing pipe 200.

[0047] In addition, the water supplied to the mixing pipe 200 can be supplied from the pure water supply source 12 or from another prepared supply source.

[0048] The piping for recovering the processing liquid from the processing unit 600 includes a drain pipe 122 connected to each processing unit 600 and draining the processing liquid (processed liquid) used for substrate processing; a recovery pipe 124 supplying the processed liquid from the drain pipes 122 to the recovery tank 30; a recovery pipe 126 connected to the recovery tank 30 and supplying the processed liquid to the generation tank 20A or the generation tank 20B; a circulation pipe 128 circulating the processing liquid between the generation tank 20A and the electrolytic cell 21A; a circulation pipe 130 circulating the processing liquid between the generation tank 20B and the electrolytic cell 21B; a supply pipe 132 merging the processing liquid from the generation tank 20A to the supply pipe 100; and a supply pipe 134 merging the processing liquid from the generation tank 20B to the supply pipe 100. A valve 122A is provided in the drain pipe 122 to regulate the flow rate of the drain from the processing unit 600 by means of the control unit 90.

[0049] Here, multiple recovery tanks 30 can also be arranged side by side. That is, the treated liquid from the recovery piping 124 can be selectively supplied to multiple recovery tanks, thereby extending the time from when the treated liquid is supplied from the recovery tank to the generation tank. In addition, a level sensor 190 for measuring the volume of the treated liquid stored in the recovery tank 30 is provided in the recovery tank 30.

[0050] The recovery piping 126 is equipped with a pump 136 for conveying the treated liquid stored in the recovery tank 30 to the generation tank 20A or the generation tank 20B, a heater 180 for heating the treated liquid, a thermometer 181 for measuring the temperature of the treated liquid, a heat exchanger 180A for cooling the treated liquid, a thermometer 181A for measuring the temperature of the treated liquid, a concentration meter 184 for measuring the concentration of the treated liquid (e.g., total organic carbon concentration, i.e., TOC concentration), a valve 126A for adjusting the flow rate of the treated liquid delivered to the generation tank 20A by control unit 90, and a valve 126B for adjusting the flow rate of the treated liquid delivered to the generation tank 20B by control unit 90.

[0051] Additionally, a circulation pipe 183 is provided branching from the recovery pipe 126. The circulation pipe 183 returns the treated liquid to the recovery tank 30 for circulation. A valve 182A is provided downstream of the branch point of the recovery pipe 126, and a control unit 90 controls the flow rate of the treated liquid flowing into the recovery pipe 126. Furthermore, a valve 182B is provided upstream of the circulation pipe 183, and a control unit 90 controls the flow rate of the treated liquid flowing into the circulation pipe 183.

[0052] In contrast to the recovery piping 126, the supply piping 170, which connects the processing liquid stored in the generating tank 20A or generating tank 20B to the recovery tank 30, is provided to transport the processing liquid to the generating tank 20A and generating tank 20B to the recovery tank 30. The supply piping 170 is provided as a different piping than the supply piping 100.

[0053] The supply piping 170 is equipped with a valve 170A for regulating the flow rate of the processed liquid flowing into the supply piping 170 from the generating tank 20A by control unit 90, a pump 172 for conveying the processed liquid to flow into the supply piping 170 from the generating tank 20A, a valve 170B for regulating the flow rate of the processed liquid flowing into the supply piping 170 from the generating tank 20B by control unit 90, a pump 174 for conveying the processed liquid to flow into the supply piping 170 from the generating tank 20B, and a valve 170C for regulating the flow rate of the processed liquid flowing into the recovery tank 30 from the supply piping 170 by control unit 90.

[0054] The circulation piping 128 is equipped with a valve 128A for adjusting the flow rate of the treatment fluid flowing in the circulation piping 128 by control using the control unit 90, a concentration meter 138 for measuring the concentration (e.g., total organic carbon concentration, i.e., TOC concentration) of the treatment fluid flowing in the circulation piping 128, a pump 140 for conveying the treatment fluid flowing in the circulation piping 128, a heater 142 for heating the treatment fluid, a thermometer 143 for measuring the temperature of the treatment fluid, a heat exchanger 142A for cooling the treatment fluid, a thermometer 143A for measuring the temperature of the treatment fluid, and a filter 144 for removing particles and the like from the treatment fluid.

[0055] The circulation piping 130 is equipped with a valve 130A for adjusting the flow rate of the treatment liquid flowing in the circulation piping 130 by control using the control unit 90, a concentration meter 146 for measuring the concentration (e.g., total organic carbon concentration, i.e., TOC concentration) of the treatment liquid flowing in the circulation piping 130, a pump 148 for conveying the treatment liquid flowing in the circulation piping 130, a heater 150 for heating the treatment liquid, a thermometer 151 for measuring the temperature of the treatment liquid, a heat exchanger 150A for cooling the treatment liquid, a thermometer 151A for measuring the temperature of the treatment liquid, and a filter 152 for removing particles and the like from the treatment liquid.

[0056] A valve 132A is provided in the supply pipe 132, which can be controlled by the control unit 90 to adjust the flow rate of the processing liquid flowing in the supply pipe 132.

[0057] A valve 134A is provided in the supply pipe 134, which can be controlled by the control unit 90 to adjust the flow rate of the processing liquid flowing in the supply pipe 134.

