Electronic component packaging method, packaging equipment and electronic equipment

Abstract

An embodiment of the present invention relates to an electronic component packaging method, a packaging apparatus, and an electronic apparatus, the electronic component packaging method comprising: a resin processing step of placing a sealing material containing a granular and / or powdery resin in a recessed container, pressing the sealing material by a pressing part fitted with the recessed container, and processing the resin by a resin processing step of pressing the sealing material by a pressing part fitted with the recessed container; processing the sealing raw material into flaky resin; and a sealing step of sealing, with the sheet-like resin, a plurality of workpieces disposed on the workpiece holding sheet, the workpieces being a package substrate and an electronic component bonded to the package substrate, with the sheet-like resin in a state where the sheet-like resin is disposed in the recessed container. According to the embodiment, the electronic component can be sealed, the sealing process can be completed without carrying the sheet-shaped resin, and the sheet-shaped resin cannot be damaged.

Description

Packaging methods, packaging equipment, and electronic equipment for electronic components Technical Field

[0001] This invention relates to the field of device sealing technology, and in particular to a packaging method for electronic components, a packaging device for electronic components, and an electronic device. Background Technology

[0002] In high-frequency communication systems of mobile communication terminals, such as smartphones, high-frequency filters are typically used to remove unwanted signals outside the frequency band used in communication. These high-frequency filters utilize electronic devices, which include electronic components, such as surface acoustic wave (SAW) elements. SAW elements are IDTs (Interdigital Transducers) with comb-shaped electrodes formed on a piezoelectric substrate.

[0003] Electronic components need to be sealed before they can be used. Current technology generally uses sheet-like sealing resin to seal electronic components. However, since sheet-like resin is generally quite thin, it is prone to cracking and deformation during handling. To facilitate transportation, release films need to be pasted on both sides of the thin sheet, and then the elastic wave element is processed with the sheet-like resin so that the sheet-like resin can seal the electronic component. Summary of the Invention

[0004] Therefore, in order to overcome at least some of the defects and deficiencies of the prior art, the present invention provides a packaging method for electronic components to prevent damage to the sheet resin made of sealing raw materials and reduce the cost of sealing.

[0005] On one hand, an embodiment of the present invention provides a method for packaging electronic components, comprising: a resin processing step: placing a sealing raw material containing granular and / or powdered resin in a concave container, and processing the sealing raw material into a sheet resin by pressing the sealing raw material with a pressing part that fits into the concave container; and a sealing step: with the sheet resin disposed in the concave container, sealing a plurality of workpieces disposed on a workpiece holding sheet with the sheet resin, wherein the workpieces are an encapsulation substrate and an electronic component bonded to the encapsulation substrate.

[0006] Secondly, another embodiment of the present invention provides an electronic component packaging apparatus, comprising: a resin processing apparatus having a concave container for holding a sealing raw material comprising granular and / or powdered resin; a pressurizing device having a pressing portion fitted into the concave container, optionally cooperating with the resin processing apparatus for pressing the sealing raw material in the resin processing apparatus by the pressing portion to obtain sheet resin; and a workpiece holding device having a workpiece holding plate, optionally connected and cooperating with the resin processing apparatus for mounting workpieces to be sealed onto the workpiece holding plate and moving them to the resin processing apparatus containing the sheet resin, thereby sealing a plurality of workpieces disposed on the workpiece holding plate using the sheet resin.

[0007] Thirdly, in one embodiment of the present invention, an electronic device is provided, comprising: a packaging substrate having opposing first and second surfaces; an electronic component disposed on the first surface of the packaging substrate; and a sealing layer covering the electronic component and sealing the electronic component together with the packaging substrate; wherein the sealing layer is a thermosetting resin processed from granular and / or powdered resin.

[0008] As can be seen from the above, the above-mentioned technical features of the present invention can have the following beneficial effects: This application obtains sheet resin by placing the sealing element material of powder and / or particles in a concave container for processing; then, with the sheet resin disposed in the concave container, the sheet resin seals multiple workpieces located on the workpiece retaining sheet, so that the sheet resin can be placed directly in the concave container without handling, reducing the loss rate of sheet resin due to handling. Secondly, since the produced sheet resin does not need to be handled, there is no need to attach release film to both sides of the sheet resin, thereby reducing costs. Attached Figure Description

[0009] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0010] Figure 1 is a schematic flowchart of an electronic component packaging method provided in the first embodiment of the present invention.

[0011] Figure 2 is a schematic diagram of the specific steps in step S102 of Figure 1.

[0012] Figure 3 is a flowchart of the sub-step of step S101 in Figure 1.

[0013] Figure 4a is a schematic diagram of the related equipment for processing sealing raw materials according to a specific embodiment of the present invention.

[0014] Figure 4b is a schematic diagram of the related devices for the sheet resin involved in a specific embodiment of the present invention.

[0015] Figure 4c is a schematic diagram of the device assembly involved in the process of sealing multiple workpieces with sheet-like resin on a workpiece retaining sheet according to a specific embodiment of the present invention.

[0016] Figure 4d is a schematic diagram of the structure of the electronic components shown in Figure 4c mounted on the packaging substrate.

[0017] Figure 4e is a schematic diagram of the specific structure of the electronic component after the sealing process shown in Figure 4c.

