High-adaptability wireless ultrasonic measurement system and construction method

Abstract

The invention discloses a high-adaptability wireless ultrasonic measurement system and a construction method, the measurement system comprises a sensing module and a detection module, the sensing module comprises a piezoelectric layer on the surface of a detection object, a first electrode structure and a first insulating plate with a first spiral groove and a first through hole, and a sensing coil is arranged in the first spiral groove; the first electrode structure is used for leading out the piezoelectric layer and the sensing coil and grounding the piezoelectric layer and the sensing coil; and the detection module comprises a transmitting part and a receiving part and is used for transmitting and receiving corresponding electromagnetic signals to the sensing module to realize wireless ultrasonic measurement. According to the invention, the coil structure is formed in the spiral groove by using the insulating plate with the spiral groove, the stability of the coil is improved, and compared with the coil structure prepared on the insulating plate through mask deposition, the preparation difficulty of the coil is reduced and the size precision of the coil is improved; and the constructed wireless ultrasonic measurement system can be more suitable for large lift-off distance, high temperature, rotation and vibration scenes.

Description

Technical Field

[0001] This invention relates to the field of piezoelectric induction detection of ultrasonic signals, and particularly to a highly adaptable wireless ultrasonic measurement system and its construction method. Background Technology

[0002] Traditional ultrasonic testing technology has been widely used for temperature, stress, defect and crack detection and imaging. However, the wired connection between the excitation device and the probe results in bulky sensors, complex wiring, and requires specialized personnel for operation, making it unsuitable for harsh environments or large structures. Traditional non-contact testing technologies such as infrared thermometry, radio frequency thermometry, fiber optic grating thermometry, and air-coupled ultrasonic thermometry can effectively avoid the limitations of wired connections, but they suffer from weak anti-interference capabilities and short lift-off distances, making them unsuitable for high-pressure, rotating, and sealed aerospace environments. Therefore, developing a non-contact, high-precision temperature measurement technology that can operate stably in extreme environments is a crucial requirement for the current development of aero-engine technology.

[0003] However, current passive wireless ultrasonic measurement systems are only used in room temperature environments and have weak reflected echoes, making them unsuitable for high-temperature operating scenarios with large lift-off distances. Some studies, such as CN119780251A, disclose a wireless ultrasonic measurement system and its construction method, which uses an insulating plate to isolate the sensing coil away from the surface of the object being measured, facilitating the generation of a non-zero induced voltage in the sensing coil. However, its transmitting coil, receiving coil, and sensing coil are all fabricated using mask deposition, requiring precise masks and exhibiting insufficient coil structural stability, making it difficult to apply in complex working conditions.

[0004] Therefore, it is necessary to improve the existing coil technology to make it suitable for complex working conditions such as high temperature, rotation, and vibration. Summary of the Invention

[0005] The purpose of this invention is to improve existing coil technology, design and build a structure for a wireless ultrasonic measurement system, and realize wireless transmission and reception of ultrasonic signals under long lift-off distances and high-temperature conditions.

[0006] To achieve the above objectives, the present invention provides a highly adaptable wireless ultrasonic measurement system, including a sensing module and a detection module. The sensing module includes a piezoelectric layer on the surface of the object to be detected, a first electrode structure, and a first insulating plate with a first spiral groove and a first through hole, wherein a sensing coil is disposed in the first spiral groove. The first electrode structure is used to lead out the piezoelectric layer and the sensing coil, and to ground the piezoelectric layer and the sensing coil; The detection module includes a transmitting component and a receiving component, used to transmit and receive corresponding electromagnetic signals to the sensing module to realize wireless ultrasonic measurement.

