Display module, forming method, related equipment and terminal

Abstract

The embodiment of the invention provides a display module, a forming method, related equipment and a terminal.The display module comprises driving core particles; the driving core particle comprises a plurality of driving electrodes, the plurality of driving electrodes are distributed on the front surface of the driving core particle, and the driving electrodes are arranged in an edge electrode area on at least one side of the driving core particle; the back surface of the driving core particle comprises a bonding pad corresponding to the driving electrode; the bonding pads are electrically connected with the driving electrodes corresponding to the bonding pads based on the through hole connecting structures; and the bonding pad is used as a metal electrode for electrically connecting the display module with an external structure. According to the display module provided by the embodiment of the invention, the overall size of the display module can be reduced.

Description

Technical Field

[0001] The embodiments of the present invention relate to the field of optoelectronic device technology, specifically to a display module, a forming method, related equipment, and a terminal. Background Technology

[0002] Display modules are core display and light-emitting devices in the field of optoelectronic devices. Examples include MicroLED (Micro Light-Emitting Diode) display modules. MicroLED display modules are modular display units that are independently driven at the pixel level and emit light themselves, featuring high brightness, high contrast, long lifespan, and low power consumption. The overall size (footprint) of the display module is one of its core design indicators, directly affecting device integration, manufacturing cost, performance, and application adaptability. Therefore, how to provide technical solutions to reduce the overall size of display modules has become an urgent technical problem to be solved. Summary of the Invention

[0003] In view of this, embodiments of the present invention provide a display module, a method for forming it, related equipment, and a terminal to reduce the overall size of the display module.

[0004] This invention provides a display module, comprising: Drive core; The driving core includes a plurality of driving electrodes, wherein the plurality of driving electrodes are distributed on the front side of the driving core, and the driving electrodes are disposed in the edge electrode region of at least one side of the driving core. The back side of the driving chip includes: pads corresponding to the driving electrodes; the pads and the corresponding driving electrodes are electrically connected based on a through-hole connection structure; the pads are used as metal electrodes for electrical connection between the display module and external structures.

[0005] Optionally, adjacent driving electrodes are arranged at preset electrode spacing; for the edge electrode area where the driving electrodes are provided, the driving electrodes are arranged in at least one row or one column.

[0006] Optionally, the display module further includes: a MicroLED chip located on the front side of the driving chip, the MicroLED chip and the driving chip forming a display panel; the MicroLED chip includes: a display area and an anti-reflection area, on the projection of the driving chip, the anti-reflection area being located in the region between the display area and the edge electrode area; The display module also includes a support substrate and an adhesive structure located between the driving chip and the support substrate; The adhesive structure is located on the front side of the driving core, and the inner edge of the area where the adhesive structure is located is spaced apart from the outer edge of the display area by a first distance.

[0007] Optionally, the display module further includes: solder balls, and / or a heat dissipation enhancement structure; The solder balls are disposed on each solder pad; The heat dissipation enhancement structure is located on the back side of the driving chip, and the area where the heat dissipation enhancement structure is formed corresponds to the display area; When the display module includes the heat dissipation enhancement structure, the heat dissipation enhancement structure also includes a uniformly arranged array of solder balls; The pads include embedded pads and protruding pads.

[0008] Optionally, the adhesive structure is located on the driving chip in a region other than the display area, or in the region between the inner edge of the edge electrode region and the outer edge of the display area; The adhesive structure includes an adhesive, a metal bonding layer, or a combination thereof; the adhesive structure is an integral structure or a collection of multiple phase spacer adhesive structures.

[0009] Optionally, the range of the preset electrode spacing is greater than or equal to 100 micrometers; the distance from the outer edge of the display area to the inner edge of the edge electrode area is greater than or equal to 50 micrometers and less than or equal to 2000 micrometers; the minimum width of the antireflection area is greater than or equal to 20 micrometers; the minimum value of the first distance is greater than or equal to 5 micrometers; and the minimum width of the adhesive structure is greater than or equal to 20 micrometers.

[0010] Optionally, the through-hole connection structure includes: an adhesive barrier layer and a metal pillar, the adhesive barrier layer being disposed on the inner wall of the through-hole connection structure, and the metal pillar filling the inner side of the adhesive barrier layer and adhering to the adhesive barrier layer; the display module further includes: A first insulating layer covers the front side of the drive chip and extends to cover the inner wall of the through-hole connection structure, the inner wall of the through-hole connection structure being separated from the adhesion barrier layer by the first insulating layer.

[0011] Optionally, the display module further includes: A second insulating layer covers the back side of the drive core and contacts the first insulating layer that extends to cover the inner wall of the through-hole connection structure; An anti-reflection structure is disposed on a side surface of the support substrate away from the front of the driving core, and the vertical projection of the disposed area of ​​the anti-reflection structure covers the anti-reflection area and the area from the outer edge of the anti-reflection area to the outer edge of the driving core. A color conversion layer is applied to the display area to convert the original display colors of the display area.

[0012] Optionally, the supporting substrate is a transparent substrate or a non-transparent substrate; The non-transparent substrate has a central hollow structure, and the central hollow area corresponds to and exposes the display area; The thickness of the supporting substrate is greater than or equal to 100 micrometers and less than or equal to 800 micrometers; The thickness of the driving core is greater than or equal to 20 micrometers and less than or equal to 800 micrometers.

[0013] This invention provides a method for forming a display module, comprising: An initial driving wafer is provided, the initial driving wafer including a plurality of device regions arranged in an array, the device regions including edge electrode regions; On the front side of the initial driving wafer, a driving electrode is formed in the edge electrode region on at least one side of each device region; A driving wafer is formed, which is obtained by thinning the initial driving wafer. The driving wafer has through-hole connection structures that electrically connect to the driving electrodes, and pads that electrically connect to the through-hole connection structures are formed on the back side of the driving wafer. The pads are used as metal electrodes for electrically connecting the display module to the external structure. A display module is formed by performing a dicing process on the device region, wherein the driving wafer in the device region serves as the driving chip of the display module.

[0014] Optionally, the initial driving wafer within the device region includes: a MicroLED chip, the MicroLED chip including a display area and an anti-reflection area; the formation of the driving wafer includes: On the front side of the initial driving wafer, a via connection structure is formed at the position corresponding to the driving electrode in each device area; On the front side of the initial driving wafer where the through-hole connection structure is formed, starting from a region at a first distance from the outer edge of the display area of ​​the MicroLED chip, an adhesive structure is formed along the direction pointing towards the edge electrode area; The bonding structure is used to fix the front side of the initial driving wafer, which forms the through-hole connection structure, to the support substrate or temporary substrate to obtain a bonded wafer structure. Flip the bonding wafer structure so that the supporting substrate or the temporary substrate is at the bottom; The back side of the initial driver wafer is thinned to form a via connection structure, and pads are formed on the back side of the initial driver wafer after the via connection structure is formed, thus obtaining the driver wafer.

[0015] Optionally, the initial driving wafer within the device region includes: a MicroLED chip, the MicroLED chip including a display area and an anti-reflection area; the formation of the driving wafer includes: On the front side of the initial driving wafer, starting from a region at a first distance from the outer edge of the display area of ​​the MicroLED chip, an adhesive structure is formed along the direction pointing towards the edge electrode area; The bonding structure is used to fix the front side of the initial driving wafer to the supporting substrate or temporary substrate to obtain a bonded wafer structure. Flip the bonding wafer structure so that the supporting substrate or the temporary substrate is at the bottom; Thin the back side of the initial driver wafer to obtain a thinned initial driver wafer; On the back side of the initial driver wafer after thinning, through-hole connection structures and pads are formed at the positions corresponding to the driver electrodes in each device area to obtain the driver wafer.

[0016] Optionally, when the bonding wafer structure includes a temporary substrate, the method further includes, after the dicing process based on the device region and before forming the display module: Remove the temporary substrate and form a color conversion layer on the display area of ​​the MicroLED chip, or form a color conversion layer on the display area of ​​the MicroLED chip before obtaining the bonding wafer structure; When the bonding wafer structure includes a supporting substrate, a color conversion layer is formed on the display area of ​​the MicroLED chip before the bonding wafer structure is obtained.

[0017] Optionally, when the bonding wafer structure includes a supporting substrate, after forming the driving wafer, the method further includes: An anti-reflection structure is formed on the plane of the support substrate on the side away from the front side of the driving wafer. The vertical projection of the area where the anti-reflection structure is set covers the anti-reflection region and the area from the outer edge of the anti-reflection region to the outer edge of the driving wafer.