[0058] The supply piping 100 is equipped with a pump 154 ​​for conveying the processing liquid flowing in the supply piping 100, a heater 156 for heating the processing liquid, a filter 158 for removing particles and the like from the processing liquid, and a valve 100A for adjusting the flow rate of the processing liquid flowing in the supply piping 100 by means of a control unit 90.

[0059] Additionally, pure water (DIW), hydrogen peroxide water, or ozone water is supplied from the pure water supply source 14 to the generation tanks 20A and 20B. The flow rate of the pure water supplied from the pure water supply source 14 to the generation tank 20A can be adjusted by controlling valve 14A using the control unit 90. Similarly, the flow rate of the pure water supplied from the pure water supply source 14 to the generation tank 20B can be adjusted by controlling valve 14B using the control unit 90. Alternatively, the pure water supply source 14 may not be present.

[0060] Additionally, sulfuric acid (H2SO4) is supplied from sulfuric acid supply source 16 to generating tanks 20A and 20B. The flow rate of sulfuric acid supplied from sulfuric acid supply source 16 to generating tank 20A can be adjusted by controlling valve 16A using control unit 90. Similarly, the flow rate of sulfuric acid supplied from sulfuric acid supply source 16 to generating tank 20B can be adjusted by controlling valve 16B using control unit 90. Alternatively, a sulfuric acid supply source 16 may not be present.

[0061] The piping for discharging the treated liquid and the treated liquid includes a drain pipe 160 for discharging the treated liquid from each of the processing units 600 to the drain tank 40, a drain pipe 162 for discharging the treated liquid from the supply tank 10 to the drain tank 40, and a drain pipe 164 for discharging the treated liquid or the treated liquid from the generating tank 20A, generating tank 20B, and recovery tank 30 to the drain tank 40. A valve 160A is provided in the drain pipe 160 to adjust the flow rate of the drained liquid from the processing unit 600 under the control of the control unit 90. A valve 162A is provided in the drain pipe 162 to adjust the flow rate of the drained liquid from the supply tank 10 under the control of the control unit 90. The drain pipe 164 is equipped with a valve 164A for adjusting the flow rate of the drain from the generating tank 20A, a valve 164B for adjusting the flow rate of the drain from the generating tank 20B, and a valve 164C for adjusting the flow rate of the drain from the recovery tank 30, all controlled by the control unit 90.

[0062] Figure 2 It is a conceptual representation Figure 1 The diagram illustrates an example of the structure of the control unit 90. The control unit 90 can be constructed from a conventional computer with circuitry. Specifically, the control unit 90 includes a central processing unit (CPU) 91, a read-only memory (ROM) 92, a random access memory (RAM) 93, a storage device 94, an input unit 96, a display unit 97, and a communication unit 98, as well as a bus 95 connecting them to each other.

[0063] ROM 92 stores the basic program. RAM 93 serves as the operating area for CPU 91 to perform specified processing. Storage device 94 is composed of non-volatile storage devices such as flash memory or hard disk drives. Input unit 96 is composed of various switches or touch panels, etc., and receives input setting instructions such as processing procedures from the operator. Display unit 97 is composed of, for example, a liquid crystal display device and indicator lights, and displays various information under the control of CPU 91. Communication unit 98 has the function of data communication via local area network (LAN) or the like.

[0064] Storage device 94 is pre-set with Figure 1The substrate processing apparatus 1 has multiple modes related to the control of each structure. The CPU 91 executes a processing program 94P to select one of these multiple modes and controls each structure in that mode. Furthermore, the processing program 94P can also be stored in a recording medium. If this recording medium is used, the processing program 94P can be installed in the control unit 90. Additionally, some or all of the functions performed by the control unit 90 do not necessarily need to be implemented in software; they can also be implemented in hardware such as dedicated logic circuits.

[0065] Figure 3 This is a schematic diagram illustrating an example of the processing unit 600 and related structures in the substrate processing apparatus of this embodiment. Furthermore, Figure 3 It shows Figure 1 This example illustrates the configuration of a processing unit 600 located downstream of one supply pipe 106, but the structure of processing units 600 located downstream of other supply pipes 106 is also similar. Figure 3 The situation is the same in the example shown.

[0066] like Figure 3 As illustrated, the processing unit 600 includes: a box-shaped chamber 80 having an internal space; a rotating chuck 251 that holds a substrate W in a horizontal position within the chamber 80 and rotates the substrate W about a vertical rotation axis Z1 passing through the center of the substrate W; and a cylindrical processing cup 511 that surrounds the rotating chuck 251 about the rotation axis Z1 of the substrate W.

[0067] The chamber 80 is surrounded by a box-shaped wall 250A. The wall 250A has an opening 250B for moving the substrate W into or out of the chamber 80.

[0068] The opening 250B is opened and closed by a baffle 250C. The baffle 250C is in the closed position covering the opening 250B by a baffle lifting mechanism (not shown here). Figure 3 (represented by a double-dotted line) and the opening position that allows the opening 250B to open ( Figure 3 The rise and fall between (represented by solid lines in the middle).

[0069] like Figure 3 As illustrated, the rotary chuck 251 has a circular plate-shaped rotary base 251A disposed opposite to the horizontally positioned substrate W, a plurality of chuck pins 251B protruding upward from the outer periphery of the upper surface of the rotary base 251A and clamping the periphery of the substrate W, a rotary shaft 251C extending downward from the center of the rotary base 251A, and a rotary motor 251D that rotates the substrate W adsorbed on the rotary base 251A by rotating the rotary shaft 251C.