[0007] Furthermore, the transmitting component includes a second insulating plate with a second helical groove and a second through hole, wherein a transmitting coil and a second electrode structure are respectively disposed in the second helical groove and the second through hole, and the second electrode structure is used to lead out the transmitting coil and ground it; The receiving component includes a third insulating plate with a third spiral groove and a third through hole. A receiving coil and a third electrode structure are respectively disposed in the third spiral groove and the third through hole. The third electrode structure is used to lead out the receiving coil and ground it. The grounding portions of the second and third electrode structures are electrically connected through a common electrode, forming a composite structure of the transmitting and receiving structures. In the composite structure, the receiving coil is closer to the sensing coil than the transmitting coil.

[0008] Furthermore, the innermost radius of the sensing coil, transmitting coil, and receiving coil is 0.50-5.0 mm, the width is 0.08-0.20 mm, the height is 0.08-0.50 mm, the distance between adjacent coils is 0.50-3.00 mm, and the number of coil turns is 10-25.

[0009] Furthermore, the first insulating plate, the second insulating plate, and the third insulating plate are obtained by etching a ceramic plate with a thickness of 2-5 mm.

[0010] Furthermore, a first gap exists between the piezoelectric layer, the first electrode structure, and the first insulating plate, and / or, The transmitting and receiving structures form a composite structure with a second gap, which is filled with insulating adhesive that can withstand temperatures of 200-1400℃.

[0011] It should be noted that the detection material in this invention is not strictly limited, and can be, for example, steel plates, bolts, turbine blades of aero-engines, etc. The material of the piezoelectric layer is not strictly limited, and can be, for example, at least one of AlN, ZnO, LiNbO3, and their doped piezoelectric materials. The specific material can be selected according to the required operating conditions. For example, for applications below 300℃, ZnO is selected; for applications between 300℃ and 650℃, AlN or Sc-doped AlN is selected; and for applications between 660℃ and 800℃, LiNbO3 or V-doped LiNbO3 is selected. The first, second, and third insulating plates can be made of ceramic materials, and the specific ceramic material used is not strictly limited. For example, it can be at least one of Al2O3, SiO2, and ZrO2. The first, second, and third electrode structures are made of elemental metals or metal alloys with a melting point higher than 800℃.

[0012] Furthermore, it also includes a generator and a detector that are respectively connected to the second electrode structure and the third electrode structure.

[0013] Preferably, the transmitting component also includes a driver and a post-amplifier. In some embodiments, the driver instrument has ultra-high accuracy of 0.22-0.25%, includes 2-5 waveform output channels, a load impedance of 50Ω-100kΩ, supports single output, stream output, timed output, and triggered output modes, and can provide waveform buffers up to 512MB. The post-amplifier can provide up to 2 watts of linear power output at frequencies between 50MHz and 1000MHz.

[0014] Preferably, the receiving component is further provided with a signal amplifier. In some embodiments, the preamplifier can achieve signal amplification processing with an amplification factor between 3 and 1000 times, and a frequency cutoff of arbitrarily selected within the frequency range of 0-60MHz, such as including but not limited to cutoffs of 0-5MHz, 7.5-60MHz, and 12.5-60MHz, with damping levels of 66, 70, etc., pulse width continuously adjustable between 10 and 100ns, excitation voltage continuously adjustable between 10 and 300V, and pulse repetition rate selected between 0 and 16 times.

[0015] The transmitting component emits alternating current, which is amplified by a post-amplifier. When the amplified current flows through the transmitting coil, it generates an alternating magnetic flux with the same frequency as the applied voltage. This alternating magnetic flux causes a change in the magnetic flux within the sensing coil, thereby generating an induced electromotive force (EMF). This causes the piezoelectric layer to generate ultrasonic waves due to the inverse piezoelectric effect. The ultrasonic waves propagate through the object being detected. When they reach the bottom of the object, they are reflected due to the large difference in acoustic impedance between the object and the air. The reflected ultrasonic waves propagate to the piezoelectric layer and generate a current due to the direct piezoelectric effect. When this current flows through the sensor coil, it generates an alternating magnetic flux, which changes the magnetic flux within the receiving coil, thereby generating an induced EMF. This EMF is then amplified by a pre-amplifier, making the detected electrical signal more significant.

