High-yield and high-brightness LED packaging device and light-emitting module

Abstract

The invention provides a high-yield and high-brightness LED packaging device and a light emitting module, the LED packaging device comprises a carrier plate, a flip LED chip, a transparent bonding layer, a glass fluorescent sheet and a light reflecting layer, the flip LED chip is arranged on the carrier plate, and the flip LED chip is provided with a main light emitting surface; the transparent bonding layer is arranged on the main light emitting surface; the glass fluorescent sheet is arranged on the transparent bonding layer; the light reflection layer is arranged on the carrier plate and surrounds the flip LED chip, the transparent bonding layer and the glass fluorescent sheet, the glass fluorescent sheet comprises a light incident surface and a light emergent surface which are oppositely arranged, the light incident surface is in contact with the transparent bonding layer, the light emergent surface is located on the side, away from the transparent bonding layer, of the light incident surface, and the light emergent surface is located on the side, away from the transparent bonding layer, of the light emergent surface. And the areas of the light emergent surface, the light incident surface and the main light emergent surface are sequentially reduced. The LED packaging device and the light-emitting module provided by the invention have the technical advantages of high yield and high brightness.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, specifically to a high-yield, high-brightness LED packaging device and light-emitting module. Background Technology

[0002] A light-emitting diode (LED) is an electroluminescent semiconductor light-emitting device. Due to its advantages such as low power consumption, small size, long life, good stability, fast response, and stable emission wavelength, it is now widely used in lighting, display, medical, and optical communication fields.

[0003] Taking the automotive industry as an example, the rise of new energy vehicles in recent years has driven the booming development of the automotive LED market. However, due to the special nature of automotive applications, national standards have clear requirements for the maximum brightness and reliability of LED packaging devices for headlights. To meet these requirements, major international manufacturers typically use vertical LED chips with higher current stability to satisfy both brightness and reliability requirements. However, domestic LED manufacturers face numerous technical barriers when using vertical LED chips. Therefore, there is an urgent need for an LED packaging device that can still meet high brightness requirements without using vertical LED chips. Summary of the Invention

[0004] This application provides a high-yield, high-brightness LED packaging device and light-emitting module, which can effectively solve the problem that LED packaging devices in related technologies cannot meet the high brightness requirements without using vertical LED chips.

[0005] In a first aspect, this application provides a high-brightness LED packaging device, the LED packaging device comprising: Carrier plate; A flip-chip LED is disposed on the carrier plate, and the flip-chip LED has a main light-emitting surface; A transparent adhesive layer is disposed on the main light-emitting surface; A glass fluorescent sheet is disposed on the transparent adhesive layer; A light-reflecting layer is disposed on the carrier plate and surrounds the flip-chip LED, the transparent adhesive layer, and the glass phosphor sheet; The glass phosphor sheet includes a light incident surface and a light emitting surface arranged opposite to each other. The light incident surface is in contact with the transparent adhesive layer, and the light emitting surface is located on the side of the light incident surface away from the transparent adhesive layer. The area of ​​the light emitting surface, the area of ​​the light incident surface, and the area of ​​the main light emitting surface decrease in sequence.

[0006] Optionally, the area of ​​the main light-emitting surface is two to three times the area of ​​the light-emitting surface, wherein the thickness of the glass phosphor is less than or equal to the thickness of the flip-chip LED, and the area of ​​the light-incident surface is 1.4 to 1.6 times the area of ​​the light-emitting surface.

[0007] Optionally, the transparent adhesive layer includes a first adhesive surface and a second adhesive surface, wherein the first adhesive surface is in contact with the main light-emitting surface, and the second adhesive surface is in contact with the light-incident surface, wherein the area of ​​the first adhesive surface and the main light-emitting surface are the same, and the area of ​​the second adhesive surface is larger than the area of ​​the light-incident surface.

[0008] Optionally, the transparent adhesive layer contains scattering particles.

[0009] Optionally, the transparent adhesive layer includes a first part and a second part, wherein the orthographic projection of the first part on the main light-emitting surface does not overlap with the orthographic projection of the glass phosphor on the main light-emitting surface, and the orthographic projection of the second part on the main light-emitting surface coincides with the orthographic projection of the glass phosphor on the main light-emitting surface, wherein the scattering particles are disposed in both the first part and the second part.