[0018] Optionally, the pads forming the through-hole connection structure on the back side of the driving wafer include: On the back surface of the driving wafer, protruding pads are formed that contact the via connection structure. Alternatively, an embedded pad is formed on the back side of the driving wafer to contact the through-hole connection structure.

[0019] Optionally, during the process of forming pads for electrically connecting the through-hole connection structure on the back side of the driving wafer, a heat dissipation enhancement structure is simultaneously formed on the back side of the driving wafer at a position corresponding to the display area.

[0020] Optionally, forming a driving electrode in at least one edge electrode region of each device region on the front side of the initial driving wafer includes: On the front side of the initial driving wafer, the driving circuitry within each device region is adjusted to form a driving electrode in the edge electrode region on at least one side of the device region. Alternatively, on the front side of the initial driving wafer, driving electrodes are formed in the edge electrode region on at least one side of each device region by rewiring.

[0021] This invention provides a display device, including a display module as described in any of the foregoing embodiments.

[0022] This invention provides an optoelectronic device, including a display module as described in any of the foregoing embodiments.

[0023] This invention provides a terminal including a display module as described in any of the foregoing embodiments.

[0024] The display module provided in this embodiment of the invention includes: a driving chip; the driving chip includes a plurality of driving electrodes, wherein the plurality of driving electrodes are distributed on the front side of the driving chip, and the driving electrodes are disposed in the edge electrode region of at least one side of the driving chip; the back side of the driving chip includes: pads corresponding to the driving electrodes; the pads and the corresponding driving electrodes are electrically connected based on a through-hole connection structure; the pads are used as metal electrodes for electrically connecting the display module to an external structure.

[0025] In the display module provided by this invention, a through-hole connection structure is provided on the driving chip to realize the electrical connection between the driving electrode and the pad, thereby enabling direct electrical connection between the display module and the external structure through the pad. It is evident that the display module provided by this invention, on the one hand, improves the flexibility of the driving electrode arrangement on the driving chip by electrically connecting the driving electrode and the pad through the through-hole connection structure, i.e., the driving electrode can be disposed in the edge electrode area of ​​at least one side of the driving chip; on the other hand, the through-hole connection structure electrically connects the driving electrode and the pad, satisfying the electrical connection between the display module and the external structure, while avoiding the use of carrier boards and metal wire bonding in related technologies. This allows for a reduction in the thickness of the display module in the vertical direction, a reduction in the area in the horizontal direction, and an increase in density, effectively reducing the vertical thickness and horizontal area occupied by the display module, achieving multi-dimensional space optimization. Therefore, the display module provided by this invention can reduce the overall volume of the display module. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0027] Figure 1 This is a schematic diagram of the structure of the original display module prepared in the related technology; Figure 2a This is a schematic diagram of the structure of a display module provided in an embodiment of the present invention; Figure 2b This is another structural schematic diagram of the display module provided in an embodiment of the present invention; Figure 2c yes Figure 2b RR' cross-sectional view of the structure shown; Figure 3 This is a schematic diagram of the arrangement of driving electrodes in the display module provided in an embodiment of the present invention; Figure 4 This is another schematic diagram of the arrangement of the driving electrodes in the display module provided in the embodiment of the present invention; Figure 5 This is another schematic diagram of the arrangement of driving electrodes in the display module provided in the embodiment of the present invention; Figure 6 This is a schematic diagram showing another arrangement of the driving electrodes in the display module provided in the embodiment of the present invention; Figure 7 This is a cross-sectional view of the display module provided in an embodiment of the present invention; Figure 8 This is a schematic diagram of a forming area of ​​the adhesive structure in the display module provided in an embodiment of the present invention; Figure 9 This is a schematic diagram of another forming area of ​​the adhesive structure in the display module provided in this embodiment of the invention; Figure 10 This is another cross-sectional view of the display module provided in an embodiment of the present invention; Figure 11 This is a schematic diagram of the structure in the area where the through-hole connection structure is located in the display module provided in this embodiment of the invention; Figure 12 This is another cross-sectional view of the display module provided in an embodiment of the present invention; Figure 13 This is a schematic diagram of the embedded pad structure in the display module provided in this embodiment of the invention; Figure 14 This is another structural schematic diagram of the display module provided in the embodiment of the present invention; Figure 15Is Figure 10 A schematic diagram of the structure obtained by adding an antireflective coating layer to the structure shown; Figure 16 Is Figure 14 A schematic diagram of the structure obtained by adding an antireflective coating layer to the structure shown; Figure 17 This is another structural schematic diagram of the display module provided in the embodiment of the present invention; Figure 18 This is a flowchart illustrating a method for forming a display module according to an embodiment of the present invention; Figure 19 This is a schematic diagram of the first structure obtained by the method for forming a display module provided in an embodiment of the present invention; Figure 20a This is a schematic diagram of the first structure obtained by preparing the through-hole connection structure in the method for forming the display module provided in the embodiment of the present invention; Figure 20b This is a schematic diagram of the second structure obtained by preparing the through-hole connection structure in the method for forming the display module provided in the embodiment of the present invention using the first method; Figure 20c This is a schematic diagram of the third structure obtained by preparing the through-hole connection structure in the method for forming the display module provided in the embodiment of the present invention using the first method; Figure 20d This is a schematic diagram of the fourth structure obtained by preparing the through-hole connection structure in the method for forming the display module provided in the embodiment of the present invention using the first method; Figure 20e This is a schematic diagram of the fifth structure obtained by preparing the through-hole connection structure in the method for forming the display module provided in the embodiment of the present invention using the first method; Figure 21a This is a schematic diagram of the first structure obtained by preparing the through-hole connection structure in the second method of the display module forming method provided in the embodiments of the present invention; Figure 21b This is a schematic diagram of the second structure obtained by preparing the through-hole connection structure in the method for forming the display module provided in the embodiment of the present invention; Figure 21c This is a schematic diagram of the third structure obtained by preparing the through-hole connection structure in the method for forming the display module provided in the embodiment of the present invention using the second method; Figure 21d This is a schematic diagram of the fourth structure obtained by preparing the through-hole connection structure in the second method of the display module forming method provided in the embodiment of the present invention; Figure 21e This is a schematic diagram of the fifth structure obtained by preparing the through-hole connection structure in the second method of the display module forming method provided in the embodiments of the present invention; Figure 22This is a schematic diagram of a bonding wafer structure obtained using a temporary substrate in the method for forming a display module provided in this embodiment of the invention. Figure 23 Is Figure 17 Based on the structure shown, a schematic diagram of a structure is obtained by using the method for forming a display module provided in an embodiment of the present invention; Figure 24 This is a schematic diagram of the second structure obtained by the method for forming the display module provided in the embodiment of the present invention; Figure 25 It is formed Figure 6 A cross-sectional view of the intermediate structure shown. Figure 26a This is a schematic diagram of the third structure obtained by the display module forming method provided in the embodiment of the present invention; Figure 26b This is a schematic diagram of the fourth structure obtained by the display module forming method provided in the embodiment of the present invention; Figure 27 This is a schematic diagram of the fifth structure obtained by the display module forming method provided in the embodiment of the present invention. Detailed Implementation

[0028] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0029] Display modules are the core display and light-emitting devices in the field of optoelectronic devices. With their advantages such as self-illumination, ultra-high brightness, high contrast, low power consumption, long lifespan, and inorganic stability, they have rapidly penetrated from near-eye displays and automotive optoelectronic devices to multiple scenarios such as professional displays, transparent displays, optical communications, and medical detection, becoming a key carrier of optoelectronic device technology.

[0030] Taking the field of MicroLED micro-display as an example, current display modules (MicroLED display modules) are all manufactured through encapsulation and wire bonding to realize the electrical functions of the display module and enable it to be electrically connected to the external structure.

[0031] Please refer to Figure 1 , Figure 1 This is a schematic diagram of the structure of the original display module prepared in the related technology.

[0032] like Figure 1As shown, in the original display module, the original display module and the external structure are electrically connected by fixing the MicroLED microdisplay panel (original MicroLED display panel) 01 (integrating the original driver chip and MicroLED microdisplay chip) onto the carrier board 02, and by connecting the original driver electrode 1102 on the MicroLED microdisplay panel 01 to the edge electrode area M of the MicroLED microdisplay panel 01 via the external metal bonding wire 03.