[0016] This invention also provides a method for constructing a wireless ultrasonic measurement system that enhances ultrasonic signals, comprising, A piezoelectric layer is prepared on the surface of the object to be detected; A second insulating plate with a first spiral groove and a first through hole is obtained, and a sensing coil is fabricated in the first spiral groove. A first electrode structure is fabricated on the upper part of the piezoelectric layer and on a first insulating plate with a first spiral groove and a first through hole to obtain a sensing module. A detection module is formed by assembling a transmitting component and a receiving component, which transmits and receives corresponding electromagnetic signals to the sensing module to realize wireless ultrasonic measurement.

[0017] Furthermore, the assembly of the transmitting and receiving components includes, A second insulating plate with a second spiral groove and a second through hole is obtained, and a third insulating plate with a third spiral groove and a third through hole is obtained; The transmitting coil and the receiving coil are respectively fabricated in the second spiral groove and the third spiral groove; The second electrode structure and the third electrode structure are respectively fabricated in the second through hole and the third through hole; The grounding portions of the second and third electrode structures are electrically connected by a common electrode, forming a composite structure of the transmitting and receiving structures. In this composite structure, the receiving coil is closer to the sensing coil than the transmitting coil.

[0018] Furthermore, the sensing coil, transmitting coil, and receiving coil are prepared by a first method using radio frequency magnetron sputtering: a center hole, side holes, helical antenna grooves, and electrode grooves are drilled on an insulating board using a laser cutter; a Cu, Ag, Ti metal, or AgCr alloy coating is deposited on both sides of the ceramic substrate using radio frequency magnetron deposition technology (deposition parameters are: radio frequency power 400-800W, deposition gas pressure 0.8-1.5Pa, pure Ar gas, deposition temperature 40-150℃, target-substrate distance 7-10cm, deposition time 0.5-4h, coating thickness 0.05-0.2mm); the surface Cu, Ag, Ti metal, or AgCr alloy coating is removed by polishing, leaving only the coating deposited in the helical grooves to form a thin-film coil.

[0019] Furthermore, the sensing coil, transmitting coil, and receiving coil can be obtained by winding them using a conductive solid: a center hole, side holes, spiral antenna grooves, and electrode grooves are drilled on an insulating board using a laser cutter; Cu or Ag metal wires are embedded in the vortex grooves of a ceramic substrate to obtain the transmitting coil, sensor coil, and receiving coil (the metal wire has a purity of 99.99%, and the diameter of the Cu or Ag wire is between 0.05-0.2 mm; the winding method includes close winding, intermittent winding, and honeycomb winding. Copper coils are low in cost and easy to process, while pure Ag coils have better conductivity and high-frequency response characteristics, making them particularly suitable for high-frequency, high-Q applications).

[0020] Furthermore, after the thin-film coil deposition and coil winding are completed, an insulating high-temperature adhesive is used to cover the entire sensing coil, which is then cured at 150-250℃ for 1-2 hours to form a hard protective layer with a thickness of 2mm-20mm, thereby improving mechanical strength and high-temperature stability.

[0021] Furthermore, the applicable lift-off distance for the coil and wireless ultrasonic measurement system of the present invention is between 1-25 mm.

[0022] Furthermore, the coil and wireless ultrasonic measurement system of the present invention are applicable to a high temperature range of 25-600°C.

