Easi3b module with improved heat dissipation performance

Abstract

The invention discloses an easy3b module with improved heat dissipation performance, and relates to the technical field of power module heat dissipation, the easy3b module comprises a power module, a plurality of chips are integrated on the power module, the easy3b module further comprises a heat conduction structure fixed on the power module, a cavity is formed in the heat conduction structure, and a capillary structure and phase change liquid are arranged in the cavity, the heat conduction structure is used for absorbing heat of the power module and the chip; the soaking structure is fixed to the side, away from the chip, of the heat conduction structure, the side, facing the heat conduction structure, of the soaking structure is provided with an opening, the opening is provided with a phase change material, the phase change material is arranged between the soaking structure and the heat conduction structure in a surrounding mode, and the phase change material is attached to the corresponding faces of the soaking structure and the heat conduction structure at the same time; the projection of the phase change material on the corresponding surface of the power module at least covers the positions of the plurality of chips. In this way, the maximum value of the local highest temperature caused by heating of the chip position on the power module can be reduced, and it is avoided that a safety threshold value is reached.

Description

Technical Field

[0001] This invention relates to the field of power module heat dissipation technology, and specifically to an easy3b module with improved heat dissipation performance. Background Technology

[0002] As a core functional module of power electronic systems, the easy3b module is widely used in voltage conversion, power drive, and other scenarios. Its operational stability directly determines the reliability of the entire system. With the increasing demand for power density in the new energy and industrial automation sectors, the output power of the easy3b module often exceeds 50W. This leads to concentrated heat generation in some internal power devices (such as IGBTs and rectifier diodes), highlighting the significant shortcomings of existing heat dissipation solutions. Traditional easy3b modules mostly use a heat dissipation structure of "solid copper substrate + surface mount heat sink" - the thermal conductivity of the solid copper substrate is only about 200W / (m²). Furthermore, the heat dissipation performance is poor, and it is impossible to quickly disperse local hot spots in the device (such as the temperature of the IGBT chip area being 15-20℃ higher than the surrounding area); under high power conditions, the temperature of local hot spots is likely to exceed the safety threshold of 150℃, which leads to increased switching losses, accelerated thermal fatigue, and even thermal failure. Summary of the Invention

[0003] This invention aims to solve the problem of poor heat dissipation performance and excessive local hot spots that can easily lead to thermal failure in existing easy3b modules.

[0004] To address the above problems, this invention provides an easy3b module with improved heat dissipation performance, including a power module on which multiple chips are integrated, and further comprising: A thermally conductive structure is fixed to the power module and bonded to multiple chips. A cavity is formed inside the thermally conductive structure, and a capillary structure and a phase change liquid are provided inside the cavity. The thermally conductive structure is used to absorb the heat of the power module and the chips. The heat dissipation structure is fixed to the heat conduction structure on the side away from the chip, and the side facing the heat conduction structure is set as an opening. A phase change material is provided at the opening. The phase change material is surrounded between the heat dissipation structure and the heat conduction structure. The phase change material is simultaneously attached to the corresponding surfaces of the heat dissipation structure and the heat conduction structure. The projection of the phase change material on the corresponding surface of the power module covers the positions of at least multiple chips.

[0005] The present invention provides an easy3b module with improved heat dissipation performance, which, compared with the prior art, has, but is not limited to, the following beneficial effects: The heat-conducting structure incorporates capillary structures and a phase-change liquid. When the power module is operational, the entire module and its chip generate heat, which is transferred to the heat-conducting structure through contact with it. A cavity is formed within the heat-conducting structure; the side of the cavity closest to the power module is a high-temperature zone, while the side furthest from the power module is a low-temperature zone. The phase-change liquid within the heat-conducting structure heats up synchronously with the structure. Upon reaching a certain temperature, a phase change occurs, the liquid vaporizes, and moves to the side furthest from the power module—the low-temperature zone. In the low-temperature zone, it releases heat and liquefies, reforming into a liquid state. It then returns to the high-temperature zone with the capillary structure to absorb heat. With a specific material selection for the heat-conducting structure, the internal arrangement of capillary structures and a phase-change liquid can further improve its thermal conductivity. The thermal structure absorbs heat from the power module, but due to the large amount of heat generated at the chip locations, the local temperature is too high, resulting in uneven surface temperatures on the thermally conductive structure. In this case, a heat-spreading structure containing phase change material is used. The projection of the phase change material on the corresponding surface of the power module covers at least several chip locations. This structure can absorb heat from the higher-temperature areas on the thermally conductive structure and transfer this heat in at least two directions: firstly, it transfers heat to the heat-spreading structure by adhering to it; secondly, it transfers heat to the lower-temperature areas on the thermally conductive structure, i.e., areas not near the chips. In this way, the maximum local temperature on the power module caused by chip-related heat generation can be reduced, preventing it from reaching the safety threshold.