[0033] Figure 1 The original display module shown is too large, which is not conducive to further size compression. Currently, glasses are the most common application area for original display modules, and they are very sensitive to the size and weight of the original display module. At the same time, die bonding (fixing the MicroLED micro-display panel 01 onto the carrier plate 02) and metal wire bonding 03 require additional costs, module weight, and reliability risks of metal wire bonding abnormalities.

[0034] To address the aforementioned issues, embodiments of the present invention provide a display module that reduces the overall size of the display module.

[0035] Please refer to Figure 2a , Figure 2b and Figure 2c , Figure 2a This is a schematic diagram of the structure of a display module provided in an embodiment of the present invention. Figure 2b This is another structural schematic diagram of the display module provided in an embodiment of the present invention. Figure 2c yes Figure 2b The RR' cross-sectional view of the structure shown.

[0036] like Figures 2a-2c As shown, the display module includes: Drive chip 11; The driving core 11 includes a plurality of driving electrodes 111, wherein the plurality of driving electrodes 111 are distributed on the front side of the driving core 11, and the driving electrodes 111 are disposed in the edge electrode region M on at least one side of the driving core 11. The back side of the driving chip 11 includes: a pad 2 corresponding to the driving electrode 111; the pad 2 and the corresponding driving electrode 111 are electrically connected based on a through-hole connection structure 3; the pad 2 is used as a metal electrode for electrically connecting the display module to an external structure.

[0037] The display module is a display unit that can be used independently and electrically connected to external devices. The display module also includes a MicroLED display panel 1, which integrates an independent driver chip 11 (an independent chip obtained after the driver wafer is cut).

[0038] The driving chip 11 has two opposing surfaces, wherein the surface forming the pad is the back side of the driving chip 11, and the surface forming the driving electrode 111 is the front side of the driving chip 11.

[0039] like Figure 1 As shown, the original driving electrodes 1102 (e.g., pads) are typically located on one edge of the front side of the original driving chip (edge ​​electrode area), which facilitates wire bonding by requiring only wires to be led from the same direction to achieve external electrical connections. Furthermore, the original driving electrodes 1102 are arranged closely together.

[0040] In this embodiment of the invention, since a carrier plate and a metal wire bonding method connecting from one side edge electrode area are no longer used, the arrangement position of the driving electrode 111 is no longer constrained by the metal wire bonding method, and the area where the driving electrode 111 is located can be flexibly adjusted. Please refer to... Figure 3 , Figure 4 and Figure 5 , Figure 3 This is a schematic diagram of the arrangement of driving electrodes in the display module provided in an embodiment of the present invention. Figure 4 5 is another schematic diagram of the arrangement of driving electrodes in the display module provided in the embodiment of the present invention, and 6 is yet another schematic diagram of the arrangement of driving electrodes in the display module provided in the embodiment of the present invention.

[0041] like Figures 2a-5 As shown, the driving electrode 111 can be arranged on one side of the edge electrode region M of the driving core 11, or the driving electrode 111 can be arranged on both sides, three sides, or four sides of the edge electrode region M.

[0042] The arrangement of the driving electrodes 111 can be determined by combining the number of driving electrodes 111 with the area and effective region of the chip (i.e., MicroLED chip 12), as long as it does not affect the performance of the display module.

[0043] While adjusting the distribution position of each driving electrode 111 on the front side of the driving chip 11, a through-hole connection structure 3 and a pad 2 are formed on the back side of the driving chip 11 in the area corresponding to the position of each driving electrode 111. The corresponding pads 2 and driving electrodes 111 are electrically connected through the through-hole connection structure 3. The through-hole connection structure 3 can be formed using a through-silicon via (TSV) process.

[0044] like Figure 2c As shown, the through-hole connection structure 3 can connect the driving electrode 111 and the pad 2 in the vertical direction H, that is, provide a vertical conductive channel in the vertical direction H (the through-hole connection structure 3 itself is a conductive structure). By using the through-hole connection structure 3, the spatial lead-out position of the driving electrode 111 can be changed, realizing flexible and high-density vertical interconnection.

[0045] Therefore, the carrier board 02 (whose horizontal footprint is larger than that of the MicroLED microdisplay panel 01) can be eliminated, thus reducing the thickness in the vertical direction H. At the same time, the area in the horizontal direction X can be reduced because the metal bonding wire 03 is no longer used.

[0046] In one embodiment, such as Figure 1 As shown, the original display module prepared in related technologies has dimensions of 4.4 mm in length and 2.5 mm in width, while the display module prepared in this embodiment of the invention has dimensions of... Figure 2a As shown, its dimensions are 2.4 mm wide and 1.8 mm wide. It can be seen that, compared to the original display modules prepared in related technologies, the size of the display module in this embodiment of the invention can be reduced by approximately 60%.

[0047] The through-hole connection structure 3 electrically connects the pad 2 and the driving electrode 111, thereby achieving electrical connection with the external structure through the pad 2. For example, the external structure can be a PCB (Printed Circuit Board), ceramic, metal, or other substrates, or a flexible circuit board, rigid-flex board, or other substrates.

[0048] Optionally, the material of the pad 2 can be metals such as gold, gold-tin, aluminum, nickel-tin, or copper-tin. The shape of the pad 2 can be rectangular, circular, etc., the size of the pad 2 is not less than 100 micrometers, and the spacing between the pads 2 is not less than 200 micrometers.

[0049] As can be seen, in the display module provided by the embodiments of the present invention, a through-hole connection structure 3 is provided on the driving chip 11 to realize the electrical connection between the driving electrode 111 and the pad 2, thereby enabling direct electrical connection between the display module and the external structure through the pad 2. It is evident that the display module provided by the embodiments of the present invention, on the one hand, improves the arrangement flexibility of each driving electrode 111 on the driving chip 11 by electrically connecting the driving electrode 111 and the pad 2 through the through-hole connection structure 3, i.e., they can be distributed on at least one side of the edge electrode area M; on the other hand, the through-hole connection structure 3 electrically connects the driving electrode 111 and the pad 2, satisfying the electrical connection between the display module and the external structure, while avoiding the use of the carrier board 02 and metal wire bonding 03 in related technologies. This allows the display module to be thinner in the vertical direction H, smaller in the horizontal direction X, and denser, effectively reducing the vertical thickness and horizontal area occupied by the display module, achieving multi-dimensional space optimization. Therefore, the display module provided by the embodiments of the present invention can reduce the overall volume of the display module.

[0050] In one embodiment, adjacent driving electrodes 111 are arranged at intervals according to a preset electrode spacing; for the edge electrode region M where the driving electrodes 111 are provided, the driving electrodes 111 are arranged in at least one row or one column.

[0051] The driving electrodes 111 are no longer tightly arranged on one side of the edge electrode area M. They can be arranged according to a preset electrode spacing, thereby increasing the spacing between the driving electrodes 111 while ensuring electrical connection function, reducing signal crosstalk, and improving process yield and device reliability.

[0052] Furthermore, since electrical connections are no longer achieved using metal wire bonding, the arrangement of the drive electrodes 111 is not constrained by wiring factors such as winding under metal wire bonding, allowing the drive electrodes 111 on the edge electrode region M to be arranged in a single column / row or multiple columns / rows. Please refer to... Figure 6 , Figure 6 This is a schematic diagram showing another arrangement of the driving electrodes in the display module provided in this embodiment of the invention.

[0053] Figure 6 Taking the arrangement of driving electrodes 111 on one side of the edge electrode region M as an example, two columns of driving electrodes 111 are arranged on this side of the edge electrode region M. Of course, in the case of multiple columns or rows, the driving electrodes 111 can still be arranged at intervals according to the preset electrode spacing.

[0054] Please refer to Figure 2a and Figure 7 , Figure 7 This is a cross-sectional view of the display module provided in an embodiment of the present invention.

[0055] like Figure 7 As shown, the display module further includes: a MicroLED chip 12 located on the front side of the driving chip 11, the MicroLED chip 12 and the driving chip 11 forming a display panel 1; the MicroLED chip 12 includes: a display area 121 and an anti-reflection area 122, the anti-reflection area 122 being located in the region between the display area 121 and the edge electrode area M on the projection of the driving chip 11; The display module also includes a support substrate 5 and an adhesive structure 4 located between the driving core 11 and the support substrate 5; The adhesive structure 4 is located on the front side of the driving core 11, and the inner edge of the area where the adhesive structure 4 is located is spaced apart from the outer edge of the display area 121 by a first distance.

