High-performance organic silicon packaging adhesive for photovoltaic module

By using high-performance silicone encapsulants made from organic polymer compounds with silicon-oxygen bonds as the main chain, the aging, corrosion, and stress problems of EVA encapsulation materials have been solved, realizing an efficient, reliable, and environmentally friendly encapsulation solution for photovoltaic modules, suitable for next-generation high-efficiency battery technologies.

CN121851981APending Publication Date: 2026-04-14INOFU ENERGY TECHNOLOGY (WUXI) CO LTD
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Patent Information

Application Number
CN202610154132.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2026-02-03
Publication Date
2026-04-14

AI Technical Summary

Technical Problem

Existing photovoltaic module encapsulation material EVA is prone to aging and producing corrosive substances in humid, hot, and ultraviolet environments, leading to module power decay. Furthermore, it does not match the thermal expansion coefficient of the solar cells, generating mechanical stress and making it difficult to recycle. It cannot meet the high temperature resistance and low corrosion requirements of next-generation high-efficiency cells such as TOPCon.

Method used

High-performance silicone encapsulants made from organic polymer compounds with silicon-oxygen bonds as the main chain have high light transmittance, chemical stability, and gel elasticity. They can be used in a wide temperature range and form a network polymer through high-temperature reaction and condensation processes to prevent corrosion and buffer stress.

Benefits of technology

It significantly improves the reliability and lifespan of photovoltaic modules, reduces power degradation rate, enhances power generation efficiency, supports environmentally friendly recycling, is suitable for high-efficiency battery technology, and has fire resistance and adaptability to complex shapes.

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Abstract

The invention relates to a high-performance organic silicon packaging adhesive for a photovoltaic module, the packaging adhesive is an organic high-molecular compound taking a silicon-oxygen bond as a main chain, and a colloidal elastomer is formed after the packaging adhesive is cured; the working temperature range of the packaging adhesive is-55 DEG C to 250 DEG C, the light transmittance of the packaging adhesive in a visible light range is not lower than 92%, and after the packaging adhesive is aged for 1000 hours under the double-85 test conditions of 85 DEG C and 85% relative humidity, the light transmittance retention rate is larger than 95%; the packaging adhesive is prepared from a monomer mixture containing dimethyl dichlorosilane and methyl trichlorosilane through high-temperature reaction, hydrolysis and condensation processes under the action of a composite catalytic system of copper and various high polymer materials, and finally a network polymer with linear and cross-linked structures is formed. The core purpose of the invention is to provide a revolutionary photovoltaic packaging material which is high in light transmittance, extremely stable in chemical property, capable of greatly improving the reliability, the service life and the power generation efficiency of a component, and environment-friendly and recoverable.
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