High-protection inverter

Abstract

The invention relates to a high-protection inverter which comprises an inverter shell, a radiator, a main circuit and a control circuit, the main circuit and the control circuit are arranged in the inverter shell, a first opening is formed in the inverter shell, and the area ratio of an area defined by the projection of the first opening on at least one first plane to a projection area of the inverter shell in the first plane is larger than 90%. An included angle between a vertical line of the first plane and a plane formed by any three points on the first opening is greater than 85 degrees; the main circuit is arranged on the heat absorption surface of the radiator and forms a main loop assembly with the radiator, and the control circuit is arranged in the inverter shell and forms a control loop assembly with the inverter shell. Compared with the prior art, the invention has the advantages of internal condensation resistance and the like.

Description

Technical Field

[0001] This invention relates to the field of inverters, and in particular to a highly protected inverter. Background Technology

[0002] Inverters generate a lot of heat, so they are generally equipped with heat dissipation modules. In the existing technology, the heat of each heat-generating unit is transferred to the heat sink through heat pipes inside the inverter. In order to reduce electromagnetic interference and ensure sufficient heat dissipation, the internal cavity is often large.

[0003] The presence of these cavities makes them prone to condensation, thus requiring the placement of initial particles inside, which increases the size of the inverter. Summary of the Invention

[0004] The purpose of this invention is to provide a highly protected inverter. By designing the main circuit assembly and control circuit assembly, the main circuit is arranged on the heat sink and a sufficiently large bottom surface is provided. As a result, the entire inverter has only one connection interface at the edge of the first opening, which provides high protection performance, reduces the height of the internal cavity, has strong resistance to internal condensation, eliminates the need for additional internal dehumidification particles, and has high stability.

[0005] The objective of this invention can be achieved through the following technical solutions:

[0006] A high-protection inverter includes an inverter housing, a heat sink, and a main circuit and a control circuit disposed within the inverter housing. The inverter housing has a first opening, and the area enclosed by the projection of the first opening onto at least one first plane is greater than 90% of the area of ​​the area of ​​the inverter housing projected onto the first plane. The angle between the perpendicular line of the first plane and the plane formed by any three points on the first opening is greater than 85 degrees.

[0007] The main circuit is arranged on the heat-absorbing surface of the heat sink and forms a main circuit assembly with the heat sink.

[0008] The control circuit is located inside the inverter housing and forms a control loop assembly with the inverter housing.

[0009] The control circuit is provided with an electrical connection pin, and the main circuit is provided with an electrical connection socket that mates with the electrical connection pin. After the main circuit assembly and the control circuit assembly are assembled, the electrical connection pin passes through the first opening and is inserted into the electrical connection socket.

[0010] The radiator is a finned radiator.

[0011] The inverter housing is a metal housing.

[0012] The inverter housing is a cuboid with a missing bottom surface, wherein the bottom surface is the surface with the largest area of ​​the cuboid.

[0013] The distance between the two bases of the cuboid is less than one-third of the length of the diagonal of the base.

[0014] The control circuit is integrated on a control PCB circuit board, and the base surface of the control PCB circuit board is parallel to the bottom surface.

[0015] The inverter housing is a sealed container formed by splicing the heat absorption surface of the radiator and the inverter housing.

[0016] The main circuit assembly is filled with high thermal conductivity silicone, and the control circuit assembly is filled with low thermal conductivity silicone.

[0017] The radiator includes a radiator shell and an inlet pipe connector and an outlet pipe connector disposed on the radiator shell. One bottom surface of the radiator shell serves as a heat absorption surface. Multiple heat dissipation fins are disposed inside the radiator shell. The two ends of the heat dissipation fins are respectively connected to the inner sides of the two bottom surfaces to form heat dissipation channels. The output end of the inlet pipe connector and the input end of the outlet pipe connector are both connected to the heat dissipation fins.

[0018] The inlet pipe connector and outlet pipe connector are connected to two opposite sides of the radiator housing.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] 1. By designing the main circuit assembly and control circuit assembly, the main circuit is arranged on the heat sink and a sufficiently large bottom surface is provided. As a result, the entire inverter has only one connection interface at the edge of the first opening, which provides high protection performance, reduces the height of the internal cavity, has strong resistance to internal condensation, eliminates the need for additional internal dehumidification particles, and ensures high stability.