[0023] Compared with the prior art, the present invention has the following beneficial effects: This invention uses an insulating plate with spiral grooves to form the coil structure in the spiral grooves, which increases the stability of the coil. Compared with the preparation of the coil structure by mask deposition on the insulating plate, it not only reduces the difficulty of coil preparation and improves the accuracy of coil size, but also makes the constructed wireless ultrasonic measurement system more adaptable to large lift-off distance of 23mm, high temperature of 500℃, rotation and vibration scenarios. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figures 1a-1f A flowchart illustrating the fabrication process of the first insulating plate is shown. Figure 2 A schematic diagram of the sensing module is shown. Figure 3 A schematic diagram of the detection module is shown; Figure 4 The ultrasonic signal test results of the wireless ultrasonic measurement system constructed in Examples 1-5 are shown; Figure 5 The ultrasonic signal test results of the wireless ultrasonic measurement system constructed in Examples 6-9 are shown; Figure 6 The ultrasonic signal test results of the wireless ultrasonic measurement system constructed in Examples 2 and 10-11 are shown. Explanation of reference numerals in the attached figures: 1. Sensing module; 11. First insulating plate; 110. First central hole; 111. First side hole; 112. First spiral groove; 113. Sensing coil; 114. First lead electrode; 115. First ground electrode; 12. Bolt; 13. Piezoelectric layer; 130. Second lead electrode; 131. Second ground electrode; 2. Detection module; 20. Second insulating plate; 200. Transmitting coil; 201. Third lead electrode; 202. Third ground electrode; 21. Third insulating plate; 210. Receiving coil; 211. Fourth lead electrode; 212. Fourth ground electrode; 22. Common electrode; 23. Generator; 24. Oscilloscope; 3. Insulating adhesive. Detailed Implementation

[0026] The endpoints and any values ​​of the ranges disclosed in this invention are not limited to the precise ranges or values, and these ranges or values ​​should be understood to include values ​​close to these ranges or values. For numerical ranges, the endpoint values ​​of the various ranges, the endpoint values ​​of the various ranges and individual point values, and individual point values ​​can be combined with each other to obtain one or more new numerical ranges, which should be considered as specifically disclosed in this invention.

[0027] The technical solutions of the present invention will be clearly and completely described below with reference to specific embodiments and accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0028] In the description of this embodiment, the terms "up," "down," "left," and "right," etc., refer to directions or positional relationships. The orientations or positional relationships shown in the accompanying drawings are for ease of description and simplification only, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, the terms "first," "second," etc., are used merely for descriptive distinction and have no specific meaning. The terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two elements or the interaction between two elements. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0029] Example 1 A method for constructing and testing a highly adaptable wireless ultrasonic measurement system includes the following steps: S1. Preparation of insulating board S101, such as Figure 1a As shown, three ceramic substrates made of Al2O3 with a thickness of 2.5 mm are selected. The ceramic substrates are the base materials for the first insulating plate 11, the second insulating plate 20 and the third insulating plate 21. Since their preparation methods are basically the same, the preparation of the first insulating plate 11 is used as an example below.

[0030] S102. Use a laser cutting machine to drill the first through hole in the ceramic substrate, such as... Figure 1b As shown, the first through hole includes a first central hole 110 and a first side hole 111.

[0031] S103. Continue using a laser cutting machine to drill the first spiral groove 112 on the ceramic substrate, such as... Figure 1c As shown, the innermost radius of the first spiral groove 112 is 0.80 mm, the width is 0.10 mm, the depth is 0.30 mm, the distance between adjacent coils is 1.0 mm, and the number of coil turns is 12.

[0032] S104. Flip the ceramic substrate after processing in S103, as follows: Figure 1d As shown, a first lead-out electrode groove and a first grounding electrode groove are prepared in the first central hole 110 and the first side hole 111.

[0033] S105, using radio frequency magnetron sputtering deposition in a pure Ar atmosphere, with a radio frequency power of 700W, a deposition pressure of 0.8Pa, a temperature of 50℃, a target-substrate distance of 7.5cm, and a deposition time of 4h, such as... Figure 1e As shown, 0.08 mm thick Ag is deposited on the upper and lower surfaces of the product obtained in S104.

[0034] S106. Grind off excess Ag on the upper and lower surfaces of the product obtained in S105, retaining only the Ag deposited in the first spiral groove 112, the first lead-out electrode groove, and the first ground electrode groove, such as... Figure 1f As shown, Ag is retained in the first spiral groove 112 to form a sensing coil 113, and Ag in the first lead-out electrode groove and the first ground electrode groove respectively form the first lead-out electrode 114 and the first ground electrode 115.

