Temperature monitoring device, method and system for switch cabinet

Abstract

The invention discloses a temperature monitoring device, method and system for a switch cabinet, relates to the technical field of power equipment monitoring, and solves the problems that the temperature of each control switch cannot be accurately monitored and a temperature overheat point and an overheat reason cannot be accurately and timely positioned in the existing switch cabinet temperature monitoring. According to the technical scheme, the system is characterized in that the system comprises a temperature analysis main device, a plurality of temperature analysis sub-devices and a plurality of temperature monitoring devices, the temperature analysis main device is in communication connection with the temperature analysis sub-devices, each temperature analysis sub-device monitors one switch cabinet through one temperature monitoring device, each temperature monitoring device comprises a plurality of fiber bragg gratings, and the fiber bragg gratings are connected with the temperature monitoring devices. Each fiber bragg grating monitors the temperature of one control switch in one switch cabinet; through the cooperation of the temperature analysis main device, the plurality of temperature analysis sub-devices and the plurality of temperature monitoring devices, the temperature of each control switch can be accurately monitored, and furthermore, a temperature overheat point and an overheat reason can be accurately and timely positioned in cooperation with a monitoring method.

Description

A temperature monitoring device, method and system for switchgear Technical Field

[0001] This invention relates to the field of power equipment monitoring technology, and more specifically, to a temperature monitoring device, method, and system for switchgear. Background Technology

[0002] A 10kV switchgear is a key piece of equipment in a power distribution system, typically used to introduce power from transmission lines into the power supply system, or to branch and control power within the distribution system. The primary function of a 10kV switchgear in a power system is to distribute, control, and protect power. It is indispensable for ensuring a safe and stable power supply in a power system. During operation, the electrical equipment and components of a 10kV switchgear may be affected by factors such as current load and ambient temperature, leading to heat generation. Excessive temperature can affect the performance and safety of the equipment; failure to accurately monitor the temperature of the electrical equipment inside the switchgear could even lead to dangerous situations such as fires.

[0003] Currently, when monitoring the temperature of switchgear, it is usually based on a single sensor to detect the temperature of the entire switchgear. This makes it impossible to accurately monitor the temperature of each control switch, thus making it impossible to accurately and promptly locate hot spots and the causes of overheating.

[0004] Therefore, this application provides a temperature monitoring device, method, and system for switchgear to solve the above-mentioned problems. Summary of the Invention

[0005] The purpose of this application is to provide a temperature monitoring device, method, and system for switchgear, which solves the problem that existing switchgear temperature monitoring relies on a single sensor to detect the temperature of the entire switchgear, making it impossible to accurately monitor the temperature of each control switch and to accurately and promptly locate hot spots and causes of overheating. This application uses a main temperature analysis device, multiple temperature analysis sub-devices, and multiple temperature monitoring devices in cooperation to accurately monitor the temperature of each control switch.

[0006] In a first aspect, this application provides a temperature monitoring device for a switchgear, comprising: a main temperature analysis device, multiple sub-temperature analysis devices, and multiple temperature monitoring devices. The main temperature analysis device is communicatively connected to the multiple sub-temperature analysis devices. Each sub-temperature analysis device monitors a switchgear through a temperature monitoring device. Each temperature monitoring device includes multiple fiber Bragg gratings, and each fiber Bragg grating monitors the temperature of a control switch in a switchgear.

[0007] By employing the above technical solution, through the cooperation of a main temperature analysis device, multiple temperature analysis sub-devices, and multiple temperature monitoring devices, the temperature of each control switch can be accurately monitored. Furthermore, the monitoring method can be used to accurately and promptly locate hot spots and causes of overheating.

[0008] In one possible implementation, the temperature monitoring device includes: a light source, an isolator, a coupler, multiple fiber Bragg gratings, and a demodulator. The light source is connected to the isolator, the isolator is connected to the coupler, the coupler is connected to the multiple fiber Bragg gratings, and the coupler is also connected to the demodulator.

[0009] A second aspect of this application provides a temperature monitoring method for a switchgear, executed on a temperature monitoring device as described above, comprising: a temperature analysis sub-device acquiring temperature measurement results of control switches through the temperature monitoring device; if the temperature measurement results of multiple control switches exceed the limit, analyzing the switch type and number of overheated control switches; determining the cause of overheating of the overheated control switches based on the switch type and number of switches, and sending it to the temperature analysis master device; the temperature analysis master device determining whether the temperature detection results of each control switch need to be verified based on the cause of overheating of multiple overheated control switches; if verification is required, verifying the temperature detection results of the current overheated control switches to obtain a verification result indicating the final cause of overheating, and sending the verification result to the temperature analysis sub-device; and the temperature analysis sub-device outputting a prompt message based on the verification result.