[0018] Figures 5a-5f are schematic diagrams showing the coordination of related devices in the processing steps and sealing steps of the first sheet resin and the second sheet resin involved in specific embodiments of the present invention.

[0019] Figure 6 is a schematic diagram of an electronic component packaging device provided in the second embodiment of the present invention.

[0020] Figure 7 is a schematic diagram of the structure of an electronic device provided in the third embodiment of the present invention.

[0021] Figure 8a is a schematic diagram of the electronic device structure after the elastic wave element shown in Figure 7 is packaged.

[0022] Figure 8b is a top view illustrating the structure of a resonator containing an IDT.

[0023] Figure 9 is a schematic diagram of another electronic device shown in Figure 7.

[0024] [Explanation of Identifiers in the Attached Image]

[0025] S101-S102, S111-113, S1021: A packaging method for electronic components.

[0026] 1: Packaging equipment for electronic components; 10: Resin processing apparatus; 101: Concave container; 11: Sheet resin; 111: Sealing material; 12: First sheet resin; 121: First sealing material; 13: Second sheet resin; 131: Second sealing material; 20: Workpiece holding device; 201: Workpiece holding sheet; 21: Workpiece; 211: Electronic component; 212: Packaging substrate; 2121: First surface; 2122: Second surface; 30: Pressing device; 31: Pressing part; 32: Vacuum suction hole; 40: Electronic device; 43: Sealing layer; 44: External connection terminal; 45: Electrode pad; 46: Bump; 47: Gap; 50: Elastic wave element; 51: Piezoelectric substrate; 52: IDT; 53: Reflector; 521: Comb electrode; 5211: Electrode finger; 5212: Busbar. Detailed Implementation

[0027] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. [First Embodiment]

[0028] As shown in Figure 1, this embodiment of the invention provides a packaging method for electronic components. Specifically, the packaging method for electronic components provided by this embodiment includes, for example, the following steps:

[0029] S101, Resin Processing Step: A sealing raw material containing granular and / or powdered resin is placed in a concave container, and the sealing raw material is processed into sheet resin by pressing the sealing raw material with a pressing part that fits into the concave container.

[0030] S102, Sealing process: With the sheet resin disposed in the concave container, a plurality of workpieces disposed on the workpiece holding sheet are sealed by the sheet resin, wherein the workpieces are an encapsulation substrate and electronic components bonded to the encapsulation substrate.

[0031] As shown in Figures 1 and 4a-4e, in step S101, the sealing raw material for the particles is, for example, particles with a particle size of less than 50 micrometers (μm) or particles with a particle size of 50 μm to 5 millimeters (mm). Specifically, particles with a particle size of less than 50 μm are, for example, ultrafine powders of 0.1 μm to 1 μm, such as 0.5 μm ultrafine powder; nanoparticles of less than 0.1 μm, such as 0.01 μm nanoparticles; or fine powders between 10 μm and 100 μm, such as 10 μm fine powder, 50 μm fine powder, or 100 μm fine powder. Particles with a particle size of 50 μm to 5 mm are, for example, sand-sized particles with a particle size between 0.05 mm and 2 mm, such as 0.05 mm, 1 mm, or 2 mm; or small pebble-sized particles with a particle size between 2 mm and 5 mm, such as 2 mm, 4 mm, or 5 mm. As shown in Figure 4a, granular and / or powdered sealing raw material 111 can be filled into the concave container 101 of the resin processing apparatus 10, and then processed to obtain sheet resin 11. The concave container 101 can be, for example, a groove.

[0032] The sealing raw material may contain non-metallic inorganic materials, such as Al2O3 (alumina), SiO2 (silicon oxide), or AlN (aluminum nitride). By adding non-metallic inorganic materials to the sealing raw material, the thermal conductivity and thermal stability of the resin can be improved, thereby maintaining better performance at high temperatures. Furthermore, the sealing raw material preferably does not contain solvents. If solvents are contained, during the processing of the sealing raw material, air bubbles will be formed by evaporation during the heating process, resulting in air bubbles in the produced sheet resin, which will affect the sealing performance of electronic components in subsequent sealing processes. A release liner can be placed inside the concave container 101 of the resin processing apparatus 10 to isolate the sealing material from the concave container 101. This prevents the sealing material from adhering to the concave container 101 after being processed by the pressurizing device 30. Furthermore, the release liner can be made of a material with a coefficient of thermal expansion of 20-100 PPM / ℃, so that the adhesion between the release liner and the sealing material is low, and the sealing material will not adhere to the release liner. This also makes it easy to separate the sheet resin from the release liner after obtaining the sheet resin.

[0033] In step S102, as shown in FIG4c or FIG5e, the workpiece holding device 20 has a workpiece holding plate 201, which has a placement area for placing a workpiece 21, and the workpiece 21 is placed in the placement area. Specifically, the workpiece 21 includes an encapsulation substrate 212 and an electronic component 211 flip-chip bonded to the encapsulation substrate 212, wherein there is preferably a gap between the electronic component 211 and the encapsulation substrate 212. The workpiece holding device 20 is moved above the resin processing apparatus 10, and the workpiece holding device 20 is pressed down to press the electronic component 211 into the concave container 101 of the resin processing apparatus 10, so that the electronic component 211 is pressed against the sheet resin 11. After pressing is completed, as shown in FIG4e or FIG5f, a plurality of sealed workpieces are obtained.