[0035] Following the same steps S102-S106, a second insulating plate 20 and a third insulating plate 21 are prepared. The innermost radius of the transmitting coil 200 of the second insulating plate 20 is 1.0 mm, the width is 0.10 mm, the height is 0.08 mm, the distance between adjacent coils is 1.0 mm, and the number of coil turns is 20. The innermost radius of the receiving coil 210 of the third insulating plate 21 is 1.0 mm, the width is 0.10 mm, the height is 0.08 mm, the distance between adjacent coils is 1.0 mm, and the number of coil turns is 20.

[0036] S2, Install sensor module 1 S201. Using radio frequency magnetron deposition, in an Ar and N2 atmosphere, with a radio frequency power of 900W, a deposition pressure of 0.9Pa (Ar to O2 flow ratio of 1 / 1), a temperature of 120℃, a target-substrate distance of 6cm, and a deposition time of 10h, AlN is deposited on the upper end face of the head of a nickel-based high-temperature alloy bolt (M9, length 4cm) 12 to form a piezoelectric layer 13 with a thickness of 15μm. S202. A second lead-out electrode 130 and a second ground electrode 131 are fabricated on the surface of the piezoelectric layer 13. The first lead-out electrode 114 and the first ground electrode 115 of the first insulating plate 11 are respectively attached to the second lead-out electrode 130 and the second ground electrode 131. The attached first lead-out electrode 114 and the second lead-out electrode 130, as well as the second lead-out electrode 130 and the second ground electrode 131, constitute the first electrode structure. A first gap exists between the piezoelectric layer 13, the first electrode structure, and the first insulating plate 11. The gap between the first insulating plate 11 and the head of the bolt 12 is filled with insulating adhesive 3, resulting in the following: Figure 2 The sensor module 1 shown is shown.

[0037] S3, Install detection module 2 like Figure 3 As shown, the third grounding electrode 202 of the second insulating plate 20 and the fourth grounding electrode 212 of the third insulating plate 21 are electrically connected through the common electrode 22 to form a composite structure. In the composite structure, the receiving coil 210 is closer to the sensing coil 113 than the transmitting coil 200. The second gap between the second insulating plate 20 and the third insulating plate 21 is filled with insulating glue 3. The generator 23 is connected to the common electrode 22 and the third lead-out electrode 201 of the second insulating plate 20 to obtain the transmitting component; the oscilloscope 24 is connected to the common electrode 22 and the fourth lead-out electrode 211 of the third insulating plate 21 to obtain the receiving component, thereby constructing the detection module 2.

[0038] Then, a high-temperature adhesive is used to cover the entire sensing coil, transmitting coil, and receiving coil, and then cured at 200°C for 1 hour to form a hard protective layer with a thickness of 5 mm, which improves mechanical strength and high-temperature stability. This completes the preparation of the transmitting coil and receiving coil ends.

[0039] S4, Detection The distance between the receiving coil 210 of the control detection module 2 and the sensing coil 113 of the sensing module 1 is 5mm, and this distance is called the lift-off distance. The corresponding wireless ultrasonic echo signal is measured at a normal temperature of 25℃, and the test results are as follows. Figure 4 As shown in the figure. The preamplifier parameters are 10dB, frequency cutoff range 0-60MHz, damping level 66, pulse width 50ns, excitation voltage 100V, and pulse repetition rate 16.

[0040] Example 2 It is basically the same as Example 1, except that the lift-off distance is controlled to be 10mm.

[0041] Example 3 It is basically the same as Example 1, except that the lift-off distance is controlled at 15mm.

[0042] Example 4 It is basically the same as Example 1, except that the lift-off distance is controlled at 20mm.

[0043] Example 5 It is basically the same as Example 1, except that the lift-off distance is controlled at 22mm.