[0010] By adopting the above technical solution, the temperature of each control switch in each switch cabinet is monitored, and when judging the cause of overheating of the control switch, it is verified by the main temperature analysis device. In this way, the functions of temperature monitoring and overheating cause analysis of each control switch are realized, improving the accuracy of temperature monitoring of control switches in switch cabinet and the accuracy of judging the cause of switch overheating, thereby enhancing the security of power supply network.

[0011] In one possible implementation, the temperature analysis sub-device acquires the temperature measurement results of the control switch through a temperature monitoring device; including: acquiring the light intensity signal from the fiber Bragg grating; acquiring the real-time current value of the fiber Bragg grating based on the light intensity information; determining the center wavelength of the fiber Bragg grating based on the real-time current value, the slope coefficient of the slant filter in the temperature detection device, the calibration current of the fiber Bragg grating, and the calibration wavelength; and determining the temperature measurement results of the control switch monitored by the fiber Bragg grating based on the center wavelength.

[0012] In one possible implementation, the cause of overheating of the overheating control switch is determined based on the switch type and the number of switches; this includes: when the current overheating control switch is a branch switch, determining whether there is a main switch among all overheating control switches; if there is a main switch, determining whether the number of all overheating control switches is greater than a preset number; if it is greater than the preset number, determining that the cause of overheating of the current overheating control switch is a switch cabinet heat dissipation failure; if it is not greater than the preset number, determining the number of other branch overheating control switches whose distance from the current overheating control switch is less than a threshold; if the number is less than a preset value, determining that the cause of overheating of the current overheating control switch is an overload of the current target control switch; if the number is not less than the preset value, determining that the cause of overheating of the current overheating control switch is a switch cabinet heat dissipation failure.

[0013] In one possible implementation, the temperature analysis master device determines whether the temperature detection results of each control switch need to be verified based on the overheating causes of multiple overheat control switches; including: acquiring the downstream power supply network controlled by the current overheat control switch; determining whether there is an overheat control switch controlling the downstream power supply network among all overheat control switches; if so, determining whether the overheating cause of the overheat control switch controlling the downstream power supply network matches that of the current overheat control switch; if they do not match, then the temperature detection result of the current overheat control switch is considered to need to be verified.

[0014] A third aspect of this application also provides a temperature monitoring system for a switchgear, comprising: a temperature analysis submodule, used to acquire temperature measurement results of control switches through a temperature monitoring device; if the temperature measurement results of multiple control switches exceed the limit, analyze the switch type and number of overheated control switches; determine the cause of overheating of the overheated control switches based on the switch type and number of switches, and send it to the temperature analysis main module; the temperature analysis main module is used to determine whether the temperature detection results of each control switch need to be verified based on the cause of overheating of multiple overheated control switches; if verification is required, verify the temperature detection results of the current overheated control switch, obtain a verification result indicating the final cause of overheating, and send the verification result to the temperature analysis submodule; the temperature analysis submodule is also used to output prompt information based on the verification result.

[0015] In one possible implementation, the temperature analysis submodule acquires the temperature measurement results of the control switch through a temperature monitoring device; specifically, this includes: acquiring the light intensity signal from the fiber Bragg grating; acquiring the real-time current value of the fiber Bragg grating based on the light intensity information; determining the center wavelength of the fiber Bragg grating based on the real-time current value, the slope coefficient of the slant filter in the temperature detection device, the calibration current of the fiber Bragg grating, and the calibration wavelength; and determining the temperature measurement results of the control switch monitored by the fiber Bragg grating based on the center wavelength.

[0016] In one possible implementation, the temperature analysis submodule determines the cause of overheating of the overheating control switch based on the switch type and number of switches. Specifically, this includes: when the current overheating control switch is a branch switch, determining whether a main switch exists among all overheating control switches; if a main switch exists, determining whether the total number of all overheating control switches is greater than a preset number; if it is greater than the preset number, determining that the cause of overheating of the current overheating control switch is a switch cabinet heat dissipation failure; if it is not greater than the preset number, determining the number of other branch overheating control switches whose distance from the current overheating control switch is less than a threshold; if the number is less than a preset value, determining that the cause of overheating of the current overheating control switch is an overload of the current target control switch; if the number is not less than the preset value, determining that the cause of overheating of the current overheating control switch is a switch cabinet heat dissipation failure.