[0021] 2. The two components are potted separately. Depending on the heat dissipation requirements, the external heat dissipation surface is configured with a heat sink for the main circuit component and a metal shell for radiation heat dissipation for the control circuit component. The distance between the two bottom surfaces of the cuboid is less than one-third of the length of the diagonal of the bottom surface, so there is no need to install heat pipes inside, thereby improving the anti-condensation effect.

[0022] 3. The inlet and outlet pipes are connected to two opposite sides of the radiator housing. Combined with the heat dissipation channels formed by the heat dissipation fins, the flow area of ​​the heat dissipation fluid is increased, thus improving the utilization rate of the heat dissipation fluid. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the structure of the present invention;

[0024] Figure 2 This is a schematic diagram of the heat sink of the present invention;

[0025] Figure 3 This is a schematic diagram of the heat dissipation channel;

[0026] Among them: 1. Control circuit assembly, 2. Main circuit assembly, 1-1. Electrical connection pin, 2-1. Water inlet pipe connector, 2-2. Water outlet pipe connector, 2-3. Heat dissipation fins, 2-4. Heat dissipation channel. Detailed Implementation

[0027] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments. These embodiments are based on the technical solution of the present invention and provide detailed implementation methods and specific operating procedures. However, the scope of protection of the present invention is not limited to the following embodiments.

[0028] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0029] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "proximal," "distal," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Physical quantities in formulas, unless otherwise specified, should be understood as basic quantities in the International System of Units (SI), or derived quantities derived from basic quantities through mathematical operations such as multiplication, division, differentiation, or integration.

[0030] Furthermore, terms such as "horizontal," "vertical," and "sag" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal relative to "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0031] In the description of this invention, it should also be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0032] A high-protection inverter includes an inverter housing, such as Figure 1 As shown, the inverter housing includes a heat sink and a main circuit and a control circuit. The inverter housing has a first opening. The area enclosed by the projection of the first opening onto at least one first plane is greater than 90% of the area of ​​the area projected onto the first plane of the inverter housing. The angle between the perpendicular line of the first plane and the plane formed by any three points on the first opening is greater than 85 degrees.

[0033] The main circuit is arranged on the heat-absorbing surface of the heat sink and forms the main circuit assembly 2 together with the heat sink.

[0034] The control circuit is located inside the inverter housing and forms control loop assembly 1 together with the inverter housing.

[0035] The control circuit is provided with an electrical connection pin 1-1, and the main circuit is provided with an electrical connection socket that mates with the electrical connection pin 1-1. After the main circuit assembly 2 and the control circuit assembly 1, the electrical connection pin 1-1 passes through the first opening and is inserted into the electrical connection socket.

[0036] By designing the main circuit assembly 2 and the control circuit assembly 1, the main circuit is arranged on the heat sink and a sufficiently large bottom surface is provided. As a result, the entire inverter has only one connection interface at the edge of the first opening, which provides high protection performance. It can also reduce the height of the internal cavity, has strong resistance to internal condensation, does not require additional internal dehumidification particles, and has high stability.

[0037] Generally, the radiator is a finned radiator, for example, such as Figure 2 and Figure 3 As shown, the radiator includes a radiator shell and an inlet pipe connector 2-1 and an outlet pipe connector 2-2 disposed on the radiator shell. One bottom surface of the radiator shell serves as a heat-absorbing surface. Multiple heat dissipation fins 2-3 are disposed inside the radiator shell. The two ends of the heat dissipation fins 2-3 are respectively connected to the inner sides of two bottom surfaces to form a heat dissipation channel 2-4. The output end of the inlet pipe connector 2-1 and the input end of the outlet pipe connector 2-2 are both connected to the heat dissipation fins 2-3. The inlet pipe connector 2-1 and the outlet pipe connector 2-2 are connected to two opposite sides of the radiator shell. Combined with the heat dissipation channel 2-4 formed by the heat dissipation fins 2-3, the flow area of ​​the heat dissipation fluid is increased, thus improving the utilization rate of the heat dissipation fluid. By connecting the inlet pipe connector 2-1 and the outlet pipe connector 2-2 to a coolant circulation unit, heat dissipation can be achieved. The coolant is a fluid, specifically, it can be a liquid or a gas. Furthermore, in some embodiments, such as... Figure 3 As shown, the cooling channel forms a meandering section, thereby increasing the flow area of ​​the heat dissipation fluid. Of course, in some other embodiments, a design of cooling channel 2-4 consisting of multiple cooling channels connected in parallel can also be adopted.