[0010] Optionally, the transparent adhesive layer includes a first part and a second part, wherein the orthographic projection of the first part on the main light-emitting surface does not overlap with the orthographic projection of the glass phosphor on the main light-emitting surface, and the orthographic projection of the second part on the main light-emitting surface coincides with the orthographic projection of the glass phosphor on the main light-emitting surface, wherein the scattering particles are provided only in the first part.

[0011] Optionally, the transparent adhesive layer includes a first adhesive surface and a second adhesive surface, wherein the first adhesive surface is in contact with the main light-emitting surface, and the second adhesive surface is in contact with the light-incident surface, wherein the area of ​​the first adhesive surface is the same as that of the main light-emitting surface, and the area of ​​the second adhesive surface is the same as that of the light-incident surface.

[0012] Optionally, the sidewall of the glass phosphor sheet connects the light incident surface and the light emitting surface, wherein the sidewall of the glass phosphor sheet is an inclined surface.

[0013] Optionally, the sidewall of the glass phosphor sheet connects the light incident surface and the light emitting surface, wherein the sidewall of the glass phosphor sheet is an arc surface.

[0014] Secondly, this application provides a light-emitting module, the light-emitting module including at least one LED packaging device as described in any one of the above.

[0015] This application provides a high-yield, high-brightness LED packaging device and light-emitting module. The LED packaging device includes a carrier board, a flip-chip LED, a transparent adhesive layer, a glass phosphor, and a light-reflecting layer. The flip-chip LED is disposed on the carrier board and has a main light-emitting surface. The transparent adhesive layer is disposed on the main light-emitting surface. The glass phosphor is disposed on the transparent adhesive layer. The light-reflecting layer is disposed on the carrier board and surrounds the flip-chip LED, the transparent adhesive layer, and the glass phosphor. The glass phosphor includes a light-incident surface and a light-emitting surface disposed opposite to each other. The light-incident surface is in contact with the transparent adhesive layer, and the light-emitting surface is located on the side of the light-incident surface away from the transparent adhesive layer. The areas of the light-emitting surface, the light-incident surface, and the main light-emitting surface decrease sequentially. The LED packaging device and light-emitting module provided by this application have the technical advantages of high yield and high brightness. Attached Figure Description

[0016] The technical solution and other beneficial effects of this application will become apparent from the following detailed description of specific embodiments in conjunction with the accompanying drawings.

[0017] Figure 1 This is a cross-sectional schematic diagram of a first type of LED packaging device provided in some embodiments of this application.

[0018] Figure 2 This is a cross-sectional schematic diagram of a second type of LED packaging device provided in some embodiments of this application.

[0019] Figure 3 This is a cross-sectional schematic diagram of a third type of LED packaging device provided in some embodiments of this application.

[0020] Figure 4 This is a cross-sectional schematic diagram of a fourth type of LED packaging device provided in some embodiments of this application.

[0021] Figure 5 This is a cross-sectional schematic diagram of a fifth type of LED packaging device provided in some embodiments of this application.

[0022] Figure 6 This is a cross-sectional schematic diagram of a sixth type of LED packaging device provided in some embodiments of this application.

[0023] Figure 7 This is a cross-sectional schematic diagram of a seventh type of LED packaging device provided in some embodiments of this application.

[0024] Explanation of reference numerals in the attached figures: Carrier 10; Flip-chip LED 20; Main light-emitting surface 21; Transparent adhesive layer 30; First adhesive surface 31; Second adhesive surface 32; Scattering particles 33; First part 301; Second part 302; Glass phosphor sheet 40; Light incident surface 41; Light emitting surface 42; Sidewall of glass phosphor sheet 43; Light reflecting layer 50. Detailed Implementation

[0025] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0026] The terms "first" and "second" used herein are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the stated features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0027] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0028] The following disclosure provides many different implementations or examples for carrying out different structures of this application. To simplify the disclosure, specific examples of components and arrangements are described below. Of course, these are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or reference letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various implementations and / or arrangements discussed.