[0070] Furthermore, the rotary chuck 251 is not limited to Figure 3The exemplified clamping chuck can also be, for example, a vacuum adsorption chuck with a rotating base having a lower surface of a vacuum adsorption substrate W.

[0071] The processing unit 600 can also be connected to a nozzle for spraying liquids for other purposes (e.g., a nozzle for spraying other medicines or a nozzle for spraying rinsing liquid, etc.).

[0072] In addition, such as Figure 3 As illustrated, a spray nozzle 106B for spraying treatment liquid is connected to the top end of the supply pipe 106 connected to the processing unit 600. The spray nozzle 106B sprays the treatment liquid toward a predetermined part (e.g., the rotating base 251A) inside the chamber 80.

[0073] The processing cup 511 is arranged to surround the rotating chuck 251 and is raised and lowered in the vertical direction by a lifting mechanism (motor or cylinder, etc., not shown). The upper part of the processing cup 511 moves between an upper position, which is above the substrate W held by the rotating base 251A, and a lower position, which is below the substrate W.

[0074] The processing liquid that splashes outward from the upper surface of the substrate W is caught by the inner side of the processing cup 511. Furthermore, the processing liquid caught by the processing cup 511 is appropriately discharged to the outside of the chamber 80 via drain pipes 122 and 160 located at the bottom of the chamber 80 and inside the processing cup 511. Additionally, ambient gas inside the processing cup 511 is discharged using a cup exhaust mechanism (not shown).

[0075] In addition, an exhaust port 515 is provided on the side of the chamber 80. The ambient gas inside the chamber 80 is appropriately discharged to the outside of the chamber 80 through the exhaust port 515.

[0076] Figure 4 This is a cross-sectional view showing an example of the internal structure of the ejector nozzle 106B.

[0077] The nozzle 106B has a body 36 forming a flow path 35 for guiding the treatment fluid, a valve body 37 for opening and closing the flow path 35, an air compressor actuator 38 for moving the valve body 37 forward and backward along the axial direction X1 to open and close the flow path 35, a mixing pipe 200 for converging at a position (flow path 35c) in the flow path 35 further downstream than the valve body 37, and a nozzle outlet 31.

[0078] The main body 36 has a cylinder 39 constituting an air compressor actuator 38, a valve chamber 40A that moves the valve body 37 forward and backward, a flow path 35a that is connected to the supply pipe 106 and leads to the valve chamber 40A, a flow path 35b that is connected to the flow path 35a and is connected to the return pipe 108 at a position upstream of the valve chamber 40A, and a flow path 35c that leads from the valve chamber 40A to the nozzle 31.

[0079] Cylinder 39 and valve chamber 40A are arranged axially X1. Cylinder 39 and valve chamber 40A are separated by a partition wall 41. Flow paths 35a and 35c correspond to parts of the supply piping 106 that guides the processed liquid supplied from the supply tank 10 to the spray outlet 31. Additionally, flow path 35b corresponds to part of the return piping 108 that returns the processed liquid to the supply tank 10.

[0080] The pneumatic actuator 38 includes a cylinder 39, a piston 42, a spring 43, and a rod 44. The cylinder 39 is divided by the piston 42 into a front chamber on the side of a partition wall 41 and a rear chamber on the opposite side of the piston 42, located axially X1. Connectors 47 are respectively attached to the body 36 for connecting pipes that separately transmit air pressure to the front and rear chambers of the cylinder 39. The piston 42 moves axially X1 within the cylinder 39 by transmitting air pressure to either the front or rear chamber via the pipes and connectors 47.

[0081] Spring 43 is installed between piston 42 and body 36 on the rear chamber side of cylinder 39, pressing piston 42 toward partition wall 41.

[0082] The base of rod 44 is connected to piston 42, and its tip protrudes into valve chamber 40A through partition wall 41. A valve body 37 is connected to the tip of rod 44 protruding into valve chamber 40A. Valve body 37 is formed in the shape of a circular plate, connected to the tip of rod 44 in a manner that the radial direction is orthogonal to the axial direction X1. When piston 42 moves forward and backward along axial direction X1 within cylinder 39, valve body 37 moves forward and backward along axial direction X1 within valve chamber 40A via rod 44.

[0083] Valve chamber 40A includes an annular valve seat surface 46 opposite to partition wall 41 and orthogonal to axial direction X1. At the center of valve seat surface 46, flow path 35a has a concentric opening. Flow path 35c has a lateral opening in the forward and backward direction (axial direction X1) of valve body 37 of valve chamber 40A.

[0084] The main body 36 includes a cylindrical portion 49 with a nozzle outlet 31 formed at the top and protruding downward from the lower surface of the nozzle head 26. In addition, a mixing pipe 200 is inserted from the side of the cylindrical portion 49, and the mixing pipe 200 is connected to a flow path 35c located downstream of the valve chamber 40A.

[0085] With no air pressure applied to the front and rear chambers of cylinder 39, and without actuating the pneumatic actuator 38, piston 42 is pressed to the forward position within cylinder 39 by spring 43, i.e., as Figure 4 As illustrated, when pushed to a position close to the partition wall 41, the valve body 37 contacts the valve seat surface 46 within the valve chamber 40A, and the opening of the flow path 35a is closed.

