Substrate processing apparatus and substrate processing method

Abstract

The invention relates to a substrate processing apparatus and a substrate processing method. The present invention accurately detects abnormality of forward and backward movement of a shaft by using detection results of a plurality of pressure detection points by a pressure sensor. This processing unit is provided with: a nozzle body (52) for performing a predetermined surface treatment on a substrate; a shaft (532) which is driven by the motor (531) to move forward and backward in a predetermined direction; a pressure sensor (55) for acquiring a pressure value generated between the motor (531) and the nozzle body (52) at a plurality of pressure detection points; and an abnormality detection unit that detects an abnormality in the forward and backward movement of the shaft on the basis of the pressure values at at least two pressure detection points included in the plurality of pressure detection points.

Description

Technical Field

[0001] This invention relates to a substrate processing apparatus and a substrate processing method. Background Technology

[0002] As a process for processing circular or nearly circular substrates such as semiconductor wafers, there is a process that removes only the thin film at the periphery of the substrate formed on at least one main surface of the substrate. For example, a technique is known in which etchant is supplied to the periphery of the substrate while it is rotated, and only the thin film further outward than the location where the etchant is supplied is removed. This process of removing thin films is sometimes referred to as bevel etching.

[0003] For example, Patent Document 1 discloses a substrate processing apparatus housed within a processing chamber, in which a lower peripheral nozzle is provided below the substrate for etching the lower peripheral surface of a horizontally oriented substrate. In the lower peripheral nozzle, multiple nozzles are mounted on a nozzle support member, and each of these nozzles sprays a processing liquid such as a chemical solution or cleaning solution upwards toward the lower peripheral surface of the substrate.

[0004] [Background Technical Documents]

[0005] [Patent Literature]

[0006] [Patent Document 1] Japanese Patent Application Publication No. 2022-052835 Summary of the Invention

[0007] [The problem the invention aims to solve]

[0008] However, Patent Document 1 does not disclose in detail the mounting structure of the nozzle relative to the nozzle support member. Therefore, in the substrate processing apparatus disclosed in Patent Document 1, it is unclear how to adjust the nozzle position. Furthermore, in the substrate processing apparatus, even assuming that the nozzle position can be adjusted using a shaft, abnormalities may occur during the forward and backward movement of the shaft.

[0009] One objective of this invention is to detect abnormalities in the forward and backward movement of a shaft with good accuracy by using pressure sensors to detect the results of multiple pressure detection points.

[0010] [Technical means to solve the problem]

[0011] To address the aforementioned problem, a substrate processing apparatus according to one aspect of the present invention includes: a surface treatment mechanism for performing a predetermined surface treatment on a substrate; a shaft, one end of which is connected to the surface treatment mechanism and the other end of which is connected to an actuator, for moving forward and backward in a predetermined direction by being driven by the actuator; a pressure sensor, which acquires, at a plurality of pressure detection points, a pressure value generated between the actuator, the surface treatment mechanism, or the shaft as the shaft moves in the predetermined direction guided by the surface treatment mechanism; and an anomaly detection unit, which detects an anomaly in the forward and backward movement of the shaft based on the pressure value at least two of the plurality of pressure detection points.

[0012] One aspect of the substrate processing method of the present invention is as follows: a shaft is connected at one end to a surface treatment mechanism for performing a specified surface treatment on a substrate and at the other end to an actuator, and moves forward and backward in a specified direction by being driven by the actuator; pressure values ​​generated between the actuator, the surface treatment mechanism, or the shaft as the shaft moves in the specified direction guided by the surface treatment mechanism at a plurality of pressure detection points in a pressure sensor are obtained; and an abnormality in the forward and backward movement of the shaft is detected based on the pressure values ​​at at least two pressure detection points included in the plurality of pressure detection points.

[0013] [The effects of the invention]

[0014] According to one aspect of the present invention, abnormalities in the forward and backward movement of a shaft can be detected with good accuracy by using the detection results of multiple pressure detection points using a pressure sensor. Attached Figure Description

[0015] Figure 1 This is a top view showing a schematic configuration of a substrate processing system equipped with one aspect of the substrate processing apparatus of the present invention, namely the processing unit.

[0016] Figure 2 This is a side view showing the internal structure of the processing unit.

[0017] Figure 3 yes Figure 2 The top view of the processing unit shown.

[0018] Figure 4 It is a diagram showing the structure and configuration of the processing mechanism equipped in the processing unit.

[0019] Figure 5 This is a cross-sectional view of a nozzle block showing the structure of a single liquid spray nozzle in the processing unit, indicating that the nozzle body is located at the origin.

[0020] Figure 6This is a cross-sectional view of a nozzle block showing the structure of a single liquid spray nozzle part equipped with a processing mechanism, showing the nozzle body in its forwardmost position.

[0021] Figure 7 This is a three-dimensional diagram showing the configuration near the pressure sensor equipped in the processing mechanism.

[0022] Figure 8 This is a flowchart illustrating an example of a process in which a control unit within a processing unit sprays processing liquid from a nozzle body.

[0023] Figure 9 This is a flowchart illustrating an example of a process in which a control unit within the processing unit moves the nozzle body.

[0024] Figure 10 This is a graph illustrating the relationship between time and the pressure value obtained from a pressure sensor.

[0025] Figure 11 This is a graph illustrating the relationship between time and pressure values ​​at multiple pressure detection points obtained by a pressure sensor.

[0026] Figure 12 This is a cross-sectional view of the nozzle block included in the processing unit of Variation 1 of the present invention.

[0027] Figure 13 This is a cross-sectional view showing an example of an on / off valve included in the processing unit of Variation 2 of the present invention. Detailed Implementation

[0028] (Substrate processing system)

[0029] Hereinafter, an embodiment of the present invention will be described in detail. The following description mainly relates to the substrate processing system, but also includes a description of the substrate processing method for processing the substrate. Figure 1 This is a top view showing a schematic configuration of a substrate processing system 100 equipped with one aspect of the substrate processing apparatus of the present invention, namely the processing unit 1. Figure 1 This is a schematic diagram showing the internal structure of the substrate processing system 100, excluding the outer wall panel or other components. The substrate processing system 100 is, for example, located in a cleanroom and is a monolithic device for processing substrates S one by one.

[0030] The substrate processing system 100 includes multiple processing units (substrate processing apparatuses) 1, each serving as a processing entity for the substrate S. Figure 1 Although four processing units 1 are shown arranged in a horizontal direction, each processing unit 1 can also be stacked in multiple segments in the vertical direction. In each of the plurality of processing units 1 equipped in the substrate processing system 100, substrate processing with processing liquid is performed.