[0029] Reference Figures 1 to 7As shown, in a first aspect, this application provides a high-brightness LED packaging device, the LED packaging device including a carrier 10, a flip-chip LED 20, a transparent adhesive layer 30, a glass phosphor 40, and a light-reflecting layer 50. The flip-chip LED 20 is disposed on the carrier 10, and the flip-chip LED 20 has a main light-emitting surface 21; the transparent adhesive layer 30 is disposed on the main light-emitting surface 21; the glass phosphor 40 is disposed on the transparent adhesive layer 30; and the light-reflecting layer 50... The light source is disposed on the carrier plate 10 and surrounds the flip-chip LED 20, the transparent adhesive layer 30, and the glass phosphor 40. The glass phosphor 40 includes a light incident surface 41 and a light emitting surface 42 disposed opposite to each other. The light incident surface 41 is in contact with the transparent adhesive layer 30, and the light emitting surface 42 is located on the side of the light incident surface 41 away from the transparent adhesive layer 30. The area of ​​the light emitting surface 42, the area of ​​the light incident surface 41, and the area of ​​the main light emitting surface 21 decrease in sequence.

[0030] In the high-brightness LED packaging device provided in this application embodiment, a larger luminous flux can be obtained by using a flip-chip 20 with a larger main light-emitting surface 21. By utilizing the characteristic that the area of ​​the light emitting surface 42 of the glass phosphor 40 is smaller than the area of ​​the light incident surface 41, light can be focused, the luminous intensity can be improved, and thus the LED packaging device can have higher brightness.

[0031] Furthermore, since the areas of the light emitting surface 42, the light incident surface 41, and the main light emitting surface 21 decrease sequentially, when the size of the main light emitting surface 21 of the flip-chip 20, which directly affects the total amount of light, and the size of the light emitting surface 42 of the glass phosphor sheet 40, which directly affects the brightness of the LED packaged device, are fixed, the area difference between the light incident surface 41 and the light emitting surface 42 can be effectively reduced by decreasing the size of the light incident surface 41 of the glass phosphor sheet 40. This reduces the difference in side length between the light incident surface 41 and the light emitting surface 42, thereby reducing the inclination of the sidewall 43 of the glass phosphor sheet 40 connecting the light incident surface 41 and the light emitting surface 42 relative to the normal of the light incident surface 41. This reduces the risk of cracks in the sidewall 43, thereby reducing the requirements for the manufacturing process of the glass phosphor sheet 40, lowering the manufacturing cost, and improving the yield of the LED packaged device.

[0032] In some embodiments of this application, the area of ​​the main light-emitting surface 21 is two to three times the area of ​​the light-emitting surface 42, wherein the thickness of the glass phosphor sheet 40 is less than or equal to the thickness of the flip-chip LED chip 20, and the area of ​​the light-incident surface 41 is 1.4 to 1.6 times the area of ​​the light-emitting surface 42.

[0033] In the high-brightness LED packaging device provided in this application embodiment, in order to obtain a greater luminous flux, the area of ​​the main light-emitting surface 21 is two to three times the area of ​​the light-emitting surface 42. Furthermore, the applicant has discovered that, since the thickness of the glass phosphor 40 is less than the thickness of the flip-chip LED 20, if the area difference between the light-incident surface 41 and the light-emitting surface 42 of the glass phosphor 40 is too large when the glass phosphor 40 thickness is small, the sidewall 43 of the glass phosphor 40 will be more prone to cracking. Therefore, this application controls the area of ​​the light-incident surface 41 by making its area 1.4 to 1.6 times that of the light-emitting surface 42, thereby reducing the area difference between the light-incident surface 41 and the light-emitting surface 42 and improving the yield and stability of the glass phosphor 40.

[0034] In some embodiments of this application, the ratio of the thickness of the glass phosphor 40 to the thickness of the flip-chip LED 20 is 0.8 to 1.

[0035] In some embodiments of this application, the carrier plate 10 is a ceramic carrier plate to improve the thermal conductivity of the carrier plate 10, thereby improving the reliability of the LED packaging device.

[0036] In some embodiments of this application, the flip-chip LED 20 is fixedly connected to the carrier board 10. Exemplarily, the flip-chip LED 20 can be fixed to the carrier board 10 by eutectic bonding.