[0034] This application obtains sheet resin 11 by processing granular and / or powdered sealing raw material 111 in a resin processing apparatus 10; a workpiece holding device 20, on which multiple workpieces are mounted, is then placed in the sheet resin 11 of the resin processing apparatus 10 for sealing, resulting in a packaged workpiece with a sealing layer. The sheet resin 11 can be obtained by first processing the sealing raw material 111 in the resin processing apparatus 10, eliminating the need to transport the sheet resin 11. The workpieces to be packaged are then placed on the resin processing apparatus 10 via the workpiece holding device 20 for packaging, thus achieving the packaging process for multiple workpieces and realizing the sheet resin 11. No handling is required; the resin can be placed directly into the resin processing device 10, reducing the loss rate of the sheet resin 11 due to handling. Secondly, the sheet is formed by heating and pressurizing the sealing raw materials of granules and / or powders. However, since the sheet is prone to cracking and deformation during handling, release films need to be pasted on both sides of the sheet for convenient transportation. This application uses the sheet resin 11 to seal multiple workpieces disposed on the workpiece holding device 20 while the sheet resin 11 is disposed in the concave container 101. Therefore, there is no need to handle the sheet resin 11, which can save costs in the packaging process of electronic components.

[0035] In a preferred embodiment of this example, the electronic component may be, for example, an elastic wave element, and a partial structural diagram of the elastic wave element is shown in Figures 8a-8b. As shown in Figure 8b, the elastic wave element 50 is, for example, an elastic surface wave element, which has a piezoelectric substrate 51. A metal pattern is formed on a main surface of the piezoelectric substrate 51 of the elastic wave element 50. The metal pattern has an IDT 52 and a reflector 53, wherein the IDT 52 is a comb-shaped electrode with multiple intersecting electrode fingers. That is, the IDT 52 and the reflector 53 are formed on the piezoelectric substrate 51. The IDT 52 has comb-shaped electrodes 521 facing each other. The comb-shaped electrodes 521 have multiple electrode fingers 5211 and busbars 5212 connecting the multiple electrode fingers. The reflector 53 is disposed on both sides of the IDT 52. There is a gap between the elastic wave element and the packaging substrate, and the sealing process is performed while maintaining the gap.

[0036] The packaging method of this embodiment can be used to package a single electronic component or multiple electronic components. It can package elastic wave components or non-elastic wave components. When packaging an elastic wave component, a cavity is formed between the substrate and the elastic wave component in the resulting elastic wave device (cavity 47 as shown in Figure 8a). When packaging a non-elastic wave component, the substrate and the non-elastic wave component in the resulting non-elastic wave device may not have a cavity.

[0037] Furthermore, in the resin processing step, the sealed raw material 111 placed in the concave container 101 of the resin processing apparatus 10 is first heated, and the temperature can be maintained between 100-120°C, and then subjected to high pressure, for example, 30-100 kg / cm². 2 The pressure causes the sealing raw material 111 to be formed into sheet resin 11 through low temperature and high pressure molding. In the prior art, when sealing elastic wave elements, finished sheet sealing resin is generally used directly. However, since the cost of finished sealing resin is relatively expensive, this application can reduce the cost of use in the sealing process by obtaining the sealing raw material and processing it into sheet resin itself.

[0038] As shown in Figures 4a and 6, the pressurizing device 30 includes, for example, a pressing part 31. The pressing part 31 on the pressurizing device 30 applies pressure to the sealing raw material 111 to obtain sheet resin 11. A separating film can also be provided on the lower surface of the pressing part 31 to prevent the sealing raw material 111 from adhering to the pressing part 31 during processing.

[0039] Furthermore, the sheet resin is a thermosetting resin, as shown in Figure 2. Step S1021 specifically includes:

[0040] S1021. In the sealing process, the sheet resin is heated to soften it, the electronic component is pressed into the sheet resin so that the softened resin covers and surrounds the surface of the electronic component, and the softened sheet resin is heated further to completely solidify the surface of the electronic component, thereby sealing the electronic component together with the packaging substrate.

[0041] Specifically, the thermosetting resin is a polymer compound that undergoes an irreversible chemical reaction when heated, thereby curing into a solid material. The steps of this embodiment utilize the characteristics of thermosetting resin, such as epoxy resin. As shown in Figure 4c, in this embodiment, the workpiece holding device 20 is first moved above the resin processing device 10, and then the electronic component 211 is placed in the concave container 101 of the resin processing device 10, so that the electronic component 211 is attached to the sheet resin 11 or the electronic component 211 is located above the first sheet resin 12. Then, the sheet resin 11 in the resin processing apparatus 10 is heated to soften it. At this time, pressure is applied to the workpiece holding device 20, so that the electronic components 211 in the multiple workpieces on the workpiece holding device 20 are squeezed against the softened sheet resin. The softened sheet resin will then coat the surface of the electronic components 211. Then, the temperature is raised from 100°C to 120°C, so that the sheet resin 11 begins to cure on the surface of the electronic components 211 until curing is complete, and the encapsulated electronic components are obtained, as shown in Figure 4e.