[0031] The substrate S is a circular substrate. In this embodiment, "circular substrate" refers to a "generally circular substrate" that, in addition to having a strictly circular shape when viewed from above, also includes a portion of the outer periphery with an enveloping circular shape that has a portion that differs from the circumference, such as an oriented plane or a notch.

[0032] Furthermore, various substrates can be used as the "substrate" in this embodiment, such as semiconductor wafers, glass substrates for photomasks, glass substrates for liquid crystal displays, glass substrates for plasma displays, substrates for field emission displays (FED), substrates for optical discs, substrates for magnetic disks, and substrates for magneto-optical discs. Although the following description uses a substrate processing apparatus mainly used for processing semiconductor wafers as an example and refers to the accompanying drawings, it can also be applied to the processing of the various substrates illustrated above.

[0033] The processing unit 1 of this embodiment performs the following process: receiving a substrate S on which a thin film of metal or metal compound is formed on one main surface, and removing only the peripheral portion of the thin film formed on the substrate S by etching. This etching process is sometimes referred to as "bevel etching" or simply "bevel processing". In addition, this bevel etching process can be performed by all of the multiple processing units 1 included in the substrate processing system 100, or multiple processing units performing different processes can be combined.

[0034] like Figure 1 As shown, the substrate processing system 100 has a substrate processing region 110 for processing a substrate S. A transfer unit 120 is disposed adjacent to the substrate processing region 110. The transfer unit 120 has a container holding section 121 capable of holding multiple containers C for accommodating substrates S. The transfer unit 120 includes a transfer robot 122 for picking up the containers C held by the container holding section 121, removing unprocessed substrates S from the containers C, or storing processed substrates S in the containers C. In each container C, multiple substrates S are accommodated in a generally horizontal orientation.

[0035] In the substrate processing area 110, a stage 112 is configured to hold a substrate S from a transfer robot 122. Furthermore, in top view, a substrate transfer robot 111 is positioned approximately at the center of the substrate processing area 110. Additionally, multiple processing units 1 are arranged to surround the substrate transfer robot 111.

[0036] Relative to these processing units 1, the substrate transfer robot 111 randomly picks up the mounting stage 112 and transfers the substrate S between itself and the mounting stage 112. On the other hand, each processing unit 1 performs a prescribed process on the substrate S, equivalent to the substrate processing apparatus of the present invention. In this embodiment, these processing units (substrate processing apparatus) 1 have the same function. Therefore, parallel processing of multiple substrates S is possible. Furthermore, in Figure 1 In the diagram, symbol 11 represents the partition, or chamber, of processing unit 1, and the component with additional symbol 15 is the baffle installed in chamber 11.

[0037] (Inside the processing unit)

[0038] Figure 2 This is a side view showing the internal structure of processing unit 1. Figure 3 yes Figure 2 The top view of processing unit 1 shown. Figure 2 and Figure 3 In order to facilitate understanding, there are instances where the size or quantity of each part is exaggerated or simplified in the map.

[0039] like Figure 2 and Figure 3 As shown, the processing unit 1 has a structure in which a substrate processing section SP is disposed in an internal space 12 within a chamber 11. The substrate processing section SP of the processing unit 1 is disposed on the upper surface of a base member 17 with a high base plate structure. Each component constituting the substrate processing section SP is electrically connected to a control unit 10 of the entire control device and operates according to instructions from the control unit 10.

[0040] To clarify the configuration and operation of the various parts of the device, a coordinate system with the Z-direction as the vertical direction and the XY plane as the horizontal plane is appropriately added below. Figure 3 In the coordinate system, the horizontal direction, which is equivalent to the up and down direction on the paper, is designated as the "Y direction", and the horizontal direction orthogonal to it is designated as the "X direction".

[0041] The substrate processing unit SP includes a rotation holding mechanism 2, an anti-scattering mechanism 3, an upper surface protection heating mechanism 4, a processing mechanism 5, an atmosphere separation mechanism 6, a lifting mechanism 7, a centering mechanism 8, and a substrate observation mechanism 9. These mechanisms are mounted on the base component 17.

[0042] The holding and rotating mechanism (rotating mechanism) 2 holds the substrate S in a horizontal position and rotates it about a vertical axis passing through the center of the substrate S. The holding and rotating mechanism 2 includes: a substrate holding part 2A, which holds the substrate S in a substantially horizontal position with the film forming surface of the substrate S facing downward; and a rotating mechanism part 2B, which rotates the substrate holding part 2A holding the substrate S and a part of the anti-scattering mechanism 3, namely the rotating cup part 31, synchronously.

[0043] The substrate holding section 2A includes a circular plate-shaped component, namely a rotary chuck 21, which is smaller than the substrate S. The rotary chuck 21 is arranged with its central axis aligned with the rotation axis AX, and uses the suction force of the pump 26 to hold the substrate S from below. Room temperature nitrogen is supplied to the rotary chuck 21 from the nitrogen supply section 29.

[0044] A cylindrical rotating shaft portion 22 is connected to the lower surface of the rotating suction cup 21. The rotating shaft portion 22 extends in the vertical direction Z with its axis aligned with the rotating shaft AX. Furthermore, a rotating mechanism portion 2B is connected to the rotating shaft portion 22.

[0045] The rotating mechanism 2B includes an electric motor 23 that generates a rotational driving force for rotating the substrate holding part 2A and the rotating cup part 31 of the anti-scattering mechanism 3, and a power transmission part 27 for transmitting the rotational driving force.

[0046] The rotating mechanism 2B not only enables the rotating suction cup 21 to rotate integrally with the substrate S, but also includes a power transmission section 27 to ensure that the rotating cup section 31 rotates synchronously with the rotation. The power transmission section 27 includes a circular plate component 27a made of non-magnetic material or resin. The circular plate component 27a is coaxially mounted with the rotating shaft section 22 and can rotate together with the rotating shaft section 22 around the rotating axis AX.

[0047] The anti-splash mechanism 3 prevents the etching solution sprayed during the etching process from scattering and recovers the treated liquid. The anti-splash mechanism 3 includes: a rotating cup portion 31 capable of rotating around a rotation axis AX while surrounding the outer periphery of the substrate S held by the rotating suction cup 21; and a fixed cup portion 34 fixedly disposed around the rotating cup portion 31. The rotating cup portion 31 is a connector linking the lower cup 32 and the upper cup 33. The droplets captured by the rotating cup portion 31, along with gas components, are recovered and collected by the fixed cup portion 34. The droplets are drained, and the gas components are effectively vented by adjusting the pressure of the fixed cup portion 34 through the operation of the venting portion 38.

