Wafer degumming and slicing equipment

Abstract

The invention provides wafer degumming and slicing equipment, belongs to the technical field of wafer degumming and cleaning, and solves the problem of poor stability of wafer degumming in the prior art. The wafer degumming and slicing equipment comprises a degumming device, the degumming device comprises a degumming tank, the interior of the degumming tank is used for wafer degumming, the degumming tank is provided with a heating unit, and the heating unit acts on the degumming tank for heating; the wafer separating and feeding device comprises a material groove, and the material groove is used for wafer separating and feeding in the material supply frame; and the transfer device is used for transferring a material frame between the degumming device and the fragmentation feeding device. According to the wafer degumming device, the heating unit is additionally arranged to heat the degumming groove, so that the wafer can be effectively and completely separated from the wafer support, the wafer degumming stability is improved, wafer damage is avoided, meanwhile, the wafer fragmentation feeding device is arranged, and the damage rate of wafer fragmentation feeding can be reduced.

Description

Technical Field

[0001] This application belongs to the field of wafer cleaning technology, and more specifically, relates to a wafer debonding and slitting device. Background Technology

[0002] In the photovoltaic semiconductor manufacturing process, after the wafers are wire-cut into individual wafers, they need to be separated from the substrate and carrier through a debonding process. Then, they are inserted into a special basket to complete subsequent cleaning, inspection and other processes. The wafer sorting and loading process after debonding and before basket insertion is a key process to ensure wafer integrity and production continuity.

[0003] As photovoltaic semiconductor technology moves towards higher concentration and ultra-thin designs, wafer wire cutting technology has gradually evolved from abrasive wire cutting to diamond wire cutting. Processing time has been reduced from 22 hours to 6-8 hours, and wafer thickness has gradually decreased to below 100 micrometers. These wafers are extremely sensitive to stress, and the industry's requirements for production efficiency and yield continue to increase. Current technology for wafer debonding involves directly lowering the wafer holder to the surface of the debonding tank, ensuring that the adhesive area between the wafer and the holder is immersed in the debonding solution. However, this method cannot guarantee complete removal of the adhesive, leading to debonding failure for some wafers, and the lifting of the wafer holder may also pull away some wafers.

[0004] Based on the above, the technical problem with the existing technology is that the stability of wafer debonding is not good. Summary of the Invention

[0005] The purpose of this application is to address the aforementioned problems in the prior art by proposing a wafer debonding and slitting device that solves the problem of poor stability in wafer debonding in the prior art and improves the stability of wafer debonding.

[0006] The objective of this application can be achieved through the following technical solution: a wafer debonding and slitting device, comprising: a debonding device including a debonding tank for wafer debonding, a heating unit provided on the debonding tank, and the heating unit acting on the debonding tank to heat it; a slitting and feeding device including a material trough for feeding and slitting wafers in a feeding frame; and a transfer device for transferring the feeding frame between the debonding device and the slitting and feeding device.

[0007] In the aforementioned wafer debonding and slitting equipment, the debonding device further includes a wafer pressing assembly, which includes: a pressure roller disposed on the debonding groove for pressing the wafer to separate it from the wafer holder; a rotating shaft connected to the pressure roller and having rotational freedom to drive the pressure roller to swing and press the wafer; and a pressing drive mechanism disposed on the debonding groove and acting on the rotating shaft to drive the rotating shaft to rotate.

[0008] In the aforementioned wafer debinding and slitting equipment, at least two sets of wafer pressing components are configured. The two sets of wafer pressing components are mirror-symmetrically arranged at the same height position, and each set of wafer pressing components has multiple pressure rollers. The wafer pressing components have a first state and a second state. In the first state, each pressure roller rotates away from the bottom of the debinding tank, and the horizontal spacing of the pressure rollers of the two sets of wafer pressing components gradually decreases from top to bottom to allow the wafer to descend into the material frame. In the second state, the pressure rollers of the two sets of wafer pressing components rotate towards the bottom of the debinding tank, and the horizontal spacing of the pressure rollers gradually increases from top to bottom to adapt to the pressing of the outer diameter contour of the wafer.

[0009] In the aforementioned wafer debonding and slitting equipment, the debonding device further includes a plurality of positioning elements, which are distributed on the inner periphery of the debonding tank and form a positioning area between the plurality of positioning elements. The positioning area is used to accommodate the material frame.

[0010] In the aforementioned wafer debonding and slitting equipment, the debonding device further includes a baffle assembly, which includes: a baffle member, which is at least partially located within the positioning area and has a degree of freedom to move away from the positioning member to abut against the wafer; and a baffle driving mechanism, which is disposed on the debonding groove and acts on the baffle member to drive the baffle member to move.

[0011] In the aforementioned wafer debonding and slitting equipment, a fifth sensor is provided on the debonding tank. The fifth sensor faces the positioning area to detect the distance from the wafer. The fifth sensor is communicatively or electrically connected to the baffle driving mechanism.

[0012] In the aforementioned wafer debinding and slitting equipment, the transfer device includes: a conveying track disposed above the debinding device and the slitting and loading device; a wafer tray handling robot movably disposed on the conveying track for conveying or retrieving wafer trays to or from the debinding device; and a material frame handling robot movably disposed on the conveying track for transferring material frames between the debinding device and the slitting and loading device.

[0013] In the aforementioned wafer debonding and slitting equipment, the material trough is provided with a loading area and a buffer platform. The loading area is used for loading wafers into the material frame, and the buffer platform is used for buffering the material frame. The slitting and loading device further includes: a conveying component, which includes a first driving mechanism disposed on the material trough for driving the material frame to move within the loading area; and a lifting component, which is disposed on the path along which the first driving mechanism drives the material frame to move, for lifting the wafers in the material frame one by one.

[0014] In the aforementioned wafer debinding and slitting equipment, the lifting assembly includes: a first lifting member having a lifting surface that extends obliquely upwards from below the loading area into the loading area to form a height difference, and the lifting surface having a degree of freedom of movement for lifting wafers within the loading frame; an adsorption mechanism disposed above the first lifting member for adsorbing wafers lifted by the first lifting member; and a second lifting member disposed on the adsorption mechanism for further lifting wafers adsorbed by the adsorption mechanism.

[0015] In the above-mentioned wafer debonding and slitting equipment, the first lifting member is a wheel body, the outer periphery of the wheel body has the lifting surface, the wheel body has rotational freedom to lift the wafer, the outer periphery of the wheel body is made of elastic material, and the outer periphery of the wheel body is provided with multiple partition grooves, which are used to switch positions with the rotation of the first lifting member to receive wafers one by one.