[0017] In one possible implementation, the temperature analysis main module determines whether the temperature detection results of each control switch need to be verified based on the overheating causes of multiple overheat control switches. Specifically, this includes: obtaining the downstream power supply network controlled by the current overheat control switch; determining whether there is an overheat control switch controlling the downstream power supply network among all overheat control switches; if so, determining whether the overheating cause of the overheat control switch controlling the downstream power supply network matches that of the current overheat control switch; if they do not match, then the temperature detection result of the current overheat control switch is considered to need to be verified.

[0018] Compared with existing technologies, this application has the following advantages: First, by comprehensively analyzing whether the overheating switch is a main switch or a branch switch, the number of switches experiencing overheating, and the distance between the overheating switches, the cause of overheating of the current target control switch can be determined. Compared with existing solutions that only determine whether the switch cabinet is overheating based on the overall temperature of the switch cabinet, this solution can monitor the temperature of each control switch precisely. Furthermore, by analyzing the overheating causes of overheating switches from multiple dimensions, misjudgments of overheating causes due to lack of dimensional information can be reduced, improving the accuracy of the analysis of the overheating causes of the current overheating control switch. Second, after the temperature control master device obtains the overheating cause of each overheating switch, it verifies switches with mismatched overheating causes, which can reduce the possibility of misjudging the overheating causes of switches. Simultaneously, the temperature control master device does not need to verify all obtained overheating causes of switches; instead, it first determines whether the overheating causes match. If they do not match, it verifies the overheating causes of switches with mismatched overheating causes, saving computational resources for the temperature analysis master device. Attached Figure Description

[0019] The accompanying drawings, which are included to provide a further understanding of embodiments of the invention and form part of this application, do not constitute a limitation thereof. In the drawings:

[0020] Figure 1 is a structural diagram of the temperature monitoring device for the switchgear;

[0021] Figure 2 is a structural diagram of the temperature detection device;

[0022] Figure 3 is a flowchart of the temperature monitoring method for switchgear;

[0023] Figure 4 is a structural diagram of the temperature monitoring system for the switchgear. Detailed Implementation

[0024] In the following, the terms “comprising” or “may include” as used in the various embodiments of this application indicate the presence of the claimed function, operation, or element, and do not limit the addition of one or more functions, operations, or elements. Furthermore, as used in the various embodiments of this application, the terms “comprising,” “having,” and their cognates are intended only to indicate a specific feature, number, step, operation, element, component, or combination of the foregoing, and should not be construed as primarily excluding the presence of one or more other features, numbers, steps, operations, elements, components, or combinations of the foregoing, or the possibility of adding one or more combinations of the foregoing.

[0025] In various embodiments of this application, the expression "or" or "at least one of B and / or C" includes any combination or all combinations of the words listed simultaneously. For example, the expression "B or C" or "at least one of B and / or C" may include B, may include C, or may include both B and C.

[0026] It should be noted that if a description refers to "connecting" a component to another component or "connecting" it to another component, then the first component can be directly connected to the second component, and a third component can be "connected" between the first and second components. Conversely, when a component is "directly connected" to another component or "directly connected" to another component, it can be understood that there is no third component between the first and second components.

[0027] The terminology used in the various embodiments of this application is for the purpose of describing particular embodiments only and is not intended to limit the various embodiments of this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the various embodiments of this application pertain. Terms (such as those defined in a generally used dictionary) are to be interpreted as having the same meaning as in the context of the relevant technical field and are not to be interpreted as having an idealized or overly formal meaning, unless clearly defined in the various embodiments of this application.

[0028] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the embodiments and accompanying drawings. The illustrative embodiments and descriptions of this application are only for explaining this application and are not intended to limit this application.

[0029] Example 1

[0030] Please refer to Figure 1. This application provides a temperature monitoring device for a switch cabinet, including: a temperature analysis main device, multiple temperature analysis sub-devices, and multiple temperature monitoring devices. The temperature analysis main device is communicatively connected to the multiple temperature analysis sub-devices. Each temperature analysis sub-device monitors a switch cabinet through a temperature monitoring device. Each temperature monitoring device includes multiple fiber Bragg gratings, and each fiber Bragg grating monitors the temperature of a control switch in a switch cabinet.