[0048] The upper surface protection heating mechanism 4 protects the upper surface of the substrate S in a manner that prevents it from being exposed to the surrounding atmosphere. The upper surface protection heating mechanism 4 has a baffle plate 41 disposed above the upper surface of the substrate S held by the rotating chuck 21. The baffle plate 41 has a circular plate portion 42 held in a horizontal position. The circular plate portion 42 houses a heater (not shown) that is driven and controlled by a heater drive unit 422.

[0049] When the circular plate portion 42 is positioned close to the processing position of the substrate S, the upper surface protection heating mechanism 4 supplies heating gas from the heating gas supply portion 47 between the substrate S and the circular plate portion 42. The heating gas is supplied from the central side of the circular plate portion 42 and flows toward the periphery. As a result, it is possible to prevent the surrounding atmosphere of the substrate S from entering the upper surface of the substrate S.

[0050] The atmosphere separation mechanism 6 separates the internal space 12 within the chamber 11 into a sealed space 12a capable of performing inclined surface treatment on the substrate S, and an outer space 12b of the sealed space 12a. The atmosphere separation mechanism 6 is configured to completely surround the rotating chuck 21, the substrate S held by the rotating chuck 21, the rotating cup portion 31, and the upper surface protection heating mechanism 4 from above. The atmosphere separation mechanism 6 has a lower sealed cup component 61 and an upper sealed cup component 62. The lower sealed cup component 61 is configured to be movable in the vertical direction (able to move up and down).

[0051] like Figure 2 As shown, the lower sealing cup component 61 descends and is positioned at the lower limit position, while in the vertical direction, the upper sealing cup component 62, the lower sealing cup component 61 and the fixed cup part 34 are connected, and the upper sealing cup component 62, the lower sealing cup component 61 and the fixed cup part 34 form a sealed space 12a.

[0052] Furthermore, although not shown, when the lower sealing cup component 61 rises and moves to the retracted position, it engages with the upper cup 33, and the upper cup 33 also rises together. Thus, the upper cup 33 and the upper surface protection heating mechanism 4 move upwards from the rotary suction cup 21. The movement of the lower sealing cup component 61 to the retracted position creates a transport space for the substrate transport robot 111 to receive the rotary suction cup 21.

[0053] The lifting mechanism 7 moves the lower sealed cup component 61 up and down. The lifting mechanism 7 has two lifting drive units, namely a first lifting drive unit 71 and a second lifting drive unit 72. The first lifting drive unit 71 and the second lifting drive unit 72 move two different parts of the side circumference of the lower sealed cup component 61 synchronously and in the vertical direction. Therefore, the lifting and lowering of the upper surface protection heating mechanism 4 and the lower sealed cup component 61 can be performed stably. Furthermore, as the lower sealed cup component 61 rises and falls, the lifting mechanism 7 also moves the upper cup 33, which is connected to the lower cup 32 and forms the rotating cup part 31, up and down.

[0054] The centering mechanism 8 eliminates the eccentricity of the substrate S and performs a centering process that aligns the center of the substrate S with the rotation axis AX. The centering mechanism 8 has a single abutting part 81 and multiple abutting parts 82 arranged on opposite sides of the rotation axis AX across the rotating chuck 21, and a centering drive part 83 that moves the single abutting part 81 and multiple abutting parts 82 in the abutting movement direction.

[0055] The substrate observation mechanism 9 is a mechanism for optically observing the periphery of the processed substrate S for the purpose of confirming whether the processing is appropriate. The substrate observation mechanism 9 includes a light source unit 91, an imaging unit 92, an observation head 93, and an observation head drive unit 94.

[0056] Processing unit 5 performs an etching process to remove only the peripheral portion of the thin film formed on substrate S. For example... Figure 3 As shown, the processing unit 5 includes a nozzle block 50 disposed on the lower surface side of the substrate S, and a processing liquid supply section 59 for supplying processing liquid to the nozzle block 50. As described later, the nozzle block 50 has a plurality of processing liquid ejection nozzle sections 51 (see reference). Figure 4 The treatment fluid supply unit 59 is connected to each treatment fluid ejection nozzle unit 51.

[0057] The treatment liquid supply unit 59 is configured to supply SC1 liquid, DHF (diluted hydrofluoric acid) or functional water (CO2 water, etc.) as treatment liquid, and can independently spray SC1 liquid, DHF and functional water from each treatment liquid spray nozzle unit 51.

[0058] like Figure 2 As shown, in order to spray the processing liquid toward the periphery of the lower surface of the substrate S, the nozzle support portion 57 of the nozzle support block 50 is provided below the substrate S held by the rotating suction cup 21. The nozzle support portion 57 has a thin-walled cylindrical portion 571 extending in the vertical direction and an annular flange portion 572 with a radially outwardly bent flange at the upper end of the cylindrical portion 571.

[0059] The cylindrical portion 571 has a shape that allows it to move freely within the air gap formed between the circular plate member 27a and the lower cup 32. The nozzle support portion 57 is fixedly configured such that the cylindrical portion 571 moves into the air gap, and the flange portion 572 is located between the substrate S held by the rotating chuck 21 and the lower cup 32. The nozzle block 50 is mounted on a portion of the peripheral edge of the upper surface of the flange portion 572.

[0060] (Processing Agency)

[0061] Next, use Figures 4-6 The processing mechanism 5 will be explained in detail. Figure 4 This is a diagram showing the structure and configuration of the processing mechanism 5 equipped in the processing unit 1. Figure 5 This is a cross-sectional view of a nozzle block showing the structure of a processing liquid ejection nozzle section equipped with the processing mechanism 5, indicating that the nozzle body is located at the origin. Figure 6 This is a cross-sectional view of a nozzle block showing the structure of a processing liquid ejection nozzle section equipped with the processing mechanism 5, showing the nozzle body in its forwardmost position.

[0062] like Figure 4 As shown, the nozzle block 50 has three sets of treatment liquid ejection nozzles 51A, 51B, and 51C that respectively eject treatment liquid, and a support base 54 that supports them. Each treatment liquid ejection nozzle 51A to 51C has the same shape. In addition, here, the nozzle block 50 is shown to have a configuration with three treatment liquid ejection nozzles 51, but it is fine to have two or more.

[0063] The support base 54 is mounted on the nozzle support 57 (reference). Figure 2 The upper part of the support base 54 has a roughly circular flange portion 572. The support base 54 supports three treatment liquid ejection nozzle portions 51A to 51C. Hereinafter, the direction in which the three treatment liquid ejection nozzle portions 51A to 51C are arranged will be referred to as the transverse direction of the support base 54.