[0016] Compared with the prior art, this application has the following beneficial effects:

[0017] This application adds a heating unit to heat the debonding tank, thereby ensuring that the wafer can be effectively and completely detached from the wafer holder, improving the stability of wafer debonding, and avoiding wafer damage. At the same time, a wafer loading device is set up to reduce the damage rate of wafer loading. Attached Figure Description

[0018] Figure 1 This is a simplified structural diagram of the wafer debonding and slitting equipment of this application; Figure 2 This is a simplified structural diagram of the wafer debonding and slitting equipment of this application; Figure 3 This is a simplified structural diagram of the two states of the chip depressurization component of this application; Figure 4 This is a simplified structural diagram of the segmented feeding device of this application; Figure 5 This is a schematic diagram of the wheel loading operation in this application. Figure 1 ; Figure 6yes Figure 5 A magnified structural diagram of region A in the middle; Figure 7 This is a simplified structural diagram of the wheel body supporting the wafer in this application; Figure 8 This is a schematic diagram of the wheel loading operation in this application. Figure 2 ; Figure 9 This is a schematic diagram of the wheel loading operation in this application. Figure 3 ; Figure 10 This is a schematic diagram of the working state of the conveyor belt feeding according to this application; Figure 11 This is a simplified structural diagram of the conveyor belt carrying wafers according to this application; Figure 12 This is a partial structural schematic diagram of the feeding mechanism and transmission mechanism of this application; Figure 13 yes Figure 12 A magnified structural diagram of region B in the middle; Figure 14 This is a schematic diagram of the adsorption mechanism, the second lifting component, and the liquid spraying assembly of this application; Figure 15 yes Figure 14 A magnified structural diagram of region C in the middle; Figure 16 This is a simplified flowchart of the segmented feeding method of this application; Figure 17 This is a simplified structural diagram of the wheel body and the positions of the X and Y points on the wheel body according to this application; Figure 18 yes Figure 17 A simplified schematic diagram of the wafer loading state of the wheel shown; Figure 19 This is a schematic diagram of the material frame structure of this application; Figure 20 This is a partial cross-sectional structural diagram of the material frame applied to the feeding area in this application; Figure 21 This is a simplified structural diagram of the cleaning device viewed from above; Figure 22 This is a simplified structural diagram of the cleaning device in its forward view. The markings in the diagram are as follows: 1000. Degumming device; 1100, Degumming tank; 1200, Wafer pressing assembly; 1210, Pressure roller; 1220, Rotating shaft; 1230, Pressing drive mechanism; 1300, Positioning component; Q4, Positioning area; 1400, Baffle assembly; 1410, Baffle component; 1420, Baffle drive mechanism; 1500, Fifth sensor; 1600, Heating unit; 2000, Segmented feeding device; 2100, Feed trough; Q1, Feeding area; 2110, Buffer platform; 2200, Conveying assembly; 2210, First drive mechanism; 2220, Guide rail; 2230, Pushing mechanism; 2231, Push plate; 2232, Second drive mechanism; 2240, First detection assembly; 2241, First contact shaft; 22411, First contact end; 2242, First sensor; 2250, Transmission mechanism; 2300, Lifting assembly; 2310, First lifting component; 2310a, Wheel; 2311. Separating groove; 2312, elastic belt; 2310b, conveyor belt; 2313, flexible strip; 2320, adsorption mechanism; 2321, adsorption plate; 23211, adsorption hole; Q3, clearance area; 2330, second lifting member; 2331, transmission belt; 2340, buffer member; 2341, guide part; Q2, buffer area; 2350, third sensor; 2400, second detection assembly; 2410, second contact shaft; 2420, second sensor; 2500, spray assembly; 2510, water jet; 3000, Cleaning equipment; 3100, Cleaning tank; 3200, Conveyor roller; 3300, Guide component; 3400, Fourth sensor; 3500, Spraying mechanism; 3600, Fluid jetting mechanism; 3700, Limiting roller; 3800, Brush roller; 4000, Transfer device; 4100 Conveyor track; 4200 Crystal tray handling robot; 4300 Material frame handling robot; 5000, chip handling robot; 5100, suction cup; 6000, material frame; 6100, Support roller; 6110, Elastic part; 6200, First connecting plate; 6210, First opening; 6220, Second opening; 6300, Second connecting plate; 6310, Third opening; S1, First chip; S2, Second chip; S3, Third chip; S4, Fourth chip; S5, Fifth chip; S, Chip. Detailed Implementation

[0019] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0020] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0021] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0022] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0023] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0024] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only embodiments.

[0025] See Figure 1 This application provides a wafer debonding and slitting device, including a debonding device 1000, a transfer device 4000, a slitting and loading device 2000, a wafer handling robot 5000, and a cleaning device 3000. The debonding device 1000 is used to debond the wafers in the wafer holder 6000, and the transfer device 4000 is used to transfer a wafer tray (not shown), an empty wafer tray, and a wafer holder 6000 (see reference) with wafers bonded to it, between the debonding device 1000 and the slitting and loading device 2000. Figure 20 ) or empty material frame 6000 (reference) Figure 19 The wafer loading device 2000 receives the wafer frame 6000 from the transfer device 4000 and moves the wafer frame 6000 to achieve wafer loading. The wafer handling robot 5000 transfers the wafers uploaded one by one by the wafer loading device 2000 to the cleaning device 3000, which cleans the wafers. It is understood that since the wafers are formed from a single crystal ingot, the ingot needs to be glued to the bottom of the wafer holder using an adhesive process. Then, the wafer holder is fed into a wire cutting device for wire cutting to form multiple wafers. The resulting multiple wafers are still glued to the wafer holder. At this point, the wafer holder with multiple wafers is transferred to the de-adhesive device 1000 of this application, and then the wafer holder is lowered so that the wafers at its bottom are immersed in the de-adhesive device 1000 to perform de-adhesive processing.