[0006] As a further aspect of the present invention, the phase change material is a solid-liquid phase change.

[0007] As a further aspect of the present invention, the phase change material contains at least a paraffin component.

[0008] As a further aspect of the present invention: the phase change material further includes expanded graphite, and the mass fraction of paraffin in the phase change material is higher than the mass fraction of expanded graphite in the phase change material.

[0009] As a further aspect of the present invention: a cooling fan is connected to the side of the heat dissipation structure that is opposite to the heat conduction structure, wherein the airflow generated by the cooling fan when it is working is directed toward the heat dissipation structure.

[0010] As a further aspect of the present invention: the cooling fan is connected to the heat dissipation structure via a heat sink.

[0011] As a further aspect of the present invention: a number of evenly distributed protrusions are formed on the side of the heat sink that is directly opposite the cooling fan.

[0012] As a further aspect of the present invention, a thermally conductive material is coated between the thermally conductive structure and the power module.

[0013] As a further aspect of the present invention, at least one of the heat-conducting structure, heat-spreading structure, and heat sink is made of copper.

[0014] As a further aspect of the present invention, the heat dissipation structure and the heat conduction structure are integrally formed. Attached Figure Description

[0015] The invention will now be further described with reference to the accompanying drawings.

[0016] Figure 1 This is a schematic diagram of the overall structure of Embodiment 1 of the present invention; Figure 2 This is a schematic diagram of the overall side view of the structure according to Embodiment 1 of the present invention; Figure 3 This is a simulation temperature model diagram of the power module in operation before the improvement of this invention. In the diagram, the red end of the bar structure represents the highest temperature value, and the blue end represents the lowest temperature value. Figure 4 This is a simulation temperature model diagram of the improved power module in the working state according to the present invention. In the diagram, the red end of the bar structure represents the highest temperature value, and the blue end represents the lowest temperature. Figure 5 This is a schematic diagram of the overall perspective structure of Embodiment 2 of the present invention; Figure 6 This is a perspective structural diagram showing the correspondence between the thermally conductive surface and the chip in the power module in Embodiment 2 of the present invention.

[0017] In the diagram: 1. Power module; 11. Chip; 2. Thermal conduction structure; 21. Capillary structure; 3. Heat dissipation structure; 31. Phase change material; 4. Cooling fan; 41. Heat sink; 42. Bump; 5. Auxiliary heat transfer structure; 51. Thermal conductive surface; 52. Suspended structure. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings showing multiple embodiments according to this application. It should be understood that the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. All other embodiments obtained by those skilled in the art based on the embodiments described in this application without creative effort will fall within the scope of protection of this application.

[0019] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used in the description of this application is for the purpose of describing specific embodiments only and is not intended to limit this application; the terms "comprising," "including," "having," "containing," etc., in the description, claims, and accompanying drawings of this application are open-ended terms. Therefore, "comprising," "including," or "having" refers to, for example, a method or apparatus having one or more steps or elements, but is not limited to having only these one or more elements. The terms "first," "second," etc., in the description, claims, or accompanying drawings of this application are used to distinguish different objects, not to describe a specific order or hierarchy. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0020] In the description of this invention, it should be understood that the terms "upper", "lower", "left", "right", "front", "rear", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0021] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "attachment" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0022] It should be emphasized that when the term "comprising / including" is used in this specification, it is used to explicitly indicate the presence of the stated feature, integer, step, or component, but does not exclude the presence or addition of one or more other features, integers, steps, parts, or groups of features, integers, steps, or parts.

[0023] In this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, in this application, the character " / " generally indicates that the preceding and following related objects have an "or" relationship.