[0056] The support substrate 5 is located directly above the driving core 11, and the support substrate 5 and the driving core 11 are bonded together by the adhesive structure 4.

[0057] The thickness of the support substrate 5 is between 100 micrometers and 800 micrometers, and the material can be a visible light highly transparent material such as glass or sapphire. The support substrate 5 can also have an anti-reflection film layer to increase light transmission.

[0058] When using the bonding structure 4 to bond the driving core 11 and the supporting substrate 5, the inner edge of the area where the bonding structure 4 is set is kept at a first distance from the outer edge of the display area 121. This can prevent the bonding structure 4 from causing contamination, damage or performance drift to the core functional area (display area 121), thereby improving the yield and long-term stability of the device.

[0059] The antireflection region 122 is used to eliminate stray light reflected from the light emitted from the display area 121 in the system application. It can be designed with a two-dimensional closely arranged diffuse reflection scheme, such as the antireflection region 122 adopting a two-dimensional closely arranged and overlapping microlens structure to achieve antireflection and diffuse reflection effects. It can also be designed with metasurfaces, Bragg reflective layers, etc. to form a diffuse reflection or antireflection structure. It can also be made of light-absorbing materials, such as titanium nitride, black glue, carbon film, or carbon porous structure.

[0060] Alternatively, optical collimation structures such as lenses and metasurfaces can be integrated on the display area 121.

[0061] Optionally, the adhesive structure 4 is located on the driving core 11 in a region other than the display area 121, or in the region between the inner edge of the edge electrode region M and the outer edge of the display area 121; The adhesive structure 4 includes an adhesive, a metal bonding layer, or a combination thereof; the adhesive structure 4 is an integral structure or a collection of multiple phase spacer adhesive structures.

[0062] Please refer to Figure 8 and Figure 9 , Figure 8 This is a schematic diagram of a forming area of ​​the adhesive structure in the display module provided in an embodiment of the present invention. Figure 9 This is a schematic diagram of another forming area of ​​the adhesive structure in the display module provided in the embodiment of the present invention.

[0063] like Figure 8 As shown, when the first distance A is satisfied, the adhesive structure 4 is located in the area between the inner edge of the edge electrode area M and the outer edge of the display area 121. At this time, the adhesive structure 4 surrounds the display area 121 in a dam-like shape and is an integral structure. Figure 8 The cross-sectional view of the adhesive structure shown can be referenced. Figure 7 ,like Figure 7 As shown, when the first distance is satisfied, the adhesive structure 4 is located in the area between the edge electrode area M and the display area 121.

[0064] like Figure 9As shown, when the first distance is satisfied, the adhesive structure 4 covers the area of ​​the driving core 11 excluding the display area 121, and is also a single-piece structure. Please refer to... Figure 10 , Figure 10 This is another cross-sectional view of the display module provided in an embodiment of the present invention. For example... Figure 10 As shown, when the first distance is satisfied, the adhesive structure 4 is located in an area outside the display area 121, resulting in a more stable adhesive effect.

[0065] Figure 8 and Figure 9 The adhesive structure 4 shown is a one-piece structure, i.e., a continuous structure. In some embodiments, the adhesive structure 4 can also be a discontinuous structure obtained by graphic processing, i.e., the adhesive structure 4 is a collection of multiple phase spacer adhesive structures, realizing the precise formation of the adhesive structure 4 at a specified position.

[0066] In one embodiment, the width of the adhesive structure 4 can be either non-uniform or uniform, and the adhesive structure can be flexibly set according to the specific application scenario.

[0067] In one embodiment, the preset electrode spacing is greater than or equal to 100 micrometers; the distance from the outer edge of the display area 121 to the inner edge of the edge electrode area M is greater than or equal to 50 micrometers and less than or equal to 2000 micrometers; the minimum width of the antireflection area 122 is greater than or equal to 20 micrometers; the minimum value of the first distance A is greater than or equal to 5 micrometers; and the minimum width of the adhesive structure (e.g., ...) Figure 8 As shown in B), it is greater than or equal to 20 micrometers. While ensuring the electrical connection performance of the display module, it ensures the normal function of each functional area. For example, sufficient space is reserved between the display area 121 and the edge electrode area M to form the anti-reflection area 122. The first distance ensures that the adhesive structure 4 will not interfere with the function of the display area 121. The preset electrode spacing of the driving electrode 111 can make the final device have good electrical performance.

[0068] Please refer to Figure 11 , Figure 11 This is a schematic diagram of the structure of the through-hole connection structure in the display module provided in the embodiment of the present invention.

[0069] like Figure 11 As shown, the through-hole connection structure 3 includes: an adhesive barrier layer 31 and a metal pillar 32. The adhesive barrier layer 31 is disposed on the inner wall of the through-hole connection structure 3, and the metal pillar 32 fills the inner side of the adhesive barrier layer 31 and adheres to the adhesive barrier layer 31. The display module also includes: A first insulating layer 61 covers the front side of the drive core 11 and extends to cover the inner wall of the through-hole connection structure 3. The inner wall of the through-hole connection structure 3 and the adhesive barrier layer 31 are separated by the first insulating layer 61.

[0070] The material of the first insulating layer 61 can be a dielectric material such as silicon oxide, silicon nitride, or aluminum oxide.

[0071] The metal pillar 32 can be made of metals such as copper, tungsten, or gold, and the adhesive barrier layer 31 can be made of single or multiple layers of materials such as Ti, TiN, Ta, or TaN. In some embodiments, the adhesive barrier layer 31 can also be made of polycrystalline silicon.

[0072] Please continue to refer to this. Figure 11 The display module may further include: The second insulating layer 62 covers the back side of the drive core 11 and is in contact with the first insulating layer 61 that extends to cover the inner wall of the through-hole connection structure 3.

[0073] The second insulating layer 62 can further enhance insulation protection.

[0074] Please continue to refer to this. Figure 10 The display module further includes a heat dissipation enhancement structure 7 located on the back side of the driving core 11, wherein the area of ​​the heat dissipation enhancement structure 7 corresponds to the display area 121.

[0075] By using the through-hole connection structure 3 to reduce the thickness in the vertical direction H and the area in the horizontal direction X, thereby reducing the heat dissipation path of the display module and accelerating the heat dissipation efficiency, a heat dissipation enhancement structure 7 is added on the back of the driver chip 11 at the position corresponding to the display area 121, which can further accelerate the heat dissipation efficiency.

[0076] For example, the heat dissipation enhancement structure 7 can be patterned and vapor-deposited along with the pad 2 and then separated from the initial driver wafer along with the MicroLED display panel 1 during the dicing process.

[0077] Please refer to Figure 12 , Figure 12 This is another cross-sectional view of the display module provided in an embodiment of the present invention.

[0078] like Figure 12 As shown, the display module further includes: solder balls 81, and / or a heat dissipation enhancement structure 7; The solder ball 81 is disposed on each solder pad 2; The heat dissipation enhancement structure 7 is located on the back side of the driving core 11, and the area where the heat dissipation enhancement structure 7 is formed corresponds to the display area 121; When the display module includes the heat dissipation enhancement structure 7, the heat dissipation enhancement structure 7 also includes a uniformly arranged solder ball array 82; The pad 2 includes an embedded pad and a protruding pad.

[0079] The pads 2 are used to implant solder balls 81 for ball grid array (BGA) packaging. At the same time, the position of the driving electrode 111 can be redistributed through redistribution layer (RDL), so that the solder balls 81 and the pads 2 are relatively evenly distributed on the back of the MicroLED display panel 1 (driving chip 11).

[0080] A uniformly distributed array of solder balls 82 can also be formed simultaneously on the heat dissipation enhancement structure 7 to improve the connection reliability between the display module and the external structure.

[0081] In one embodiment, the shape of the pad 2 can be rectangular, circular, etc., the size of the pad 2 is not less than 100 micrometers, and the spacing between the pads 2 is not less than 200 micrometers.

[0082] Among them, protruding pads, for example Figure 10 The bottom of pad 2, as shown, is in contact with the back surface of the drive chip 11.

[0083] For embedded pads, please refer to Figure 13 , Figure 13 This is a schematic diagram of the embedded pad structure in the display module provided in the embodiment of the present invention.