[0064] The support base 54 has ears 542 with screw holes at both lateral ends. The support base 54 abuts the two ears 542 against the upper surface of the flange portion 572 and is fixed to the flange portion 572 by screws 543 inserted into the screw holes formed in the ears 542.

[0065] The upper surface 541 of the base 54 between the two lugs 542 in the support base 54 becomes the support surface for supporting the three treatment liquid spray nozzles 51A to 51C. The three treatment liquid spray nozzles 51A to 51C are fixed to the support base 54 using screws or the like.

[0066] Here, taking a single treatment liquid ejection nozzle section 51A as an example, refer to... Figure 5 and Figure 6 Its structure will be explained. In addition, when there is no need to distinguish between the various treatment liquid ejection nozzle sections 51A to 51C, they will sometimes be referred to simply as "treatment liquid ejection nozzle section 51".

[0067] like Figure 5 and Figure 6 As shown, the processing liquid ejection nozzle section 51 includes a main part, namely a nozzle body 52, and a nozzle drive section 53 that reciprocates the nozzle body 52 in the radial direction of the substrate S. The nozzle body 52 is disposed below the substrate S and ejects the processing liquid from the ejection outlet 521 toward the peripheral portion of the lower surface of the substrate S. The nozzle body 52 is an example of a surface treatment mechanism for performing a specified surface treatment on the substrate S.

[0068] The nozzle body 52 has an elongated shape along the radial direction of the substrate S, with a nozzle head 52a on the outer side in the radial direction and an axial portion 52b on the inner side in the radial direction. An outlet 521 for ejecting the processing liquid is provided at the outer end (top) of the nozzle head 52a. The outlet 521 receives the processing liquid from the processing liquid supply unit 59 (see reference). Figure 3 The processing liquid supplied through the internal manifold 522 is sprayed outward at an elevation angle of 45 degrees when viewed from the rotation axis AX. The processing liquid is sprayed toward the periphery of the lower surface of the substrate S.

[0069] A metal thin film or a metal compound thin film is formed on the lower surface of the substrate S. When the sprayed processing liquid has a dissolving effect on the film, the thin film in the area where the processing liquid is attached to the lower surface of the substrate S is etched away. When the substrate S is rotated, the processing liquid spreads to a position further outward than the attachment point due to centrifugal force, resulting in the removal of the thin film further outward than the attachment point.

[0070] The shaft-shaped portion 52b is located inside the substrate S in the radial direction in the nozzle body 52, that is, on the side opposite to the nozzle outlet 521, and extends inward in the radial direction. The shaft-shaped portion 52b is inserted through and supported in the bearing 533 provided in the nozzle drive portion 53.

[0071] The nozzle drive unit 53 includes a motor (actuator) 531, a shaft 532, a bearing 533 supporting the shaft-shaped portion 52b of the nozzle body 52, and a housing 534. The motor 531 is held in a motor holder 535, except for the side of the shaft 532 that is mounted to the outward side in the radial direction. The motor 531 is, for example, a stepper motor.

[0072] The shaft 532 is cantilevered and integrated with the motor 531. One end of the shaft 532 is connected to the shaft-shaped portion 52b of the nozzle body 52, and the other end of the shaft 532 is connected to the motor 531. Furthermore, one end of the shaft 532 engages with the shaft-shaped portion 52b.

[0073] Specifically, the shaft-shaped portion 52b of the nozzle body 52 has a shaft hole 523 that opens inward in the radial direction and extends outward in the radial direction for inserting the shaft 532, and a nut 524 is fixed in the shaft hole 523. On the other hand, the shaft 532 has a thread on its outer periphery that engages with the nut 524. By engaging the nut 524 with the thread on the outer periphery of the shaft 532, the shaft 532 engages with the shaft-shaped portion 52b.

[0074] Therefore, when the shaft 532 rotates under the drive of the motor 531, the nut 524, which is screwed onto the outer circumference of the shaft 532, moves along the radial direction of the substrate S. The direction of movement is determined by the rotation direction of the shaft 532, and the amount of movement is determined by the amount of rotation of the shaft 532. By moving the nut 524 along the radial direction of the substrate S, the nozzle body 52, which fixes the nut 524, moves along the radial direction of the substrate S.

[0075] At this time, the shaft 532 rotates while being driven by the motor 531, and moves back and forth in the radial direction of the substrate S, which is one example of a predetermined direction. Furthermore, by rotating the shaft 532, the nozzle body 52, fixed to the nut 524, moves in the radial direction of the substrate S, thus the shaft 532 moves back and forth relative to the nozzle body 52 in the radial direction of the substrate S. In other words, the shaft 532 moves back and forth in the radial direction of the substrate S within the shaft hole 523 of the shaft-shaped portion 52b of the nozzle body 52. ​​The nozzle body 52 moves in the radial direction of the substrate S guided by the shaft 532.

[0076] The housing 534 secures and houses the motor 531 and the bearing 533. The housing 534 not only secures the motor 531 and the bearing 533, but also houses them in a manner that covers at least the portion from the side of the shaft 532 connected to the motor 531 to the bearing 533.

[0077] The bearing 533 is configured to support the shaft-shaped portion 52b when the nozzle body 52 is moved to its outermost radial position. The bearing 533 extends from the end portion 531E of the motor 531 in the direction of reciprocating movement of the shaft 532, and houses the shaft 532 internally, having an inner circumferential surface 533F for sliding the nozzle body 52. ​​The end portion 531E is the end portion in the radial direction outside the substrate S surrounding the rotating shaft portion 531A of the motor 531. Furthermore, in Figure 5 and Figure 6 In the text, a portion of bearing 533 is omitted.

[0078] The nozzle drive unit 53 moves the nozzle body 52 back and forth in the radial direction of the substrate S via the motor 531, thereby adjusting the position of the nozzle body 52. ​​As a result, the contact position of the processing liquid ejected from the nozzle outlet 521 provided on the nozzle body 52 with the substrate S can be changed, thereby adjusting the etching width.

[0079] Furthermore, the bearing 533 is a sleeve-type bearing 533A extending in the radial direction of the substrate S. The outer end of the sleeve-type bearing 533A in the radial direction is located at a position that can support the shaft-shaped portion 52b when the nozzle body 52 is moved to the outermost position in the radial direction of the substrate S, and extends inward in the radial direction from said position.

[0080] The shaft-shaped portion 52b is inserted through the outer end of the sleeve bearing 533A in the radial direction, and the shaft 532 is inserted through the inner end of the sleeve bearing 533A in the radial direction. In the sleeve bearing 533A, the shaft-shaped portion 52b engages with the shaft 532.