[0024] Example 1: like Figure 1-2 As shown, an easy3b module with improved heat dissipation performance includes a power module 1, on which multiple chips 11 are integrated. It also includes: a heat-conducting structure 2, fixed to the power module 1 and attached to the multiple chips 11, with a cavity formed within the heat-conducting structure 2. The cavity contains a capillary structure 21 and a phase change liquid. The heat-conducting structure 2 is used to absorb heat from the power module 1 and the chips 11. A heat-spreading structure 3, fixed to the heat-conducting structure 2 on the side away from the chips 11, has an opening on the side facing the heat-conducting structure 2. A phase change material 31 is provided at the opening, and the phase change material 31 is surrounded between the heat-spreading structure 3 and the heat-conducting structure 2. The phase change material 31 is simultaneously attached to the corresponding surfaces of the heat-spreading structure 3 and the heat-conducting structure 2. The projection of the phase change material 31 on the corresponding surface of the power module 1 covers at least the positions of the multiple chips 11.

[0025] In this embodiment, a capillary structure 21 and a phase change liquid are arranged inside the heat-conducting structure 2. When the power module 1 is in operation, the entire module and the chip 11 generate heat. The heat generated is transferred to the heat-conducting structure 2 through contact with it, forming a cavity inside the heat-conducting structure 2. The side of the cavity closer to the power module 1 is a high-temperature zone, and the side farther away from the power module 1 is a low-temperature zone. The phase change liquid inside the heat-conducting structure 2 heats up synchronously with the heat-conducting structure 2. When the temperature reaches a certain level, a phase change occurs, vaporizing and moving to the side farther away from the power module 1, i.e., the low-temperature zone. In the low-temperature zone, it releases heat and liquefies, reforming into a liquid state. It then returns to the high-temperature zone with the capillary structure 21 to absorb heat. When the material of the heat-conducting structure 2 is chosen to be specific, the heat conduction effect of the heat-conducting structure 2 can be further improved by arranging the capillary structure 21 and the phase change liquid inside. The heat-conducting structure 2 absorbs heat from the power module 1. However, due to the large amount of heat generated at the location of chip 11, its local temperature is too high, resulting in uneven surface temperatures on the heat-conducting structure 2. At this time, the heat-spreading structure 3, which contains phase change material 31, has a projection on the corresponding surface of the power module 1 covering at least multiple locations of chip 11. It can absorb the heat from the corresponding high-temperature areas on the heat-conducting structure 2 and transfer the heat in at least two directions. One is to transfer heat to the heat-spreading structure 3 by adhering to it, and the other is to transfer heat to the low-temperature areas on the heat-conducting structure 2, i.e., areas not near chip 11. In this way, the maximum local temperature caused by the heat generated at the location of chip 11 on the power module 1 can be reduced, thus avoiding reaching the safety threshold.

[0026] Optionally, the phase change material 31 may be a solid-liquid phase change.

[0027] In this embodiment, the phase change material 31 is selected as a solid-liquid phase change, so that the phase change material 31 has a certain fluidity after the phase change, which can fully contact the heat-conducting structure 2 to absorb heat, which is conducive to balancing the temperature of each local hot spot on the heat-conducting structure 2 and achieving a uniform heat distribution effect.

[0028] Optionally, the phase change material 31 contains at least a paraffin component.

[0029] In this embodiment, the phase change material 31 includes at least paraffin wax because paraffin wax has a large latent heat, which makes it easier to absorb more heat during the phase change process, and its melting point is lower than the highest temperature at which the easy3b module generates heat during operation, which makes it easier to absorb heat and generate a phase change.

[0030] Optionally, the phase change material 31 also contains expanded graphite, and the mass fraction of paraffin in the phase change material 31 is higher than the mass fraction of expanded graphite in the phase change material 31.

[0031] In this embodiment, expanded graphite is mixed into the phase change material 31, which can improve the structural stability of the phase change material in the solid state. Secondly, the thermal conductivity of expanded graphite is large, which is beneficial to improve the overall heat absorption rate of the phase change material 31 and facilitates rapid cooling.

[0032] In one possible implementation, the phase change material 31 contains 70% paraffin by mass and 30% expanded graphite by mass, and the thickness of the phase change material 31 when it is in a solid state within the heat-spreading structure 3 does not exceed 1.8 mm.

