Photosensitive chip packaging structure and preparation method thereof

Abstract

The invention relates to the technical field of semiconductor packaging, in particular to a photosensitive chip packaging structure and a preparation method thereof. According to the photosensitive chip packaging structure, a photosensitive area of a photosensitive chip structure and a corresponding optical channel carrier plate are oppositely stacked, so that external light enters the optical channel carrier plate from the outer side end face of the optical channel carrier plate and is transmitted to the photosensitive chip structure; the light sensing chip structure obtains external light rays in different directions through the light sensing area and the light channel carrier plates, the light sensing chip structure transmits obtained external light ray information to a main chip or other external devices, the direction of the external light rays is obtained, other complex packaging structures are not needed, and the cost is reduced. Finally, the photosensitive chip packaging structure which is small in thickness and is used for detecting the external light direction is obtained. Meanwhile, the optical channel carrier plates are arranged in an optical isolation mode through the plastic packaging layers, so that external light rays cannot be transmitted among the multiple optical channel carrier plate structures, and mutual interference is avoided.

Description

A photosensitive chip packaging structure and its fabrication method Technical Field

[0001] This invention relates to the field of semiconductor packaging technology, and in particular to a photosensitive chip packaging structure and its fabrication method. Background Technology

[0002] In existing photosensitive chip packaging structures, the photosensitive chip is in direct contact with the substrate and lacks the function of sensing the direction of the light source. As a result, in multi-light source environments, when light enters from different directions, the photosensitive chip packaging structure cannot distinguish the light sources from different directions, which affects its performance. Summary of the Invention

[0003] To address the aforementioned technical problems, this invention provides a photosensitive chip packaging structure and its fabrication method.

[0004] This application provides a photosensitive chip packaging structure, comprising: a substrate, a photosensitive structure, and a molding compound; the photosensitive structure is located on a first surface of the substrate, and the molding compound covers the photosensitive structure and the first surface of the substrate, the molding compound being opaque; the photosensitive structure includes a light channel carrier structure and a photosensitive chip structure; the light channel carrier structure includes a plurality of light channel carriers, each light channel carrier radiating in a different direction, and the sidewalls of the photosensitive chip packaging structure expose the outer end faces of the plurality of light channel carriers, the plurality of light channel carriers being optically isolated from each other; the photosensitive chip structure is electrically connected to the substrate, the photosensitive chip structure including at least one photosensitive area, the photosensitive area and the corresponding light channel carrier are stacked opposite each other, such that the photosensitive chip structure obtains external light from different directions through the photosensitive area and the plurality of light channel carriers.

[0005] Optionally, the light channel carrier structure is located between the substrate and the photosensitive chip structure, the first surface of the photosensitive chip structure having a photosensitive area corresponds to the first surface of the light channel carrier structure, and the second surface of the light channel carrier structure corresponds to the first surface of the substrate.

[0006] Optionally, the optical channel carrier has a first conductive post, and the optical channel carrier is electrically connected to the first surface of the substrate and the first surface of the photosensitive chip structure through the first conductive post, thereby realizing the electrical connection between the photosensitive chip structure and the substrate.

[0007] Optionally, the second surface of the photosensitive chip structure and the first surface of the substrate are electrically connected by metal leads to realize the electrical connection between the photosensitive chip structure and the substrate.

[0008] Optionally, the photosensitive chip structure is located between the light channel carrier structure and the substrate, the first surface of the light channel carrier structure corresponds to the first surface of the photosensitive chip structure having a photosensitive area, and the second surface of the photosensitive chip structure corresponds to the first surface of the substrate.

[0009] Optionally, the second surface of the photosensitive chip structure is provided with chip conductive bumps, and the photosensitive chip structure is electrically connected to the first surface of the substrate through the chip conductive bumps, thereby realizing the electrical connection between the photosensitive chip structure and the substrate.

[0010] Optionally, the first surface of the photosensitive chip structure and the substrate are electrically connected by metal leads to achieve electrical connection between the photosensitive chip structure and the substrate.

[0011] Optionally, the photosensitive structure further includes a sealing dam, which is located around the photosensitive area of ​​the photosensitive chip structure and the corresponding stacked area of ​​the light channel carrier, so that a cavity structure is formed between the photosensitive area of ​​the photosensitive chip structure and the first surface of the light channel carrier.

[0012] Optionally, the photosensitive structure further includes a light guide connection structure, which is located between the photosensitive area of ​​the photosensitive chip structure and the corresponding stacked area of ​​the light channel carrier.

[0013] Optionally, the photosensitive chip structure is a single unit, and the first surface of the photosensitive chip structure includes a photosensitive area, which is stacked opposite to several corresponding optical channel carriers.

[0014] Optionally, the photosensitive chip structure is a single unit, and the first surface of the photosensitive chip structure includes a plurality of photosensitive areas, the same number as the plurality of optical channel carriers, and the plurality of photosensitive areas are stacked opposite to the corresponding optical channel carriers.

[0015] Optionally, the number of photosensitive chip structures is the same as the number of optical channel carriers, and the first surface of each photosensitive chip structure includes a photosensitive area, which is stacked opposite to the corresponding optical channel carrier.

[0016] Optionally, the substrate surface may also have a main chip, which is electrically connected to the photosensitive chip structure and the substrate.

[0017] Optionally, the main chip is disposed in the middle region of the plurality of optical channel carriers or in the surrounding region of the photosensitive structure.

[0018] Optionally, the optical channel carrier plate is four in number and arranged in a cross shape.

[0019] Optionally, the optical channel carrier plates are four in a staggered "+" arrangement.

[0020] Optionally, the second surface of the substrate has substrate conductive bumps for electrically connecting the photosensitive chip packaging structure and external devices.

[0021] The present invention also provides a method for fabricating a photosensitive chip packaging structure, comprising: providing a substrate; forming a photosensitive structure and a molding compound on a first surface of the substrate, wherein the photosensitive structure includes a light channel carrier structure and a photosensitive chip structure; the light channel carrier structure includes a plurality of light channel carriers, each light channel carrier radiating in a different direction; the photosensitive chip structure is electrically connected to the substrate, the photosensitive chip structure includes at least one photosensitive area, the photosensitive area and the corresponding light channel carrier are stacked opposite to each other; the molding compound covers the photosensitive structure and the first surface of the substrate, the molding compound is opaque, thereby isolating the plurality of light channel carriers from each other, and the sidewalls of the photosensitive chip packaging structure expose the outer end faces of the plurality of light channel carriers.

[0022] Optionally, the light channel carrier structure is formed between the substrate and the photosensitive chip structure, the first surface of the photosensitive chip structure having a photosensitive area corresponds to the first surface of the light channel carrier structure, and the second surface of the light channel carrier structure is disposed opposite to the first surface of the substrate.

[0023] Optionally, the step of forming a photosensitive structure on the first surface of the substrate includes: setting a light channel carrier structure on the first surface of the substrate, wherein a second surface of the light channel carrier structure is disposed opposite to the first surface of the substrate; setting the photosensitive chip structure on the first surface of the light channel carrier structure, wherein the photosensitive area of ​​the first surface of the photosensitive chip structure is disposed opposite to the first surface of the light channel carrier structure; and electrically connecting the photosensitive chip structure and the first surface of the substrate.

[0024] Optionally, the step of electrically connecting the photosensitive chip structure and the first surface of the substrate includes: electrically connecting the second surface of the photosensitive chip structure and the first surface of the substrate through metal leads.

[0025] Optionally, the step of electrically connecting the photosensitive chip structure and the first surface of the substrate includes: the light channel carrier in the light channel carrier structure has a first conductive post, and the photosensitive chip structure is electrically connected to the first surface of the substrate through the first conductive post of the light channel carrier, thereby realizing the electrical connection between the photosensitive chip structure and the substrate.

[0026] Optionally, the photosensitive chip structure is formed between the light channel carrier structure and the substrate, the first surface of the light channel carrier structure corresponds to the first surface of the photosensitive chip structure having a photosensitive area, and the second surface of the photosensitive chip structure is disposed opposite to the first surface of the substrate.