[0042] This embodiment utilizes the properties of thermosetting resin to press electronic components 211 into sheet resin 11 during the time it takes for the thermosetting resin to soften and cure. Then, by utilizing the irreversibility of thermosetting resin, a sealing layer is formed on the surface of electronic components 211 after curing. The resulting encapsulated electronic components are more corrosion resistant and have excellent mechanical strength, hardness, and wear resistance.

[0043] In a preferred embodiment of this example, as shown in FIG3, step S101 specifically includes:

[0044] S111. A first sealing raw material comprising powdered and / or granular resin is disposed in the concave container.

[0045] S112. Press the first sealing material with the pressing part to process the first sealing material into a first sheet resin.

[0046] S113. A second sealing material comprising powder and / or particulate resin is disposed on the first sheet resin, and the second sealing material is processed into a second sheet resin, wherein the non-metallic inorganic content of the second sealing material is higher than the non-metallic inorganic content of the first sealing material.

[0047] Specifically, the powder and granules in the first sealing material containing powdered and / or granular resin and the second sealing material containing powdered and / or granular resin can be referred to the relevant description of sealing materials above, and will not be repeated here. The second sealing material may contain non-metallic inorganic materials, which can be referred to the specific introduction and description of sealing materials above, and will not be repeated here. The content of non-metallic inorganic materials in the second sealing material is higher than that in the first sealing material, which is beneficial to improving the thermal conductivity of the second sealing layer formed on the electronic component through the sealing process, so that the thermal conductivity of the second sealing layer is higher than that of the first sealing layer. Furthermore, since the second sealing layer is located between the electronic component and the first sealing layer, it can quickly dissipate the heat generated by the electronic component, thereby improving the heat dissipation performance of the module. Compared with the second sealing material, the first sealing material contains less material and has better coverage of the electronic component 211. By defining the first and second sealing materials, the resulting packaged module with a double sealing layer achieves both good heat dissipation performance and airtightness.

[0048] In a preferred embodiment of this invention, as shown in FIG5e, during the sealing process, with the first sheet resin 12 and the second sheet resin 13 disposed in the concave container 101, a plurality of electronic components 211 disposed on the workpiece holding piece 201 are sealed using the first sheet resin 12 and the second sheet resin 13. The resulting packaged electronic components have a double-layer sealing layer, wherein the first sealing layer is made of the first sheet resin 12 and the second sealing layer is made of the second sheet resin 13, as shown in FIG5f.

[0049] Furthermore, the sealing process is performed by pressing the plurality of workpieces into the first sheet resin and the second sheet resin while the first sheet resin and the second sheet resin are heated, from the time the first sheet resin and the second sheet resin begin to soften until they begin to cure.

[0050] Specifically, the time from the beginning of softening to the beginning of curing of the first sheet resin 12 is longer than the time from the beginning of softening to the beginning of curing of the second sheet resin 13. The first sheet resin 12 and the second sheet resin 13 are, for example, thermosetting resins. The time from the beginning of softening to the beginning of curing of the first sheet resin 12 is a first time, and the time from the beginning of softening to the beginning of curing of the second sheet resin 13 is a second time. Preferably, the first time exceeds the second time.

[0051] The first duration exceeding the second duration can be, for example, the following situations:

[0052] The second sheet resin 13 begins to soften, and at the same time the first sheet resin 12 begins to soften. That is, the first sheet resin 12 and the second sheet resin 13 begin to soften at the same time. At this time, the second sheet resin 13 begins to cure first, and the curing time of the first sheet resin 12 is later than the curing time of the second sheet resin 13, so that the first duration exceeds the second duration.

[0053] By limiting the different times for the first sealing material 121 and the second sealing material 131 to start to cure, the first sheet resin 12 and the second sheet resin 13 can be sealed simultaneously within the resin processing apparatus 10 without having to be sealed separately, which can save on the packaging steps and packaging costs of electronic components.

[0054] Furthermore, the heating temperature required for the first sheet resin 12 formation process is lower than the heating temperature required for the second sheet resin 13 formation process. Specifically, the heating temperature in the first resin processing step to obtain the first sheet resin 12 is 80-150°C, and the heating temperature in the second resin processing step to obtain the second sheet resin 13 is also 80-150°C.

[0055] Furthermore, the thermal conductivity of the second sheet resin 13 is higher than that of the first sheet resin 12. Specifically, the thermal conductivity of the first sheet resin 12 is 0.3-3 W / mK, and the thermal conductivity of the second sheet resin 13 is 1-4 W / mK. The second sheet resin 13 may contain a non-metallic inorganic material composed of a substance with high thermal conductivity, and the filler content in the resin is in the range of 70 wt% to 90 wt%. Typically, the non-metallic inorganic material is composed of granules with a diameter of about 10 μm. Specifically, epoxy resins containing fillers or phenolic resins containing fillers can be used to constitute the first sheet resin 12. The non-metallic inorganic material is, for example, silicon oxide, aluminum oxide, aluminum nitride, or powdered diamond.

[0056] Furthermore, after processing to obtain the first sheet resin 12 and the second sheet resin 13, the workpiece holding device 20 is placed inside the resin processing apparatus 10, such that the electronic component 211 is located on the second sheet resin 13.