[0033] like Figure 1-2 As shown, optionally, a cooling fan 4 is connected to the side of the heat dissipation structure 3 that is away from the heat conduction structure 2, wherein the airflow generated by the cooling fan 4 when it is working is directed toward the heat dissipation structure 3.

[0034] In this embodiment, by arranging a cooling fan 4 and directing the airflow of the cooling fan 4 directly towards the heat dissipation structure 3, the heat absorption and cooling effect on the heat dissipation structure 3 can be further accelerated, thereby increasing the overall heat dissipation speed.

[0035] like Figure 1-2 As shown, optionally, the cooling fan 4 is connected to the heat dissipation structure 3 via the heat sink 41.

[0036] In this embodiment, the cooling fan 4 is connected to the heat dissipation structure 3 through the heat sink 41. Through heat conduction, some heat can be transferred to the cooling fan 4, which can further provide an outlet for heat dissipation.

[0037] like Figure 1-2As shown, optionally, a number of evenly distributed protrusions 42 are formed on the side of the heat sink 41 that is directly opposite the cooling fan 4.

[0038] In this embodiment, the protrusions 42 increase the contact area between the heat sink 41 and the airflow blown by the cooling fan 4, further increasing the heat dissipation area and improving the speed of heat dissipation.

[0039] In one possible implementation, the heat sink has dimensions of 55mm × 35mm × 5mm, the number of protrusions 42 is 100-120, the protrusions 42 have a diameter of 0.5mm and a height of 0.8mm, and the spacing between the protrusions 42 is 0.3mm.

[0040] Optionally, a thermally conductive material 22 is coated between the thermally conductive structure 2 and the power module 1.

[0041] In this embodiment, by coating the heat-conducting structure 2 and the power module 1 with a heat-conducting material 22, the bonding effect between the heat-conducting structure 2 and the power module 1 can be further improved, avoiding the problem of poor heat dissipation caused by poor contact.

[0042] In one possible implementation, the thermally conductive material 22 is implemented as thermally conductive silicone grease with a thermal conductivity of 8.5 W / (m²). K).

[0043] Optionally, at least one of the heat-conducting structure 2, the heat-spreading structure 3, and the heat sink 41 is made of copper.

[0044] In this embodiment, the thermal conductivity of copper is higher, reaching 200 W / (m²). K), and has a high production cost-performance ratio.

[0045] Optionally, the heat dissipation structure 3 and the heat conduction structure 2 are integrally formed.

[0046] In this embodiment, the heat dissipation structure 3 and the heat conduction structure 2 are integrally formed, reducing the assembly process and making the improved design more modular.

[0047] In one detailed implementation: The main body of the easy3b module adopts the commercially available standard easy3b functional module. Its core power circuit includes an IRF540N IGBT chip (15mm×10mm in area), an FR107 rectifier diode, and an LM358 driver chip. The external interface of the module follows the standard pin definition. The bottom copper layer is 0.3mm thick and is used to bond with the heat conduction structure 2 for heat conduction. The total thickness of the module body is 10mm, and the length and width are 55mm×35mm to ensure that it matches the size of the subsequent heat dissipation components.

[0048] Thermal Conductive Structure 2: The shell uses T2 copper as the substrate and cover plate, and is encapsulated into a closed structure through vacuum brazing. The overall dimensions are 55mm × 35mm × 2mm (length and width tolerance ±0.1mm, thickness tolerance ±0.05mm). The internal closed vapor chamber accounts for approximately 60% of the volume. The inner wall of the chamber is lined with copper powder capillary cores through a sintering process. The copper powder particle size is 8μm, the sintering temperature is 850℃, and the holding time is 30min, forming interconnected capillary channels with a pore size of 5-10μm to ensure efficient recirculation of the working fluid. The phase change working fluid inside the chamber is high-purity deionized water (resistivity ≥18MΩ). The working fluid, consisting of 40% of the steam chamber volume, is injected. After injection, the injection port is sealed using laser welding to ensure no leakage. The working fluid has a boiling point of 100℃ and is compatible with the module's operating temperature range of 40-80℃. The connection surface between the thermally conductive structure 2 and the power module 1 is ground (roughness Ra≤0.1μm) and coated with 0.1mm thick Henkel BERGQUIST GAPPAD8000 thermal grease (thermal conductivity 8.5W / (m²)). K), with an operating temperature range of 40℃-150℃), is aligned and bonded to the IGBT chip concentration area at the bottom of the easy3b module body, with the bonding pressure controlled at 0.3MPa to ensure that the thermal grease is evenly filled in the gaps without any air bubbles.