[0027] Optionally, the step of forming a photosensitive structure on the first surface of the substrate includes: setting a photosensitive chip structure on the first surface of the substrate, wherein a second surface of the photosensitive chip structure is disposed opposite to the first surface of the substrate; setting the light channel carrier structure on the first surface of the photosensitive chip structure, wherein the photosensitive area of ​​the first surface of the photosensitive chip structure is disposed opposite to the first surface of the light channel carrier structure; and electrically connecting the photosensitive chip structure and the first surface of the substrate.

[0028] Optionally, the step of electrically connecting the photosensitive chip structure and the first surface of the substrate includes: electrically connecting the first surface of the photosensitive chip structure and the first surface of the substrate through metal leads.

[0029] Optionally, the step of electrically connecting the photosensitive chip structure and the first surface of the substrate includes: electrically connecting the second surface of the photosensitive chip structure and the first surface of the substrate through conductive bumps.

[0030] Optionally, it also includes forming a sealed dam around the photosensitive area of ​​the photosensitive chip structure and the corresponding stacked area of ​​the optical channel carrier, such that a cavity structure is formed between the photosensitive area of ​​the photosensitive chip structure and the first surface of the optical channel carrier.

[0031] Optionally, it also includes forming a light guide connection structure, which is formed between the photosensitive area of ​​the photosensitive chip structure and the corresponding stacked area of ​​the light channel carrier.

[0032] Optionally, the step of forming a photosensitive structure and a molding layer on the first surface of the substrate includes: the first surface of the substrate has a plurality of photosensitive encapsulation areas; a plurality of optical channel carrier bodies are disposed corresponding to the photosensitive encapsulation areas on the first surface of the substrate; the plurality of optical channel carrier bodies corresponding to each photosensitive encapsulation area are radiating in different directions, and the optical channel carrier bodies span adjacent photosensitive encapsulation areas; the photosensitive chip structure is disposed on the first surface of the optical channel carrier body within the photosensitive encapsulation area; the first surface of the photosensitive area of ​​the photosensitive chip structure corresponds to the first surface of the optical channel carrier body; the photosensitive chip structure is electrically connected to the substrate; a molding material layer is formed on the optical channel carrier body, the photosensitive chip structure, and the first surface of the substrate; a plurality of discrete photosensitive chip encapsulation structures are formed by cutting; the optical channel carrier body is cut to form a disconnected optical channel carrier; the sidewalls of the photosensitive chip encapsulation structure expose the outer end faces of a plurality of optical channel carriers.

[0033] Optionally, the step of forming a photosensitive structure and a molding layer on the first surface of the substrate includes: the first surface of the substrate has a plurality of photosensitive encapsulation regions, and a plurality of photosensitive chip structures are correspondingly disposed in the photosensitive encapsulation regions on the first surface of the first surface of the photosensitive chip structures within the photosensitive encapsulation regions; a plurality of optical channel carrier bodies are disposed on the first surface of the photosensitive chip structures within the photosensitive encapsulation regions, the plurality of optical channel carrier bodies within one photosensitive encapsulation region are radiating in different directions, and the optical channel carrier bodies span adjacent photosensitive encapsulation regions; the photosensitive chip structures are electrically connected to the substrate; a molding material layer is formed on the optical channel carrier bodies, the photosensitive chip structures and the first surface of the substrate; a plurality of discrete photosensitive chip encapsulation structures are formed by cutting, the optical channel carrier bodies are cut to form disconnected optical channel carriers, and the sidewalls of the photosensitive chip encapsulation structures expose the outer end faces of a plurality of optical channel carriers.

[0034] In summary, the advantages and beneficial effects of the present invention are as follows: This application provides a photosensitive chip packaging structure and its fabrication method. The photosensitive chip packaging structure includes a substrate, a photosensitive structure, and a molding compound. The photosensitive structure is located on a first surface of the substrate, and the molding compound covers the photosensitive structure and the first surface of the substrate. The molding compound is opaque. The photosensitive structure includes a light channel carrier structure and a photosensitive chip structure. The light channel carrier structure includes a plurality of light channel carriers, each of which is radiating in a different direction. The sidewalls of the photosensitive chip packaging structure expose the outer end faces of the plurality of light channel carriers, and the plurality of light channel carriers are optically isolated from each other. The photosensitive chip structure is electrically connected to the substrate. The photosensitive chip structure includes at least one photosensitive area, and the photosensitive area and the corresponding light channel carrier are stacked opposite each other, so that the photosensitive chip structure obtains external light from different directions through the photosensitive area and the plurality of light channel carriers.

[0035] The described photosensitive chip packaging structure stacks the photosensitive areas of the photosensitive chip structure with corresponding optical channel carriers. External light enters the optical channel carrier from its outer end face, and the carrier transmits the light to the chip structure. The chip structure receives external light from different directions through the photosensitive areas and the multiple optical channel carriers. This information is then transmitted to the main chip or other external devices to determine the direction of the external light. This eliminates the need for complex packaging structures, resulting in a relatively thin photosensitive chip packaging structure for detecting the direction of external light. Furthermore, optical isolation between the optical channel carriers prevents external light from interfering with the transmission between the carrier structures.

[0036] By providing a sealing barrier, light-guiding connection structure, or adhesive film with a certain thickness or a small thickness in the area where the photosensitive area of ​​the photosensitive chip structure is stacked opposite to the corresponding optical channel carrier, subsequent encapsulation materials are prevented from entering between the photosensitive chip structure and the optical channel carrier, thus preserving the transmission path of external light from the optical channel carrier to the photosensitive chip structure. When the photosensitive chip encapsulation structure is applied, the photosensitive chip structure obtains external light from different directions through the photosensitive area and several optical channel carriers. Attached Figure Description

[0037] Figure 1 is a top view of a photosensitive chip packaging structure provided in an embodiment of the present invention; Figure 2 is a cross-sectional view of a photosensitive chip packaging structure of Figure 1 along the A1A2 direction; Figure 3 is a top view of a photosensitive chip packaging structure provided in another embodiment of the present invention; Figure 4 is a cross-sectional view of a photosensitive chip packaging structure provided in another embodiment of the present invention; Figure 5 is a cross-sectional view of a photosensitive chip packaging structure provided in another embodiment of the present invention; Figure 6 is a top view of a photosensitive chip packaging structure provided in another embodiment of the present invention; Figure 7 is a cross-sectional view of a photosensitive chip packaging structure of Figure 6 along the B1B2 direction; Figure 8 is a photosensitive chip packaging structure provided in another embodiment of the present invention. Figure 9 is a cross-sectional view along the C1C2 direction of one of the photosensitive chip packaging structures in Figure 8; Figure 10 is a top view of a photosensitive chip packaging structure provided in another embodiment of the present invention; Figure 11 is a cross-sectional view along the D1D2 direction of one of the photosensitive chip packaging structures in Figure 10; Figure 12 is a top view of a photosensitive chip packaging structure provided in another embodiment of the present invention; Figure 13 is a top view of a photosensitive chip packaging structure provided in another embodiment of the present invention; Figures 14-20 are schematic flowcharts of a method for preparing a photosensitive chip packaging structure provided in an embodiment of the present invention; Figure 21 is a schematic flowchart of a method for preparing a photosensitive chip packaging structure provided in an embodiment of the present invention. Detailed Implementation

[0038] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0039] It should be understood that terms such as “first” and “second” used herein to describe various elements, components, regions, layers, and / or sections should not be limited by these terms. These terms may be used only to distinguish one element, component, region, layer, or section from another. For example, the use of terms such as “first” and “second” herein does not imply order or sequence unless the context clearly indicates otherwise. For ease of description, spatially relative terms such as “upper” and “lower” may be used herein to describe the relationship of one element or feature to other elements or features as shown in the accompanying drawings. It should be understood that spatially relative terms are intended to include not only the orientations shown in the accompanying drawings but also different orientations of the device in use or operation.