[0026] Regarding the degumming device 1000, please refer to [the relevant documentation / reference]. Figure 2The debonding device 1000 includes a debonding tank 1100 and a wafer pressing assembly 1200. The debonding tank 1100 is used for debonding wafers. The wafer pressing assembly 1200 includes a pressure roller 1210, a rotating shaft 1220, and a pressing drive mechanism 1230. The pressure roller 1210 is disposed on the debonding tank 1100 and is used to press the wafer to separate it from the wafer holder. The rotating shaft 1220 is connected to the pressure roller 1210 and has rotational freedom to drive the pressure roller 1210 to swing and press the wafer. The pressing drive mechanism 1230 is disposed on the debonding tank 1100 and acts on the rotating shaft 1220 to drive the rotating shaft 1220 to rotate. Understandably, the debonding tank 1100 can be filled with debonding liquid, and the debonding tank 1100 can hold the material frame 6000, which can carry the wafer. When the wafer at the bottom of the wafer holder descends to a certain height, for example, when the area where the wafer and the wafer holder are bonded is immersed below the liquid surface of the debonding tank 1100, after a period of debonding treatment, most of the adhesive between the wafer holder and the wafer can be removed. At this time, the pressing drive mechanism 1230 of the wafer pressing assembly 1200 can drive the rotating shaft 1220 to rotate. The rotation of the rotating shaft 1220 drives the pressure roller 1210 to swing and press down the wafer, so that the wafer has a downward movement tendency, and the wafer and the wafer holder can gradually separate. In addition, as another operation method, the wafer pressing assembly 1200 can also be used to press against the wafer, and the wafer holder can move upward, thereby realizing the separation of the wafer holder and the wafer. Subsequently, the material frame 6000 is used as a new carrier to carry the wafer.

[0027] See Figure 2 and Figure 3 In some embodiments, at least two sets of wafer pressing assemblies 1200 are configured, and the two sets of wafer pressing assemblies 1200 are mirror-symmetrically arranged at the same height position. Each set of wafer pressing assemblies 1200 has multiple pressure rollers 1210. The wafer pressing assemblies 1200 have a first state and a second state. In the first state, each pressure roller 1210 rotates away from the bottom of the desizing tank 1100, and the horizontal spacing of the pressure rollers 1210 of the two sets of wafer pressing assemblies 1200 gradually decreases from top to bottom to allow the wafer S to descend into the feed frame 6000. In the second state, the pressure rollers 1210 of the two sets of wafer pressing assemblies 1200 rotate towards the bottom of the desizing tank 1100, and the horizontal spacing of the pressure rollers 1210 gradually increases from top to bottom to adapt to the pressing of the outer circumference of the wafer S. (Refer to...) Figure 3 Part a shows the first state of the wafer pressing assembly 1200. The pressure rollers 1210 of the two sets of wafer pressing assemblies 1200 swing upward as the rotating shaft 1220 rotates, thereby increasing the gap between the two sets of wafer pressing assemblies 1200 to make way for the wafer S, so that the wafer S can descend into the feed frame 6000. Figure 3Part b illustrates the second state of the wafer pressing assembly 1200. The pressure rollers 1210 of the two sets of wafer pressing assemblies 1200 swing downwards as the rotation shaft 1220 rotates, thereby reducing the gap between the two sets of wafer pressing assemblies 1200 and pressing down on the wafer S, making it easier for the wafer S to detach from the wafer holder. It should be noted that the spacing and position of each set of pressure rollers 1210 in the horizontal direction are specifically arranged to adapt to the outer contour shape of the wafer S, meeting the requirements for clearance or pressing down.

[0028] See Figure 2 In some embodiments, the degumming device 1000 further includes a plurality of positioning members 1300, which are distributed around the inner periphery of the degumming tank 1100. A positioning area Q4 is formed between the positioning members 1300, and the positioning area Q4 is used to accommodate the material frame 6000. For example, the positioning members 1300 are plate-shaped, and the plurality of positioning members 1300 are distributed circumferentially within the degumming tank 1100 to enclose and form the positioning area Q4. The positioning area Q4 contains the material frame 6000, thereby fixing the material frame 6000 and improving stability.

[0029] See Figure 2 In some embodiments, the debonding device 1000 further includes a baffle assembly 1400, which includes a baffle member 1410 and a baffle driving mechanism 1420. The baffle member 1410 is at least partially located within the positioning area Q4. The baffle member 1410 has the freedom to move away from the positioning member 1300 to abut against the wafer. The baffle driving mechanism 1420 is disposed on the debonding groove 1100 and acts on the baffle member 1410 to drive the baffle member 1410 to move. For example, the baffle member 1410 is strip-shaped or plate-shaped, and the baffle driving mechanism 1420 is a linear driving mechanism, such as an electric cylinder or a pneumatic cylinder. The baffle driving mechanism 1420 drives the baffle member 1410 to move closer to the wafer, and the baffle member 1410 can abut against the end face of the wafer, thereby preventing the wafer from tipping over.

[0030] See Figure 2In some embodiments, a fifth sensor 1500 is provided on the stripping tank 1100. The fifth sensor 1500 faces the positioning area Q4 to detect the distance to the wafer. The fifth sensor 1500 is communicatively or electrically connected to the wafer baffle driving mechanism 1420. It is understood that when the wafer descends into the stripping tank 1100, the fifth sensor 1500 on the stripping tank 1100 can detect the distance between the wafer and the fifth sensor 1500. The fifth sensor 1500 then sends the distance information to the wafer baffle driving mechanism 1420, which drives the wafer baffle member 1410 to a preset position relative to the wafer, for example, 20mm from the wafer. The wafer baffle driving mechanism 1420 can perform a wafer baffle operation to prevent the wafer from tipping over and falling irregularly into the feed frame 6000, causing it to shatter. A high-temperature resistant plastic plate (not shown) is installed near the wafer. The material is relatively soft to ensure that no hard or metal materials directly contact the wafer. Meanwhile, the motor of the baffle drive mechanism 1420 is equipped with a torque feedback mechanism, which can prevent the baffle component 1410 from moving too far and hitting the chip when the ranging fails, thus preventing damage.

[0031] See Figure 2 In some embodiments, the debonding apparatus 1000 further includes a heating unit 1600 disposed within the debonding tank 1100, and the heating unit 1600 acts on the debonding tank 1100 to heat it. For example, the heating unit 1600 is a heating wire. Since the debonding tank 1100 stores debonding liquid, heating the debonding tank 1100 by the heating unit 1600 accelerates the removal of adhesive between the wafer and the wafer holder, thereby improving the debonding efficiency.

[0032] For information on the transfer device 4000, please refer to... Figure 1 The transfer device 4000 includes a conveying track 4100, a crystal tray handling robot 4200, and a material frame handling robot 4300. The conveying track 4100 is disposed above the degumming device 1000 and the slitting and feeding device 2000. The crystal tray handling robot 4200 is movably disposed on the conveying track and is used to convey or retrieve the crystal tray to the degumming device 1000. The material frame handling robot 4300 is movably disposed on the conveying track 4100 and is used to transfer the material frame 6000 between the degumming device 1000 and the slitting and feeding device 2000.