[0057] As shown in Figure 5f, since this application seals the electronic component 211 upside down, a first sheet resin 12 is formed below the second sheet resin 13, resulting in the encapsulated electronic component. The encapsulated electronic component is then placed upright. The structure of the encapsulated electronic component, from top to bottom, consists of a first sealing layer formed after the first sheet resin 12 has cured, a second sealing layer formed after the second sheet resin 13 has cured, the electronic component 211, and the encapsulation substrate 212. The second sealing layer contains filler, which facilitates heat dissipation, and its low filler concentration promotes surface planarization of the device.

[0058] To facilitate understanding of the present invention, the various steps of the electronic component packaging method of this embodiment will be described in detail below with reference to Figures 1-3, 4a-4e, 5a-5f, and 8.

[0059] The electronic component packaging method provided in this embodiment of the invention is applicable to electronic components. This embodiment includes an electronic component packaging device 1, as shown in FIG6. The packaging device 1 includes, for example, a resin processing device 10, a workpiece holding device 20, and a pressurizing device 30.

[0060] As shown in Figures 4a and 4b, firstly, epoxy resin powder with a particle size of 25 micrometers or epoxy resin granules with a particle size of 3 millimeters are selected. Then, Al2O3 solid insulating material is added to the powder or granules to obtain sealing raw material 111. Next, the sealing raw material 111 is placed into the concave container 101 of the resin processing apparatus 10. A release liner can be laid inside the concave container 101 beforehand to prevent the finished product from adhering to the inside of the concave container 101. After placement, the pressurizing device 30 with a pressing part 31 is moved to directly above the resin processing apparatus 10, i.e., the pressing part 31 corresponds to the concave container 101. The sealing raw material 111 placed in the concave container 101 is then heated to a temperature of 100-120°C to soften it. Finally, the pressurizing device 30 presses down on the sealing raw material 111 to obtain sheet-like resin 11, as shown in Figure 4b. After processing is completed, the pressurizing device 30 is removed. At this time, sheet resin 11 is placed in the concave container 101 of the resin processing device 10.

[0061] Then, a workpiece is mounted on the workpiece holding plate 201 of the workpiece holding device 20. The workpiece is sequentially provided with an encapsulation substrate 212 and an electronic component 211 (as shown in FIG4e). That is, the encapsulation substrate 212 and the electronic component 211 are sequentially flipped onto the workpiece holding plate 201 of the workpiece holding device 20. Then, the workpiece holding device 20 with the electronic component 211 is moved to the resin processing apparatus 10. The electronic component 211 is aligned with the concave container 101, as shown in FIG4c. The electronic component 211 is placed in the concave container 101 and close to the sheet resin 11.

[0062] Then, the sheet resin 11 in the resin processing apparatus 10 is heated to 100-120°C, causing the sheet resin 11 to soften. Then, downward pressure is applied to the workpiece holding device 20, causing the electronic component 211 to be pressed into the softened sheet resin 11. Then, heating continues, raising the temperature to 120-150°C, and the softened sheet resin 11 begins to cure until it is completely cured. At this point, since the electronic component 211 is pressed into the sheet resin 11, the sheet resin 11 can coat the surface of the electronic component 211 and cure, thus obtaining an encapsulated electronic component, as shown in Figure 4e.

[0063] Furthermore, to enhance the wear resistance and corrosion resistance of the encapsulated module, a second sealing resin can be formed based on the first sealing resin, as shown in Figures 5a-5f. This encapsulation method specifically includes:

[0064] As shown in Figures 5a and 5b, firstly, epoxy resin powder with a particle size of 25 micrometers or epoxy resin granules with a particle size of 3 millimeters are selected. Then, the first sealing raw material 121 is placed into the concave container 101 of the resin processing device 10. A release film can be laid in the concave container 101 beforehand to prevent the finished product from sticking to the inside of the concave container 101. After placement, the pressurizing device 30 is moved to directly above the resin processing device 10, and the pressing part 31 of the pressurizing device 30 is aligned with the concave container 101. The first sealing raw material 121 placed in the concave container 101 is then heated to a temperature of 100-120°C to soften it. Then, the pressurizing device 30 is adjusted downwards to pressurize the first sealing raw material 121, resulting in a sheet-like first sheet resin 12, as shown in Figure 5b. After processing is completed, the pressurizing device 30 is removed. At this time, a sheet-like first sheet resin 12 is formed in the concave container 101 of the resin processing device 10.

[0065] Secondly, as shown in Figure 5c, after processing the first sheet resin 12, the pressurizing device 30 is raised to a certain height, and then a second sealing material 131 is added into the concave container 101. The second sealing material 131 includes epoxy resin powder with a particle size of 30 micrometers or epoxy resin particles with a particle size of 3 millimeters and SiO2 solid insulating material. Then, the second sheet resin 13 is obtained by a similar processing method to the first sheet resin 12, so that the first sheet resin 12 and the second sheet resin 13 are formed sequentially from bottom to top in the concave container 101, as shown in Figure 5d.

[0066] Then, the encapsulation substrate 212 and the electronic component 211 are flip-mounted sequentially on the workpiece holding device 20. The workpiece holding device 20 containing the electronic component 211 is then moved to the resin processing device 10. The electronic component 211 is aligned with the concave container 101, as shown in FIG5e. The electronic component 211 is placed in the concave container 101 and close to the second sheet resin 13.