[0040] In this application, unless otherwise expressly specified and limited, the terms "connected" and "connected" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0041] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Furthermore, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples. It should be noted that the terms "comprising" and "having," and their variations, used in this application are intended to cover non-exclusive inclusion.

[0042] This invention provides a photosensitive chip packaging structure, as shown in Figures 1 and 2, comprising: a substrate 100, a photosensitive structure, and a molding compound 300; the photosensitive structure is located on a first surface of the substrate 100, and the molding compound 300 covers the photosensitive structure and the first surface of the substrate 100, and the molding compound 300 is opaque; the photosensitive structure includes a light channel carrier structure and a photosensitive chip structure 10; the light channel carrier structure includes a plurality of light channel carriers 30, each light channel carrier 30 radiating in a different direction, and the sidewalls of the photosensitive chip packaging structure expose the outer end faces of the plurality of light channel carriers 30, and the plurality of light channel carriers 30 are optically isolated from each other; the photosensitive chip structure 10 is electrically connected to the substrate 100, and the photosensitive chip structure 10 includes at least one photosensitive region 11, the photosensitive region 11 and the corresponding light channel carrier are stacked opposite each other, so that the photosensitive chip structure 10 obtains external light from different directions through the photosensitive region 11 and the plurality of light channel carriers 30.

[0043] Specifically, in this embodiment of the invention, the substrate 100 is a silicon substrate, a silicon carbide substrate, a sapphire substrate, a ceramic substrate, a copper-clad laminate, a redistribution layer, or other suitable substrate.

[0044] In other embodiments, the substrate may also be a semiconductor packaging structure substrate having one or more chip packaging structures.

[0045] In other embodiments, the semiconductor packaging structure substrate may also have one or more photosensitive structures according to the present invention.

[0046] In this embodiment of the invention, the substrate 100 includes a first surface and a second surface. The second surface of the substrate 100 has substrate conductive bumps 101 for electrically connecting the photosensitive chip packaging structure and external devices. The photosensitive chip structure transmits the obtained external light information to the external devices to obtain the direction of the external light, or transmits information with the existing system to achieve efficient operation of the system.

[0047] In this embodiment of the invention, the substrate conductive bump 101 is a solder ball, gold block, copper pillar or other suitable conductive bump.

[0048] In this embodiment of the invention, the substrate 100 further includes a substrate line 102, which is electrically connected to the substrate conductive bump 101 on the second surface of the substrate.

[0049] In an embodiment of the present invention, as shown in FIG2, the optical channel carrier structure includes a plurality of optical channel carriers 30, each optical channel carrier 30 being radiating in a different direction, and the sidewall of the photosensitive chip packaging structure exposing the outer end faces of the plurality of optical channel carriers 30, and the plurality of optical channel carriers 30 being optically isolated from each other.

[0050] Furthermore, in order to increase the light receiving area and ensure sufficient light under different lighting conditions, the light channel carrier can also be trapezoidal, with the width of the light channel carrier exposed on the sidewall of the photosensitive chip packaging structure being greater than the width inside.

[0051] Furthermore, the optical channel carrier can also have multiple sides exposed on the sidewalls of the photosensitive chip packaging structure, thereby allowing the photosensitive chip structure to receive more external light. For example, as shown in Figure 3, the optical channel carrier can be rectangular or square, with two sides exposed, and one optical channel carrier can simultaneously detect light from both sides.

[0052] In this embodiment of the invention, the optical channel carrier 30 is a glass carrier.

[0053] In other embodiments, the light channel carrier is a monocrystalline silicon carrier or other light-transmitting carrier.

[0054] In this embodiment of the invention, the sidewall of the photosensitive chip packaging structure exposes the outer end faces of several light channel carriers 30. The outer end faces of the light channel carriers 30 serve as the entrances for external light to enter the light channel carriers 30. When the photosensitive chip packaging structure is applied, external light enters the light channel carriers 30 from the outer end faces of the several light channel carriers 30, passes through the several light channel carriers 30 and the photosensitive area 11, and reaches the photosensitive chip structure, thereby enabling the photosensitive chip structure to obtain external light from different directions.

[0055] In this embodiment of the invention, a plurality of optical channel carrier plates 30 are arranged in a radiating manner facing different directions, so that external light can enter the optical channel carrier plates 30 from different directions (i.e., the orientation of the plurality of optical channel carrier plates 30), and the optical channel carrier plates 30 transmit the external light to the photosensitive chip structure 10, so that the photosensitive chip structure 10 obtains external light from different directions.

[0056] In this embodiment of the invention, the plurality of optical channel carriers 30 are optically isolated from each other to prevent external light from entering the other plurality of optical channel carriers after being transmitted to the photosensitive chip structure, thereby avoiding interference between the other plurality of photosensitive chip structures.

[0057] In an embodiment of the present invention, as shown in FIG2, the optical channel carrier structure is located between the substrate and the photosensitive chip structure. The first surface of the photosensitive chip structure having a photosensitive region 11 corresponds to the first surface of the optical channel carrier structure, and the second surface of the optical channel carrier structure corresponds to the first surface of the substrate 100.

[0058] In an embodiment of the present invention, as shown in FIG2, the optical channel carrier 30 has a first conductive post 31. The optical channel carrier 30 is electrically connected to the substrate circuit 102 of the substrate 100 and the first surface of the photosensitive chip structure 10 through the first conductive post 31, thereby realizing the electrical connection between the photosensitive chip structure 10 and the substrate 100.

[0059] Specifically, a first conductive bump 41 is provided in the pad area outside the photosensitive area of ​​the photosensitive chip structure 10, and a second conductive bump 42 is provided in the area of ​​the first conductive post 30 on the second surface of the light channel carrier 30. The photosensitive chip structure 10 and the substrate 100 are electrically connected through the first conductive bump 41, the second conductive bump 42 and the first conductive post 31.

[0060] In this embodiment of the invention, the first conductive bump 41 and the second conductive bump 42 are solder balls, gold blocks, copper pillars or other suitable conductive materials.

[0061] In other embodiments, the optical channel carrier does not have a first conductive pillar, and the second surface of the photosensitive chip structure and the first surface of the substrate are electrically connected by metal leads to realize the electrical connection between the photosensitive chip structure and the substrate.

[0062] In some embodiments, the metal lead may be aluminum wire, gold wire, silver wire, copper wire, etc.

[0063] In this embodiment of the invention, the photosensitive chip structure is a single photosensitive chip or a packaged structure of one or more photosensitive chips, and the photosensitive chip corresponds to the photosensitive area of ​​the photosensitive chip structure.

[0064] In another embodiment, as shown in FIG4, the photosensitive chip structure 10 is located between the light channel carrier structure and the substrate 100, the first surface of the light channel carrier structure corresponds to the first surface of the photosensitive chip structure 10 having a photosensitive area, and the second surface of the photosensitive chip structure corresponds to the first surface of the substrate 100.

[0065] Specifically, the second surface of the photosensitive chip structure 10 has a pad area, and the pad area is provided with a chip conductive bump 44. The second surface of the photosensitive chip structure 10 is electrically connected to the first surface of the substrate 100 through the chip conductive bump 44, thereby realizing the electrical connection between the photosensitive chip structure and the substrate.

[0066] In this embodiment of the invention, the conductive bump 44 of the chip is a solder ball, gold block, copper pillar or other suitable conductive material.

[0067] In other embodiments, the first surface of the photosensitive chip structure has a pad area, the second surface of the photosensitive chip structure is directly disposed on the first surface of the substrate, and the first surface of the photosensitive chip structure with the pad area and the substrate are electrically connected by metal leads to realize the electrical connection between the photosensitive chip structure and the substrate.