[0033] For information on the 2000 segmented feeding device, please refer to the attached diagram in the instruction manual. Figure 4The segmented feeding device 2000 of this application includes a material trough 2100, a conveying assembly 2200, and a lifting assembly 2300. The material trough 2100 is provided with a loading area Q1; the conveying assembly 2200 includes a first driving mechanism 2210, which is disposed on the material trough 2100 and is used to drive the material frame 6000 to move within the loading area Q1; the lifting assembly 2300 includes a first lifting member 2310, an adsorption mechanism 2320 and a second lifting member 2330. The first lifting member 2310 has a lifting surface (not shown in the figure), which extends from below the loading area Q1 upwards into the loading area Q1 to form a height difference, and the lifting surface has a degree of freedom of movement, used to lift the wafers in the material frame 6000. The adsorption mechanism 2320 is disposed above the first lifting member 2310 and is used to adsorb the wafers lifted by the first lifting member 2310. The second lifting member 2330 is disposed above the adsorption mechanism 2320 and is used to continue to lift the wafers adsorbed by the adsorption mechanism 2320. Understandably, the feed frame 6000 is used to place the wafer stack formed by the crystal ingot slicing process. The wafer stack contains multiple axially arranged wafers. The feed tank 2100 can contain liquid, so that the wafers are always in an immersion environment to clean them when they are fed. The feed tank 2100 is provided with a feeding area Q1, and the feed frame 6000 in the feeding area Q1 moves to feed the wafers. The first drive mechanism 2210 drives the material frame 6000 to move in the loading area Q1. When the material frame 6000 moves above the first lifting member 2310, the bottom of the wafer in the material frame 6000 is low and can be lifted by the lifting surface of the first lifting member 2310. The wafer moves upward synchronously with the lifting surface and gradually gets off the support of the material frame 6000. The adsorption mechanism 2320 can adsorb the initially lifted wafer. Then, the second lifting member 2330 continues to lift the wafer adsorbed by the adsorption mechanism 2320 to a suitable height. The height of each wafer on the lifting surface is different. After the wafer is lifted to the set height, it can be removed one by one by an external mechanism or manually. This implementation reduces the damage rate of wafer slab loading.

[0034] See Figure 5 In some embodiments, the first lifting member 2310 is a wheel 2310a. The outer periphery of the wheel 2310a has a lifting surface, which is the portion of the outer circle of the wheel 2310a near the feed frame 6000. The wheel 2310a has rotational freedom to lift the wafer. It is understood that the outer diameter of the wheel 2310a can be adjusted based on the dimensions of the feed frame 6000 and the wafer. The wheel 2310a can be driven to rotate, thereby enabling it to continuously lift the wafer within the feed frame 6000. It should be noted that... Figure 5 Taking the first chip S1, the second chip S2, and the third chip S3 as an example (the actual chip arrangement is more compact), Figure 5 (The image only shows a portion of the wafers) The wafer loading process is explained in detail: Figure 5 The second wafer S2 and the third wafer S3 are initially supported by the support structure inside the feed frame 6000. The bottom of the second wafer S2 and the third wafer S3 extends out of the bottom of the feed frame 6000. As the feed frame 6000 moves forward, the first wafer S1 first contacts the wheel 2310a. The wheel 2310a rotates and drives the first wafer S1 to rise synchronously. The first wafer S1 gradually separates from the support structure inside the feed frame 6000.

[0035] See Figure 6 In some embodiments, the outer periphery of the wheel 2310a is made of an elastic material, and the outer periphery of the wheel 2310a is provided with a plurality of partition grooves 2311. These partition grooves 2311 are used to switch positions as the first lifting member 2310 rotates to receive wafers one by one. It is understood that by providing a plurality of partition grooves 2311 circumferentially on the outer periphery of the wheel 2310a, the width of each partition groove 2311 is configured to be slightly larger than the thickness of a single wafer, thereby allowing for the accommodation of a single wafer (e.g., ...). Figure 6 The first wafer (S1) shown is made of an elastic material, which makes it less likely to be damaged. When the first lifting member 2310 moves, the partition grooves 2311 distributed on the outer periphery of the first lifting member 2310 gradually move to a height position that can contact the wafer, thereby lifting the wafer one by one to realize wafer feeding.

[0036] See Figure 7 In some embodiments, at least two elastic bands 2312 are wound around the outer periphery of the wheel 2310a, and the at least two elastic bands 2312 are axially spaced apart on the wheel 2310a to support the wafer. It is understood that, compared to... Figure 6 The partition groove 2311 shown in the scheme is... Figure 7 The two elastic bands 2312 shown make it easier to protect the chip (e.g.) Figure 7 The first chip S1 shown is used to avoid damage from hard contact with the chip.

[0037] Furthermore, as the 6000mm feed frame continues to advance, reference... Figure 8The second chip S2 is also lifted upward by the wheel 2310a. At this time, the first chip S1 and the second chip S2 are received and supported by the buffers 2340 on both sides of the wheel 2310a. The buffers 2340 on both sides protrude at least partially from the highest point of the wheel 2310a, and a buffer area Q2 is formed between the buffers 2340 on both sides and the highest point of the wheel 2310a. The buffer area Q2 is used to buffer the chip lifted by the wheel 2310a. An adsorption plate 2321 is provided above the buffer area Q2. It is understandable that the buffers 2340 on both sides of the first lifting member 2310 not only buffer the wafers but also have a limiting function to ensure that the wafers are stably located within the buffer area Q2. It should be noted that the distance between the buffers 2340 and the first lifting member 2310 needs to be preset to ensure that the wafers can smoothly enter the buffer area Q2. Furthermore, the distance between the buffers 2340 on both sides needs to be controlled to be less than the outer diameter of the wafer. For example, the buffer 2340 is a shaft, which can reduce frictional damage to the outer diameter of the wafer. One end of the shaft extends directly below the adsorption mechanism 2320, so that when a wafer is lifted by the second lifting member 2330, multiple wafers to be lifted can be buffered on the shaft. That is, the buffer area Q2 can buffer wafers initially lifted by the first lifting member 2310, awaiting subsequent secondary lifting. It should be noted that a guide portion 2341 is provided on the end of the shaft near the first lifting member 2310 (see reference). Figure 6 The guide section 2341 can guide the chip from the first lifting member 2310 to the shaft, thereby improving the cache fault tolerance.

[0038] After the material frame moves forward a certain distance from 6000, refer to Figure 9 The second chip S2 is attracted by the front adsorption plate 2321, while the second lifting member 2330 ( Figure 9 Not shown in the image, please refer to the following: Figure 4 or Figure 14 The first chip S1, which was previously adsorbed by the adsorption plate 2321, has been raised to a higher position. The first chip S1 is then adsorbed by the suction cup 5100 of the chip handling robot 5000. The chip handling robot 5000 can move and transfer a single chip.