[0038] In some embodiments, air-cooled heat sinks or other methods may also be used, and the specific heat dissipation method needs to be determined based on the overall power requirements.

[0039] In this embodiment, the inverter housing is a metal housing, which is a cuboid with a missing bottom surface. The bottom surface is the largest surface area of ​​the cuboid, and the distance between the two bottom surfaces is less than one-third of the diagonal length of the bottom surface. The main circuit assembly 2 is filled with high thermal conductivity silicone, while the control circuit assembly 1 is filled with low thermal conductivity silicone. Both components are filled with silicone. Depending on the heat dissipation requirements, the main circuit assembly 2 uses a heat sink for heat dissipation, while the control circuit assembly 1 uses a metal housing for radiative heat dissipation. Since the distance between the two bottom surfaces of the cuboid is less than one-third of the diagonal length of the bottom surface, internal heat pipes are not required, thus improving the anti-condensation effect.

[0040] The control circuit is integrated on the control PCB board, and the base surface and bottom surface of the control PCB board are parallel.

[0041] The inverter housing is a sealed container formed by splicing the heat absorption surface of the radiator and the inverter housing.

[0042] The structure of the main circuit and control circuit is no different from the existing technology. The main heat-generating components of the main circuit are power devices, including IGBTs, MOS, inductors, etc., so they will not be described in detail.

Claims

1. A high-protection inverter, comprising an inverter housing, a heat sink, and a main circuit and a control circuit disposed within the inverter housing, characterized in that, The inverter housing is provided with a first opening, and the area enclosed by the projection of the first opening onto at least one first plane is greater than 90% of the area of ​​the area of ​​the inverter housing projected onto the first plane, wherein the angle between the perpendicular line of the first plane and the plane formed by any three points on the first opening is greater than 85 degrees. The main circuit is arranged on the heat-absorbing surface of the heat sink and forms a main circuit assembly with the heat sink. The control circuit is located inside the inverter housing and forms a control loop assembly with the inverter housing. The control circuit is provided with an electrical connection pin, and the main circuit is provided with an electrical connection socket that mates with the electrical connection pin. After the main circuit assembly and the control circuit assembly are assembled, the electrical connection pin passes through the first opening and is inserted into the electrical connection socket.

2. The high-protection inverter according to claim 1, characterized in that, The radiator is a finned radiator.

3. The high-protection inverter according to claim 1, characterized in that, The inverter housing is a metal housing.

4. A high-protection inverter according to claim 1, characterized in that, The inverter housing is a cuboid with a missing bottom surface, wherein the bottom surface is the surface with the largest area of ​​the cuboid.

5. A high-protection inverter according to claim 4, characterized in that, The distance between the two bases of the cuboid is less than one-third of the length of the diagonal of the base.

6. A high-protection inverter according to claim 4, characterized in that, The control circuit is integrated on a control PCB circuit board, and the base surface of the control PCB circuit board is parallel to the bottom surface.

7. A high-protection inverter according to claim 1, characterized in that, The inverter housing is a sealed container formed by splicing the heat absorption surface of the radiator and the inverter housing.

8. A high-protection inverter according to claim 1, characterized in that, The main circuit assembly is filled with high thermal conductivity silicone, and the control circuit assembly is filled with low thermal conductivity silicone.

9. A high-protection inverter according to claim 1, characterized in that, The radiator includes a radiator shell and an inlet pipe connector and an outlet pipe connector disposed on the radiator shell. One bottom surface of the radiator shell serves as a heat absorption surface. Multiple heat dissipation fins are disposed inside the radiator shell. The two ends of the heat dissipation fins are respectively connected to the inner sides of the two bottom surfaces to form heat dissipation channels. The output end of the inlet pipe connector and the input end of the outlet pipe connector are both connected to the heat dissipation fins.

10. A high-protection inverter according to claim 9, characterized in that, The inlet pipe connector and outlet pipe connector are connected to two opposite sides of the radiator housing.

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