[0084] Figure 13 The embedded pad 21 shown has its top surface flush with the back surface of the drive chip 11. Since an embedded pad 21 is formed, the shape of the adhesion barrier layer 31 in the through-hole connection structure 3, as well as the shapes of the first insulating layer 61 and the second insulating layer 62, also change, as shown below. Figure 13 The first adhesion barrier layer 310 shown conforms to the embedded pad 21, and the modified first insulating layer 610 and modified second insulating layer 620 extend to cover the inner wall of the through-hole connection structure 3. Because the embedded pad 21 is embedded inside the drive chip 11, it is more effective than... Figure 11 The metal pillar 32 shown has a decreasing length under the embedded pad 21, as shown in the figure. Figure 13 The modified metal column 320 is shown.

[0085] In one embodiment, the material of the pad 2 (including the protruding pad and the embedded pad) can be Cr20nm / Pt50nm / Au100nm, where Cr is the adhesive layer, Pt is the barrier layer, and the Au layer is used for subsequent packaging as an anti-oxidation and eutectic layer.

[0086] In another embodiment, the material of the pad 2 can be Ti20nm / Cu2um / Ni2um / Sn2um, where Ti is the adhesion layer, Cu is the current and heat spread layer, Ni is the eutectic barrier depletion layer, and Sn is used for die bonding.

[0087] To achieve anti-reflection in the non-display area, in one embodiment, the display module further includes: an anti-reflection structure disposed on the side surface of the support substrate 5 away from the front of the driving chip 11, and the vertical projection of the disposed area of ​​the anti-reflection structure covers the anti-reflection area 122 and the area from the outer edge of the anti-reflection area 122 to the outer edge of the driving chip 11.

[0088] The anti-reflection structure can be an anti-reflection film layer formed by additionally depositing material on the support substrate 5, or it can be a roughened surface formed by roughening the surface of the support substrate 5. The roughened surface has an anti-reflection function and is used to improve stray light in the non-display area.

[0089] In one embodiment, the supporting substrate 5 is a transparent substrate or a non-transparent substrate; The non-transparent substrate has a central hollow structure, and the central hollow area corresponds to and exposes the display area 121; The thickness of the supporting substrate 5 is greater than or equal to 100 micrometers and less than or equal to 800 micrometers. The thickness of the driving core 11 is greater than or equal to 20 micrometers and less than or equal to 800 micrometers.

[0090] The thickness of the driver chip 11 is the final thickness after thinning, and the remaining final thickness is related to the size of the MicroLED display panel 1.

[0091] Among them, transparent substrates, for example Figure 10 The supporting substrate 5 in the structure shown can be a complete structure whose vertical projection area covers the entire surface of the driving core 11.

[0092] For non-transparent substrates, please refer to Figure 14 , Figure 14 This is another structural schematic diagram of the display module provided in the embodiment of the present invention.

[0093] like Figure 14 As shown, the supporting substrate is a non-transparent substrate 51. Due to its non-transparent nature, in order to avoid affecting the performance of the display area 121, the non-transparent substrate 51 is designed with a central hollow structure, and the central hollow area corresponds to and exposes the display area 121.

[0094] For cases where the antireflection structure is an antireflection film layer, please refer to [the relevant documentation / reference]. Figure 15 , Figure 15Is Figure 10 A schematic diagram of the structure obtained by adding an antireflective coating layer to the structure shown.

[0095] like Figure 15 As shown, the antireflective film 91 is a film formed by depositing an additional material layer on the support substrate (transparent substrate) 5 and patterning the material layer. The vertical projection of the setting area of ​​the antireflective film 91 covers the antireflective region 122 and the region from the outer edge of the antireflective region 122 to the outer edge of the driving core 11, thereby improving stray light in the non-display area.

[0096] For cases where the anti-reflection structure is a roughened surface, please refer to [the relevant documentation / reference]. Figure 16 , Figure 16 Is Figure 14 A schematic diagram of the structure obtained by adding an antireflective coating layer to the structure shown.

[0097] like Figure 16 As shown, the anti-reflection structure is a roughened surface 92, which can be a roughening treatment of the non-cutout area of ​​the non-transparent substrate 51. For example, KOH (potassium hydroxide) is soaked in the patterned central cutout area before patterning. After patterning, a non-transparent substrate with a central cutout structure is obtained, and the surface of the non-cutout area is a roughened surface 92. The roughened surface 92 is used to improve stray light in the non-display area.

[0098] Please refer to Figure 17 , Figure 17 This is another structural schematic diagram of the display module provided in the embodiment of the present invention.

[0099] like Figure 17 As shown, the display module further includes: A color conversion layer 10 covers the display area 121 and is used to convert the original display colors of the display area 121.

[0100] Color conversion materials, such as quantum dots, phosphors, and phosphor sheets, are deposited in the display area 121 to form a color conversion layer 10, which is used to convert the original color (initial display color) displayed in the display area 121 into other colors, such as converting original blue light into white light through yellow phosphor.

[0101] This invention also provides a method for forming a display module, used to prepare the display module described in any of the foregoing embodiments.

[0102] Please refer to Figure 18 , Figure 18 This is a schematic flowchart of a method for forming a display module provided in an embodiment of the present invention.

[0103] like Figure 18 As shown, the method includes the following steps: Step S100: Provide an initial driving wafer, the initial driving wafer including a plurality of arrayed device regions, the device regions including edge electrode regions.

[0104] The initial driver wafer is an uncut wafer. For example, the diameter of the initial driver wafer can be a common wafer size of 100 mm, 200 mm, or 300 mm.

[0105] Multiple device regions are arrayed on the initial driver wafer. Each device region contains a sub-initial driver wafer and a MicroLED display chip integrated on the sub-initial driver wafer. Each MicroLED display chip and its corresponding integrated sub-initial driver wafer constitute an uncut MicroLED display panel. That is, one device region corresponds to an independent MicroLED display panel obtained after subsequent cutting.

[0106] Step S101: On the front side of the initial driving wafer, a driving electrode is formed in the edge electrode region of at least one side of each device region.

[0107] The adjustment of the driving electrode position is performed on a per-device basis for each uncut MicroLED display panel. On the front side of the initial driving wafer, the driving electrode is arranged in the edge electrode area on at least one side of each device area.

[0108] The layout of the driving electrodes in each device area is adjusted so that the driving electrodes can be located in the edge electrode area M on at least one side, thereby improving the flexibility of the driving electrode setup.

[0109] The structure obtained in step S101 can be referenced. Figure 19 , Figure 19 This is a schematic diagram of the first structure obtained by the method of forming a display module provided in the embodiment of the present invention.

[0110] like Figure 19 As shown, the initial driving wafer at this time includes: the adjusted device region 1a with array arrangement. The adjusted device region 1a refers to the device region after the layout of the driving electrodes has been adjusted. Figure 19 The example shown is an adjusted device area 1a in the upper left corner.

[0111] It is easy to understand that, Figure 19 The other smaller diagrams also show an adjusted device area.

[0112] Step S102: Form a driving wafer, which is obtained by thinning the initial driving wafer. The driving wafer has a through-hole connection structure that electrically connects to the driving electrode, and a pad that electrically connects to the through-hole connection structure is formed on the back side of the driving wafer.

[0113] The pads are used as metal electrodes for electrical connection between the display module and the external structure.

[0114] The device area with rearranged driving electrodes is further processed to obtain a thinned initial driving wafer, i.e., a driving wafer, with a through-hole connection structure. A pad for electrically connecting the through-hole connection structure is formed on the back side of the driving wafer to realize the electrical connection between the pad and the driving electrode through the through-hole connection structure. Subsequently, the pad is used to realize the electrical connection with the external structure.

[0115] The initial thickness of the thinned driver wafer (driver wafer) is in the range of 20 micrometers to 800 micrometers.

[0116] Step S103: Perform a cutting process based on the device region to form a display module, wherein the driving wafer in the device region is used as the driving chip of the display module.

[0117] The driver wafers (i.e. driver chips) in each device area after the driver wafer is cut, along with the corresponding integrated MicroLED display chips, serve as display panels to obtain the final display module.