[0039] See Figure 10 In some embodiments, the first lifting member 2310 is a conveyor belt 2310b, which has a lifting surface and reciprocating motion degrees of freedom to lift the wafer. For example, as the first lifting member 2310, the conveyor belt 2310b is configured with a height difference on its upper surface. As the conveyor belt 2310b moves, the portion of its upper surface at the lower position gradually moves to the higher position, thereby achieving wafer lifting.

[0040] See Figure 11In some embodiments, flexible strips 2313 are arranged along the length of the conveyor belt 2310b, with at least two flexible strips 2313 spaced apart in the width direction of the conveyor belt 2310b to support the wafer. It is understood that by providing two flexible strips 2313 on the conveyor belt 2310b, hard contact can be avoided, thereby further reducing the damage rate during the wafer lifting process.

[0041] See Figure 12 In some embodiments, the first lifting member 2310 ( Figure 12 Taking wheel 2310a as an example, it can be connected to the first drive mechanism 2210 through a transmission mechanism 2250. For example, the transmission mechanism 2250 includes a belt (not shown in the figure) and a transmission wheel (not shown in the figure). Part of the belt is sleeved on the transmission wheel, and part of the belt is sleeved on the output part of the first drive mechanism 2210. The transmission wheel is connected to the first lifting member 2310, so the first drive mechanism 2210 drives the belt to move, the belt drives the transmission wheel to rotate, and the transmission wheel drives the first lifting member 2310 to move synchronously. Since the first drive mechanism 2210 also drives the material frame 6000 to move at the same time, and since the rotation speed of the transmission wheel of the transmission mechanism 2250 depends on the outer diameter, by controlling the ratio of the linear velocity of the transmission wheel to the linear velocity of wheel 2310a, the horizontal component force of the wheel 2310a driving the wafer to rotate is made to a suitable value, so as to avoid the wafer from tilting. In actual testing, the wafer on wheel 2310a is slightly tilted, which does not affect the lifting effect and can be adsorbed and fixed later.

[0042] Continue to refer to Figure 4 and Figure 12 In some embodiments, the conveying assembly 2200 further includes a guide rail 2220, which is disposed within the material trough 2100 for sliding connection with the material frame 6000, and a feeding area Q1 is formed above the guide rail 2220. For example, there are two guide rails 2220, each arranged within the material trough 2100. The material frame 6000 can be placed on the guide rails 2220. When the first driving mechanism 2210 drives the material frame 6000 to move, the material frame 6000 can move along the length direction of the guide rail 2220, ensuring the moving accuracy of the material frame 6000.

[0043] Reference Figure 12In some embodiments, the conveying assembly 2200 further includes a pushing mechanism 2230, which includes a push plate 2231 and a second driving mechanism 2232. The height of the push plate 2231 is within the height range of the loading area Q1. The second driving mechanism 2232 is mounted on the first driving mechanism 2210 and acts on the push plate 2231 to move it toward the adsorption mechanism 2320. It is understood that the second driving mechanism 2232 is mounted on the first driving mechanism 2210 and is either an electric cylinder or a pneumatic cylinder. When the first driving mechanism 2210 drives the material frame 6000 to a certain position in the loading area Q1, the second driving mechanism 2232 drives the push plate 2231 to move, thereby providing support and pushing functions for the wafer tail. It can cooperate with the first lifting member 2310 for continuous loading and lifting. For example, the portion of the push plate 2231 that contacts the wafer is made of POM plastic to prevent direct metal contact with the wafer.

[0044] See Figure 12 and Figure 13 In some embodiments, the feeding mechanism 2230 is further provided with a first detection component 2240. The first detection component 2240 includes a first contact shaft 2241 and a first sensor 2242. The first contact shaft 2241 is disposed on one side of the push plate 2231 or passes through the push plate 2231, and the end of the first contact shaft 2241 facing the feeding area Q1 is the first contact end 2411. The first contact end 2411 always has a tendency to protrude from the push plate 2231 to contact the wafer. The first sensor 2242 faces the first contact shaft 2241 to detect whether the first detection shaft has moved. Understandably, by adding a waterproof distance sensor, namely the first sensor 2242, near the wafer, to determine the distance between the pusher plate 2231 and the wafer, this application employs a spring-based detection scheme. A protrusion and a spring can be provided on the first contact shaft 2241. Utilizing the cooperation of the protrusion and spring, when the first contact shaft 2241 contacts the wafer, it overcomes the spring force and moves axially. The first sensor 2242 detects this movement of the first contact shaft 2241, thus determining the distance between the pusher plate 2231 and the wafer. This detection method avoids damage to the wafer. Alternatively, other detection schemes, such as hard connections, can also be used.

[0045] See Figure 14 In some embodiments, the adsorption mechanism 2320 includes an adsorption plate 2321 and a first pump body (not shown). The adsorption plate 2321 is disposed above the first lifting member 2310. See [reference needed]. Figure 15The adsorption plate 2321 has multiple adsorption holes 23211 on the side facing the material frame 6000. These holes are used to adsorb the wafers lifted by the first lifting member 2310. The first pump body is connected to the adsorption holes 23211 to provide negative pressure adsorption force. It can be understood that by using the negative pressure adsorption force provided by the first pump body, the multiple adsorption holes 23211 on the adsorption plate 2321 simultaneously adsorb and fix a single wafer, ensuring that the wafer can be stably lifted by the second lifting member 2330. Furthermore, since the material tank 2100 is in a liquid environment, the wafer will not be damaged due to excessive friction with the adsorption plate 2321. A pipe can be installed between the first pump body and the adsorption plate 2321 to draw out water. The pumping power of the first pump body can be adjusted to avoid excessive adsorption force that would prevent the wafer from being lifted by the second lifting member 2330.

[0046] Continue to refer to Figure 14 In some embodiments, the adsorption plate 2321 has clearance areas Q3 on both sides, which are used to avoid the material frame 6000 so that the material frame 6000 can move through. It can be understood that by setting the clearance areas Q3, the material frame 6000 can move forward smoothly, thereby continuously driving the wafer feeding.

[0047] Continue to refer to Figure 14 In some embodiments, the second lifting member 2330 includes a drive belt 2331 and a third drive mechanism (not shown). The drive belt 2331 is arranged along the length of the adsorption plate 2321. Figure 15 The transmission belt 2331 protrudes at least partially relative to the adsorption plate 2321 to contact the wafer. The third driving mechanism acts on the transmission belt 2331 to drive the transmission belt 2331 to lift the wafer. For example, the adsorption plate 2321 has a conveying groove (not shown), and the transmission belt 2331 is arranged in the conveying groove. The transmission belt 2331 protrudes partially from the conveying groove. The third driving mechanism can be a combination of a motor and a pulley. The output shaft of the motor is equipped with a pulley, which is connected to the transmission belt 2331. Thus, when the third driving mechanism drives the transmission belt 2331 to convey, the transmission belt 2331 can drive the wafer upward due to the adsorption effect of the adsorption plate 2321.