[0068] In this embodiment of the invention, as shown in FIG2, the photosensitive chip packaging structure further includes a sealing dam 20. The sealing dam 20 is located around the photosensitive area 11 of the photosensitive chip structure and the corresponding stacked area of ​​the optical channel carrier 30. The sealing dam is designed to have a certain height, so that a cavity structure is formed between the photosensitive area 11 of the photosensitive chip structure and the first surface of the optical channel carrier 30. The height of the sealing dam 20 is determined according to the actual application scenario to ensure that it can effectively play the functions of blocking, supporting or separating, preventing subsequent packaging materials from entering the cavity structure between the photosensitive chip structure and the optical channel carrier, and preserving the transmission path of external light from the optical channel carrier to the photosensitive chip structure. When the photosensitive chip packaging structure is applied, the photosensitive chip structure 10 obtains external light from different directions through the photosensitive area 11, the cavity structure 21, and several optical channel carriers 30.

[0069] In this embodiment of the invention, a sealing material is disposed around the photosensitive area 11 on the first surface of the photosensitive chip structure and the corresponding stacked area of ​​the optical channel carrier 30 to form a sealing dam 20, thereby forming a cavity structure 21 between the photosensitive area 11 of the photosensitive chip structure and the first surface of the optical channel carrier 30. The sealing dam 20 prevents subsequent encapsulation material from entering the cavity structure between the photosensitive chip structure and the optical channel carrier, thus preserving the transmission path of external light from the optical channel carrier to the photosensitive chip structure.

[0070] In this embodiment of the invention, the sealing dam is made of an adhesive. This choice is based on the adhesive’s excellent bonding properties and plasticity, which allows the sealing dam 20 to adhere firmly to the desired location while maintaining the stability and durability of the structure.

[0071] Furthermore, the adhesive is not limited to a specific type, but can be flexibly selected according to actual usage conditions and performance requirements. In some embodiments, the adhesive is a common glue, which is easy to use, cures quickly, and has high bonding strength, making it suitable for bonding various materials. In other embodiments, other types of adhesives can be selected, such as adhesives with special weather resistance, high temperature resistance, or chemical corrosion resistance, to meet the usage requirements in specific environments. In summary, the material selection of the sealing dam 20 fully considers various factors in practical applications to ensure that its performance reaches its optimal state.

[0072] In another embodiment, as shown in FIG5, the photosensitive structure further includes a light guide connection structure. The light guide connection structure is located between the photosensitive area of ​​the photosensitive chip structure and the corresponding stacked area of ​​the optical channel carrier. The light guide connection structure prevents subsequent encapsulation material from entering between the photosensitive chip structure and the optical channel carrier, thus preserving the transmission path of external light from the optical channel carrier to the photosensitive chip structure. When the photosensitive chip encapsulation structure is applied, the photosensitive chip structure obtains external light from different directions through the photosensitive area, the light guide connection structure, and the plurality of optical channel carriers.

[0073] Specifically, the light guide connection structure is formed by curing transparent adhesive, light guide glass plate, adhesive film, or other light-transmitting materials.

[0074] In one embodiment, the photosensitive chip structure is fixed to the optical channel carrier by an adhesive film. The adhesive film is a die-attach film, also known as DAF (Die Attach Film), a widely used chip bonding film in semiconductor packaging. Die-attach films, with their transparent optical properties, excellent adhesion performance, good thermal and chemical stability, and adaptability to various materials, have become the preferred material for bonding chips to substrates and between chips. Of course, in practical applications, other types of adhesive films can be selected based on specific packaging requirements, process conditions, and cost considerations. These adhesive films may have different adhesion, thickness, temperature range, or special functions to meet the requirements of different packaging designs and application scenarios. In short, the selection of adhesive films requires comprehensive consideration of multiple factors to ensure the reliability and performance of the packaged products.

[0075] This application provides a sealing barrier, light-guiding connection structure, or adhesive film of a certain thickness or a small thickness in the area where the photosensitive area of ​​the photosensitive chip structure is stacked with the corresponding optical channel carrier. This prevents subsequent encapsulation materials from entering between the photosensitive chip structure and the optical channel carrier, while preserving the transmission path of external light from the optical channel carrier to the photosensitive chip structure. When the photosensitive chip encapsulation structure is applied, the photosensitive chip structure obtains external light from different directions through the photosensitive area and several optical channel carriers.

[0076] In this embodiment of the invention, as shown in FIG2, the photosensitive chip packaging structure further includes a molding compound 300. The molding compound covers the first surface of the photosensitive structure and the substrate 100. The molding compound 300 is opaque, ensuring that external light can only enter the photosensitive chip structure through the exposed outer end faces of the plurality of light channel carriers 30, thus preventing external light from entering the photosensitive chip structure 10 from areas other than the outer end faces of the plurality of light channel carriers 30 exposed on the sidewalls of the photosensitive chip packaging structure, thereby affecting the performance of the photosensitive chip packaging structure.

[0077] In this embodiment of the invention, the molding layer 300 is formed by a molding process.

[0078] In other embodiments, the molding process for forming the encapsulation layer can be injection molding or transfer molding.

[0079] In this embodiment of the invention, the material of the molding layer 300 can be epoxy resin, polyimide resin, benzocyclobutene resin or polybenzoxazole resin.

[0080] In this embodiment of the invention, when the photosensitive chip packaging structure is applied, the molding layer 300 prevents external light from entering the photosensitive area of ​​the photosensitive chip structure from areas other than the outer end face of the light channel carrier plate exposed to the sidewall of the photosensitive chip packaging structure, ensuring that external light can only travel from the light channel carrier plate 30 to the photosensitive chip via the transmission path.

[0081] In an embodiment of the present invention, the photosensitive chip packaging structure has a photosensitive chip structure, the first surface of the photosensitive chip structure includes a plurality of photosensitive areas, the same number as the plurality of optical channel carriers, the plurality of photosensitive areas are stacked opposite to the corresponding optical channel carriers, and the photosensitive areas are used to receive external light.

[0082] Specifically, as shown in Figures 1 and 2, there are four optical channel carriers 30 arranged in a cross shape, and there is one photosensitive chip structure 10. The first surface of the photosensitive chip structure 10 includes four photosensitive areas 11. The four photosensitive areas 11 of the photosensitive chip structure 10 are arranged opposite to the corresponding first surfaces of the optical channel carriers 30. The first surface of the photosensitive chip structure 10 is electrically connected to the first surface of the optical channel carrier 30 through a first conductive bump 41. The second surface of the optical channel carrier 30 is electrically connected to the first surface of the substrate 100 through a second conductive bump 42.

[0083] In another embodiment, the photosensitive chip structure is a single unit, and the first surface of the photosensitive chip structure includes a photosensitive area, which is stacked opposite to several corresponding optical channel carriers.

[0084] Specifically, as shown in Figures 6 and 7, there are four optical channel carrier plates 30 arranged in a cross shape, and one photosensitive chip structure 10. The first surface of the photosensitive chip structure 10 includes four photosensitive areas 11, which are disposed opposite to the corresponding first surfaces of the optical channel carrier plates 30. The first surface of the photosensitive chip structure 10 is electrically connected to the first surface of the optical channel carrier plate 30 through a first conductive bump 41, and the second surface of the optical channel carrier plate 30 is electrically connected to the first surface of the substrate 100 through a second conductive bump 42.

[0085] In another embodiment, the number of photosensitive chip structures is the same as the number of optical channel carriers, and the first surface of each photosensitive chip structure includes a photosensitive area, which is stacked opposite to the corresponding optical channel carrier.

[0086] Specifically, as shown in Figures 8 and 9, there are four optical channel carrier plates 30 arranged in a cross shape, and four photosensitive chip structures 10. The first surface of each photosensitive chip structure 10 includes a photosensitive area 11. The photosensitive area 11 is disposed opposite to the first surface of the corresponding optical channel carrier plate 30. The first surface of the photosensitive chip structure 10 is electrically connected to the first surface of the optical channel carrier plate 30 through the first conductive bump 41. The second surface of the optical channel carrier plate 30 is electrically connected to the first surface of the substrate 100 through the second conductive bump 42.

[0087] In another embodiment, the substrate surface also has a main chip, which is electrically connected to the photosensitive chip structure and the substrate. The main chip obtains the direction of the external light from the external light information obtained by the photosensitive chip structure.