[0049] Phase Change Material 31: The material uses paraffin wax (melting point 45℃, industrial grade, purity ≥99%) as the phase change matrix, mixed with 30% by mass of expanded graphite (particle size 200 mesh, expansion ratio ≥200 times). After being uniformly mixed by high-speed stirring (3000 rpm, stirring time 20 min), 0.5% by mass of silane coupling agent (KH550) is added to improve compatibility. The molding process involves pouring the mixture into a mold (dimensions 55mm×35mm×1.8mm), holding it at a molding temperature of 60℃ and a pressure of 0.2MPa for 15 min, cooling to room temperature, and then demolding to obtain Phase Change Material 31. Its phase change temperature is 45℃, latent heat is 165kJ / kg, density is 0.95g / cm³, and compressive strength is ≥0.8MPa, ensuring that it does not deform during module installation and operation.

[0050] Heat sink 41: Made of T2 copper, it is CNC milled into a flat plate structure of 55mm×35mm×5mm (length and width tolerance is ±0.1mm, thickness tolerance is ±0.05mm). The lower surface is processed with a micro-bump array by laser engraving: there are a total of 110 bumps 42, distributed in an 11×10 matrix. The diameter of a single bump is 0.5mm and the height is 0.8mm (tolerance ±0.03mm). The distance between the bumps is 0.3mm. The surface of the bumps is electrolytically polished (roughness Ra≤0.2μm) and passivated for anti-oxidation treatment (passivation solution is 5% chromic acid solution, immersion time 10min).

[0051] Cooling Fan 4: Dimensions 40×40×10mm (length, width, and height tolerance ±0.2mm), operating voltage 12V, rated power 0.6W, airflow 5.2CFM, speed 3000rpm, air pressure 2.5mmH2O, noise ≤35dB (A); The fan is fixed to the bottom of the copper heat sink with ABS plastic clips. The clips are injection molded and have an interference fit with the grooves on the edge of the heat sink. The distance between the fan and the lower surface of the heat sink is 2mm, ensuring that the airflow blows vertically to the 42-point array without airflow obstruction.

[0052] The overall assembly process is as follows: First, wipe the contact surfaces of the easy3b module body, heat conduction structure 2, heat dissipation structure 3, and heat sink 41 clean with anhydrous ethanol to remove oil and impurities, and let them dry before use. Apply thermal grease to the corresponding surfaces of thermally conductive structure 2, attach it to the main body of the easy3b module and apply a pressure of about 0.3MPa, and keep it in place for 10 minutes to cure; then attach the heat-spreading structure 3 to the thermally conductive structure 2 with thermal adhesive and cure at room temperature for 24 hours. The cooling fan 4 is fixed to the heat sink 41 with clips. The fan power cable is routed along the edge of the heat sink 41 and connected to the auxiliary power interface of the easy3b module to ensure stable power supply. The entire assembly is secured with four screws (located at the four corners of the module, with hole positions consistent with the standard easy3b module), with the screw tightening torque controlled at 0.8N. m, to avoid over-tightening that could cause component deformation.

[0053] Example 2: like Figure 5-6 As shown, based on Embodiment 1, it also includes an auxiliary heat transfer structure 5, which is fixed on the heat sink 41. The auxiliary heat transfer structure 5 has several thermally conductive surfaces 51, and the projection of the thermally conductive surfaces 51 on the heat transfer structure 2 completely covers at least one chip 11. The auxiliary heat transfer structure 5 also has a suspended structure 52, which is located between the heat sink 41 and the cooling fan 4. The suspended structure 52 is fixedly connected to all the thermally conductive surfaces 51, and the suspended structure 52 is provided with a porous structure for airflow.