[0048] Continue to refer to Figure 14In some embodiments, the wafer feeding device 2000 of this application further includes a second detection component 2400. The second detection component 2400 includes a second contact shaft 2410 and a second sensor 2420. The second contact shaft 2410 is disposed on one side of the adsorption plate 2321, and the end of the second contact shaft 2410 facing the feeding area Q1 is the second contact end (not shown in the figure). The second contact end always has a tendency to protrude from the transmission belt 2331 to contact the wafer. The second sensor 2420 is disposed at a distance from the second contact shaft 2410 and away from the second contact end. The second sensor 2420 faces the second contact shaft 2410. For example, the second sensor 2420 is a distance sensor. When the wafer moves forward and contacts the protruding second contact end of the second contact shaft 2410, the second contact end is made of a soft or elastic material. The second contact shaft 2410 is provided with a spring (not shown in the figure) and a spring seat (not shown in the figure). The second contact shaft 2410 is compressed to overcome the spring force, and the second contact shaft 2410 moves axially, which is detected by the second sensor 2420, obtaining a signal that the wafer is attracted. This signal can then be fed back to the third drive mechanism of the second lifting member 2330 to lift the wafer sequentially. This detection structure is relatively conventional, so it will not be described in detail here. Continue to refer to Figure 14 In some embodiments, the wafer loading device 2000 of this application further includes a liquid spraying assembly 2500, which includes water jets 2510 and a second pump body. Multiple water jets 2510 are distributed on both sides of the adsorption mechanism 2320, with the multiple water jets 2510 facing upwards towards the first lifting member 2310. The second pump body is connected to the liquid path of the multiple water jets 2510. It is understood that, due to the small gap between wafers after debinding in the previous process, the water jets 2510 are used to spray water to further prevent wafer adhesion during loading, ensuring single-wafer loading. For example, the water jets 2510 are connected to the second pump body via water pipes. Water is delivered to the water jets 2510 through the second pump body and water pipes, and then sprayed by the water jets 2510 towards the area above the first lifting member 2310 to disperse the wafers.

[0049] Continue to refer to Figure 14 In some embodiments, a third sensor 2350 is provided above the second lifting member 2330, and the third sensor 2350 faces the second lifting member 2330. A wafer handling robot 5000 is also provided above the second lifting member 2330 (see reference). Figure 5 , Figure 8 , Figure 9 or Figure 10The wafer handling robot 5000 has at least three degrees of freedom of movement. It is equipped with a suction cup 5100 for adsorbing wafers lifted by the second lifting member 2330. It is understood that by using the wafer handling robot 5000 to replace manual wafer handling, the overall efficiency of wafer loading is improved. Furthermore, using the suction cup 5100 to adsorb wafers increases the stability of wafer handling and further reduces the wafer damage rate.

[0050] See Figure 4 In some embodiments, the material tank 2100 is used to contain cleaning fluid, and a buffer platform 2110 is provided inside the material tank 2100 and on one side of the loading area Q1. The buffer platform 2110 is used to buffer the material frames 6000. It can be understood that by setting the buffer platform 2110 in the material tank 2100, when a material frame 6000 containing a wafer is loaded in the loading area Q1, the material frame 6000 of the previous process can be buffered in the buffer platform 2110. After all the material frames 6000 in the previous process have been loaded, the material frame 6000 can be moved to the loading area Q1 for loading.

[0051] See Figure 16 The wafer slab loading method of this application includes: S100, placing the slab frame in the loading area; S200, driving the slab frame to feed towards the wheel body, while simultaneously driving the wheel body to rotate, so as to gradually lift the wafer in the slab frame; S300, defining the initial contact point between the wafer and the wheel body as point X, and controlling the feeding speed of the slab frame to be substantially equal to the horizontal moving speed of the wafer at point X.

[0052] See Figure 17 and Figure 18 In some embodiments, the method of this application further includes defining the point at which the wafer S disengages from contact when it rotates with the wheel to a position higher than point X as point Y, and defining the linear velocity of the wheel at point X as V. 大 Define the horizontal velocity component of the wafer S at point X as V1, define the center of the wheel as point O, define the line connecting point X and point O as line XO, define the line connecting point Y and point O as line YO, define the angle formed by line XO and line YO as θ, and control the wheel speed to satisfy: It is understandable that, since the horizontal velocity of the wafer continuously increases as it moves from point X to point Y, as long as the horizontal velocity of the wafer at point X remains consistent with the feed speed of the feed frame (i.e., the linear velocity of the wheel), it can be ensured that the bottom of the wafer moves faster than the top during its forward movement, causing the wafer to tilt slightly towards the feed frame. Field verification has shown that a slight tilt towards the feed frame results in better wafer loading; conversely, if the wafer tilts towards the suction plate, jamming is more likely to occur (e.g., ...). Figure 18 As shown in the figure, it is necessary to ensure that the horizontal velocity of the wafer at point X is consistent with the feed rate of the feed frame.

[0053] In some embodiments, the wheel body includes a main wheel ( Figure 17 (Middle red circle) and rubber wheel ( Figure 17 (A yellow circle in the center), the rubber wheel is sleeved on the outer circle of the main wheel, and the radius of the main wheel is defined as R. 小 Define the radius of the rubber wheel as R. 大 Define the angular velocity of the main wheel and the rubber wheel as n; based on , , And the actual R 小 and R 大 Calculate and determine the included angle value θ, based on R 小 R 大 The formula θ sets the relative position between the wheel and the material frame. It can be understood that, using the above formula, the radius of the main wheel and the radius of the rubber wheel, and the included angle θ, the required relative position between the wheel and the material frame can be quickly calculated, facilitating the operator's placement.