[0086] Therefore, the flow path 35a and flow path 35c are closed, and the treatment liquid supplied from the supply tank 10 through the supply pipe 106 and flow path 35a returns to the supply tank 10 through flow path 35b and return pipe 108 (circulation state).

[0087] In this cycle state, if air pressure is transmitted to the front chamber of cylinder 39, causing piston 42 to retract towards the rear chamber of cylinder 39 against the pressing force of spring 43, then within valve chamber 40A, valve body 37 moves away from valve seat surface 46, and the opening of flow path 35a is released from valve chamber 40A. Therefore, flow path 35a and flow path 35c are connected via valve chamber 40A, and the treatment fluid supplied from supply tank 10 through supply pipe 106 and flow path 35a is ejected from nozzle 31 through flow path 35c (ejection state).

[0088] In this ejection state, if the air pressure is stopped from being transmitted to the front chamber of cylinder 39, and instead air pressure is transmitted to the rear chamber of cylinder 39, causing piston 42 to move towards the front chamber of cylinder 39, i.e., closer to partition wall 41, due to the pressing force of spring 43, then within valve chamber 40A, valve body 37 contacts valve seat surface 46, and the opening of flow path 35a is closed. Therefore, flow path 35a and flow path 35c are closed, restoring the circulation state where the treatment fluid supplied from supply tank 10 through supply pipe 106 and flow path 35a returns to supply tank 10 through flow path 35b and return pipe 108.

[0089] In the above-described ejection state, if valve 200A is opened to allow water to be mixed into the processing solution from the mixing pipe 200, the temperature of the processing solution containing electrolytic sulfuric acid will rise due to the heat of reaction. Specifically, the temperature of the processing solution will rise to the temperature used for substrate processing (processing temperature).

[0090] <Regarding the operation of the substrate processing apparatus>

[0091] Next, the operation of the substrate processing apparatus will be described. The substrate processing method using the substrate processing apparatus of this embodiment includes: a step of spraying a processing liquid onto a substrate W that has been fed into the processing unit 600 to perform substrate processing; a step of cleaning the substrate W that has undergone substrate processing; a step of rotating the cleaned substrate W to dry it; and a step of removing the dried substrate W from the processing unit 600.

[0092] The following is for reference Figure 5 as well as Figure 6 The substrate processing included in the operation of the aforementioned substrate processing apparatus will be described. Here, Figure 5 This is a diagram illustrating an example of the structure of a substrate processing apparatus in a cyclic state of ejecting nozzle 106B. Additionally, Figure 6 This is a diagram illustrating an example of the structure of a substrate processing apparatus in the ejection state of the ejection nozzle 106B. Figure 5as well as Figure 6 In the diagram, valves in the open state are indicated by black. Furthermore, the actions shown below are performed by controlling the operation of various structures (pumps, heaters, valves, or rotary motors, etc.) in the board processing device 1 using the control unit 90.

[0093] First, sulfuric acid (H2SO4) is circulated between the generating tank 20A and the electrolytic cell 21A via circulation piping 128 to generate a treatment solution containing electrolyzed sulfuric acid. Here, electrolyzed sulfuric acid refers to persulfate (peroxydisulfate; i.e., H2S2O8) generated by electrolyzing sulfuric acid. At the same temperature, persulfate has a stronger oxidizing power than carboxylic acid (H2SO5).

[0094] By controlling valve 16A through control unit 90, sulfuric acid is appropriately supplied from sulfuric acid supply source 16 to generation tank 20A. Additionally, by controlling valve 14A through control unit 90, pure water (DIW) is appropriately supplied from pure water supply source 14. Furthermore, as described below, by controlling valve 126A through control unit 90, treated liquid is supplied from recovery tank 30 to generation tank 20A.

[0095] When valve 128A is open, the processing liquid stored in the generation tank 20A is conditioned to, for example, below 60°C by heater 142 and heat exchanger 142A in the circulation piping 128, particulates are appropriately removed by filter 144, and then pumped to electrolytic cell 21A by pump 140. Since heat may be generated during electrolysis in electrolytic cell 21A, heat exchanger 142A is preferably provided to conditioned the processing liquid to below 60°C. By conditioned the processing liquid to below 60°C (electrolysis temperature), the generation rate of electrolytic sulfuric acid during sulfuric acid electrolysis increases. Furthermore, by conditioned the processing liquid to below 60°C, the self-decomposition of electrolytic sulfuric acid into carboxylic acid (H₂SO₅) and OH radicals can be suppressed.

[0096] Then, by electrolyzing the temperature-controlled sulfuric acid in electrolytic cell 21A, a treatment solution containing electrolyzed sulfuric acid and sulfuric acid is generated. Here, since water molecules in the treatment solution are also electrolyzed during sulfuric acid electrolysis, the concentration of the treatment solution increases as electrolysis proceeds. The concentration of the treatment solution containing electrolyzed sulfuric acid is measured by concentration meter 138, and the control unit 90 controls the flow rate of the treatment solution supplied to electrolytic cell 21A based on the measured concentration (i.e., by controlling the opening and closing of control valve 128A, the flow rate of the treatment solution is increased when the measured concentration is low, and decreased when the measured concentration is high). Furthermore, if the concentration of electrolyzed sulfuric acid is reduced, the persulfate generation efficiency increases.