[0031] Specifically, the temperature monitoring device for the switchgear is designed for monitoring the temperature of 10kV switchgear. It includes a main temperature analysis unit and multiple sub-temperature analysis units communicatively connected to this main unit. Each sub-unit monitors one 10kV switchgear unit through a specific temperature monitoring device. The 10kV switchgear includes multiple control switches, and each temperature monitoring device includes multiple fiber Bragg gratings, with each fiber Bragg grating corresponding to one control switch in the 10kV switchgear. The temperature monitoring devices acquire the temperature value of each control switch in the 10kV switchgear based on each fiber Bragg grating. The sub-units determine the cause of switch overheating based on the temperature value from their corresponding monitoring devices. The main temperature analysis unit verifies the judgment results of each sub-unit based on the overheating causes uploaded by all sub-units, obtaining the final overheating cause for each control switch. The sub-units then output a warning message based on this final overheating cause.

[0032] In one possible implementation, the temperature monitoring device includes: a light source, an isolator, a coupler, multiple fiber Bragg gratings, and a demodulator. The light source is connected to the isolator, the isolator is connected to the coupler, the coupler is connected to the multiple fiber Bragg gratings, and the coupler is also connected to the demodulator.

[0033] Specifically, as shown in Figure 2, the temperature detection device includes a light source, an isolator, a coupler, multiple fiber Bragg gratings, and a demodulator. The light emitted by the light source is incident on the multiple fiber Bragg gratings through the isolator and coupler. The coupler distributes the optical signal from the light source to multiple output channels, each of which can be connected to a fiber Bragg grating. The light reflected back from each fiber Bragg grating passes through the coupler; one path is incident on the isolator and attenuated, thus preventing the reflected light from affecting the light source. The other reflected light is incident on the demodulator for demodulation to obtain the light intensity signal.

[0034] This demodulator may include a slant-side filter, a wavelength splitter, etc. Different reflected wavelengths of light pass through the wavelength splitter and enter different fiber optic signal extractors for intensity signal extraction to obtain the corresponding current value. The current center wavelength can then be calculated using the following formula:

[0035]

[0036] Where λ0 is the current center wavelength, λ1 is the calibration wavelength, K is the slope coefficient, I1 is the real-time current value, and I2 is the calibration current. After obtaining the current center wavelength, the temperature value of the control switch corresponding to the fiber grating can be determined based on the pre-calibrated relationship between temperature and center wavelength.

[0037] It is understood that the temperature monitoring device provided in this embodiment, through the cooperation of a main temperature analysis device, multiple temperature analysis sub-devices and multiple temperature monitoring devices, can accurately monitor the temperature of each control switch. Furthermore, it can also accurately and promptly locate hot spots and causes of overheating by cooperating with monitoring methods.

[0038] Example 2

[0039] Please refer to Figure 3. This application also provides a method for monitoring the temperature of a switchgear, which is performed on the temperature monitoring device described above, and includes the following steps.

[0040] Step S1: The temperature analysis sub-device obtains the temperature measurement results of the control switch through the temperature monitoring device.

[0041] In one possible implementation, step S1 includes: S11, acquiring the light intensity signal from the fiber Bragg grating; S12, acquiring the real-time current value of the fiber Bragg grating based on the light intensity information; S14, determining the center wavelength of the fiber Bragg grating based on the real-time current value, the slope coefficient of the slant filter in the temperature detection device, the calibration current of the fiber Bragg grating, and the calibration wavelength; and S15, determining the temperature measurement result of the control switch monitored by the fiber Bragg grating based on the center wavelength.

[0042] Step S2: If the temperature measurement results of multiple control switches exceed the limit, analyze the switch type and number of the overheat control switches.

[0043] Specifically, the switch type can be a main switch used to control the on / off state of the 10KV switchgear and the downstream power supply network, or a branch switch used to control the on / off state of a branch power supply network of the 10KV switchgear and its corresponding downstream power supply network.

[0044] Step S3: Determine the cause of overheating of the overheat control switch based on the switch type and number of switches, and send the result to the temperature analysis master device.