[0054] See Figure 19 and Figure 20 The feed frame 6000 of this application is used in the wafer loading device 2000 of this application. The feed frame 6000 is provided with a plurality of support rollers 6100. At least one support roller 6100 has an elastic portion 6110 on its surface. The elastic portion 6110 allows the outer circumference portions of a plurality of wafers S to be spaced along the length direction of the support roller 6100 to form a plurality of slots (not shown). The slots are used to separate and fix the wafers S. The feed frame 6000 is provided with a first connecting plate 6200 and a second connecting plate 6300 at its two ends, respectively. The bottom of the first connecting plate 6200 has a first opening 6210. The first opening 6210 is used to allow the feed frame 6000 to avoid the first lifting member 2310 (see reference) when it moves. Figure 12 The wheel body 2310a), a second opening 6220 is provided above the first opening 6210, the second opening 6220 is used to avoid the adsorption mechanism 2320 and the second lifting member 2330 when the feeding frame 6000 moves. Figure 14And / or, the second connecting plate 6300 is provided with a third opening 6310, which is used for external material pushing. For example, the elastic part 6110 is a sponge, and the surfaces of the two support rollers 6100 have elastic parts 6110, which can stably support the wafer S and embed the wafer S, separating them from each other to avoid sticking, and facilitating subsequent single-wafer lifting and feeding of the wafer S. Understandably, the first connecting plate 6200 and the second connecting plate 6300 can limit the bottom of the wafer S, preventing the wafer S from tipping over the discharge frame 6000. Furthermore, by opening the first opening 6210 on the first connecting plate 6200, the first lifting member 2310 can be inserted, so that the material frame 6000 will not interfere with the first lifting member 2310 when moving towards the first lifting member 2310, until the top of the wafer S is lifted by the first lifting member 2310. By providing the second opening 6220, the material frame 6000 can avoid the adsorption mechanism 2320 and the second lifting member 2330 when moving forward, and continue to lift the wafer S in conjunction with the first lifting member 2310. By opening the third opening 6310 on the second connecting plate 6300, the third opening 6310 facilitates the pushing of the tail of the wafer S during the wafer S feeding stage, preventing the wafer S from collapsing as a whole.

[0055] The wafer loading device 2000 of this application drives the material frame 6000 to move in the loading area Q1 via the first drive mechanism 2210. When the material frame 6000 moves above the first lifting member 2310, the bottom position of the wafer in the material frame 6000 is low, so it can be lifted by the lifting surface of the first lifting member 2310. The wafer S moves upward synchronously with the lifting surface tilting, and gradually gets off the support of the material frame 6000. The initially lifted wafer can be adsorbed by the adsorption mechanism 2320, and then the wafer adsorbed by the adsorption mechanism 2320 is lifted upward by the second lifting member 2330 until it is finally lifted to a suitable height. The height of each wafer S on the lifting surface is different. After the wafer S is lifted to the set height position, it can be removed one by one by an external mechanism or manually, which ultimately reduces the damage rate of wafer S during wafer loading.

[0056] See Figure 21 Regarding the cleaning device 3000, the cleaning device 3000 includes a cleaning tank 3100 and a conveying roller 3200. The cleaning tank 3100 is disposed in the lifting assembly 2300 (see reference). Figure 4On one side, a plurality of conveyor rollers 3200 are used to receive and clean the wafers S lifted by the second lifting component 2330. These conveyor rollers 3200 are located within the cleaning tank 3100 and spaced apart along the length of the cleaning tank 3100. Each conveyor roller 3200 has rotational freedom and is used to convey the wafers S. It can be understood that the wafers S are picked up from the lifting component 2300 and placed onto the conveyor rollers 3200 by the wafer handling robot 5000. Each conveyor roller 3200 can be driven to rotate by a motor to transfer the wafers S. The wafers S are cleaned simultaneously during transfer, improving overall cleaning and conveying efficiency.

[0057] Continue to refer to Figure 21 In some embodiments, guide members 3300 are provided on both sides near the axial direction of the conveying roller 3200, and the distance between the guide members 3300 on both sides is determined by the distance near the sheet feeding device 2000 (see reference). Figure 1 The wafer gradually contracts in the direction away from the wafer feeding device 2000. It is understood that in order to prevent the wafer S from deviating and detaching from the two ends of the conveyor roller 3200 when it is being conveyed on the conveyor roller 3200, a guide 3300 is added so that the wafer S is brought closer together and conveyed along the middle part of the conveyor roller 3200.

[0058] Continue to refer to Figure 1 and Figure 21 In some embodiments, a wafer handling robot 5000 is provided between the wafer loading device 2000 and the cleaning device 3000. The wafer handling robot 5000 is used to transfer single wafers S onto the conveyor rollers 3200. A fourth sensor 3400 is provided between the conveyor rollers 3200 to detect whether there are wafers S on the conveyor rollers 3200. The fourth sensor 3400 is communicatively connected to the wafer handling robot 5000. For example, the fourth sensor 3400 is a distance sensor. By detecting whether there are wafers S on the conveyor rollers 3200, the fourth sensor 3400 controls the operation of the wafer handling robot 5000. If the presence of wafers S is detected, the wafer handling robot 5000 stops placing wafers S onto the conveyor rollers 3200. If the absence of wafers S is detected, the wafer handling robot 5000 places wafers S onto the conveyor rollers 3200. This configuration avoids wafers S overlapping and incomplete cleaning, and also avoids interference and damage to other structures during subsequent transport.

[0059] See Figure 22In some embodiments, the cleaning apparatus 3000 further includes a spray mechanism 3500 and / or a fluid jetting mechanism 3600. The spray mechanism 3500 is disposed above the conveyor roller 3200 and has a spray head (not shown) that sprays towards the conveyor roller 3200 to wet the wafer S. The fluid jetting mechanism 3600 is disposed below the conveyor roller 3200 and has a fluid nozzle (not shown) that sprays towards the conveyor roller 3200 to rinse the wafer S. For example, the spray head may be connected to a spray nozzle, which may be connected to a spray liquid supply source. The spray mechanism 3500 sprays towards the conveyor roller 3200 to wet the wafer S. Similarly, the fluid nozzle may be connected to a spray liquid supply source, and the fluid jetting mechanism 3600 sprays from bottom to top to rinse the wafer S.

[0060] Continue to refer to Figure 22 In some embodiments, the cleaning apparatus 3000 further includes a set of limiting rollers, which includes two vertically spaced limiting rollers 3700. The space between the two vertically spaced limiting rollers 3700 is used to accommodate the wafer S to limit the wobbling of the wafer S. The limiting rollers 3700 are arranged in the layout direction of the conveying rollers 3200 to input or output the wafer S. It can be understood that by setting the limiting roller set, the wafer S can be prevented from being sprayed by the fluid jetting mechanism 3600 and thus avoid large-scale movement. At the same time, stable wafer S transmission can improve the cleaning effect. It should be noted that the spacing between the limiting rollers 3700 is preset to match the thickness of the wafer S. The outer surface of the limiting rollers 3700 can be made of elastic material to avoid damage to the wafer S.