[0044] The ultrasonic signals detected by the wireless ultrasonic measurement system of Examples 1-5 were tested at a normal temperature of 25°C, and the results are as follows. Figure 4 As shown, it can be seen that even at a lift-off distance of 22mm, an ultrasonic signal of 0.15V can still be effectively detected.

[0045] Example 6 Using the same method as in Example 1, corresponding spiral grooves and hole structures were drilled into the Al2O3 ceramic substrate. Then, Ag wires were embedded within the spiral grooves of the ceramic substrate to obtain the transmitting coil, sensor coil, and receiving coil. The Ag wires themselves had a diameter of 0.1 mm and were wound tightly around the corresponding lead-out electrode holes and ground electrode holes. The corresponding lead-out electrodes and ground electrodes were implemented by embedding Ag wires in the corresponding hole structures, thus constructing a wireless ultrasonic measurement system. Stainless steel bolts (M5, 3.6 cm in length) were used, and the lift-off distance was controlled to be 6 mm.

[0046] Example 7 It is basically the same as Example 6, except that the lift-off distance is controlled at 12mm.

[0047] Example 8 It is basically the same as Example 6, except that the lift-off distance is controlled at 18mm.

[0048] Example 9 It is basically the same as Example 6, except that the lift-off distance is controlled at 23mm.

[0049] The ultrasonic signals detected by the wireless ultrasonic measurement system of Examples 6-9 were tested at a normal temperature of 25°C, and the results are as follows: Figure 5 As shown, it can be seen that even at a lift-off distance of 23mm, an ultrasonic signal of 0.29V can still be effectively detected.

[0050] Patent CN119780251A represents preliminary work for this invention. Similar to this invention, it uses an insulating plate to isolate the sensing coil away from the surface of the object being tested. However, its transmitting coil, receiving coil, and sensing coil are all fabricated using mask deposition. Under the same testing conditions, at a lift-off distance of 15mm, the ultrasonic signal is reduced to only 0.05V.

[0051] In both Embodiments 5 and 9 of this invention, an insulating plate with spiral grooves was prepared, and then a coil structure was formed in the spiral grooves using maskless thin-film deposition and conductive solid winding methods, respectively. The ultrasonic signals at lift-off distances of 22 mm and 23 mm were 0.15 V and 0.29 V, respectively. These results demonstrate that placing the coil in the spiral grooves of the insulating plate is not simply an adaptive adjustment; the spiral grooves facilitate the fabrication of finer coil structures, and this finer structural design significantly improves the detection performance of the measurement system.

[0052] In practical applications, high-temperature environments are often required. To further study the detection performance of the measurement system constructed in this invention at higher temperatures, its ultrasonic signal was also tested under high-temperature conditions of 300℃ and 500℃.

[0053] Example 10 The construction method of the highly adaptable wireless ultrasonic measurement system is the same as in Example 2, and the corresponding wireless ultrasonic echo signal is measured under a high temperature environment of 300℃.

[0054] Example 11 The construction method of the highly adaptable wireless ultrasonic measurement system is the same as in Example 2, and the corresponding wireless ultrasonic echo signal is measured in a high temperature environment of 500℃.

[0055] The ultrasonic signals detected by the wireless ultrasonic measurement systems in Examples 2 and 10-11 are as follows: Figure 6 As shown, even at a high temperature of 500℃, an ultrasonic signal of 0.21V can still be effectively detected.

[0056] In summary, this invention, by preparing an insulating plate with spiral grooves, forms a coil structure within the spiral grooves and designs two methods: thin film deposition and conductive solid winding. Compared to preparing the coil structure by mask deposition on the insulating plate, this not only reduces the difficulty of coil preparation and improves the accuracy of coil dimensions, but also makes the constructed wireless ultrasonic measurement system more adaptable to scenarios involving a 23mm lift-off distance, 500℃ high temperature, rotation, and vibration.