[0088] Specifically, the main chip is disposed in the middle region of several optical channel carriers, and the main chip is electrically connected to the substrate and the photosensitive chip structure through a third conductive bump.

[0089] Furthermore, as shown in Figures 10 and 11, there are four optical channel carriers 30 arranged in a cross shape. A main chip 60 is disposed in the middle area of ​​the four optical channel carriers 30. The first surface of the main chip 60 is disposed opposite to the first surface of the substrate 100. The main chip 60 is electrically connected to the substrate 100 and the photosensitive chip structure 10 through a third conductive bump. There are four photosensitive chip structures 10. The first surface of each photosensitive chip structure 10 includes a photosensitive area 11. The photosensitive area 11 is disposed opposite to the first surface of the corresponding optical channel carrier 30. The first surface of the photosensitive chip structure 10 is electrically connected to the first surface of the optical channel carrier 30 through the first conductive bump 41. The second surface of the optical channel carrier 30 is electrically connected to the first surface of the substrate 100 through the second conductive bump 42.

[0090] In another embodiment, as shown in FIG12, the main chip is disposed in the area surrounding the photosensitive structure, and the main chip is electrically connected to the substrate 100 and the photosensitive chip structure through a third conductive bump.

[0091] In another embodiment, as shown in FIG13, there are four optical channel carriers 30 arranged in a staggered "+" pattern, and there is one photosensitive chip structure 10 with a first surface including four photosensitive areas 11. The four photosensitive areas 11 of the photosensitive chip structure 10 are arranged opposite to the first surface of the corresponding optical channel carrier 30.

[0092] In another embodiment, there are four optical channel carrier structures arranged in a staggered "+" pattern, and there are four photosensitive chip structures. The first surface of each photosensitive chip structure includes a photosensitive area, and the photosensitive area is stacked opposite to the corresponding optical channel carrier.

[0093] In other embodiments, the number of optical channel carriers is five, six, eight, twelve, or other suitable quantities. The plurality of optical channel carriers are evenly arranged to ensure that the propagation path and angle of external light in different optical channel carriers are consistent, making the propagation direction of light in the optical channel carriers more regular and predictable, reducing the deviation in light direction judgment caused by channel position deviation, and improving the accuracy of light direction judgment.

[0094] The present invention also provides a method for fabricating a photosensitive chip packaging structure, as shown in FIG21, comprising: step S10, providing a substrate; step S20, forming a photosensitive structure and a molding compound on a first surface of the substrate, wherein the photosensitive structure includes a light channel carrier structure and a photosensitive chip structure; the light channel carrier structure includes a plurality of light channel carriers, each light channel carrier radiating in a different direction; the photosensitive chip structure is electrically connected to the substrate, the photosensitive chip structure includes at least one photosensitive area, the photosensitive area and the corresponding light channel carrier are stacked opposite to each other; the molding compound covers the photosensitive structure and the first surface of the substrate, the molding compound is opaque, thereby isolating the plurality of light channel carriers from each other, and the sidewalls of the photosensitive chip packaging structure expose the outer end faces of the plurality of light channel carriers.

[0095] Specifically, step S10 is performed, as shown in Figure 14, by providing a substrate 100.

[0096] In this embodiment of the invention, the substrate 100 includes a first surface and a second surface; the first surface of the substrate 100 has a light channel region, which is used for subsequent placement of a light channel carrier plate; the second surface of the substrate 100 has substrate conductive bumps 101, which are used to electrically connect the photosensitive chip packaging structure and external devices, and obtain the direction of external light by using the information of external light obtained by the photosensitive chip structure through external devices, or to transmit information with existing systems to achieve efficient operation of the system.

[0097] In this embodiment of the invention, the substrate conductive bump 101 is a solder ball, a gold block, or other suitable conductive bump.

[0098] In this embodiment of the invention, the substrate 100 further includes a substrate circuit 102, which is electrically connected to the substrate conductive bumps 101 on the second surface of the substrate.

[0099] Step S20 is performed, as shown in Figures 15 to 20, to form a photosensitive structure and a molding layer 300 on the first surface of the substrate 100.

[0100] The photosensitive structure includes a light channel carrier plate structure and a photosensitive chip structure 10. The light channel carrier plate structure includes a plurality of light channel carrier plates 30, each of which is radiating in a different direction. The photosensitive chip structure 10 is electrically connected to the substrate 100. The photosensitive chip structure 10 includes at least one photosensitive area 11, which is stacked opposite to the corresponding light channel carrier plate 30. The molding layer 300 covers the first surface of the photosensitive structure 10 and the substrate 100. The molding layer 300 is opaque, which provides optical isolation between the plurality of light channel carrier plates 30. The sidewalls of the photosensitive chip encapsulation structure expose the outer end faces of the plurality of light channel carrier plates 30.

[0101] In this embodiment of the invention, as shown in FIG15, a plurality of optical channel carrier plates 30 are arranged in a radiating manner facing different directions, so that external light can enter the optical channel carrier plates 30 from different directions (i.e., the orientation of the plurality of optical channel carrier plates 30), and the optical channel carrier plates 30 transmit the external light to the photosensitive chip structure 10, so that the photosensitive chip structure 10 obtains external light from different directions.

[0102] In this embodiment of the invention, the plurality of optical channel carriers 30 are isolated from each other, that is, the plurality of optical channel carriers 30 do not contact each other. This allows for optical isolation between the plurality of optical channel carriers 30 by means of a molding compound, preventing external light from entering through the outer end faces of some of the optical channel carriers 30 and then being transmitted out through the inner end faces of some of the optical channel carriers 30 to enter the other plurality of optical channel carriers, thus avoiding interference between the plurality of photosensitive chip structures.

[0103] In this embodiment of the invention, the optical channel carrier is a glass carrier.

[0104] In other embodiments, the light channel carrier is a monocrystalline silicon carrier or other light-transmitting carrier.

[0105] In this embodiment of the invention, the light channel carrier structure is formed between the substrate and the photosensitive chip structure, the first surface of the photosensitive chip structure having a photosensitive area corresponds to the first surface of the light channel carrier structure, and the second surface of the light channel carrier structure is disposed opposite to the first surface of the substrate.

[0106] Specifically, the step of forming the photosensitive structure on the first surface of the substrate includes: setting a light channel carrier structure on the first surface of the substrate, with the second surface of the light channel carrier structure being disposed opposite to the first surface of the substrate; setting the photosensitive chip structure on the first surface of the light channel carrier structure, with the photosensitive area of ​​the first surface of the photosensitive chip structure being disposed opposite to the first surface of the light channel carrier structure; and electrically connecting the photosensitive chip structure and the first surface of the substrate.

[0107] Further, as shown in Figures 15 and 16, the step of forming the photosensitive structure on the first surface of the substrate 100 includes: step S211, providing a plurality of light channel carrier plates 30, each light channel carrier plate 30 having a first surface and a second surface opposite to the first surface, the second surface of the light channel carrier plate 30 being provided with a second conductive bump 42, and the light channel carrier plate 30 having a first conductive post 31, the first conductive post 31 and the second conductive bump 42 being disposed opposite to each other; step S212, disposing the light channel carrier plate 30 in the light channel region of the first surface of the substrate 100, the light channel carrier plate 30 being disposed in the first... The two surfaces are disposed opposite to the first surface of the substrate 100 and the plurality of optical channel carriers 30 are isolated from each other. In this embodiment of the invention, the plurality of optical channel carriers 30 are isolated from each other, that is, the plurality of optical channel carriers 30 do not contact each other, so that optical isolation is subsequently achieved between the plurality of optical channel carriers 30 by means of a molding compound, preventing external light from entering through the outer end face of one of the plurality of optical channel carriers 30 and then being transmitted out through the inner end face of the plurality of optical channel carriers 30 to enter the other plurality of optical channel carriers, thereby avoiding interference between the plurality of photosensitive chip structures.