[0054] In Embodiment 1, the combination of the heat-conducting structure 2 with capillary structure 21 and the heat-spreading structure 3 with phase change material 31 can reduce the local maximum temperature of the power module 1 during operation. However, the adjustment method involves interconnecting the high-heat and low-heat areas on the power module 1 for cooling. In this design, the low-heat area is already higher than the ambient temperature, resulting in limited heat absorption from the high-heat area. Therefore, the final manifestation on the power module 1, heat-conducting structure 2, heat-spreading structure 3, and heat sink 41 is that there are still localized hot spots. Therefore, an auxiliary heat transfer structure 5 is designed, which attaches the high-heat area on the heat sink 41 to the heat-conducting surface 51, and connects multiple heat-conducting surfaces 51 to the suspended structure 51. The suspended structure 52 is more... The direction closer to the cooling fan 4 can be understood as follows: the side closer to the cooling fan 4 has a relatively lower air temperature, while the side closer to the power module 1 has a relatively higher air temperature. Therefore, the suspended structure 52 is closer to the cooling fan 4 than the heat sink 41. When the cooling fan 4 provides cool airflow for heat dissipation to one side of the power module 1, the cooler airflow will first act on the suspended structure 52 to cool it down. The suspended structure 52 is connected to multiple thermally conductive surfaces 51, which can preferentially act on the high-temperature area of ​​the heat sink 41, and then ultimately act on the chip 11 through layer-by-layer heat transfer. This can achieve a preferential heat dissipation effect on the chip 11 and further reduce the upper temperature limit of the high-temperature area of ​​the power module 1.

[0055] In one possible implementation, the thermally conductive patch 51 is fixed to the heat sink 41 by thermally conductive adhesive.

[0056] While the present invention has been disclosed above, its scope of protection is not limited thereto. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, and all such changes and modifications will fall within the scope of protection of the present invention.

Claims

1. An easy3b module with improved heat dissipation performance, comprising a power module (1), wherein multiple chips (11) are integrated on the power module (1), characterized in that, Also includes: A heat-conducting structure (2) is fixed on the power module (1) and attached to multiple chips (11). A cavity is formed inside the heat-conducting structure (2), and a capillary structure (21) and a phase change liquid are provided inside the cavity. The heat-conducting structure (2) is used to absorb the heat of the power module (1) and the chips (11). The heat dissipation structure (3) is fixed on the side of the heat conduction structure (2) away from the chip (11) and is set as an opening on the side facing the heat conduction structure (2). A phase change material (31) is provided at the opening. The phase change material (31) is surrounded between the heat dissipation structure (3) and the heat conduction structure (2). The phase change material (31) is simultaneously attached to the corresponding surfaces of the heat dissipation structure (3) and the heat conduction structure (2). The projection of the phase change material (31) on the corresponding surface of the power module (1) covers the positions of at least a number of chips (11).

2. The easy3b module with improved heat dissipation performance according to claim 1, characterized in that, The phase change material (31) is a solid-liquid phase change.

3. The easy3b module with improved heat dissipation performance according to claim 2, characterized in that, The phase change material (31) contains at least a paraffin component.

4. The easy3b module with improved heat dissipation performance according to claim 3, characterized in that, The phase change material (31) also contains expanded graphite, and the mass fraction of paraffin in the phase change material (31) is higher than the mass fraction of expanded graphite in the phase change material (31).

5. The easy3b module with improved heat dissipation performance according to claim 1, characterized in that, A cooling fan (4) is connected to the side of the heat-spreading structure (3) that is opposite to the heat-conducting structure (2), wherein the airflow generated by the cooling fan (4) when it is working is directed toward the heat-spreading structure (3).

6. The easy3b module with improved heat dissipation performance according to claim 5, characterized in that, The cooling fan (4) is connected to the heat dissipation structure (3) via the heat sink (41).

7. The easy3b module with improved heat dissipation performance according to claim 6, characterized in that, Several evenly distributed protrusions (42) are formed on the side of the heat sink (41) that is directly opposite the cooling fan (4).

8. The easy3b module with improved heat dissipation performance according to claim 1, characterized in that, A thermally conductive material (22) is coated between the thermally conductive structure (2) and the power module (1).

9. The easy3b module with improved heat dissipation performance according to claim 6, characterized in that, At least one of the heat-conducting structure (2), heat-spreading structure (3), and heat sink (41) is made of copper.

10. The easy3b module with improved heat dissipation performance according to claim 1, characterized in that, The heat dissipation structure (3) and the heat conduction structure (2) are integrally formed.

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