[0097] The aforementioned generating tanks 20A and 20B are redundant. Therefore, similar to the case of generating tank 20A, sulfuric acid (H2SO4) is circulated between generating tank 20B and electrolytic cell 21B via circulation piping 130 to generate a treatment solution containing electrolyzed sulfuric acid.

[0098] By controlling valve 16B via control unit 90, sulfuric acid is appropriately supplied from sulfuric acid supply source 16 to generation tank 20B. Additionally, by controlling valve 14B via control unit 90, pure water (DIW) is appropriately supplied from pure water supply source 14. Furthermore, as described below, by controlling valve 126B via control unit 90, treated liquid is supplied from recovery tank 30 to generation tank 20B.

[0099] When valve 130A is open, the processing liquid stored in the generating tank 20B is conditioned to the electrolysis temperature (e.g., below 60°C) by the heater 150 and heat exchanger 150A in the circulation piping 130, particles are appropriately removed by the filter 152, and the liquid is then pumped to the electrolytic cell 21B by the pump 148. Since heat may be generated during electrolysis in the electrolytic cell 21B, a heat exchanger 150A is preferably provided to conditioned the processing liquid to below 60°C.

[0100] Then, by electrolyzing the temperature-controlled sulfuric acid in electrolytic cell 21B, a treatment solution containing electrolyzed sulfuric acid and sulfuric acid is generated. The concentration of the treatment solution containing electrolyzed sulfuric acid is measured by concentration meter 146, and the control unit 90 adjusts the flow rate of the treatment solution supplied to electrolytic cell 21B by opening and closing control valve 130A based on the measured concentration.

[0101] Generating tanks 20A and 20B can supply processing liquid to the supply tank 10 in a switchable manner. For example, Figure 5 As illustrated, valve 128A can be opened to circulate the treatment liquid in the circulation piping 128, and valve 132A can be opened to supply the treatment liquid from the generating tank 20A to the supply tank 10. During this period, valves 130A and 134A are closed to pre-store the treated liquid from the recovery tank 30 in the generating tank 20B. Alternatively, if the concentration of the electrolyzed sulfuric acid stored in the generating tank 20A does not reach the desired concentration, valve 128A can be opened and valve 132A closed to continue circulating the treatment liquid in the circulation piping 128. The concentration of the treatment liquid increases through the electrolysis of sulfuric acid, and valves 130A and 134A are opened to supply the supply tank 10 with the treatment liquid circulating in the circulation piping 130, which has reached the desired concentration. That is, even if the treatment liquid is being generated in one generating tank (electrolytic cell), the treatment liquid can be continuously supplied from another generating tank.

[0102] The processing fluid supplied from any one (or both) of the generating tanks is conditioned to a temperature of, for example, below 60°C by a heater 156 in the supply piping 100, passes through a filter 158 to remove particulates, etc., and is pumped by a pump 154 ​​via an open valve 100A to the supply tank 10.

[0103] The processing liquid supplied from the generation tank via the supply piping 100 is stored in the supply tank 10. In addition, pure water (DIW) or the like is appropriately supplied from the pure water supply source 12 to the supply tank 10 to adjust the concentration of the processing liquid.

[0104] The processing fluid, supplied from the supply tank 10 via the circulation piping 102, is temperature-regulated by the heater 116 so that the temperature measured by the thermometer 117 in the circulation piping 102 becomes, for example, below 60°C. Particulate matter is appropriately removed by the filter 119, and the fluid is then pumped back to the supply tank 10 by the pump 114. The control unit 90 monitors the substrate processing performed by the processing unit 600 according to the processing procedure, and regulates the flow rate of the processing fluid circulating in the circulation piping 102 by opening and closing the valve 102A, etc., so that the flow rate of the processing fluid measured by the flow meter 112 becomes sufficient for the substrate processing.

[0105] A valve 104A, whose flow rate is adjusted by control of the control unit 90, and a concentration meter 120 are installed on the measuring pipe 104 branching from the circulation pipe 102. The control unit 90 performs the following controls based on the concentration of the treated liquid measured by the concentration meter 120: opening the valve 12A to supply pure water or the like to the supply tank 10 from the pure water supply source 12, or electrolyzing the treated liquid in the electrolytic cell 118 to increase the concentration of the treated liquid.

[0106] A supply pipe 106 is provided on the downstream side of the circulation pipe 102, branching to each processing unit 600. The corresponding valve 106A is opened by the control unit 90, so that the processing liquid can be supplied to the processing unit 600 appropriately.

[0107] In the cyclic state of the ejection nozzle 106B ( Figure 4 With the valve body 37 in contact with the valve seat surface 46, valves 106A and 108A are opened, and the processing liquid supplied from the circulation pipe 102 to the supply pipe 106 and then to the return pipe 108 merges into the circulation pipe 110, thereby returning to the supply tank 10. In this way, by circulating the processing liquid within the ejection nozzle 106B in the supply pipe 106, temperature changes in the processing liquid caused by the temperature difference between the pipe and the processing liquid can be suppressed when the ejected processing liquid is used for substrate processing. Furthermore, the processing liquid supplied via the return pipe 108 during circulation is preferably suppressed to a minimum flow rate sufficient to maintain the temperature of the pipe.