[0081] As a sleeve-type bearing, for example, an Iglidur G (product name: Igus Inc.) sliding bearing can be used. However, although using a sleeve-type bearing as bearing 533 is preferred in the above-mentioned respect, it is not limited to this, and for example, it can be configured to arrange rolling bearings in multiple locations.

[0082] Furthermore, the motor 531 and bearing 533 are fixed to the housing 534 by a tight fit. More precisely, because the motor 531 is held by the motor holder 535, the motor 531, together with the bearing 533, is fixed to the housing 534 by a tight fit while held by the motor holder 535.

[0083] Furthermore, a sealing ring 536 is disposed on the outer side of the bearing 533 in the radial direction to seal the annular space between the bearing 533 and the shaft-shaped portion 52b. An annular groove 534a is formed in the housing 534 for disposing of the sealing ring 536, and the sealing ring 536 is embedded in the groove 534a. An annular pressing member 537 is embedded on the outer side of the sealing ring 536 in the radial direction to prevent the sealing ring 536 from falling off.

[0084] The central shafts of motor 531, shaft 532, and bearing 533 are aligned. In other words, the central shafts of motor 531, shaft 532, and bearing 533 are coaxially configured.

[0085] The treatment fluid ejection nozzle 51 (51A-51C) and the support base 54 are made of a material with excellent chemical resistance, such as a resin material. For example, depending on the purpose, polyethylene resin, PTFE (polytetrafluoroethylene) resin, PEEK (polyetheretherketone) resin, etc. can be appropriately selected and used.

[0086] (Pressure sensor)

[0087] Figure 7 This is a perspective view showing the configuration near the pressure sensor 55 equipped on the processing unit 5. The nozzle block 50 has... Figures 5-7 The pressure sensor 55 is shown. The pressure sensor 55 acquires the pressure value generated between the motor 531 and the nozzle body 52 as the nozzle body 52 moves radially in the substrate S guided by the shaft 532. Specifically, the pressure sensor 55 acquires the pressure value generated between the end 531E of the motor 531 and the shaft-shaped portion 52b.

[0088] The pressure sensor 55 has a plane 55F orthogonal to the axial direction of the axis 532, and multiple pressure detection points on the plane 55F. The plane 55F is the plane outside the radial direction of the substrate S in the pressure sensor 55. The multiple pressure detection points are, for example, multiple pressure sensors. The multiple pressure detection points can be positioned concentrically on the plane 55F, or they can be positioned in a matrix on the plane 55F.

[0089] The pressure sensor 55 acquires pressure values ​​at each of a plurality of pressure detection points. That is, the pressure sensor 55 acquires the pressure distribution relative to the plane 55F. Alternatively, the pressure sensor 55 may have only one pressure detection point.

[0090] A pressure sensor 55 has a through hole 55H through which the shaft 532 passes, and is disposed at the end 531E of the motor 531 protruding from the shaft 532. Furthermore, the pressure sensor 55 is positioned near the boundary between the end 531E and the other end of the shaft 532. The pressure sensor 55 is generally annular in shape and is arranged to surround the other end of the shaft 532. The pressure sensor 55 is disposed within and housed within the bearing 533.

[0091] (Control unit)

[0092] like Figure 2 As shown, the control unit 10 includes a drive control unit 101, a data acquisition unit 102, and an origin position detection unit 103. Furthermore, the origin position detection unit 103 includes an anomaly detection unit 104.

[0093] Figure 8 This is a flowchart illustrating an example of a process in which the control unit 10 of the processing unit 1 causes the nozzle body 52 to spray processing liquid. For example... Figure 8 As shown, the control unit 10 performs initial settings (S1). Details of the initial settings will be described later. After the control unit 10 performs the initial settings, the drive control unit 101 determines whether the substrate S has been moved into the processing unit 1 (S2). If the drive control unit 101 determines that the substrate S has not been moved in (NO in S1), the drive control unit 101 continues the processing in step S2.

[0094] On the other hand, when the drive control unit 101 determines that the substrate S has been loaded (YES in S1), it rotates the substrate S by holding the rotation mechanism 2 (S3). While performing the process in step S3, the drive control unit 101 moves the nozzle body 52 from the origin position by means of the motor 531 and sprays the processing liquid from the nozzle body 52 (S4).

[0095] Next, the drive control unit 101 determines whether to terminate the process of spraying the processing liquid onto the substrate S (S5). If the drive control unit 101 determines that the process of spraying the processing liquid onto the substrate S should be terminated (yes in S5), the process of spraying the processing liquid onto the substrate S is terminated. On the other hand, if the drive control unit 101 determines that the process of spraying the processing liquid onto the substrate S should not be terminated (no in S5), the process of the drive control unit 101 proceeds to step S2.

[0096] (Move back to the origin)

[0097] Figure 9 This is a flowchart illustrating an example of the process by which the control unit 10 of the processing unit 1 moves the nozzle body 52. Figure 9 The symbol A1 represents the initial setting process performed by the control unit 10 as step S1, and is a flowchart illustrating an example of the process of returning the nozzle body 52 to the origin position. The origin position is the position where the axial portion 52b of the nozzle body 52 abuts against the pressure sensor 55.

[0098] like Figure 9 As indicated by symbol A1, the control unit 10 outputs a movement command (S11) that moves the nozzle body 52 toward the origin position. The movement command indicates the manner in which the nozzle body 52 is moved to the origin position.

[0099] After the control unit 10 outputs a movement command to move towards the origin position, the data acquisition unit 102 begins acquiring data from the pressure sensor 55 (S12). At this time, the data acquisition unit 102 acquires the pressure values ​​of multiple pressure detection points in the pressure sensor 55. After the data acquisition unit 102 begins acquiring data from the pressure sensor 55, the drive control unit 101 executes the drive of the motor 531 based on the movement command in step S11 (S13). In step S13, the motor 531 moves the nozzle body 52 to the origin position.

[0100] Next, the data acquisition unit 102 completes the acquisition of data from the pressure sensor 55 (S14). After the data acquisition unit 102 completes the acquisition of data from the pressure sensor 55, the origin position detection unit 103 determines whether the pressure value at any of the multiple pressure detection points of the pressure sensor 55 is above a preset threshold (S15). In addition, in step S15, the origin position detection unit 103 may also determine whether the pressure value at least two pressure detection points included in the multiple pressure detection points is above the threshold.