[0067] Then, the second sheet resin 13 in the resin processing apparatus 10 is heated at 100-120°C to soften it. Pressure is then applied to the workpiece holding device 20 to press the electronic component 211 into the softened second sheet resin 13. Heating continues to raise the temperature to 120-150°C, and the softened second sheet resin 13 begins to solidify. Heating continues for 0.5-1 hour to completely solidify the softened second sheet resin 13. At this point, because the electronic component 211 is pressed into the second sheet resin 13, the second sheet resin 13 covers the surface of the elastic device and solidifies, resulting in an encapsulated electronic component with a sealing layer of the second sheet resin.

[0068] Then, while heating the second sheet resin 13, the curing temperature is 100-120℃, causing the first sheet resin 12 to soften as well. Then, downward pressure is applied to the workpiece holding device 20, pressing the encapsulated electronic component with the sealing layer of the second sheet resin into the softened first sheet resin 12. Then, heating continues, and the softened first sheet resin 12 begins to cure. Since the materials in the first sheet resin 11 and the second sheet resin 13 are different, non-metallic inorganic materials are added to the second sheet resin 13, making the curing time of the second sheet resin 13 longer. After the first sheet resin 11 cures, the second sheet resin 13 does not cure. Heating continues, so that the softened first sheet resin 12 is completely cured. The first sheet resin 12 covers the surface of the sealing layer of the second sheet resin and cures, thus obtaining an encapsulated module with a first sealing layer and a second sealing layer. The first sealing layer is composed of the first sheet resin, and the second sealing layer is composed of the second sheet resin, as shown in Figure 5f.

[0069] Because the first sheet resin 12 and the second sheet resin 13 have different thermal conductivity, the encapsulated electronic components can be further protected, reducing the impact on the electronic components and improving the performance of various devices made from these electronic components. [Second Embodiment]

[0070] As shown in FIG6, a second embodiment of the present invention provides an electronic component packaging device 1. As shown in FIG6, the electronic component packaging device 1 includes, for example, a resin processing apparatus 10, a workpiece holding apparatus 20, and a pressurizing apparatus 30.

[0071] The resin processing apparatus 10 has a concave container 101 for holding a sealing raw material 111 containing granular and / or powdered resin.

[0072] A pressurizing device 30 has a pressing part 31 that fits into the concave container 101. The pressurizing device 30 can be selectively used with the resin processing device 10. The pressurizing device 30 is used to press the sealing raw material 111 in the resin processing device 10 through the pressing part 31 to obtain sheet resin 11.

[0073] A workpiece holding device 20, which has a workpiece holding plate 201, is optionally compatible with the resin processing device 10. The workpiece holding device 20 is used to place the workpiece to be sealed onto the workpiece holding plate 201 and move it to a processing device on which the sheet resin 11 is placed, so as to seal the workpiece disposed on the workpiece holding plate 201 by means of the sheet resin 11.

[0074] In order to ensure that the pressurizing device 30 and the resin processing device 10 cooperate to form sheet resin 11, a vacuum adsorption hole 32 can be provided in the pressurizing device 30 to ensure that the pressurizing device 30 maintains a stable position during the processing.

[0075] It should be noted that the electronic component packaging methods implemented by the various modules of the electronic component packaging device 1 provided in this embodiment are as described in the first embodiment above, and therefore will not be described in detail here. Optionally, the various modules and other operations or functions in the second embodiment are respectively for implementing the method in the first embodiment of the present invention, and the beneficial effects are the same as in the first embodiment. For the sake of brevity, they will not be described in detail here. [Third Embodiment]

[0076] As shown in Figures 7 and 8a, this embodiment provides an electronic device 40, which includes, for example, a packaging substrate 212, electronic components 211, and a sealing layer 43.

[0077] Specifically, as shown in FIG7, the packaging substrate 212 has a first surface 2121 and a second surface 2122, that is, the first surface 2121 is the upper surface of the packaging substrate 212, and the second surface 2122 is the lower surface of the packaging substrate 212. An electronic component 211 is disposed on the first surface 2121 of the packaging substrate 212; the sealing layer 43 covers the electronic component 211 and seals the electronic component 211 together with the packaging substrate 212.

[0078] Specifically, the sealing layer 43 can be obtained from sheet resin using the electronic component encapsulation method described in the first embodiment above. The encapsulation substrate 212 can be, for example, a PCB substrate, a ceramic substrate, an organic substrate, etc., and the electronic component 211 can be, for example, an electronic component in the prior art, such as an elastic wave component or a non-elastic wave component.

[0079] In this embodiment, by setting a sealing layer 43, the electronic component 211 can be sealed and protected.

[0080] Furthermore, as shown in FIG9, the sealing layer 43 includes a first sealing layer 431 and a second sealing layer 432, wherein the second sealing layer 432 is disposed between the electronic component 211 and the first sealing layer 431, and the thermal conductivity of the second sealing layer 432 is higher than that of the first sealing layer 431. The thermal conductivity of the first sealing layer is 0.3-3 W / mK; the thermal conductivity of the second sealing layer 432 is 1-4 W / mK. The first sealing layer 431 can be composed of a first sheet resin obtained by the electronic component encapsulation method involved in the first embodiment described above, and the second sealing layer 432 can be composed of a second sheet resin obtained by the electronic component encapsulation method involved in the first embodiment described above.