[0061] Continue to refer to Figure 22 In some embodiments, the cleaning apparatus 3000 further includes a brush roller assembly, which includes two vertically spaced brush rollers 3800. The space between the two vertically spaced brush rollers 3800 is used to accommodate the wafer S for brushing the wafer S, and the brush rollers 3800 are arranged in the layout direction of the conveyor roller 3200 to input or output the wafer S. It is understood that the brush rollers 3800 are arranged on the path of the conveyor roller 3200 to convey the wafer S. The vertically spaced brush rollers 3800 can brush both end faces of the wafer S. Furthermore, the brush roller assembly can also cooperate with a limiting roller assembly. When the wafer S is conveyed through the limiting roller assembly, it is restricted from moving up and down, and the wafer S can be stably brushed by the brush rollers 3800, improving the cleaning effect.

[0062] The specific embodiments described herein are merely illustrative examples of the spirit of this application. Those skilled in the art to which this application pertains may make various modifications or additions to the described specific embodiments or use similar methods to substitute them, without departing from the spirit of this application or exceeding the scope defined by the appended claims.

Claims

1. A wafer debonding and slitting device, characterized in that, include: A debonding device (1000) includes a debonding tank (1100) for debonding wafers (S), and a heating unit (1600) is provided on the debonding tank (1100) for heating the debonding tank (1100). A wafer loading device (2000) includes a feed trough (2100) for wafer (S) slicing and loading within a feed frame (6000); and A transfer device (4000) is used to transfer a material frame (6000) between the degumming device (1000) and the sheet feeding device (2000).

2. The wafer debonding and slitting equipment according to claim 1, characterized in that, The debonding device (1000) further includes a wafer pressing assembly (1200), which includes: A pressure roller (1210) is disposed on the degumming groove (1100) for pressing down the wafer (S) to separate it from the wafer holder; A rotating shaft (1220) is connected to the pressure roller (1210), and the rotating shaft (1220) has rotational freedom to drive the pressure roller (1210) to swing and press the wafer (S); and A pressing drive mechanism (1230) is disposed on the degumming groove (1100), and the pressing drive mechanism (1230) acts on the rotating shaft (1220) to drive the rotating shaft (1220) to rotate.

3. The wafer debonding and slitting equipment according to claim 2, characterized in that, At least two sets of the wafer pressing assembly (1200) are configured. The two sets of wafer pressing assemblies (1200) are mirror-symmetrically arranged at the same height position, and each set of wafer pressing assemblies (1200) has multiple pressure rollers (1210). The wafer pressing assembly (1200) has a first state and a second state. In the first state, each pressure roller (1210) rotates away from the bottom of the debonding groove (1100). The horizontal spacing of the pressure rollers (1210) of the two sets of wafer pressing assemblies (1200) gradually decreases from top to bottom to allow the wafer (S) to descend into the material frame (6000). In the second state, the pressure rollers (1210) of the two sets of wafer pressing assemblies (1200) rotate towards the bottom of the debonding groove (1100). The horizontal spacing of the pressure rollers (1210) gradually increases from top to bottom to adapt to the pressing of the outer circle contour of the wafer (S).

4. The wafer debonding and slitting equipment according to claim 1, characterized in that, The degumming device (1000) further includes a plurality of positioning elements (1300), which are distributed on the inner periphery of the degumming tank (1100). A positioning area (Q4) is formed between the plurality of positioning elements (1300), and the positioning area (Q4) is used to accommodate the material frame (6000).

5. The wafer debonding and slitting equipment according to claim 4, characterized in that, The degumming device (1000) further includes a baffle assembly (1400), the baffle assembly (1400) comprising: A baffle (1410) is at least partially located within the positioning area (Q4) and has a degree of freedom to move in a direction away from the positioning member (1300) to abut against the wafer (S). A baffle driving mechanism (1420) is disposed on the degumming groove (1100), and the baffle driving mechanism (1420) acts on the baffle member (1410) to drive the baffle member (1410) to move.

6. The wafer debonding and slitting equipment according to claim 5, characterized in that, The degumming tank (1100) is equipped with a fifth sensor (1500), which faces the positioning area (Q4) to detect the distance to the wafer (S). The fifth sensor (1500) is communicatively or electrically connected to the baffle drive mechanism (1420).

7. The wafer debonding and slitting equipment according to claim 1, characterized in that, The transfer device (4000) includes: A conveying track (4100) is disposed above the degumming device (1000) and the sheet feeding device (2000); A crystal tray handling robot (4200), movably mounted on the conveying track (4100), is used to convey or retrieve crystal trays to or from the debinding device (1000); and A material frame handling robot (4300) is movably mounted on the conveying track (4100) and is used to transfer material frames (6000) between the degumming device (1000) and the sheet feeding device (2000).

8. The wafer debonding and slitting equipment according to claim 1, characterized in that, The feed trough (2100) is provided with a loading area (Q1) and a buffer platform (2110). The loading area (Q1) is used for loading wafers (S) into the feed frame (6000), and the buffer platform (2110) is used for buffering the feed frame (6000). The wafer loading device (2000) further includes: A conveying assembly (2200), the conveying assembly (2200) including a first driving mechanism (2210), the first driving mechanism (2210) being disposed on the trough (2100) for driving the material frame (6000) to move within the feeding area (Q1); and The lifting assembly (2300) is disposed on the path of the first driving mechanism (2210) driving the material frame (6000) to move, and is used to lift the wafers (S) in the material frame (6000) one by one.

9. The wafer debonding and slitting equipment according to claim 8, characterized in that, The lifting assembly (2300) includes: The first lifting member (2310) has a lifting surface. The lifting surface extends from below the loading area (Q1) and enters the loading area (Q1) at an angle to form a height difference. The lifting surface has a degree of freedom of movement and is used to lift the wafer (S) in the material frame (6000). An adsorption mechanism (2320) is disposed above the first lifting member (2310) and is used to adsorb the wafer (S) lifted by the first lifting member (2310); The second lifting member (2330) is disposed on the adsorption mechanism (2320) and is used to continue to lift the wafer (S) adsorbed by the adsorption mechanism (2320).

10. The wafer debonding and slitting equipment according to claim 9, characterized in that, The first lifting member (2310) is a wheel (2310a). The outer periphery of the wheel (2310a) has the lifting surface. The wheel (2310a) has rotational freedom to lift the wafer (S). The outer periphery of the wheel (2310a) is made of elastic material. The outer periphery of the wheel (2310a) is provided with a plurality of partition grooves (2311). The plurality of partition grooves (2311) are used to switch positions as the first lifting member (2310) rotates to receive wafers (S) one by one.

Images