[0108] In the ejection state of the ejection nozzle 106B ( Figure 4 With the valve body 37 in the state of being away from the valve seat surface 46, valve 106A is opened and valve 108A is closed, and the processing liquid is sprayed from the spray outlet 31 of the spray nozzle 106B toward the upper surface of the substrate W. Then, substrate processing is performed.

[0109] Here, just before the treatment liquid is ejected from the nozzle 31, water is introduced from the mixing pipe 200, which is in the open state of valve 200A, into the treatment liquid in the flow path 35c. When water such as pure water is mixed with the treatment liquid containing electrolyzed sulfuric acid, the temperature of the treatment liquid rises due to the heat of reaction, for example, reaching about 90°C.

[0110] By using a preheating agent to heat the electrolytic sulfuric acid, the oxidizing power of the sulfuric acid is increased. Even without using a heater or similar means to heat the solution, substrate processing (such as resist stripping) can be performed efficiently using the processing solution. Furthermore, when ozone water is mixed with the electrolytic sulfuric acid as the preheating agent, the oxidizing power of the ozone water itself also increases, potentially resulting in a processing solution with even stronger oxidizing power.

[0111] In addition, since electrolytic sulfuric acid contains both persulfate and carboxylic acid, the treatment solution can exert a higher oxidizing power compared to using carboxylic acid alone for substrate treatment at the same temperature.

[0112] The processing solution sprayed onto substrate W and used for substrate treatment flows into drain pipe 122 via valve 122A (which is in the open state). The processed liquid contains sulfate ions (SO42-). 2- Then, the treated liquid is merged into the recovery piping 124 and recovered by the recovery tank 30.

[0113] Electrolyzed sulfuric acid can be recycled and reused for substrate processing by electrolysis. Therefore, by using a processing solution containing electrolyzed sulfuric acid for substrate processing, the amount of wastewater generated during substrate processing can be reduced.

[0114] The treated liquid stored in the recovery tank 30 can be selectively delivered to the generation tank 20A via the recovery piping 126 using the pump 136 (i.e., to one or both of the generation tanks 20A and 20B) by opening valve 126A and to the generation tank 20B by opening valve 126B.

[0115] In addition, by selectively opening and closing valves 182A and 182B in the recovery piping 126, it is possible to switch between supplying the treated liquid to the generation tank side and circulating the treated liquid through the recovery tank 30.

[0116] Figure 7 This diagram illustrates an example of a case where the treated liquid is circulated to the recovery tank 30 while the nozzle 106B is in the ejection state.

[0117] In cases where the temperature of the liquid after substrate processing has not sufficiently decreased, such as... Figure 7 As illustrated, by opening valve 182B to circulate the treated liquid, an opportunity is created for heater 180 and heat exchanger 180A to further regulate the temperature of the treated liquid. Furthermore, this circulation ensures the time required for the decomposition of the corrosion inhibitor, etc., described later.

[0118] Here, the post-processing liquid supplied from the recovery tank 30 to the generation tank 20A or the generation tank 20B contains residual resists and other substances that were peeled off from the substrate during substrate processing.

[0119] On the other hand, the surface of the electrolytic cell, which serves as the diamond electrode, is oxidized by water molecules (H2O). Furthermore, it is well known that resists acting as organic materials undergo oxidative decomposition (organic matter → CO2 + nH2O). ＋ During this process, carbon atoms forming the electrolytic cell will be extracted along with oxygen atoms from the surface of the electrolytic cell.

[0120] Therefore, electrolyzing treated liquid containing residual resists in an electrolytic cell can lead to cell damage. Although the residual resists will decompose due to the oxidizing power of the treated liquid, incomplete decomposition can damage (deplete) the electrolytic cell.

[0121] In contrast, in this embodiment, the processed liquid stored in the generation tank 20A or generation tank 20B can be transported to the recovery tank 30 via the supply piping 170. For example, such as Figure 7 As shown, by opening valve 170A, the processed liquid stored in generating tank 20A can be transported to recovery tank 30 via supply pipe 170. By transporting the processed liquid stored in generating tank 20A or generating tank 20B to recovery tank 30, the processed liquid generated at a sufficiently high concentration through electrolysis in the electrolytic cell can be mixed with the processed liquid recovered to recovery tank 30 via drain pipe 122.

[0122] Therefore, the oxidizing power of the treated liquid stored in the recovery tank 30 increases, promoting the decomposition of the resist and other substances remaining in the liquid. As a result, the amount of resist and other substances remaining in the treated liquid supplied to the generating tank via the recovery pipe 126 is reduced, thus enabling the treated liquid to be supplied to the electrolytic cell, thereby reducing damage to the electrolytic cell during electrolysis.

[0123] Furthermore, the processing liquid stored in generation tank 20A or generation tank 20B is sufficiently conditioned by heater 142, heat exchanger 142A, heater 150, and heat exchanger 150A to, for example, below 60°C. Therefore, by mixing this processing liquid with the processed liquid stored in recovery tank 30, the temperature of the processed liquid stored in recovery tank 30 can be reduced. Thus, the heat generated during the decomposition of the corrosion resist can be offset, and the temperature adjustment range can be reduced when the processing liquid is conditioned by circulating in circulation piping 128 or circulation piping 130.

[0124] Here, the volume of the treatment liquid supplied via the supply pipe 170 is controlled by the control unit 90 with reference to the measurement results of the liquid level sensor 190 in the recovery tank 30, so that the mixed treatment liquid becomes the desired concentration and temperature.