[0118] As can be seen, the method for forming a display module provided in this embodiment of the invention, during the formation of the driving wafer, has through-hole connection structures electrically connected to the driving electrodes, and pads electrically connected to the through-hole connection structures are formed on the back of the driving wafer. This allows for direct electrical connection between the display module and external structures via the pads. Therefore, the method for forming a display module provided in this embodiment of the invention, on the one hand, improves the flexibility of the arrangement of driving electrodes on the driving chip by electrically connecting the driving electrodes and pads via the through-hole connection structures, allowing them to be distributed on at least one side of the edge electrode area; on the other hand, the through-hole connection structures electrically connecting the driving electrodes and pads not only satisfy the electrical connection between the display module and external structures but also avoid the use of carrier boards and metal wire bonding. This allows for a reduction in the thickness of the display module in the vertical direction, a reduction in the area in the horizontal direction, and an increase in density, effectively reducing the vertical thickness and horizontal area occupied by the display module and achieving multi-dimensional space optimization. Therefore, the display module provided in this embodiment of the invention can reduce the overall volume of the display module.

[0119] In one implementation, step S102 may include: On the front side of the initial driving wafer, the driving circuitry within each device region is adjusted to form a driving electrode in the edge electrode region on at least one side of the device region. Alternatively, on the front side of the initial driving wafer, driving electrodes are formed in the edge electrode region on at least one side of each device region by rewiring.

[0120] That is, the adjustment of the driving electrode can be achieved by adjusting the driving circuit or by rewiring, which improves the flexibility of the arrangement of the driving electrode.

[0121] In one embodiment, the initial driving wafer within the device region includes: a MicroLED chip, the MicroLED chip including a display area and an anti-reflection area; step S102 includes: On the front side of the initial driving wafer, a via connection structure is formed at the position corresponding to the driving electrode in each device area; On the front side of the initial driving wafer where the through-hole connection structure is formed, starting from a region at a first distance from the outer edge of the display area of ​​the MicroLED chip, an adhesive structure is formed along the direction pointing towards the edge electrode area; The bonding structure is used to fix the front side of the initial driving wafer, which forms the through-hole connection structure, to the support substrate or temporary substrate to obtain a bonded wafer structure. Flip the bonding wafer structure so that the supporting substrate or the temporary substrate is at the bottom; The back side of the initial driver wafer is thinned to form a via connection structure, and pads are formed on the back side of the initial driver wafer after the via connection structure is formed, thus obtaining the driver wafer.

[0122] This means that the through-hole connection structure can be formed first, and then the initial driver wafer with the through-hole connection structure can be thinned.

[0123] In other embodiments, the initial driving wafer within the device region includes a MicroLED chip, the MicroLED chip including a display area and an anti-reflection area; step S102 includes: On the front side of the initial driving wafer, starting from a region at a first distance from the outer edge of the display area of ​​the MicroLED chip, an adhesive structure is formed along the direction pointing towards the edge electrode area; The bonding structure is used to fix the front side of the initial driving wafer to the supporting substrate or temporary substrate to obtain a bonded wafer structure. Flip the bonding wafer structure so that the supporting substrate or the temporary substrate is at the bottom; Thin the back side of the initial driver wafer to obtain a thinned initial driver wafer; On the back side of the initial driver wafer after thinning, through-hole connection structures and pads are formed at the positions corresponding to the driver electrodes in each device area to obtain the driver wafer.

[0124] The adhesive structures are all formed starting from a region with a first distance from the outer edge of the display area, along a direction pointing towards the edge electrode area. The adhesive structures can be formed by patterning or by dispensing.

[0125] For example, adhesive can be prepared on various device regions. The final shape of the adhesive can be a dam-like structure, such as... Figure 8 As shown.

[0126] Of course, in other embodiments, the final shape of the adhesive can also be discontinuous and not of equal width, such as distributing dots of adhesive around the display area to form a collection of multiple phase spacer adhesive structures.

[0127] In other embodiments, the adhesive may also be as follows: Figure 9 As shown, all areas except display area 121 (which is the area at the first distance from the outer edge of display area 121) are covered.

[0128] As described above, the through-hole connection structure can be formed in the following ways: Method 1: First, thin the initial driver wafer, then form a through-hole connection structure and pads on the back side of the thinned initial driver wafer to obtain the driver wafer.

[0129] Method 2: First, form a via connection structure on the front side of the initial driver wafer, then thin the initial driver wafer including the via connection structure and form pads to obtain the driver wafer.

[0130] Depending on the different ways of forming the through-hole connection structure, the overall forming process of the display module also changes accordingly.

[0131] The formation process of the display module under method 1 can be referred to Figure 20a , 20b 20c, 20d and 20e, Figure 20a This is a schematic diagram of the first structure obtained by preparing the through-hole connection structure in the method for forming the display module provided in the embodiment of the present invention. Figure 20b This is a schematic diagram of the second structure obtained by preparing the through-hole connection structure using the first method in the method for forming the display module provided in this embodiment of the invention. Figure 20c This is a schematic diagram of the third structure obtained by preparing the through-hole connection structure using the first method in the method for forming the display module provided in this embodiment of the invention. Figure 20d This is a schematic diagram of the fourth structure obtained by preparing the through-hole connection structure using the first method in the method for forming the display module provided in this embodiment of the invention. Figure 20e This is a schematic diagram of the fifth structure obtained by preparing the through-hole connection structure in the first method of forming the display module provided in the embodiment of the present invention.

[0132] like Figures 20a-20eAs shown, the initial driver wafer 110 and the supporting substrate 5 are first bonded to obtain a bonded wafer structure 120; then the bonded wafer structure 120 is flipped and the initial driver wafer 110 is thinned to obtain a thinned initial driver wafer 1101; then, on the back side of the thinned initial driver wafer 1101, a through-hole connection structure 3 is formed at the position corresponding to the driving electrode, and a pad 2 is formed to obtain a driver wafer, so that the through-hole connection structure 3 electrically connects the pad and the corresponding driving electrode. Finally, based on the device area cutting, the final independent driver chips and MicroLEDs are obtained to obtain the display module.

[0133] The formation process of the display module under Method 2 can be found in [reference]. Figure 21a , 21b 21c, 21d and 21e, Figure 21a This is a schematic diagram of the first structure obtained by preparing the through-hole connection structure using the second method in the method for forming the display module provided in this embodiment of the invention. Figure 21b This is a schematic diagram of the second structure obtained by preparing the through-hole connection structure using the second method in the method for forming the display module provided in this embodiment of the invention. Figure 21c This is a schematic diagram of the third structure obtained by preparing the through-hole connection structure using the second method in the method for forming the display module provided in this embodiment of the invention. Figure 21d This is a schematic diagram of the fourth structure obtained by preparing the through-hole connection structure using the second method in the method for forming the display module provided in this embodiment of the invention. Figure 21e This is a schematic diagram of the fifth structure obtained by preparing the through-hole connection structure in the second method of the display module forming method provided in the embodiment of the present invention.

[0134] like Figures 21a-21e As shown, on the front side of the initial driver wafer, through-hole connection structures have already been pre-established in each device area. Therefore, the initial driver wafer (processed initial driver wafer 113) including the through-hole connection structure is bonded to the support substrate 5 to obtain the bonded wafer structure 120. Then, the bonded wafer structure 120 is flipped, and the processed initial driver wafer is thinned to obtain the thinned initial driver wafer (thinned initial driver wafer 114 with through-hole connection structure) forming the through-hole connection structure 3. Then, pads 2 are formed on the back side of the thinned initial driver wafer 114 with through-hole connection structure to obtain the driver wafer, so that the through-hole connection structure 3 electrically connects the pads and the corresponding driver electrodes. Finally, the wafer is cut based on the device area to obtain the final independent MicroLED display chips and driver chips, thus obtaining the display module.

[0135] It should be noted that the bonded wafer structure 120 referred to in the embodiments of the present invention is the name of the structure obtained after the bonding process. Therefore, the bonded wafer structure 120 is the structure obtained by bonding in the above-mentioned manner corresponding to different through-hole connection structures.

[0136] When obtaining the bonded wafer structure, a temporary substrate or a support substrate can be used. When using a temporary substrate, temporary adhesive can be used for bonding. Since the temporary substrate needs to be removed later, the temporary adhesive also needs to be removed. Therefore, the temporary adhesive can cover the entire front side of the initial driver wafer or the entire front side of the initial driver wafer forming the through-hole interconnect structure. Please refer to [reference needed]. Figure 22 , Figure 22 This is a schematic diagram of a bonding wafer structure obtained using a temporary substrate in the method for forming a display module provided in an embodiment of the present invention.