[0101] If the origin position detection unit 103 determines that the pressure value at at least one of the multiple pressure detection points of the pressure sensor 55 does not reach the threshold (no in S15), the processing of the control unit 10 proceeds to the processing of step S11. On the other hand, if the origin position detection unit 103 determines that the pressure value at any of the multiple pressure detection points of the pressure sensor 55 is above the threshold (yes in S15), it detects that the nozzle body 52 has returned to the origin position (S16). After the origin position detection unit 103 detects that the nozzle body 52 has returned to the origin position, the processing of the control unit 10 proceeds to step S2.

[0102] Figure 10 This is an example graph showing the relationship between time and the pressure value obtained by pressure sensor 55. Figure 10 In the diagram, the horizontal axis represents time [sec], and the vertical axis represents pressure value [Pa]. When the drive control unit 101 drives the motor 531 in step S13, the pressure value increases as time passes. Here, in step S16, the origin position detection unit 103... Figure 10 As indicated by symbol P1, when the pressure value is above a threshold, for example 45 Pa, the nozzle body 52 is detected to return to the origin position.

[0103] As described above, when the pressure value obtained by the pressure sensor 55 exceeds a preset threshold, the origin position detection unit 103 detects that the nozzle body 52 has returned to the origin. Here, because the space between the motor 531 and the nozzle body 52 is a space with design freedom, the pressure sensor 55 can be designed in any shape, and the configuration of the processing unit 1 can be miniaturized. For example, the pressure sensor 55 can be designed as a thin film and is small in size.

[0104] Furthermore, through step S16, when the pressure value at at least two of the multiple pressure detection points exceeds a preset threshold, the origin position detection unit 103 detects that the nozzle body 52 has returned to the origin position. By using the detection results of multiple pressure detection points, the return of the nozzle body 52 to the origin position can be detected with high accuracy. In addition, it can be confirmed whether the shaft-shaped portion 52b of the nozzle body 52 uniformly abuts against the pressure sensor 55.

[0105] Furthermore, as described above, the pressure sensor 55 has a through hole 55H through which the shaft 532 passes, and is located at the end 531E of the motor 531 protruding from the shaft 532. Therefore, in step S16, the origin position detection unit 103 can reliably detect that the nozzle body 52 has returned to the origin.

[0106] (Movement towards the pressure detection position)

[0107] Figure 9The symbol A2 represents the process executed by the control unit 10 as the initial setting of step S1, and is a flowchart illustrating an example of the process of moving the nozzle body 52 to the pressure detection position. The pressure detection position is, for example, the origin position. Figure 9 The processing of step S21, as shown by symbol A2, can also be compared with... Figure 9 The process of step S11, as shown by symbol A1, is the same.

[0108] Figure 9 The processes in steps S22 to S24, as shown by symbol A2, are sequentially connected with... Figure 9 The processing of steps S12 to S14, as shown by symbol A1, is the same. Furthermore, the control unit 10 and... Figure 9 The processes of steps S15 and S16, as indicated by symbol A1, are executed in parallel. Figure 9 The symbol A2 indicates the processing steps S25 to S27.

[0109] like Figure 9 As indicated by symbol A2, in step S24, after the data acquisition unit 102 completes the acquisition of data from the pressure sensor 55, the anomaly detection unit 104 of the origin position detection unit 103 determines whether there is a difference in the time-dependent change of the pressure value detected at each of the plurality of pressure detection points (S25). Furthermore, in step S25, the anomaly detection unit 104 may also determine whether there is a difference in the time-dependent change of the pressure value at at least two pressure detection points included in the plurality of pressure detection points.

[0110] Figure 11 This is an example graph showing the relationship between time and pressure values ​​at multiple pressure detection points obtained by pressure sensor 55. Figure 11 In the diagram, the horizontal axis represents time [sec], and the vertical axis represents pressure [Pa].

[0111] also, Figure 11 The pressure values ​​PV1, PV2, and PV3 represent the pressure values ​​at the first, second, and third pressure detection points, respectively. These three pressure detection points comprise the multiple pressure detection points of the pressure sensor 55. When the drive control unit 101 drives the motor 531 in step S23, the pressure values ​​increase over time.

[0112] Anomaly detection unit 104, for example, in Figure 11 In the case indicated by symbol B1, it is determined that the time-dependent changes in pressure values ​​PV1, PV2, and PV3 detected at each of the first, second, and third pressure detection points are indistinguishable.

[0113] In addition, for example, such as Figure 11As indicated by symbol B2, consider the following situation: A significant difference D1 is identified between the pressure value PV2 detected at the second pressure detection point and the pressure values ​​PV1 and PV3 detected at the first and third pressure detection points at the same time. In this case, the anomaly detection unit 104 determines that the time-dependent changes in pressure values ​​PV1, PV2, and PV3 are different.

[0114] In other words, if the anomaly detection unit 104 confirms a significant difference between the pressure value detected at any one of the multiple pressure detection points and the pressure value detected at other pressure detection points at the same time, it determines that the time-dependent change of the pressure value detected at each of the multiple pressure detection points is different.

[0115] In addition, for example, such as Figure 11 As indicated by symbol B3, consider the following situation: A significant difference is identified between the rate of change of the pressure value PV2 detected at the second pressure detection point within a specific period T1 and the rate of change of the pressure values ​​PV1 and PV3 detected at the first and third pressure detection points within the same specific period T1. In this case, the anomaly detection unit 104 determines that there is a difference in the time-dependent changes of the pressure values ​​PV1, PV2, and PV3. The rate of change is the proportion of the pressure value relative to the specific period T1. The specific period T1 is, for example, the period between the time points when pressure values ​​are acquired that are adjacent in time.

[0116] In this way, if the anomaly detection unit 104 determines that there is a difference in the time-dependent change of the pressure value detected at each of the multiple pressure detection points when it confirms that the rate of change of the pressure value detected at any one of the multiple pressure detection points over a specific period is significantly different from the rate of change of the pressure value detected at other pressure detection points over a specific period.

[0117] If the anomaly detection unit 104 determines that there is a difference in the time-dependent change of the pressure value detected at each of the multiple pressure detection points (yes in S25), it determines that the forward and backward movement of the shaft 532 is abnormal (S26). At this time, the control unit 10 causes the alarm output unit (not shown) to output an alarm.

[0118] Through steps S25 and S26, anomalies occurring during the forward and backward movement of shaft 532 can be accurately determined. Examples of anomalies in the forward and backward movement of shaft 532 include deformation of shaft 532 and misalignment of shaft 532 with the central axis of motor 531. Such deformation and misalignment are caused by the deterioration of shaft 532 over time or by thermal effects applied to shaft 532.

[0119] Furthermore, if the pressure detection position is the origin position in step S21 and is true in step S25, the anomaly detection unit 104 can also determine that there is an anomaly in the return of the nozzle body 52 to the origin position. Therefore, it is possible to accurately determine any anomalies that occur when the nozzle body 52 returns to the origin position.