[0108] Step S213: Provide a photosensitive chip structure 10. The first surface of the photosensitive chip structure 10 includes a plurality of photosensitive areas and a pad area other than the photosensitive areas. The pad area of ​​the first surface of the photosensitive chip structure 10 is provided with a first conductive bump 41. Step S214: Deposit the photosensitive chip structure 10 on the first surface of the light channel carrier. Each photosensitive area of ​​the first surface of the photosensitive chip structure 10 is stacked opposite to the corresponding light channel carrier to form the photosensitive structure.

[0109] In this embodiment of the invention, the photosensitive chip structure 10 is electrically connected to the first surface of the substrate through the first conductive post 31, the first conductive bump 41, and the second conductive bump 42.

[0110] In other embodiments, when there is no first conductive bump between the first surface of the light channel carrier and the first surface of the photosensitive chip structure, and no second conductive bump between the second surface of the light channel carrier and the first surface of the substrate, and the second surface of the light channel carrier is directly disposed on the first surface of the substrate, the second surface of the photosensitive chip structure and the first surface of the substrate are electrically connected through metal leads to realize the electrical connection between the photosensitive chip structure and the substrate.

[0111] In other embodiments, the photosensitive chip structure is formed between the light channel carrier structure and the substrate, the first surface of the light channel carrier structure corresponds to the first surface of the photosensitive chip structure having a photosensitive area, and the second surface of the photosensitive chip structure is disposed opposite to the first surface of the substrate.

[0112] Specifically, the step of forming a photosensitive structure on the first surface of the substrate includes: setting a photosensitive chip structure on the first surface of the substrate, wherein a second surface of the photosensitive chip structure is disposed opposite to the first surface of the substrate, and the photosensitive chip structure and the first surface of the substrate are electrically connected; setting the light channel carrier structure on the first surface of the photosensitive chip structure, wherein the photosensitive area of ​​the first surface of the photosensitive chip structure is disposed opposite to the first surface of the light channel carrier structure.

[0113] Further, the step of forming the photosensitive structure on the first surface of the substrate includes: step S222, providing a photosensitive chip structure, the photosensitive chip structure having a first surface and a second surface, the first surface of the photosensitive chip structure including a plurality of photosensitive areas; step S222, disposing the second surface of the photosensitive chip structure on the first surface electrically connected to the substrate, the photosensitive chip structure and the substrate having a chip conductive bump, the chip conductive bump being used to realize the electrical connection between the photosensitive chip structure and the first surface of the substrate; step S223, providing a plurality of light channel carriers 30, the light channel carriers 30 having a first surface and a second surface opposite to the first surface; step S224, disposing the plurality of light channel carriers on the first surface of the photosensitive chip structure, each photosensitive area of ​​the first surface of the photosensitive chip structure 10 being stacked opposite to the first surface of the corresponding light channel carrier to form the photosensitive structure.

[0114] In this embodiment of the invention, the plurality of optical channel carriers do not contact each other, so that optical isolation is subsequently set between the plurality of optical channel carriers by molding material, preventing external light from entering through the outer end face of one of the plurality of optical channel carriers 30 and then being transmitted out through the inner end face of the plurality of optical channel carriers to enter the other plurality of optical channel carriers, thereby avoiding interference between the plurality of photosensitive chip structures.

[0115] The photosensitive chip structure is electrically connected to the first surface of the substrate through the conductive bumps of the chip, thereby realizing the electrical connection between the photosensitive chip structure and the substrate.

[0116] In other embodiments, the second surface of the photosensitive chip structure is directly disposed on the first surface of the substrate, and the first surface of the photosensitive chip structure and the substrate are electrically connected by metal leads to realize the electrical connection between the photosensitive chip structure and the substrate.

[0117] In this embodiment of the invention, as shown in Figures 17 and 18, the step of forming a photosensitive structure and a molding layer on the first surface of the substrate includes: the first surface of the substrate has a plurality of photosensitive encapsulation regions 70; a plurality of light channel carrier plates 32 are correspondingly disposed in the photosensitive encapsulation regions 70 on the first surface of the substrate; the plurality of light channel carrier plates 32 corresponding to each photosensitive encapsulation region 70 are radiating in different directions, and the light channel carrier plates 32 span adjacent photosensitive encapsulation regions; a first surface of the light channel carrier plates 32 within the photosensitive encapsulation region 70 is provided with... The photosensitive chip structure 10 is placed, with its first surface having a photosensitive area corresponding to the first surface of the light channel carrier plate body 32, and the photosensitive chip structure 10 is electrically connected to the substrate 100; a molding compound layer is formed on the first surfaces of the light channel carrier plate body 32, the photosensitive chip structure 10, and the substrate 100; a plurality of discrete photosensitive chip package structures are formed by cutting, and the light channel carrier plate body 32 is cut to form a disconnected light channel carrier plate, and the sidewalls of the photosensitive chip package structure expose the outer end faces of a plurality of light channel carrier plates.

[0118] In another embodiment, the step of forming a photosensitive structure and a molding layer on the first surface of the substrate includes: the first surface of the substrate has a plurality of photosensitive encapsulation regions, and a plurality of photosensitive chip structures are correspondingly disposed in the photosensitive encapsulation regions on the first surface of the first surface of the photosensitive chip structures within the photosensitive encapsulation regions; a plurality of optical channel carrier bodies are disposed on the first surface of the photosensitive chip structures within the photosensitive encapsulation regions, the plurality of optical channel carrier bodies within one photosensitive encapsulation region are radiating in different directions, and the optical channel carrier bodies span adjacent photosensitive encapsulation regions; the photosensitive chip structures are electrically connected to the substrate; a molding material layer is formed on the optical channel carrier bodies, the photosensitive chip structures and the first surface of the substrate; a plurality of discrete photosensitive chip encapsulation structures are formed by cutting, the optical channel carrier bodies are cut to form disconnected optical channel carriers, and the sidewalls of the photosensitive chip encapsulation structures expose the outer end faces of a plurality of optical channel carriers.

[0119] In this embodiment of the invention, as shown in FIG19, the photosensitive chip packaging structure further includes a sealing dam 20. The sealing dam 20 is formed around the photosensitive area 11 of the photosensitive chip structure and the corresponding stacked area of ​​the optical channel carrier 30. The sealing dam is designed to have a certain height, so that a cavity structure is formed between the photosensitive area 11 of the photosensitive chip structure and the first surface of the optical channel carrier 30. The height of the sealing dam 20 is determined according to the actual application scenario to ensure that it can effectively perform functions such as blocking, supporting or separating. The sealing dam 20 prevents subsequent packaging materials from entering the cavity structure between the photosensitive chip structure and the optical channel carrier 30, and preserves the transmission path of external light from the optical channel carrier 30 to the photosensitive chip structure 10. When the photosensitive chip packaging structure is applied, the photosensitive chip structure obtains external light from different directions through the photosensitive area 11, the cavity structure 21, and several optical channel carriers 30.

[0120] In this embodiment of the invention, a sealing material is disposed around the photosensitive area 11 of the first surface of the photosensitive chip structure and the corresponding stacked area of ​​the optical channel carrier to form a sealing dam, thereby forming a cavity structure between the photosensitive area of ​​the photosensitive chip structure and the first surface of the optical channel carrier. The sealing dam prevents subsequent encapsulation material from entering the cavity structure 11 between the photosensitive chip structure and the optical channel carrier, thus preserving the transmission path of external light from the optical channel carrier 30 to the photosensitive chip structure 10.

[0121] In this embodiment of the invention, the material used for the sealing dam is an adhesive. This choice is based on the adhesive’s excellent bonding properties and plasticity, which allows the sealing dam 20 to adhere firmly to the desired location while maintaining the stability and durability of the structure.

[0122] Furthermore, the adhesive is not limited to a specific type, but can be flexibly selected according to actual usage conditions and performance requirements. In some embodiments, the adhesive is a common glue, which is easy to use, cures quickly, and has high bonding strength, making it suitable for bonding various materials. In other embodiments, other types of adhesives can be selected, such as adhesives with special weather resistance, high temperature resistance, or chemical corrosion resistance, to meet the usage requirements in specific environments. In summary, the material selection of the sealing dam 20 fully considers various factors in practical applications to ensure that its performance reaches its optimal state.