[0137] like Figure 22 As shown, a temporary substrate 50 is fabricated on the initial driving wafer forming the through-hole interconnect structure. The initial driving wafer forming the through-hole interconnect structure and the temporary substrate 50 are bonded together. After removing the temporary substrate 50, the desired result is obtained. Figure 2c The structure shown.

[0138] The material of the temporary substrate 50 can be the same as that of the supporting substrate 5, such as transparent or non-transparent materials like glass or sapphire as described above. An organic material is applied to the front side of the initial driving wafer forming the via interconnect structure or the temporary substrate to form a temporary adhesive 43. Then, the temporary substrate 50 is bonded and integrated with the initial driving wafer forming the via interconnect structure. The temporary substrate 50 and the temporary adhesive 43 are removed after all back-side processes are completed.

[0139] Because a temporary substrate or a support substrate (which is not removed subsequently) can be used in the bonding wafer structure, different process sequences are possible when forming the color conversion layer. For example, when the bonding wafer structure includes a temporary substrate, after the dicing process based on the device region and before forming the display module, it further includes: Remove the temporary substrate and form a color conversion layer on the display area of ​​the MicroLED chip, or form a color conversion layer on the display area of ​​the MicroLED chip before obtaining the bonding wafer structure; When the bonding wafer structure includes a supporting substrate, a color conversion layer is formed on the display area of ​​the MicroLED chip before the bonding wafer structure is obtained.

[0140] The color conversion layer is formed above the display area and acts on the display area. Therefore, when using a support substrate, the color conversion layer is formed before obtaining the bonded wafer structure. When using a temporary substrate, since the temporary substrate is removed after dicing based on the device area, the color conversion layer can be formed after the temporary substrate is removed, or it can be formed before obtaining the bonded wafer structure.

[0141] When the bonded wafer structure includes a supporting substrate, the resulting structure containing the color conversion layer can be referenced. Figure 23 , Figure 23 Is Figure 17 Based on the structure shown, a schematic diagram of a structure is obtained by using the method for forming a display module provided in the embodiment of the present invention.

[0142] like Figure 23 As shown, after the color conversion layer 10 is formed above the display area 121, the support substrate 5 is bonded to form a bonded wafer structure.

[0143] Since the bonded wafer structure can be fabricated using a temporary substrate or a supporting substrate, the final display module may only include a MicroLED display panel (such as...). Figure 2c The structure shown can also be a MicroLED display panel and a supporting substrate (e.g. Figure 10 (Structure shown).

[0144] Optionally, when the bonded wafer structure includes a supporting substrate, after step S102, the method further includes: An anti-reflection structure is formed on the plane of the support substrate on the side away from the front side of the driving wafer. The vertical projection of the area where the anti-reflection structure is set covers the anti-reflection region and the area from the outer edge of the anti-reflection region to the outer edge of the driving wafer.

[0145] Optionally, the pads forming the through-hole connection structure on the back side of the driving wafer include: On the back surface of the driving wafer, protruding pads are formed that contact the via connection structure. Alternatively, an embedded pad is formed on the back side of the driving wafer to contact the through-hole connection structure.

[0146] Protruding pads, for example Figure 10 As shown. Embedded pads, for example... Figure 13 As shown.

[0147] As mentioned above, there are various ways to form the via connection structure. When the via connection structure is prepared using method 2, the process of forming the embedded pad can be as follows: after thinning the back side of the initial driving wafer including the via connection structure to expose the via connection structure, a dielectric layer is deposited on the back side, and then etching is performed at the location of the via connection structure, and pad material is deposited to form the embedded pad.

[0148] When using method 1 to fabricate the via connection structure, the formation process of the embedded pad can be as follows: on the back side of the initially thinned driving wafer, the via connection structure and the pad etching space are etched at the positions corresponding to the driving electrodes; material is then deposited to form the via connection structure and the embedded pad. Please refer to [reference needed]. Figure 24 , Figure 24 This is a schematic diagram of the second structure obtained by the method for forming a display module provided in an embodiment of the present invention.

[0149] like Figure 24 As shown, the embedded pad 21 is located inside the initial driving wafer after thinning. The heat dissipation enhancement structure can be fabricated simultaneously with the embedded pad 21, thus the resulting heat dissipation enhancement structure is... Figure 24 The embedded heat dissipation enhancement structure 71 is shown.

[0150] Figure 24 The structure shown can be achieved using a double damask process.

[0151] Since a heat dissipation enhancement structure can be formed simultaneously during the formation of the pads, in one embodiment, while forming the pads for electrically connecting the via connection structure on the back side of the driver wafer, a heat dissipation enhancement structure is simultaneously formed at the position corresponding to the display area on the back side of the driver wafer.

[0152] For example Figure 22 The raised pads and heat dissipation enhancement structure 7 (raised heat dissipation enhancement structure) shown are or Figure 24 The embedded pads and heat dissipation enhancement structure shown (embedded heat dissipation enhancement structure 71).

[0153] The following section describes the fabrication of the protruding pads and the overall display module, using the example of driving electrodes arranged in the edge electrode area on one side.

[0154] Please refer to Figure 6 and Figure 25 , Figure 25 It is formed Figure 6 The diagram shows a cross-sectional view of the intermediate structure.

[0155] Figure 6 and Figure 25As shown, the driving electrode 111 is arranged on one side of the edge electrode region within the device region of the initial driving wafer 110. At this time, a through-hole connection structure is fabricated on the front side of the initial driving wafer 110 at the location where the driving electrode 111 is arranged. Then, the support substrate 5 is bonded, and after forming the pads and cutting, the desired result can be obtained. Figure 6 The structure shown.

[0156] For details on the through-hole connection structure and pad fabrication, please refer to [reference needed]. Figure 26a , Figure 26b , Figure 26a This is a schematic diagram of the third structure obtained by the display module forming method provided in the embodiment of the present invention. Figure 26b This is a schematic diagram of the fourth structure obtained by the display module forming method provided in the embodiment of the present invention.

[0157] like Figure 26a As shown, by analyzing Figure 25 In the structure shown, the back side of the initial driving wafer 110 is thinned to directly expose the through-hole connection structure (metal pillar), and then the bonding pads are fabricated to obtain... Figure 26b The structure shown.

[0158] Furthermore, to enhance insulation protection, an insulating layer can be deposited and patterned openings can be created on the back side of the initially thinned driving wafer to form a second insulating layer that extends to the metal pillars. Then, bonding pads are fabricated to obtain... Figure 13 The structure shown.

[0159] exist Figure 26a Based on the structure shown, while fabricating the pads, a heat dissipation enhancement structure can be fabricated on the back side of the initially thinned driving wafer at the location corresponding to the display area. Please refer to... Figure 27 , Figure 27 This is a schematic diagram of the fifth structure obtained by the display module forming method provided in the embodiment of the present invention.

[0160] like Figure 27 As shown, a heat dissipation enhancement structure 72 covering the non-pad area is formed in the non-pad area (including the area corresponding to the display area).

[0161] This invention also provides a display device, including a display module as described in any of the foregoing embodiments.

[0162] The display device is a device with image / video / information display functions. For example, it can be an AR (Augmented Reality) / VR (Virtual Reality) near-eye display device, a smartwatch display device, a mobile phone display device, an in-vehicle display device, a television display device, a monitor, an industrial control display device, etc.

[0163] This invention also provides an optoelectronic device, including a display module as described in any of the foregoing embodiments.

[0164] The display module can be applied to optoelectronic devices in the optoelectronic field, such as vehicle lights, wearable devices, and lighting equipment.

[0165] This invention also provides a terminal, including a display module as described in any of the foregoing embodiments.

[0166] The terminal is a complete device that is designed for end users and can be used independently, including but not limited to consumer electronics terminals, vehicle terminals, home display terminals, industrial control terminals, medical display terminals, and smart home terminals.

[0167] The foregoing describes multiple embodiments of the present invention. The optional methods described in each embodiment can be combined and cross-referenced without conflict, thereby extending to a variety of possible embodiments. These can all be considered as embodiments disclosed or made public by the present invention.

[0168] While the embodiments of the present invention have been disclosed above, the present invention is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the present invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. A display module, characterized in that, include: Drive core; The driving core includes a plurality of driving electrodes, wherein the plurality of driving electrodes are distributed on the front side of the driving core, and the driving electrodes are disposed in the edge electrode region of at least one side of the driving core. The back side of the driving chip includes: pads corresponding to the driving electrodes; the pads and the corresponding driving electrodes are electrically connected based on a through-hole connection structure; the pads are used as metal electrodes for electrical connection between the display module and external structures.