[0057] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A highly adaptable wireless ultrasonic measurement system, comprising a sensing module and a detection module, characterized in that, The sensing module includes a piezoelectric layer on the surface of the object to be detected, a first electrode structure, and a first insulating plate with a first spiral groove and a first through hole, wherein a sensing coil is disposed in the first spiral groove. The first electrode structure is used to lead out the piezoelectric layer and the sensing coil, and to ground the piezoelectric layer and the sensing coil; The detection module includes a transmitting component and a receiving component, used to transmit and receive corresponding electromagnetic signals to the sensing module to realize wireless ultrasonic measurement.

2. The highly adaptable wireless ultrasonic measurement system according to claim 1, characterized in that, The transmitting component includes a second insulating plate with a second spiral groove and a second through hole. A transmitting coil and a second electrode structure are respectively disposed in the second spiral groove and the second through hole. The second electrode structure is used to lead out the transmitting coil and ground it. The receiving component includes a third insulating plate with a third spiral groove and a third through hole. A receiving coil and a third electrode structure are respectively disposed in the third spiral groove and the third through hole. The third electrode structure is used to lead out the receiving coil and ground it. The grounding portions of the second and third electrode structures are electrically connected through a common electrode, forming a composite structure of the transmitting and receiving structures. In the composite structure, the receiving coil is closer to the sensing coil than the transmitting coil.

3. The highly adaptable wireless ultrasonic measurement system according to claim 2, characterized in that, The innermost radius of the sensing coil, transmitting coil, and receiving coil is 0.50-5.0 mm, the width is 0.08-0.20 mm, the height is 0.08-0.50 mm, the distance between adjacent coils is 0.50-3.00 mm, and the number of coil turns is 10-25.

4. The highly adaptable wireless ultrasonic measurement system according to claim 2, characterized in that, The first, second, and third insulating plates are obtained by etching a ceramic plate with a thickness of 2-5 mm.

5. The highly adaptable wireless ultrasonic measurement system according to claim 2, characterized in that, A first gap exists between the piezoelectric layer, the first electrode structure, and the first insulating plate, and / or, The transmitting and receiving structures form a composite structure with a second gap, which is filled with insulating adhesive that can withstand temperatures of 200-1400℃.

6. The highly adaptable wireless ultrasonic measurement system according to claim 1, characterized in that, It also includes a generator and a detector that are connected to the second electrode structure and the third electrode structure, respectively.

7. A method for constructing a highly adaptable wireless ultrasonic measurement system, characterized in that, include, A piezoelectric layer is prepared on the surface of the object to be detected; A second insulating plate with a first spiral groove and a first through hole is obtained, and a sensing coil is fabricated in the first spiral groove. A first electrode structure is fabricated on the upper part of the piezoelectric layer and on a first insulating plate with a first spiral groove and a first through hole to obtain a sensing module. A detection module is formed by assembling a transmitting component and a receiving component, which transmits and receives corresponding electromagnetic signals to the sensing module to realize wireless ultrasonic measurement.

8. The method for constructing a highly adaptable wireless ultrasonic measurement system according to claim 7, characterized in that, The aforementioned transmitting and receiving components include, A second insulating plate with a second spiral groove and a second through hole is obtained, and a third insulating plate with a third spiral groove and a third through hole is obtained; The transmitting coil and the receiving coil are respectively fabricated in the second spiral groove and the third spiral groove; The second electrode structure and the third electrode structure are respectively fabricated in the second through hole and the third through hole; The grounding portions of the second and third electrode structures are electrically connected by a common electrode, forming a composite structure of the transmitting and receiving structures. In this composite structure, the receiving coil is closer to the sensing coil than the transmitting coil.

9. The method for constructing a highly adaptable wireless ultrasonic measurement system according to claim 8, characterized in that, The sensing coil, transmitting coil, and receiving coil are prepared by radio frequency magnetron sputtering.

10. The method for constructing a highly adaptable wireless ultrasonic measurement system according to claim 8, characterized in that, The sensing coil, transmitting coil, and receiving coil are formed by winding a conductive solid.

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