[0045] In one possible implementation, S3 includes: S31, when the current overheat control switch is a branch switch, determining whether there is a main switch among all overheat control switches; S32, if there is a main switch, determining whether the number of all overheat control switches is greater than a preset number; S33, if it is greater than the preset number, determining that the overheating cause of the current overheat control switch is a 10KV switchgear heat dissipation failure; S34, if it is not greater than the preset number, determining the number of other branch overheat control switches whose distance from the current overheat control switch is less than a threshold; S35, if the number is less than the preset value, determining that the overheating cause of the current overheat control switch is the current target control switch overload; S36, if the number is not less than the preset value, determining that the overheating cause of the current overheat control switch is a 10KV switchgear heat dissipation failure.

[0046] Step S4: The temperature analysis main device determines whether the temperature detection results of each control switch need to be verified based on the cause of overheating of multiple overheat control switches.

[0047] For example, if, in the same switch cabinet, the cause of overheating of one overheating control switch is determined to be a heat dissipation failure, while the causes of overheating of other overheating control switches are not heat dissipation failures, then it is unreasonable to determine that the cause of overheating of the overheating control switch is a heat dissipation failure, and verification is required.

[0048] In one possible implementation, S4 includes: S41, obtaining the downstream power supply network controlled by the current overheat control switch; S42, determining whether there is an overheat control switch controlling the downstream power supply network among all overheat control switches; S43, if there is, determining whether the overheating cause of the overheat control switch controlling the downstream power supply network matches that of the current overheat control switch; S44, if they do not match, considering that the temperature detection result of the current overheat control switch needs to be verified.

[0049] Step S5: If verification is required, the temperature detection result of the current overheat control switch is verified to obtain the verification result indicating the final cause of overheating, and the verification result is sent to the temperature analysis sub-device.

[0050] Step S6: The temperature analysis sub-device outputs a prompt message based on the calibration results.

[0051] Specifically, since each temperature analysis sub-device corresponds to a 10KV switch cabinet, the final output of the prompt information is from the temperature analysis sub-device.

[0052] In addition, if the overheating of the current overheat control switch is due to a fault in the switch itself, a prompt message can be output to alert the operator of the switch malfunction. The temperature of the overheat control switch will be continuously monitored, and if the temperature exceeds the preset limit for an extended period and / or the temperature of the current overheat control switch exceeds the preset temperature value, the current overheat control switch will be disconnected. If the overheating of the current overheat control switch is due to an overload, a control message can also be output after the prompt message to disconnect the current overheat control switch.

[0053] It is understandable that the temperature monitoring method provided in this embodiment involves: First, analyzing the cause of overheating of the target control switch by comprehensively considering whether the switch exhibiting overheating is a main switch or a branch switch, the number of switches exhibiting overheating simultaneously, and the distance between the overheating switches. Compared to existing solutions that determine whether the switch cabinet is overheating based solely on the overall temperature of the switch cabinet, this solution can monitor the temperature of each individual control switch precisely. Furthermore, analyzing the cause of overheating based on multiple dimensions reduces misjudgments of overheating causes due to a lack of dimensional information, improving the accuracy of the analysis of the overheating cause of the current overheating control switch. Second, after the temperature control master device obtains the cause of overheating for each overheating switch, it verifies switches with mismatched overheating causes, reducing the possibility of misjudgments of switch overheating causes. Simultaneously, the temperature control master device does not need to verify all obtained overheating causes; instead, it first determines whether the overheating causes match. If there is a mismatch, it verifies the overheating causes of the switches with mismatched causes, saving computational resources for the temperature analysis master device.

[0054] Example 3

[0055] Please refer to Figure 4. This application also provides a temperature monitoring system for switchgear, used to implement the temperature monitoring method for switchgear as described above. The system includes: a temperature analysis submodule, used to acquire the temperature measurement results of control switches through a temperature monitoring device; if the temperature measurement results of multiple control switches exceed the limit, analyze the switch type and number of overheated control switches; determine the cause of overheating of the overheated control switches based on the switch type and number of switches, and send it to the temperature analysis main module; the temperature analysis main module is used to determine whether the temperature detection results of each control switch need to be verified based on the cause of overheating of multiple overheated control switches; if verification is required, verify the temperature detection results of the current overheated control switch, obtain a verification result indicating the final cause of overheating, and send the verification result to the temperature analysis submodule; the temperature analysis submodule is also used to output prompt information based on the verification result.