[0081] The content of non-metallic inorganic matter in the second sealing layer 432 is higher than that in the first sealing layer 431. Specifically, the content of non-metallic inorganic matter in the second sealing layer 432 and the first sealing layer 431 can be referred to the specific description of the doped materials in the first sheet resin 11 and the second sheet resin 13 in the first embodiment, which will not be repeated here.

[0082] In a preferred embodiment of this invention, the first sealing layer 431 comprises a conductive material, an insulating material, and a resin raw material; the second sealing layer 432 comprises an insulating material and a resin raw material. By including a conductive material in the first sealing layer 431, the electromagnetic shielding effect of the second sealing layer 432 is better than that of the first sealing layer 431, thereby better protecting the electronic component 211. In this embodiment, the material included in the first sealing layer 431 differs from the aforementioned non-metallic inorganic material. The aforementioned non-metallic inorganic material is mainly used to improve the thermal conductivity and heat dissipation function between the first sealing layer 431 and the second sealing layer 432. However, in this application, the first sealing layer 431 includes a conductive material to give the structure a better electromagnetic shielding effect. The two are not the same. In other embodiments, the material included in the first sealing layer 431 can be set according to the actual situation. For example, if a better electromagnetic shielding effect is required, a conductive material can be added; or if a heat dissipation function is required, the content of non-metallic inorganic material between the first sealing layer 431 and the second sealing layer 432 can be adjusted. Specific details are not limited here.

[0083] Furthermore, the first sealing layer 431 has a TG (Glass Transition Temperature) of 90-130°C, and the second sealing layer 432 has a glass transition temperature of 150-180°C.

[0084] The CTE (Coefficient of Thermal Expansion) of the first sealing layer 431 is 10-40 PPM / ℃, and the CTE of the second sealing layer 432 is 5-15 PPM / ℃.

[0085] Specifically, the glass transition temperature is the critical temperature at which a material transitions from a glassy state to a highly elastic state. Within a temperature range of 90-130°C, the molecular structure of the first sealing layer changes, affecting its physical properties such as hardness, elasticity, and thermoplasticity. Similarly, within a temperature range of 150-180°C, the molecular structure of the second sealing layer changes, also affecting its physical properties such as hardness, elasticity, and thermoplasticity. The coefficient of thermal expansion refers to the range of a material's thermal expansion coefficient between 10 and 40 picometers per meter per degree Celsius. This coefficient of thermal expansion is an important parameter for measuring the thermal stability of a material. The smaller the number, the higher the thermal stability of the material. That is, the thermal stability of the second sealing layer 432 is higher than that of the first sealing layer 431, thus enabling the electronic device 40 to better protect the internally sealed electronic components 211.

[0086] By setting different glass transition temperatures and coefficients of thermal expansion for the first sealing layer 431 and the second sealing layer 432, the thermal stability of the second sealing layer 432 can be higher than that of the first sealing layer 431, thereby better protecting the internal electronic components 211.

[0087] Furthermore, the non-metallic inorganic content in the first sealing layer 431 is higher than that in the second sealing layer 432, which is beneficial to improving the thermal conductivity of the second sealing layer 432 formed on the electronic component 211 through the sealing process, thereby making the thermal conductivity of the second sealing layer 432 higher than that of the first sealing layer 431.

[0088] As shown in Figure 8a, the electronic component 211 is an elastic wave element 50, and there is a gap 47 between the elastic wave element 50 and the packaging substrate 212.

[0089] In a preferred embodiment of this embodiment, as shown in FIG9, the electronic device 40 further includes, for example, an external connection terminal 44, an electrode pad 45, and a bump 46.

[0090] Specifically, the external connection terminal 44 is disposed on the second surface 2122 of the packaging substrate 212 away from the elastic wave element (that is, the lower surface of the packaging substrate 212).

[0091] Electrode pads 45 are disposed on the upper surface of the packaging substrate 212, that is, on the side of the packaging substrate 212 close to the elastic wave element. The electrode pads 45 may be circular pads formed of copper or copper-containing alloys. In this embodiment, there may be multiple electrode pads 45, which are arranged at intervals on the upper surface of the packaging substrate 212.

[0092] The bumps 46 are disposed on the electrode pads 45 and located between the electrode pads 45 and the electronic component 211. In this embodiment, when there are multiple electrode pads 45, there are also multiple bumps 46, and the number of bumps 46 corresponds one-to-one with the number of electrode pads 45. That is, the bumps 46 are formed on the upper surface (the side facing away from the package substrate 212) of each electrode pad 45. The bumps 46 are, for example, gold bumps, and the electronic component 211 is mounted on the package substrate 212 by flip-chip bonding using the bumps 46. The electronic component 211 is electrically connected to the multiple electrode pads 45 via the multiple bumps 46.

[0093] Furthermore, it is understood that the foregoing embodiments are merely illustrative examples of the present invention. Provided that the technical features do not conflict, the structure is not contradictory, and the purpose of the invention is not violated, the technical solutions of the various embodiments can be arbitrarily combined and used.