[0037] In some embodiments of this application, the orthographic projection of the flip-chip 20 on the carrier 10 is rectangular. The flip-chip 20 also includes a back light-emitting surface disposed opposite to the main light-emitting surface 21. The area of ​​the back light-emitting surface can be the same as the area of ​​the main light-emitting surface 21. The flip-chip 20 also includes a side light-emitting surface connecting the main light-emitting surface 21 and the back light-emitting surface. The side light-emitting surface is in contact with the light-reflecting layer 50.

[0038] In some embodiments of this application, the transparent adhesive layer 30 includes a substrate, which may be made of transparent silicone.

[0039] In some embodiments of this application, the glass phosphor sheet 40 may be formed by mixing phosphor and glass powder and then sintering at high temperature.

[0040] In some embodiments of this application, the phosphor may comprise one or more phosphor powders selected from the group consisting of yttrium aluminum garnet, argonium aluminum garnet, nitrides, sulfides, and silicates.

[0041] In some embodiments of this application, the average particle size of the phosphor is between 20 micrometers and 40 micrometers. Since the average particle size of the phosphor is greater than 20 micrometers, and the thickness ratio of the glass phosphor sheet 40 to the flip-chip LED chip 20 is 0.8 to 1, it is essential to control the risk of cracking in the sidewall 43 of the glass phosphor sheet 40.

[0042] In some embodiments of this application, the light-reflecting layer 50 includes a substrate and reflective particles. The substrate may be transparent silicone, and the reflective particles may be titanium dioxide or other reflective particles.

[0043] Reference Figures 1 to 5 As shown, in some embodiments of this application, the transparent adhesive layer 30 includes a first adhesive surface 31 and a second adhesive surface 32. The first adhesive surface 31 is in contact with the main light-emitting surface 21, and the second adhesive surface 32 is in contact with the light-incident surface 41. The areas of the first adhesive surface 31 and the main light-emitting surface 21 are the same, and the area of ​​the second adhesive surface 32 is larger than the area of ​​the light-incident surface 41.

[0044] In the high-brightness LED packaging device provided in this application embodiment, the first bonding surface 31 of the transparent bonding layer 30 contacts the main light-emitting surface 21 of the flip-chip LED 20, so that the transparent bonding layer 30 and the flip-chip LED 20 remain relatively fixed; the second bonding surface 32 of the transparent bonding layer 30 contacts the light-incident surface 41 of the glass phosphor 40, so that the transparent bonding layer 30 and the glass phosphor 40 remain relatively fixed. Based on this, the area of ​​the first bonding surface 31 is the same as that of the main light-emitting surface 21, and the area of ​​the second bonding surface 32 is larger than that of the light-incident surface 41. That is, the transparent bonding layer 30 can completely cover the flip-chip LED 20, but the glass phosphor 40 cannot completely cover the transparent bonding layer 30. This results in the second bonding surface 32 of the transparent bonding layer 30 directly contacting the light-reflecting layer 50, thereby improving the bonding stability between the various structures in the LED packaging device, appropriately simplifying the fabrication process of the transparent bonding layer 30, and reducing manufacturing costs.

[0045] Reference Figures 2 to 5 In some embodiments of this application, the transparent adhesive layer 30 is provided with scattering particles 33.

[0046] In the high-brightness LED packaging device provided in this application embodiment, in order to allow more light emitted from the flip-chip 20 to enter the glass phosphor sheet 40, scattering particles 33 are provided in the transparent adhesive layer 30.

[0047] Reference Figure 2 and Figure 3 In some embodiments of this application, the transparent adhesive layer 30 includes a first portion 301 and a second portion 302. The orthographic projection of the first portion 301 on the main light-emitting surface 21 does not overlap with the orthographic projection of the glass phosphor sheet 40 on the main light-emitting surface 21. The orthographic projection of the second portion 302 on the main light-emitting surface 21 coincides with the orthographic projection of the glass phosphor sheet 40 on the main light-emitting surface 21. The scattering particles 33 are disposed in both the first portion 301 and the second portion 302.

[0048] In the high-brightness LED packaging device provided in this application embodiment, since the scattering particles 33 are provided in both the first part 301 and the second part 302, the light extraction efficiency can be appropriately improved, allowing more light emitted from the flip-chip 20 to enter the glass phosphor sheet 40, thereby improving the brightness of the LED packaging device. More importantly, it can also effectively reduce the difficulty of preparing the transparent adhesive layer 30. The preparation process of the transparent adhesive layer 30 can be to directly mix the substrate of the transparent adhesive layer 30 and the scattering particles 33 to form a film, which greatly reduces the production cost.