[0120] On the other hand, if the anomaly detection unit 104 determines that the time-dependent changes in pressure values ​​detected at each of the multiple pressure detection points are not different (no in S25), it determines that the forward and backward movement of the shaft 532 is normal (S27). Furthermore, if the pressure detection position in step S21 is the origin position, and no in step S25, the anomaly detection unit 104 can also determine that the return of the nozzle body 52 to the origin position is normal. After the anomaly detection unit 104 determines that the forward and backward movement of the shaft 532 is normal, the processing of the control unit 10 proceeds to step S2.

[0121] Based on the above, the anomaly detection unit 104 detects anomalies in the forward and backward movement of the shaft 532 based on the pressure values ​​of at least two pressure detection points included in the multiple pressure detection points. In this way, by using the detection results of multiple pressure detection points, anomalies in the forward and backward movement of the shaft 532 can be detected with high accuracy.

[0122] (Variation Example 1)

[0123] Figure 12 This is a cross-sectional view of the nozzle block 50A included in the processing unit of Variation 1 of the present invention. The processing unit of Variation 1 includes the nozzle block 50A as a configuration corresponding to the nozzle block 50. Figure 12 As shown, the nozzle block 50A includes a nozzle body 52, a motor 531, a shaft 532, a housing 534, and a support shaft 611. Additionally, in Figure 12 The support base 54, bearing 533, sealing ring 536 and pressing component 537 are omitted.

[0124] The support shaft 611 provides auxiliary support for the nozzle body 52. ​​One end of the support shaft 611 is fixed to the shaft-shaped portion 52b of the nozzle body 52, and the other end of the support shaft 611 is connected to the housing 534.

[0125] The housing 534 has a shaft hole 612, and the support shaft 611 has threads on its outer circumference. The support shaft 611 is engaged with the housing 534 by a screw provided in the shaft hole 612 through the threads of the support shaft 611. Therefore, when the shaft 532 is rotated by the motor 531 and the nozzle body 52 moves in the radial direction of the substrate S, the support shaft 611 also moves in the radial direction of the substrate S.

[0126] (Variation Example 2)

[0127] Figure 13This is a cross-sectional view showing an example of the on / off valve VA included in the processing unit of Variation 2 of the present invention. Figure 13 As shown, the on / off valve VA has a housing 211, an opening / closing part 212, a shaft 213, an actuator 214, and a pressure sensor 56. The on / off valve VA is a needle valve.

[0128] An on / off valve VA is provided on pipe 217, and opens or closes the flow path 218 of pipe 217 through which the processing liquid flows, based on a control signal from a drive control unit 101 (described later) of a control unit (not shown) included in the processing unit. Furthermore, pipe 217 guides the processing liquid to a supply unit (not shown) that supplies processing liquid to the substrate S. This supply unit is, for example, a nozzle body 52.

[0129] The housing 211 internally houses the shaft 213, actuator 214, and pressure sensor 56. The opening / closing section 212 opens and closes the flow path 218 of the pipe 217 that guides the processing liquid to the supply section supplying the processing liquid to the substrate S. In other words, the opening / closing section 212 is an example of a surface treatment mechanism for performing a specified surface treatment on the substrate S. The opening / closing section 212 has a diaphragm 212a and a connecting section 212b. The diaphragm 212a is made of a plastic material such as resin.

[0130] The connecting portion 212b connects the diaphragm 212a to the shaft 213. A sealing ring 216 is provided in a groove formed in the connecting portion 212b to seal the space between the connecting portion 212b and the housing 211. A spring 215 is provided between the connecting portion 212b and the housing 211. One end of the shaft 213 is connected to the connecting portion 212b, and the other end of the shaft 213 is connected to the motor 214a of the actuator 214.

[0131] The actuator 214 includes a motor 214a, a connecting portion 214b, and a support portion 214c. The motor 214a is connected to the other end of the shaft 213, causing the shaft 213 to move forward and backward. Driven by the motor 214a, the shaft 213 moves forward and backward in a direction that causes the opening and closing portion 212 to open and close the flow path 218, as an example of a predetermined direction. In other words, the shaft 213 moves forward and backward in the direction in which the actuator 214 and the opening and closing portion 212 are arranged.

[0132] Connecting part 214b connects motor 214a to support part 214c. Support part 214c supports pressure sensor 56. Shaft 213 moves forward and backward driven by motor 214a, thereby changing the distance between shaft 213 and support part 214c.

[0133] Pressure sensor 56 acquires the pressure value generated between support 214c and shaft 213 at multiple pressure detection points as it moves through opening / closing part 212 and guided by shaft 213 towards opening flow path 218. Pressure sensor 56 differs from pressure sensor 55 at points where a through hole 55H is not formed and at points where its shape is not approximately annular.

[0134] The processing unit in Variation Example 2 has the same control unit as Control Unit 10, including a drive control unit 101, a data acquisition unit 102, and an origin position detection unit 103. In this case, the functions of the drive control unit 101, data acquisition unit 102, and origin position detection unit 103 in the control unit of Variation Example 2 can also be the same as those in Control Unit 10.

[0135] [Software Implementation Example]

[0136] The function of the processing unit 1 (hereinafter referred to as the "device") is implemented by a program, which is used to enable the computer to function as the device and to enable the computer to function as each control block of the device (in particular, each part included in the control unit 10).

[0137] In this configuration, the device comprises a computer having at least one control unit (e.g., a processor such as a CPU (Central Processing Unit)) and at least one storage device (e.g., a memory) as hardware for executing the program. The program is executed via the control unit and the storage device, thereby achieving the functions described in this embodiment.

[0138] The program may be recorded on one or more non-transitory, computer-readable recording media. The device may or may not have the recording media. In the latter case, the program may be supplied to the device via any wired or wireless transmission medium.

[0139] Furthermore, some or all of the functions of each control block can also be implemented through logic circuits. For example, integrated circuits that form the logic circuits that enable the functions of each control block are also included within the scope of this invention.

[0140] 〔Summarize〕

[0141] A substrate processing apparatus according to one aspect of the present invention comprises: a surface treatment mechanism for performing a predetermined surface treatment on a substrate; a shaft, one end of which is connected to the surface treatment mechanism and the other end of which is connected to an actuator, and which moves forward and backward in a predetermined direction by being driven by the actuator; a pressure sensor for acquiring, at a plurality of pressure detection points, a pressure value generated between the actuator, the surface treatment mechanism, or the shaft as the shaft moves in the predetermined direction guided by the surface treatment mechanism; and an anomaly detection unit for detecting an anomaly in the forward and backward movement of the shaft based on the pressure value at least two of the plurality of pressure detection points.