[0094] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for packaging an electronic component, characterized in that, include: Resin processing step: A sealing raw material containing granular and / or powdered resin is placed in a concave container, and the sealing raw material is processed into a sheet resin by pressing the sealing raw material with a pressing part that fits into the concave container; Sealing step: With the sheet resin disposed in the concave container, a plurality of workpieces disposed on a workpiece holding sheet are sealed with the sheet resin, wherein the workpieces are an encapsulation substrate and electronic components bonded to the encapsulation substrate.

2. The packaging method according to claim 1, characterized in that, The electronic component is an elastic wave element, and there is a gap between the elastic wave element and the packaging substrate. The sealing process is performed while maintaining the gap.

3. The packaging method according to claim 1, characterized in that, In the resin processing step, the sealing raw material contains non-metallic inorganic matter; wherein, the resin processing step includes the following sub-steps: disposing of a first sealing raw material containing powder and / or granular resin in the concave container; pressing the first sealing raw material by the pressing part to process the first sealing raw material into a first sheet resin; disposing of a second sealing raw material containing powder and / or granular resin on the first sheet resin, and processing the second sealing raw material into a second sheet resin, wherein the non-metallic inorganic matter content of the second sealing raw material is higher than the non-metallic inorganic matter content of the first sealing raw material.

4. The packaging method according to claim 3, characterized in that, In the sealing process, with the first sheet resin and the second sheet resin disposed in the concave container, the first sheet resin and the second sheet resin are used to seal multiple electronic components disposed on the workpiece retaining sheet.

5. The packaging method according to claim 3, characterized in that, The sealing process is performed by pressing the plurality of workpieces into the first sheet resin and the second sheet resin while the first sheet resin and the second sheet resin are heated, from the time the first sheet resin and the second sheet resin begin to soften until they begin to solidify.

6. The packaging method according to claim 5, characterized in that, The time from the beginning of softening to the beginning of curing of the first sheet resin is longer than the time from the beginning of softening to the beginning of curing of the second sheet resin.

7. The packaging method according to claim 1 or 5, characterized in that, In the sealing process, the sheet resin is heated to soften it, and the electronic component is pressed into it so that the softened resin covers and surrounds the surface of the electronic component. The softened sheet resin is then heated to completely solidify on the surface of the electronic component, thereby sealing the electronic component together with the packaging substrate.

8. A packaging device for electronic components, characterized in that, include: A resin processing apparatus having a concave container for holding a sealing raw material containing granular and / or powdered resin; a pressurizing device having a pressing part that fits into the concave container and is optionally coupled to the resin processing apparatus for pressing the sealing raw material in the resin processing apparatus through the pressing part to obtain sheet resin; and a workpiece holding device having a workpiece holding plate that is optionally connected to the resin processing apparatus for mounting workpieces to be sealed onto the workpiece holding plate and moving them to the resin processing apparatus containing the sheet resin, thereby sealing multiple workpieces disposed on the workpiece holding plate with the sheet resin.

9. An electronic device, characterized in that, include: The packaging substrate has opposing first and second surfaces; Electronic components are disposed on the first surface of the packaging substrate; A sealing layer covers the electronic component and, together with the packaging substrate, seals the electronic component; wherein the sealing layer is a thermosetting resin, processed from granular and / or powdered resin.

10. The electronic device according to claim 9, characterized in that, The sealing layer includes a first sealing layer and a second sealing layer, wherein the second sealing layer is disposed between the electronic component and the first sealing layer, and the thermal conductivity of the second sealing layer is higher than that of the first sealing layer.

11. The electronic device according to claim 9, characterized in that, The sealing layer includes a first sealing layer and a second sealing layer. The second sealing layer is disposed between the electronic component and the first sealing layer. The content of non-metallic inorganic matter in the second sealing layer is higher than that in the first sealing layer.

12. The electronic device according to claim 9, characterized in that, The sealing layer includes a first sealing layer and a second sealing layer, wherein the second sealing layer is disposed between the electronic component and the first sealing layer, and the first sealing layer includes conductive filler and resin raw material.

13. The electronic device according to claim 9, characterized in that, The sealing layer includes a first sealing layer and a second sealing layer, wherein the second sealing layer is disposed between the electronic component and the first sealing layer, the glass transition temperature of the first sealing layer is 90-130°C, and the glass transition temperature of the second sealing layer is 150-180°C.

14. The electronic device according to claim 9, characterized in that, The sealing layer includes a first sealing layer and a second sealing layer, wherein the second sealing layer is disposed between the electronic component and the first sealing layer, the coefficient of thermal expansion of the first sealing layer is 10-40 PPM / ℃, and the coefficient of thermal expansion of the second sealing layer is 5-15 PPM / ℃.

15. The electronic device according to claim 9, characterized in that, The electronic component is an elastic wave element, and there is a gap between the elastic wave element and the packaging substrate.

16. The electronic device according to claim 9, characterized in that, The electronic device further includes: an external connection terminal disposed on the second surface of the packaging substrate; an electrode pad disposed on the side of the packaging substrate near the electronic component; and a bump disposed on the electrode pad and located between the electrode pad and the electronic component.

Images