[0125] Furthermore, by controlling valves 132A, 134A, 170A, and 170B, the processing fluid can be supplied to either or both of the supply piping 170 and the supply piping 100.

[0126] <Regarding the effects produced by the above-described implementation methods>

[0127] Next, examples of the effects produced by the embodiments described above will be shown. Furthermore, in the following description, the effects are described based on the specific structures exemplified in the embodiments described above; however, other specific structures exemplified in this application specification may be substituted to produce the same effects. That is, for convenience, sometimes only one of the corresponding specific structures will be described representatively below, but the representatively described specific structure may also be replaced with other corresponding specific structures.

[0128] According to the embodiments described above, the substrate processing apparatus includes a substrate processing unit, a supply tank 10, a generation unit, a recovery unit, a first supply path, and a second supply path. Here, the substrate processing unit corresponds, for example, to a processing unit 600 including an ejection nozzle 106B. The generation unit corresponds, for example, to generation tanks 20A and 20B, electrolytic cells 21A and 21B. The recovery unit corresponds, for example, to a recovery tank 30 including a recovery pipe 124 and a recovery pipe 126. The first supply path corresponds, for example, to a supply pipe 100. The second supply path corresponds, for example, to a supply pipe 170. The processing unit 600 processes the substrate using a processing liquid. The supply tank 10 stores the processing liquid supplied to the processing unit 600. The generation unit generates the processing liquid through electrolysis. The recovery tank 30 recovers the processing liquid supplied to the processing unit 600, i.e., the processed liquid. Furthermore, the recovery tank 30 supplies the processed liquid to the generation unit. Supply piping 100 is a piping that supplies the processed liquid generated by the generation unit to supply tank 10. Supply piping 170 is a piping that supplies the processed liquid generated by the generation unit to recovery tank 30. Supply piping 170 is a different piping (path) from supply piping 100. Here, the generation unit supplies the processed liquid from at least one of supply piping 100 and supply piping 170. In addition, recovery tank 30 supplies the processed liquid, mixed with the processed liquid supplied via supply piping 170, to the generation unit.

[0129] According to this structure, by supplying the treatment liquid from the generation tank, the oxidizing power of the treated liquid stored in the recovery tank 30 can be increased, thereby promoting the decomposition of residual corrosion inhibitors and the like in the liquid. As a result, the treated liquid can be supplied to the electrolytic cell, thereby reducing damage to the electrolytic cell during electrolysis.

[0130] Furthermore, the same effect can be achieved by appropriately adding other structures illustrated in this application specification to the above structure, that is, by appropriately adding other structures not mentioned as structures in this application specification.

[0131] Furthermore, according to the embodiment described above, the substrate processing apparatus includes a measuring unit that measures the volume of the processed liquid in the recovery tank 30 and outputs the measurement result. Here, the measuring unit corresponds, for example, to a level sensor 190. Moreover, the generation unit controls the flow rate of the processed liquid supplied to the recovery tank 30 based on the measurement result. With this structure, the volume of the processed liquid supplied via the supply pipe 170 can be adjusted to achieve the desired concentration and temperature of the mixed processed liquid. Additionally, according to the embodiment described above, the substrate processing apparatus includes a measuring unit that measures the TOC concentration of the processed liquid in the recovery tank 30 and outputs the measurement result. Here, the measuring unit corresponds, for example, to a concentration meter 184. Moreover, the generation unit controls the flow rate of the processed liquid supplied to the recovery tank 30 based on the measurement result. With this structure, the volume of the processed liquid supplied via the supply pipe 170 can be adjusted to achieve the desired concentration and temperature of the mixed processed liquid.

[0132] Furthermore, according to the embodiment described above, the generation unit includes a first temperature regulating unit for adjusting the treated liquid and the generated processed liquid to an electrolysis temperature, which is the temperature used to generate the processed liquid through electrolysis. Here, the first temperature regulating unit corresponds, for example, to heater 142, heat exchanger 142A, heater 150, heat exchanger 150A, etc. With this structure, a temperature that suppresses the deactivation of electrolyzed sulfuric acid can be maintained. Additionally, the heat that may be generated during electrolysis can be effectively counteracted.

[0133] Furthermore, according to the embodiment described above, the recovery tank 30 has a second temperature regulating unit for adjusting the treated liquid to an electrolysis temperature, which is the temperature used to generate the treated liquid through electrolysis. Here, the second temperature regulating unit corresponds, for example, to a heater 180, a heat exchanger 180A, etc. With this structure, by using the heater 180 and the heat exchanger 180A for temperature regulation, the temperature of the treated liquid, which becomes high due to substrate processing, can be reduced, and the deactivation of electrolytic sulfuric acid can be suppressed. In addition, the range of temperature regulation required in the generation tank can be reduced.

[0134] According to the embodiments described above, in the substrate processing method, the processing liquid supplied to the processing unit 600 is stored in the supply tank 10. Then, in the processing unit 600, the substrate W is processed using the processing liquid. Then, the processing liquid supplied to the processing unit 600, i.e., the processed liquid, is recovered to the recovery tank 30 and then supplied to the generation unit. Then, in the generation unit, the processing liquid is generated from the liquid containing the processed liquid by electrolysis. Here, the substrate processing apparatus for performing substrate processing includes: a supply pipe 100 for supplying the processing liquid generated by the generation unit to the supply tank 10; and a supply pipe 170 for supplying the processing liquid generated by the generation unit to the recovery tank 30, the supply pipe 170 being a different path from the supply pipe 100. Moreover, the process of supplying the processed liquid to the generation unit is a process of supplying the processed liquid mixed with the processing liquid supplied via the supply pipe 170 to the generation unit.