[0123] In other embodiments, the photosensitive chip packaging structure further includes a light-guiding connection structure. This light-guiding connection structure is formed between the photosensitive area of ​​the photosensitive chip structure and the corresponding stacked area of ​​the optical channel carrier. The light-guiding connection structure prevents subsequent packaging material from entering between the photosensitive chip structure and the optical channel carrier, thus preserving the transmission path of external light from the optical channel carrier to the photosensitive chip structure. When this photosensitive chip packaging structure is applied, the photosensitive chip structure receives external light from different directions through the photosensitive area, the light-guiding connection structure, and the plurality of optical channel carriers.

[0124] In other embodiments, the photosensitive chip structure is fixed to the optical channel carrier by an adhesive film. The adhesive film is a die-attach film, also known as DAF (Die Attach Film), a widely used chip bonding film in semiconductor packaging. Die-attach films, with their excellent adhesion, good thermal and chemical stability, and adaptability to various materials, have become the preferred material for bonding chips to substrates and between chips. Of course, in practical applications, other types of adhesive films can be selected based on specific packaging requirements, process conditions, and cost considerations. These adhesive films may have different adhesion, thickness, temperature range, or special functions to meet the requirements of different packaging designs and application scenarios. In short, the selection of adhesive films requires comprehensive consideration of multiple factors to ensure the reliability and performance of the packaged products.

[0125] Specifically, the light guide connection structure is formed by curing transparent adhesive, a light guide glass plate, or other light-transmitting materials.

[0126] This application provides a sealing barrier, light-guiding connection structure, or adhesive film of a certain thickness or a small thickness in the area where the photosensitive area of ​​the photosensitive chip structure is stacked with the corresponding optical channel carrier. This prevents subsequent encapsulation materials from entering between the photosensitive chip structure and the optical channel carrier, while preserving the transmission path of external light from the optical channel carrier to the photosensitive chip structure. When the photosensitive chip encapsulation structure is applied, the photosensitive chip structure obtains external light from different directions through the photosensitive area and several optical channel carriers.

[0127] In step S30, as shown in FIG20, a molding compound is formed on the first surface of the photosensitive structure and the substrate. The molding compound covers the first surface of the photosensitive structure and the substrate, and the plurality of optical channel carriers are optically isolated from each other. The sidewalls of the photosensitive chip packaging structure expose the outer end faces of the plurality of optical channel carriers. The molding compound is opaque.

[0128] In this embodiment of the invention, a molding compound layer is formed on the first surface of the photosensitive structure and the substrate 100, and a discrete photosensitive chip package structure is formed by cutting. The sidewalls of the photosensitive chip package structure expose the outer end faces of a plurality of light channel carrier plates 30.

[0129] In this embodiment of the invention, the molding layer 300 covers the first surface of the photosensitive structure and the substrate. The molding layer 300 is opaque. On the one hand, the molding layer provides optical isolation between the plurality of optical channel carriers 30, ensuring that external light can only enter the photosensitive chip structure through the exposed outer end faces of the plurality of optical channel carriers 30. This prevents external light from entering the photosensitive chip structure from areas other than the outer end faces of the plurality of optical channel carriers 30 exposed on the sidewalls of the photosensitive chip packaging structure, thus affecting the performance of the photosensitive chip packaging structure.

[0130] In this embodiment of the invention, a molding process is used to form a plastic sealant layer.

[0131] In other embodiments, the molding process for forming the encapsulation layer can be injection molding or transfer molding.

[0132] In this embodiment of the invention, the material of the molding layer can be epoxy resin, polyimide resin, benzocyclobutene resin, or polybenzoxazole resin.

[0133] In this embodiment of the invention, when the photosensitive chip packaging structure is applied, the molding layer prevents external light from entering the photosensitive area of ​​the photosensitive chip structure from areas other than the outer end face of the light channel carrier exposed to the sidewall of the photosensitive chip packaging structure, ensuring that external light can only travel from the light channel carrier to the photosensitive chip via the transmission path.

[0134] Finally, it should be noted that any modification or equivalent substitution of some or all of the technical features based on the device structure and the technical solutions of the embodiments of the present invention, without departing from the corresponding technical solutions of the present invention, shall fall within the patent scope of the device structure and the embodiments of the present invention.

Claims

1. A photosensitive chip packaging structure, characterized in that, include: Substrate, photosensitive structure and encapsulation layer; The photosensitive structure is located on the first surface of the substrate, and the encapsulation layer covers the photosensitive structure and the first surface of the substrate. The encapsulation layer is opaque. The photosensitive structure includes a light channel carrier structure and a photosensitive chip structure. The light channel carrier structure includes a plurality of light channel carriers, each of which is radiating in a different direction. The sidewalls of the photosensitive chip encapsulation structure expose the outer end faces of the plurality of light channel carriers. The plurality of light channel carriers are optically isolated from each other. The photosensitive chip structure is electrically connected to the substrate. The photosensitive chip structure includes at least one photosensitive area. The photosensitive area and the corresponding light channel carrier are stacked opposite each other, so that the photosensitive chip structure obtains external light from different directions through the photosensitive area and the plurality of light channel carriers.

2. The photosensitive chip packaging structure as described in claim 1, characterized in that, The light channel carrier structure is located between the substrate and the photosensitive chip structure. The first surface of the photosensitive chip structure with a photosensitive area corresponds to the first surface of the light channel carrier structure, and the second surface of the light channel carrier structure corresponds to the first surface of the substrate.

3. The photosensitive chip packaging structure as described in claim 2, characterized in that, The optical channel carrier has a first conductive post, and the optical channel carrier is electrically connected to the first surface of the substrate and the first surface of the photosensitive chip structure through the first conductive post, thereby realizing the electrical connection between the photosensitive chip structure and the substrate.

4. The photosensitive chip packaging structure as described in claim 2, characterized in that, The second surface of the photosensitive chip structure and the first surface of the substrate are electrically connected by metal leads, thereby realizing the electrical connection between the photosensitive chip structure and the substrate.

5. The photosensitive chip packaging structure as described in claim 1, characterized in that, The photosensitive chip structure is located between the light channel carrier structure and the substrate. The first surface of the light channel carrier structure corresponds to the first surface of the photosensitive chip structure having a photosensitive area, and the second surface of the photosensitive chip structure corresponds to the first surface of the substrate.

6. The photosensitive chip packaging structure as described in claim 5, characterized in that, The second surface of the photosensitive chip structure is provided with chip conductive bumps, and the photosensitive chip structure is electrically connected to the first surface of the substrate through the chip conductive bumps, thereby realizing the electrical connection between the photosensitive chip structure and the substrate.

7. The photosensitive chip packaging structure as described in claim 5, characterized in that, The first surface of the photosensitive chip structure and the substrate are electrically connected by metal leads, thereby realizing the electrical connection between the photosensitive chip structure and the substrate.

8. The photosensitive chip packaging structure as described in claim 1, characterized in that, The photosensitive structure also includes a sealed dam, which is located around the photosensitive area of ​​the photosensitive chip structure and the corresponding stacked area of ​​the light channel carrier, so that a cavity structure is formed between the photosensitive area of ​​the photosensitive chip structure and the first surface of the light channel carrier.

9. The photosensitive chip packaging structure as described in claim 1, characterized in that, The photosensitive structure further includes a light guide connection structure, which is located between the photosensitive area of ​​the photosensitive chip structure and the corresponding stacked area of ​​the light channel carrier.

10. The photosensitive chip packaging structure as described in claim 1, characterized in that, The photosensitive chip structure is a single unit, and the first surface of the photosensitive chip structure includes a photosensitive area, which is stacked opposite to several corresponding optical channel carriers.