[0056] In one possible implementation, the temperature analysis submodule acquires the temperature measurement results of the control switch through a temperature monitoring device; specifically, this includes: acquiring the light intensity signal from the fiber Bragg grating; acquiring the real-time current value of the fiber Bragg grating based on the light intensity information; determining the center wavelength of the fiber Bragg grating based on the real-time current value, the slope coefficient of the slant filter in the temperature detection device, the calibration current of the fiber Bragg grating, and the calibration wavelength; and determining the temperature measurement results of the control switch monitored by the fiber Bragg grating based on the center wavelength.

[0057] In one possible implementation, the temperature analysis submodule determines the cause of overheating of the overheating control switch based on the switch type and number of switches. Specifically, this includes: when the current overheating control switch is a branch switch, determining whether a main switch exists among all overheating control switches; if a main switch exists, determining whether the total number of all overheating control switches is greater than a preset number; if it is greater than the preset number, determining that the cause of overheating of the current overheating control switch is a switch cabinet heat dissipation failure; if it is not greater than the preset number, determining the number of other branch overheating control switches whose distance from the current overheating control switch is less than a threshold; if the number is less than a preset value, determining that the cause of overheating of the current overheating control switch is an overload of the current target control switch; if the number is not less than the preset value, determining that the cause of overheating of the current overheating control switch is a switch cabinet heat dissipation failure.

[0058] In one possible implementation, the temperature analysis main module determines whether the temperature detection results of each control switch need to be verified based on the cause of overheating of multiple overheat control switches; specifically, it includes: S51, obtaining the downstream power supply network controlled by the current overheat control switch; S52, determining whether there is an overheat control switch controlling the downstream power supply network among all overheat control switches;

[0059] S53. If it exists, determine whether the overheating cause of the control switch for the lower-level power supply network matches that of the current overheating control switch; S54. If they do not match, it is considered that the temperature detection result of the current overheating control switch needs to be verified.

[0060] It is understood that the temperature monitoring system provided in this embodiment is used to implement the temperature monitoring method described above, and corresponds one-to-one with the above method, and has the corresponding technical effects.

[0061] The above specific embodiments further illustrate the purpose, technical solution, and beneficial effects of the present invention. It should be understood that the above are merely specific embodiments of the present invention and are not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A temperature monitoring device for a switchgear, characterized in that, include: The device comprises a main temperature analysis unit, multiple sub-temperature analysis units, and multiple temperature monitoring units. The main temperature analysis unit is communicatively connected to the multiple sub-temperature analysis units. Each sub-temperature analysis unit monitors a switch cabinet through a temperature monitoring unit. Each temperature monitoring unit includes multiple fiber Bragg gratings, and each fiber Bragg grating monitors the temperature of a control switch in a switch cabinet.

2. The temperature monitoring device for a switchgear according to claim 1, characterized in that, The temperature monitoring device includes: a light source, an isolator, a coupler, multiple fiber Bragg gratings, and a demodulator. The light source is connected to the isolator, the isolator is connected to the coupler, the coupler is connected to the multiple fiber Bragg gratings, and the coupler is also connected to the demodulator.

3. A method for monitoring the temperature of a switchgear, characterized in that, Performed on the temperature monitoring device as described in any one of claims 1-2, the method includes: a temperature analysis sub-device acquiring temperature measurement results of control switches through the temperature monitoring device; if the temperature measurement results of multiple control switches exceed the limit, analyzing the switch type and number of overheating control switches; determining the cause of overheating of the overheating control switches based on the switch type and number of switches, and sending it to the temperature analysis master device; the temperature analysis master device determining whether the temperature detection results of each control switch need to be verified based on the cause of overheating of multiple overheating control switches; if verification is required, verifying the temperature detection results of the current overheating control switch to obtain a verification result representing the final cause of overheating, and sending the verification result to the temperature analysis sub-device; and the temperature analysis sub-device outputting a prompt message based on the verification result.

4. The temperature monitoring method for a switchgear according to claim 3, characterized in that, The temperature analysis sub-device acquires the temperature measurement results of the control switch through the temperature monitoring device; including: acquiring the light intensity signal from the fiber Bragg grating; acquiring the real-time current value of the fiber Bragg grating based on the light intensity information; determining the center wavelength of the fiber Bragg grating based on the real-time current value, the slope coefficient of the inclined side filter in the temperature detection device, the calibration current and calibration wavelength of the fiber Bragg grating; and determining the temperature measurement results of the control switch monitored by the fiber Bragg grating based on the center wavelength.