[0142] The substrate processing apparatus of one aspect of the present invention may further include: a rotation mechanism for holding a circular substrate in a horizontal position and rotating it about a vertical axis passing through the center of the substrate; and the surface treatment mechanism is disposed below the substrate and is a nozzle body that sprays treatment liquid from a spray outlet toward the periphery of the lower surface of the substrate; the axis moves back and forth in the radial direction of the substrate as the predetermined direction.

[0143] In one aspect of the substrate processing apparatus of the present invention, it may also be determined that the forward and backward movement of the shaft is abnormal when the time-dependent change of the pressure value detected by the anomaly detection unit at each of the plurality of pressure detection points is different.

[0144] In one aspect of the substrate processing apparatus of the present invention, the anomaly detection unit may determine that the forward and backward movement of the shaft is abnormal if it finds a significant difference between the pressure value detected for any one of the plurality of pressure detection points and the pressure values ​​detected for other pressure detection points at the same time.

[0145] In a substrate processing apparatus of one aspect of the present invention, the anomaly detection unit may determine that the forward and backward movement of the shaft is abnormal if it confirms a significant difference between the rate of change of the pressure value detected at any one of the plurality of pressure detection points over a specific period and the rate of change of the pressure value detected at the other pressure detection points over the same specific period.

[0146] In one aspect of the substrate processing apparatus of the present invention, the pressure sensor may also have a through hole through which the shaft passes and be disposed at the end of the actuator protruding from the shaft.

[0147] The substrate processing apparatus of one aspect of the present invention may further include: a bearing extending from the end of the actuator in the direction of reciprocating movement of the shaft, and housing the shaft therein, having an inner peripheral surface that allows the surface treatment mechanism to slide; and the pressure sensor being housed within the bearing.

[0148] In one aspect of the substrate processing apparatus of the present invention, the central axis of the actuator, the central axis of the shaft, and the central axis of the bearing may also be aligned.

[0149] One aspect of the substrate processing method of the present invention is as follows: a shaft is connected at one end to a surface treatment mechanism for performing a specified surface treatment on a substrate, and at the other end to an actuator, and moves forward and backward in a specified direction by being driven by the actuator; pressure values ​​generated between the actuator, the surface treatment mechanism, or the shaft are obtained at multiple pressure detection points in a pressure sensor as the shaft moves in the specified direction guided by the surface treatment mechanism; and an abnormality in the forward and backward movement of the shaft is detected based on the pressure values ​​at at least two pressure detection points included in the plurality of pressure detection points.

[0150] [Additional Notes]

[0151] This invention is not limited to the embodiments described herein. Various modifications can be made within the scope of the claims. Embodiments obtained by appropriately combining multiple technical methods disclosed in the embodiments are also included within the technical scope of this invention.

[0152] [Explanation of Symbols]

[0153] 1 processing unit

[0154] 2. Maintaining Rotation Mechanism

[0155] 10 control units

[0156] 531 electric motor

[0157] 531E end

[0158] 52 Nozzle Body

[0159] 55, 56 pressure sensors

[0160] 55F plane

[0161] 55H Through Hole

[0162] 103 Origin Position Detection Department

[0163] 104 Anomaly Detection Department

[0164] 212 Opening and Closing Section

[0165] 213, 532 axes

[0166] 214 actuator

[0167] 533 bearing

[0168] 533F inner circumferential surface

[0169] D1 Significant difference

[0170] T1 specific period

[0171] S substrate.

Claims

1. A substrate processing apparatus comprising: a surface treatment mechanism for performing a specified surface treatment on a substrate; The shaft is connected at one end to the surface treatment mechanism and at the other end to the actuator, and moves forward and backward in a specified direction by being driven by the actuator. A pressure sensor acquires, at multiple pressure detection points, the pressure value generated between the actuator, the surface treatment mechanism, or the shaft as the surface treatment mechanism moves in the predetermined direction guided by the shaft through the surface treatment mechanism. and The anomaly detection unit detects anomalies in the forward and backward movement of the shaft based on the pressure values ​​of at least two pressure detection points included in the plurality of pressure detection points.

2. The substrate processing apparatus according to claim 1, further comprising: a rotation mechanism for holding a circular substrate in a horizontal position and rotating it about a vertical axis passing through the center of the substrate; and The surface treatment mechanism is disposed below the substrate and is a nozzle body that sprays treatment liquid from the spray outlet toward the periphery of the lower surface of the substrate; The axis moves forward and backward in the radial direction of the substrate, which is the predetermined direction.

3. The substrate processing apparatus according to claim 1, wherein if the time-dependent change in the pressure value detected by the abnormality detection unit at each of the plurality of pressure detection points is different, it is determined that the forward and backward movement of the shaft is abnormal.

4. The substrate processing apparatus according to claim 3, wherein the anomaly detection unit determines that the forward and backward movement of the shaft is abnormal if it confirms a significant difference between the pressure value detected for any one of the plurality of pressure detection points and the pressure values ​​detected for other pressure detection points at the same time.

5. The substrate processing apparatus according to claim 3, wherein the anomaly detection unit determines that the forward and backward movement of the shaft is abnormal if it confirms a significant difference between the rate of change of the pressure value detected for any one of the plurality of pressure detection points over a specific period and the rate of change of the pressure value detected for the other pressure detection points over the same specific period.

6. The substrate processing apparatus of claim 1, wherein the pressure sensor forms a through hole through which the shaft passes and is disposed at the end of the actuator protruding from the shaft.

7. The substrate processing apparatus according to claim 6, further comprising: a bearing extending from the end of the actuator in the direction of reciprocating movement of the shaft, and housing the shaft therein, having an inner peripheral surface for sliding the surface treatment mechanism; and The pressure sensor is housed within the bearing.

8. The substrate processing apparatus according to claim 7, wherein the central axis of the actuator, the central axis of the shaft, and the central axis of the bearing are aligned.

9. A substrate processing method comprising: connecting one end of a shaft to a surface processing mechanism for performing a specified surface treatment on a substrate, and connecting the other end to a shaft of an actuator, and moving forward and backward in a specified direction by being driven by the actuator; Among multiple pressure detection points in the pressure sensor, the pressure value generated between the actuator, the surface treatment mechanism, or the shaft is obtained as the surface treatment mechanism moves in the predetermined direction guided by the shaft; and Based on the pressure values ​​of at least two pressure detection points included in the plurality of pressure detection points, abnormalities in the forward and backward movement of the shaft are detected.

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