11. The photosensitive chip packaging structure as described in claim 1, characterized in that, The photosensitive chip structure is a single unit. The first surface of the photosensitive chip structure includes a plurality of photosensitive areas, which are the same number as the plurality of optical channel carriers. The plurality of photosensitive areas are stacked opposite to the corresponding optical channel carriers.

12. The photosensitive chip packaging structure as described in claim 1, characterized in that, The number of photosensitive chip structures is the same as the number of optical channel carriers. The first surface of each photosensitive chip structure includes a photosensitive area, and the photosensitive area is stacked opposite to the corresponding optical channel carrier.

13. The photosensitive chip packaging structure as described in claim 1, characterized in that, The substrate surface also has a main chip, which is electrically connected to the photosensitive chip structure and the substrate.

14. The photosensitive chip packaging structure as described in claim 13, characterized in that, The main chip is located in the middle area of ​​several optical channel carriers or around the photosensitive structure.

15. The photosensitive chip packaging structure as described in claim 1, characterized in that, The optical channel carrier consists of four plates arranged in a cross shape.

16. The photosensitive chip packaging structure as described in claim 1, characterized in that, The optical channel carrier consists of four plates arranged in a staggered "+" pattern.

17. The photosensitive chip packaging structure as described in claim 1, characterized in that, The second surface of the substrate has substrate conductive bumps for electrically connecting the photosensitive chip packaging structure and external devices.

18. A method for fabricating a photosensitive chip packaging structure, characterized in that, include: Provide substrate; A photosensitive structure and a molding compound are formed on the first surface of the substrate. The photosensitive structure includes a light channel carrier structure and a photosensitive chip structure. The light channel carrier structure includes a plurality of light channel carriers, each of which is radiating in a different direction. The photosensitive chip structure is electrically connected to the substrate and includes at least one photosensitive area, which is stacked opposite to the corresponding light channel carrier. The molding compound covers the photosensitive structure and the first surface of the substrate. The molding compound is opaque, thereby isolating the plurality of light channel carriers from each other. The sidewalls of the photosensitive chip encapsulation structure expose the outer end faces of the plurality of light channel carriers.

19. The method for fabricating a photosensitive chip packaging structure as described in claim 18, characterized in that, The light channel carrier structure is formed between the substrate and the photosensitive chip structure. The first surface of the photosensitive chip structure with a photosensitive area corresponds to the first surface of the light channel carrier structure, and the second surface of the light channel carrier structure is disposed opposite to the first surface of the substrate.

20. The method for fabricating a photosensitive chip packaging structure as described in claim 19, characterized in that, The step of forming a photosensitive structure on the first surface of the substrate includes: setting a light channel carrier structure on the first surface of the substrate, wherein a second surface of the light channel carrier structure is disposed opposite to the first surface of the substrate; setting the photosensitive chip structure on the first surface of the light channel carrier structure, wherein the photosensitive area of ​​the first surface of the photosensitive chip structure is disposed opposite to the first surface of the light channel carrier structure; and electrically connecting the photosensitive chip structure and the first surface of the substrate.

21. The method for fabricating a photosensitive chip packaging structure as described in claim 20, characterized in that, The step of electrically connecting the photosensitive chip structure and the first surface of the substrate includes: electrically connecting the second surface of the photosensitive chip structure and the first surface of the substrate through metal leads.

22. The method for fabricating a photosensitive chip packaging structure as described in claim 20, characterized in that, The step of electrically connecting the photosensitive chip structure and the first surface of the substrate includes: the light channel carrier in the light channel carrier structure has a first conductive post, and the photosensitive chip structure is electrically connected to the first surface of the substrate through the first conductive post of the light channel carrier, thereby realizing the electrical connection between the photosensitive chip structure and the substrate.

23. The method for fabricating a photosensitive chip packaging structure as described in claim 18, characterized in that, The photosensitive chip structure is formed between the light channel carrier structure and the substrate. The first surface of the light channel carrier structure corresponds to the first surface of the photosensitive chip structure having a photosensitive area. The second surface of the photosensitive chip structure is disposed opposite to the first surface of the substrate.

24. The method for fabricating a photosensitive chip packaging structure as described in claim 23, characterized in that, The step of forming a photosensitive structure on the first surface of the substrate includes: setting a photosensitive chip structure on the first surface of the substrate, wherein a second surface of the photosensitive chip structure is disposed opposite to the first surface of the substrate; setting the light channel carrier structure on the first surface of the photosensitive chip structure, wherein the photosensitive area of ​​the first surface of the photosensitive chip structure is disposed opposite to the first surface of the light channel carrier structure; and electrically connecting the photosensitive chip structure and the first surface of the substrate.

25. The method for fabricating a photosensitive chip packaging structure as described in claim 24, characterized in that, The step of electrically connecting the photosensitive chip structure and the first surface of the substrate includes: electrically connecting the first surface of the photosensitive chip structure and the first surface of the substrate through metal leads.

26. The method for fabricating a photosensitive chip packaging structure as described in claim 24, characterized in that, The step of electrically connecting the photosensitive chip structure and the first surface of the substrate includes: electrically connecting the second surface of the photosensitive chip structure and the first surface of the substrate through conductive bumps.

27. A method for fabricating a photosensitive chip packaging structure as described in claim 19 or 23, characterized in that, It also includes forming a sealed dam, which is formed around the photosensitive area of ​​the photosensitive chip structure and the corresponding stacked area of ​​the optical channel carrier, so that a cavity structure is formed between the photosensitive area of ​​the photosensitive chip structure and the first surface of the optical channel carrier.

28. A method for fabricating a photosensitive chip packaging structure as described in claim 19 or 23, characterized in that, It also includes forming a light guide connection structure, which is formed between the photosensitive area of ​​the photosensitive chip structure and the corresponding stacked area of ​​the light channel carrier.

29. The method for fabricating a photosensitive chip packaging structure as described in claim 18, characterized in that, The steps of forming a photosensitive structure and a molding layer on the first surface of the substrate include: the first surface of the substrate has a plurality of photosensitive encapsulation areas; a plurality of optical channel carrier bodies are disposed corresponding to the photosensitive encapsulation areas on the first surface of the substrate; the plurality of optical channel carrier bodies corresponding to each photosensitive encapsulation area are radiating in different directions, and the optical channel carrier bodies span adjacent photosensitive encapsulation areas; the photosensitive chip structure is disposed on the first surface of the optical channel carrier body within the photosensitive encapsulation area; the first surface of the photosensitive area of ​​the photosensitive chip structure corresponds to the first surface of the optical channel carrier body; the photosensitive chip structure is electrically connected to the substrate; a molding material layer is formed on the optical channel carrier body, the photosensitive chip structure, and the first surface of the substrate; a plurality of discrete photosensitive chip encapsulation structures are formed by cutting; the optical channel carrier body is cut to form a disconnected optical channel carrier; the sidewalls of the photosensitive chip encapsulation structure expose the outer end faces of a plurality of optical channel carriers.

30. The method for fabricating a photosensitive chip packaging structure as described in claim 18, characterized in that, The steps of forming a photosensitive structure and a molding compound layer on the first surface of the substrate include: the first surface of the substrate has a plurality of photosensitive encapsulation regions, and a plurality of photosensitive chip structures are correspondingly disposed in the photosensitive encapsulation regions on the first surface of the first surface of the photosensitive chip structures within the photosensitive encapsulation regions; a plurality of optical channel carrier bodies are disposed on the first surface of the photosensitive chip structures within the photosensitive encapsulation regions, the plurality of optical channel carrier bodies within one photosensitive encapsulation region are radiating in different directions, and the optical channel carrier bodies span adjacent photosensitive encapsulation regions; the photosensitive chip structures are electrically connected to the substrate; a molding compound layer is formed on the optical channel carrier bodies, the photosensitive chip structures and the first surface of the substrate; a plurality of discrete photosensitive chip encapsulation structures are formed by cutting, the optical channel carrier bodies are cut to form disconnected optical channel carriers, and the sidewalls of the photosensitive chip encapsulation structures expose the outer end faces of a plurality of optical channel carriers.

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