5. The temperature monitoring method for a switchgear according to claim 3, characterized in that, The cause of overheating of the overheating control switch is determined based on the switch type and number of switches. This includes: when the current overheating control switch is a branch switch, determining whether there is a main switch among all overheating control switches; if there is a main switch, determining whether the total number of overheating control switches is greater than a preset number; if it is greater than the preset number, determining that the cause of overheating of the current overheating control switch is a heat dissipation failure of the switch cabinet; if it is not greater than the preset number, determining the number of other branch overheating control switches whose distance from the current overheating control switch is less than a threshold; if the number is less than the preset value, determining that the cause of overheating of the current overheating control switch is an overload of the current target control switch; if the number is not less than the preset value, determining that the cause of overheating of the current overheating control switch is a heat dissipation failure of the switch cabinet.

6. The temperature monitoring method for a switchgear according to claim 3, characterized in that, The temperature analysis main unit determines whether the temperature detection results of each control switch need to be verified based on the overheating causes of multiple overheat control switches. This includes: acquiring the downstream power supply network controlled by the current overheat control switch; determining whether there is an overheat control switch controlling the downstream power supply network among all overheat control switches; if so, determining whether the overheating cause of the overheat control switch controlling the downstream power supply network matches that of the current overheat control switch; if they do not match, then the temperature detection result of the current overheat control switch is considered to need to be verified.

7. A temperature monitoring system for a switchgear, characterized in that, include: The temperature analysis submodule is used to obtain the temperature measurement results of the control switch through a temperature monitoring device. If the temperature measurement results of multiple control switches exceed the limit, the switch type and number of the overheating control switches are analyzed; the cause of overheating of the overheating control switches is determined based on the switch type and number of switches, and then sent to the temperature analysis main module. The temperature analysis main module is used to determine whether the temperature detection results of each control switch need to be verified based on the cause of overheating of multiple overheat control switches. If verification is required, the temperature detection result of the current overheat control switch is verified to obtain a verification result indicating the final cause of overheating, and the verification result is sent to the temperature analysis submodule. The temperature analysis submodule is also used to output prompt information based on the verification results.

8. The temperature monitoring system for a switchgear according to claim 7, characterized in that, In the temperature analysis submodule, the temperature measurement results of the control switch are obtained through a temperature monitoring device; specifically, this includes: obtaining the light intensity signal from the fiber Bragg grating; obtaining the real-time current value of the fiber Bragg grating based on the light intensity information; determining the center wavelength of the fiber Bragg grating based on the real-time current value, the slope coefficient of the inclined side filter in the temperature detection device, the calibration current and calibration wavelength of the fiber Bragg grating; and determining the temperature measurement results of the control switch monitored by the fiber Bragg grating based on the center wavelength.

9. A temperature monitoring system for a switchgear according to claim 7, characterized in that, In the temperature analysis submodule, the cause of overheating of the overheating control switch is determined based on the switch type and number of switches. Specifically, this includes: when the current overheating control switch is a branch switch, determining whether there is a main switch among all overheating control switches; if there is a main switch, determining whether the number of all overheating control switches is greater than a preset number; if it is greater than the preset number, determining that the cause of overheating of the current overheating control switch is a heat dissipation failure of the switch cabinet; if it is not greater than the preset number, determining the number of other branch overheating control switches whose distance from the current overheating control switch is less than a threshold; if the number is less than the preset value, determining that the cause of overheating of the current overheating control switch is an overload of the current target control switch; if the number is not less than the preset value, determining that the cause of overheating of the current overheating control switch is a heat dissipation failure of the switch cabinet.

10. A temperature monitoring system for a switchgear according to claim 7, characterized in that, In the temperature analysis main module, the temperature detection results of each control switch need to be verified based on the overheating causes of multiple overheating control switches. Specifically, this includes: obtaining the downstream power supply network controlled by the current overheating control switch; determining whether there is an overheating control switch controlling the downstream power supply network among all overheating control switches; if so, determining whether the overheating cause of the overheating control switch controlling the downstream power supply network matches that of the current overheating control switch; if they do not match, then the temperature detection result of the current overheating control switch is considered to need to be verified.

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