[0049] Reference Figure 4 and Figure 5 In some embodiments of this application, the transparent adhesive layer 30 includes a first portion 301 and a second portion 302. The orthographic projection of the first portion 301 on the main light-emitting surface 21 does not overlap with the orthographic projection of the glass phosphor sheet 40 on the main light-emitting surface 21. The orthographic projection of the second portion 302 on the main light-emitting surface 21 coincides with the orthographic projection of the glass phosphor sheet 40 on the main light-emitting surface 21. The scattering particles 33 are provided only in the first portion 301.

[0050] In the high-brightness LED packaging device provided in this application embodiment, since the scattering particles 33 are only disposed in the first part 301, the light extraction efficiency can be greatly improved, allowing more light emitted from the flip-chip 20 to enter the glass phosphor 40, thereby improving the brightness of the LED packaging device.

[0051] In some embodiments of this application, the film formation times of the first portion 301 and the second portion 302 may be different.

[0052] Reference Figures 6 to 7In some embodiments of this application, the transparent adhesive layer 30 includes a first adhesive surface 31 and a second adhesive surface 32. The first adhesive surface 31 is in contact with the main light-emitting surface 21, and the second adhesive surface 32 is in contact with the light-incident surface 41. The first adhesive surface 31 and the main light-emitting surface 21 have the same area, and the second adhesive surface 32 and the light-incident surface 41 have the same area.

[0053] In the high-brightness LED packaging device provided in this application embodiment, the first bonding surface 31 of the transparent bonding layer 30 contacts the main light-emitting surface 21 of the flip-chip LED 20, so that the transparent bonding layer 30 and the flip-chip LED 20 remain relatively fixed; the second bonding surface 32 of the transparent bonding layer 30 contacts the light-incident surface 41 of the glass phosphor 40, so that the transparent bonding layer 30 and the glass phosphor 40 remain relatively fixed. Based on this, the area of ​​the first bonding surface 31 is the same as that of the main light-emitting surface 21, and the area of ​​the second bonding surface 32 is the same as that of the light-incident surface 41. That is, the transparent bonding layer 30 can completely cover the flip-chip LED 20, the glass phosphor 40 can completely cover the transparent bonding layer 30, and the area of ​​the second bonding surface 32 is smaller than the area of ​​the first bonding surface 31. Correspondingly, since the area of ​​the second bonding surface 32 is smaller than that of the first bonding surface 31, the transparent bonding layer 30 can be used to form a light-collecting structure, which helps to allow the emitted light from the flip-chip LED chip 20 to be incident into the glass phosphor sheet 40 with higher efficiency.

[0054] Reference Figure 2 , Figure 4 , Figure 6 The sidewall 43 of the glass phosphor sheet 40 connects the light incident surface 41 and the light emitting surface 42, wherein the sidewall 43 of the glass phosphor sheet 40 is an inclined surface.

[0055] Reference Figure 1 , Figure 3 , Figure 5 , Figure 7 The sidewall 43 of the glass phosphor sheet 40 connects the light incident surface 41 and the light emitting surface 42, wherein the sidewall 43 of the glass phosphor sheet 40 is an arc surface.

[0056] Reference Figures 1 to 7 In some embodiments of this application, the edge of the light-reflecting layer 50 is flush with the edge of the carrier plate 10, and the surface of the light-reflecting layer 50 on the side away from the carrier plate 10 is flush with the light-emitting surface 42 of the glass phosphor sheet 40.

[0057] Secondly, some embodiments of this application provide a light-emitting module, the light-emitting module including at least one LED packaging device as described in any one of the above.

[0058] In some embodiments of this application, the light-emitting module may be a vehicle headlight, a lamp board used in a display device, or the like.