2. The display module as described in claim 1, characterized in that, The adjacent driving electrodes are arranged at preset electrode spacing; for the edge electrode area where the driving electrodes are provided, the driving electrodes are arranged in at least one row or one column.

3. The display module as described in claim 2, characterized in that, Also includes: The MicroLED chip is located on the front side of the driver chip, and the MicroLED chip and the driver chip together constitute a display panel; The MicroLED chip includes a display area and an anti-reflection area, wherein the anti-reflection area is located in the region between the display area and the edge electrode area on the projection of the driving chip; The display module also includes a support substrate and an adhesive structure located between the driving chip and the support substrate; The adhesive structure is located on the front side of the driving core, and the inner edge of the area where the adhesive structure is located is spaced apart from the outer edge of the display area by a first distance.

4. The display module as described in claim 3, characterized in that, Also includes: Solder balls, and / or heat dissipation enhancement structures; The solder balls are disposed on each solder pad; The heat dissipation enhancement structure is located on the back side of the driving chip, and the area where the heat dissipation enhancement structure is formed corresponds to the display area; When the display module includes the heat dissipation enhancement structure, the heat dissipation enhancement structure also includes a uniformly arranged array of solder balls; The pads include embedded pads and protruding pads.

5. The display module as described in claim 3, characterized in that, The adhesive structure is located on the driving chip in a region other than the display area, or in the region between the inner edge of the edge electrode region and the outer edge of the display area; The adhesive structure includes an adhesive, a metal bonding layer, or a combination thereof; the adhesive structure is an integral structure or a collection of multiple phase spacer adhesive structures.

6. The display module as described in claim 5, characterized in that, The preset electrode spacing is greater than or equal to 100 micrometers; the distance from the outer edge of the display area to the inner edge of the edge electrode area is greater than or equal to 50 micrometers and less than or equal to 2000 micrometers; the minimum width of the antireflection area is greater than or equal to 20 micrometers; the minimum value of the first distance is greater than or equal to 5 micrometers; and the minimum width of the adhesive structure is greater than or equal to 20 micrometers.

7. The display module as described in claim 3, characterized in that, The through-hole connection structure includes: an adhesive barrier layer and a metal pillar, wherein the adhesive barrier layer is disposed on the inner wall of the through-hole connection structure, and the metal pillar fills the inner side of the adhesive barrier layer and adheres to the adhesive barrier layer; the display module further includes: A first insulating layer covers the front side of the drive chip and extends to cover the inner wall of the through-hole connection structure, the inner wall of the through-hole connection structure being separated from the adhesion barrier layer by the first insulating layer.

8. The display module as described in claim 7, characterized in that, Also includes: A second insulating layer covers the back side of the drive core and contacts the first insulating layer that extends to cover the inner wall of the through-hole connection structure; An anti-reflection structure is disposed on a side surface of the support substrate away from the front of the driving core, and the vertical projection of the disposed area of ​​the anti-reflection structure covers the anti-reflection area and the area from the outer edge of the anti-reflection area to the outer edge of the driving core. A color conversion layer is applied to the display area to convert the original display colors of the display area.

9. The display module as described in claim 3, characterized in that, The supporting substrate can be a transparent substrate or a non-transparent substrate; The non-transparent substrate has a central hollow structure, and the central hollow area corresponds to and exposes the display area; The thickness of the supporting substrate is greater than or equal to 100 micrometers and less than or equal to 800 micrometers; The thickness of the driving core is greater than or equal to 20 micrometers and less than or equal to 800 micrometers.

10. A method for forming a display module, characterized in that, include: An initial driving wafer is provided, the initial driving wafer including a plurality of device regions arranged in an array, the device regions including edge electrode regions; On the front side of the initial driving wafer, a driving electrode is formed in the edge electrode region on at least one side of each device region; A driving wafer is formed, which is obtained by thinning the initial driving wafer. The driving wafer has through-hole connection structures that electrically connect to the driving electrodes, and pads that electrically connect to the through-hole connection structures are formed on the back side of the driving wafer. The pads are used as metal electrodes for electrically connecting the display module to the external structure. A display module is formed by performing a dicing process on the device region, wherein the driving wafer in the device region serves as the driving chip of the display module.

11. The method for forming a display module as described in claim 10, characterized in that, The initial driving wafer within the device region includes: a MicroLED chip, the MicroLED chip including a display area and an anti-reflection area; forming the driving wafer includes: On the front side of the initial driving wafer, a via connection structure is formed at the position corresponding to the driving electrode in each device area; On the front side of the initial driving wafer where the through-hole connection structure is formed, starting from a region at a first distance from the outer edge of the display area of ​​the MicroLED chip, an adhesive structure is formed along the direction pointing towards the edge electrode area; The bonding structure is used to fix the front side of the initial driving wafer, which forms the through-hole connection structure, to the support substrate or temporary substrate to obtain a bonded wafer structure. Flip the bonding wafer structure so that the supporting substrate or the temporary substrate is at the bottom; The back side of the initial driver wafer is thinned to form a via connection structure, and pads are formed on the back side of the initial driver wafer after the via connection structure is formed, thus obtaining the driver wafer.

12. The method for forming a display module as described in claim 10, characterized in that, The initial driving wafer within the device region includes: a MicroLED chip, the MicroLED chip including a display area and an anti-reflection area; forming the driving wafer includes: On the front side of the initial driving wafer, starting from a region at a first distance from the outer edge of the display area of ​​the MicroLED chip, an adhesive structure is formed along the direction pointing towards the edge electrode area; The bonding structure is used to fix the front side of the initial driving wafer to the supporting substrate or temporary substrate to obtain a bonded wafer structure. Flip the bonding wafer structure so that the supporting substrate or the temporary substrate is at the bottom; Thin the back side of the initial driver wafer to obtain a thinned initial driver wafer; On the back side of the initial driver wafer after thinning, through-hole connection structures and pads are formed at the positions corresponding to the driver electrodes in each device area to obtain the driver wafer.

13. The method for forming a display module as described in claim 11 or 12, characterized in that, When the bonded wafer structure includes a temporary substrate, the method further includes, after the dicing process based on the device region and before forming the display module: Remove the temporary substrate and form a color conversion layer on the display area of ​​the MicroLED chip, or form a color conversion layer on the display area of ​​the MicroLED chip before obtaining the bonding wafer structure; When the bonding wafer structure includes a supporting substrate, a color conversion layer is formed on the display area of ​​the MicroLED chip before the bonding wafer structure is obtained.

14. The method for forming a display module as described in claim 13, characterized in that, When the bonding wafer structure includes a supporting substrate, the method further includes, after forming the driving wafer: An anti-reflection structure is formed on the plane of the support substrate on the side away from the front side of the driving wafer. The vertical projection of the area where the anti-reflection structure is set covers the anti-reflection region and the area from the outer edge of the anti-reflection region to the outer edge of the driving wafer.

15. The method for forming a display module as described in claim 13, characterized in that, The pads formed on the back side of the driving wafer to electrically connect the through-hole connection structure include: On the back surface of the driving wafer, protruding pads are formed that contact the via connection structure. Alternatively, an embedded pad is formed on the back side of the driving wafer to contact the through-hole connection structure.

16. The method for forming a display module as described in claim 13, characterized in that, During the process of forming pads for electrically connecting the through-hole connection structure on the back side of the driving wafer, a heat dissipation enhancement structure is simultaneously formed on the back side of the driving wafer at the position corresponding to the display area.

17. The method for forming a display module as described in claim 10, characterized in that, The method of forming a driving electrode in at least one edge electrode region of each device region on the front side of the initial driving wafer includes: On the front side of the initial driving wafer, the driving circuitry within each device region is adjusted to form a driving electrode in the edge electrode region on at least one side of the device region. Alternatively, on the front side of the initial driving wafer, driving electrodes are formed in the edge electrode region on at least one side of each device region by rewiring.

18. A display device, characterized in that, Includes the display module as described in any one of claims 1-9.

19. A photoelectric device, characterized in that, Includes the display module as described in any one of claims 1-9.

20. A terminal, characterized in that, Includes the display module as described in any one of claims 1-9.

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