[0135] According to this structure, by supplying the treatment liquid from the generation tank, the oxidizing power of the treated liquid stored in the recovery tank 30 can be increased, thereby promoting the decomposition of residual corrosion inhibitors and the like in the liquid. As a result, the treated liquid can be supplied to the electrolytic cell, thereby reducing damage to the electrolytic cell during electrolysis.

[0136] Furthermore, the order in which each process is performed can be changed without special restrictions.

[0137] Furthermore, the same effect can be achieved by appropriately adding other structures illustrated in this application specification to the above structure, that is, by appropriately adding other structures not mentioned as the above structure in this application specification.

[0138] <Examples of variations of the implementation methods described above>

[0139] In the embodiments described above, electrolytic sulfuric acid is used for substrate treatment, but the liquid used as the treatment solution may also be, for example, a mixed solution of sulfuric acid and hydrogen peroxide water (SPM).

[0140] In this case, electrolytic sulfuric acid is also generated in the generation tank. During the stage of supplying to the supply tank 10, or the stage of supplying from the supply tank 10 to each processing unit 600, or both stages, the electrolytic sulfuric acid is heated to produce high-temperature sulfuric acid. Furthermore, by mixing hydrogen peroxide water, which serves as the water supply, from the mixing pipe 200, a processing solution for substrate processing can be prepared.

[0141] When SPM is used as the treatment solution, water molecules in the treatment solution are also electrolyzed during sulfuric acid electrolysis, which can increase the concentration that was reduced due to the addition of water, thereby producing electrolyzed sulfuric acid.

[0142] In addition, in the embodiments described above, the material, size, shape, relative configuration relationship or implementation conditions of each structural component are sometimes described, but these are all examples and not limiting.

[0143] Therefore, many variations and equivalents not illustrated can be assumed within the scope of the technology disclosed in this application. These include, for example, modifications, additions, or omissions of at least one structural member.

[0144] Furthermore, in at least one of the embodiments described above, if the material name is not specifically specified, the material contains other additives, such as alloys, unless there is a contradiction.

[0145] Explanation of reference numerals in the attached figures: 1. Substrate processing apparatus 10 Supply Tanks 21A Electrolytic Cell 21B Electrolytic Cell 118 Electrolytic Cell 170 Supply Piping

Claims

1. A substrate processing apparatus, wherein, have: A substrate processing unit is used to process a substrate using a processing solution; A supply tank for storing the processing liquid supplied to the substrate processing unit; The generation section is used to generate the treatment liquid by electrolysis; The recovery unit is used to recover the processing liquid, i.e. the post-processing liquid, supplied to the substrate processing unit, and to supply the post-processing liquid to the generation unit. A first supply path is used to supply the processing liquid generated by the generating unit to the supply tank; as well as A second supply path is used to supply the processing liquid generated by the generating unit to the recycling unit, and the second supply path is a different path from the first supply path. The recovery unit supplies the processed liquid, which is mixed with the processed liquid supplied via the second supply path, to the generation unit.

2. The substrate processing apparatus as claimed in claim 1, wherein, The substrate processing apparatus further includes a first measuring unit, which measures the volume of the processed liquid in the recovery unit and outputs the measurement result. The generation unit controls the flow rate of the treatment liquid supplied to the recovery unit based on the measurement results.

3. The substrate processing apparatus as described in claim 1 or 2, wherein, The generating unit has a first temperature regulating unit for adjusting the treated liquid and the generated treated liquid to an electrolysis temperature, wherein the electrolysis temperature is the temperature at which the treated liquid is generated by electrolysis.

4. The substrate processing apparatus as described in claim 1 or 2, wherein, The recovery unit has a second temperature regulating unit for adjusting the treated liquid to an electrolysis temperature, the electrolysis temperature being the temperature at which the treated liquid is generated through electrolysis.

5. The substrate processing apparatus as described in claim 1 or 2, wherein, The substrate processing apparatus further includes a second measuring unit, which measures the total organic carbon concentration of the treated liquid in the recovery unit and outputs the measurement result. The generation unit controls the flow rate of the treatment liquid supplied to the recovery unit based on the measurement results.

6. A substrate processing method, used to process the substrate using a processing solution. in, include: The process of storing the processing liquid supplied to the substrate processing unit in a supply tank; The substrate processing unit is a process in which the substrate is processed using the processing liquid; The process of recovering the processing liquid (i.e., the processed liquid) supplied to the substrate processing unit to the recovery unit, and then supplying it to the production unit; and In the generation section, the process of generating the treated liquid from a liquid containing the treated liquid by electrolysis; have: A first supply path is used to supply the processing liquid generated by the generating unit to the supply tank; and A second supply path is used to supply the processing liquid generated by the generating unit to the recycling unit, and the second supply path is a different path from the first supply path. The process of supplying the processed liquid to the generating unit is the process of supplying the processed liquid, which is mixed with the processed liquid supplied via the second supply path, to the generating unit.

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