[0059] In summary, this application provides a high-yield, high-brightness LED packaging device and light-emitting module. The LED packaging device includes a carrier board, a flip-chip LED, a transparent adhesive layer, a glass phosphor, and a light-reflecting layer. The flip-chip LED is disposed on the carrier board and has a main light-emitting surface. The transparent adhesive layer is disposed on the main light-emitting surface. The glass phosphor is disposed on the transparent adhesive layer. The light-reflecting layer is disposed on the carrier board and surrounds the flip-chip LED, the transparent adhesive layer, and the glass phosphor. The glass phosphor includes a light-incident surface and a light-emitting surface disposed opposite to each other. The light-incident surface is in contact with the transparent adhesive layer, and the light-emitting surface is located on the side of the light-incident surface away from the transparent adhesive layer. The areas of the light-emitting surface, the light-incident surface, and the main light-emitting surface decrease sequentially. The LED packaging device and light-emitting module provided by this application have the technical advantages of high yield and high brightness.

[0060] The above provides a detailed description of a high-brightness LED packaging device provided in the embodiments of this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. An LED packaging device, characterized in that, The LED packaging device includes: Carrier plate; A flip-chip LED is disposed on the carrier plate, and the flip-chip LED has a main light-emitting surface; A transparent adhesive layer is disposed on the main light-emitting surface; A glass fluorescent sheet is disposed on the transparent adhesive layer; A light-reflecting layer is disposed on the carrier plate and surrounds the flip-chip LED, the transparent adhesive layer, and the glass phosphor sheet; The glass phosphor sheet includes a light incident surface and a light emitting surface arranged opposite to each other. The light incident surface is in contact with the transparent adhesive layer, and the light emitting surface is located on the side of the light incident surface away from the transparent adhesive layer. The area of ​​the light emitting surface, the area of ​​the light incident surface, and the area of ​​the main light emitting surface decrease in sequence.

2. The LED packaging device according to claim 1, characterized in that, The area of ​​the main light-emitting surface is two to three times the area of ​​the light-emitting surface, wherein the thickness of the glass phosphor is less than or equal to the thickness of the flip-chip LED, and the area of ​​the light-incident surface is 1.4 to 1.6 times the area of ​​the light-emitting surface.

3. The LED packaging device according to claim 2, characterized in that, The transparent adhesive layer includes a first adhesive surface and a second adhesive surface. The first adhesive surface is in contact with the main light-emitting surface, and the second adhesive surface is in contact with the light-incident surface. The areas of the first adhesive surface and the main light-emitting surface are the same, and the area of ​​the second adhesive surface is larger than the area of ​​the light-incident surface.

4. The LED packaging device according to claim 3, characterized in that, The transparent adhesive layer contains scattering particles.

5. The LED packaging device according to claim 4, characterized in that, The transparent adhesive layer includes a first part and a second part. The orthographic projection of the first part on the main light-emitting surface does not overlap with the orthographic projection of the glass phosphor on the main light-emitting surface. The orthographic projection of the second part on the main light-emitting surface coincides with the orthographic projection of the glass phosphor on the main light-emitting surface. The scattering particles are disposed in both the first part and the second part.

6. The LED packaging device according to claim 4, characterized in that, The transparent adhesive layer includes a first part and a second part. The orthographic projection of the first part on the main light-emitting surface does not overlap with the orthographic projection of the glass phosphor on the main light-emitting surface. The orthographic projection of the second part on the main light-emitting surface coincides with the orthographic projection of the glass phosphor on the main light-emitting surface. The scattering particles are provided only in the first part.

7. The LED packaging device according to claim 2, characterized in that, The transparent adhesive layer includes a first adhesive surface and a second adhesive surface. The first adhesive surface is in contact with the main light-emitting surface, and the second adhesive surface is in contact with the light-incident surface. The areas of the first adhesive surface and the main light-emitting surface are the same, and the areas of the second adhesive surface and the light-incident surface are the same.

8. The LED packaging device according to claim 1, characterized in that, The sidewall of the glass phosphor sheet connects the light incident surface and the light emitting surface, wherein the sidewall of the glass phosphor sheet is an inclined surface.

9. The LED packaging device according to claim 1, characterized in that, The sidewall of the glass phosphor sheet connects the light incident surface and the light emitting surface, wherein the sidewall of the glass phosphor sheet is an arc surface.

10. A light-emitting module, characterized in that, The light-emitting module includes at least one LED packaging device as described in any one of claims 1 to 9.

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